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TRANSCRIPT
EMBEDDED
EMBEDDED SOLUTIONS
DATA MODUL offers perfectly coordinated embedded computer systems based on x86
and ARM architectures. From pre-configured kits, complete custom baseboard design
to professional embedded computing design – DATA MODUL provides the full range of
embedded solutions. Display control technology is offered in a wide variety of building
blocks and solutions based on DATA MODUL’s proprietary know-how.
› CPU boards
› Embedded box PCs › eMotion LCD controller boards
› Embedded computing design
INDEX
Competencies .......................................................... 4
Technologies and Brands ....................................... 8
Markets and References ....................................... 10
Products ................................................................. 12
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› Large product portfolio of x86 and ARM
based embedded boards
› Various form-factors and performance
levels
› Long-term partnership with world-leading
manufacturers of embedded products
› Intel based COM Express® Modules
› Single board computers & baseboard
designs
› Compact and rough housing concepts
› Extensive distribution portfolio of leading
box PC manufacturers
› Available with IP protection classes IP20
to IP65
› Extended temperature range
› With different certifications available
› Configurable on customer demands
(Memory, SSD, OS, interfaces)
› High-end board solutions for displays
up to UHD/4k resolution
› Latest display interfaces and inputs
› Fully configured plug & play kits with
converter, power supply, cables and
OSD board
› For outstanding image quality
CPU BOARDS EMBEDDED BOX PCseMotion LCD CONTROLLER BOARDS
DATA MODUL embedded solutions comprise CPU modules, baseboards, single board computers
and LCD controller boards developed entirely in-house.
› Pre-configured kits consisting of embedded
board, display and fitting cable set
› Adaption and integration of all available
displays (TFT-LVDS, TFT-TTL, eDP) incl.
inverters, tested cables and adapted
power ON/OFF timing
› Customized images for embedded
operating systems
› Custom embedded OS services
EASYKIT-SOLUTIONS
COMPETENCIES
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› Long-term availability of at least 5 years
› Professional PCN/EOL processes
› In-house FAE team and worldwide sales offices to
quickly and flexibly meet even major challenges
and deadlines
› Long-term partnership with world-leading
manufacturers of embedded products
› Adaption and integration of TFTs including video
BIOS (certified settings for each TFT available)
› Accessories like memory modules, mass-storage
and extension modules
› Customization based on standard products
› Programmable logic
› BIOS/UEFI support
› Bootloader support
› Driver development, APIs
› Board support packages
› Mainline based Yocto Linux OS
SOFTWARE DEVELOPMENTEMBEDDED COMPUTING DESIGN SERVICES & SUPPORT CUSTOMER ADVANTAGES
DATA MODUL is greatly expanding its display control expertise. An experienced engineering team
dedicated to developing professional embedded computing designs now supports high quality
product development for industrial use. Customers benefit from the modular concept resulting in
validated core components, reduced development time and less time for validation.
› Schematic and layout review
› Design validation
› Comprehensive technical support
› Compliance measurements
› Custom embedded OS services
(WES8, WES7, WinXPe, WinCE6,
WinEC7, WinEC2013, Win10IoT,
Embedded Linux)
› Standard and customized computer-on-modules,
baseboard designs and single board computers
› Latest CPU platforms
› Latest professional measuring equipment
› Failure mode and effects analysis
› R & D sites in Germany
› System integration with all other key technologies
including display, touch sensor and certifications
› From low power single-core designs up to high end
multi-core solutions
› Part selection in consideration of cost and quality
COMPETENCIES
› Form factors, e.g. ATX, Micro-ATX, Mini
ITX, Pico ITX, 3.5” and more
› No carrier board needed
› “Off-the-shelf” solutions
› Proven reference design based on
Computer-On-Modules
› Building blocks for reduced
development time and cost
› All performance levels
› Form Factors, e.g. COM Express, Qseven,
SMARC, Colibri and more
› Customer-specific carrier board
› x86-based modules
› ARM-based modules
EBX 146 x 203 mm / 5.75” x 8.0”
EPIC 115 x 165 mm / 4.5” x 6.5”
3.5” 102 x 145 mm / 4.02” x 5.71”
PC/104 90 x 96 mm / 3.575” x 3.775”
Pico-ITX 100 x 72 mm / 3.9” x 2.8”
COM Express mini 84 x 55 mm
COM Express compact 95 x 95 mm
COM Express basic 125 x 95 mm
› Avalue
› congatec › MSI
› F&S › Toradex
› ASRock
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In addition to the product portfolios of all major embedded manufacturers, DATA MODUL offers
a wide range of professionally designed embedded solutions, developed and designed by the
in-house development team based in Deggendorf.
TECHNOLOGIES & BRANDS
FULL-CUSTOM DESIGN DISTRIBUTION PARTNERSSINGLE BOARD COMPUTER (SBC) COMPUTER-ON-MODULES (COM)
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DATA MODUL understands that embedded technology is a rapidly growing market. Its aim is to further consolidate this market growth through its innovative product portfolio. The following applications are just an example.
