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TRANSCRIPT
EMBEDDED
EMBEDDED SOLUTIONS
DATA MODUL offers perfectly coordinated embedded computer systems based on x86
and ARM architectures. From pre-configured kits, complete custom baseboard design
to professional embedded computing design – DATA MODUL provides the full range of
embedded solutions. Display control technology is offered in a wide variety of building
blocks and solutions based on DATA MODUL’s proprietary know-how.
› CPU boards
› Embedded box PCs › eMotion LCD controller boards
› Embedded computing design
INDEX
Competencies .......................................................... 4
Technologies and Brands ....................................... 8
Markets and References ....................................... 10
Products ................................................................. 12
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› Proven reference design based on
Computer-On-Modules
› Building blocks for reduced
development time and cost
› All performance levels
FULL-CUSTOM DESIGN
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› Large product portfolio of x86 and ARM
based embedded boards
› Various form-factors and performance
levels
› Long-term partnership with world-leading
manufacturers of embedded products
› Intel based COM Express® Modules
› Single board computers & baseboard
designs
› High-end board solutions for displays
up to UHD/4k resolution
› Latest display interfaces and inputs
› Fully configured plug & play kits with
converter, power supply, cables and
OSD board
› For outstanding image quality
CPU BOARDS eMotion LCD CONTROLLER BOARDS
DATA MODUL embedded solutions comprise CPU modules, baseboards, single board computers
and LCD controller boards developed entirely in-house.
› Pre-configured kits consisting of embedded
board, display and fitting cable set
› Adaption and integration of all available
displays (TFT-LVDS, TFT-TTL, eDP) incl.
inverters, tested cables and adapted
power ON/OFF timing
› Customized images for embedded
operating systems
› Custom embedded OS services
› Cooling solutions
EASYKIT-SOLUTIONS
COMPETENCIES
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› Long-term availability of at least 5 years
› Professional PCN/EOL processes
› In-house FAE team and worldwide sales offices to
quickly and flexibly meet even major challenges
and deadlines
› Long-term partnership with world-leading
manufacturers of embedded products
› Adaption and integration of TFTs including video
BIOS (certified settings for each TFT available)
› Accessories like memory modules, mass-storage
and extension modules
› Customization based on standard products
› Programmable logic
› BIOS/UEFI support
› Bootloader support
› Driver development, APIs
› Board support packages
› Mainline based Yocto Linux OS
SOFTWARE DEVELOPMENTEMBEDDED COMPUTING DESIGN SERVICES & SUPPORT CUSTOMER ADVANTAGES
DATA MODUL is greatly expanding its display control expertise. An experienced engineering team
dedicated to developing professional embedded computing designs now supports high quality
product development for industrial use. Customers benefit from the modular concept resulting in
validated core components, reduced development time and less time for validation.
› Schematic and layout review
› Design validation
› Comprehensive technical support
› Compliance measurements
› Custom embedded OS services
(WES8, WES7, WinXPe, WinCE6,
WinEC7, WinEC2013, Win10IoT,
Embedded Linux)
› Standard and customized computer-on-modules,
baseboard designs and single board computers
› Latest CPU platforms
› Latest professional measuring equipment
› Failure mode and effects analysis
› R & D sites in Germany
› System integration with all other key technologies
including display, touch sensor and certifications
› From low power single-core designs up to high end
multi-core solutions
› Part selection in consideration of cost and quality
COMPETENCIES
› Form factors, e.g. ATX, Micro-ATX, Mini
ITX, Pico ITX, 3.5” and more
› No carrier board needed
› Self-developed SBCs
› “Off-the-shelf” solutions
› Form Factors, e.g. COM Express, Qseven,
SMARC, Colibri and more
› Customer-specific carrier board
› x86-based modules
› ARM-based modules
Pico-ITX 100 x 72 mm / 3.9” x 2.8”
3.5” 102 x 145 mm / 4.02” x 5.71”
Mini-ITX 170 x 170 mm / 6.69” x 6.69”
COM Express mini 84 x 55 mm
COM Express compact 95 x 95 mm
COM Express basic 125 x 95 mm
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In addition to the product portfolios of all major embedded manufacturers, DATA MODUL offers
a wide range of professionally designed embedded solutions, developed and designed by the
in-house development team based in Deggendorf. a
TECHNOLOGIES & BRANDS
SINGLE BOARD COMPUTER (SBC) COMPUTER-ON-MODULES (COM)
EMBEDDED CONCEPT
eMOTION LCD CONTROLLER BOARDS
VISUAL & TOUCH SOLUTIONS
COM MODULES & SBCs
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DATA MODUL understands that embedded technology is a rapidly growing market. Its aim is to further consolidate this market growth through its innovative product portfolio. The following applications are just an example.
