engineering leaders masters series fall 2007 engineering leaders masters series master of science...

Engineering Leaders Masters Series

Fall 2007


Master of Science

with Major in

Packaging of

Electronics and

Optical Devices

Fall 2007www.engr.smu.edu

Presentation OutlinePresentation OutlineSMU School of EngineeringSMU School of Engineering

Mechanical Engineering DepartmentMechanical Engineering DepartmentGraduate Degree ProgramsGraduate Degree Programs

MS and PhD in Mechanical Engineering MS and PhD in Mechanical Engineering

Professional Degree ProgramsProfessional Degree Programs MS with a Major in Manufacturing Systems ManagementMS with a Major in Manufacturing Systems Management MS with a Major in Packaging of Electronics and Optical MS with a Major in Packaging of Electronics and Optical

DevicesDevices

Details of Professional Degree Program Details of Professional Degree Program MS with a Major in Packaging of Electronics and Optical MS with a Major in Packaging of Electronics and Optical

DevicesDevicesProfessional Certificate in Electronic Packaging FundamentalsProfessional Certificate in Electronic Packaging Fundamentals


Fall 2007

School School of of EngineeringEngineering



“At SMU, we are educating today’s engineers to be tomorrow’s engineering leaders.”

~Geoffrey Orsak, Dean

SMU School of Engineering


Five Engineering DepartmentsFive Engineering Departments

Mechanical Engineering (ME)Mechanical Engineering (ME)

Computer Science and Engineering Computer Science and Engineering

(CSE)(CSE)

Electrical Engineering (EE)Electrical Engineering (EE)

Engineering Management, Engineering Management,

Information and Systems (EMIS) Information and Systems (EMIS)

Environmental and Civil Engineering Environmental and Civil Engineering

(ENCE)(ENCE)


Student PopulationStudent Population

Undergraduate studentsUndergraduate students~ 800~ 800

Graduate StudentsGraduate Students~ 1,005 ~ 1,005

(~43 Ph.D. students)(~43 Ph.D. students)


School Of EngineeringSchool Of Engineering

First University to offer Distance Learning program with TAGER Satellite Network VHS Delivery DVD delivery Streaming Video downloads WebEx and Blackboard 100% Coverage of all graduate courses

SMU is the only university that offers a complete program in SMU is the only university that offers a complete program in Packaging of Electronics and Optical Devices via Distance Packaging of Electronics and Optical Devices via Distance LearningLearning


Fall 2007

Engineering Engineering Leader’s Leader’s Masters Masters Series Series


Engineering Leader’s Masters SeriesEngineering Leader’s Masters Series

Continuous Learning Undergraduate Certificate Graduate Beyond

Lecture Series Evening and daytime events Current and topical Experts from Industry

Networking opportunities


Delivery MethodsDelivery MethodsPackaging of Electronics and Optical DevicesPackaging of Electronics and Optical Devices

• On CampusOn Campus Traditional classroomsTraditional classrooms

• Distance LearningDistance Learning DVD deliveryDVD delivery Streaming video Streaming video

downloadsdownloads


On Campus InstructionOn Campus Instruction

Standard M/W , M/W/F or T/TH classes

Day and evening formats

Standard Fall / Spring / Summer Semesters

Taught by full-time and adjunct Faculty


Distance LearningDistance Learning

Streaming Video Downloads Flexible scheduling

Lectures are current Usually posted to the SMU

server within a few hoursof delivery

Exams are proctored

Industry students are welcome to attend on campus if convenient


Fall 2007

Mechanical Mechanical Engineering Engineering DepartmentDepartment


ME at SMU is a Research-ME at SMU is a Research-

oriented, student-centered oriented, student-centered

department. The department department. The department

promotes world class research promotes world class research

with absolute commitment to with absolute commitment to

excellence in teaching.excellence in teaching.