› Dedicated certifications
› Particular electromagnetic
compatibility (EMC)
› Long-term availability
› High performance CPU boards
› Embedded solution with
custom dimensions
› Independent driving of
several displays
› Ultrasonic devices
› Computer tomography
› Non-invasive ventilation
› Slot machines
› Player tracking systems
› Kiosk
› Long life solutions
› Shock resistance
› Obsolescence management
› Computer numeric control
› Diagnostic systems
› Machine control
› Low power consumption
› Vibration resistance
› High signal-to-noise-ratio
› Passenger information system
› Ticket vending machines
› Control stand applications
› Reliable operation
› High durability
› Extended temperature range
› Human machine interfaces
› Sensors
› Motion control
› IOT-ready embedded
solutions
› Driving solutions for high
resolution displays
› Low power consumption
› Building automation
› Security
› Access control systems
MARKET DEMANDS MARKET DEMANDS
REFERENCE APPLICATIONS REFERENCE APPLICATIONS
MEDICINE & HEALTHCARE
MECHANICAL ENGINEERING
AUTOMATION & ROBOTICS
BUILDING TECHNOLOGY
TRANSPORTATIONDIGITAL SIGNAGE & GAMING
MARKETS & REFERENCES
Mechanical Engineering
Gam
ing
Ou
tdo
or MaritimeAutomotive
Transportation
Point of Sales
Digital Signage
Automation & Robotics
MedicineBuilding Technology
Wh
ite Go
od
s Portable Application
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eDM-COMB-KL6 eDM-COMB-SL6
Formfactor COM Express Basic Type 6 COM Express Basic Type 6
Processor 7th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E36th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E3, Celeron® G3900E/G3902E
Chipset Mobile Intel® 100 series, QM175, HM175 and CM238 Mobile Intel® 100 series, QM170, HM170 and CM236
DRAM2x DDR4 SO-DIMMs up to 2400MT/s and 32 Gbyte, Intel® Xeon® and Intel® i3 with ECC support
2x DDR4 SO-DIMMs up to 2133MT/s and 32 GByte, Intel® Xeon® with ECC support
Mass storage 4x SATA 3 4x SATA 3
Bus 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO
Ethernet 10/100/1000BaseT 10/100/1000BaseT
I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)
Panel Interface LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.) LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.)
Audio HD audio HD audio
OthersDMEC board controller, TPM 1.2/TPM 2.0, Intel® Optane memory
DMEC board controller, TPM 1.2/TPM 2.0
eDM-COMB-BW6 eDM-COMB-HW6
Formfactor COM Express Basic Type 6 COM Express Basic Type 6
Processor 5th Gen Intel® Core™ i7/Intel® Xeon® E34th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E3, Celeron® 2000E/2002E
Chipset Mobile Intel® 8 Series QM87 and HM86 Mobile Intel® 8 Series QM87 and HM86
DRAM 2x DDR3L SO-DIMMs up to 1600MT/s and 32 GByte 2x DDR3L SO-DIMMs up to 1600MT/s and 32 GByte
Mass storage 4x SATA 3 4x SATA 3
Bus 7x PCIe Gen 2, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO 7x PCIe Gen 2, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO
Ethernet 10/100/1000BaseT 10/100/1000BaseT
I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2)
Panel Interface LVDS 2x 24/eDP, 3 x DDI (DP++, HDMI, DVI), 1x VGA (opt.) LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.)
Audio HD audio HD audio
Others DMEC board controller, TPM 1.2/TPM 2.0 DMEC board controller, TPM 1.2/TPM 2.0
COMPUTER-ON-MODULES
KABYLAKE
› 7th Gen Intel®
Core™ processor
SKYLAKE
› 6th Gen Intel® Core™
processor
BROADWELL
› 5th Gen Intel® Core™
processor
HASWELL
› 4th Gen Intel® Core™
processor
BRASWELL
› 4th Gen Intel®
AtomTM processor
APOLLO LAKE
› 5th Gen Intel® Atom™
SoC processor
eDM-COMC-BS6 eDM-COMB-AL6
Formfactor COM Express Basic Type 6 COM Express Basic Type 6
Processor
Intel® Pentium® N3710, QC 2.56 GHzCeleron® N3160 QC 2.24 GHzCeleron® N3060 DC 2.48 GHzCeleron® N3010 DC 2.24 GHzAtom™ X5-E8000 QC 2.00 GHz
Intel® Pentium® N4200, QC 2.50 GHzCeleron® N3350 DC 2.40 GHzAtomTM x5-E3950 QC 2.00 GHzAtomTM x5-E3940 QC 1.80 GHzAtomTM x5-E3930 DC 1.80 GHz
Chipset Integrated in SOC Integrated in SoC
DRAM 2x DDR3L SO-DIMMs up to 1600MT/s and 8 GByte 2x DDR3L SO-DIMMs up to 1866MT/s and 8 GByte
Mass storage2x SATA 3, 1x microSD card socket (opt.)max. 64 Gbyte eMMC onboard
2x SATA 3, 1x microSD card socket (opt.) max. 64 Gbyte eMMC onboard
Bus 3x PCIe Gen 2, LPC, SPI, I²C, GPIO 5x PCIe Gen 2, LPC, SPI, I²C, GPIO
Ethernet 10/100/1000BaseT 10/100/1000BaseT
I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)
Panel Interface LVDS 2x 24/eDP, 2x DDI (DP++, HDMI, DVI), 1 x VGA (opt.) LVDS 2x 24/eDP 1.3, 2x DDI (DP++, HDMI, DVI), 1x VGA (opt.)
