October 2012Revision: EB61_02.0
MachXO2 Pico Development Kit
User’s Guide
2
MachXO2 Pico Development Kit User’s Guide
IntroductionThank you for choosing the Lattice Semiconductor MachXO2™ Pico Development Kit.
This guide describes how to begin using the MachXO2 Pico Development Kit, an easy-to-use platform for rapidly prototyping system control designs using MachXO2 PLDs. Along with the evaluation board and accessories, this kit includes the pre-loaded Pico SoC Demo (Environment Scanning Demonstration Design) that demonstrates board diagnostic functions including ultra-low power, LCD driver, I/O control, current measuring, time stamps and data logging to non-volatile memory using the 8-bit LatticeMico8™ microcontroller.
The contents of this user’s guide include demo operation, top-level functional descriptions of the various portions of the evaluation board, descriptions of the on-board connectors, switches, a complete set of schematics and the bill of materials for the MachXO2 Pico Evaluation Board.
Note: Static electricity can severely shorten the lifespan of electronic components. See the MachXO2 Pico Devel-opment Kit QuickSTART Guide for handling and storage tips.
FeaturesThe MachXO2 Pico Development Kit includes:
• MachXO2 Pico Evaluation Board – The MachXO2 Pico Evaluation Board features the following on-board com-ponents and circuits:
– MachXO2 LCMXO2-1200ZE PLD device in a 132-ball csBGA package. The board is designed for density migration, allowing a lower density MachXO2 device to be assembled on the board.
- Part number LCMXO2-1200ZE-P-EVN is populated with the R1 silicon. Part number LCMXO2-1200ZE-P1-EVN is populated with the Standard silicon. The demos have been targeted for a specific version of silicon and are not interchangeable. For more information on the R1 to Standard migration refer to AN8086, Designing for Migration from MachXO2-1200-R1 to Standard (Non-R1) Devices
- 4 Mbit SPI Flash memory– Current sensor circuits using Delta-Sigma ADC– LCD driven with PWM analog output circuitry– Expansion header for JTAG, SPI, I2C and PLD I/Os– 4 capacitive touch sense buttons– Standard USB cable for device programming– RS-232/USB and JTAG/USB interface– RoHS-compliant packaging and process – USB or 2032 battery powered
• Pre-loaded Reference Designs and Demo – The kit includes a pre-loaded Pico SoC Demo design that inte-grates several Lattice reference designs including: the LatticeMico8 microcontroller, master WISHBONE bus controller, soft delta-sigma ADC, SPI master controller, UART peripheral, Embeded Block RAM and additional control functions.
• USB connector Cable – A mini B USB port provides power, a communication and debug port via a USB-to-RS-232 physical channel and programming interface to the MachXO2 JTAG port.
• Battery – A 2032 coin battery can provides an alternate source of power.
• QuickSTART Guide – Provides information on connecting the MachXO2 Pico Evaluation Board, installing Win-dows hardware drivers, and running the Pico SoC Demo.
Figure 1 shows the top side of the MachXO2 Pico Evaluation Board with comments on the specific features that are designed in the board.
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MachXO2 Pico Development Kit User’s Guide
Figure 1. MachXO2 Pico Evaluation Board, Top Side
USBInterface
Socket
2x16GPIO
Header
LCDScreen
MachXO2-1200ZE
I2C Temperature
SensorCoin BatterySlot
SPI FlashMemory
CapacitiveTouch SenseButtons
Push-button
MachXO2 DeviceThis board features a MachXO2 PLD with a 1.2V core supply. The PLD is packaged in a 132-ball csBGA which pro-vides a migration path to devices ranging from 640 LUTs to 4340 LUTs. A complete description of this device can be found in the MachXO2 Family Handbook.
Software RequirementsYou should install the following software before you begin developing designs for the evaluation board:
• Lattice Diamond™ 1.2 (or higher)
• ispVM™ System 17.9.1 (or higher)
Demonstration DesignLattice provides the Pico SoC Demo design programmed in the board. The design utilizes the MachXO2 in the con-text of low power applications.
The Pico SoC Demo illustrates the use of the LatticeMico8 microcontroller, associated peripherals and firmware to provide a low power system featuring voltage/current measurement, data logging to nonvolatile memory, I/O con-trol, embedded block RAM utilization, UART communication, capacitive touch sense buttons and a LCD controller.
