euripides office 17, rue de l’amiral hamelin 75783 paris ... · 3 euripides sab – strategy...

EURIPIDES Office

17, rue de l’Amiral HAMELIN

75783 Paris cedex 16

FRANCE

September 2010 | version 1

EURIPIDES SAB - STRATEGY RESEARCH AGENDA

2 EURIPIDES SAB – Strategy Research Agenda

Version 1/ September 2010

INTRODUCTION AND EURIPIDES POSITION INSIDE EUREKA

EUREKA and its Information and Communications Technology (ICT) Clusters are making major

contributions to the future of ICT in Europe. CATRENE, CELTIC, EURIPIDES and ITEA 2 have clear views

on their roles in ensuring Europe maintains and increases its global leadership in a domain that is

crucial to the competitiveness of all major industrial sectors as well as to the wellbeing of European

citizens.

ICT and Smart System Integration will play a key role in the future prosperity of Europe. However,

while the global market is growing fast, research and development costs are rising even faster. As

few companies can support these costs alone, alliances are necessary, with similar public support in

Europe as is found in the rest of the world.

Europe needs micro/nanoelectronics and smart systems as a driving force and enabling technology,

with intensified efforts needed to fully exploit existing potential. While Europe is globally

competitive, it must continue to generate leading-edge technology at research centers of sufficient

size and critical mass, while at the same time stimulating the creativity and flexibility of smaller

organizations – particularly small and medium-sized enterprises (SMEs) – in creating new ideas and

applying them commercially.

Advanced System Integration and smart manufacturing processes for high-tech products in

numerous application fields

“ICT in the form of systems, software and services is responsible for innovations in most fields,” says

Jean Luc Maté, chairman of the EURIPIDES smart system integration cluster. “Hardware and software

integration is required in smart devices to deliver a complete system. However, while everyone

thinks Europe is the leader in systems design and architecture, they all envisage manufacture in the

Far East or other low cost region.”

Shared research and development strategies, accompanied by market success, will help break this

paradigm and allow people to think differently about high-tech, low-cost production in Europe. For

example, by using heterogeneous technology to improve integration and cut costs, overall

competitiveness can be improved dramatically. However, this requires innovative, imaginative ways

of technology development and manufacturing – also needing funding. In this context, EURIPIDES is a

forum for European product innovation, especially for SMEs, with the financing help of the different

member states of EUREKA. In contrast to Framework Programs of the EC, EURIPIDES (EUREKA) is a

bottom-up approach led by industry. In such an environment the total value chain from R&D to

production is considered.

It is necessary to make breakthroughs to maintain employment (and even create the innovative

stimulus to re-localize employment in Europe) by synchronizing research investment for both low

volume, high-tech strategic devices such as for medicine, aerospace and defense, and mass volume,

high-tech low-cost products for communications, multimedia, automotive, etc. This also includes the

improvement of existing products to fulfill new functionality needs and to extend their market

competitiveness. Both strategies meet the challenge that EURIPIDES faces for the next generation of

smart systems and their manufacturing processes.



EURIPIDES mission

The EURIPIDES program is a modern, highly regarded tool to structure industrial projects and

reinforce the strength and position of SMEs and LEs on the international market of Smart Systems.

Main contributions to European electronic system and microsystem competitiveness are:

• Increase the R&D and manufacturing capabilities of European companies, with a specific

focus on SMEs in the growing global market of Smart Systems

• Development of advanced systems based on miniaturization, autonomy, reliability, or low

energy using techniques such as micro and nano technologies, interconnects, system-

oriented packaging and test

• Reducing time to market by organizing product value chains ,

• Support high volume, low cost solutions for smart systems and heterogeneous integration by

cooperation between high tech and low cost industry sectors

• Increase trans-national cooperation with the New European member States. Only high level

technology competencies of the whole community can guarantee the competitiveness of

Europe.

With more than 7,000 man-years of high-level research financed to date, EURIPIDES offers

unmatched capability in Europe to develop and deploy Integrated Smart Systems in such highly

diverse and complementary application fields as Automotive, Aeronautics, Medtech and Security.

With an average output of 170 M€ total cost of labeled projects per year, the results of the

EURIPIDES calls are encouraging.

The different technology domains covered by EURIPIDES members and projects are the following:

• Technologies for high reliability, high-density electronic modules

• Microsystems

• Technologies for smart cards

• Infrared sensors for medical applications

• THz imaging for security

• MEMS and MOEMS integration for all domains

• System in Packaging and chip stacking

• Optoelectronic and microwave on-chip

• LED systems and organic LED applications

• RFID integration

• Smart Wireless sensors and networks (ICs, passives, MEMS, antennas, ...)