Audio HD audio HD audio
Others DMEC board controller, MIPI-CSI 2.0, TPM 1.2 / TPM 2.0b DMEC board controller, TPM 1.2/TPM 2.0
FLEXIBLE SOLUTION FOR ARM BASED PANEL PCS
eDM-CB-Colibri
Formfactor 115 mm x 76 mm
Processormodules Entire Colibri family (SO-DIMM)
Mass Storage microSD card slot
Ethernet RJ45 ethernet connector
USB3x USB 2.0 Type-A host, 2x USB 2.0 host pin header (1x shared), 1x USB OTG Micro
Panel Interface 24 bit TTL-RGB, 2x 24 bit LVDS, HDMI, VGA
Internal I/OSPI, UART, PWM, GPIO, analog input, I²C, CAN, RS232/485/422
Supply Voltage 9 to 24 VDC
On-Board Power Supplies 12 VDC Max. 1A, 5 VDC max. 6A, 3.3 VDC max. 3A
› ARM baseboard for Toradex
Colibri module (115 x 76mm)
› 24 Bit TTL RGB & LVDS to WXGA
› 4x USB 2.0 host and 1x USB OTG
› Interfaces: LAN, RS232/485/422,
CAN,I²C, SPI, RTC, GPIO
› Wide power input:
9 VDC to 24 VDC
› Power supply to drive
panels up to 10.4”
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conga-TS170 conga-TS175 conga-TCA5
Formfactor COM Express Type 6 COM Express Basic Type 6 COM Express Mini Type 10
Processor6th Gen Intel® Core™/Celeron® processors („Skylake“)
7th Gen Intel® Core™/Intel® Xeon® E3 processors („Kabylake“)
5th Gen Intel® Atom™/Celeron®/Pentium® processors („Apollo Lake“)
Chipset Mobile Intel® 100 Series Mobile Intel® 100 Series Integrated Intel® SoC
DRAM2x DDR4 SO-DIMMs up to 2133MT/s and 32 Gbyte
2x DDR4 SO-DIMMs up to 2400MT/s and 32 GByte
2x DDR3L SO-DIMMs up to 1687MT/s and 8 GByte
Mass storage
4x SATA Gen 3 4x SATA Gen 32x SATA 3.0, up to 64 GByte eMMC onboard
Bus8x PCIe Gen 3, LPC, I²C, 2x UART
8x PCIe Gen 3, LPC, I²C, 2x UART 5x PCIe, LPC, SPI, I²C, 2x UART
Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT
I/O 8x USB 2.0, 4x USB 3.0 8x USB 2.0, 4x USB 3.0 4x USB 3.0, 8x USB 2.0
Panel Interface
3x DP 1.2/HDMI, LVDS 2x 24bit 3x DP 1.2/HDMI, LVDS 2x 24bit2x DP/HDMI/LVDS 2x 24 bit, 1x eDP optional
Audio HD audio HD audio HD audio
Others ACPI 4.0 with battery support ACPI 4.0 with battery supportACPI 5.0 with battery support, ext. temp. -versions available
conga-MA3 conga-MA4 conga-MA5
Formfactor COM Express Basic Type 10
Processor3rd Gen Intel® Atom™/Celeron® processors („Bay Trail)
4th Gen Intel® Atom™/Celeron®/ Pentium® processors („Braswell“)
5th Gen Intel® Atom™/Celeron®/Pentium® processors („Apollo Lake“)
Chipset Intel® SoC integrated Intel® SoC integrated Integrated in SoC
DRAMMax. 8 Gbyte DDR3 onboard DDR3
max. 4 GByte DDR3L 1600 Up to 8 GByte DDR3L onboard
Mass storage
2x SATA, eMMC up to 64 GByte, SDIO
2x SATA 3.0, SDIO, up to 32 GByte eMMC
2x SATA 3.0, up to 64 Gbyte eMMC onboard
Bus 4x PCIe, LPC, I²C, SMBus, SPI 3x PCIe, I²C, 2x UART, SMBus 3x/4x PCIe, I²C, 2x UART, SMBus
Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT
I/O 7x USB 2.0, 1x USB 3.0 8x USB 2.0, 2x USB 3.0 6x USB 2.0, 2x USB 3.0/2.0
Panel Interface
LVDS 1x 24, 1x HDMI/DPLVDS 1x 18 bit/1x 24 bit, 2x DP/HDMI/DVI, 1x eDP
LVDS 1x 18 bit/1x 24 bit or eDP, 1x DP/HDMI
Audio HD audio HD audio HD audio
OthersACPI 5.0 with battery support, ext. temp. -versions -40°C to 85°C
ACPI 5.0 with battery support ACPI 5.0 with battery support
conga-QA3 conga-QA4 conga-QA5 conga-SA5
Formfactor Qseven™ (70 x 70 mm) Qseven™ (70 x 70 mm) μQseven™ (70 x 70 mm) SMARC 2.0 (82 x 50 mm)
Processor3rd Gen Intel® Atom™/Celeron®/Pentium® processors („Bay Trail“)
4th Gen Intel® Atom™/Celeron®/Pentium® processors („Braswell“)
5th Gen Intel® Atom™/Celeron®/Pentium® processors („Apollo Lake“)
5th Gen Intel® Atom™/Celeron®/Pentium® processors („Apollo Lake“)
Chipset Integrated in SOC Integrated in SOC Integrated in SOC Integrated in SOC
DRAM Up to 8 GByte DDR3 onboard Up to 8 GByte DDR3L onboard Up to 8 GByte DDR3L onboard up to 8 GByte DDR3L onboard
Mass storage2x SATA, 1x SDIO, up to 32 GByte eMMC onboard
2x SATA 3.0, 1x SDIO, up to 64 Gbyte eMMC onboard
1x SATA 3.0, up to 64 GByte eMMC onboard
1x SATA 3.0,up to 64 Gbyte eMMC onboard
Bus LPC, SPI, I²C, 3x PCIe LPC, SPI, I²C, 3x PCIe SPI, I²C, 1x PCIe, LPC 4x PCIe, 2x I²C, , 2x SPI
Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT 10/100/1000 BaseT
I/O6x USB 2.0 or 1x USB 3.0 and 5x USB 2.0
8x USB 2.0 or 1x USB 3.0 and 5x USB 2.0
5x USB 2.0, 1x USB 3.0/2.0 4x USB 2.0, 2x USB 3.0
Panel Interface LVDS 2x 24/HDMI or DP LVDS or 2x eDP, DP or HDMILVDS (single/dual channel)/eDP, HDMI or DP
LVDS 2x 24 /eDP, HDMI or DP
Audio HD audio HD audio HD audioHD audio/integrated audio DSP
OthersACPI 5.0 compliant, smart battery management, ext. temp. -versions available
MIPI-CSI 2.0 for up to 2x HD-cameras, hardware accelerating video decoding
1x MIPI-CSI x4/1x MIPI-CSI x2, smart battery management, ext. temp. -versions available
1x MIPI-CSI x4/1x MIPI-CSI x2, smart battery management, ext. temp. -versions available