• The LatticeMico8 executable program initializes the peripherals that are embedded in the SoC design. During ini-tialization, the LatticeMico8 uploads the user menu on the Terminal of a PC.
• Users interact with LatticeMico8 and the board through the Terminal of a PC or through the capacitive touch sense buttons.
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MachXO2 Pico Development Kit User’s Guide
Figure 2. Pico SoC Demo Block Diagram
MachXO2 Pico Evaluation Board
MachXO2-1200ZE
UART LCDCapacitive TouchSense Buttons
LatticeMico8Microcontroller
MasterSPI
SoftADC
MasterI2C
SPIFlash
AnalogSignal
PC
I2CTemp
Sensor
EmbeddedBlock RAM
Power management is handled in two phases by the MachXO2 Pico Evaluation Board system:
1. MachXO2 Function – After the reset is de-asserted, LatticeMico8 initializes the peripherals embedded in the MachXO2 device and uploads the user menu onto the HyperTerminal window of a PC.
Figure 3. HyperTerminal User Menu
2. Users interact with LatticeMico8 microcontroller and the board by selecting the available options in the HyperTerminal menu. The available options are:
• ‘m’ – This option re-displays the main menu anytime during the demonstration. PICO is displayed on the LCD screen.
• ‘i’ – This option measures the Icc using a Delta Sigma. The result is displayed to the terminal and the LCD. Board button 3 performs the same function but results are only displayed to the LCD.
• ‘o’ – This option measures Icco using Delta Sigma. The result is displayed to the terminal and the LCD. Pressing board button 2 performs the same function but results are only displayed to the LCD.
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MachXO2 Pico Development Kit User’s Guide
• ‘s’ – This option reads the device ID of the SPI Flash on the board. The results are displayed to the terminal and the LCD.
• 't' - This option reads the I2C temperature sensor on the board. The result is displayed to the Terminal and to the LCD. Button 4 on the board performs the same function but the result is only displayed on the LCD
• 'r' This option samples the capacitive touch buttons on the board and displays the data in the terminal.
• "0-9" - These values will echoed to the terminal and displayed on the LCD
• 'l' - This option will read the Icc, Icco, and Temperature and log it to the SPI flash memory. The WRITE page pointer will increment when 'l' is pressed. The initial value of the page pointer after power up is a 0. Button 1 on the board performs the same function the LCD will display 8888
• 'd' - This option will read the data from the SPI Flash device and display to to the Terminal window. The READ page pointer will increment when 'd' is pressed. The intial value of the page pointer after a power up is 0.
• 'c' - This option will clear (reset) the WRITE and READ page pointers
• 'e' - This selection will perform a bulk-erase of the Flash memory in the SPI Flash device and will clear (reset) the WRITE and READ page pointers.
Setting up the BoardDrivers and FirmwareBefore you begin, you will need to obtain the necessary hardware drivers for Windows from the Lattice web site.
1. Browse to www.latticesemi.com/alpha-mxo2-pico-kit and locate the hardware device drivers for the USB inter-face.
2. Download the ZIP file to your system and unzip it to a location on your PC.Linux Support:
The USB interface drivers for the evaluation board are included in Linux kernel 2.4.20 or greater, including distribu-tions compatible with Lattice Diamond design software (Red Hat Enterprise v.3, v.4 or Novell SUSE Enterprise v.10).
The Pico SoC Demo is preprogrammed into the MachXO2 Pico Evaluation Board, however over time it is likely that your board will be modified.
To download the demo source files and reprogram the MachXO2 Pico Evaluation Board:
1. Download the demo appliction source code from www.latticesemi.com/alpha-mxo2-pico-kit.
2. Use .\Environment_Scanning_demo\project\impl1\Environment_Scanning_demo_impl1.jed to restore the Environment Scanning demonstration design.
Connecting to the MachXO2 Pico Evaluation Board1. Connect the evaluation board to your PC using the USB cable provided. The USB connector on the board
includes reference designator J1. Once the connection is made, a blue LED with reference designator D2 will illuminate.
2. If you are prompted “Windows may connect to Windows Update”, select No, not this time from available options and click Next to proceed with the installation.