Mechanical Engineering Department (ME)Mechanical Engineering Department (ME)


Mechanical Engineering FacultyMechanical Engineering Faculty

1212 Full time faculty Full time faculty

77 Emeritus faculty Emeritus faculty

88 Adjunct faculty Adjunct faculty

33 Staff members Staff members

33 Post-Doctoral Research Post-Doctoral Research Associates Associates

Yildirim Hurmuzlu

Chair

Radovan Kovacevic Peter Raad Jose Lage

Wei Tong Charles Lovas Paul Krueger David Willis

Gemunu Happawana Dona Mularkey Elena Borzova Donald Price


Mechanical Engineering Degree ProgramsMechanical Engineering Degree Programs

Mechanical Engineering (ME)Mechanical Engineering (ME)BS, MS, Ph.D.BS, MS, Ph.D.

M.S. with Major in Packaging of M.S. with Major in Packaging of Electronics and Optical Devices Electronics and Optical Devices (PEOD)(PEOD)MS, Professional CertificatesMS, Professional Certificates

M.S. with Major in Manufacturing M.S. with Major in Manufacturing Systems Management (MSM)Systems Management (MSM)MS, Professional CertificatesMS, Professional Certificates


SMUSMUPackaging of Electronics and Optical DevicesPackaging of Electronics and Optical Devices

Presented from an Industry PerspectivePresented from an Industry Perspective

Donald Price, Ph.D., P.E.Donald Price, Ph.D., P.E.DirectorDirector

December 15, 2006


Why Packaging of Electronics and Why Packaging of Electronics and Optical Devices ?Optical Devices ?

In today’s environment, an engineer working in the electronics industry must constantly develop more advanced capabilities in the design and packaging of electronic systems.

These systems are becoming more complex, with ever-increasing requirements for higher reliability and lower-cost manufacturability.

To compete, you will need an understanding of the: Effect of mechanical vibrations on components and systems, Behavior of electronic components Fundamentals of optoelectronics and microelectromechanical systems

(MEMS) Failure modes and mechanisms of electronic components Current thermal management techniques Electronic materials and their material properties Basics of experimental measurements Computational techniques used in both mechanical and thermal design Fundamentals of electronic manufacturing technology.


Why Packaging of Electronics and Why Packaging of Electronics and Optical Devices ?Optical Devices ? Being trained in these disciplines, you will find yourself in high

demand, as advanced electronic and optical devices reach even further into our everyday lives.

You will learn how this program will resolve all of the issues, which currently are limiting progress in your career.


Why Southern Methodist University ?Why Southern Methodist University ?

The MS program in Packaging of Electronics and Optical Devices at SMU is one of only a few programs in the world designed to provide you, the practicing engineer, with the depth and breadth of skills in the diverse disciplines, which you need to succeed in this ever more demanding field

No time for on-campus coursework? No problem. Traveling for your employer! No problem.

This program is unique, in that it delivers courses via Distance Learning, enabling you to balance your advanced degree studies with your work priorities.

You are able to easily communicate with your SMU professors via telephone, fax, and email. Lecture notes and course materials are placed on the web site in advance of classroom lectures.


Why Southern Methodist University ?Why Southern Methodist University ?

The lectures are digitally recorded and are available for streaming video downloads from the SMU web site to your computer over the internet.

With this form of course delivery, the program is ideally suited for engineers throughout the United States and for military personnel, whether stationed in the US or abroad.

SMU offers qualified military personnel and government employees discounted tuition.


SMU’s Vision and Mission StatementSMU’s Vision and Mission Statement SMU has revised the course content and

technical approach of the M.S. degree program in Packaging of Electronic and Optical Devices

The content of the program now features electronic packaging education being presented from an industry perspective in order to provide complete instruction in the design, development, and manufacture of electronic components and systems.

SMU believes that the electronics industry in this area requires engineers with multidisciplinary skills in the fields of electronic materials science, mechanical design, and thermal management.


Vision and Mission Statement (cont)Vision and Mission Statement (cont) SMU seeks to develop students uniquely able

to contribute to the growth of the electronics and avionics in the Dallas-Ft. Worth area and around the world.

We believe that the electronics industry seeks to hire engineers with a cross-disciplinary educational background, possessing skills and capabilities in mechanical modeling, mechanical design, and thermal design, as well as an understanding of electronic materials and material properties.

