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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.
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23 April 2012, Gunavathi/ Douglas Garrett
Oak Hill Probe to KLM Probe Transfer2M27V CorrelationCAB# 11302371D
0. Introduction – Reason for Probe Site Qualification
� NPI Site to Mass Production Site - Expected(normal) product transfer from NPI (Fab) Probe Site toMass Production Site. This transfer minimizeslogistical complexities and offers flexibility and synergybetween Probe and Final Test.
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1. Objective and Considerations
1.1 Objective
� Objective is to qualify KLM Probe facility as joint probe site for probing
2M27V. Complete list of affected parts is outlined in PCN QSD.
� Scheduled to complete by 30th April 2012 (not including PCN)
� No impact of customer deliveries
1.2 Considerations
� Test Platform Hardware in KLM Probe is identical platform used in OHP
Probe, and verified by tester calibration and dual site Kappa comparative
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Probe, and verified by tester calibration and dual site Kappa comparative
analysis (see slide).
� Identical probe card design used in both sites
� Test Program Revision and test limits are identical in both sites.
� Measurement Systems Analysis (GR&R) performed per 12MRM97179Aproving bin / yield repeatability.
� Visual Inspection including Bond Pads per global specification 12M54564J
2. Correlation Plan2.1 Pre-Correlation items
� Installed and Verified:
� Navigator setup and control map files
� Tester config requirements (hardware/operating system version)
� Probe card documents (PRVX, Schematic, Drawing)
� Prober files (xx e.g. TEL-P8XL probe)
� PROMIS flow (see slide)
� All Bin monitoring systems and limit files
� Zero Defect files (EWM, DPAT, and GDBC Files)
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� Zero Defect files (EWM, DPAT, and GDBC Files)
� Verified installation and lock-down of 2M27V test program
� Probe Card Repair completed incoming inspection on probe card
2. Correlation Plan
2.2 OHP vs. KLM Correlation Plan
Probe Correlation:
� Completed hardware correlation
� 3 wafers(Sort1 and Sort2)
� Confirmed cross-site correlation on all 3 wafers on yield distribution
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3. Correlation Criteria
3.1 Correlation Criteria
(According to Global Probe Transfer Specification 12MQS10020G)
Yield & Bin Correlation
� Fully probe (test) all three wafers in OHP Probe
� Fully probe (test) the same three correlation wafers in KLM Probe
� Bin variation must pass within 6%
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Slide 5
� Yield variation must pass within 3%
Probe Flow4. Probe Flow Comparison (Promis Probe Flow comparison)
Exchanging pre-correlation items (section 2.1)
Sort 1 probe – 25C
Bake – 250C
Sort 2 probe – 25C
Sort 1 – Zero defect map updateOHT
KLM
P
Sort 1 probe – 25C
Bake – 250C
Sort 2 probe – 25C
Sort 1 – Zero defect map update
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Slide 6
Sort 2 probe – 25C
Sort 2 – Zero defect map update
FOI
KLM - Assembly
Probe
Probe
Slide 6
Sort 2 probe – 25C
Sort 2 – Zero defect map update
FOI
KLM - Assembly
Correlation Results (CHD - TJN)5. Bin to Bin Variation – Overall Sort1 Results
ATX
KLM
7 8 9 14 19 55 101 104 109 121 122 127 128 139 141 144 148 156
7 0.02 0.24
8 0.07 0.05
9
14
19 0.17 0.05
55 1.47 0.05 0.07 0.07 0.02
101 0.59 0.02 0.02
104 0.02
109
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Slide 7
*All data in percentage %
121
122 0.05 0.07 0.02 0.02
127
128 0.02
139 0.21 0.02
141
143 0.02
144 0.09
148 0.02
1 7 9 14 19 20 32 50 59 60 61 62 65 69 72 101 104 109 121 122 139 148 156 185 201 222 230 231 235
1 0.02% 0.21% 0.05% 0.17% 0.21% 0.36% 0.02% 0.19% 0.21%
7 0.12%
9
14
19
20
30 0.52% 0.02%
32
50 0.02% 0.92% 0.07% 0.02%
53 0.02% 0.02%
60 0.14% 0.02% 0.05% 0.02% 0.02%
61 0.05% 0.26% 0.02% 0.07% 0.05%
62 0.07% 0.09% 0.02%
65 0.02% 0.17%
69 0.12%
70 0.02%
72
86
ATX
KLM
Overall LOGIC Results Matrix5. Bin to Bin Variation – Overall Sort 2 Results
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86
101
104 0.28% 0.02% 0.02% 0.95%
109 0.36% 0.09%
121
139 0.19% 0.02% 0.09%
148
156
185
201
222
230
231 0.19% 0.02% 0.02%
235
Indicates correlating bin
Slide 8
*All data in percentage %
6. Correlation Summary Kappa Assessment
PASSED
Wafer Wafer # 06 Wafer # 16 Wafer # 17 Overall
Probe Yield (KLM) 95.16% 95.66% 95.16%
Probe Yield (ATX) 95.59% 95.02% 95.23%
Bin Correlation Error Mean (<6%) 1.56% 2.77% 2.84% 2.39%
Yield Correlation Error Mean (<3%) 1.69% 2.81% 2.59% 2.37%
Sort1
Wafer Wafer #04 Wafer #05 Wafer #18 Overall
Sort2
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� Kappa wafer analysis showed that the yield from both Probe sites are not statistically different in yield. Bin fallout from both sites were also comparable.