› Dedicated certifications
› Particular electromagnetic
compatibility (EMC)
› Long-term availability
› High performance CPU boards
› Embedded solution with
custom dimensions
› Independent driving of
several displays
› Ultrasonic devices
› Computer tomography
› Non-invasive ventilation
› Slot machines
› Player tracking systems
› Kiosk
› Long life solutions
› Shock resistance
› Obsolescence management
› Computer numeric control
› Diagnostic systems
› Machine control
› Low power consumption
› Vibration resistance
› High signal-to-noise-ratio
› Passenger information system
› Ticket vending machines
› Control stand applications
› Reliable operation
› High durability
› Extended temperature range
› Human machine interfaces
› Sensors
› Motion control
› IOT-ready embedded
solutions
› Driving solutions for high
resolution displays
› Low power consumption
› Building automation
› Security
› Access control systems
MARKET DEMANDS MARKET DEMANDS
REFERENCE APPLICATIONS REFERENCE APPLICATIONS
MEDICINE & HEALTHCARE
MECHANICAL ENGINEERING
AUTOMATION & ROBOTICS
BUILDING TECHNOLOGY
TRANSPORTATIONDIGITAL SIGNAGE & GAMING
MARKETS & REFERENCES
Mechanical Engineering
Gam
ing
Ou
tdo
or MaritimeAutomotive
Transportation
Point of Sales
Digital Signage
Automation & Robotics
MedicineBuilding Technology
Wh
ite Go
od
s Portable Application
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COM EXPRESS MODULES
SKYLAKE
› 6th Gen Intel® Core™
processor
APOLLO LAKE
› 5th Gen Intel® Atom™
SoC processor
COFFEE LAKE
› 8th Gen Intel®
Core™ processor
eDM-COMB-CF6 eDM-COMB-AL6
Form factor COM Express Basic Type 6 COM Express Compact Type 6
Processor8th Gen. Intel® Core™ up to 6 cores/Intel® Xeon® E3
Intel® Pentium® N4200, QC 2.50 GHzCeleron® N3350 DC 2.40 GHzAtomTM x5-E3950 QC 2.00 GHzAtomTM x5-E3940 QC 1.80 GHzAtomTM x5-E3930 DC 1.80 GHz
Chipset Mobile Intel®300 series, QM370, HM370 and CM246 Integrated in SoC
DRAM2x DDR4 SO-DIMMs up to 2666MT/s and32 Gbyte/ECC optional
2x DDR3L SO-DIMMs up to 1866MT/s and 8 GByte
Mass storage 4x SATA 32x SATA 3, 1x microSD card socket (opt.) max. 64 Gbyte eMMC onboard
Bus 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C; GPIOs 5x PCIe Gen 2, LPC, SPI, I²C, GPIO
Ethernet 10/100/1000BaseT 10/100/1000BaseT
I/O8x USB 2.0 , 4 x USB 3.0/USB 3.1, 2x USB Type C2 x UART (COM1/2)
8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)
Panel Interface LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI) LVDS 2x 24/eDP 1.3, 2x DDI (DP++, HDMI, DVI), 1x VGA (opt.)
Audio HD Audio HD Audio
Others DMEC Board Controller, TPM 1.2 / TPM 2.0 DMEC board controller, TPM 1.2/TPM 2.0
KABYLAKE
› 7th Gen Intel®
Core™ processor
eDM-COMB-KL6 eDM-COMB-SL6
Form factor COM Express Basic Type 6 COM Express Basic Type 6
Processor 7th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E36th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E3, Celeron® G3900E/G3902E
Chipset Mobile Intel® 100 series, QM175, HM175 and CM238 Mobile Intel® 100 series, QM170, HM170 and CM236
DRAM2x DDR4 SO-DIMMs up to 2400MT/s and 32 Gbyte, Intel® Xeon® and Intel® i3 with ECC support
2x DDR4 SO-DIMMs up to 2133MT/s and 32 GByte, Intel® Xeon® with ECC support
Mass storage 4x SATA 3 4x SATA 3
Bus 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO
Ethernet 10/100/1000BaseT 10/100/1000BaseT
I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)
Panel Interface LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.) LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.)
Audio HD Audio HD Audio
Others DMEC board controller, TPM 1.2/TPM 2.0, Intel® Optane memory DMEC board controller, TPM 1.2/TPM 2.0
COM EXPRESS™COM Express™ is an open Computer-on-Module standard, defined and
maintained by the PICMG.
With its different form factors and pin-outs, this form factor offers the widest
scalability in computing performance and power consumption.
It is designed for the latest chip sets and serial signaling protocols, inclu-
ding PCI Express Gen 3, 10GbE, SATA, up to USB 3.1, and high resolution video interfaces.
COM EXPRESS TYPE 6COM Express Type 6 is the most popular and widely
used computer-on-module form factor on the
market. It brings Computer-on-Modules in
line with current and future technology
trends by providing for the latest graphics
interfaces (DisplayPort/DVI/HDMI).
COM Express Basic Type 6 pinout has also additional legacy
functions replaced by Digital Display interfaces (DDI), additional
PCI Express lanes, and reserved pins for future technologies.
The COM Express Compact Type 6 pinout form factor is ideally suited to single chip x86 solutions (SoCs)
with a power range between 5 to 20 watts. Utilizing both Intel®
Core™ and Atom® SoCs, Compact size modules are typically
targeted at mid- and entry level applications.
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› LCD-controllers especially designed for the
needs of industrial customers
› Long term availability and product stability
› Fully configured plug & play kits
› Outstanding image quality
eMotion UHD eMotion USB
Input/s 2x DP (1.2)/HDMI (1.4)/DVI (Dual-Link) 1x USB Type C with Alternate Mode
Display Support V-BY-One 8 lanes, eDP 8 lanes 2 channel LVDS interface
Color Depth 24/30 Bit (1,07 Mrd) 6/8 Bit
Max. Resolution Up to 3840 x 2160 pixel @60Hz (UHD) Up to 1920 x 1200 pixel
Dimming Support Analog and PWM Analog and PWM
Power 12/24V USB-PD (5 to 20 VDC)
Mechanical Dimensions
140 x 140mm 80 x 100mm
Special Features DDC/CI support, OSD keyboard or IR commanderUSB Type C Input (DP-signals with USB-PD), 1x USB 2.0 (external for e.g. keyboard/mouse), 1x USB 2.0 (internal for e.g. touch controller), 1x stereo audio out
Summary High-end board for UHD/4k displaysThe new cost effective "one cable solution" for compact & slim monitor designs
eMotion ST2:2/eMotion ST2:3 eMotion ST1:3
Input/s RGB/DVI on ST2:2, DP(1.1)/DVI-I on ST2:3 DP (1.1)/RGB/DVI
Display Support 2 channel LVDS interface 2 channel LVDS interface
Color Depth 6/8 Bit 6/8 Bit
Max. Resolution Up to 1920 x 1200 pixel Up to 1920 x 1200 pixel
Dimming Support Analog and PWM Analog and PWM
Power 12/24V 12/24V
Mechanical Dimensions
96 x 96mm 149.9 x 110mm
Special Features DDC/CI support, OSD via RS232DDC/CI support, OSD via RS232, large screen support, 24V->12V DC/DC converter for 12V backlight
Summary Entry level board with attractive price Midrange board, especially for large screen applications
eMotion ST5:3 eMotion ST3:4
Input/s DP (1.1)/RGB/DVI (via special connector) DP (1.2)/HDMI (1.4)/DVI/RGB/CVBS / YC
Display Support 2 channel LVDS interface 4 channel LVDS interface and DisplayPort output
Color Depth 6/8 Bit 8/10 Bit
Max. Resolution Up to 1920 x 1200 pixel Up to 2560 x 1600 pixel
Dimming Support Analog and PWM Analog and PWM
Power 12/24V 5/12V
Mechanical Dimensions
120 x 100 x 8.5mm 155 x 115mm
Special FeaturesDDC/CI support, OSD via RS232, low profile for special applications
DDC/CI support, OSD via RS232, IR option, onboard memory, DP daisy chaining, support for large screens and ambient light sensor, PIP, PBP, 10bit support, FRC (60->120Hz), up- /downscaling
SummaryEntry level board for low profile or DisplayPort only applications
High-end board for all possible requirements
LCD CONTROLLER BOARDS SINGLE BOARD COMPUTER
With the SBC form factor, especially designed for slim PPCs, DATA MODUL is standardizing ARM boards for the
first time, as these allow the slim implementation of particularly popular display formats such as 7’’, 10.1’’ 12’’
and 15.6’’. Standard kits, consisting of display, the easyTouch sensor, also developed by DATA MODUL, controller
and corresponding cabling, also only require short lead times.
