Industr ia l and Mult i -Market

Data Sheet Revision 1.0, 2011-05-27Final

ESD5V3U1U Ser iesUni-directional Ultra-Low Capacitance ESD / Transient Protection Diode

ESD5V3U1U-02LS ESD5V3U1U-02LRH

TVS DiodesTransient Voltage Suppressor Diodes

Edition 2011-05-27Published by Infineon Technologies AG 81726 Munich, Germany© 2011 Infineon Technologies AG All Rights Reserved.

Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

ESD5V3U1U Series

Final Data Sheet 3 Revision 1.0, 2011-05-27

Trademarks of Infineon Technologies AGAURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™.

Other TrademarksAdvance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.Last Trademarks Update 2010-06-09

Revision HistoryPage or Item Subjects (major changes since previous revision)Revision 1.0, 2011-05-27

ESD5V3U1U Series

Table of Contents

Final Data Sheet 4 Revision 1.0, 2011-05-27

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1 Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode . . . . . . . . . . . . . . . . . . 71.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71.2 Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 83.2 Typical Characteristics at TA=25°C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5 Ordering Information Scheme (Examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176.1 PG-TSSLP-2-1 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176.2 PG-TSLP-2-7 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table of Contents

ESD5V3U1U Series

List of Figures

Final Data Sheet 5 Revision 1.0, 2011-05-27

Figure 1 Pin Configuration and Schematic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 2 Definitions of Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 3 Reverse current IR = f(TA) , VR = 5.3 V, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 4 Line capacitance CL = f(VR), f = 1MHz, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 5 Line capacitance CL = f(f), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 6 Line capacitance CL = f(TA), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 7 Clamping voltage VTLP = f(ITLP), from pin 1 to pin 2[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 8 Forward clamping voltage VTLP = f(ITLP), from pin 2 to pin 1[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 9 IEC61000-4-2: VCL = f(t), 8 kV positive pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 10 IEC61000-4-2: VCL = f(t), 8 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 11 IEC61000-4-2: VCL = f(t), 15 kV positive pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 12 IEC61000-4-2: VCL = f(t), 15 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 13 Single line, uni-directional ESD / Transient protection[2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 14 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Figure 15 PG-TSSLP-2-1: Package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 16 PG-TSSLP-2-1: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 17 PG-TSSLP-2-1: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 18 PG-TSSLP-2-1: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 19 PG-TSLP-2-7: Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 20 PG-TSLP-2-7: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 21 PG-TSLP-2-7: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 22 PG-TSLP-2-7: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

List of Figures

ESD5V3U1U Series

List of Tables

Final Data Sheet 6 Revision 1.0, 2011-05-27

Table 1 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Table 2 Maximum Rating at TA = 25 °C, unless otherwise specified. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Table 3 DC Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Table 4 RF Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Table 5 ESD Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

List of Tables

ESD5V3U1U Series

Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode

Final Data Sheet 7 Revision 1.0, 2011-05-27

1 Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode

1.1 Features

• ESD / Transient protection of high speed data lines exceeding– IEC61000-4-2 (ESD): ±20 kV (air / contact)– IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)– IEC61000-4-5 (surge): 3 A (8/20 μs)

• Maximum working voltage: VRWM = 5.3 V• Ultra low capacitance: CL = 0.4 pF (typical)• Low clamping voltage, low dynamic resistance RDYN = 0.6 Ω (typical)• Very small form factor down to 0.62 x 0.32 x 0.31 mm3

• Pb-free (RoHS compliant) and halogen free package

1.2 Application Examples

• USB 2.0, Mobile HDMI Link, MDDI, MIPI, etc.• HDMI, DisplayPort, DVI, Ethernet, Firewire, S-ATA

2 Product Description

Figure 1 Pin Configuration and Schematic Diagram

Table 1 Ordering InformationType Package Configuration Marking codeESD5V3U1U-02LS PG-TSSLP-2-1 1 line, uni-directional LESD5V3U1U--02LRH PG-TSLP-2-7 1 line, uni-directional E5

PG-TS(S)LP-2-S ingle Die diode P inConf and SchematicDiag.vst.vsd

b) Schematic diagrama) Pin configuration

Pin 1 Pin 2

TSSLP -2

Pin 1 Pin 2

TSLP-2

Pin 1

Pin 2

Pin 1 marking (lasered)

ESD5V3U1U Series

Characteristics

Final Data Sheet 8 Revision 1.0, 2011-05-27

3 Characteristics

3.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified

Figure 2 Definitions of Electrical Characteristics

Table 2 Maximum Rating at TA = 25 °C, unless otherwise specified

Parameter Symbol Values UnitMin. Typ. Max.

ESD (air / contact) discharge1)

1) VESD according to IEC61000-4-2

VESD – – 20 kVPeak pulse current (tp = 8/20 μs)2)

2) IPP according to IEC61000-4-5

IPP – – 3 AOperating temperature range TOP -55 – 125 °CStorage temperature Tstg -65 – 150 °C

Table 3 DC Characteristics at TA = 25 °C, unless otherwise specified

Parameter Symbol Values Unit Note / Test ConditionMin. Typ. Max.