PASSED
Wafer Wafer #04 Wafer #05 Wafer #18 Overall
Probe Yield (KLM) 83.78 % 84.07% 85.56%
Probe Yield (ATX) 81.79% 81.79% 84.42%
Bin Correlation Error Mean (<6%) 5.33% 5.76% 5.69% 5.59%
Yield Correlation Error Mean (<3%) 2.77% 2.92% 2.77% 2.82%
7. Probe Mark Inspection
1 24
5
� Criteria: Probe mark must be > than 5 microns from the passivation opening (Glass Line) per specification 12MTX10001G
Min Distance From Edge (microns)
Point 1 23
Point 2 18
Point 3 21
Point 4 21
Point 5 21
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Slide 10
Probe Mark Inspection Points
1 2
3
4 Point 5 21
1M76G Probe ILD DOE 8. Interlayer Dielectric Study Wafers:
KLM 2M27V
Probe Card:
16 dut x16 (Vertical type)
Card: 75M27V1601
Platform:
Teradyne J750 / TEL P8XL
KLM system KLJ750-28
Inputs:
• 3 overdrives
• 70
• 85- Nominal
• 100
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Slide 11
• 100
• 3 levels of probe events (Touch downs, TD)
• 4 TD
• 6 TD
• 8 TD
• ZPTPA at -5
• measured planarity = 25-30µm
• Single touch probe
• Room temp probe (25C)
Outputs:
• ILD integrity / barrier layer damage assessment
ILD Scrub Examples8.1 Interlayer Dielectric Results
70 OD 6TD 70 OD 8TD 85 OD 4TD70 OD 4TD 85 OD 6TD
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85 OD 8TD 100 OD 4TD 100 OD 6TD 100 OD 8TD
ILD Results8.1 Interlayer Dielectric Results
70 OD 4TD 70 OD 6TD 70 OD 8TD
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Note: With visual Inspection No Dimples or Cracks were seen.
85 OD 4TD 85 OD 6TD 85 OD 8TD
ILD Results8.1 Interlayer Dielectric Results
100 OD 4TD 100 OD 6TD
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Note: With visual Inspection No Dimples or Cracks were seen.
100 OD 8TD
2M27V ILD INSPECTION
Probe site : KLM
10-Oct-11
Inspected by Kong Siow Lian
Test
Platform
Probe Stresses ILD Inspection Results
Overdrive Probe Events Die Inspected (%) % Failed (# Wafer)
704 100% dies 0%
8.1 Interlayer Dielectric Results
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Teradyne
J750
704 100% dies 0%
6 100% dies 0%
85
4 100% dies 0%
6 100% dies 0%
8 100% dies 0%
100
4 100% dies 0%
6 100% dies 0%
8 100% dies 0%
9. Conclusion and Recommendation
9.1 Conclusion
� Based on this report, 2M27V passed all Probe correlation requirements according to
FSL rules without any issues.
9.2 Recommendation
� Test program for 2M27V can be released in KLM Probe
� Track probe and final test yields to check for equivalence on lead production lots.
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� Track probe and final test yields to check for equivalence on lead production lots.