COMPUTER-ON-MODULE ADVANTAGES COMPARED TO FULL CUSTOM DESIGNS
CONCEPT
› CPU module with standard PC core
functions
› Carrier board with customer specific
functions & size
› Logical alternative to a chip-down
design effort
BENEFITS
› Faster time to market
› Reduced development costs
› Scalable product range
› Allows customer focus on system
features
› Faster reaction to market trends
› Second source philosophy
› Minimize inventory cost
COMPUTER-ON-MODULES
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Apalis T30 Apalis i.MX6 Apalis TK1
Formfactor MXM3 (82.0 x 45.0 x 6.0 mm)
OSLinux or Win EC7, Win EC 2013 incl. runtime license
Linux or Win EC7, Win EC 2013 incl. runtime license
Linux
ProcessorNVIDIA®Tegra 3 CortexA9 Quad-Core up to 1.4 GHz
NXP® i.MX 6 Cortex-A9 (Dual-/ Quad-Core) up to 1.0 GHz
NVIDIA®Tegra K1 CortexA15 Quad-Core up to 2.2 GHz
RAM 1 GByte/2 GByte RAM onboard512 MByte/1 GByte/2 GByte RAM onboard
2 GByte RAM onboard
Mass storage
4 GByte/8 GB eMMC flash onboard 4 GByte eMMC flash onboard 16 GByte eMMC flash onboard
Ethernet 10/100/1000 MBit
I/O2x CAN, 4x UART, 3x USB, 3x I²C, 2x SPI, PCIe, SATA, 4-wire res. touch
2x CAN, 5x UART, 5x USB, 3x I²C, 3x SPI, PCIe, SATA, 4-wire res. touch
2x CAN, 10x UART, 3x USB 3.0, 7x I²C, 5x SPI, 1 x USB 2.0, PCIe, 1 x SATA 2, 4-wire res. touch
Graphics NVIDIA GPU up to Full HD (1080p) Vivante up to Full HD (1080p) NVIDIA GPU up to Ultra-HD (4k)
Panel Interface
24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI
24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI
1 x 24 Bit LVDS, HDMI
Audio In/Out/Mic
OthersMax. 127 GPIOs, 4x ADC, temp. 0°C to 70°C (-40°C to 85°C)
Max. 135 GPIOs, 4x ADC, temp. 0°C to 70° C (-40°C to 85°C)
Max. 92 GPIOs, 21 x AI (12Bit), temp. -20°C to 85°C
APALIS
The latest SOM product family Toradex integrates high performance ARM® embedded processors from Nvidia®
and NXP®. This offers solution for a numerous of multimedia / industrial applications with long-term availability.
Apalis 82.0 x 45.0 mm / 3.22” x 1.77”
Colibri 67.6 x 36.7 mm / 2.66“ x 1.44“
ARM BASED COM-MODULES
Colibri VF50 Colibri VF61 Colibri iMX7D / 7S
Formfactor SO-DIMM, (67.6 x 36.7 mm)
OSLinux or Win CE6, Win EC7 incl. runtime license
Linux or Win CE6, Win EC7 incl. runtime license
Linux or Win EC7, Win EC 2013 incl. runtime license
ProcessorNXP® Vybrid™ ARM Cortex™-A5 400MHz
NXP® Vybrid™ ARM Cortex™-A5 500MHz, Cortex™-M4 167 MHz
NXP® i.MX 7Solo /Dual ARM Cor-tex™-A7800MHz/1.0GHz, Cortex™-M4 200MHz
RAM 128 MByte DDR3 256 MByte DDR3 256 MByte/512 MByte/1 GByte DDR3
Mass storage 128 MByte NAND 512 MByte SLC NAND 512 MByte SLC NAND
Touch interfaces
4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/UART
Ethernet 10/100Mbit IEEE1588 + 2nd RGMI 10/100Mbit IEEE1588 + 2nd RGMI 10/100Mbit IEEE1588 + 2nd RGMI
I/O2x CAN, 5x UART, 2x USB, 4x I²C, 17x PWM
2x CAN, 5x UART, 2x USB, 4x I²C, 17x PWM
2x CAN, UART, 2x USB, I²C, SPI, PWM
Graphics 2D acceleration max. 1024 x 768 pixel 2D acceleration max. 1024 x 768 pixel 2D acceleration max. 1920 x 1080 pixel
Panel Interface
24Bit TTL-RGB 24Bit TTL-RGB 24Bit TTL-RGB
Audio In/Out/Mic In/Out/Mic
OthersMax. 101 GPIOs, 2x analog input, 1x camera interface, temp. 0°C to 70°C (-40°C to 85° C)
Max. 101 GPIOs, 2x analog input, 1x camera interface, temp. 0°C to 70°C (-20°C to 85° C)
External bus: 16 Bit temp. -20°C to 85°C
Colibri iMX6DL / 6S Colibri T20 Colibri T30
Formfactor SO-DIMM, (67.6 x 36.7 mm)
OSLinux or Win EC7, Win EC 2013 incl. runtime license
Linux or Win CE6, Win EC7 incl. runtime license
Linux or Win EC7, Win EC 2013 incl. runtime license
ProcessorNXP® i.MX6 Solo /I.MX6 DualLite 1x Cortex-A9 1.0 GHz / 2x Cortex-A9 1.0 GHz
NVIDIA® Tegra 2 Cortex-A9 Dual 1.0 GHz
NVIDIA® Tegra 3 CortexA9 Quad 1.4 GHz
RAM 512 MByte/256 MByte DDR3 512 MByte/256 MByte DDR3 1 GByte DDR3
Mass storage 4 GByte eMMC 512 MByte/1 GByte NAND 4 GByte eMMC
Touch interfaces
4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C /USB/UART
Ethernet 10/100 Mbit IEEE1588 10/100 Mbit 10/100 Mbit
I/O 2x CAN, UART, 2x USB, I²C, SPI, PWM 5x UART, 2x USB, 2x I²C, 4x SPI, 4x PWM 5x UART, 2x USB, 3x I²C, 5x SPI, 4x PWM
Graphics Vivante up to Full HD (1080p) Nvidia up to Full HD (1080p) Nvidia up to Full HD (1080p)
Panel Interface
24 Bit TTL-RGB, HDMI 24 Bit TTL-RGB, HDMI , VGA 24 Bit TTL-RGB, HDMI , VGA
Audio In/Out/Mic In/Out/Mic In/Out/Mic
OthersExternal bus 32Bit, max. 110 GPIOs, 4x ADC, temp. 0°C to 70°C (-40°C to 85°C)
Max. 110 GPIOs, 4x analog input, temp. 0°C to 70°C (-20°C to 85°C)
External bus 16Bit, max. 110 GPIOs, 4x analog input, temp. 0°C to 70°C (-40°C to 85° C)
COLIBRI
The Colibri product family ARM® envelop currently twenty scalable boards from low power to high performance.
