![Page 1: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/1.jpg)
Micro- & Nano-Technologies Enabling More Compact, Lightweight Thermoelectric Power Generation & Cooling Systems
2011 Thermoelectrics Applications WorkshopSan Diego, CA5 January 2011
Terry J. Hendricks, Shankar Krishnan, Steven Leith
Pacific Northwest National LaboratoryEnergy & Efficiency Division
MicroProducts Breakthrough InstituteCorvallis, OR
We Sincerely Thank Our Sponsor: John Fairbanks, Gurpreet SinghU.S. Department of Energy
EERE - Office of Vehicle Technologies
![Page 2: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/2.jpg)
Advanced Thermoelectric System DesignSingle & Segmented Material TE Legs
2
Qh,out
Qc,in
Power InPower In
Th
N
Tc
Compartment Cooling Flow
Hot-Side Rejection Flow
Tcold
Cold Side Heat Exchanger
Hot Side Heat Exchanger
Tamb , mhAmbient
•
Tcabin , mc•
P
I
Power InPower In
Th
N
Tc
Compartment Cooling Flow
Hot-Side Rejection Flow
Tcold
Cold Side Heat Exchanger
Hot Side Heat Exchanger
Tamb , mhAmbient
•Tamb , mhAmbient
•
Tcabin , mc•Tcabin , mc•
P
I
Thermoelectric Heating/CoolingLow-Temperature Systems
Qh,in
Power Out
Tcold
N1
Thot
Industrial & Vehicle Exhaust Flow
Environment Ambient Flow
Tcold
Qc,out
External Load, Ro
Hot Side Heat Exchanger
Cold Side Heat Exchanger
Tamb , mcAmbient
•
Tex , mhExhaust
•
P2
Thermoelectric Power GenerationHigh-Temperature Systems
P1
N2
Generally Do Cascading Rather Than Segmenting to Achieve Large ∆T
Advantages of SegmentingDepends on Available ∆T
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0 200 400 600 800 1000 12000
0.02
0.04
0.06
0.08
0.1
0.12
Power [W]
Max
imum
Effi
cien
cy
0.237(W/cm2) →
0.403(W/cm2) →
0.589(W/cm2) →
0.808(W/cm2) →
1.06(W/cm2) →
1.34(W/cm2) →
1.66(W/cm2) →
2.02(W/cm2) →
2.41(W/cm2) →
2.83(W/cm2) →
3.28(W/cm2) →
3.77(W/cm2) →
←T h
=490
(K)
←T h
=515
(K)
←T h
=540
(K)
←T h
=565
(K)
←T h
=590
(K)
←T h
=615
(K)
←T h
=640
(K)
←T h
=665
(K)
←T h
=690
(K)
←T h
=715
(K)
←T h
=740
(K)
←T h
=765
(K)
←T h
=790
(K)
←T h
=815
(K)
←T h
=840
(K)
←T h
=865
(K) Tcold=380 (K)
Tcold=415 (K)Tcold=450 (K)Constant Thot
0 200 400 600 800 1000 12000
0.02
0.04
0.06
0.08
0.1
0.12
Power [W]
Max
imum
Effi
cien
cy
98(W/kg) →
165(W/kg) →
243(W/kg) →
335(W/kg) →
441(W/kg) →
561(W/kg) →
696(W/kg) →
846(W/kg) →
1012(W/kg) →
1194(W/kg) →
1392(W/kg) →
1608(W/kg) →
1841(W/kg) →
←T h
=490
(K)
←T h
=515
(K)
←T h
=540
(K)
←T h
=565
(K)
←T h
=590
(K)
←T h
=615
(K)
←T h
=640
(K)
←T h
=665
(K)
←T h
=690
(K)
←T h
=715
(K)
←T h
=740
(K)
←T h
=765
(K)
←T h
=790
(K)
←T h
=815
(K)
←T h
=840
(K)
←T h
=865
(K) Tcold=380 (K)
Tcold=415 (K)Tcold=450 (K)Constant Thot
TE Power GenerationHeat Exchanger / TE Device Integration Requirements
Regions of Higher Specific Power Also Associated with Higher Heat Flux Regions
Hot Side Heat Exchanger Dictates: TE Specific Power TE Power Flux TE Volumetric Specific
Power
Heat Fluxes > 15 W/cm2 inPreferred Design Regimes Hot-side Cold-side
Segmented Skutterudite/Bi2Te3 Materials
hm
