electronics january-march 2010 (issue...

insidE...AnAloG circUits As coMPAct As diGitAl 06connEctors 09PortABlE BAttErY PoWEr 10PAssiVEs 14

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12Wireless Personal Area network

ElEctronicstHE WidEst rAnGE oF ElEctronic ProdUcts & BrAnds JAnUArY -MArcH 2010 (issUE 4)

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www.rsaustralia.com 1300 656 636 3ElEctronics JAnUArY - MArcH 2010

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IA_0

058

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/10

What’s inside this issue...

05 sEMicondUctors

06 AnAloG circUits As coMPAct As diGitAl

09 connEctors

10 PortABlE BAttErY PoWEr

11 connEctors/rElAY

12 WirElEss PErsonAl ArEA nEtWorK

14 PAssiVEs

Welcome to the January 2010 edition of the new rs Electronics Publication.

Communication has become an important part in our modern life and in this issue, we focus on communication related articles and products that help us to design our future.

In this issue, read up our featured article on page 6 to find out how Professor Ishihara Noboru of Tokyo Institute of Technology creates a compact single chip wireless analog circuit which reduces power consumption.

Energy efficiency is a hot topic at the moment, so we have some solutions to help you design for lower power consumption. Take a look at how portable battery power can help out on page 10.

Don’t forget you can keep up-to-date with the latest information at the RS Electronics Centre on RS Online, which is just a click away!

RegardsRSElectronicsTeam

Terms and conditions: All products sold in this publication are subject to the terms and conditions of sale set out in the current RS Catalogue. Prices are valid at the time of print, but may be changed by RS at any time, and exclude GST which will be charged at the current rate. This issue is valid from 1st January to 31st March 2010 and offers are available while stocks last. All savings in this magazine are against the 2009/10 catalogue price. Free delivery anywhere in Australia for all orders over $125 exclusive of GST.

can’t find what you need?Try RS online, our guided navigation tools will help you find the product faster

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contEnts

Analog circuits as compact as digitalPage06

WElcoME


406-580 FT232RL 28SSOP USB to Serial UART 3.3 to 5.25V

406-578 FT2232D 48LQFP Dual USB UART/FIFO IC 4.35 to 5.25V

406-540 FT245RL 28SSOP USB to Parallel FIFO, Security Dongle

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UniVErsAl sEriAl BUs (UsB) solUtions FTDI is a specialist in converting legacy peripherals to Universal Serial Bus (USB). This offers the easiest route to USB migration by combining USB-Serial (USB-RS232) and USB-FIFO silicon solutions.

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6 ElEctronics JAnUArY - MArcH 2010

With the widespread adoption of wireless technology in mobile phones and wireless LAN, GPS, Bluetooth, ZigBee Sensor Network, Wireless USB, etc., high speed and high frequency circuits are rapidly gaining importance. However, if various wireless techniques are packed into a single mobile device, not only does it occupy a large circuit area, but also increases power consumption. Can’t we make the chips smaller like the digital circuits so that we can reduce power consumption, increase efficiency and cut down costs? Prof. Ishihara Noboru of Tokyo Institute of Technology’s Integrated Research Institute Solution Research Green ICT (Project leader - Prof. Masu Kazuya) is conducting a research on whether or not the size of wireless circuits can be reduced like the digital circuits.

“I aspire to create a RF (High Frequency) circuit that can be used in all wireless devices with just a basic circuit.” Digital circuits are becoming smaller and smaller, but it is impossible to reduce the size of

analog circuits due to their passive electrical components such as coils (inductors).

But Prof. Ishihara is not ready to accept this fact. If analog circuits can become smaller like digital circuits, they will be more cost effective, consume less electricity and more efficient. If power consumption is reduced, battery life will naturally increase. What more do we need?

Cost can be reduced drastically if a common RF chip can be used for all wireless devices. This can be achieved through mass production. The application will be different from the present RFID. All products will have an RF chip. Attaching the chips to clothes and books does not only help prevent theft but also enable tracking of stolen goods! Portable devices that can download contents wirelessly will become very popular. One can even watch news on their wrist watch! Doctors will be able to monitor the body temperature, blood pressure, heart rate, etc. of their patients at any point in time.

