Download - Reduce SMT Changeover Time
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Project : Reduce SMT Changeover Time
Presented by : Damian Murphy Denis
Bose Lean Enterprise
• Reduce SMT changeover time by 40% from 30 minutes to 18 minutes for ALL HED conversions.
Challenge
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PlanStep 1: Define and Breakdown ProblemStep 2: Grasp Current ConditionStep 3: Set a Target ConditionStep 4: Conduct Root Cause and Gap
AnalysisStep 5: Identify Potential Countermeasures
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PROBLEM STATEMENT • Current SMT changeover time is
30 minutes vs. goal of 18 minutes (40% reduction).
IMPACT STATEMENT• Without reducing changeover time we
will waste 3.5 days / month or 42 days / year as non productive workdays!
• This accumulated conversion time is impacting our efficiency especially so when we start to move towards medium or high mix with double shifts.
Step 1: Define & Break Down Problem
Team Lead: Damian M Denis
Champion: Mr. Ahmad Zamsari Zakaria
Team Members:Roszamzura AbRashidLeow Yen ThingNiven Lam
TEAM
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Step 2: Grasp Current Condition
- The highest set-up time spent per day is at 240 minutes (16.67%) of total production time (1440 minutes).
- Average set-up time is at 175 minutes per day (almost 3 hrs / day).
- The above trend is showing the frequency time is increasing!
Min
Date 6-Jan 7-Jan 8-Jan 9-Jan 13-Jan
14-Jan
15-Jan
20-Jan
21-Jan
22-Jan
23-Jan
27-Jan
28-Jan
29-Jan
0
50
100
150
200
250
300
Change Over (Min)
Trend Line
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Step 2: Grasp Current Condition
Question:- What is the highest contributor of SMT
set-up time?
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- Top 2 contributor is Siplace setup (10 mins) & Dek setup (8 mins).
- Much of these activities are very much focused at in-line activities thus making the set-up time to be at 30 mins.
Step 2: Grasp Current Condition Online Changeover Sequencing Results
No. Process Time (mins) Sequencing
1 Load PCB on conveyor 2 Check PCB p/n before
loading into conveyor
2 2D Barcode setup 2 Set 2D barcode based
on latest BOM. Test run for 1st board
3 Dek setup 8 Remove old stencil and send to cleaning area.
Start cleaning process for old stencil Setup support block. Load new
program
Load new stencil and apply solder
paste
Perform knead paste for 2 boards.
If good ready to run.
4 Koh Young setup 2 Load new program Test run for 1st board If good ready to run.
5 Siplace setup 10 Remove previous material & send to
Supermarket
Push out new material from Supermarket to
SMT
Load new material into Siplace machine
Load new program Scan material Scan table Scan Siplace
machine
Manual confirm PUP, Pitch and attach MSD
label
Test run 2 boards
Handload component (if have) Tech. verify If good, ready
to run
6 Reflow setup 2 Scan new programTemp. setting and rail
width are adjusted automaticaly
7 AOI setup 2 Load new program 1st board verification If good ready to start mass-pro (for BSS)
8 ICT setup 2 Load new program 2nd board verification If good ready to start mass-pro (for TSS)
30 mins
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TARGET CONDITION• All SMT HED model changeover
will have a new flow to meet the 18 minutes SMT changeover time.
GOAL• Reduce EACH conversion time
to 18 minutes by 27 Feb 2014.
Step 3: Set a Target ConditionOBSTACLES
- That this changeover requires all parties to play exact/specific role to achieve the stated 18 minutes.
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Step 4: Conduct Root Cause & Gap Analysis
WHY SMT Changeover
takes 30 minutes for each setup?
Debugging 1st PCBA AOI
verification
Shortage of materials from
Supermarket/WH
Debugging 2nd PCBA AOI
verification
Materials comes with quality
issues
Confirming PUP, Pitch etc are done in-line
Cleaning process for old
stencil done inline
Scanning of materials are done in-line
No F1 mindset in doing set-up
change
Movement between incoming & outgoing
gantry tables
Push out new material from
Supermarket to SMT
Measurement Materials
Manpower Machine
MethodProblem Statement
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Step 4: Conduct Root Cause & Gap Analysis
The fishbone diagram shows 2 pertinent issues:-
1) Those in red are direct causes.
2) Those in yellow are indirect causes of 30 mins SMT set-up time.
a) First, we will focus on direct causes to reduce the gap to achieve 18 mins.
b) But it is also equally important to have a change in mindset in achieving this whilst employing process changes as well.
c) The F1 mindset will complement very well with the prescribed process changes to achieve 18 mins.
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Step 5: Identify Potential Countermeasures
1) Training on F1 set-up concept.
2) Scanning of material is done off-line at Supermarket.
3) All PUP, Pitch and MSD label preparation is done off-line at Supermarket too.
4) All complete gantry table are to be brought from Supermarket into SMT line ahead 30 mins before conversion.
5) Cleaning of stencil is ONLY done once SMT begins its proper run.
Timeline
Key Milestone Date
1) F1 concept training
6th Feb onwards
2) Offline scanning
10th Feb
3) PUP, Pitch & MSD off-line
12th Feb
4) Gantry table readiness
14th Feb
5) Stencil cleaning offline
6th Feb
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Step 5: Identify Potential Countermeasures
Timeline
Key Milestone Date
1st PCBA AOI & ICT speed up
6th Feb
1st PCBA AOI & ICT speed up
6th Feb
Hilite WH & Planner for shortages
5th Feb
Hilite SQE & Planner for quality issues
5th Feb
6) 1st PCBA AOI & ICT verification is speed up.
7) 1st PCBA AOI & ICT verification is taken out.
8) To hilite to WH & Planner if there is any material shortages.