Toradex integrates embedded SoC from Nvidia®/ NXP® and Marvell.
ARM BASED COM-MODULES
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EFUS™/QSEVEN™ The new small “efus™” SOM product family with the latest scalable NXP® I.MX processors, offers solution for
every application.
ARMSTONE™ armStone™ SBC product family is the fastest way to start a project, an addition carrier board is not required.
efus™A9 efus™A9X efus™A7UL efus™A53LS
Form factor efus™ (47 x 62,1 mm)
OS Android, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
ProcessorNXP® i.MX 6 Cortex-A9 (Solo-/DualLite/Quad) up to 1.2 GHz
NXP® i.MX 6 Cortex-A9 SolX max. 1.0 GHz u. Cortex M4 200 Mhz
NXP® i.MX 6 Cortex-A7 UltraLite max. 696 MHz
NXP® QorIQ®LS1012A Cortex®-A53-800 MHz (Layerscape)
DRAM Max. 2 GByte onboard Max. 2 GByte onboard Max. 1 GByte onboard 512MB onboard
Mass storageMax. 32 GByte eMMC, 1 GByte NAND, SATA
Max. 32GByte eMMC, 1 GByte NAND
Max. 32GByte eMMC, 1 GByte NAND
64 MB QSPI NOR Flash
Ethernet 10/100/1000 MBit 2x 10/100/1000 MBit 2x 10/100/1000 MBit 2x 10/100/1000 MBit
I/O2x CAN, 4x UART, 2x USB, I²C, 2x SPI, PCIe
2x CAN, 4x UART, 2x USB, I²C, SPI
2x CAN, 4x UART, 2x USB, I²C, SPI
1x CAN, 1x UART, 1x USB 3.0 OTG, 1x PCIe, 1x SATA, 1x SDIO
GraphicsVivante GPU up to Full HD (1080p)
Integrated up to 1280 x 1024 pixel (WXGA)
Integrated up to 1280 x 1024 pixel (WXGA)
N/a
Panel Interface 18bit TTL-RGB, 2x 24Bit LVDS 18 bit TTL-RGB, 24Bit LVDS 18 bit TTL-RGB N/a
Audio I²S I²S I²S N/a
OthersTemp. 0°C to 70° C (-20°C to 85° C)
Optional: IEEE802.11b/g/n, BT3.0, temp. 0°C to 70°C (-20°C to 85°C)
Optional: IEEE802.11b/g/n, BT3.0, temp. 0°C to 70°C (-20°C to 85°C)
Bluetooth 4.0, WLAN, temp. 0°C to 70°C (-20°C to 85° C)
armStoneA5 armStoneA8 armStoneA9 armStoneA9r2
Formfactor Pico-ITX (100 x 72 mm)
OS Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
ProcessorNXP® Vybrid Cortex-A5 500 MHz/Cortex-M4 167 MHz
Samsung S5PV210 Cortex-A8 800 MHz 1.0 Ghz
NXP® i.MX 6 Cortex-A9 (Solo-/ Dual-/Quad), 800 Mhz up to 1.0 GHz
NXP® i.MX 6 Cortex-A9 (Solo/ DualLite / QuadPlus) 1.0 GHz
DRAM Max. 1 GByte onboard Max. 1 GByte onboard Max. 4 GByte onboard Max. 4 GByte onboard
Mass storage Max. 512 MByte onboard Max. 512 MByte onboard Max.1 GByte NANDMax. 32 GByte eMMC, 1 GByte NAND
Ethernet 1-2 ETH 10/100 MBit 1-2 ETH 10/100 MBit 10/100/1000 MBit 10/100/1000 MBit
I/O1-2x CAN, 3x UART, 2x USB, I²C, SPI
1x CAN, 3x UART, 2x USB, I²C, SPI
1-2x CAN, 3x UART, 5x USB, I²C,SPI, mPCIe, SATA
2x CAN, 5x UART, 5x USB, I²C, SPI, mPCIe, SATA
GraphicsIntegrated up to 1024 x 768 pixel
Integrated up to Full HD (1080p)
Vivante GPU up to Full HD (1080p)
Vivante GPU up to Full HD (1080p)
Panel Interface
18 Bit TTL-RGB, 18Bit LVDS 18 Bit LVDS, HDMI18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI
18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI
Audio In/Out/MIC
OthersMax. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)
Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)
Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)
Bluetooth BT3.0 IEEE 802.11a/b/g/n
ARM BASED COM-MODULES
› LCD-controllers especially designed for the
needs of industrial customers
› Long term availability and product stability
› Fully configured plug & play kits
› Outstanding image quality
eMotion UHD eMotion USB
Input/s 2x DP (1.2)/HDMI (1.4)/DVI (Dual-Link) 1x USB Type C with Alternate Mode
Display Support V-BY-One 8 lanes, eDP 8 lanes 2 channel LVDS interface
Color Depth 24/30 Bit (1,07 Mrd) 6/8 Bit
Max. Resolution Up to 3840 x 2160 pixel @60Hz (UHD) Up to 1920 x 1200 pixel
Dimming Support Analog and PWM Analog and PWM
Power 12/24V USB-PD (5 to 20 VDC)
Mechanical Dimensions
140 x 140mm 80 x 100mm
Special Features DDC/CI support, OSD keyboard or IR commanderUSB Type C Input (DP-signals with USB-PD), 1x USB 2.0 (external for e.g. keyboard/mouse), 1x USB 2.0 (internal for e.g. touch controller), 1x stereo audio out