Reverse working voltage VRWM – – 5.3 V Pin 1 to Pin 2Breakdown voltage VBR 6 – – V IBR = 1 mA, from Pin 1

to Pin 2Reverse current IR – <10 100 nA VR = 5.3 V, from Pin 1

to Pin 2

Diode_Characteris tic_Curve_Uni-directional. vsd

VF

RDYN: Dynamic resistance

VBR: Breakdown voltage

VRWM: Maximum working voltage

VCL: Clamping voltage

VFC: Forward clamping voltage

IPP: Peak pulse current

VFC

IF

VRWM

VFVR

VBRVCL

IR

IF

IPP

IPP

IR

IRWM

RDYN

RDYN

VF: Forward voltage

IF: Forward current

VR: Reverse voltage

IR: Reverse current

ESD5V3U1U Series

Characteristics

Final Data Sheet 9 Revision 1.0, 2011-05-27

Table 4 RF Characteristics at TA = 25 °C, unless otherwise specified

Parameter Symbol Values Unit Note / Test ConditionMin. Typ. Max.

Line capacitance1)

1) Total capacitance line to ground

CL – 0.4 0.6 pF VR = 0 V, f = 1 MHzSerie inductance LS – 0.2 – nH ESD5V3U1U-02LS

– 0.4 – nH ESD5V3U1U-02LRH

Table 5 ESD Characteristics at TA = 25 °C, unless otherwise specified

Parameter Symbol Values Unit Note / Test ConditionMin. Typ. Max.

Clamping voltage VCL – 19 – V IPP = 16 A, from Pin 1 to Pin 2

– 28 – V IPP = 30 A, from Pin 1 to Pin 2

Forward clamping voltage VFC – 10 – V IPP = 16 A, from Pin 2 to Pin 1

– 17 – V IPP = 30 A, from Pin 2 to Pin 1

Dynamic resistance1)

1)Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between IPP1 = 10 A and IPP2 = 40 A.

RDYN – 0.6 – V Pin 1 to Pin 2– 0.5 – V Pin 2 to Pin 1

ESD5V3U1U Series

Characteristics

Final Data Sheet 10 Revision 1.0, 2011-05-27

3.2 Typical Characteristics at TA=25°C, unless otherwise specified

Figure 3 Reverse current IR = f(TA) , VR = 5.3 V, from pin 1 to pin 2

Figure 4 Line capacitance CL = f(VR), f = 1MHz, from pin 1 to pin 2

10-12

10-11

10-10

10-9

10-8

10-7

10-6

25 50 75 100 125 150

I R [

A]

TA [°C]

0

0.2

0.4

0.6

0.8

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

CL [

pF

]

VR [V]

ESD5V3U1U Series

Characteristics

Final Data Sheet 11 Revision 1.0, 2011-05-27

Figure 5 Line capacitance CL = f(f), from pin 1 to pin 2

Figure 6 Line capacitance CL = f(TA), from pin 1 to pin 2

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0 500 1000 1500 2000 2500 3000

CL [

pF

]

f [MHz]

0V

5.3V

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

-25 0 25 50 75

CL [

pF

]

TA [°C]

0V

5.3V

ESD5V3U1U Series

Characteristics

Final Data Sheet 12 Revision 1.0, 2011-05-27

Figure 7 Clamping voltage VTLP = f(ITLP), from pin 1 to pin 2[1]

Figure 8 Forward clamping voltage VTLP = f(ITLP), from pin 2 to pin 1[1]

0

10

20

30

40

0 5 10 15 20 25 30 35 40 0

5

10

15

20

I TL

P [

A]

Eq

uiv

ale

nt

VIE

C

[kV

]

VTLP [V]

ESD5V3U1U-02xxRDYN

RDYN=0.6Ω

0

10

20

30

40

0 5 10 15 20 25 30 35 40 0

5

10

15

20

I TL

P [

A]

Eq

uiv

ale

nt

VIE

C

[kV

]

VTLP [V]

ESD5V3U1U-02xxRDYN

RDYN=0.5Ω

ESD5V3U1U Series

Characteristics

Final Data Sheet 13 Revision 1.0, 2011-05-27

Figure 9 IEC61000-4-2: VCL = f(t), 8 kV positive pulse from pin 1 to pin 2

Figure 10 IEC61000-4-2: VCL = f(t), 8 kV negative pulse from pin 1 to pin 2

-10

0

10

20

30

40

50

60

70

80

90

-100 0 100 200 300 400 500 600 700 800 900

VC

L [

V]

tp [ns]

VCL-max-peak = 82.2 [V]

VCL-30ns-peak = 17.3 [V]

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

10

-100 0 100 200 300 400 500 600 700 800 900

VC

L [

V]

tp [ns]

VCL-max-peak = -76.1 [V]

VCL-30ns-peak = -8.9 [V]

