选择电池充电器ic时的考虑因素 · industry news 6 power system design china 2007 1/2 nxp...

市场观察市场观察

选择电池充电器IC时的考虑因素

2007年1/2月

32

...................................................................................................................................................................................................... 4

2 0 0 7 .................................................................................................................................................... 6..................................................................................................................................................................... 6

................................................................................................................................................ 6............................................................................................................................ 8

picoChip ........................................................................................................................................................................... 8Cirrus Logic IC ............................................................................................................................ 8

.......................................................................................................................................................................................................... 8

S M D .......................................................................................................................................... 10SIMPLE SWITCHER ........................................................................................................................................ 12

CMOS Paul Greenland Enpirion ............................................................................................................. 13

Marijana Vukicevic iSuppli ........................................................................................ 14

P S D C ................................................................ 15P S D C ........................................................................ 16

IC Steve Knoth ..................................................................................................... 17

Lucio Di Jasio Microchip Technology Inc. .................................................................................................................. 21

PCIM China ................................................................................................................................................ 23

Stuart Lester UR Group Ltd. .......................................................................................................................... 35

Wi-LEM Loïc Moreau LEM SA ........................................................................................................................ 37

Mike Fowle r ...................................................................................................... 40

Hannes Rahn Brian Roberts Wendel Charles RFMD ............................................................................. 42

.................................................................................................................................................................................................... 48

Arnold AldermanPaul GreenlandJeff Ju

Alex Lidow

Davin LeeDave BellRalf J. MuensterDhaval DalalBalu BalakrishnanMichael Wang

AnagenesisEnpirion

/Eupec

Intersil

Micrel

Power Integrations

3

CC.p65 2007-2-14, 17:212-3

54

Power Systems Design China Steering Committee MembersMemberArnold AldermanPaul GreenlandJeff JuSimon ChenWu, Xin (Wilson)Alex Lidow

MemberDavin LeeDave BellRalf J. MuensterDhaval DalalBalu BalakrishnanMichael Wang

RepresentingAnagenesisEnpirionFairchild SemiconductorInfineon Technologies/EupecIntelInternational Rectifier

RepresentingIntersilLinear TechnologyMicrelON SemiconductorPower IntegrationsTexas Instruments

View Point ......................................................................................................................................................................................... 4

Industry News2007 International Low Power Design Seminar will be held in Beijing ........................................................................................................... 6Rockwell Automation Has Realized Achievement Continued Increase and Offers Service Further for Chinese OEMs Customer ............. 6NXP Dongguan Factory Completes Fifth Phase of Investment, Goes into Full Operation .............................................................................. 6Infineon Definite Mid-Term Goal: Focusing High-Energy Effect, Mobility and Safety ..................................................................................... 8PicoChip Establishes Beijing Design Center .................................................................................................................................................... 8Cirrus Logic March to Growing Market for Power Management Integrated Circuits ..................................................................................... 8Power Events ................................................................................................................................................................................................... 8

High-performance non-shielded SMD inductors in low-profile packages .................................................................................................... 10New Series Step-Down Switching Regulator ............................................................................................................................................... 12

The Challenge of Powering Deep Sub-Micron CMOS Loads By Paul Greenland, Enpirion ..................................................................... 13

MarketWatchBrief Slowdown Ahead for Power Management Semiconductors Marijana Vukicevic, iSuppli Corporation ......................................... 14

Multi-Gate Technology to Achieve Breakthrough Results, New Semiconductor Structures Significantly Improve Energy EfficiencyReported by Liu Hong, Editor-in-Chief PSDC ................................................................................................................................................. 15High Performance Analog Chip is in the Lead Industry, and Power Management Grows up to the Surmount Market LevelReported by Liu Hong, Editor-in-Chief PSDC ................................................................................................................................................. 16

Cover StoryPower for the Purpose By Steve Knoth, Linear Technology ................................................................................................................... 17

Intelligent PowerIntelligent Power-Supply Design By Lucio Di Jasio, Microchip Technology Inc. ......................................................................................... 21

PCIM China Conference Guide ........................................................................................................................ 23

Intelligent PowerIntelligence Overcomes Power Struggles By Stuart Lester, UR Group Ltd ............................................................................................. 35

Power ManagementWi-LEM Wireless Local Energy Meter for Plug & Save By Loïc Moreau, LEM SA ................................................................................... 37

Portable PowerSerialization for Ultra-Portables By Mike Fowler, Fairchild Semiconductor ............................................................................................. 40Improving Energy Conservation in Mobile Handsets By Hannes Rahn, Brian Roberts and Wendel Charles, RFMD .............................. 42

New Products ............................................................................................................................................................................ 48

C O N T E N T S

5

CC.p65 2007-2-14, 17:214-5

VIEWPOINT

4 Power System Design China 2007 1/2

L E D

R-

G-B

50K/

IR

L E D

LED

40-80 lm/W

AGS Media Group5D

518033info@powersystemsdesignchina.comwww.powersystemsdesignchina.com

[email protected] 13651220041

Jim [email protected]