Summary High-end board for UHD/4k displaysThe new cost effective "one cable solution" for compact & slim monitor designs
eMotion ST2:2/eMotion ST2:3 eMotion ST1:3
Input/s RGB/DVI on ST2:2, DP(1.1)/DVI-I on ST2:3 DP (1.1)/RGB/DVI
Display Support 2 channel LVDS interface 2 channel LVDS interface
Color Depth 6/8 Bit 6/8 Bit
Max. Resolution Up to 1920 x 1200 pixel Up to 1920 x 1200 pixel
Dimming Support Analog and PWM Analog and PWM
Power 12/24V 12/24V
Mechanical Dimensions
96 x 96mm 149.9 x 110mm
Special Features DDC/CI support, OSD via RS232DDC/CI support, OSD via RS232, large screen support, 24V->12V DC/DC converter for 12V backlight
Summary Entry level board with attractive price Midrange board, especially for large screen applications
eMotion ST5:3 eMotion ST3:4
Input/s DP (1.1)/RGB/DVI (via special connector) DP (1.2)/HDMI (1.4)/DVI/RGB/CVBS / YC
Display Support 2 channel LVDS interface 4 channel LVDS interface and DisplayPort output
Color Depth 6/8 Bit 8/10 Bit
Max. Resolution Up to 1920 x 1200 pixel Up to 2560 x 1600 pixel
Dimming Support Analog and PWM Analog and PWM
Power 12/24V 5/12V
Mechanical Dimensions
120 x 100 x 8.5mm 155 x 115mm
Special FeaturesDDC/CI support, OSD via RS232, low profile for special applications
DDC/CI support, OSD via RS232, IR option, onboard memory, DP daisy chaining, support for large screens and ambient light sensor, PIP, PBP, 10bit support, FRC (60->120Hz), up- /downscaling
SummaryEntry level board for low profile or DisplayPort only applications
High-end board for all possible requirements
LCD CONTROLLER BOARDS
20 | www.data-modul.com [email protected] 21
3.5” SBC-210 MS-98F6 / MS-98G6 MS-98I8 ECM-BSW
Formfactor 3.5“
ProcessorIntel® Celeron® N2930 1.83 GHz/J1900 2.0 GHz
Intel® Celeron® N2930 1.83 GHz/J1900 2.0 GHz
Intel® Celeron® N3160 1.6 GHz/N3010 1.04 GHz
Intel® Celeron® N3160 1.6 GHz
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM Max. 8 GByte DDR3L 1333 Max. 8 GByte DDR3L 1333 Max. 8 GByte DDR3L 1600 Max. 8 GByte DDR3L 1600
Mass storage2x SATA, 1x mSATA
1x SATA 1x mSATA
1x SATA 1x mSATA
1x SATA 1x mSATA
Bus 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe (one-half-size)
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O2x USB 3.0, 6x USB 2.0, 4x COM
1x USB 3.0, 7x USB 2.0, 6x COM
4x USB 3.0, 2x USB 2.0, 4x COM
4x USB 3.0, 2 x USB 2.0, 5x COM
Panel Interface CRT/LVDS 2x24/HDMICRT/LVDS 2x24/HDMI (MS-98G6: DVI)
LVDS 2x24/HDMI/DPLVDS 2x24/HDMI (VGA optional)
Audio HD audio HD audio with amplifier HD audio HD audio
Others 8x GPIO 8x GPIO 8x GPIO16x GPIO, touch controller (optional)
Power Requirement 9 to 36 VDC 12/19/24 VDC 9 to 36 VDC 12 to 26 VDC
SINGLE BOARD COMPUTERS
Pico-ITX eDM-pITX-BT MS-98H6 EPX-APL SOM-P101
Formfactor Pico-ITX
ProcessorIntel® Celeron® J1900 2.0 GHz
Intel® Celeron®/ Pentium® N3010/N3160/N3710
Intel® Celeron® N3350 (Apollo Lake)
Intel® Celeron® N3350/ Pentium® N4200 (Apollo Lake)
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAMMax. 4 GByte DDR3L 1600 onboard
2 GByte DDR3L 1600 onboard
Max. 8 GByte DDR3L 1600 Max. 8 GByte DDR3L 1600
Mass storage1x SATA 1x mSATA (half-size)
1x SATA 1x mSATA
1x SATA 1x M.2
1x SATA 1x mSATA
Bus 2x Mini PCIe (half-size) 1x Mini PCIe (one half-size) 2x M.2 1x Mini PCIe, 1x M.2
Ethernet 10/100/1000BaseT 10/100/1000BaseT Dual 10/100/1000BaseT 10/100/1000BaseT
I/O1x USB 3.0, 3x USB 2.0, 2x COM
2x USB 3.0, 4x USB 2.0, 2x COM
2x USB 3.0, 4x USB 2.0, 1x COM
1x USB 3.0, 2x USB 2.0, 2x COM
Panel Interface LVDS 2x 24/DP LVDS 2x 24/HDMI/DP LVDS 2x 24/HDMI/DP LVDS 2x 24/HDMI
Audio HD audio HD audio HD audio with amplifier HD audio
Others CAN 2.0, 8x GPIO, SMB, I²C 16x GPIO 8x GPIO 8x GPIO, MIOe extension
Power Requirement 12 VDC 12 VDC 12 VDC 12 VDC
Small-sized and fully-integrated single board computers with a wide range of performance levels.
