dragonboard™ based on qualcomm® snapdragon™ …

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LM80-P0436-53 Rev A

DragonBoard™ based on Qualcomm® Snapdragon™ processor

Application Note – Creating a Camera Mezzanine and Camera Flex Circuit for DragonBoard

LM80-P0436-53 Rev A

September 2016

https://www.96boards.org/DragonBoard410c/forum

LM80-P0436-53 Rev A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 2

Revision history

Revision Date Description

A September 20, 2016 Initial release


Contents

1 Introduction ........................................................................................................................... 4

1.1 Purpose ..................................................................................................................................................... 4 1.2 Additional information ................................................................................................................................ 4

2 Flex circuit for a camera module ......................................................................................... 5

2.1 High level overview .................................................................................................................................... 7 2.2 96Boards Pinout ........................................................................................................................................ 7 2.3 Schematic .................................................................................................................................................. 8 2.4 Flex Circuit Stackup – Overview ................................................................................................................ 9 2.5 Flex Circuit Stackup – Details .................................................................................................................... 9 2.6 Design Considerations ............................................................................................................................. 10 2.7 Bill of Materials ........................................................................................................................................ 11

3 Mezzanine Board Design .....................................................................................................12

3.1 Block Diagram ......................................................................................................................................... 12 3.1.1 Signal Discussion ................................................................................................................... 13

3.2 Detailed Schematics ................................................................................................................................ 15 3.3 Layout considerations .............................................................................................................................. 15

EXHIBIT 1 .................................................................................................................................17

Figures

Figure 2-1 Camera Module Flex Circuit ......................................................................................................................... 5 Figure 2-2 Sunny Optical module Q5V27B-201 ............................................................................................................. 6 Figure 2-3 Flex Circuit Block Diagram ............................................................................................................................ 7 Figure 2-4 Circuit Pinout ................................................................................................................................................ 8 Figure 2-5 Detailed Circuit Schematic ............................................................................................................................ 8 Figure 2-6 Circuit Stackup .............................................................................................................................................. 9 Figure 2-7 Circuit Stackup - Details .............................................................................................................................. 10 Figure 3-1 ST-Micro Robotics board ............................................................................................................................ 12 Figure 3-2 Block diagram ............................................................................................................................................. 13 Figure 3-3 Detailed Schematics ................................................................................................................................... 15


1 Introduction

1.1 Purpose

This application note provides instructions on how to design a mezzanine board and a camera flex

circuit to permit a 5MP MIPI-CSI camera to be used with the DragonBoard 410c. The camera

module and flex may also be used with other 96Boards products since it is compliant with the

96Boards Camera connector Addendum.

This document also outlines how to design a mezzanine board to convert from the CE High Speed

connector to the Camera connectors.

1.2 Additional information

For additional information, go to https://www.96boards.org/db410c-getting-started/.

Other useful Documents

96Boards CE Specification http://www.96boards.org/ce-specification

96Boards Camera Addendum

https://github.com/96boards/documentation/tree/master/Addenda

96 Boards Mezzanine Specification – Not published at the time of this document’s

publication.

https://www.96boards.org/db410c-getting-started/

http://www.96boards.org/ce-specification

https://github.com/96boards/documentation/tree/master/Addenda


2 Flex circuit for a camera module

This section provides design guidelines for the design of a 5MP camera module flex circuit as shown in

Figure 2-1.

Figure 2-1 Camera Module Flex Circuit

This flex circuit is designed for use with a Sunny Optical module Q5V27B-201. See Figure 2-2.

Please use this information to contact Sunny Optical for module datasheets and procurement:

CoCo Wang 王柯科 Sales Dept.

宁波舜宇光电信息有限公司

Ningbo Sunny Opotech Co.,Ltd

地址：浙江省余姚市舜宇路66～68号

Address：No. 66-68, Shunyu Road, Yuyao, Zhejiang, China.