With its 130mm x 80mm dimensions, this format offers 30% more room in width and thus allows more leeway for
interfaces than Pico-ITX. To be able to make use of the maximum installation space behind a 7’’ LCD, the height
was increased to 80 compared to the Pico-ITX of 72 mm. The assembly can reach the extremely low depth of max.
13 mm by using flat connectors, where the mating connectors are applied at the side. In this way, no installation
height is lost through the connection of the interfaces and the network cable bushing (RJ45) remains the highest
point of the assembly.
eDM-SBC-iMX6-PPC
Form factor 130 x 80 x 13 mm (DM Slim PPC-Format)
ProcessorNXP® i.MX6 Solo, Cortex A9 800 MHz, 1C, 512KB L2 Cache, GC880 NXP® i.MX6 DualLite, Cortex A9 800 MHz, 2C, 512KB L2 Cache, GC880 NXP® i.MX6 Dual, Cortex A9 800 MHz, 2C, 1MB L2 Cache, GC2000 NXP® i.MX6 Quad, Cortex A9 800 MHz, 4C, 1MB L2 Cache, GC2000
DRAM Onboard up to 2 GByte DDR3 (1066MT/s)
Mass storage Onboard eMMC up to 64GByte
GraphicsIntegrated Graphics Processing Unit with 2D, 3D Vector Graphics 1080p 30fps video decode and encode
Display interfaces1 x HDMI 1.4 (Micro-HDMI, Type D), 1 x Dual Channel 24 Bit LVDS for up to e.g. Full HD 1920 x 1080 Pixel
Operating Systems Linux (Yocto)
Ethernet Gigabit Ethernet Controller, 10/100/1000 Mbps with Texas Instruments DP83867IR PHY
I/O
4 x USB 2.0 (EHCI), 1 x USB OTG, 4 x UART, 1 x RS485 full-duplex (optional), 1 x Micro-SD card slot, 1 x SATA II (3Gb/s) on mPCIe Socket (only on Dual/Quad Version), 1 x PCIe 2.0 Lane on mPCIe Socket, 1 x SPI, 1 x I²C, 1 x PWM, 8 x GPIO, 2 x CAN with up to 1 Mbit/s (1 optional with isolated Transceiver), 1 x M.2 WLAN/Bluetooth module (optional), Intel Wireless-AC 8265
Power Supply VCC: 24V (+/-30%) , optional: +12 V (+/-5%)
Operating Systems Linux (Yocto) Kernel 4.9
Temperature Operating: -40°C to +85°C, Storage: -40°C to +85°C
Humidity Operating: < 80% RH non-condensing
Safety, Shock and Vibration Designed to meet EN60950, IEC/EN60068-2-27 and IEC/EN60068-2-6
ARM BASED SBC
13mm
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conga-TS170 conga-TS370 conga-TCA5
Form factor COM Express Basic Type 6 COM Express Basic Type 6 COM Express Compact Type 6
Processor6th Gen. Intel® Core™ /Intel® Xeon® E3 processor
8th Gen. Intel® Core™ /Intel® Xeon® E3 processor
5th Gen. Intel® Atom™ processor family, Intel® Atom™ x7-E3950 2,0 GHz, Intel® Atom™ x5-E3940/E3930 1,8 GHz, Intel® Pentium® N4200 2,5 GHz, Intel® Celeron® N3350 2,4 GHz
Chipset Mobile Intel® 100 SeriesMobile Intel® PCH-H QM370 Series or CM246 Series for Intel Xeon Processor
Integrated in SoC
DRAM2x DDR4 SO-DIMMs up to 2133MT/s and 32 Gbyte
2x DDR4 SO-DIMMs up to 2666MT/s and 32 Gbyte / ECC optional
2 x DDR3L SO-DIMMs up to 1687MT/s and 8 Gbyte
Mass storage 4x SATA Gen 3 4x SATA Gen 32x SATA 3.0Up to 64 Gbyte eMMC onboard
Bus 8x PCIe Gen 3, LPC, I²C, 2x UART 8x PCIe Gen 3, LPC, I²C, 2x UART 5x PCIe, LPC, SPI, I²C, 2x UART
Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT
I/O 8x USB 2.0, 4x USB 3.0 8x USB 2.0, 4x USB 3.1 8x USB 2.0, 4x USB 3.0
Panel Interface 3x DP 1.2/HDMI, LVDS 2x 24bit 3x DP 1.2 / HDMI, LVDS or eDP, VGA2x DP/HDMI, LVDS 2x24 bit, 1x eDP optional
Audio HD Audio HD Audio HD Audio
Others ACPI 4.0 with battery support ACPI 4.0 with battery supportACPI 5.0 with battery support, ext. temp. versions available
conga-B7AC conga-B7XD conga-MA5