3.5” ECM-APL MS-98E6 SBC-230 MS-98F3
Formfactor 3.5”
ProcessorIntel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)
Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)
Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)
Intel® Broadwell ULT, i3-5010U 2.1 GHz/ i5-5350U 1.8 GHz/ i7-5650U 2.2 GHz
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM Max. 8 GByte DDR3L 1866 Max. 8 GByte DDR3L 1866 Max. 16 GByte DDR3L 1866 Max. 8 GByte DDR3L 1600
Mass storage1x SATA 1x M.2
1x SATA 1x mSATA
1x SATA 1x mSATA
2x SATA 1x mSATA
Bus 1x Mini PCIe, 1x M.2 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe (one-half-size)
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O4x USB 3.0, 1x USB 2.0, 6x COM
4x USB 3.0, 1x USB 2.0, 6x COM
2x USB 3.0, 4x USB 2.0, 4x COM
2x USB 3.0, 4x USB 2.0, 4x COM
Panel Interface LVDS 2x 24/2x HDMI2x LVDS 2x 24/eDP/HDMI/DP
CRT/LVDS (eDP)/HDMICRT or DP/LVDS 2x 24/HDMI
Audio HD audio HD audio HD audio HD audio
Others8x GPIO, ext. temp. -40°C to 85°C
16x GPIO, ext. temp. -40°C to 85°C (optional), MIPI-CSI
8x GPIO, ext. temp (optional)
8x GPIO
Power Requirement 12 to 26 VDC 12 to 24 VDC 9 to 36 VDC 12/19/24 VDC
3.5” MS-98H3 ECM-SKLU SBC-330 ECM-KBLH
Formfactor 3.5”
ProcessorIntel® Skylake/Kabylake ULT Celeron®/i3/i5/i7 processors
Intel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz
Intel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz
Intel® Kabylake-H, i3-7100E 2.9 GHz/ i5-7440EQ 2.9 GHz/ i7-7820EQ 3.0 GHz
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® QM175 integrated
DRAM Max.16 GByte DDR4 2133 Max. 16 GByte DDR4 2133 Max. 32 GByte DDR4 2133 Max. 16 GByte DDR4 2133
Mass storage 2x SATA, 1x mSATA 1x SATA, 1x mSATA 2x SATA, 1x mSATA 2x SATA, 1x mSATA
Bus 2x Mini PCIe 1x Mini PCIe, 1x M.2 2x Mini PCIe 1x Mini PCIe, 1x M.2
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O4x USB 3.0, 4x USB 2.0, 6x COM
4x USB 3.0, 2x USB 2.0, 6x COM
4x USB 3.0, 4x USB 2.0, 4x COM
4x USB 3.0, 2x USB 2.0, 2x COM
Graphics eDP/LVDS/HDMI/DP LVDS 2x 24/2x HDMI LVDS 2x 24/2x DP LVDS 2x24/2x HDMI
Audio HD audio HD audio HD audio HD audio
Others 16x GPIO, Nano SIM holder 8x GPIO 8x GPIO 8x GPIO
Power Requirement 12 to 24 VDC 12 to 26 VDC 12 to 36 VDC 12 VDC
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Mini-ITX MS-98F1 MS-9892 EMX-APLP IMB-157
Formfactor Mini-ITX (170 x 170mm)
ProcessorIntel® Celeron®/Pentium® N3060/N3160/N3710
Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)
Intel® Celeron® N4200 (Apollo Lake)
Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM Max. 8 GByte DDR3L 1600 Max. 16 GByte DDR3L 1866 Max. 16 GByte DDR3L 1866 Max. 16 GByte DDR3L 1866
Mass storage 1x SATA, 1x mSATA 2x SATA, 1x mSATA2x SATA, 1x mSATA, SD card slot
1x SATA, 1x M.2
Bus 2x Mini PCIe 2x Mini PCIe, 1x PCIe x1 1x Mini PCIe, 1x M.21x Mini PCIe, 2x M.2, 1x PCIe x1
EthernetSingle/dual 10/100/1000BaseT
Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O4x USB 3.0, 4x USB 2.0, 4-7x COM (depending on SKU)
4x USB 3.0, 6x USB 2.0, 6x COM
4x USB 3.0, 5x USB 2.0, 6x COM
4x USB 3.0, 4x USB 2.0, 6x COM
Panel Interface1 or 2x LVDS 2x24/1 or 2x DP (eDP optional)
LVDS 2x 24/eDP/HDMI/DP LVDS 2x24/HDMI/2x DP CRT/eDP(LVDS)/HDMI
Audio HD audio HD audio with amplifier HD audio with amplifier HD audio
Others 8x GPIO16x GPIO, ext. temp. -40° to 85° C (optional)
8x GPIO, eMMC (optional) 16x GPIO
Power Requirement
12/19/24 VDC or ATX 12 to 24VDC 12 to 24 VDC 12 VDC or 19 to 24 VDC
Mini-ITX EMX-SKLUP IMB-191 MS-98E1 MS-98K1
Formfactor Mini-ITX (170 x 170mm)
ProcessorIntel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz
Intel® Socket LGA1151 for 6th Gen i3/i5/i7 processors (Skylake-S)
Intel® Socket LGA1151 for 6th/7th Gen i3/i5/i7 processors (Skylake/Kabylake-S)
Intel® Socket LGA1151 for 6th/7th Gen i3/i5/i7 processors (Skylake/Kabylake-S)
Chipset Intel® SoC integrated Intel® H110 Intel® C236/H110 Intel® H110/Q170
DRAM Max. 32 GByte DDR4 2133 Max. 16 GByte DDR4 2133 Max. 32 GByte DDR4 2133 Max. 32 GByte DDR4 2133
Mass storage 2x SATA, 1x M.2, SD card 2x SATA, 1x mSATA 3/4x SATA, 1x mSATA 3/4x SATA, 1x mSATA
Bus 2x M.2, 1x PCIe x1 1x Mini PCIe, 1x PCIe x4 1x Mini PCIe, 1x PCIe x16, 1x M.2 (C236 Version)
2x Mini PCIe, 1x PCIe x16
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT 2 or 4x 10/100/1000BaseT
I/O4x USB 3.0, 4x USB 2.0, 6x COM
4x USB 3.0, 4x USB 2.0, 4x COM
4x USB 3.0, 5x USB 2.0, 5x COM
4/8x USB 3.0, 8x USB 2.0, 6/10x COM
Panel Interface LVDS 2x 24/HDMI/DP LVDS 2x 24/2x HDMI CRT/LVDS 2x24/HDMI/DVI LVDS/eDP/HDMI/DP/2xDVI
Audio HD audio with amplifier HD audio HD audio with amplifier HD audio
Others 16x GPIO, SIM card 8x GPIO 8x GPIO 16x GPIO
Power Requirement
12 to 24 VDC 12 VDC or 19 to 24 VDC ATX 12 to 24 VDC
Embedded motherboards for industrial applications that require competitive pricing,
long-term support (5+ years), proven reliability and strict revision control.