P.C.：315400

Tel:：0086-574-62553361 (8761)

Mob: 0086-13586612061 (662061)

Fax：0086-574-62530812

www.sunnyoptical.com

Sunny Opotech NA

1798 Technology Dr. San Jose 95110

http://www.sunnyopotech.com/

[email protected]

Phone number: 408-329-9001 and ask for sales

http://www.sunnyoptical.com/

http://www.sunnyopotech.com/

mailto:[email protected]

Application Note – Creating a Camera Mezzanine and Camera Flex Circuit for DragonBoard Flex circuit for a camera module


Figure 2-2 Sunny Optical module Q5V27B-201



2.1 High level overview

The block diagram (see Figure 2-3) shows an overview of the circuitry on the flex circuit. At a

high level the flex circuit simply transmits the necessary signals from the 96Boards ZIF connector

top the camera module. A regulator is placed onboard to provide the specific voltages required

but the specific module selected.

30 Fingers to match

ZIF 0.5mm pitch

30 Pin Socket for

Camera module

MIC5387

IN2.8V

1.8V

1uF 1uF

1uF

5V

MIPI CSI 2 lanes data + CLK (Diff pairs 100 ohm)

I2C

MCLK

PWDN

RESET

1uF

AVDD

AF_VDD

DOVDD

2.8V

With AF and 3 LDO

`

50 Ohm Signals (COPPER 12um)

GND Plane (COPPER 12um)

COVERLAY

COVERLAY

Stiffener (POLYIMIDE)

Exposed Gold fingers

Gold

0.3 mm

12 cm – 15 cm

Stiffener (FR4)

Components area(Connectors and Discretes)

Through Vias

COVERLAY:TAIFLEX FHK0515 (or Equivalent) BASE MATERIAL: ESPANEX MB12-50-12REQ OR TAIFLEX 2FPDE2003MW (or Equivalent)

Figure 2-3 Flex Circuit Block Diagram

2.2 96Boards Pinout

Figure 2-4 shows the mechanical pin-out for the flex circuit. This is a 30-pin connector.



Figure 2-4 Circuit Pinout

2.3 Schematic

The detailed schematic for the flex circuit is shown in Figure 2-5.

1 ID2 MDN13 MDP14 DGND5 MDN06 MDP07 DGND8 STROBE9 PWDN10 RESET11 DOVDD12 NC13 DGND14 AVDD15 AGND16 NC17 SIO_D18 SIO_C19 AF-VDD20 DGND21 XCLK22 DGND23 SPI-D024 SPI-D125 DGND26 MCP27 MCN28 DGND29 VSYNC30 SPI-CLK 31 32 33 34

GND 1CSI0_CN0 2CSI0_CP0 3

GND 4CSI0_DN1 5CSI0_DP1 6

GND 7CSI0_DN0 8CSI0_DP0 9

GND 10CSI0_MCLK 11

VGND 12CSI0_SCL 13

CSI0_SDA 14CSI0_STDBY 15

GND 165.0V 17GND 18

LED_FLASH 19CSI0_RESET 20

1.8V 21DC_IN 22

GND 23GND 24

CSI0_DP2 25CSI0_DN2 26

GND 27CSI0_DP3 28CSI0_DN3 29

GND 30

MIC5387

IN

2.8V

1.8V

1uF 1uF1uF 1uF

2.8VEN2/3

DN

I

0R

0R

0R

0R

0R

0R

0R

DN

I

DN

I

AXT530124

Camera connector30 pins fingers 0.5 mm pitch

2.2k10V1uF

Connector forSunny Optical

Q5V27B-201Camera module

(5MP OV5645 sensor)

Figure 2-5 Detailed Circuit Schematic

The DC_IN signal is not used in this design. If a Camera module with a LED Flash is designed,

DC_IN would be used to power the LED Flash, and GPIO_A to control the flash timing.



Please see Section 3.1.1 for a more detailed description of each of the signals.