Prof. Ishihara does not limit himself to the research on circuits. He is developing an actual product and experimenting on it. Otherwise, this will amount to nothing but only an empty theory that is of no use to the industry. As part of the new applications, a series of experiment has been carried out on a small PH sensor, which requires the cooperation of the enterprises to use it, send the measured value wirelessly to a receiver and then process with a computer.

Prof. Ishihara says, “We still have to use a battery. But we are trying to make it batteryless.” This is what we call “Energy Harvester technology”.

let’s make analog circuits as compact as digitalGet ready to welcome the age of new wireless application enabled by the development of high speed and high frequency technology, which is fully supported by the industry

Prof.IshiharaNoboru

MeasuringtheRFcharacteristicsoftheprototypechipdesigned

7ElEctronics JAnUArY - MArcH 2010

Analog front end specialistProf. Ishihara is an expert in wireless circuit and has conducted research on optical communication, satellite communication and analog front end circuits of mobile wireless devices at NTT Electrical Communications Laboratories.

The miniaturization of analog circuits, which was the topic of Prof. Ishihara’s work, was a difficult task to achieve. When the specifications of the wireless circuits, especially coils (inductors) are determined, their size cannot be reduced. Prof. Ishihara wondered whether or not it is possible to make a wireless circuit without using coils. He thought of making an analog circuit with CMOS, which is usually used in digital circuits. CMOS can be miniaturized from 180nm to 130nm, 90nm, 65nm, 45nm and the entire signal amplitude can be utilized. Full swing high voltage CMOS devices are usually preferred, since miniaturization reduces noise resistance with the reduction in power voltage.

In addition, analog circuits had to be built depending on the applications. In the case of high frequency circuits, coils or capacitors were used for resonance and there was a fixed narrow frequency band for transceiving. “If the frequency band is wider, transceiving can be accomplished with a single basic circuit for various applications,” thought Prof. Ishihara and worked towards a broadband amplifier.

For the broadband amplifier which uses CMOS inverter configuration as the basis, he used CMOS to configure the Cherry-Hooper circuit which was conventionally made using bipolar circuits. But this would only mean that there is no feedback from the resistance. So, he installed an active feedback circuit with the CMOS inverter configuration. When active feedback is applied, negative feedback changes to positive since the phase rotates due to the parasitic capacity of the transistor at high frequency. Usually, the frequency characteristic shows that the gain decreases in high frequency region. But in this case, the gain increases in the high frequency region since there is a positive feedback and hence the bandwidth can also be increased.

Moreover, the local oscillation circuits required for heterodyne receivers also use CMOS. However, coils or capacitors were

conventionally used for the resonance circuits. As mentioned earlier, we did not want to use coils. So ring oscillators were used. However, their characteristics showed that there was high phase noise. As a result, crystal oscillator injection locking was used instead, which is often seen in digital circuits. The phase noise reduces by 20 - 30dB in the experiment.

The wireless circuit chip designed by Prof. Ishihara also consists of an LDO (low drop out) power circuit which converts the voltage from the battery. Since miniaturization of this power transistor is not necessary, comprehensive knowledge is required to use these concept, such as increasing the gate length to double that of the inverter CMOS.

The low noise amplifier of CMOS which was developed as a test piece produced unprecedented results. The 180nm CMOS has the following specifications - power voltage: 1.8V, band: 0 – 4.9 GHz, power consumption: 30.6mW, gain: 30.6dB, noise: 3.5 – 4.7 dB and circuit area: 0.0067mm². And with the 90nm chip, the power voltage was 1.0V, the band was wider with 0 – 6.8 GHz, the power consumption was reduced to 14.5mW, the gain was reduced to 18.0dB, the noise of 3.0 – 5.5 dB was almost the same and the circuit area was less than half at 0.0032 mm².

designing silicon icsProf. Ishihara’s group is also undertaking IC design with EDA tools since they propose to give experimental proof by attaching their high frequency wireless circuit to a silicon chip. Designing starts at 180nm and then reduced to 90nm, 65nm, 45nm and so on. The process of attaching it to the actual silicon is done by an external manufacturing specialist. Presently, TSMC Taiwan manufactures the 90nm chip. The latest 65nm RF circuits that are being produced by VDEC, e-Shuttle, etc. are expected to be ready by mid-November.

They are designed with EDA tools, but the important thing is ‘to give an experimental proof of the circuit technology by actually manufacturing the product’. The search for a foundry for the 45nm process is still in progress since the shuttle service is not available yet.