INDUSTRIAL MOTHERBOARDS
Box PCs MS-9A89 MS-9A95 EMS-SKLU EPS-KBLHE
ProcessorIntel® Atom™ E3950 (Apollo Lake)
Intel® Kabylake ULT i3/i5/i7 processors
Intel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz
Intel® Kabylake-H, i3-7100E 2.9 GHz/i5-7440EQ 2.9 GHz/i7-7820EQ 3.0 GHz
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® QM175 Express
DRAM Max. 8 GByte DDR3L 1600 Max. 32 GByte DDR4 2133Max. 16 GByte DDR4 2133
Max. 16 GByte DDR4 2400
Display1x HDMI, 1x DP, DVI/LVDS (optional)
1x DVI, 1x HDMI, 2x DP 1x DP 2x HDMI
External I/O2x LAN (4x LAN optional), 4x USB 3.0, 2x USB 2.0, 6x COM, 16x GPIO, audio
2x LAN, 4x USB 3.0, 2x USB 2.0, 1x COM, Audio
2x LAN, 4x USB 3.0, 2x COM, Audio, 12x GPIO
2x LAN, 4x USB 3.0, 2x USB 2.0, 2x COM, audio
Expansion Interface 2x Mini PCIe 2x Mini PCIe 1x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2
Storage mSATA, 1x 2.5“ Drive Bay mSATA, 1x 2.5“ Drive Bay 1x M.2, 1x 2.5 Drive Bay 1x M.2, 1x 2.5“ Drive Bay
Power Requirement 12 to 24 VDC 19 VDC 9 to 32 VDC 12 VDC
Dimension (W x H x D)
215 x 155 x 55 mm 196 x 285 x 29 mm 240 x 170 x 45 mm 250 x 220 x 60 mm
Weight 1.50 kg 2.60 kg 2.0 kg N/a
Operating Temp.-20° to 70° C with HDD -10° to 50° C with SSD
-10° to 40° C with HDD -10° to 50° C with SSD
-20° to 60° C with SSD -10° to 50° C with SSD
Fanless Operation Yes Yes Yes Yes
MountingWall mount, VESA mount, DIN rail mount
Wall mount, VESA mount, DIN rail mount
Wall mount, DIN rail mount Wall mount
Options Wifi Wifi, 3G/4GExpandable via IET interface, marine certification
Wifi
Box PCs MS-9A65 (Windbox II) NUC BOX 3000 MS-9A59 EPC-APL
ProcessorIntel® Celeron® J1900 2.0 GHz
Intel® Celeron® N3010 / N3160
Intel® Celeron® N3160Intel® Celeron® N3350/Pentium® N4200 (Apollo Lake)
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM Max. 8 GByte DDR3L 1333Max. 16 GByte DDR3L 1066/1333
2 GByte DDR3L 1600 Max. 8 GByte DDR3L 1600
Display 1x HDMI, 1x DVI 2x HDMI, 1x DP1x HDMI, 1x DP, LVDS/DVI (optional)
1x VGA, 2x HDMI
External I/O2x LAN, 2x USB 2.0, 1x USB 3.0, 1x COM, audio
1x LAN, 4x USB 3.0, audio1x LAN, 2x USB 2.0, 2x USB 3.0, 2x COM, audio
2x LAN, 4x USB 3.0, 1x COM
Expansion Interface 2x Mini PCIe 1x M.2 1x Mini PCIe 2x Mini PCIe
Storage mSATA, 1x 2.5 Drive Bay mSATA, 1x 2.5 Drive Bay mSATA, 1x 2.5 Drive Bay mSATA, 1x 2.5“ Drive Bay
Power Requirement 19 VDC 12 VDC 12 VDC 12 to 26 VDC
Dimension (W x H x D)
180 x 255 x 19 mm 118.5 x 110 x 46 mm 155 x 105 x 55 mm 177 x 123 x 43.5 mm
Weight 1.30 kg 0.51 kg 0.9 kg 1.20 kg
Operating Temp.-10° to 50° C with HDD -10° to 60° C with SSD
0° to 40° C-10° to 45° C with HDD -10° to 55° C with SSD
0° to 45° C with HDD -10° to 50° C with SSD
Fanless Operation Yes Yes Yes Yes
Mounting VESA mount VESA mountVESA mount, wall mount, DIN rail
Stand, VESA mount, DIN rail mount
Options Wifi Wifi, metal housing Wifi Wifi
EMBEDDED BOX PCS
A L L T E C H N O LO G I E S . A L L CO M P E T E N C I E S . O N E S P E C I A L I S T.
www.data-modul.com
More information and worldwide locations can be found at
DATA MODUL AG
Landsberger Straße 322 DE-80687 Munich Phone: +49 89 56017 0
DATA MODUL WEIKERSHEIM GMBH
Lindenstraße 8 DE-97990 Weikersheim Phone: +49 7934 101 0
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