2.4 Flex Circuit Stackup – Overview

STIFFENER 0.17 mm(POLYIMIDE)

(FR4)

`

50 Ohm Signals (COPPER 12um)

GND Plane (COPPER 12um)

COVERLAY

COVERLAY

Stiffener (POLYIMIDE)

Exposed Gold fingers

Gold

0.3 mm

12 cm – 15 cm

Stiffener (FR4)

Components area(Connectors and Discretes)

Through Vias

COVERLAY:TAIFLEX FHK0515 (or Equivalent) BASE MATERIAL: ESPANEX MB12-50-12REQ OR TAIFLEX 2FPDE2003MW (or Equivalent)

Figure 2-6 Circuit Stackup

2.5 Flex Circuit Stackup – Details

The two copper layers on the flex circuit form a micro-strip with carefully controlled impedance.

Figure 2-7 shows the details of the micro-strip and the dimensions required to achieve a 50 Ohm

micro-strip. The MIPI-CSI signals must be 100 Ohm differential pairs (50 Ohms for each trace).

Changing any of the materials in the stackup will change the impedance calculations. Please

consult with your flex circuit fabricator for details of the specific process and materials used. It

may be necessary to change the track dimensions to achieve the differential impedance required.



Figure 2-7 Circuit Stackup - Details

2.6 Design Considerations

In most user systems the user will wish to point the camera at the targets of interest. The user may

also wish to mount the camera on a Gimbal to allow software to change the direction that the

camera is pointing ‘on the fly’. Having a rigid camera mounting (i.e., mounting the camera

module directly on the mezzanine board) prevents these use cases. However, the system designer

may choose to directly mount the camera module on the Mezzanine board if the final application

is well known.

The detailed electrical layout should consider the following rules:

Protect CSI signals from noisy signals (clocks, SMPS, etc.). Other comments and guidelines:

■ 750 MHz clock rate; 1.5 GHz data rate

■ Differential pairs, 100 Ω nominal, ±10%

■ Total routing length < 305 mm

■ Intra-pair length matching < 5 ps (0.67 mm) – Note 1

■ Inter-pair length matching < 10 ps (1.3 mm) – Note 2

■ Lane-to-lane trace spacing = 3x line width

■ Spacing to all other signals = 4x line width



Note 1: The Intra-pair length match requirement (the difference in length between the P and

the N signals in a pair) are cumulative for the entire system, there will be length match errors

on the 410c board, on the mezzanine board, on the flex circuit, and in the camera module

flex. Design of the camera flex circuit should provide the minimum possible error (ideally

zero) since the total allowable error must be budgeted across 4 items.

Note 2: The Inter-pair length match requirement (the difference in length between the pairs

of signals to a camera) are cumulative for the entire system, there will be length match errors


flex. Design of the camera flex circuit should provide the minimum possible error (ideally

zero) since the total error must be budgeted across 4 items.

In order to reduce EMI Ground guard trace at edges of the Flex are recommended.

Power trace widths should be wide enough to handle the expected current.

2.7 Bill of Materials

NOTE: The part numbers provided are representative only, equivalent parts from other suppliers are

acceptable, with exception to the Sunny Camera module. The current Software only supports the

Sunny module, however other modules may be supported in the future. Camera flex suppliers are

encouraged to design with other modules, however it will be necessary to modify the SW to work

with alternate camera modules.

Item Part Number Supplier Description Ref Designator

1 Q5V27B-201 Sunny Optical 5MP CAMERA (OV5645) MODULE

2 20-P4444 Panasonic FPC, 5MP CAMERA (OV5645) ADAPTOR FOR 96BOARDS DRAGONBOARD

3 C1005X7S1A105K TDK CAP,CHIP CERAMIC 1UF 10% X7S 10V ROHS C1-C5

4 MIC5387-GMMYMT Micrel Semiconductor IC,VOLTAGE REGULATOR LDO 150MA 1.8-2.8V TRIPLE ROHS U1

5 AXT530124 Panasonic CONN,FPC 0.4MM PITCH STR SOCKET 30-POS ROHS J1

6 ERJ2RKF1001X Panasonic RES 1K 100PPM 1% 0.063W 0402 ROHS R2-R6

7 ERJ2GE0R00X Panasonic RES 0 200PPM 5% 0.063W 0402 ROHS R1,R7


3 Mezzanine Board Design

Figure 3-1 ST-Micro Robotics board

A mezzanine that supports a MIPI-CSI must make connections to both the High Speed connector

(for the high speed MIPI signals), and to the Low Speed connector (for power and some controls).