Julia [email protected]

5D5180330755-82244000

[email protected]

www.powersystemsdesignchina.com

www.powersystemsdesignchina.com/psdc/psdclogn.htm

2007 1/2ISSN 1815-3453

AGS Media Group Power Systems DesignChina

[email protected]

700lm 50W

LED

LED

LED LED

7 11

CCFL

LED

LED /

/

VP.p65 2007-2-15, 13:364-5

INDUSTRY NEWS


www.nxp.com

N X P S e m i -

conductors

2000

1 .59

6,260

3 5 %

2000 1

Rockwell

Automation

Media Day

2006

Listen Think Solve

2005 2006

3 0

O E M

CompactLogixTM

CMS

OEM OEMax

CMS

OEM

O E M

OEMax

CMS OEMax

O E M

Tom O Reilly

,

www.rockwellautomation.com.cn

2007

2007

6 22

� LCD PDP DLP HDTV

IPTV

� C R T

� DVD/VCD

� P C

�

�

�

�

�

�

�

www.rayjade.com.cn

www.cpsa.com.cn

IN.p65 2007-2-15, 13:556-7

INDUSTRY NEWS


PCIM China 2007 3 21-23

( www.pcimchina.com)

electronicaChina 2007 3 21-23

( www.ep-c.cn)

2007

2007 4 12-14

( www.chinaelec.com.cn)

2007 6 13-

15

( expo.dianyuan.com )

2007 6

21-23

( www.cpsa.com.cn )

Wolfgang Ziebart

2007

Ziebart

1 0

10% 10%

E B I T

2 0 0 6 /

2007 Ziebart

2007

10%

Ziebart

www.infineon.com/cn

Cirrus Logic

Cirrus Logic

1050

Cirrus Logic

David D. French

Cirrus Logic

Cirrus Logic

Cirrus Logic IC

Cirrus Logic

2004

37

30

www.cirrus.com/cn

picoChip

B a t h

picoChip

picoChip

picoChip

BUPT

W S P N

T D -

SCDMA WiMAX

www.picochip.com

CAS ICT

picoChip

IN.p65 2007-2-15, 13:558-9


Stackpole Electronics, Inc.

MPE MPI

I / O

Stackpole

Stackpole

Kory Schroeder Stackpole

MPE MPI

MPE

1.2mm

M P E

1 H 68 H

1 . 4 A

PDA

LCD

MPE

0.27 8 10

M P I

1.0m 2.0mm MPI

1 0 5

1 H

1000 H 2.5A

MPI 0 .24

8 10

S t a c k p o l e

PDH PD PCD

0302 5022

0.18 H 1000 H

1 9 A

Stackpole Electronics, Inc.

3

P S D B S F M

P D R H

3

P S D B

DC-DC

S F M D C

4mm 1.8mm

PDRH

www.seielect.com

MPI-06

MPE

MPI-09

PL1.p65 2007-2-15, 14:0610-11

13www.powersystemsdesignchina.com12 Power System Design China 2007 1/2

Paul Greenland Enpirion

1 9 6 5

24

Gordon

E.

d I / d t

CMOS

C M O S

VI

1/f

C M O S

9 0 n m

CMOS IC PLL

SNR

sheer density

ground bounce

I C

20 mVp-p

E n p i r i o n

5 M H z

500kHz

LDO

L D O

LDO

Enpir ion

I C

IC

I C

I / O

P i

CMOS

BER Enpirion

www.enpirion.com

National Semiconductor

Corporation

SIMPLE SWITCHER®

6

W E B E N C H ®

6

/

WEBENCH

WEBENCH

BuildIt!TM

24

4 8

7 5 V

3 A

50kHz 1MHz

www.national.com/CHS

SIMPLE SWITCHER® WEBENCH

6 S I M P L E

SWITCHER

0 . 5 A L M 5 5 7 4 1 . 5 A

LM5575 3.0A LM5576

6V 75V

50kHz 500kHz

0.5A LM25574 1.5A LM25575

3.0A LM25576

6V

42V

50kHz 1MHz

PP.p65 2007-2-15, 14:2012-13

MARKETWATCH


2 0 0 6

iSuppli

iSuppli

2007

2006

61

4.3 58

2005 58.4

0.6

0.8

Marijana Vukicevic iSuppli

www.isuppli.com

60 2005

55 9.5

4

13.1 2006

1 2005

9 . 4

1

iSuppli 2005

2 0 0 7

ASP

2006

2 3 7

2005 219.9

7.7

2006

2005 27.8

20072 0 0 6

2 0 0 7

2007

2 0 0 6

268 13.1

MOSFET

MOSFET

1 5

2007

ASP

1.