Prof. Ishihara thinks that an overall design which includes LSI, module level, chassis level, etc. is required to construct a platform to design the RF circuits. There are plans to collaborate with well-established companies to construct such platforms.

the fundamentals of optical fibre, copper wire and wireless are the sameAccording to Prof. Ishihara, the fundamentals of transceiver circuits of optical fibers, wireless circuits and copper wire circuits are the same. Hence, he similarly wishes to design communication circuits with wireless radio, optical fiber and Ethernet cable. If this becomes possible, then the basic circuit can be used in various forms with minimal alteration.

In the case of wireless, since digital information is placed on a narrow band as the band is narrow, it is best to broaden digital information through direct current. There is little difference between optical and radio when it comes to widening the band.

Widespread use of wireless devicesIf the single chip wireless circuit introduced by Prof. Ishihara becomes a reality, mobile phones, smart phones and smart books can made with a single chip and it can also be used for wireless software and cognitive wireless in the future. This will not only widen the application of global mobile devices, but also makes it possible to use wireless circuits in MP-3 players and digital cameras. It has an extensive scope of application. n

“We still have to use a battery. But we are trying to make it batteryless.” this is what we call

“Energy Harvester technology”.Professor.IshiharaNoboru

WirelesscircuitscanbeusedforwaterqualityexaminationifattachedtoaPHsensor

www.rsaustralia.com 1300 656 6368 ElEctronics JAnUArY - MArcH 2010

Molex Board to Board solutions for High speed communication Equipmentsslimstack™ 0.5mm Board-to-Board connector system

Molex’s SlimStack is a proven, reliable way to connect PCBs together using slim, low-profile SMT connectors. It is a family name for Molex’s broad range of Micro SMT stacking board-to-board connector, with stack heights from 1.50mm (.059”) to 20.0mm (.787”) in pitch categories of 0.40mm (.016”), 0.50mm (.020”), 0.635mm (.025”) and 1.00mm (.039”).

SlimStack offers system designers a wide range of flexibility to meet the tight packaging needs found in applications such as PDAs, cellular phones, camcorders, notebook PCs and other compact equipment. Along with various pitch and stack options, the series covers circuit size needs from 16 to 140.

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The 75005 series is available in 6-pair, 12-pair, 24-pair and 36-pair plugs and receptacles, including off-set versions, with mating heights ranging from 10mm to 25mm.

Molex’s continued focus on leading-edge technology delivers Plateau HS Mezz as the superior solution for high-speed high-density mezzanine designs. Extensive reliability testing are also conducted to ensure the robustness and reliability of our plated plastic interconnect devices. Applications include routers, switches, hubs, servers, work stations and storage devices.

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lithium-ion: the future for batteriesreducing the energy consumption of your electronic product through good design and the use of low power components is important. However for portable devices the energy storage you choose is just as critical.

With the ever growing demand for portability, rechargeable batteries are increasingly powering electronic products which would traditionally have required a mains power supply.

Previously the default choice for compact, portable power was Nickel Cadmium (NiCd), or Nickel Metal Hydride (NiMH) batteries but today the battery technology leading the way is Lithium-ion polymer, and you can’t afford to ignore its advantages.

High energy-to-weight ratio Gives a lightweight battery that for its size or weight can store more energy than either NiCd or NiMH.

lower self-discharge rateMaking Li-ion ideal for stand-by or occasional use applications. NiMH and NiCd batteries can lose anywhere from 1-5% of their charge per day, depending of the storage temperature.

lithium-ion rechargeable battery discharge mechanism Despite the name the batteries do not contain lithium metal.They operate using the insertion and extraction of lithium ions into and out of their electrodes. The negative electrode is made of a graphite blend and the positive of a lithiated cobalt oxide.

High nominal cell voltageTypically 3.7V, this high cell voltage allows higher ‘standard’ voltages to be achieved easily. A traditional NiCd or NiMH cell is only 1.2V leading to multiple cells and greater internal resistance when creating battery packs of 12V or higher.

long cycle lifeA lithium-ion cell have a working life of 1000-1200 charge cycles, compared to 500-1000 for a similar capacity NiMH cell

Minimal ‘memory’ effectsIf a NiCd, or to a lesser extent a NiMH, battery was repeatedly half charged, then discharged, a chemical change occurred within the cells and the battery would no longer have its full capacity. Li-ion batteries are virtually unaffected by this symptom.