It is recommended that a camera mezzanine board design be full size (54x85mm).

3.1 Block Diagram

The MIPI-CSI connectors and the tracks to the High Speed connector will use very little of the

PCB Area, hence other circuitry can be placed on the mezzanine board. The selection of

additional circuitry to be placed on the Mezzanine board is up to the system designer.

Application Note – Creating a Camera Mezzanine and Camera Flex Circuit for DragonBoard Mezzanine Board Design


High Speed Connector

Low Speed connector

CAMERA 0

CAMERA 1

MIPI-CSI0 (4-lanes, CLK)

MIPI-CSI1 (2-lanes, CLK)

I2C, MCLK

Controls

Power3.3V

Regulator

Figure 3-2 Block diagram

3.1.1 Signal Discussion

This section discusses some of the signals that are routed on the mezzanine card to the camera

connectors and their special requirements.

GPIO-A is used to activate a LED Flash on the Camera Module, however many camera modules

may not implement this functionality. Camera Mezzanine boards will likely have additional

functionality on the board. GPIO-A is the only GPIO that is guaranteed to have interrupt

capability on all 96Boards implementations (the 410c board has many GPIOs that can generate

interrupts). The mezzanine board implementer may choose to make the connections to GPIO-A

jumper selectable so that the interrupt capability can be used by the other circuitry on the board

and only selected when a camera module with onboard Flash circuitry is connected.

GPIO-I, GPIO-J, GPIO-K, GPIO-L these GPIOs are used to reset the camera and place the

camera in standby when not in use. The CE specification reserves these pins for operation of

camera on mezzanine bioarts that implement camera connectors. Programmers should be aware

that systems without cameras may use these pins for other functions. The mezzanine board

implementer may choose to make the connections to these GPIOs jumper selectable so that they

can be used by the other circuitry on the board and only selected when a camera module with

onboard Flash circuitry is connected. The ‘default’ factory setting should have these GPIOs

connected to the camera connectors.

DC_IN this signal provides power to the camera module, typically this would be used to power a

LED Flash module. In most cases, camera modules that do not provide flash functionality will not

use this power source. The connector specification limits the current on this pin to 200mA.



VGND (3.3V) This pin is a “Virtual Ground” it is required to provide electrical isolation between

the MCLK and the SCL signals. A track must be run the full length of the camera module to

ensure isolation of these two signals. Since the VGND track is used for isolation, a DC voltage on

the track does affect the isolation properties. Hence this track is also used to provide 3.3V to the

camera module. If a 3.3V regulator is available on the mezzanine board, then it is recommended

that this pin be driven with 3.3VDC. If 3.3V is not available, then the pin may be left floating.

Either way a Ceramic capacitor between VGND and GND is REQUIRED, on the camera

mezzanine board. DO NOT connect VGND directly to GND.

GND All of the GND signals on all of the connectors should be connected directly to a Ground

plane if at all possible. If this is not possible, a much of one plane in the area around the High

Speed connector and the Camera connectors should be flooded with ground.

CSI Clock and Data pairs. These signals should all make direct connections between the High

Speed connector and the Camera connectors. The impedance of the signals must be controlled as

a 100 Ohm differential pair (50 Ohms impedance to the ground plane). It is recommended that a

signal integrity simulation be done on these signals to ensure performance since it is extremely

difficult to measure and confirm performance on a physical board. In addition to impedance

control, the signals within a pair (inter-pair) must be length matched to within 0.67mm, and the

pairs in a camera group (intra-pair) must be matched to within 1.3mm. The maximum inter-pair

and intra-pair errors are cumulative across the system. Ideally there should be zero error on the

mezzanine board. Finally the pairs must be separated from each other by 3x the signal spacing to

reduce cross talk.

1.8V and 5V these signals are used to provide power to the camera module. The tracks between

the Low Speed connector and the Camera connectors should be designed to carry at least 50mA

on the 1.8V supply to each camera, and 200mA on the 5V supply to each camera.



