epoxies.com21 Starline Way, Cranston, RI 02921 USA t 401.946.5564 • f 401.946.5526

Potting Compounds and Adhesivesfor Power Electronic ApplicationsToday’s electronic assemblies have to perform in some of the harshest environments.Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for 30 years.

Many potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions. Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and many transportation industry products.

Thermally Conductive Potting Compounds50-3150FRUL94 V-0 UL listed*. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. Typical applications for 50-3150 FR include encapsulating power supplies, transformers, coils, insulators, sensors, etc. This system is an excellent choice for applications requiring high thermal conductivity and flame retardency.

50-3152FRUL94 V-0 UL listed*. This is a two component epoxy potting and encapsulating system. This semi-rigid epoxy has excellent shock and vibration resistance along with good thermal conductivity. 50-3152 FR has a convenient 1:1 mix ratio and is low in viscosity. It is ideal for larger potting applications wherelow exotherm is needed.

50-2369FRUL94 V-0 UL listed*. The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-0. This system offers excellent heat transfer,low exotherm, and excellent electrical properties. Popular for use with capacitors and batteries.

*UL listed File Number E235584

epoxies.com21 Starline Way, Cranston, RI 02921 USA t 401.946.5564 • f 401.946.5526

Electrically Conductive Adhesives40-3900This electrically conductive epoxy resin formulation offers the maximum in conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. Excellent choice as a solder alternative due to its room temperature cure and excellent adhesive properties.

40-390540-3905 has outstanding adhesion to aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic, and printed circuit boards. Used as a cold solder and for wire bonding.

40-392040-3920 is a one component silver filled ink with outstanding adhesion to a variety of substrates, such as kapton, Mylar, glass, polyester, ceramic, etc. Used in EMI and RFI shielding and circuit repair.

TriggerBond® Adhesives10-3005NSThis high bond strength adhesive is a clear 100% solids, two component, non-sag adhesive with a quick setting time of 5 minutes at room temperature. It is excellent for bonding plated metals, glass, ceramic, cement, most plastics and rubbers, etc.

10-3216GR10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 is excellent for bonding many metals, most plastics and rubbers.

20-2180This medium durometer polyurethane system is engineered for electronic potting, encapsulating, and casting applications. It is low in viscosity and low in toxicity. This elastomeric system is suitable for a variety of electronic insulating applications.

50-311250-3112 has a simple 1:1 mix ratio and develops a strong thermally conductive bond in four hours at room temperature. A great choice for bonding components quickly where good heat transfer is needed.

Specialty Heat Sink Bonding Adhesive70-3812NC70-3812 NC is a two component, aluminum filled epoxy system. This system is used for bonding heat sinks or joining metal parts that require the highest thermal conductivity and heat resistance. 70-3812 NC passes NASA’s outgassing requirements per ASTM E-595-07.