High peak discharge currents Although not as high as NiCd batteries, Li-ion can provide high peak currents, and the continual improvements in the composition of Li-ion cells has seen power tool manufacturers starting to use Li-ion batteries, where once they would have only used NiCd.

Consumer awareness of Lithium-ion battery technology has grown and products that don’t employ Li-ion can be perceived as out-dated, or lower quality. The demand for Li-ion batteries looks set to continue increasing, and designers of products should consider including Li-ion in their product. Although this can increase the production cost of the product failing to do so could seriously impact the desirability of the end product.

PortABlE BAttErY PoWEr


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12 ElEctronics JAnUArY - MArcH 2010

trend of Wireless Personal Area network in iEEE802.15

As an example of WPAN standard, the Bluetooth attach rate especially to cellular phone segment has been dramatically increasing. Over the last few years, the demand for the high definition TV streaming has risen and the development of the millimeter wave (60GHz) based systems has been accelerating. We cannot deny that within a WPAN standardization segment, there are many multiple standards are being standardized or were ratified which would certainly confuse consumers. It would probably be a good idea to better understand the standardization status of IEEE802.15 working group which is the subset of IEEE organization having strong influence over international standards though some proprietary standards have become de-facto standards with early penetration success.

standardization process and position of 802.15WGIEEE802.15 working group is the part of IEEE802LMSC (Local Area Network/Metropolitan Area Network Standards Committee) and the group defines the standards for WPAN. In June 1997, “Wearable” standard committee was formed and later the Study Group (SG) for WPAN was formed within IEEE802.11 working group and the group became a separate Working Group (WG) in 1999. IEEE802 defines the data link and physical layer of the OSI reference 7 models. Upper layer including interoperability specifications are usually defined by industry organizations. At the very early stage of standardization process, a Study Group (SG) is formed and later it is promoted to a Task Group (TG) to start actual standardization activities. It is also known that Interest Group (IG) and/or Standing Committee (SC) are formed prior to Study Group establishment. Since the participants for this standardization activities are individual

person as opposed to entity base, the higher number of individuals are involved, the higher influence on the decision.

current and general status of iEEE802.15 working groupOverall and the current status of each task group are as follows. 15.3 was the high rate WPAN standard utilizing 2.4GHz band but it is not being used by anybody. 15.3a was working to provide a higher speed UWB PHY enhancement amendment to 802.15.3. The process was in total deadlock and the TG member voted to withdraw PAR (Project Authorization Request) and the group was disbanded. 15.3c was developing 60GHz based alternative PHY but it was ratified in September 2009. 15.4a was working on the alternative PHY to IEEE802.15.4 and main interest was in providing communications and high precision ranging and location capability as it started by UWB related groups. The standardization was completed in March 2007 with triple PHY (Sub-GHz UWB, 2.4GHz CSS and full band UWB). 15.5 was focusing on Mesh Networking of WPANs and it was completed March this year. 15.4c was developing alternative PHY for Chinese WPAN and it was completed in March this year. 15.4d was chartered to define an amendment to the existing 802.15.4. The main purpose of defining this standard was to support a new frequency allocation (950MHz -956MHz) for active RF tag in Japan. It was completed March 2009. 15.4e is developing MAC enhancement to 802.5.4 to a) better support the industrial markets and b) permit compatibility with modifications being proposed within the Chinese WPAN. 15.4f is developing alternative PHY and MAC enhancement to 802.15.4 for active RFID systems. It has just become the task group in early this year and is planning to complete the activity by early 2011. 15.4g This

A WPAn (Wireless Personal Area network) is defined as the connection among personal devices and the communication range is narrower than that of WlAn (Wireless local Area network).

13ElEctronics JAnUArY - MArcH 2010

group started its activities in May 2008 as IG (Interest Group) for NAN (Neighborhood Area Network) but it was promoted to task group as “Smart Utility Networks (SUN)” since early 2009. The group is working to create a

PHY amendment to 802.15.4 to provide a global standard that facilitates very large scale process control applications

such as the utility smart-grid network capable of supporting large, geographically diverse networks with minimal infrastructure,

with potentially millions of fixed endpoints. It will be utilizing license exempt frequency band such as 700MHz-1GHz and 2.4GHz band for this low rate alternative PHY.