Form factor COM Express Type 7 COM Express Type 7 COM Express Mini Type 10
ProcessorUp to Intel® Atom™ C3958 with 16 cores and 16MB Cache
Up to Intel® Xeon™ D1577 with 16 cores and 24MB Cache
5th Gen. Intel® Atom™ processor family
Chipset Integrated in SOC Integrated in SOC Integrated in SOC
DRAMUp to 3 SO-DIMM sockets for DDR4 memory modules up to 16GByte each
Up to 3 SO-DIMM sockets for DDR4 memory modules up to 16GByte each
Up to 8GByte DDR3L onboard
Mass storage 2x SATA 3.0 2x SATA 3.0 2x SATA 3.0, up to 64 GByte eMMC
Bus 4x PCIe, LPC, I²C, SMBus, SPI 3x PCIe, I²C, 2x UART, SMBus 3x/4x PCIe, I²C, 2x UART, SMBus
Ethernet 4x 10GbE 2x 10GbE, 1x Intel I210AT/IT GbE 10/100/1000BaseT
I/O 4x USB 2.0, 4x USB 3.0 4x USB 2.0, 2x USB 3.0 6x USB 2.0, 2x USB 3.0/2.0
Panel Interface n.a. n.a.LVDS 1x 18 bit/1x 24 bit or eDP, 1x DP/HDMI
Audio n.a. n.a. HD Audio
Others ACPI 5.0 with battery support ACPI 5.0 with battery support ACPI 5.0 with battery support
conga-QA5 conga-QMX8 conga-SMX8 conga-SA5
Form factor Qseven™ (70 x 70 mm) Qseven™ (70 x 70 mm) SMARC 2.0 (82 x 50 mm) SMARC 2.0 (82 x 50 mm)
Processor
5th Gen. Intel® Atom™ processor family, Intel® Atom™ x7-E3950 2,0 GHz , Intel® Atom™ x5-E3940/E3930 1,8 GHz, Intel® Pentium® N4200 2,5 GHz, Intel® Celeron® N3350 2,4 GHz
NXP i.MX8 ARM Cortex A72, Cortex A53 and M4F
NXP i.MX8 ARM Cortex A72, Cortex A53 and M4F
5th Gen. Intel® Atom™ processor family, Intel® Atom™ x7-E3950 2,0 GHz, Intel® Atom™ x5-E3940/E3930 1,8 GHz, Intel® Pentium® N4200 2,5 GHz, Intel® Celeron® N3350 2,4 GHz
Chipset Integrated in SOC Integrated in SOC Integrated in SOC Integrated in SOC
DRAM Up to 8 GByte DDR3 onboard Up to 8GByte LPDDR4 onboard Up to 8GByte LPDDR4 onboard Up to 8GByte LPDDR4 onboard
Mass storage2x SATA 3.0Up to 64 GByte eMMC onboard
1x SATA 3.0Up to 64 GByte eMMC 5.0 onboard
1x SATA 3.0 Up to 64 GByte eMMC 5.0 onboard
1x SATA 3.0,Up to 64 Gbyte eMMC onboard
Bus SPI, I²C, 1x PCIe, LPC SPI, I²C, 3x PCIe, CAN SPI, I²C, 3x PCIe 4x PCIe, 2x I²C, 2x SPI
Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT 10/100/1000 BaseT
I/O 5x USB 2.0, 1x USB 3.0/2.0 5x USB 2.0, 1x USB 3.0 5x USB 2.0, 1x USB 3.0 4x USB 2.0, 2x USB 3.0
Panel InterfaceLVDS (single/dual channel) /eDPHDMI or DP
LVDS 2x24, HDMI or DP/eDP LVDS 2x24, HDMI or DP/eDPLVDS 2x24 /eDPHDMI or DP
Audio HD Audio I²S 2x I²S HD Audio / integrated Audio DSP
Others1x MIPI-CSI x4 /1x MIPI-CSI x2, smart battery management, ext. temp. versions available
Watchdog Timer, JTAG debug interface, high precision real time clock
1x MIPI-CSI x4 / 1x MIPI-CSI x2, ext. temp. versions available
1x MIPI-CSI x4 /1x MIPI-CSI x2, smart battery management, ext. temp. versions available
COMPUTER-ON-MODULE ADVANTAGES COMPARED TO FULL CUSTOM DESIGNS
CONCEPT
› CPU module with standard PC core
functions
› Carrier board with customer specific
functions & size
› Logical alternative to a chip-down
design effort
BENEFITS
› Faster time to market
› Reduced development costs
› Scalable product range
› Allows customer focus on system
features
› Faster reaction to market trends
› Second source philosophy
› Minimize inventory cost
COMPUTER-ON-MODULES
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EFUS™/PICOCORE™ The new small “efus™” SOM product family with the latest scalable NXP® I.MX processors, offers solution for
every application.
ARMSTONE™ armStone™ SBC product family is the fastest way to start a project, an addition carrier board is not required.