Hermann Eul

6 5

30%

65nm

32nm

Hermann Eul

6 5 n m

Hermann Eul

32 CMOS

65nm 3,000

MP3

5 0

SOI

5 6

IMEC

.

www.infineon.com/cn

MW.p65 2007-2-15, 14:2214-15

COVER STORY

17www.powersystemsdesignchina.com

COVER STORY


U S B

USB

I C

/

SLA

N i M H

NiCd

I C

Steve Knoth

USB

I C

PowerPathTM

USB I C

I C

-

IC

LTC4010 LTC4011

I C

IC

NiMH/NiCd

4.5V 34V

4A 1 16 NiMH NiCd

National Semiconductor

2006 21.6

2005 13% 4.492 60%

2007

7 % -

8% 59%

2005

14.0% 1GSPS

8

2 0 M S P S

65MSPS 12

LPV7215

600nA 6.6 s

/

PowerWise®

P W I

PowerWise

LP5550 PWI

P o w e r W i s e

AVS

PowerWise /

P W I

P F M

CMOS7

LP3970/71

1 1

L D O /

www.national.com/CHS

CS.p65 2007-2-15, 14:2516-17

COVER STORY


COVER STORY


/

IC USB

2

/

2

PowerPath

LTC4089 LTC4085 LTC4066

LTC4055

P C B

P C B

LTC4075/76/77 LTC4089

U S B I C

LTC4065 LTC4069

0.75mm 2mm 2mm

6 DFN

USBGPS

P D A

MP3/MP4

5V/500mA 2.5W

USB

USB

P C

U S B

LTC4089 LTC4089-5

/

IC

0.75mm 22

6mm 3mm DFN

3 6 V

40V

1 2 V

FireWire/IEEE1394

5V USB

3

IC

I C

I C

3. LTC4089

-

IC Bat-TrackTM

LTC4089

/

IC

LTC4001

2 A

4.2V /

16

0.75mm 4mm 4mm QFN

IC

1 . 5 A

9 0 %

1 L T C 4 0 0 1

1.5MHz

F i r e w i r e / I E E E 1 3 9 4

12V 24V

>5.5V

I C

USB /

<5.5V

/

IC

IC

LTC4002/6/7/8

1. IC LTC4001

2. PowerPath

2 8 V

PowerPath

U S B /

MOSFET

IC

I C

PowerPa th

PowerPath

USB VBUS

CS.p65 2007-2-15, 14:2518-19

INTELLIGENT POWER


INTELLIGENT POWER

SMPS

DSC

1. /

2.

3.

4 .

/

Lucio Di Jasio Microchip Technology Inc.

4MHz

P W M

2

4

1MHz

P W M

P W M

R C

OSCAL

MOSFET

PWM

0 %

100% 1

4

I / O

1. PIC10F200

2. PIC®

IC

C / 1 0

C/x

I C

I C

-

NiCd

NiCd

NiMH NiMH

NiCd

NiCd

IC

SMBus

1

2 SBS

3

4

5

USB

I C

2mm 2mm

I C

I C

1. IC

www.linear.com.cn

COVER STORY

TF-5.p65 2007-2-15, 14:2920-21


SMPS

3.

OSCCAL 600kHz

1.2MHz

8

20dB

3

www.microchip.com

INTELLIGENT POWER

Dynex Semiconductor

GTO 1300V 6500V 600A 4000A

1200V 8500V 450A 6000A

60V 600V 900A 8000A

SR_JF07_PCIM China.p65 2007-2-15, 14:4722-23


Thursday, 22 March 2007 2007 3 22

Session Unit B B

Session 3/ 3

Future DC/DC Converter Concepts

--- Part I

/

Session 4/ 4

Advanced Power Semiconductors

--- Part I

Keynote Presentation

Lunch

Departure Shuttle Bus to Shanghai International Expo Center (SNIEC)

(SNIEC)

9:00 -11:20

11:30 - 12:10

12:15 -13:15

13:30 - 16:10

Session Unit C C

Session 5/ 5

Future DC/DC Converter Concepts

--- Part II

/

Session 6/ 6

Advanced Power Semiconductors

--- Part II

Wednesday, 21 March 2007 2007 3 21

8:30 Opening

Session Unit A A

Session 1/ 1

New AC/DC Power Converter

Topologies

/

Session 2/ 2

Advanced Motor Drive & Motion

Control Systems


Lunch


(SNIEC)

8:50 -11:30

11:40 - 12:20

12:30 -13:15

13:30

Friday, 23 March 2007 2007 3 23

Session Unit D D

Session 7/ 7

Power Electronics in Cars

Session 8/ 8

Power Quality Solutions


Lunch


(SNIEC)