• Ultra miniaturized modules for mobile communication

• Packaging for harsh environment

• Thermal management (materials, characterisation, simulation)

• Embedded systems: hardware and software co-design

• Reliability test and simulation, lifetime prediction

• Devices and systems for energy efficiency (e.g. for electric vehicle) ,

• Chemical sensing implementation ,

• Assembly and packaging of power systems



EURIPIDES has a mission of near term development of new and improved products and technology

transfer, rather than a role of catalyst of mid to long term research. Consequently, EURIPIDES does

not compete with FP and platforms and is focused on linking research institutes and universities with

the industry and especially the SME’s to build up the value chain from R&D to production.

Europe has the advantage to have a rather efficient R&D infrastructure, but in order to link the

infrastructure to industry; EURIPIDES has a role to play as a facilitator for the support of innovative

projects relevant to industrial development. In addition, EURIPIDES strives for harmonization of

financing solutions through a strong effort of lobbying with public authorities to maintain and extend

the success of the program.

Through the long existence of EURIPIDES (previously Eurimus and Pidea) this mission has not

fundamentally changed and has proven to be highly appreciated by the industries using it. The

number of projects could be improved by building up more cross-border support.

The mission of EURIPIDES must be continuously focused on the bridging of national financing

authorities to facilitate technology transfer, irrespective of borders, for the benefit of the whole of

European industry. It will be shown that transnational cooperation between research institutes and

companies is the most effective way.

Structure of EURIPIDES inside EUREKA

As mentioned above, EURIPIDES is one of the EUREKA clusters devoted to ICT and Smart System

Integration.

EUREKA ‘Clusters’ are long-term, strategically significant industrial initiatives. They usually have a

large number of participants, and aim to develop generic technologies of key importance for

European competitiveness mainly in ICT, energy and more recently in the biotechnology sector.

Clusters bring together large companies, often competitors, along with SMEs, research institutes and

universities, sharing both the risk and benefits of innovation. They focus on developing and

commercially exploiting new technologies. Their goal is to ensure that Europe retains its leading

position in the world market.

Initiated by industry in close collaboration with national funding authorities, each Cluster has a

technological ‘roadmap’ defining the most important strategic domains. Specific goals are achieved

through scores of individual projects. A key asset of EUREKA is its flexibility: roadmaps and projects

are continuously adapted in response to the rapidly changing technological environment and market

demands.

Clusters aim to exploit the technologies developed through existing national and European programs

and play an important role in defining European standards and interoperability.

EURIPIDES promotes the development of new products, processes and services using or enabling the

use of integrated smart systems based on microtechnology.



Large & Complex Systems

End-to-end solutions

Electronic System

Components

Optical components

Electronic packaging

& assembly

Micro/Nano

Electronics &

Software

Telecom

Application&S

ervicesMiddleware

Mobile&Home

Integration

Telecom NW

solutions

Security&Test

platforms

The Cluster’s projects are working on a diverse range of advanced reliable electronic systems based

on miniaturization, low energy, connectivity using micro- and nanotechnologies, interconnects and

packaging. Their impact will be felt in many sectors, from biomedical and transport to aeronautics,

space, energy, telecommunications, industrial process control, multimedia and e-commerce.

Fig.1 - Position of the different Clusters inside EUREKA

EURIPIDES management is headed by the Council with approximately 22 members from LEs, SME’s

and Research Institutes supported by the Office located in Paris.

This Council is divided in 3 parts with specific missions:

• The Executive Board

• The Technical Evaluation Committee (TEC) for the project expertise

• The Scientific Advisory Board (SAB) for the strategy implementation.

The actualized list of the participants of these sections is given on the EURIPIDES website:

www.euripides-eureka.eu

In parallel, another Council called EURIPIDAC, groups the representatives of the national public

authorities. Usually these participants are playing the role of contact point by the state members.

The list is also available on the EURIPIDES website.



BUILDING PROJECTS AND FINANCING

EURIPIDES has been created with a clear industrial objective to support R&D activities in the area of

Smart Systems. The program management reflects this industrial involvement. The mainstream of

project partnerships will be built on small teams of industries and institutes teaming-up to achieve

advanced industrial results in the scope of EURIPIDES. Very large co-operative projects aiming at

achieving major breakthroughs and gathering larger consortia will also be encouraged. The ultimate

goal is to gain globally significant market shares for the European Heterogeneous system-based

industry with strong trans-European cooperation.

The rules for participation in a EUREKA project are the following:

• Main member: the country of the participant who submits the project or who is responsible

or who coordinates it must be a EUREKA member. The list of these countries is available on

the EUREKA web site: www.EUREKAnetwork.org

• Other members: they should come at least from another EUREKA member.

