Download - Microchip Fabrication A Practical Guide to Semiconductor Processing 半導體製程 材料科學與工程研究所 張翼 教授
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Microchip FabricationA Practical Guide to Semiconductor Processing
半導體製程材料科學與工程研究所張翼 教授
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Chapter 1 The Semiconductor Industry
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Figure 1.1 Eniac statistics. (Foundations of Computector Technology, J. G. Giarratano, Howard W. Sams & Co., Indianapolis, Ind., 1983) (First electronic computer,1947)
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Figure 1.2 Vacuum tube
Vacuum tube (better radiation hardening) → Transistor
NCTU is the first University to use transistor in student Lab.
→
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Figure 1.3 The first transistor.
Bell Labs John Bardeen, Walter Brattin,
William Shockley 1956 Nobel Prize (Physicist) Si-Ge, bandgap increase, low
terminal noise
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Figure 1.4 Solid-state discrete devices.
active device: transistors & diodes
passive element: capacitors & resistors
Discrete device account for 12% sale in 1998
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Figure 1.5 Kilby integrated circuit from his notebook (Courtesy of Texas Instruments.)
In 1959, TI developed first IC. (Jack Kilby)
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Figure 1.6 Horni “teardrop” transistor.
Planar Technology
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Figure 1.7 Growth of Dram Density (After Campbell, The Science of Engineering and Microelectronics fabrication, Oxford Press.)
First demo, Bell Labs First production, NEC
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Figure 1.8 IC integration table.
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Figure 1.9 Decreasing image feature size. (After Wolf and Tauber, “Silicon Processing for the VSLI Era.”)
2000, 0.18µm, TSMC 2012, 0.005µm
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Figure 1.10 Effect of processing larger die on larger wafers.
wafer size → 12 inch (1B USD to build)
ULSI chip size> 0.5 inch each side
# whole die in a wafer : 40 → Need to decrease contamination
use class 1 clean room
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Figure 1.11 Relative size of airborne particles and wafer dimensions.
class 1 1 Particle/ft3
Particle size < 0.1µm
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Figure 1.12 Cross section of typical planarized two-level metal VLI structure showing range of via depths after planarization. (Courtesy of Solid State Technology)
Use multilayer interconnect level to increase traffic
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Figure 1.13 Wafer fabrication (and electrical test).
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Figure 1.14 Price of chips per bit of memory.
Moore’s law (1965): Doubling of transistorsin the ICs every couple of years1971 22501982 120,0001993 3,100,0002000 42,000,000
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Figure 1.15 Semiconductor chip uses. (Courtesy In-Stat-1995 SEMI ISS seminary)
original driving force: military demand
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Figure 1.16 Semiconductor and vehicle parts growth (Courtesy Semiconductor Industry Association)
→ semiconductor→ motor vehicle parts
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Figure 1.17 Future DRAM capacity. (Source: Business Week, July, 1994)
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Figure 1.18 Growth of semiconductor industry-capital spending (Courtesy of Semiconductor Industry Association)
→ semiconductors
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Figure 1.18
Wafer Fabrication Vertical Integration IDM:Integrated Device Manufacturer-include IC design and man
ufacture Fab Fabless company Foundry
Captive: produce in house for their own use Merchant supplier: sell to the open market
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Figure 1.19 Stages of semiconductor manufacturing.
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Figure 1.20 Conversion of silicon dioxide to semiconductor grade silicon.
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Figure 1.21 Crystal growth and wafer preparation.
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Figure 1.22 Wafer fabrication (and electrical test)
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Figure 1.23 Packaging stage.
Packaging technology becomes important as CPU speed approaching 1 Gb/Sec
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Figure 1.24 P-N and N-P junctions.
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Figure 1.25 Basics of silicon planar processing.
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Figure 1.26 Double diffused bipolar transistor formed in epitaxial layer.
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Figure 1.27 DRAM growth design rule and number of process steps. (SEMI 1995 ISS Conference)