The group activities has been drawing significant attention as it is considered as one of the important factor for the “Smart Grid” framework which will enable significantly high efficiency of each life line. 24 standard proposals were presented during May 2009 session and they are being merged as of today. It is considered that the process is expected to be further accelerated since it has involved with economic and political aspects other than technology as well. It is targeted to complete the process by the end of 2010. 15.6 is working on the standardization of BAN (Body Area Network) including medial usage and it is expected to complete the process by early 2010. 15.7 The IG for VLC (Visible Light Communication) has promoted to TG in early 2009 and currently working on technical issues. IGthz The group has started as an IG since early 2008. It is still an early stage of standardization process as it is exploring the feasibility of TeraHertz for wireless communications covering from 300GHz to 3THz. It has formed a Science Committee and it will investigate the existing research result and it will begin working to become a Study Group later on. SCwng (Standing Committee Wireless Next Generation・This group is working to facilitate and stimulate presentations and discussions on new Wireless related Technologies within the defined scope. TGs including 15.6, 15.4f, 15.4g and 15.7 were formed from this WNG. As of September 2009, there are 193 voters within 802.15 working group.

summaryFor the successful market penetration of newly developed wireless standard and technology, the formation of “Ecosystem” will become significantly important factor. The Ecosystem for WPAN can be defined as a system with every multiple factor being mutually interacted each other at the right timing which provides a single solution by combining any necessary factors on a flexible basis. The factors are defined such as early technology validation, standardization, reliable semiconductor solution, reference design and software, killer application, multiple semiconductor providers, readily available components solutions, early adopters, measurement capability, logo certification support for assuring interoperability and so on. Many multiple wireless standards including proprietary ones exist on a same chronological sequence and some may be adopted but some may be obsoleted. It is considered to be very important to keep track of the trend of ecosystem from macro perspective to succeed in this industry. n

Applications and distance image of each wireless standard

overall Mapping of Wireless standards

Position and organization of iEEE802.15 (WPAn)


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391-5157 RR0816Q-220-D 22Ω

MEtAl FilM cHiP rEsistors rr sEriEs The parts offer excellent performance and tolerance in TCR, current noise, linearity, for high frequency circuit applications.

• Resistance Range:10 to 360 kΩ

• Resistance Tolerance: 0.5%

• Power Rating: 0.0625W

• Size: 1608 (0603in)

667-6460 SG-8003CE 1.8432MHz PC B

crYstAl oscillAtors sG8003cE FAMilY• Wide Frequency range: 1.66MHz

• Low Supply voltage: 3.3V


687-4876 PAS0815LR2R3105 2.3Vdc, 1F, 70mΩ

687-4885 PAS1016LR2R3205 2.3Vdc, 2F, 50mΩ

687-4898 PAS1020LA3R0405 3Vdc, 4F, 300mΩ

687-4908 PAS1220LA3R0905 3Vdc, 9F, 200mΩ

687-4901 PAS1235LA3R0206 3Vdc, 20F, 100mΩ

687-4905 PAS1840LA3R0506 3Vdc, 50F, 70mΩ

cYlindEr tYPE PAs cAPAcitor PAS series can store a large number of ions into its amorphous structure (doping), therefore they have much larger capacitance than conventional electric double layer capacitors.

nEW687-4914 LIC1235R 3R8406 3.8Vdc, 40F, 150mΩ

687-4917 LIC1840R 3R8107 3.8Vdc, 100F, 100mΩ

687-4911 LIC2540R 3R8207 3.8Vdc, 200F, 50mΩ

cYlindEr tYPE litHiUM ion cAPAcitor Lithium Ion Capacitors(LIC) are one of the Hybrid Capacitor to which the reaction of EDLC(Electric double layers capacitor) and that of lithium-ion battery are adapted.

nEW

630-3478 HK160810NJ-T

MUltilAYEr cHiP indUctor For HiGH FrEQUEncY Multilayer inductor made of advanced ceramics with low-resistivity silver used as internal conductors provides excellent Q and SRF characteristics.

• Inductance:10nh

• Inductance Tolerances: ±5%

• Size:1608 (0603in)

630-4673 CBC3225T1R0MR

WoUnd cHiP PoWEr indUctors cB sEriEs Chip Inductors that are suitable for module design which needs high electric current like DC/DC converters.

• Inductance: 1.0μh

• Inductance Tolerances: ±20%

• Size: 3225

SuSuMu

PAssiVEs


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TI Products, Application Knowledge and Support

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