Preferred TEDesign Regime
Texh= 873 KTamb = 300 K
= 0.1 kg/sUAh = 377 W/K
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TE CoolingHeat Exchanger / TE Device Integration Requirements
250 300 350 400 450 500 550 6000
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Cooling Capacity [W]
Max
imum
CO
P
←1421(W/kg)
←1294(W/kg)
←1173(W/kg)
←1057(W/kg)
←Th =340(K)
←Th =337(K)
←Th =334(K)
←Th =331(K)
←Th =328(K)
←Th =325(K)
←Th =322(K)
←Th =319(K)
←Th =316(K)
Tcold=280 (K)Tcold=270 (K)Tcold=260 (K)Constant Thot
Distributed Cooling Systems
Typical COP – Cooling Capacity – Power / Mass Relationship Shown Distributed TE Cooling Systems
Create Lower Heat Flows per Unit
Higher COP’s Lower Power / Mass
Generally Right Directions forAutomotive Distributed Cooling
p-type NPB BixSb2-xTe3*
n-type Bi2Te3 – Bi2Se3
* Poudel, B., Hao, Q.H., Ma, Y., Lan, Y., Minnich, A. Yu, B.,Yan, X., Wang, D., Muto, A., Vashaee, D., Chen, X., Liu, J.,Dresselhaus, M.S., Chen, G., Ren, Z., 2008, “High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys,” Sciencexpress, 10.1126, science.1156446.
UAc = 40 W/KTcabin = 298 K
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100 150 200 250 300 350 400 4500
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Qc Per Mass[W/kg]
Max
imum
CO
P
←T h
=340
(K)
←T h
=337
(K)
←T h
=334
(K)
←T h
=331
(K)
←T h
=328
(K)
←T h
=325
(K)
←T h
=322
(K)←
T h=3
19(K
)←T h
=316
(K)
Tcold=280 (K)Tcold=270 (K)Tcold=260 (K)Constant Thot
p-type NPB BixSb2-xTe3
n-type Bi2Te3 – Bi2Se3
UAc = 40 W/K
Tcabin = 298 K
Preferred TEDesign Regime
TE CoolingHeat Exchanger / TE Device Integration Requirements
0.4 0.5 0.6 0.7 0.8 0.9 10
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Qc Per Area [W/cm2]
Max
imum
CO
P
←T h
=340
(K)
←T h
=337
(K)
←T h
=334
(K)
←T h
=331
(K)
←T h
=328
(K)
←T h
=325
(K)
←T h
=322
(K)
←T h
=319
(K)←
T h=3
16(K
)
Tcold=280 (K)Tcold=270 (K)Tcold=260 (K)Constant Thot
Preferred TEDesign Regime
p-type NPB BixSb2-xTe3
n-type Bi2Te3 – Bi2Se3
UAc = 40 W/K
Tcabin = 298 K
Distributed TE Cooling Systems Generally Move Into Regions of: Higher COP’s Higher Specific Cooling Capacity (Compact, Lightweight Systems) Higher Heat Fluxes (Higher Heat Transfer Coefficients)
Generally Higher Performance Heat Exchanger SystemsRequired
![Page 6: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/6.jpg)
PNNL Developing High-Performance Microtechnology Heat Transfer Technologies
TE Power Generation From TQG Exhaust Energy Recovery Hot-Side Heat Exchanger Designs Being Developed & Refined CFD Analyses & Experimental Testing Helping to Refine Designs Design Performance Goals:
High Thermal Transfer Flux (~10-12 W/cm2) in Hot-Side Heat Exchanger Low Pressure Drop (< 1 psi) Heat Flux vs. Pressure Drop Characteristics Quantified for Different Design Approaches
Different Materials Can Be Used: Stainless Steel, Inconel, Haynes Materials, Ceramics
COMSOLCFD Analysis
Air Supply HeatersWater-Cooled Heat Sink
Hydrodynamic Conditioning& Mixing
Design Point
