Download - MPRS_Final presentation_ Grant Reynolds1
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G R A N T R E Y N O L D S
S U R F S T U D E N T
S E M I C O N D U C T O R A N D D I M E N S I O N A L M E T R O L O G Y D I V
C M O S D E V I C E – R E L I A B I L I T Y G R O U P
M E N T O R ( S ) : J A S O N R Y A N A N D J A A F A R C H B I L I
Massively Parallel Reliability Test System
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Semiconductor Reliability
What is reliability testing within electronics?
Accelerated lifetime testing
Elevated temperatures and increased voltages
Why is reliability so important?
Ensuring it will last
Projecting how long it will last
(at normal conditions)
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Semiconductor Reliability Testing
System reliability (billions of devices)
Inferred from device level (single device)
Performance vs reliability
Satellite vs cell phone
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Traditional Testing
Current method of testing
Probing stations
Drawbacks of probe stations
Four to eight probe pins
Limited testing capacity
Expensive
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Issues in Current Reliability Testing
Can’t test a transistor for 10 years
But too much acceleration produces unreliable statistics
New/Advanced transistors require more samples Gate oxide thickness fabrication variability
Accurate lifetime models require many test conditions
“Reliability testing is the bottleneck
of technological development”
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The Massively Parallel Reliability System
What is the MPRS? Goal: produce accurate lifetime projections of semiconducting devices
Long-term Goal: provide a universal standard reliability platform that can test for all the degradation modes in semiconductor devices
Statistics on lots of devices = Accurate lifetime projection
Why did NIST create this system? Solves probing station problems:
Cost/Time
Lots of statistical data on devices
Up to 3000 devices
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Experimental setup of MPRS
How does it work?
Thirty mini 100 probe pin stations
PCB does device monitoring and stressing
Temperature board for chuck and die
microscope
Loading position
Computerplatform
micromanipulator
temperature control
electronics
Stress and measure
electronics
MetalchuckVacuum
Heating filament
a) b)
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I/O Physical Interface
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Control and Measurement Interface
Measurements and data within MPRS
PCB measures, monitors, and controls critical reliability failure
(aka “the breakdown of the device”)
How the testing works
Device to microcontroller I/O interfaces built depending on type of semiconductor and type of test
Which failure mode we are interested in
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TDDB – time dependant dielectric breakdown
Dielectric breakdown
TDDB - thin oxide SiC
Different PCB
Different I/O interface
TDDB – thick oxide on SiC
SiC MOS capacitors
Thick oxide devices call
for robust I/O interface
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SiC Thick Oxide Boards
Previous board
64 Individual switches => 64 devices
Cross talk
Noise
New Board
Implements high voltage switch
arrays (up to 100V)
2 sets of seven switch arrays
Stressing and measuring
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How Do We Measure and Stress?
2 sets of seven channels
16 devices per channel (16 bit switch array)
112 switches but only 100 devices
Controlling the switches
ADC
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Device under test (DUT)
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LabVIEW program
Call Library Function nodes
Dynamic Link Library
USB Communication
ProcessIO( )
PIC Firmware
Breakdown of Testing Structure
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Hierarchy of LabVIEW
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Getting Things to Work
Logical mapping of what needs to happen
Break map into smallest component and start to test
Build a VI, a DLL routine, and a PIC firmware case
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Getting Things to Work Properly
Finding the smallest possible step forward
Testing the step
Change one thing
Test again
Finding ways to test new code
Probing
Sending information back to labVIEW
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Conclusion/Summary
MPRS drastically increases reliability testing capacity
Provides good statistics from large sample sizes
This is important because….
MPRS design standard
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Acknowledgements
Special thanks to:
Jason Ryan
Jaafar Chbili
Zakariae Chbili
Charles Cheung
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