ESD5V3U1U Series

Characteristics

Final Data Sheet 14 Revision 1.0, 2011-05-27

Figure 11 IEC61000-4-2: VCL = f(t), 15 kV positive pulse from pin 1 to pin 2

Figure 12 IEC61000-4-2: VCL = f(t), 15 kV negative pulse from pin 1 to pin 2

-10

0

10

20

30

40

50

60

70

80

90

100

110

-100 0 100 200 300 400 500 600 700 800 900

VC

L [

V]

tp [ns]

VCL-max-peak = 104.8 [V]

VCL-30ns-peak = 24.1 [V]

-110

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

10

-100 0 100 200 300 400 500 600 700 800 900

VC

L [

V]

tp [ns]

VCL-max-peak = -105.1 [V]

VCL-30ns-peak = -13.7 [V]

ESD5V3U1U Series

Application Information

Final Data Sheet 15 Revision 1.0, 2011-05-27

4 Application Information

Figure 13 Single line, uni-directional ESD / Transient protection[2]Application_ESD5V3U1U-02xxx.vsd

ESD5V3U1U Series

Ordering Information Scheme (Examples)

Final Data Sheet 16 Revision 1.0, 2011-05-27

5 Ordering Information Scheme (Examples)

Figure 14 Ordering information scheme

ESD 5V3 U - XX YY

Package or ApplicationXX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)YY = Package family:

LS = TSSLPLRH = TSLPS = SOT363U = SC74

XX = Application family:LC = Low ClampHDMI

Uni- / Bi-directional or Rail to Rail protection

Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V)

ESD 0P1 RF - XX YY

PackageXX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)YY = Package family:

LS = TSSLPLRH = TSLP

For Radio Frequency Applications

Line Capacitance CL in pF: ( i.e.: 0P1 = 0.1pF)

n U

Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)

Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)

ESD5V3U1U Series

Package Information

Final Data Sheet 17 Revision 1.0, 2011-05-27

6 Package Information

6.1 PG-TSSLP-2-1 (mm)[3]

Figure 15 PG-TSSLP-2-1: Package overview

Figure 16 PG-TSSLP-2-1: Footprint

Figure 17 PG-TSSLP-2-1: Packing

Figure 18 PG-TSSLP-2-1: Marking (example)

TSSLP-2-1,-2-PO V05

±0.0350.32

1

2

±0.0

250.

355

±0.0

250.

21)

0.62

±0.0

35

+0.010.31 -0.02

1) Dimension applies to plated terminal

Cathodemarking

1)±0.0250.26

Bottom viewTop view

0.27

0.19

0.19

0.19

Copper Solder mask Stencil apertures

0.57

0.24

0.62

0.32

0.24

0.14

TSSLP-2-1,-2-FP V02

0.43

4

0.73

0.35

Cathodemarking

8

TSSLP-2-1,-2-TP V03

ESD5V3U1U Series

Package Information

Final Data Sheet 18 Revision 1.0, 2011-05-27

6.2 PG-TSLP-2-7 (mm)[3]

Figure 19 PG-TSLP-2-7: Package Overview

Figure 20 PG-TSLP-2-7: Footprint

Figure 21 PG-TSLP-2-7: Packing

Figure 22 PG-TSLP-2-7: Marking (example)

TSLP 2 7 PO V02

±0.050.6

1

2

±0.0

50.

65

±0.0

350.

251)

1±0.

05

0.05 MAX.

+0.010.39 -0.03

1) Dimension applies to plated terminal

Cathodemarking

1)±0.0350.5

Bottom viewTop view

TSLP-2-7-FP V01

0.45

0.27

50.

275

0.37

50.92

5

Copper Solder mask Stencil apertures

0.35

1

0.6

0.35

0.3

TSLP-2-7-TP V03

0.76

4

1.16

0.5

Orientationmarking

8

ESD5V3U1U Series

Terminology

Final Data Sheet 19 Revision 1.0, 2011-05-27

Terminology

CL Line capacitanceDVI Digital Visual InterfaceEFT Electrical Fast TransientESD Electrostatic DischargeHDMI High Definition Multimedia InterfaceIEC International Electrotechnical CommissionIPP Peak pulse currentIR Reverse currentIRWM Maximum Reverse working CurrentLS Serial inductanceMDDI Mobile Display Digital InterfaceMIPI Mobile Industrial Processor InterfaceRoHS Restriction of Hazardous Substances DirectiveS-ATA Serial Advanced Technology AttachmentTA Ambient temperatureTOP Operation temperaturetp Pulse durationTstg Storage temperatureUSB Universal Serial BusVBR Breakdown VoltageVCL Reverse clamping voltageVESD Electrostatic discharge voltageVFC Forward Clamping VoltageVR Reverse voltageVRWM Maximum Reverse Working Voltage

ESD5V3U1U Series

References

Final Data Sheet 20 Revision 1.0, 2011-05-27

References[1] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP

[2] Infineon AG - Application Note AN140: ESD Protection for Digital High-Speed Interfaces (HDMI, FireWire, ...) using ESD5V3U1U)

[3] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package

Published by Infineon Technologies AG

w w w . i n f i n e o n . c o m