60 kW TQG Design Conditions: 0.158 kg/sec, 780 K
Rectangular Honeycomb Design
Design Target
Several Workable Design Points Identified
ε = 0.93
![Page 7: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/7.jpg)
7
Co-Functional Power / Cooling Systems Co-Functional Integration of 3 Power & Cooling Technologies
Organic Rankine Cycle Based Cooling Thermoelectric Power Generation Micro/Nano Heat Transfer Technologies (Microchannel Heat Exchangers)
System Designed, Fabricated & Tested at PNNL MBI TE Topping Cycle
Step-Down (Lower) Input Temperatures to ORC
Simultaneously Produce Useful Power
E/C ORC to Provide Useful Cooling Capacity Known & Demonstrated Components in this Phase Reduce Cost & Risk & Development Time
Microchannel Heat Exchangers Used toDramatically Reduce Volume & Weight
Funded by U.S. Army RDECOM
High Temperature HEX
Thermoelectric Generator
Expander/CompressorHeat Pump
Electrical Power
Heat Rejectionto SurroundingsHeat in from
Cooling Space
Hot ExhaustStream
ThermalResistance
ThermalResistance
Qin,H
Qout
Waste Heat forTotal Energy
RecoverySpentExhaust
Qtot,outQin
High Temperature HEX
Thermoelectric Generator
Expander/CompressorHeat Pump
Electrical Power
Heat Rejectionto SurroundingsHeat in from
Cooling Space
Hot ExhaustStream
ThermalResistance
ThermalResistance
Qin,H
Qout
Waste Heat forTotal Energy
RecoverySpentExhaust
Qtot,outQin
![Page 8: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/8.jpg)
CFPC – Fabrication & Test First-in-Class, Pioneering System TEG Power System Uses
MicroChannel Heat Exchangers Stainless Steel Air HX On Hot-Side Aluminum R245fa HX on Cold-Side
High-Temperature Bi2Te3 Modules First-Ever 320°C Bi2Te3 Modules
System Size Dimensions: 30” X 30” X 19” Weight: ~100 kgs
System Fabrication Completed System Testing Completed
Exhaust Heat Simulated with Electrical Heater / Blower System
Stable System Operation Many Performance Metrics Satisfied
8
TEG Power System
Co-Functional System Build-up
ORC Boiler
Scroll Expander
![Page 9: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/9.jpg)
MicroTechnology in Distributed TE HVAC Systems DOE Project in Advanced TE HVAC
Systems for Automobiles Zonal Climate Control for Thermal Comfort Compact Microtechnology Heat Exchangers
Reduce Weight & Volume Low Cost Manufacturing
Coupled with Compact TE HVAC Systems Wicking Systems for Water Management
Leveraging Nano-Scale Coating Technology
Significant Microtechnology Cost Modeling Cost Sensitivities Identified Low-Cost Manufacturing Avenues Being Developed Sensitivities to Production Volumes Material and Process Cost Drivers
9
Hybrid / PHEV Vehicles
Nano-Scale Coatings
Cost Modeling Approach
![Page 10: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/10.jpg)
PNNL Nano-Scale Coatings Impact Surface Hydrophobicity and Surface Boiling Heat Transfer ZnO on Al Substrate Rave = 315 nm θ = 20.3° Can Make Super-Hydrophilic
Surfaces θ= 0° Bare Aluminum
Substrate θ=104° Huge Ramifications on Water
Management / Transport