To this end, we believe that the program, as now structured, meets that need


Degree Requirements,Degree Requirements,

Admission RequirementsAdmission Requirements

Admission ProcessAdmission Process


In addition to meeting the School of Engineering degree requirements for a Master of Science degree, applicants are required to satisfy the following additional requirements:

Satisfactory completion of a required core curriculum consisting of the four courses (12 hrs)

Satisfactory completion of the required six (6) electives selected from a list of eight (8) electronic packaging courses (18 hrs)

Degree RequirementsDegree Requirements


Admission RequirementsAdmission RequirementsIn addition to meeting the School of Engineering admission requirements for a Master of Science degree, applicants are required to satisfy the following additional requirements:

Bachelor of Science in one of the engineering disciplines, or in a closely related scientific field


Admission ProcessAdmission Process

Procedures and forms are located at

http://engr.smu.edu/students/graduate_admission.html

What you will need Completed application form Two recommendation forms (one from a manager or

supervisor) Current resume All official undergraduate and graduate transcripts $75 application fee


CurriculumCurriculumPackaging of Electronics and Optical DevicesPackaging of Electronics and Optical Devices

Core Courses - 12 hrs ME 7334 – Fundamentals of Electronic Packaging ME 7242 – Introduction to Thermal Management of Electronics ME 7343 – Electronic Packaging Materials:

Processes, Properties, and Testing ME 7358 – Vibration Analysis of Electronic Systems


CurriculumCurriculumPackaging of Electronics and Optical DevicesPackaging of Electronics and Optical Devices

Electronic Packaging Electives [select six (6) of eight (8) courses] - 18 hrs

ME 7314 – Introduction to Microelectromechanical Systems and Devices

ME 7335 – Convective Cooling of Electronics ME 7344 – Conductive Cooling of Electronics ME 7346 – Application of Computational Techniques to the

Mechanical and Thermal Design of Electronic Systems

ME 7348 – Thermal, Fluid, and Mechanical Measurements in Electronic Systems

ME 7360 – Electronic Product Design and Reliability ME 7367 – Electronic Manufacturing Technology ME 7359 – Analysis and Design of Optoelectronic Packages


Schedule of Course OfferingsSchedule of Course OfferingsCore CoursesCore Courses

Year 07 08 09 10Semester Fall Sp Su Fall Sp Su Fall Sp Su Fall

Core Courses (must take all

four) Course Title Name of Instructor

ME 5/7358

Vibration Analysis of Electronic Systems Santos Garza X X X

ME 5/7343

Electronic Packaging Materials: Processes, Properties, and Testing Donald Price X X X

ME 5/7342Introduction to Thermal Management of Electronics Donald Price X X X

ME 5/7334

Fundamentals of Electronic Packaging Donald Price X X X X


Schedule of Course OfferingsSchedule of Course OfferingsPackaging Elective Courses (select 6 of 8)Packaging Elective Courses (select 6 of 8)

Year 07 08 09 10

Semester Fall Sp Su Fall Sp Su Fall Sp Su Fall

Packaging Electives

(select 5 of 7) Course Title Name of Instructor

ME 5/7314

Introduction to Microelectromechanical Systems and Devices (MEMs) Santos Garza X X X X

ME 5/7359Analysis and Design of Optoelectronic Packaging

ME 5/7335Convective Cooling of Electronics Donald Price X X X

ME 5/7344Conductive Cooling of Electronics Donald Price X X

ME 5/7346

Application of Computational Techniques to the Mechanical and Thermal Design of Electronic Systems Donald Price X X

ME 5/7348Thermal, Fluid, and Mechanical Measurements in Electronics Donald Price X X X

ME 5/7360Electronic Product Design and Reliability Donald Price X X X

ME 5/7363Electronic Manufacturing Technology Santos Garza X X X


Training ProgramsTraining Programs

Professional CertificatesProfessional Certificates


Training ProgramsTraining ProgramsProfessional Certificates inProfessional Certificates in

Packaging of Electronics and Packaging of Electronics and Optical DevicesOptical Devices