9:00 -11:20

11:40 - 12:20

12:30 -13:15

13:30

13:30

Conference Program at a Glance

SR_JF07_PCIM China.p65 2007-2-15, 14:4724-25


8:50 - 9:10

Session 2 (parallel running to Session 1) 2 1

Advanced Motor Drive & Motion Control Systems

Chairman: Prof. Dianguo Xu, Harbin Institute of Technology, China

How to choose the Right Integrated Power Module for Appliance Application

Zhou Chen, International Rectifier, USA

2.1

Summary of each paper is available at: �www.pcimchina.com

9:10 - 9:30 2.2

9:30 - 9:50 2.3

9:50 - 10:10 2.4

Fault Tolerant Schemes in the Control of Electrical Drives

Mario Pacas, University Siegen, Germany

The Key Points of BLDC Type Compressor driven for Inverter Aircon

Aircon BLDC

Wang Rendong, Renesas System Solutions (Beijing), China

High Efficiency and Low Cogging Torque Motor Design for Hermetic DC Compressors

Chih-Chung Lo, Yu-Choung Chang, Industrial Technology Research Institute,Taiwan

10:10 - 10:30 Coffee Break

10:30 - 10:50 2.5

10:50 - 11:10 2.6

11:10 - 11:30 2.7

11:40 - 12:20

12:30 - 13:15

13:30Bus Shuttle to SNIEC - Shanghai New International Expo Center

(SNIEC)

The IPMSM Position Sensorless Vector Control System for the Home Appliance

IPMSM

Fukumoto Tetsuya, Aoyama gakuin University, Japan

Enhanced Field Sensors used as a very simple Current Sensor

David Jobling, Marc Schaerrer, Brian he Bo, LEM Group, Switzerland

A new IGBT Module for Matrix Converter and AC application

IGBT AC

Norbert Pluschke, Semikron International, Hong Kong


State of the Art and Future Trends in Electronics controlled Lighting Systems

Prof. Dianguo Xu, Harbin Institute of Technology, China

Lunch


8:30 - 8:40

Session 1 (parallel running to Session 2) 1 2New AC/DC Power Converter Topologies

/Chairman: Dr. Ying Jianping, Delta Electronics, China

Opening

8:50 - 9:10 Environmental Stewardship: How Semiconductor Suppliers Help to Meet Energy-Efficiency Regulations and Voluntary Specifications in China

Robin Clark, ICF International, USA, Andrew Fanara, US Environmental ProtectionAgency, USA, Aizhen Li, China Standard Certification Center, China, DavidFridley, Lawrence Berkeley National Lab, USA, Louise Merriman, Jeff Ju,Fairchild Semiconductor, USA

1.1

9:10 - 9:30 1.2

9:30 - 9:50 1.3

9:50 - 10:10 1.4

10:10 - 10:30

10:30 - 10:50 1.5

10:50 - 11:10 1.6

11:10 - 11:30 1.7

11:40 - 12:20

13:30

12:30 - 13:15

ICE2QS01 Provides a New Solution for Quasi-Resonant Flyback ConvertersICE2QS01Yi He, Infineon Technologies Asia Pacific, Singapore

Analysis and Design of a 1MHz LLC Resonant Converter with Coreless Transformer Driver1M Hz LLCMingping Mao, Fraunhofer Institute, Germany

An Open Load Solution for the LLC Resonant ConverterLLCYan Chao, Delta Electronics, China

Coffee Break

Topologies for Standby Power and its Performance Evaluation

Eric Kok, Infineon Technologies, Singapore

ZVS and ZCS High Efficiency Low Profile AdapterZVS ZCSBogdan Tudor Bucheru, Delta Energy Systems, USA

Power Conversion and the New Business Model

Jaspar Lim, American Superconductor, Singapore

Keynote Presentation State of the Art and Future Trends in Electronics controlled Lighting Systems

Prof. Dianguo Xu, Harbin Institute of Technology, China

Lunch

Bus Shuttle to SNIEC - Shanghai New International Expo Center(SNIEC)

Wednesday, 21 March 2007 Morning Sessions Start: 8:30

Hotel Holiday Inn Pudong, 899 Dong Fang Road, Shanghai

2007 3 21 8 30

8 9 9

SR_JF07_PCIM China.p65 2007-2-15, 14:4726-27



Session 4 (parallel running to Session 3) 4 3Advanced Power Semiconductors - Part I

Chairman: Norbert Pluschke, Semikron International, Hong Kong

9:00 - 9:20 The Development of new IGBT Module with the Unified Package PartsIGBT

Manabu Matsumoto, Mitsubishi Electric, Japan

4.1

9:20 - 9:40

9:40 - 10:00 4.3

10:00 - 10:20

10:20 - 10:40

10:40 - 11:00 4.5

11:00 - 11:20 4.6

11:30 - 12:10

Influence of Thermal Cross Coupling at Power Modules

Daojie Chen, Tyco Electronics Power Systems, China, Ralf Ehler, Ernö Temesi,

Zsolt Gyimothy, Tyco Electronics Power Systems, Hungary

PrimePACK - The new High Power IGBT Module ConceptPrime PACK - IGBTZhi Hong Liang, Zhen Bo Zhao, Infineon Technologies, China