0.005 0.030 0.055 0.080 0.105 0.130 0.155
NaOH Concentration [mol/L]
10
30
50
70
90
Conta
ct
Angle
[d
egre
es]
Set 1Set 2
Heat Flux, kW/m2H
eatT
rans
ferC
oeffi
cien
t,kW
/m2 K
101 102 103
5
10
15
20
2530
Al - Unique Surface (18)Cu - 30 Contact Angle (Fl)Al - 20 Contact Angle (Fl)Bare Al
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PNNL Developing High-Performance Microtechnology Heat Transfer Technologies TE Cooling / Heating
Automotive Distributed HVAC Systems A Number of Microtechnology Designs Are Being Investigated An Example of One Such Design Is Presented Here
Heat Transfer vs. Pressure Drop Characteristics Quantified
![Page 12: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/12.jpg)
0.4
0.5
0.6
0.7
0.8
0.9
1
0.015 0.017 0.019 0.021 0.023 0.025 0.027 0.029 0.031 0.033 0.035
Volume of Metal, Liters
Effe
ctiv
enes
s
135
160
185
210
235
260
285
310
335
Hea
t T
ran
sfer
Rat
e, W
Copper
Aluminum
Effect of Channel Aspect Ratio on Effectiveness
Modeled Channel Aspect Ratio: 2:1 – 8:1
Wall Thickness on Order of 150 - 350 um
4 cm
2 cm
8 cm
4 cm
2 cm
8 cm
![Page 13: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/13.jpg)
7
7.5
8
8.5
9
9.5
10
10.5
11
0.4 0.5 0.6 0.7 0.8 0.9 1
Effectiveness
Hea
t T
ran
sfer
Den
sity
(Q/V
olm
etal
), k
W/L
t.
Copper
Aluminum
Effect of Channel Aspect Ratio on Flux Density
4 cm
2 cm
8 cm
4 cm
2 cm
8 cm
![Page 14: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/14.jpg)
Process-Based Microtechnology Cost Modeling Microtechnology Manufacturing Cost is Key to Automotive Applications Process-Based Cost Modeling
Cost Sensitivities Identified
Low-Cost Manufacturing Avenues Being Developed
Sensitivities to Production Volumes
Material and Process Cost Drivers
System Performance Modeling Integrated with Cost Modeling to Identify Low-Cost, Manufacturable Microtechnology Designs
Cost Modeling Incorporates Critical Process & Cost Elements Prioritizes R&D Investment Plans & Enables Business Decisions Compared 3 Process Approaches for Microtechnology Heat Exchanger
Design Discussed Above Cost Modeling for High-Temperature Exhaust Recovery Applications Cost Modeling for Low-Temperature Advanced Cooling Applications
![Page 15: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/15.jpg)
Process Based Cost ModelingBottom-Up Approach to Estimating Cost of Goods Sold (COGS)
Based on Operation of Virtual Manufacturing Line – Breaks Down Cost by Unit Process
Cost of Goods Sold (COGS)
Variable CostsFixed Costs
Capital EquipmentMaintenance
Facilities/Buildings
Direct LaborDirect Materials
Indirect MaterialsUtilitiesProcess-Based Cost
Model Algorithm
Model Outputs
Start with Process Flow and Associated Equipment Set
Process COGS vs. Volume and ParetoCost SensitivityID Cost Drivers
Not IncludedOverhead & Profit
InsuranceTaxes
Inventory Management AccountingMarketing
Sales
Capital EquipmentLabor
MaterialsEnergy
FacilitiesMaintenance
Cost Elements
Model Inputs
Process Flow
Unit Process 1Unit Process 2Unit Process 3
Etc.