3. Choose the Install from specific location (Advanced) option and click Next. 4. Select Search for the best driver in these locations and click the Browse button to browse to the Win-
dows driver folder created earlier. Select the CDM 2.04.06 WHQL Certified folder and click OK.5. Click Next. A screen will display as Windows copies the required driver files. Windows will display a mes-
sage indicating that the installation was successful.
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MachXO2 Pico Development Kit User’s Guide
Programming the MachXO2Using ispVM System software, users can scan and perform JTAG operations, including programming, with the MachXO2 device.
Setting Up Windows HyperTerminalYou will use a terminal program to communicate with the evaluation board. The following instructions describe the Windows HyperTerminal program which is found on most Windows PCs. You may use another terminal program but setup will be somewhat different. Windows 7 does not include HyperTerminal. Tera Term has been verified to work with Windows 7. For Linux, Minicom is a good alternative.
Note: This step uses the procedure for Windows XP users. Steps may vary slightly if using another Windows ver-sion.
1. From the Start menu, select Control Panel > System. The “System Properties” dialog appears.
2. Select the Hardware tab and click Device Manager. The “Device Manager” dialog appears.Figure 4. Device Manager – COM Port
3. Expand the Ports (COM & LPT) entry and note the COM port number for the USB Serial Port.4. From the Start menu, select Programs > Accessories > Communications > HyperTerminal. The
HyperTerminal application and a “Connection Description” dialog appear.
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MachXO2 Pico Development Kit User’s Guide
Figure 5. New Connection – COM Port
5. Specify a Name and Icon for the new connection. Click OK. The “Connect To” dialog appears.6. Select the COM port identified in Step 3 from the Connect using: list. Click OK.
Figure 6. Selecting the COM Port
7. The “COMn Properties” dialog appears where “n” is the COM port selected from the list.8. Select the following Port Settings and click OK.
Bits per second: 115200Data bits: 8Parity: NoneStop bits: 1Flow control: None
Figure 7. COM Port Properties
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MachXO2 Pico Development Kit User’s Guide
9. The HyperTerminal window appears.10. From the MachXO2 Pico Evaluation Board, press the reset push-button with reference designator S1. The
Pico SoC demo main menu appears.
Setting Up Linux MinicomMinicom is a terminal program found with most Linux distributions. It can be used to communicate with the MachXO2 Pico Evaluation Board.
To setup Minicom:
1. Check active serial ports:
#dmesg | grep tty
Note the tty label assigned to the USB port
2. From a command prompt, start Minicom:#minicom –s
The configuration menu appears.
3. Highlight Serial port setup and press Enter. Serial port settings appear.4. Press A (Serial Device). Specify the active serial device noted in Step 1 and press Enter.5. Press E (Bps/Par/Bits). Specify 115200, None, 8 and press Enter.6. Press F (Hardware Flow Control). Specify None and press Enter.7. Press Esc. The configuration menu appears.8. Select Save setup as dfl. Minicom saves the port setup as the new default.9. Select Exit. The Minicom interface appears.10. From the evaluation board, press the S1 push-button (GSR). The Pico SoC demo main menu appears.
Ordering Information
Description Ordering Part NumberChina RoHS Environment-Friendly
Use Period (EFUP)
MachXO2 Pico Development Kit LCMXO2-1200ZE-P-EVN
Technical Support AssistanceHotline: 1-800-LATTICE (North America)
+1-503-268-8001 (Outside North America)
e-mail: [email protected]
Internet: www.latticesemi.com
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MachXO2 Pico Development Kit User’s Guide
Revision HistoryDate Version Change Summary
February 2011 01.0 Initial release.
April 2011 01.1 Updated Pico Evaluation Board Top Side diagram, Pico SoC Demo block diagram, HyperTerminal User Manual information, Appendix A and Appendix B.
June 2011 01.2 Added Appendix C.
July 2011 01.3 Updated Features list with information on migration from MachXO2-1200-R1 to Standard (non-R1) devices.
July 2011 01.4 Added limitations section to Appendix C.
December 2011 01.5 Added Appendix D.
February 2012 01.6 Updated document with new corporate logo.
June 2012 01.7 Added Appendix D, Dual Boot Demonstration.
Updated Appendix E, Limitations.
June 2012 01.8 Added “MachXO2 Pico Evaluation Board I2C Bus Power Enable” dia-gram to Appendix D.