Soft Start Control

Norbert Schaefer, Semikron, Germany, Wenrui Zhang, Semikron, Hong Kong

Coffee Break

High Power Density in Power Modules

Alan Elbanhawy, Fairchild Semiconductor, USA

An Innovative Hybrid Approach for Next-Generation Off-Line SMPS High Power ICConverters

SMPS ICLorenzo Maurizio Selgi, Fabio Cacciotto, Luigi Arcuri, Fragapane Leonardo,STMicroelectronics, Italy

Keynote Presentation Power Supply Technology - Present and Future

- Milan M. Jovanovic, Delta Products, USA

13:30

12:15- 13:15


Lunch

Summary please see seesion 3 3

4.2

4.4


Session 3 (parallel running to Session 4) 3 4Future DC/DC Converter Concepts - Part I

/Chairman: Prof. Xu Dehong, Zhejiang University, China

9:00 - 9:20 Very High Efficiency Power Conversion using a Novel Current Shaping Technology

Dan Jitaru, Delta Energy Systems, USA

3.1

9:20 - 9:40 3.2

9:40 - 10:00 3.3

10:00 - 10:20 3.4

10:20 - 10:40

10:40 - 11:00 3.5

11:00 - 11:20 3.6

11:30 - 12:10

Digital Control Techniques enabling Power Density Improvements and PowerManagement Capabilities

Per-Johan Wiberg, Ericsson Power Modules, USA

An Accurately Regulated Multiple Output ZVS DC-DC ConverterZVSDC-DC

Yanjun Zhang, Dehong Xu, Zhejiang University, Yu Han, Zhong Du, Emerson, China

True Digital Solutions Simplify Full Featured Cost Effective Buck Converters

Hasmukh Modi, Primarion, USA

Coffee Break

New Approaches to build Jitter Free High Voltage, Small Size Power Supply

Winter Cheng, National Semiconductor, China

Reducing Power with Dynamic Voltage Scaling

Scot Lester, Texas Instruments, USA

Keynote Presentation Power Supply Technology - Present and Future

- Milan M. Jovanovic, Delta Products, USA

13:30

12:15 - 13:15


Lunch

Technology for power systems of modern computer/telecom equipment is facing extremely tough challengesbecause of continuously increasing power-density and efficiency requirements. Meeting these requirementswill require significant technology advancements in system architectures, devices and materials, topologyoptimization, and packaging/thermal area. In this presentation, major technology challenges and futuretrends in each of these key technology areas are identified and briefly discussed.

