F R A U N H O F E R I N S T I T U T E F O R P H O T O N I C M I C R O S Y S T E M S I P M S
MEMS Technologies Dresden
Fraunhofer IPMS provides:
200 mm wafer processing in
a 1500m2 (15,000 ft2) clean
room facility
Clean room cleanliness of
ISO14644-1 Class 4
CMOS compatibility
3-shift operations
at 24 hours / 5 days
Integrated Manufacturing
Execution System ensures
quality fabrication
Very few foundries are able to provide
comprehensive services from con-
cept design to marketable products.
Fraunhofer IPMS provides these foundry
services for individual steps in process or
technology modules for micro-electro-
(opto)-mechanical systems (MEMS &
MOEMS) while covering the entire value
chain from technology and product
development to pilot fabrication.
Our services comprise feasibility studies,
simulations of critical parameters and
process flows, single process develop-
ment design and prototyping of low- to
medium-volume production. We con-
duct complete electrical and nonelectri-
cal tests and reliability examinations as
well as microsystem characterization.
In addition to our extensive experience
and know-how with micro-scanning
mirrors and spatial light modulators, we
provide broad expertise in manufactur-
ing standard MEMS such as pressure
sensors, photo diodes, ion-sensitive field
effect transistors and organic field effect
transistors (OFETs) as well as back-end
for IR thermopiles.
MEMS Clean Room
Fraunhofer IPMS develops micro-
electro-mechanical (MEMS) and
micro-opto-electro-mechanical
(MOEMS) systems, products and
technologies. Using our 200mm
state-of-the-art clean room
facility, our services range from
feasibility studies to process
technology development all the
way to complete fabrication pro-
cesses including prototyping and
pre-series manufacturing for the
rapidly growing fields of sensors
and actuators. We are offering
our deep technological exper-
tise in the fields of bulk MEMS
and surface MEMS as well as the
monolithic integration of MEMS-
on-CMOS.
Bulk Micromachining
Bulk micromachining allows us to cre-
ate moveable and electrically isolated
three-dimensional structures into silicon
substrate (the bulk). Using excellent
mechanical and electrical (by doping)
properties of monocrystalline silicon,
Fraunhofer IPMS applies dry deep-silicon
etch processes (Bosch),wet etch pro-
cesses (TMAH) and dedicated deposition
processes to fabricate e.g. MEMS scan-
ners, pressure or infrared sensors.
Surface Micromachining
Using CMOS compatible surface micro-
machining technologies, Fraunhofer
IPMS generates microstructures apply-
ing sequences of deposition and etching
processes of multiple structural layers.
Moveable parts such as micro-mirrors
or oscillating plates are manufactured
by deposition of these materials on
top of inorganic sacrificial layers (e.g.
a-Si, SiO2) and a final release using high
selective dry etch processes.
Manufacturing Technologies
MEMS-on-CMOS Technology
Fraunhofer IPMS is offering the complete manufacturing chain to apply bulk and
surface micromachining on customized CMOS substrates for applications such as
spatial light modulators, capacitive micro-machined ultrasonic transducers (CMUTs)
and other sensor or actuator arrays. Using foundry-fabricated CMOS backplanes,
we are able to shorten development times for these highly integrated devices fo-
cusing on MEMS-CMOS interface, MEMS integration and fabrication.
Services at a GlanceFraunhofer IPMS customers benefit from
both our extensive experience in R&D
and fabrication as well as our expertise
in diverse fields of application. Scanning
mirrors and spatial light modulators are
examples of technologies developed at
Fraunhofer IPMS which have prompted
our successful cooperation with industry
partners and we have manufactured
pressure sensors for the automotive
industry and photo diodes in our clean
room for years. Due to strong and
trusted relationships within our network
of excellent partners in the semiconduc-
tor / MEMS ecosystem, Fraunhofer IPMS
is uniquely positioned to offer clients
products and services well beyond our
intrinsic capabilities. This is particularly
demonstrated in both the distinguished
ADMONT (Advanced Distributed Pilot
Line for More-than-Moore Technologies)
project and the Fraunhofer High Perfor-
mance Center Functional Integration in
Micro- and Nanoelectronics.