efus™A9 efus™A9X efus™A7UL efus™A53LS
Form factor efus™ (47 x 62.1 mm)
OSAndroid, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
Android, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
Android, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
Android, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
ProcessorNXP® i.MX 6 Cortex-A9(Solo-/ DualLite/ Quad) upto 1.2 GHz
NXP® i.MX 6 Cortex-A9 SoloX max. 1.0 GHz and Cortex M4 200Mhz
NXP® i.MX 6 Cortex-A7 UltraLite max. 696 MHz
NXP® QorIQ®LS1012ACortex®-A53-800MHz (Layerscape)
DRAM Max. 2 GByte onboard Max. 2 GByte onboard Max. 1 GByte onboard 512MB onboard
Mass storageMax. 32 GByte eMMC, 1 GByteNAND, SATA
Max. 32 GByte eMMC, 1 GByteNAND
Max. 32GByte eMMC, 1 GByteNAND
64 MB QSPI NOR Flash
Ethernet 10/100/1000MBit 2x 10/100/1000MBit 2x 10/100/1000MBit 2 x 10/100/1000MBit
I/O2x CAN, 4x UART, 2x USB, I²C,2x SPI, PCIe
2x CAN, 4x UART, 2x USB, I²C,SPI
2x CAN, 4x UART, 2x USB, I²C,SPI
1x CAN, 1 x UART, 1x USB 3.0 OTG, 1 x PCIe, 1 x SATA, 1 x SDIO
GraphicsVivante GPU up to Full HD(1080p)
integrated up to 1280 x 1024WXGA
integrated up to 1280 x 1024WXGA
Panel Interface 18bit TTL-RGB, 2x24Bit LVDS 18bit TTL-RGB, 24Bit LVDS 18 bit TTL-RGB
Audio I²S I²S I²S
OthersTemp. 0°C to +70°(-20°C to +85°C)
Optional: IEEE802.11b/g/n,BT3.0, temp. 0°C to +70° (-20°C to +85°C)
Optional: IEEE802.11b/g/n,BT3.0, temp. 0°C to +70°(-20°C to +85°C)
Bluetooth 4.0, WLAN, temp. 0°C to +70°(-20°C to +85°C)
armStoneA5 armStoneA8 armStoneA9 armStoneA9r2
Form factor Pico-ITX (100 x 72 mm)
OS Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
ProcessorNXP® Vybrid Cortex-A5 500 MHz/Cortex-M4 167 MHz
Samsung S5PV210 Cortex-A8 800 MHz 1.0 Ghz
NXP® i.MX 6 Cortex-A9 (Solo-/Dual-/Quad), 800 Mhz up to 1.0 GHz
NXP® i.MX 6 Cortex-A9 (Solo/ DualLite/QuadPlus) 1.0 GHz
DRAM Max. 1 GByte onboard Max. 1 GByte onboard Max. 4 GByte onboard Max. 4 GByte onboard
Mass storage Max. 512 MByte onboard Max. 512 MByte onboard Max.1 GByte NANDMax. 32 GByte eMMC, 1 GByte NAND
Ethernet 1-2 ETH 10/100 MBit 1-2 ETH 10/100 MBit 10/100/1000 MBit 10/100/1000 MBit
I/O1-2x CAN, 3x UART, 2x USB, I²C, SPI
1x CAN, 3x UART, 2x USB, I²C, SPI
1-2x CAN, 3x UART, 5x USB, I²C,SPI, mPCIe, SATA
2x CAN, 5x UART, 5x USB, I²C, SPI, mPCIe, SATA
GraphicsIntegrated up to 1024 x 768 pixel
Integrated up to Full HD (1080p)
Vivante GPU up to Full HD (1080p)
Vivante GPU up to Full HD (1080p)
Panel Interface
18 Bit TTL-RGB, 18Bit LVDS 18 Bit LVDS, HDMI18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI
18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI
Audio In/Out/Mic
OthersMax. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)
Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)
Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)
Bluetooth BT3.0 IEEE 802.11a/b/g/n
ARM BASED COM-MODULES
COLIBRI & APALIS The Colibri product family ARM® envelop currently twenty scalable boards from low power to high performance.
The latest SOM product family integrates high performance ARM® embedded processors from Nvidia®and NXP®.
ARM BASED COM-MODULES
Apalis T30 Apalis i.MX6 Apalis TK1 eDM-CB-Colibri
Form factor MXM3 (82.0 x 45.0 x 6.0 mm) MXM3 (82.0 x 45.0 x 6.0 mm) MXM3 (82.0 x 45.0 x 6.0 mm) Colibri form (115 x 76 mm)
OS Linux or Win EC7, Win EC 2013 Linux or Win EC7, Win EC 2013 Linux
ProcessorNVIDIA®Tegra 3 CortexA9 Quad-Core up to 1.4 GHz
NXP® i.MX 6 Cortex-A9 (Dual-/ Quad-Core) up to 1.0 GHz
NVIDIA®Tegra K1 CortexA15 Quad-Core up to 2.2 GHz
RAM 1 GByte/2 GByte RAM onboard512 MByte/1 GByte/2 GByte RAM onboard
2 GByte RAM onboard
Mass storage 4 GByte/8 GB eMMC flash onboard 4 GByte eMMC flash onboard 16 GByte eMMC flash onboard
Ethernet 10/100/1000 MBit 10/100/1000 MBit 10/100/1000 MBit
I/O2x CAN, 4x UART, 3x USB, 3x I²C, 2x SPI, PCIe, SATA, 4-wire res. touch
2x CAN, 5x UART, 5x USB, 3x I²C, 3x SPI, PCIe, SATA, 4-wire res. touch
2x CAN, 10x UART, 3x USB 3.0, 7x I²C, 5x SPI, 1 x USB 2.0, PCIe, 1 x SATA 2, 4-wire res. touch
3x USB 2.0 Type-A Host2x USB 2.0 Host Pin header, 1x USB OTG Micro, SPI, UART, PWM, GPIO, Analog Input, I2C, CAN, RS-485, RS-422
Graphics NVIDIA GPU up to Full HD (1080p) Vivante up to Full HD (1080p) NVIDIA GPU up to Ultra-HD (4k)