2007 3 22 9 00

8 9 9

Thursday, 22 March 2007 Morning Sessions Start: 9:00


SR_JF07_PCIM China.p65 2007-2-15, 14:4728-29




Advanced Power Semiconductors - Part II

Chairman: Prof. Leo Lorenz, Infineon Technologies, China

13:30 - 13:50 Reverse Conducting (RC-)IGBTs from 900V to 1600V

900V 1600V IGBT

Oliver Hellmund, Stephan Voss, Wolfgang Frank, Infineon Technologies,

Germany, Simon Zijing Chen, Infineon Technologies, China

6.1

13:50 - 14:10 6.2

14:10 - 14:30 6.3

14:30 - 14:50

14:50 - 15:10 6.4

15:10 - 15:30 6.5

15:30 - 15:50 6.6

Elimination of Secondary MOSFET Avalanche Failure in DC Bus Converters

DC MOSFET

Weidong Fan, International Rectifier, USA

Universal, High Brightness LED Driver IC offers increased Flexibility and Higher

Efficiency

LED IC

Ravi Bhatia, Mansion Lui, STMicroelectronics, Singapore

Coffee Break

Impact of Mounting Height Variation on DC-DC Converter FET Peak Ring Voltage

DC-DC FET

Arthur Black, Carlo Ocampo, Fairchild Semicondutor, USA

Offline Power Supply Topologies for LED lighting

LED

Donald Ashley, John Jovalusky, Power Integrations, USA

CAL4: The next Generation 1200V Freewheeling Diode

CAL4: 1200V

Volker Demuth, Semikron International, Germany

15:50 - 16:10 6.7 From New Driver Concepts to Intelligent Modules

Hui Wu, Infineon Zhi Hong Liang, Infineon Technologies, China, Wolfgang Frank,

Infineon Technologies, Germany



Future DC/DC Converter Concepts - Part II

/

Chairman: Dr. Xinbo Ruan, Nanjing University, China

13:30 - 13:50 Powering Portable Photographic Flash Lighting

Scot Lester, Texas Instruments, USA

5.1

13:50 - 14:10 5.2

14:10 - 14:30 5.3

14:30 - 14:50

14:50 - 15:10 5.4

15:10 - 15:30 5.5

15:30 - 15:50 5.6

Application of a 6kw Soft Switching DC-DC Converter in Rectifier Module

6kw DC-DC

Lisheng Shi, M.L. Crow, University of Missouri-Rolla, USA

A new Compact Monolithic Step-Down Synchronous Regulator manages High

Current Conversions

Massimiliano Merisio, STMicroelectronics, Italy

Coffee Break

Dual SmartRectifierTM - DirectFET Chipset Solution Overcomes Package Induced

Sensing Limitations Allowing High Performance Synchronous Output Rectification

in LCD TV Power Supplies

- FET

Adnaan Lokhandwala, International Rectifier, USA

A Simple and Flexible Non-Inverting Buck-Boost Converter for MCU Based

Battery Charger Applications

- MCU

Nikhil Gupta, STMicroelectronics, India

Low Qgd 200 to 250V UltraFET Trench MOSFETs with low Trr and Qrr for

Synchronous Rectification, AC/DC and DC/DC Applications

Trr Qrr Qgd 200 250 FET MOSFETs

AC/DC DC/DC

Praveen Shenoy, Bob Brockway, Fairchild Semiconductor, USA

2007 3 22 9 00

8 9 9

Thursday, 22 March 2007 Morning Sessions Start: 9:00


SR_JF07_PCIM China.p65 2007-2-15, 14:4730-31



Session 8 (parallel running to Session 7) 8 7Power Quality Solutions

Chairman: Jean-Paul Beaudet, MGE UPS Systems, France

9:00 - 9:20 New Trench-Field-Stop IGBT in UPS Applications- - IGBT UPS

Yizheng Zhou, Ziying Chen, Infineon Technologies, China,Wolfgang Frank, Infineon Technologies, Germany

8.1

9:20 - 9:40 8.2

9:40 - 10:00 8.3

10:00 - 10:20 8.4

10:20 - 10:40

10:40 - 11:00 8.5

11:00 - 11:20 8.6

11:40 - 12:20

Improvement Current Sharing of Paralleled UPS SystemUPS

Yu Wei, Chao Yang, Yi Chen, Dehong Xu, Zhejiang University, China

Transformerless 3-Phase UPS: A Natural Evolution toward better Performances UPS:

Jean-Paul Beaudet, MGE UPS Systems, France

Disturbance Rejection Control for Autonomous Wind-Diesel Power Systems

Anastasios Pouliezos, Technical University of Crete, Greece

Coffee Break

A Nonlinear Method of Detecting Sags for UPS ApplicationUPS

Raj M. Naidoo, University of Pretoria, South Africa

Optimum Harmonic Elimination Control Method for Multilevel Inverters usingArtificial Neural Network

Seyyed Hossein Hosseini, Hassan Taguizadeh, Hamed Latafat, Kaveh Razi,University of Tabriz, Iran

Keynote Presentation Hybrid Propulsion System: "GM March to Zero Emissions"

G MVanessa Paladini, Maurizio Cisternino, Giovanni Cipolla,General Motors Powertrain, Europe, Italy

13:30

12:30 - 13:15

Shuttle Bus to SNIEC - Shanghai New International Expo Center (SNIEC)

Lunch

Summary please see session 7 7


Session 7 (parallel running to Session 8) 7 8Power Electronics in Cars

Chairman: Prof. Zhihong Wu, Tongji University, China

9:00 - 9:20 Driving High Brightness LEDs for Wide Input DC to DC ApplicationsDC-DC

LEDDennis Solley, ON Semiconductor, USA

7.1

9:20 - 9:40 7.2

9:40 - 10:00 7.3

10:00 - 10:20 7.4

10:20 - 10:40

10:40 - 11:00 7.5

11:00 - 11:20 7.6

11:40 - 12:20

Laminated Bus Bars for the Power Electronics In Cars

Reuven Koter, Eldre, USA

A Novel Varied Frequency Control Method used in Hybrid Electric Vehicle

Qingbo Hu, Zhejiang University, China

1500W Automotive Bi-Directional Battery Charger1500WLucian Hriscu, Delta Energy Systems, USA

Coffee Break

Reliable IGBT Modules for (Hybrid) Electric VehiclesIGBT

Andreas Volke, Zhen Bo Zhao, Infineon Technologies, China

Automotive Buck Regulator with Enhanced Load Range

Winter Chen, National Semiconductor, China

Keynote Presentation Hybrid Propulsion System: "GM March to Zero Emissions"

G MVanessa Paladini, Maurizio Cisternino, Giovanni Cipolla, General MotorsPowertrain Europe, Italy

13:30

12:30 - 13:15


Lunch

The continuous petrol cost increase jointly to the always more stringent legislation for emissions pave the wayfor the introduction on the market of hybrid technology. However, the on costs still represent a major drawbackof this technology. According to the specific region requirements a trade-off between costs and vehiclefeatures is required. The paper describes the GM global strategy, going through the most promising hybridsarchitectures with particular focus on Asia-Pacific market.

2007 3 23 9 00

8 9 9

Friday, 23 March 2007 Morning Sessions Start: 9:00


SR_JF07_PCIM China.p65 2007-2-15, 14:4732-33


INTELLIGENT POWER


I2C PMbus

DC-DC

A C / D C

Astec Power

A C / D C

iMP Electronica

11 14-17

i M P

PC

2 0 0 0

Stuart Lester UR Group Ltd.