Associated countries can participate as any full EUREKA member with the only additional

requirement of a balanced European participation, involving at least two companies from

different EUREKA member countries.

• The non- EUREKA members or “Third Country”: they could participate as the third partner

only if at least 2 organizations from 2 EUREKA member countries are involved and they must

have secured funding (own private sources and/or combination own funding plus national

public co-funding) for participation in a project.

EUREKA member countries

EUREKA national information points



Financing process

The EURIPIDES label allows a proposer from a EURIPIDES country to receive funding from its National

Public Authorities (NPAs) according to the national policy of this country. EURIPIDES proposers

should check the specific rules existing in the various countries before the submission of a PO

(Project Outline) to be sure that the project can be supported in every country.

Regular contacts are established between the EURIPIDES Council and the Public Authorities to

harmonize the access to funding. A “EURIPIDES Authority Council” (EURIPIDAC) is in place, gathering

members from the various EURIPIDES countries to facilitate the funding process from the beginning

of the proposal.

Project organization

Minimum 2 partners from EUREKA members: the main member should come from a EUREKA

country. Participants from associated countries or non-EUREKA members are submitted to special

rules. Please refer to the “EUREKA Project Form Guidelines”.

- One country’s share in a project should not exceed 75% of the total budget of the project (in

Euros).

- A Project Consortium Agreement (PCA) between the partners of the consortium should be

signed at the beginning of the project.

The most efficient method for building-up a consortium is to submit an “Expression of Interest” to

the EURIPIDES Office which can spread the information to the first level of members or on the

EURIPIDES website, depending on the level of confidentiality desired by the main contractor. If a

high level is requested, the Office can contact a limited number of persons able to find partners in

the right countries.

To submit a proposal, such consortium should constitute a European Consortium (EUREKA countries)

between businesses and/or research institutes.

The first step is to propose a Project Outline (PO). The PO is addressed to the EURIPIDES Office

before the closing date for PO submission. In the same time, each partner (or one per country)

contacts its national public authority to prepare the documents for project funding (Expression of

Interest, checking of the thematic priorities and existing program lines, clarification of the chances

for funding, etc.).

According to the EUREKA regulations, each country defines its own financing rules. Therefore some

discrepancies appear between the different EUREKA members in terms of:

• National Priorities in R/D topics

• ROI expectations

• Public/private financing ratio ; Industry/RTO public money distribution

In consequence, a primary contact with the National Authorities is highly recommended.



If the project is selected by EURIPIDES Technical Evaluation Committee (TEC), the consortium is

invited to submit a Full Proposal Project (FPP).

In all cases, the excellence of project proposers and the quality of their co-operation will be the

major criteria for project selection by the EURIPIDES Council.

The project should be industry-driven with clear targets in terms of product development and/or

technology acquisition (know-how, patents, etc.). The economical impact is also a key issue.

The Call calendar for EURIPIDES, PO and FPP forms are available on EURIPIDES web site :

www.euripides-eureka.eu

BENEFITS FOR INDUSTRY AND MEMBER COUNTRIES

As mentioned in the mission, EURIPIDES is more focused in the development of new and improved

products and technology transfer than as catalyst of future research. EURIPIDES is devoted to linking

research institutes with the industry and especially the SME’s to fill the gap between R&D and

production.

Due to its extensive network EURIPIDES is the organization which can provide partners covering the

total value chain from research, design, development, prototyping, small scale production for market

launch and even large scale production. Some companies specialized in product dissemination can

also be added.

Specific benefits for industrial EURIPIDES members are:

• Introduction in the European R&D network (Road mapping, Know How, Intellectual Property,

etc.)

• Funding of product developments (from EUREKA member states)

• Establishment as a supplier

• Complete own value chain

• Prototyping and pre-production for market evaluation

• Access to volume production facilities

• Contact with distribution networks

The benefit for the EUREKA member states participating in EURIPIDES includes active support for

industry, including both SMEs and LEs, to identify and interact with partners, subcontractors, product

distributors, etc. inside Europe and keep the know-how on the continent.

Specific advantages for the member states are:

• Maintain a leading position in high tech system integration

• Strengthen industrial networks, preserving and creating jobs,

• Expand reach of national companies to international business

• Connect start-ups to complete value chains

• Achieve national and international recognition for high tech performance



While not all countries support EURIPIDES projects equally, some regional sources of financing can

also be engaged as alternative or complementary financing. EURIPIDES remains committed to

bringing together the strongest consortiums for the projects within the EUREKA states, regardless of

national borders. The market success of the participating companies and the growth of the European

high tech sector will provide the validation to the national authorities that transnational cooperation

between research institutes and companies is the most effective way.

