Download - Second Semester M.tech Degree Examination, November 2012

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S pecialization : VLSI and Em bed d ed

MECVE 201-ANALYSIS AND DESIGN OF A NALOG

(Regular)

Answer all quest ions.

1. (a) What is meant by Body ef fect? What is its effect on the tr



6. (a) With the help of diagram explain the function of current m

Cascode current mirrors.

(b) Discuss about Dominant pole compensation.

7. (a) List and explain about various noise modelsfor circuit elem

(b) Analyse the Op-Amplowpass filter fromnoise perspective.

Or

8. (a) Write notes on :

(i) Flicker noise.

(ii) Thermal noise.

(b) Derive the expression for noise bandwidth for a first adder



Second Semester Branch : Electronics and Communication

Specialization,: VLSI and Embedded

MECVE 202-ADV ANCED EMBEDDED SYS

(Regular)

Answer all questions.

1. (a) Differentiate between Moore-type and Melay type Finite-S

the elevator's unit control process using state machine



7. (a) Explain how the embedded software can be put into the tar

(b) Discuss about linking and locating software.

Or

8. (a) List and explain the testing steps at host machine.

(b) List and explain the features of simulator.



Second Semes~er Branch : Electronics and Communication

SpecializatiOn : VLSI and Embedded

, MEC'VE 203-VLSI SYSTEM DESI

(Regular)


1. (a) Explain the Full Custom design flowwith necessary diagr



Second Semester

Branch: Electronics and Communication En

Specialization: VLSt and Embedded Sy

MECVE 204-REAL TIME OPERATING

(Regular)


1. (a) List the basic functions of the real time kernal and expla



7. (a) Ljst and explain the full range of communication options pr

(b) Under Micro Cos kemal, what are the different states that a

of time? Explain about each one.' .

Or

8. (a) Explain the following: (i) Memory layout in Vx works; (ii)

(b) Discuss general requirements of a processor a port RT Linu

architectUre.



Second Semester Branch: Electronics and Communication En

Specialization: VLSI and Embedded S

MEC VE 205.2-MEMS AND MICROSYSTEM TECHN

(Regular)


l. (a) ..Enumerate and explain the MEMS features.



2

6. (a) Explain the differe~ces between MEMS and MOEMS.

(b) ExplaIn the applications of optical MEMS.

(c) Explain the principle ofMEMS piezo actuator.

(d) Give an account on 'Bulk Micromachining'.

7. (a) Explain the features of ¥EMS scanners.

(b) Compare and contrast optical switching and Electronic Sw

(c) Explain the applications of MEMS in air bag system.

(d) Write a technical note on 'MEMS pills' ..

Or

8 . (a) Explain the application of MEMS in printers.

(b) E l i h i i l f i l i di l



Branch: Electronics and Communication En

Specialization: VLSI and Embedded Sy

MEC VE 206.2-TESTING OF VLSI CIRCUIT

(Regular)


1. (a) Consider a single board system with 25 ASICSwhich hav

and tested with a fault coverage of 0 95 while the board



3. (a) (i) Compare and explain the serial and par allel fault simu

(ii) Compute combinational and sequential measures of the r

D-flip flop. (b) Howthe cycliccircuits are tested? Explain'.

Or

4. (a) (i) Find out the test vectors for the followingfaults using P

f

SAO



8. (a) Consider the path a - e - g in the circuit. Derive a test for

cir cuit explain the path delay fault.

(b) What in IDDQ testing? How the leakage faults are detect

Download - Second Semester M.tech Degree Examination, November 2012

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