Feasibility study and simulation for MEMS products and processes
Process development (200 mm, CMOS compatible)
ASIC design & layout
Complete analog, digital and mixed-signal design and simulation
Integration of actuators and sensors
MEMS-on-CMOS
Tools: CADENCE
MEMS design & layout
Expertise in physical domain simulation
Reduced order models
Tools: ANSYS, COMSOL, MATLAB, SIMULINK, MATHEMATICA, CADENCE
Pilot-fabrication for complete MEMS products
Characterization, test & reliability
Electrical (analog, mixed signal)
Electro-optical
Non electrical (mechanical, optical)
Physical parameter extraction
System design and integration
Foundry services for individual processes or sequences
(also for selected 150 mm process steps)
Added Value
Comprehensive competencies
in surface and bulk micro-
machining
One-stop-shop for your spe-
cific requirements along the
entire value chain
State-of-the-art clean room
facility capable of low- to
mid-volume pilot production
Intensive engineering sup-
port for manufacturing
processes in 24-hour / 5-day
operations
More Information:
Forschungsfabrik
Mikroelektronik
Deutschland
www.forschungsfabrik-
mikroelektronik.de
Research and Development across Several LocationsThe Research Fab Microelectronics
Germany (FMD) will be a unique offer
to the German and European semicon-
ductor and electronics industry. This
cooperation of 13 research institutes
(11 Fraunhofer and 2 Leibniz institutes)
connects all processes and infrastruc-
ture available to serve major areas of
technology that are essential to the
research, development and (pilot)
fabrication of micro- and nanosystems
whether it is for information gathering
and processing, telecommunications, or
power electronics. The FMD is divided
into four key areas (technology parks)
III / V semiconductors, silicon based
technologies, hetero-integration and
design / testing / reliability.
Investments in Fraunhofer IPMS MEMS TechnologiesDue to our focus on CMOS compatible
Bulk and Surface MEMS and MOEMS
technologies and its MEMS-on-CMOS
integration we will strengthen our
portfolio in these areas for future needs.
A major step is the implementation of a
200 / 300mm DUV lithography to shrink
MEMS features size, to connect the
MEMS part with required CMOS nodes
and to pave the way for 300mm MEMS
development. Further investments are
dedicated to processes for manufactur-
ing of high reflective mirrors from DUV
to NIR range, to expand available range
of sensor materials and its characteriza-
tion.
Wafer Processing Capabilities
Service Process Details Core Equipment
Lithography
i-Line i-Line Lithography for 400 nm L / S NSR-2205i 14E2 | Nikon
Spin and Spray Coating SK-80EX| Screen
Contact, Proximity Double-side Mask Aligner MA 200 GEN 3| SUSS
High Topology Spray Coater EV101| EVG
Deposition, Diffusion, Oxidation, CMP
PE-CVD Silicon Oxide as ILD and Sacrificial Layers
a-Si:H as Sacrificial Layers
Silicon Nitride for Passivation / Membranes Centura| Applied Materials
HDP Oxide as ILD and Sacrificial Layers
SiGe as Construction Layer
LP-CVD Poly-silicon for Trench Fill / Sacrificial Layer
Silicon Oxide for Insulator, Membranes E1550 HT 320-4| Centroterm
Silicon Nitride, Low Stress Silicon Nitride (200 MPa)
PVD Sputtering Al, AlSiCu, Ti, TiN for Interconnects Sigma 204| SPTS
Ta, Ta2O5, HfO2 for Chemical Sensors and Barriers
Al, TiAl, Al-Alloys for Mirrors and Hinges CS400S| Von Ardenne
SiO2, Al2O3 for Optical Coatings and Barriers
Evaporation Al, SiO2, Al2O3 PLS 570| Balzers
Atomic Layer Deposition SiO2, Al2O3, HfO2 P-300| Picosun
Oxidation Thermal, SiO2 (horizontal) Inotherm
Thermal, SiO2 (vertical) Alpha 8SE | TEL
Rapid Thermal Annealing Annealing Heatpuls 8800| OEMgroup
Chemical Mechanical Polishing Si, SiO2 DESICA| Applied Materials
Etching / Cleaning
Dry Etch Metal etch (Al / Al alloys) ALLIANCE 9600PTX| LAM
Dielectrics & Polysilicon Etch (SiO2, Si3N4, PolySi, a-Si)
Deep Silicon Etch (Bosch Process) Fine Deep Trenches with High Aspect Ratio up to 25:1
Omega fxP| SPTS
Gas Phase Release Techniques HF-GPE for SiO2 MEMS-CET system| Primaxx
XeF2 for a-