Panel Interface24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI
24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI
1 x 24 Bit LVDS, HDMI24 Bit TTL-RGB, 2x24Bit LVDS,HDMI, VGA
Audio In/Out/Mic
OthersMax. 127 GPIOs, 4x ADC, temp. 0°C to 70°C (-40°C to 85°C)
Max. 135 GPIOs, 4x ADC, temp. 0°C to 70° C (-40°C to 85°C)
Max. 92 GPIOs, 21 x AI (12Bit), temp. -20°C to 85°C
6 to 24 VDC
Colibri VF61 Colibri iMX7D/7S Colibri iMX6DL/6S Colibri T20
Form factor SO-DIMM, (67.6 x 36.7 mm)
OSLinux or Win CE6, Win EC7,Win EC 2013 incl. runtime license
Linux or Win EC7,Win EC 2013 incl. runtime license
Linux or Win EC7,Win EC 2013 incl. runtime license
Linux or Win CE6, Win EC7
ProcessorNXP® Vybrid™ ARM Cortex™-A5 500MHz, Cortex™-M4 167 MHz
NXP® i.MX 7Solo/Dual ARM Cortex™-A7800MHz/ 1.0GHz, Cortex™-M4 200MHz
NXP® i.MX6 Solo /I.MX6 DualLite, 1x Cortex-A9 1.0 GHz / 2x Cortex-A9 1.0 GHz
NVIDIA® Tegra 2 Cortex-A9 Dual 1.0 GHz
RAM 256 MByte DDR3256 MByte/512 MByte/1 GByte DDR3
512 MByte/256 MByte DDR3 512 MByte/256 MByte DDR3
Mass storage 512 MByte SLC NAND 512 MByte SLC NAND 4 GByte eMMC 512 MByte/1 GByte NAND
Touch interfaces
4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/ UART4-wire res. touch/I²C/USB/ UART
4-wire res. touch/I²C/USB/ UART
Ethernet 10/100Mbit IEEE1588 + 2nd RGMI 10/100Mbit IEEE1588 + 2nd RGMI 10/100 Mbit IEEE1588 10/100 Mbit
I/O2x CAN, 5x UART, 2x USB, 4x I²C, 17x PWM
2x CAN, UART, 2x USB, I²C, SPI, PWM
2x CAN, UART, 2x USB, I²C, SPI, PWM
5x UART, 2x USB, 2x I²C, 4x SPI, 4x PWM
Graphics2D acceleration max. 1024 x 768 pixel
2D acceleration max. 1920 x 1080 pixel
Vivante up to Full HD (1080p) Nvidia up to Full HD (1080p)
Panel Interface 24Bit TTL-RGB 24Bit TTL-RGB 24 Bit TTL-RGB, HDMI 24 Bit TTL-RGB, HDMI , VGA
Audio In/Out/Mic In/Out/Mic In/Out/Mic In/Out/Mic
OthersMax. 101 GPIOs, 2x analog input, 1x camera interface, temp. 0°C to 70°C (-20°C to 85° C)
External bus: 16 Bit temp. -20°C to 85°C
External Bus 32Bit, max 110 GPIOs, 4x ADC, temp. 0°C to +70° (-40°C to +85°C)
Max. 110 GPIOs, 4x analog input, temp. 0°C to 70°C (-20°C to 85°C)
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3.5” SBC-210 MS-98F6 / MS-98G6 MS-98J8 ECM-APL
Form factor 3.5“
ProcessorIntel® Celeron® N2930 1.83 GHz / J1900 2.0 GHz
Intel® Celeron® N2930 1.83 GHz / J1900 2.0 GHz
Intel® Atom™ E3930/E3940 / Celeron® N3350 / Pentium N4200
Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM max. 8 GByte DDR3L 1333 max. 8 GByte DDR3L 1333 max. 8 GByte DDR3L 1866 max. 8 GByte DDR3L 1866
Mass storage 2x SATA, 1x mSATA1x SATA 1x mSATA
1x SATA 1x mSATA
1x SATA, 1x M.2
Bus 2x Mini PCIe 2x Mini PCIe 1x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O2x USB 3.0, 6 x USB 2.0, 4x COM"
1x USB 3.0, 7x USB 2.0, 6x COM
4x USB 3.0, 2x USB 2.0, 4x COM
4x USB 3.0, 1x USB 2.0, 6x COM
Panel Interface CRT/LVDS 2x24/HDMICRT/LVDS 2x24/HDMI (MS-98G6: DVI)
LVDS 2x24/HDMI/DP LVDS 2x24/2x HDMI
Audio HD Audio HD Audio with Amplifier HD Audio HD Audio
Others 8x GPIO 8x GPIO 8x GPIO8x GPIO, extended Temp. -40°C to +85°C (optional)
Power requirement 9 to 36 VDC 12 VDC / 19 VDC / 24 VDC 9 to 36 VDC 12 to 26 VDC
SINGLE BOARD COMPUTERS
Pico-ITX MS-98J6 MS-98I6 EPX-APL SOM-P101
Form factor Pico-ITX
ProcessorIntel® Celeron® J3455 (Apollo Lake)
Intel® Atom™ E3930/E3940/Celeron® N3350/ Pentium® N4200
Intel® Celeron® N3350/ Pentium® N4200
Intel® Celeron® N3350 / Pentium® N4200
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM max. 8 GByte DDR3L 1600 4 GByte DDR4 onboard max. 8 GByte DDR3L 1600 max. 8 GByte DDR3L 1600
Mass storage 1x SATA, 1x mSATA 1x SATA, 1x mSATA 1x SATA, 1x M.2 1x SATA, 1x mSATA
Bus 1x Mini PCIe, 1x M.2 2x Mini PCIe (one half-size) 2x M.2 1x Mini PCIe, 1x M.2
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT 10/100/1000BaseT
I/O2x USB 3.0, 4x USB 2.0, 2x COM
2x USB 3.0, 2x USB 2.0, 2x COM
2x USB 3.0, 4x USB 2.0, 1x COM
1x USB 3.0, 2x USB 2.0, 2x COM
Panel InterfaceLVDS 2x24/HDMI/ Mini-DP
LVDS 2x24/HDMI/ Mini-DP
LVDS 2x 24/HDMI/ DP
LVDS 2x 24/HDMI
Audio HD Audio HD Audio HD Audio with Amplifier HD Audio
Others 8x GPIO 16x GPIO, MIPI-CSI 8x GPIO 8x GPIO, MIOe Extension
Power requirement 12 VDC 12 VDC 12 VDC 12 VDC
Small-sized and fully-integrated single board computers with a wide range of performance levels.