3.2 Detailed Schematics

1 GND2 CSI0_CN03 CSI0_CP04 GND5 CSI0_DN16 CSI0_DP17 GND8 CSI0_DN09 CSI0_DP010 GND11 CSI0_MCLK12 VGND13 CSI0_SCL14 CSI0_SDA15 CSI0_STANDBY16 GND17 5.0V18 GND19 LED_FLASH20 CSI0_RESET21 1.8V22 DC_IN23 GND (DC_IN Return)24 GND25 CSI0_DP226 CSI0_DN227 GND28 CSI0_DP329 CSI0_DN330 GND

CAM0 (4-lane)

1 GND2 CSI1_CN03 CSI1_CP04 GND5 CSI1_DN16 CSI1_DP17 GND8 CSI1_DN09 CSI1_DP010 GND11 CSI1_MCLK12 VGND13 CSI1_SCL14 CSI1_SDA15 CSI1_STANDBY16 GND17 5.0V18 GND19 LED_FLASH20 CSI1_RESET21 1.8V22 DC_IN23 GND (DC_IN Return)24 GND25 NC26 NC27 GND28 NC29 NC30 GND

CAM1 (2-lane)

CSI0_C+ 2CSI0_C- 4

GND 6CSI0_D0+ 8CSI0_D0- 10

GND 12CSI0_D1+ 14CSI0_D1- 16

GND 18CSI0_D2+ 20CSI0_D2- 22

GND 24CSI0_D3+ 26CSI0_D3- 28

GND 30I2C2_SCL 32

I2C2_SDA 34I2C3_SCL 36

I2C3_SDA 38GND 40

CSI1_D0+ 42CSI1_D0- 44

GND 46CSI1_D1+ 48CSI1_D1- 50

GND 52CSI1_C+ 54CSI1_C- 56

GND 58RESERVED 60

High Speed (60-pin)

1 SD_DAT0/SPI1_DOUT3 SD_DAT15 SD_DAT27 SD_DAT3/SPI1_CS9 SD_SCLK/SPI1_SCLK11 SD_CMD/SPI1_DIN13 GND15 CLK0/CSI0_MCLK17 CLK1/CSI1_MCLK19 GND21 DSI_CLK+23 DSI_CLK-25 GND27 DSI_D0+29 DSI_D0-31 GND33 DSI_D1+35 DSI_D1-37 GND39 DSI_D2+41 DSI_D2-43 GND45 DSI_D3+47 DSI_D3-49 GND51 USB_D+53 USB_D-55 GND57 HSIC_STR59 HSIC_DATA

GND 2PWR_BTN_N 4

RST_BTN_N 6SPI_SCLK 8SPI0_DIN 10

SPI0_CS 12SPI0_DOUT 14

PCM_FS 16PCM_CLK 18PCM_DO 20PCM_DI 22GPIO-B 24GPIO-D 26GPIO-F 28GPIO-H 30GPIO-J 32GPIO-L 34

SYS_DCIN 36SYS_DCIN 38

GND 40

Low Speed (40-pin)

1 GND3 UART0_CTS5 UART0_TxD7 UART0_RxD9 UART0_RTS11 UART1_TxD13 UART1_RxD15 I2C0_SCL17 I2C0_SDA19 I2C1_SCL21 I2C1_SDA23 GPIO-A25 GPIO-C27 GPIO-E29 GPIO-G31 GPIO-I33 GPIO-K35 +1V837 +5V39 GND

MCLK0

MCLK1

CAM_SCLCAM_SDASTANDBY0

5.0V

5.0V

FLASH

RESET0

CAM_SCL

CAM_SDA

STANDBY1

FLASH

RESET11.8V

1.8V

FLASH

RESET0

RESET11.8V

5.0V

STANDBY1

STANDBY0

CAM_SCL

CAM_SDA

MCLK1MCLK0

DC_IN

DC_IN

1uF

DC_IN

3.3V Reg(optional)

5.0V 3.3V

3.3V

3.3V

1uF 1uF1uF

1uF1uF1uF

1uF

1uF1uF

Figure 3-3 Detailed Schematics

3.3 Layout considerations

Connect all Grounds connected to a ground plane. Since impedance control is required, a 4-layer

PCB is the minimum layer count expected for a mezzanine board that will be used for a Camera



mezzanine board. It may be possible to achieve these required impedances on a two-layer PCB,

however it is up to the board designer to simulate and verify the design.

