Download - Thermal Management In Electronic Components – Can Polymers Replace Metals Or Ceramics Jun08
Thermal Management in Electronic Components –Can Polymers Replace Metals or Ceramics?
Aravind Chander, Senior Research Analyst,
Technical Insights, Chennai,
June 3, 2008
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Focus Points
• Introduction to Thermally Conductive Polymers (TCPs)
• Technology Challenges and Drivers
• Current Trends and Future Trends
• Material Technologies Analysis
• Technological Innovations in this Arena
• Key Industry Participants
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Introduction
• Electronic devices are getting smaller and thinner
• Conventional plastic components overheat often and develop
localized "hot spots"
• Development of TCP’s has paved way to significant breakthrough
for thermal management applications as they carry the same heat transfer capacity as metals or ceramics
• TCP’s have good chemical resistance and give up heat faster
during molding than conventional plastics
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ManufacturingCost
Thermal Fatigue and
Heat Dissipation
Elevated Temperature
Challenges – Thermally Conductive Polymers
Note: Size of the ball is not related toimportance or weight of the factor
Due to the polymer properties such as High CTE and Low
Thermal Conductivities.
The increase in activities of the components has led to demand for more powerin order to maintain the existing performance.
Lack of NewPolymer
Compounds
Concern for Passive
Component Manufacturers
high-temperature conditions
for a long period of time
can damage or change
their organic properties.
There is a demand for newer compoundsthat could compete with the existing
thermoplastic compositions.
Demand for More Power
High initial cost is the biggest obstacle to wider acceptance of
thermally conductive compounds.
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Continuedfocus onWeight
Reduction
Drivers – Thermal Conductive Polymers
Easy material
process ability Polymers, particularly bio-based polymeric compounds are gaining importance which
can be effectively recycled with no harmful effect on the environment.
Polymers can be more easily custom manufactured to a wider rangeof sizes and shapes when compared to conventional materials.
This enables them to be deployed for a broader range of applications.
Note: Size of the ball is not related toimportance or weight of the factor
Compounds can be used as encapsulates in
electronic component packaging making it suitable for smaller and thinner without
compromising onmechanical properties.
Excellent Mechanical
Properties
Weight reduction by means of using plastics for manufacturing safer, lighter and high performance devices.
Miniaturization
of electroniccomponents
Recyclability
Thermally Conductive Polymers possess higher flexural strength, tensile
stiffness, and low-impact strengths.
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Current Trends
Laser Diode Encapsulation is in
the developmental phase
High viscosities make molding
over a large surface area
difficult
Carbon nanofibers and boron
nitride filler is gaining more
attraction
Custom-molded heat
sinks on circuit boards
Thermally conductive adhesives
for lighting application
Current
Trends
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Future Trends
Elastomers is expected to get
more treatment
Tailorable CTEs with low
manufacturing cost
PCB itself can act as heat sink
New compounds from
natural resources high
temperature stability
Composites will target flip chips
and solder joint applications
Future
Trends
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Parameters for Technology Performance
Temperature range
Mechanical Strength
Processing ease and
Workability
Chemical resistance
CTE
Technology
Performance
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Parameters for Application Potential
Cost
Miniaturization of
components
Design
Thermal Stability
Light Weighted ness
Application
Potential
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Technology Performance Vs Application Potential (Present Scenario)
Electronics Sector- Present Scenario
Silicone
Carbon Nanofibres
Epoxies
AcrylicsUrethanes
0
5
10
0 5 10Technology Performance
Ap
plicati
on
Po
ten
tial
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Technology Performance Vs Application Potential(7- 10 years from Now)
Electronics Sector-10 years from now
Silicones
Carbon Nanofibres
Epoxies Acrylics
Urethanes
0
5
10
0 5 10
Technology Performance
Ap
pli
cati
on
Po
ten
tial
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Noteworthy Innovations
� Development of a polycarbonate compound (Nemcon- H) by Ovation Polymers Inc.
� National Starch and Chemical Company, NJ, USA have demonstrated fusible particles can enhance thermal conductivity.
� A broad range of Vectra liquid crystal polymer (LCP) grades using several polymer systems with various fillers and reinforcements was developed by Ticona Technical Polymers, KY, US
� Development of a new thermally conductive line of compound by Dow Corning Corporation, US.
� Development of a series of boron nitride filler grades under the name PolarTherm by Momentive Performance Materials GmbH.
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Key Industry Participants
Pronat
Industries Ltd.
Cool Polymers Inc
Ovation PolymersFujipoly American CorporationCYTEC IncCast-Coat Inc
TimtronicsDiemat Inc.Ticona Technical Polymers
MomentivePerformance Materials
Kunze Folien GmbHShin-Etsu
Chemical Co. Ltd
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For Additional Information
Steve LeeStrategic Account ManagerChemicals, Materials and Food, Asia Pacific(65) 6890 [email protected]