Manufacturing Management Manufacturing Management FundamentalsFundamentals

Short CoursesShort CoursesCutting-edge topics for IT Cutting-edge topics for IT

professionalsprofessionals


Professional Certificate in Professional Certificate in Electronic Packaging FundamentalsElectronic Packaging Fundamentals

A Graduate Certificate is earned upon the successful completion of three (3) courses selected from the following list of four (4) core courses:

ME 7334 – Fundamentals of Electronic Packaging ME 7242 – Introduction to Thermal Management of Electronics ME 7343 – Electronic Packaging Materials:

Processes, Properties, and Testing

ME 7358 – Vibration Analysis of Electronic Systems


Admission RequirementsAdmission RequirementsProfessional Certificate inProfessional Certificate inElectronic Packaging FundamentalsElectronic Packaging Fundamentals

Students must have an undergraduate degree in science or engineering or five (5) years of directly relevant professional experience

Students who complete the requirements for the professional certificate, and meet the admission requirements, can apply for admission as a degree-seeking student in the graduate degree program in Packaging of Electronics and Optical Devices

For those students accepted into the graduate degree program, the courses taken to complete the professional certificate will count toward the graduate degree requirements


Completion RequirementsCompletion RequirementsProfessional Certificate inProfessional Certificate inElectronic Packaging FundamentalsElectronic Packaging Fundamentals

The professional certificate will be awarded upon completion of three (3) of the four (4) core courses with a grade of B or better in each of the three courses

The three courses for the professional certificate must be completed within three (3) years from admission to the program


Statement Regarding Thesis Statement Regarding Thesis RequirementRequirement

MS Degree with Major in Packaging of MS Degree with Major in Packaging of Electronics and Optical DevicesElectronics and Optical Devices


Thesis Not Required for MS DegreeThesis Not Required for MS Degree

For the MS degree with a major in Packaging of Electronics and Optical Devices, a thesis is not normally required

If the student wants to pursue a research project and has a topic of sufficient applicability to the interests of the student’s sponsoring company, it is permissible to substitute a thesis for two (2) of the ten (10) courses required for graduation


Thesis Requirement (continued)Thesis Requirement (continued)

Basic requirements for substitution: The research should be totally funded by the sponsoring

company The research may either be performed at SMU or on the

premises of the sponsoring company, depending on the topic and the scope of the work

The student will need to select a faculty member to act as thesis advisor

SMU faculty and staff, associated with the project, are willing to sign a confidentiality agreement, but there is a basic requirement that the thesis, and any publications derived from the thesis, be publishable in the open literature

Depending on the scope of the work and the level-of-effort, it may be necessary for the student’s sponsoring company to compensate the faculty thesis advisor for time required for supervision


Fall 2007

Loan Programs Loan Programs and Distributed and Distributed Payment Plan Payment Plan

for Tuitionfor Tuition


SMU Tuition Loan ProgramsSMU Tuition Loan Programs For graduate students registered for a minimum of six hours per

semester, go to http://smu.edu/financial_aid

and click on “Grad and Professional Students” Federally backed low interest loans are available, and students may be

eligible for up to $18,000 per year Payment is not required until after the student finishes his or her studies For graduate students registering for three hours per semester,

application websites for two lenders that offer educational loans

www.wellsfargo.com/student/undergrad/education/?_requestid=50321

www.educationone.com/chase-student-loans/continuing-education.htm

Both of these lenders offer loans, which are consumer/credit based with variable interest rates. Funds are disbursed directly to the student, not the school.


Distributed Tuition PaymentsDistributed Tuition Payments To ease the pain of advance tuition payments prior to reimbursement

by your company, SMU has created an arrangement whereby you can make distributed tuition payments through Sallie Mae

Two payment plans are available depending on when you apply These are: 5 month/ten month payment plan and four month payment

plan 5 Month and 10 Month Payment Plans

Due Dates – The 1st of each month beginning June 1st Enrollment fee - $50.00 for the 5 Pay Plan (Fall or Spring Only) and

$100 for the 10 Pay Plan (Fall & Spring) Last date to enroll in this plan for Fall is August 4th Students can enroll by phone (1-800-635-0120 or 1-800-556-6684),

online at www.tuitionpay.com, or by mailing in the enrollment form


Distributed Tuition PaymentsDistributed Tuition Payments 4 Month Payment Plan

Due Dates – August 25th, September 25th, October 25th, November 25th - Please note that this plan was set up so that the students MUST pay for the first (August 25th) payment and the enrollment fee AT THE TIME OF ENROLLMENT regardless of when they enroll in this plan.