Signal Integrity simulations are strongly recommended before building any PCB. Most major

PCB CAD tools have signal integrity simulation capabilities.

Signal Length matching is required, again, most major PCB CAD tools have this capability.

Protect CSI signals from noisy signals (clocks, SMPS, etc.). Other comments and guidelines:

■ 750 MHz clock rate; 1.5 GHz data rate

■ Differential pairs, 100 Ω nominal, ±10%

■ Total routing length < 305 mm

■ Intra-pair length matching < 5 ps (0.67 mm) – Note 1

■ Inter-pair length matching < 10 ps (1.3 mm) – Note 2

■ Lane-to-lane trace spacing = 3x line width

■ Spacing to all other signals = 4x line width

Note 1: The Intra-pair length match requirement (the difference in length between the P and

the N signals in a pair) are cumulative for the entire system, there will be length match errors


flex. Design of the camera mezzanine circuit should provide the minimum possible error

(ideally zero) since the total error must be budgeted across 4 items.

Note 2: The Inter-pair length match requirement (the difference in length between the pairs

of signals to a camera) are cumulative for the entire system, there will be length match errors


flex. Design of the camera mezzanine circuity should provide the minimum possible error

(ideally zero) since the total error must be budgeted across 4 items. The lengths for the (5)

signal pairs to camera 0 and the (3) signal pairs to camera 1 do not need to be the same.

The 96Boards Addendum compliant connectors are available from multiple manufacturers in

both horizontal and vertical orientations. Pin 1 should be clearly marked on both the camera

module and the mezzanine board to aid the user in correctly assembling the two components. The

locations of the camera connector(s) are up to the systems designer, however it is recommended

that the connectors be placed close to the High Speed connector to minimize the overall signal

length.


EXHIBIT 1

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2. COMPLIANCE WITH LAWS; APPLICABLE LAW. You agree to comply with all applicable local, international and national laws and regulations and with U.S. Export Administration Regulations, as they apply to the subject matter of this Agreement. This Agreement is governed by the laws of the State of California, excluding California’s choice of law rules.

3. CONTRACTING PARTIES. If the Materials are downloaded on any computer owned by a corporation or other legal entity, then this Agreement is formed by and between QTI and such entity. The individual accepting the terms of this Agreement represents and warrants to QTI that they have the authority to bind such entity to the terms and conditions of this Agreement.

4. MISCELLANEOUS PROVISIONS. This Agreement, together with all exhibits attached hereto, which are incorporated herein by this reference, constitutes the entire agreement between QTI and You and supersedes all prior negotiations, representations and agreements between the parties with respect to the subject matter hereof. No addition or modification of this Agreement shall be effective unless made in writing and signed by the respective representatives of QTI and You. The restrictions, limitations, exclusions and conditions set forth in this Agreement shall apply even if QTI or any of its affiliates becomes aware of or fails to act in a manner to address any violation or failure to comply therewith. You hereby acknowledge and agree that the restrictions, limitations, conditions and exclusions imposed in this Agreement on the rights granted in this Agreement are not a derogation of the benefits of such rights. You further acknowledges that, in the absence of such restrictions, limitations, conditions and exclusions, QTI would not have entered into this Agreement with You. Each party shall be responsible for and shall bear its own expenses in connection with this Agreement. If any of the provisions of this Agreement are determined to be invalid, illegal, or otherwise unenforceable, the remaining provisions shall remain in full force and effect. This Agreement is entered into solely in the English language, and if for any reason any other language version is prepared by any party, it shall be solely for convenience and the English version shall govern and control all aspects. If You are located in the province of Quebec, Canada, the following applies: The Parties hereby confirm they have requested this Agreement and all related documents be prepared in English.