3.5” MS-98E6 SBC-230(-WT) MS-98F3 MS-98H3
Form factor 3.5”
ProcessorIntel® Atom™ E3930/E3940/Celeron® N3350/Pentium® N4200
Intel® Atom™ E3930/E3940/E3950/Celeron® N3350/ Pentium® N4200"
Intel® Broadwell ULT, i3-5010U 2.1 GHz/ i5-5350U 1.8 GHz/ i7-5650U 2.2 GHz
Intel® Skylake/Kabylake ULT Celeron/i3/i5/i7 processors
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM max. 8 GByte DDR3L 1866 max. 16 GByte DDR3L 1866 max. 8 GByte DDR3L 1600 max. 16 GByte DDR4 2133
Mass storage 1x SATA, 1x mSATA 1x SATA, 1x mSATA 2x SATA, 1x mSATA 2x SATA, 1x mSATA
Bus 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe (one half-size) 2x Mini PCIe
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O4x USB 3.0, 2x USB 2.0, 6x COM
2x USB 3.0, 4x USB 2.0, 4x COM
2x USB 3.0, 4x USB 2.0, 4x COM
4x USB 3.0, 4x USB 2.0, 6x COM
Panel Interface2x LVDS 2x24/eDP/ HDMI/DP
CRT/LVDS(eDP)/HDMI CRT or DP/LVDS 2x 24/HDMI eDP/LVDS/HDMI/DP
Audio HD Audio HD Audio HD Audio HD Audio
Others16x GPIO, extended temp. -40° to +85°C (optional), MIPI-CSI
8x GPIO, extended temp. (optional)
8x GPIO 16x GPIO, Nano SIM Holder
Power requirement 12 to 24 VDC 9 to 36 VDC 12 or 19 or 24 VDC 12 to 24 VDC
3.5” ECM-SKLU SBC-330 ECM-KBLH ECM-CFS
Form factor 3.5”
ProcessorIntel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz
Intel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz
Intel® Kabylake-H, i3-7100E 2.9 GHz/ i5-7440EQ 2.9 GHz/ i7-7820EQ 3.0 GHz
Intel® Coffee Lake (8th Gen.) Celeron/i3/i5/i7 processors
Chipset Intel® SoC integrated Intel® SoC integrated Intel® QM175 Express Intel® Q370 Express
DRAM max. 16 GByte DDR4 2133 max. 32 GByte DDR4 2133 max. 16 GByte DDR4 2400 max. 16 GByte DDR4 2400
Mass storage 1x SATA, 1x mSATA 2x SATA, 1x mSATA 2x SATA, 1x mSATA, 1x M.2 2x SATA, 1x mSATA
Bus 1x Mini PCIe, 1x M.2 2x Mini PCIe 1x Mini PCIe, 1x M.2 1x Mini PCIe
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O4x USB 3.0, 2x USB 2.0, 6x COM
4x USB 3.0, 4x USB 2.0, 4x COM
4x USB 3.0, 2x USB 2.0, 2x COM
4x USB 3.1, 2x USB 2.0, 2x COM
Graphics LVDS 2x 24/2x HDMI LVDS 2x 24/2x DP LVDS 2x 24/2x HDMI LVDS 2x 24/2x HDMI
Audio HD Audio HD Audio HD Audio HD Audio
Others 8x GPIO 8x GPIO 8x GPIO 8x GPIO
Power requirement 12 to 26 VDC 12 to 36 VDC 12 VDC 12 VDC
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Mini-ITX MS-98J0 MS-9892 EMX-APLP IMB-159
Form factor Mini-ITX (170 x 170mm)
ProcessorIntel® Atom™ E3940/ Celeron® N3350
Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)
Intel® Celeron® N4200 (Apollo Lake)
Intel® Celeron® N4100 (Gemini Lake)
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM max. 8 GByte DDR3L 1866 Max. 16 GByte DDR3L 1866 Max. 16 GByte DDR3L 1866 max. 8 GByte DDR4 2400
Mass storage 1x SATA, 1x M.2 2x SATA, 1x mSATA2x SATA, 1x mSATA, SD card slot
1x SATA, 1x M.2
Bus 2x M.2, 1x PCIe x1 2x Mini PCIe, 1x PCIe x1 1x Mini PCIe, 1x M.21x Mini PCIe, 2x M.2, 1x PCIe x1
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT
I/O4x USB 3.0, 3x USB 2.0, 6x COM
4x USB 3.0, 6x USB 2.0, 6x COM
4x USB 3.0, 5x USB 2.0, 6x COM
4x USB 3.0, 5x USB 2.0, 6x COM
Panel interface LVDS 2x 24/HDMI/DP LVDS 2x 24/eDP/HDMI/DP LVDS 2x 24/HDMI/2x DP CRT/LVDS 2x 24/eDP/DP
Audio HD Audio with Amplifier HD audio with amplifier HD audio with amplifier HD Audio with Amplifier
Others 8x GPIO16x GPIO, ext. temp. -40° to 85° C (optional)
8x GPIO, eMMC (optional) 16x GPIO
Power requirement
12 VDC 12 to 24VDC 12 to 24 VDC 12 VDC or 19 to 28 VDC
Mini-ITX EMX-SKLUP MS-98J4 MS-98K1 IMB-1213
Form factor Mini-ITX (170 x 170mm)
ProcessorIntel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz
Intel® Skylake/Kabylake ULT Celeron/i3/i5/i7 processors
Intel® Socket LGA1151 for 6th/7th Gen. I3/i5/i7 processors (Skylake/Kabylake-S)
Intel® Socket LGA1151 for 8th Gen. Celeron/i3/i5/i7 processors (Coffee Lake)
Chipset Intel® SoC integrated Intel® SoC integrated Intel® H110/Q170 Intel® Q370 Express
DRAM max. 32 GByte DDR4 2133 max. 32 GByte DDR4 2133 max. 32 GByte DDR4 2400 max. 32 GByte DDR4 2400
Mass storage 2x SATA, 1x M.2, SD Card 2x SATA, 1x mSATA, 1x M.2 2x SATA, 1x M.2 2x SATA, 1x M.2
Bus 2x M.2, 1x PCIe x12x Mini PCIe, 2x M.2, 1x PCIe x4
1x Mini PCIe, 1x PCIe x161x Mini PCIe, 1x M.2, 1x PCIe x16
Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT 2 or 4x 10/100/1000BaseT Dual 10/100/1000BaseT
I/O4x USB 3.0, 4x USB 2.0, 6x COM
4x USB 3.0, 5x USB 2.0, 6x COM
max. 8x USB 3.0, max. 5x USB 2.0, 4x COM
4x USB 3.1, 4x USB 2.0, 4x COM
Panel interface LVDS 2x 24/HDMI/DP2x LVDS 2x 24/2x HDMI/ 2x DP
LVDS/HDMI/DP/2xDVI 2xDVI"
LVDS 2x24/eDP/3xDP
Audio HD Audio with Amplifier HD Audio with Amplifier HD Audio with Amplifier HD Audio with Amplifier
Others 16x GPIO, SIM Card 8x GPIO 16x GPIO, Nano SIM Holder 8x GPIO, TPM, RAID Fun ction
Power requirement
12 to 24 VDC 12 to 24 VDC 12 to 24 VDC 12 VDC or 19 to 28 VDC
Embedded motherboards for industrial applications that require competitive pricing,
long-term support (5+ years), proven reliability and strict revision control.