UR

Group Swindon

48 24

4 8

1 2

U R

10 50

iMP 2000 PC

UR

U R

PC

[email protected] +86 - 21 - 64712001

Email

PCIM 2007 3 21 -23

S N I E C

1634 114

200031

+86 - 21 - 64712180

+86 - 21 - 64712001

2007 3 21

520

930

1 2 5 0

1460

1

2

3

4

810

1420

1820

2150

* 3 22 C B

2007 3 22 2007 3 23

A B

C

D

Registration Form for Participants from China

TF_6.p65 2007-2-15, 14:5234-35


POWER MANAGEMENT


POWER MANAGEMENT

C O 2

30

5

90

2 0 0 6 4

2006/32/EC

Loïc Moreau MacroComponents LEM SA

Sub-metering LEM

1.

-

2.

3 .

4.

UL CE

U R

Swindon

AC/DC

Astec

WEEE

U R

E M C

P S U

HALT HASS

i M P

EN 60601

EMC

www.ur-group.co.uk

INTELLIGENT POWER

TF_7.p65 2007-2-15, 15:0136-37


POWER MANAGEMENT


POWER MANAGEMENT

Wi-LEMWi-LEM

1

EMN

Mesh Gate MG MN

EMN

1

EMN

5 30

EMN

pre-wired split core

IEC 62053 Active Energy Class 1

Reactive Energy Class 3

0.5

EMN 120 240VAC

50/60Hz

5A 100A

LEM

EMN

D I N

Wi-LEM

2

LEM EMN

MG

2.

M G

EMN

8 0 2 .

15.4 ZigBee

240 EMN

PC

RS 232 RS 485

MODBUS RTU

MN

E M N

M G

25 MN

Wi-LEM

MN

Wi-LEM

LEM

www.lem.com.cn

5 .

6.

7.

5 A

DIN

/

RS 485 Modbus

4 4 8 16

24VDC

HVAC

1.

1.

TF_7.p65 2007-2-15, 15:0238-39


PORTABLE POWER


PORTABLE POWER

EMI

P L L

P L L

P L L

PLL

P L L

SerDes PLL

PLL

GPIO

2. a 77.7ns

27.8ns b 65%

(a)

(b)

P L L

PLL

P L L

C T L

I / O

C T L

VSWR

u SerDes

E M I

CTL

CTL

u SerDes

u SerDes

SPI u SerDes

u SerDes

SerDes

SerDes

www.fairchildsemi.com/cn

1 0

10ns 100ns

0.5mA SerDes 10

Mike Fowler

20

u SerDes

CTL I/O

5.44MHz

2 mA

SerDes 5 10

250 A

u SerDes

1. GRO PLL PLL 50% uSerDes 50%

GRO 30% 60%

SerDes 25 100

u S e r D e s

100nA

TF_1.p65 2007-2-15, 15:0440-41


PORTABLE POWER


PORTABLE POWER

PA

3.2V

P A

2

3

3

PA

DC-DC

2.5V-

2.8V

D C

P A

P A

2.

3.

IMS 2006

4. GSM 900 DCS1800 PCS1900

2G 3G

HSDPA

LCD

TRP HSDPA

T R P

Hannes Rahn Brian Roberts Wendel Charles RFMD

1

2 6 0 0

IC

RF PA

3G 40%

600-880

1200-1400

9-10%

1

1. IMS 2006

TF_2.p65 2007-2-15, 15:0542-43


PORTABLE POWER


PORTABLE POWER

1.6W/kg

TRP

SAR

TRP 3GPP

P A

RF

P A

P A

RF3196

RF3166

RF3166 Power Star

/

PA

profienciences

PA

RF3166

6

P A

Power Star

P A

50

P A

Pout

8. RF3166 RF3166 RF3166

7. RF3166

9. RF3166 RF3166 RF3166

PA PA

SAR TRP

4

W C D M A - E D G E

WCDMAGPRS

T R P

S A R

TRP SAR

T R P

RF

S A R

T R P

/

TRP TRP

S A R

5

F C C

S A R

SAR

5.

6 .

