ece 300 microprocessor project

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ECE 300 Microprocessor Project Nick Jones Nick Jones Bibi Morales Bibi Morales Hadi Choueiry Hadi Choueiry Tyler Griffin Tyler Griffin Group 9

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ECE 300 Microprocessor Project. Group 9. Nick Jones Bibi Morales Hadi Choueiry Tyler Griffin. Objectives. To learn to use teamwork and communication skills to complete a project. Gain experience with PCBs and surface mount components Learn precision soldering - PowerPoint PPT Presentation

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Page 1: ECE 300 Microprocessor Project

ECE 300 Microprocessor Project Nick JonesNick Jones

Bibi MoralesBibi Morales

Hadi ChoueiryHadi Choueiry

Tyler GriffinTyler Griffin

Group 9

Page 2: ECE 300 Microprocessor Project

Objectives

To learn to use teamwork and communication skills to complete a project.

Gain experience with PCBs and surface mount components

Learn precision soldering Programming and debugging in C To select a proper temperature

sensor that meets the needs of our particular project.

Page 3: ECE 300 Microprocessor Project

Board Components - Chip

The first component that was soldered onto the board was the MSP430 chip using the provided microscope.

This was done by aligning the chip with the circuit traces and keeping it stable with a tiny bit of flux.

There were 100 solder connections which proved to be difficult at first.

Page 4: ECE 300 Microprocessor Project

Board Components-LCD Display

40 pin LCD It was difficult to line up the pins to fit in the

slots on the board. The holes on the board sucked the solder

down into board.

Page 5: ECE 300 Microprocessor Project

Board Components – Resistor and Capacitors

These components were placed on the board and held in place by a small amount of solder.

They were then soldered down.

C1 0.1 uf C2 0.1 uf C3 10 uf (polarized) C4 0.1 uf C5 0.1 uf C6 10 uf (polarized) C9 1.0 uf C10 0.1 uf R5 47 kohms

Page 6: ECE 300 Microprocessor Project

Board Components- Other parts

The components were placed on the board:

Push button switch voltage regulator 5 volt input connector slider switch JTAG connector 32.7 kHz crystal

Page 7: ECE 300 Microprocessor Project

Board Components – Switch

Added switch

Selects between On board AD22103 Off board AD590

Page 8: ECE 300 Microprocessor Project

The Completed Board

Page 9: ECE 300 Microprocessor Project

Sensor Circuit

9 V ba t te ry

9 V ba t te ry

B

A

C

D P D T s w itc h

V o ltag eS u p p lyfo r p ro tob o ard

C (+ 9 V )

B (g rd )

+

_

A D 5 9 0 s e n s o r

7 4 1

B

pin 7

pin 4

pin 6pin 2

pin 3

C

A

+

_+

_

V S

R FB

R IN

1 0 k

1 .8 k

1 k

+

_

V O

T o A /D c o n v e rte ro f th e m s p 4 3 0

• •a b

1 0 0 pot

1 k

AD590

AD22103

Page 10: ECE 300 Microprocessor Project

Temperature Sensor AD590 and AD22103

Page 11: ECE 300 Microprocessor Project

Programming the Chip

The files provided by Dr. Green, lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c, were used in our project.

The MSP430 Flash emulation tool was connected to the board and the computer.

Using IAR and C-SPY we programmed the board.

Page 12: ECE 300 Microprocessor Project

Programming the Board

sensor.c

Page 13: ECE 300 Microprocessor Project

AD22103 Results

AD22103 vs Calibration

0

5

10

15

20

25

0 20 40 60 80 100 120

Time (Seconds)

T (

De

g C

) Calibration

AD 22103

Linear (Calibration)

Linear (AD 22103)

Page 14: ECE 300 Microprocessor Project

AD590 Results

AD590 vs Calibration

0

5

10

15

20

25

0 20 40 60 80 100 120

Time (Seconds)

T (

De

g C

) AD590

Calibration

Linear (AD590)

Linear (Calibration)

Page 15: ECE 300 Microprocessor Project

Questions?

Nick JonesNick Jones

Bibi MoralesBibi Morales

Hadi ChoueiryHadi Choueiry

Tyler GriffinTyler Griffin

Group 9