集成无源器件驱动系统级 封装小型化 · xpeedic confidential page 3 sip key - passive...
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集成无源器件驱动系统级封装小型化
Dr. Wenliang Dai
VP Engineering, Xpeedic Technology
10/19/2018
Page 2Xpeedic Confidential
System Miniaturization Trend
SOC: System On Chip
SiP: System in Package
SiP - Enabler of system miniaturization• Shorter TTM• Lower cost• Full use of existing IC resources• Heterogeneous integration• IP protection
Trend of electronic systems• Miniaturization• High Performance• Lower Weigh• Lower Cost
Page 3Xpeedic Confidential
SiP Key - Passive Devices
Passive DevicesPassive Devices
70% system cost,
80% area,
90% device num.SiP
The passive devices with miniaturization and high performance are key for SiP.
Page 4Xpeedic Confidential
Passive Miniaturization Solution - IPD
IPD: Integrated Passive DeviceDiscrete Passive Device
IPD Benefits• Miniaturization – low profile, low
weight, high density• Performance – electrical, reliability• Cost – BOM reduction, early TTM, low
process cost
Page 5Xpeedic Confidential
RF IPD over LTCC & SMD
From Onchip and ST
Page 6Xpeedic Confidential
IPD Application over Frequency
From GTI Group
Page 7Xpeedic Confidential
IPD Application
From Yole
Page 8Xpeedic Confidential
XPEEDIC IPD Solution
Dedicated EM tools and expertise
IPD Library
• Proven, application oriented, complete
Design for SiP
• One-stop SiP design service
iModelerFast PDK Model Generation
SnpExpertS-parameter Exploration
MetisIC-Package Co-Simulation
IRISFast RFIC Passive Extraction
Page 9Xpeedic Confidential
M4 M4M3
M2M2M2M2
M1 M1 M1
V1 V1
V0V0
P1 P1 P1P1P1
XPEEDIC IPD Process and ProductsIPD Process
Rs>2000 Ohm.cm
IPD Device
R/L/C
Filter/Filter Group
Match Network
Coupler
Balun
Divider
Hybrid
Si Substrate
High Resisitivity SiliconGlass
Page 10Xpeedic Confidential
XPEEDIC IPD Design Flow
Schematic Generation /Optimization
Layout Generation
EM Simulation
Final EM Verification
PDK Library
Tuning
Tape-out/Package /Measurement
iModelerFast PDK Model Generation
SnpExpertS-parameter Exploration
iVerifierRF Passive PDK Verification
IRISFast RFIC Passive Extraction
Page 11Xpeedic Confidential
XPEEDIC IPD Measurement vs. Simulation
Good agreement between simulation and measurement.
Page 12Xpeedic Confidential
XPEEDIC IPD Application for Mobile Phone
Page 13Xpeedic Confidential
XPEEDIC IPD Application for Wireless
Page 14Xpeedic Confidential
XPEEDIC IPD Application for Meter-WaveDiscrete devices on PCB
Packaged IPD
Page 15Xpeedic Confidential
XPEEDIC IPD Examples(1) – WB Coupler
0.8×0.8×0.2 mm3
LTCCcounterpart
Page 16Xpeedic Confidential
XPEEDIC IPD Examples(2) – Balun
LTCCcounterpart
0.5×0.5×0.35 mm3
Page 17Xpeedic Confidential
XPEEDIC IPD Examples(3) – WLAN Diplexer
0.8×0.8×0.35 mm3
LTCCcounterpart
Page 18Xpeedic Confidential
XPEEDIC IPD Examples(4) – Glass Diplexer
Item Freq /MHz TGV LTCC HRS 2D GlassIL
/dB698~960 0.25 0.27 0.52 0.50
1710~2690 0.37 0.37 0.60 0.58Isolation
/dB698~960 27 26 25 26
1710~2690 27 31 27 26Atten/dB
698~960 28 26 25 261710~2690 27 30 27 26
Size/mm3 -- 2.5×2.2×0.45 2.5×2.0×1.0 1.5×1.5×0.35
Page 19Xpeedic Confidential
XPEEDIC SiP Examples with IPD
SiP with IPD
B
E
C
D
A
HR-Si Substrate
Chip1 Chip2BGA
IPD Substrate
IPD Substrate with TSV
IPD for
RC Network
IPD for stack die
IPD for PA module