Enrollment Fee - $100.00 for plans $2,499.99 or less & $150.00 for plans $2,500.00 or more.

The last date to enroll in this plan for Fall is September 30th The only way to enroll for this plan is by PHONE. Students cannot

enroll online. The 5 Month Payment Plan is offered before the fall semester begins. The 4 Month Payment Plan is offered to those students who are not able

to make payment after payment due date. Those students who enroll on the 4 Month Payment Plan are also responsible for a $100 Late Payment Fee in addition to the enrollment fee.


Fall 2007

Thumbnail Thumbnail Sketches Sketches of of CourseworkCoursework


Core CoursesCore Courses

ME 7334 - Fundamentals of Electronic Packaging This course is an introduction into all aspects of the packaging of

electronics covered in this degree program ME 7342 – Introduction to Thermal Management of Electronics

This is an introductory course into all of the methods used for the thermal design and thermal management of electronic components and systems

ME 7343 - Electronic Packaging Materials: Processes, Properties, and Testing

This course covers all of the materials used in electronic components and systems and the properties of those materials

ME 7358 – Vibration Analysis of Electronic Systems This course introduces all aspects of the mechanical design of

electronic components and systems, particularly in the areas of vibrations and mechanical shock


Packaging ElectivesPackaging Electives ME 7314 - Introduction to Microelectromechanical Systems

(MEMS) and Devices This course develops the basics for microelectromechanical devices

and systems, including microactuators, microsensors, and micromotors, micromachining techniques (surface and bulk micromachining), and microfabrication techniques

ME 7335 - Convective Cooling of Electronics This course reviews of the fundamentals of convection heat transfer,

followed by applications of these principals to the convective cooling of electronic components and systems. Special topics in convective cooling, such as spray cooling, jet-impingement cooling, microchannel cooling, and heat pipe applications will also be included.

ME 7344 - Conductive Cooling of Electronics This course reviews of the fundamentals of conduction heat transfer,

followed by application to the conductive cooling of electronics. Special topics in conductive cooling, such as contact conductance, interface thermal resistance, heat spreaders, thermal interface materials, phase change materials, and thermoelectric devices


Packaging Electives (continued)Packaging Electives (continued) ME 7346 - Application of Computational Techniques to the

Mechanical and Thermal Design of Electronic Systems

This course focuses on the utilization of CAD tools to develop mechanical and thermal models of electronic systems and to design elements of these systems

ME 7348 - Thermal, Fluid, and Mechanical Measurements in Electronics

This course covers all methods of experimental measurements used in the design and testing of electronic systems. In addition, proper experimental procedures will be discussed

ME 7359 - Analysis and Design of Optoelectronic Packaging This course will cover optical fiber interconnections, packaging for

high-density optical back planes, selection of fiber technologies; semi-conductor laser and optical amplifier packaging, optical characteristics and requirements, optical alignment, and packaging


Packaging Electives (continued)Packaging Electives (continued)

ME 7360 - Electronic Product Design and Reliability This course will investigate the failures, failure modes, and

failure mechanisms in electronic systems, including failure detection, environmental stress tests, and failure analysis.

In addition, this course will cover temperature as a reliability factor and provide an overview of high temperature electronics, the use of silicon devices at high temperatures, and the selection of passive devices for use at high temperatures.

ME 5/7363 - Electronic Manufacturing Technology This course covers an introduction to the electronics

manufacturing industry, electronic components, interconnections, printed wiring boards, soldering and solderability, automated assembly, including leaded component insertion and surface mount device placement

engineering leaders masters series fall 2007 engineering leaders masters series master of science...

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