TF_2.p65 2007-2-15, 15:0544-45


PORTABLE POWER


PORTABLE POWER

PAP A

PA

13 RF3266

10dB

2 5 d e g

WCDMA

8 d B m

PA

PA

PA

PA

14

DC-DC

DC-DC

P A

13. PA

LPM

14. 3dBm

P A

PA 57% PA

DC-DC 3.0

4 .5

P A

PWM

PA

PA

P A

RF

DC-DC

2 2mm

D C - D C

W C D M A

EDGE GPRS

,

PA

RFMD

15. LC DC-DC

www.rfmd.com

8 RF3166

RF3166 RF3166

3.2dB 1.15dB 9 3:1

2.6A 2.05A

5 0

5 0

10 PA

2 d B V S W R

23dBm Pout 313mA

6:1

3 6 5 m A

WCDMA PA

1 1

WCDMA 0.5dB

P A

P A

12 PA

3 2 5 m A

40mA

5 0

PA

P A

P A

P A

PA

PA

10. PA 2dB PA

VSWR

12. PA 2dB PA

VSWR

11. WCDMA

TF_2.p65 2007-2-15, 15:0546-47

NEW PRODUCTS


NEW PRODUCTS


ICI R

I R S 2 1 6 8 D I C

HVIC

IC PFC

1 6

SO

PFC

PFC

IRS2168D PFC

PF 0.995

THD 10%

2.5% DC

P F C

D C

IC

1.6

VCO

15.6V

VCC

www.irf.com.cn

3MHz -ON Semicon-

d u c t o r

PWM PFM

P W M -

NCP1523 NCP1523B

NCP1523 NCP1523B 3MHz

1 H

9 3 %

NCP1523

P W M /

PFM NCP1523B

P W M

www.onsemi.com.cn

ADCA n a l o g

D e v i c e s

PulSAR® ADC

ADI AD7980 1MSPS

16bit ADC

16 bit ADC 80

A T E

A D 7 9 8 0

E K G

AD7980

ATE

A D C

www.analog.com/zh

NP.p65 2007-2-15, 16:2248-49

NEW PRODUCTS


NEW PRODUCTS


austriami-

crosystems AS1907-09

I C

1.8V 3.3V

AS1907-09

0.9%

+1.6V +2.5V

100mV

1ms 20ms 100ms

AS1907

2.3A SMDDiotec SMD

B40S2A B380S2A 2006

SO-DIL

2.3A

SMD

2A 0.95V

8.3ms

7 2 A

A S 1 9 0 8

AS1909

AS1907- 09

0.7 3.6V

0.7V AS1907/08 1.0V

AS1909

F a i r c h i l d

Semiconductor

FXL2TD245

MicroPakTM

FXL2TD245

0.55mm 1.6mm 2.1mm

S O I C

80%

1

P D A

1.1-3.6V

FXL2TD245

10 MicroPak 35%

V c c

GND FXL2TD245

3

www.fairchildsemi.com/cn

www.austriamicrosystems.com/index_chin.htm

S M D

2007

www.diotec.com

NP.p65 2007-2-15, 16:2350-51

NEW PRODUCTS


NEW PRODUCTS


NP.p65 2007-2-15, 16:2352-53

NEW PRODUCTS


NEW PRODUCTS


S i C o n n e c t

PLT050

1 6

Q o S

EMC

www.siconnect.com

400mA

AnalogicTech

400mA

AAT1149

0 6 0 3

1mm

AAT1149 2.7V 5.5V

400mA

1.0V VIN

98%

AAT1149

45 A 3MHz

AAT1149

7 0 s

www.analogictech.com

5

PLT050 ADSL

1 4 M b p s

8 5 M b p s

SiConnect

SDTV

V o I P

P L T 0 5 0

SiConnect POEMTM

NP.p65 2007-2-15, 16:2354-55

NEW PRODUCTS


NEW PRODUCTS


Analog Devices .......................................................................... 48AnalogicTech ............................................................................. 55APEC .......................................................................................... 56austriami-crosystems ................................................................ 51Cirrus Logic .................................................................................. 8CPSA ............................................................................................ 6CPS Expo .................................................................................. 52Cree ............................................................................................ 9CT-Concept .............................................................................. 49Diotec ......................................................................................... 51Dynex Semiconductor ........................................................... 24electronica China ................................................................... 53Enpirion ....................................................................................... 13Fairchild ................................................................................... C2Farchild ................................................................................ 40, 51Infineon Technologies .......................................................... 11Infineon Technologies ........................................................... 8, 15International Rectifier .......................................................... C4International Rectifier ................................................................. 48iSuppli ......................................................................................... 14LEM SA....................................................................................... 37

*

.........................................................................

.........................................................................

Linear Technology ................................................................... 7Linear Technology ..................................................................... 17Methode ................................................................................... 50Micrel ....................................................................................... C3Microchip Technology ................................................................ 21Microsemi ............................................................................... 55National Semiconductor ...................................................... 12, 16NXP ............................................................................................... 6ON Semiconductor ..................................................................... 48PCIM China .............................................................................. 24PCIM China Conference Program .............................................. 23PicoChip ....................................................................................... 8Power Integrations ................................................................. 2Power Systems Design China ............................................ 54Rayjade ........................................................................................ 6RFMD .......................................................................................... 42Rockwell ...................................................................................... 6SiConnect ................................................................................... 55Stackpole Electronics ................................................................ 10Texas Instruments .................................................................. 5UR Group ................................................................................... 35

NP.p65 2007-2-15, 16:2356-57

PL1.p65 2006-12-21, 16:3410

选择电池充电器ic时的考虑因素 · industry news 6 power system design china 2007 1/2 nxp...

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