SUCCESS STORIES

Some examples of successful projects can be directly attributed to the EURIPIDES cluster. New

technologies or new products are the outcomes and their benefits are visible in our everyday lives.

EURIPIDES success stories cover a large range of applications including medical, communication,

automotive, health, safety, security,etc.

MEDICAL : the example of CARUS

The CARUS project aimed at the development of early predictive and advanced diagnosis technology

for atherosclerosis in the carotid artery in response to the major health issues associated with

cardiovascular diseases. The ultimate technological goal of the project is to develop an innovative

high frame rate matrix, ultrasound system for non-invasive real-time three dimensional, quantitative

assessments of structural and functional vascular properties.

High performances matrix sensor design

• High frame rate (50Hz to 100Hz) 3D beam forming for:

• Real time volumetric imaging

� Strain imaging of the blood vessel wall (figure below)

� Novel imaging methodology (superharmonic, …)

� Plaque detection



SECURITY: the example of VisioPack

VisioPack project has been lead by five European partners decided to join together their R&D

capacity to package a new intelligent and autonomous vision system on EURIPIDES project. The

innovation was focused on integration and packaging of core electronics in vision and video-

detection with own energy and a light information volume transmission. The field of application is

large (sensitive site perimeter surveillance, human detection, on board surveillance for public

transportation, pedestrian counting, etc.). Today, a new product is in catalog and several commercial

propositions are in progress.

VisioPack concept

AUTOMOTIVE: the example of IQFUEL

Embedded automotive sensor for fuel combustion properties measurement

• Sensor motivation is driven by increasing WW fuel variability (biodiesel, flexfuel)

• Together with control functions, sensor will provide reduction of pollutant emission and

engine consumption through engine self tuning

• Sensor is based on Infrared Spectroscopy using one MOEMS component as one tunable

optical transmission filter

• Challenge consists of reaching target performances: low price, miniaturization and high

reliability for a generalized smart Tank



Courtesy of 3D PLUS

TECHNOLOGICAL INNOVATION

WALPACK Project

EURIPIDES projects are not limited to applications, but are also open to technological innovation.

This successful project had been the first step for a French SME to develop a new concept of wafer

level packaging on rebuilt wafer. WALPACK project was developing high-density and 3D chip-stacking

technology for cost-effective system-in-package devices.

Innovative developments in wafer-level packaging and three-dimensional (3D) stacking in the

WALPACK project have resulted in a highly cost-effective approach to system-in-package integration

for extremely small electronic devices. This technology simplifies the combination of components in

a single, ultra-thin module that offers high interconnection density, high data throughput and

excellent reliability, while keeping processing costs low. The WALPACK technology is already being

developed for key markets in space and high-end computing as well as mobile phones, high capacity

smart cards and biomedical devices.

3D PLUS received the 2007 EUREKA Lynx Award for outstanding technological and commercial

achievement.

Results of the EUREKA project are very promising with the proof-of-concept demonstrator fulfilling

all its requirements. For example the company 3D PLUS has now taken the technology further,

developing and optimizing its process through a joint development agreement with NXP (formerly

Philips Semiconductors) which will manufacture modules for 3D PLUS as well as its own applications,

mainly mobile phones.

These developments are helping 3D PLUS to diversify from its space and aerospace base for into

medical (e.g. micro camera 1/10” for endoscopy –see figure 1), smart card, telecommunications and

IP licensing fields

Figure 1 – micro camera

IPITECH Project

Innovative PCB Integration Technologies for HDI Boards In Harsh Environments

Objectives: Assess, adapt and validate new High Density PCB technologies in harsh environment :

copper filled microvias, stacked microvias, microvias-in-pad, track width (75 µm and 50 µm locally

Assess the impact of these new technologies on Signal Integrity and Thermal management

Assess the mounting of new passive and active packages



Technical advantages:

- Route BGA with a pitch as small as 0.4 or 0.5 mm

- Allow densification of routing and surface components

- Improve the thermal impedance of vias

- Reduce the impedance discontinuities

- Improve the power integrity

- Optimize the decoupling

FUTURE TRENDS IN SYSTEM INTEGRATION

Future smart systems could be compared with a human body in that, electronic products can be

considered to have a brain (microprocessor) with numerous sensors connected to it and the

integration technologies provide the nervous (interconnection) and the skeletal (physical support

structures) systems.