Box PCs MS-9A89 MS-9A95 EMS-SKLU EPS-KBLHE
ProcessorIntel® Atom™ E3940/E3950 or Intel® Core i3-7100U (Kabylake ULT)
Intel® Kabylake ULT i3/i5/i7 processors
Intel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz
Intel® Kabylake-H, i3-7100E 2.9 GHz/i5-7440EQ 2.9 GHz/i7-7820EQ 3.0 GHz
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® QM175 Express
DRAMmax. 8 GByte DDR3L or 16 GByte DDR4
max. 32 GByte DDR4 2133
max. 16 GByte DDR4 2133
max. 16 GByte DDR4 2400
Display1x HDMI, 1x DP, DVI/LVDS (optional)
1x DVI, 1x HDMI, 1x DP 1x DP 2x HDMI
External I/O2x LAN (4x LAN as option), 4x USB 3.0, 4x USB 2.0, 6x COM, 16x GPIO, Audio
2x LAN, 4x USB 3.0, 2x USB 2.0, 2x COM, Audio
2x LAN, 4x USB 3.0, 2x COM, Audio, 12x GPIO
2x LAN, 4x USB 3.0, 2x USB 2.0, 2x COM, Audio
Expansion interface 2x Mini PCIe 2x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2
Storage mSATA, 1x 2.5" Drive Bay mSATA, 1x 2.5" Drive Bay 1x M.2, 1x 2.5" Drive Bay 1x mSATA, 2x 2.5" Drive Bay
Power requirement 12 to 24 VDC 19 VDC 9 to 32 VDC 12 VDC
Dimension (W x H x D) 215 x 155 x 55 mm 196 x 285 x 29 mm 240 x 170 x 45 mm 250 x 220 x 60 mm
Weight 1.55 kg 2.45 kg 2.0 kg 4.5 kg
Operating temp. -10° to +60°C with SSD-10° to +40°C with HDD -10° to +50°C with SSD
-20° to +60°C with SSD -10° to +50°C with SSD
Fanless operation Yes Yes Yes Yes
MountingWall Mount, VESA Mount, DIN Rail Mount
Wall Mount, VESA Mount, DIN Rail Mount
Wall Mount, DIN Rail Mount Wall Mount
Options Wifi, 3G/4G, CAN Wifi, 3G/4GExpandable via IET Interface, Marine Certification
Wifi, 3G/4G, wide DC-input, TPM
Box PCs MS-9A65 MS-9A59 EPC-APL VMS-APL
ProcessorIntel® Celeron® J1900 2.0 GHz
Intel® Celeron® N3160Intel® Celeron® N3350/Pentium N4200
Intel® Atom™ E3930/E3940/E3950 / Celeron® N3350 / Pentium® N4200
Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated
DRAM max. 8 GByte DDR3L 1333 2 GByte DDR3L 1600 max. 8 GByte DDR3L 1866 max. 8 GByte DDR3L 1866
Display 1x HDMI, 1x DVI1x HDMI, 1x DP, (LVDS or DVI optional)
1x VGA, 2x HDMI 1x DP, 1x LVDS
External I/O2x LAN, 2x USB 2.0, 1x USB 3.0, 1x COM, Audio
1x LAN, 2x USB 2.0, 2x USB 3.0, 2x COM, Audio, GPIO
2x LAN, 4x USB 3.0, 1x COM2x LAN, 4x USB 3.0, 2x COM, 8x GPIO, Audio
Expansion interface 2x Mini PCIe 1x Mini PCIe 2x Mini PCIe2x Mini PCIe, Avalue IET Interface
Storage mSATA, 1x 2.5" Drive Bay mSATA, 1x 2.5" Drive Bay mSATA, 1x 2.5" Drive BayM.2, 1x 2.5" Drive Bay, SD Card
Power requirement 19 VDC 12 VDC 12 to 26 VDC 9 to 36 VDC
Dimension (W x H x D) 180 x 255 x 19 mm 155 x 105 x 55 mm 177 x 123 x 43.5 mm 239 x 186 x 62 mm
Weight 1.30 kg 0.9 kg 1.20 kg tbd
Operating temp.0° to +40°C with HDD -10° to +60°C with SSD
-10° to +45°C with HDD -10° to +55°C with SSD
0° to +45°C with HDD -10° to +50°C with SSD
-40 or 20°C to +70°C depending on CPU
Fanless operation Yes Yes Yes Yes
Mounting VESA MountVESA Mount, Wall Mount, DIN Rail
Stand, VESA Mount, DIN Rail Mount
Wall Mount
Options Wifi Wifi Wifi CAN, Wifi
EMBEDDED BOX PCSINDUSTRIAL MOTHERBOARDS
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