Process to Process ComparisonsDefine Fabrication Toolbox
Inform R&D Agenda
Contact: [email protected]
![Page 16: Micro- & Nano-Technologies Enabling More Compact ... · p-type NPB Bi. x. Sb. 2-Te. 3. n-type Bi. 2. Te. 3 – Bi. 2. Se. 3. UA. c = 40 W/K T. cabin = 298 K Distributed TE Cooling](https://reader035.vdocuments.mx/reader035/viewer/2022071002/5fbf4aefe4ec205db114744f/html5/thumbnails/16.jpg)
$0
$20
$40
$60
$80
$100
$120
$140
$160
1,000 10,000 100,000 1,000,000
Prod
ucti
on C
ost (
USD
/Dev
ice)
Production Volume (Vehicles/yr)
Integrated HTX COGS Estimation and Pareto : Process "A"
Direct Materials
Sheet Cutting
Sheet Clean and Prep
Weld 1
Singulation 1
Weld 2
Singulation 2
8 HTX per Vehicle / Aluminum HTX / 2 cm x 4 cm x 8 cm HTX Dimensions
$155.00
$30.75$20.50 $19.50
Process Relies on Significant Laser Use Not a Good Design + Process MatchExisting, Scalable Fabrication Processes and OTS Production Equipment
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$0
$5
$10
$15
$20
$25
$30
$35
$40
$45
1,000 10,000 100,000 1,000,000
Prod
ucti
on C
ost (
USD
/Dev
ice)
Production Volume (Vehicles/yr)
Integrated HTX COGS Estimation and Pareto : Process "B"
Direct Materials
Sheet Cutting
Sheet Clean and Prep
Braze 1
Singulation 1
Braze 2
Singulation 2
8 HTX per Vehicle / Aluminum HTX / 2 cm x 4 cm x 8 cm HTX Dimensions
$40.00
$7.50$4.50 $4.25
Direct Materials Primary Cost Driver at Production VolumesExisting, Scalable Fabrication Processes and OTS Production Equipment
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$0
$5
$10
$15
$20
$25
$30
$35
$40
$45
$50
1,000 10,000 100,000 1,000,000
Prod
ucti
on C
ost (
USD
/Dev
ice)
Production Volume (Vehicles/yr)
Integrated HTX COGS Estimation and Pareto : Process "C"
Direct Materials
Sheet Cutting
Sheet Clean and Prep
Braze 1
Singulation 1
Braze 2
Singulation 2
8 HTX per Vehicle / Copper HTX / 2 cm x 4 cm x 8 cm HTX Dimensions
$46.50
$13.75$11.00 $10.50
Direct Materials Cost for Copper is 4x that for Aluminum Drives CostImproved Yield and Cycle Times in Copper Braze vs. Aluminum Braze
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Vehicles HTX Units $/Unit Capital Equipment ($k) $/Unit Capital Equipment ($k) $/Unit Capital Equipment ($k)1,000 8,000 $153.90 $1,705 $40.09 $1,400 $46.48 $1,40010,000 80,000 $30.85 $5,455 $7.44 $1,400 $13.87 $1,400
100,000 800,000 $20.54 $43,830 $4.55 $2,550 $10.91 $2,0501,000,000 8,000,000 $19.55 $459,300 $4.19 $17,750 $10.61 $14,750
Process A Process B Process CAluminum Copper
Annual Volume
Summary - Process Comparisons
1.25 mm4 cm
2 cm
8 cm
1.25 mm4 cm
2 cm
8 cm
4 cm
2 cm
8 cm
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Summary Microtechnology Thermal Systems Required to Enable Compact, Light weight
TE Systems TE Power Generation TE Cooling / Heating
Microtechnology Thermal Systems Successfully Integrating into TE Systems Process-Based Cost Modeling is Critical to Developing Low Cost
Manufacturing Pathways, Processes, and Materials Cost Modeling Incorporates Critical Process & Cost Elements Cost Sensitivities Identified Low-Cost Manufacturing Avenues Being Developed Sensitivities to Production Volumes Material and Process Cost Drivers Identified
System Performance Modeling Integrated with Cost Modeling to Identify Low-Cost, Manufacturable Microtechnology Designs
Prioritizes R&D Investment Plans & Enables Business Decisions
20
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Questions & Discussion
We are What We Repeatedly do. Excellence, Then, is not an Act, But a Habit.
Aristotle
Thank you for your time and interest