In this context system integration combines several components or functionalities with a very high

degree of miniaturization and flexibility at reasonable costs in semiconductor cubes, starting on chip

(system on chip SoC), in one package (system in package, SiP) or board (system on board, SoB), that

is specifically adapted to the application environment.

Example of heterointegration for a

miniaturized sensor system (EU-project eCube)



In terms of technology, “More Moore” and “More than Moore” approaches are mainly based on

CMOS-compatible processes and they are therefore limited to a certain set of materials.

Heterointegration technologies deliver the opportunity that components based on very different

technologies and materials can be integrated, such as sensor components, photonic or RF devices,

smart displays, etc.

For manufacturing of hetero systems, new architectures, system integration technologies,

production logistics and test strategies are necessary. Adequate interfaces for different application

environments have to be created and evaluated. Considering non-electric functions,

heterointegration (SiP, SoB, 3D integration) can achieve higher complexity than System on Chip (SoC)

solutions.

Heterointegration technologies provide the interaction of different functions, materials and

technologies with a strong focus to the system’s application environment and reasonable cost.

Heterointegration is one of the driving forces to bring microsystems, nanosystems, bio-electronics

and micro-mechatronics into application. It provides a variety of integrated functions to serve a large

range of applications that include consumer, communications, automotive, medical, safety,

aerospace, life science, etc.

Further advantages of heterointegration solutions include the opportunity to use established

processes, shorter time to market cycle, and a high degree of flexibility. This high flexibility of

heterointegration technologies certainly offers the possibility to integrate “System on Chip”

solutions, for example for subsystems.

Despite the importance of heterointegration, we should not forget all the improvements at the

component level. Microsystems are now touching most of the industrial domains and some

improvements need to be done in terms of reliability for devices working under high vacuum, for

example, or in the field of chemical sensors. The direct interaction of electronic devices with their

environment remains a strong research topic in terms of stability, lifetime and robustness.

Processes used to manufacture smart systems often require a multi-disciplinary approach which may

link design, technology, reliability, etc. in the context of multi-functionality.

Design, assembly and packaging of a microelectronic circuit or microsystem does not generally lead

to a completely integrated system because a typical system normally requires a number of different

active and passive devices to enable it to fulfil the functionality as desired. System level integration

involves optimized assembly, interconnection and protection of all components, wiring substrates

and interfaces concerning the required system functionality and the intended application

environment. In the future different versions of SiPs will be used for system packaging. These are

Multichip Modules, Stacked-Die Packages and Stacked-Packages.

In this context, enhancement of assembly and packaging technologies plays a very important role for

future smart systems. MEMS-based products and systems for example require a high level of

expertise and sophisticated equipment for assembly and packaging, because MEMS may have very

thin moving parts or other non-electrical features which need special conditions to be able to

function. Therefore often solutions for media access or specific membrane movements are in the

focus.

Today advanced assembly and packaging technologies at all levels (wafer, chip/package, board) are

increasingly being solicited. Available solutions like 3D wafer level packaging, chip stacking, thin chip

integration, miniaturized or embedded passives and large-scale multifunctional board assemblies

represent the basis for new system designs and applications. New structuring and interconnection



methods (e.g. nano-interconnects) lead to very small system sizes and provide the opportunity for

functionality oriented system assemblies. This is a new challenge for interconnection and packaging:

to switch from technology oriented packaging to system oriented packaging.

The following needs have to be in focus to extend advanced assembly and packaging in the future:

• low cost interconnection technologies (high density multilevel wire bonding, fine pitch flip

chip, thin interconnects, fine pitch TSVs)

• interconnects and packages for high temperature and harsh environment

• low temperature assembly technologies

• low cost high speed assembly

• special functionality oriented mould compounds (e.g. with nanoparticles)

• improved materials functionality, such as new electrical, optical, thermal properties (e.g. by

Carbon NanoTubes)

• 3D compatible actives and passives (e.g. nano structured materials for high k capacitors, low

k inductors, interposer, thin chips)

• high accuracy positioning and self positioning/assembly technologies of die, devices,

components, interconnects, etc.

Because of their strong relevance, 3D wafer-level packaging on the one hand side and board level

system packaging on the other side will dominate future product manufacturing.

EURIPIDES community is committed to help European industries to absorb such new

technologies to create a wealth of new products and to keep our innovation forces to the

highest level.

CONTACT THE EURIPIDES OFFICE FOR FURTHER INFORMATION :

17, rue de l’Amiral HAMELIN

75783 Paris cedex 16

FRANCE

Tel : +33 1 45 05 70 49

Fax: +33 1 45 05 70 37

[email protected]

euripides office 17, rue de l’amiral hamelin 75783 paris ... · 3 euripides sab – strategy...

Documents