9) To hilite to SQE & Planner if there is any material quality issue incl. packaging issue.
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DoStep 6: Develop & Test CountermeasuresStep 7: Refine & Finalize
CountermeasuresStep 8: Implement Countermeasures
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After brainstorming the team agrees on a set of solutions based on their knowledge & experience.
In addition, we use the prioritization matrix to help us to zero in on some of the important decision criteria and we found it correlates with the team decision as well.
The below shows the solution the team have opted to implement as subject matter expertise:-i. F1 mind-set trainingii. Offline material scanningiii. Gantry table replacement readinessiv. PUP, Pitch & MSD readinessv. Offline stencil cleaning
Brainstorming & Subject Matter Expertise
Step 6: Develop & Test Countermeasures
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Analysis of the above matrix is on the next slide.
Selection Criteria Business Impact Resource Availability Effort/Impact Ability to leverage Weighted SumList of potential countermeasures: 3 4 5 2F1 Training 5 9 5 9 94Offl ine material scanning 9 9 9 9 252Gantry table placement 1 9 9 9 252PUP, Pitch & MSD readiness 5 9 9 9 248Offl ine stencil cleaning 1 5 9 9 2121st PCBA ICT verification 1 1 1 5 602nd PCBA AOI verification 1 5 1 5 32Materials shortage from WH 1 1 5 1 16Materials with incoming quality issue 5 1 5 5 36
LEGEND Relationship 1 Weak Relationship5 Medium Relationship9 Strong Relationship
Countermeasure Selection thru Prioritization Matrix
Step 6: Develop & Test Countermeasures
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Step 6: Develop & Test Countermeasures
Countermeasure Selection
The above matrix clearly shows which countermeasures should be prioritized to get the best/optimum result with the given resources we have at SMT.
The one with the most impactful countermeasures are hilited in red.
So, which countermeasures are selected?
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Step 7: Refine & Finalize Countermeasures
The Finalized Countermeasures
Actions Status Lesson learnt Show results Doc. Update Define KPI Owner
F1 set-up concept training
Done
To be included in all SMT DL orientation training
Training records
Yes NA OperationsOffl ine PUP, Pitch & MSD label Done Step 1 No NA Training/Ops.Offl ine material scanning Done Step 2 No NA Training/Ops.Placing gantry table ahead (no waiting time) Done Step 3 No NA Training/Ops.
Offl ine stencil cleaning
Done
To be done once the line complete verification and start to rum as normal
Reduce Dek setup from 8 to 3
minsNo NA Training/Ops.
Reduce Siplace setup from 10 to
3 mins
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Step 8: Implement Countermeasures
Progress checks – Below is the timeline to wrap up all countermeasures by end of Feb 2014.
Bose Malaysia - 18mins. SMT Changeover ReadinessDepartment : SMT Operations
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
F1 Concept Mindset Training
Offline Material Scanning
Gantry Table Placement
18 mins Changeover Fully Implemented
CountermeasuresFeb'14
PUP, Pitch & MSD Readiness
Offline Stencil Clening
Training for all DL & GL
To be done by Supermarket team
To be done by Supermarket team
To be done by Supermarket team
To be done once prod. starts running
All systems
go!
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CheckStep 9: Measure Process Performance
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No. Process Time (mins) Sequencing1 Load PCB on
conveyor 2 Check PCB p/n before loading into conveyor
2 2D Barcode setup 2 Set 2D barcode based on latest BOM.
Test run for 1st board
3 Dek setup 3 Remove old stencil and send to cleaning area.
Setup support block. Load new program
Load new stencil and apply solder
pastePerform knead
paste for 2 boards. If good ready
to run.
4 Koh Young setup 2 Load new program Test run for 1st board If good ready to run.
5 Siplace setup 3 Remove previous material & send to
Supermarket
Load new material into
Siplace machineLoad new program Scan table Scan Siplace
machineTest run 2
boardsHandload
component (if have)
Tech. verify
If good, ready to run
6 Reflow setup 2 Scan new programTemp. setting and
rail width are adjusted
automatically
7 AOI setup 2 Load new program 1st board verification
If good ready to start mass-pro (for BSS)
8 ICT setup 2 Load new program 2nd board verification
If good ready to start mass-pro (for TSS)
18 mins.
New Online Changeover Sequencing Results
Step 9: Measure Process Performance
Financial Benefits : - Decreasing the time per set-up will increase the number of set-ups conducted in a given time
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Step 9: Measure Process Performance
New Online Changeover Sequencing Results
All changeover has been reduce to 18 mins (0.3 hrs) beginning 3 Mar 2014 at all SMT line schedule.
Financial Benefits : - Increasing the number of set-ups will result in more production opportunity though SMT.
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Step 9: Measure Process Performance
Financial Benefits : - Decreasing the time per set-up will result in the ability to run smaller batch/kit sizes through SMT
Monitoring:-1) All SMT production schedule from 27 Feb 2014 onwards
has reflected the new changeover time at 18 mins.2) Monitoring was done from 27 Feb – 6 Mar 2014 and the
result during WW10 is as per the new changeover time.
Reflection:-3) All process change must be coupled with paradigm shift
to maximize the benefits of any projects.
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ActStep 10: Refine, Standardize and Stabilize
the processStep 11: Monitor Process PerformanceStep 12: Evaluate Results, Share Learning
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Steps 10 – 12: Standardize / Monitor Performance / Share Learning
Standards
- All SMT production schedule for HED will reflect the new changeover time (0.3 hrs.) from 3 March 2014.
- To implement this improvement on other new SMT lines that are to be set-up in BSM.
Yokoten Opportunities
Next Steps- To reduce SMT changeover time for ASD/Automotive
models.
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QUESTIONS?
COMMENTS?