July 2012 01.9 Appendix D figure title changed from “MachXO2 Pico Evaluation Board I2C Bus Power Enable” to “MachXO2 Pico Evaluation Board SPI/I2C Bus Power Enable”.
October 2012 02.0 Highlighted board limitations and workarounds in the demos.
© 2012 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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MachXO2 Pico Development Kit User’s Guide
Appendix A. SchematicFigure 8. USB 5V, MachXO2 Power Rails, 3.0V Battery, 1.2V Rail and Current Monitors
5 5
4 4
3 3
2 2
1 1
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MachXO2 Pico Development Kit User’s Guide
Figure 9. Current Sense Amplifiers, Power Enable Mux
5 5
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High = Powered (S1)
Low = Disabled (S2)
High = Powered (S1)
Low = Disabled (S2)
R75
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R75
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R45
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R45
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C26
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R91
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R65
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R65
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R39
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R39
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R46
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C25
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C25
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C22
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R38
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R64
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C27
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R61
2k DI
1%R61
2k DI
1%
R42 2k D
I0.
1%R42 2k D
I0.
1%
U21
ST
G36
93Q
TRU
21
ST
G36
93Q
TR
1S2
1
123S
EL
3
2S1
4D
25
2S2
6
GN
D11
3S1
7
D3
8
3S2
9
4SE
L10
4S1
12
D4
13
4S2
14
VC
C2
1S1
15
D1
16
U20
ST
G36
93Q
TRU
20
ST
G36
93Q
TR
1S2
1
123S
EL
3
2S1
4D
25
2S2
6
GN
D11
3S1
7
D3
8
3S2
9
4SE
L10
4S1
12
D4
13
4S2
14
VC
C2
1S1
15
D1
16
C30
0.04
7uF
DI
C30
0.04
7uF
DI
R52
50 DI
0.1%
R52
50 DI
0.1%
R89
0 DI
R89
0 DI
R41
50 DI
0.1%
R41
50 DI
0.1%
C19
0.04
7uF
DI
C19
0.04
7uF
DI
R50
1k DI
1%R50
1k DI
1%
R51
2k DI
0.1%
R51
2k DI
0.1%
C24
0.1u
FD
I
C24
0.1u
FD
I
R49
0 DI
R49
0 DI
R96
0 DI
R96
0 DI
R97
0 DI
R97
0 DI
R81
500
DI
1%R81
500
DI
1%
R40
0 DI
R40
0 DI
R58
1k DI
1%R58
1k DI
1%
R92
1k DI
1%R92
1k DI
1%
R57
2k DI
0.1%
R57
2k DI
0.1%
12
MachXO2 Pico Development Kit User’s Guide
Figure 10. USB to JTAG and I2C for the MachXO2
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
EE
SK
EE
DA
TA
SH
LD_D
ebug
EE
CS
+5V
_US
B
+3.
3V
+3.
3Vor
Bat
+3.
3V
VC
C18
FT
+3.
3V
+3.
3V
+3.
3V
+3.
3V
PW
R_E
NA
BLE
b[p
g1]
US
B_S
CL
[pg4
,5]
US
B_T
CK
[pg5
]
US
B_T
DI
[pg5
]
US
B_T
DO
[pg5
]
US
B_T
MS
[pg5
]
US
B_S
DA
[pg4
,5]
BD
BU
S1
[pg5
]
BD
BU
S2
[pg5
]
BD
BU
S0
[pg5
]
BD
BU
S3
[pg5
]
BD
BU
S4
[pg5
]
BD
BU
S5
[pg5
]
BD
BU
S6
[pg5
]
BD
BU
S7
[pg5
]
US
B_1
2MH
Z[p
g4]
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
63
US
B t
o JT
AG
and
I2C
for
the
XO
2
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
63
US
B t
o JT
AG
and
I2C
for
the
XO
2
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
63
US
B t
o JT
AG
and
I2C
for
the
XO
2
MA
CH
XO
2 P
ico
Boa
rdEA
US
B C
on
nec
tio
n
M93C46-WMN6TP Manuf:ST Micro
Digi-Key Part Number 497-5090-1-ND
FT
2232
Con
trol
led
Hig
h =
JT
AG
Low
= I2
C
R34
0 DI
R34
0 DI
FTD
I Hig
h-S
peed
US
B
F
T223
2H
FT
2232
HL
U23
DIFT
DI H
igh-
Spe
ed U
SB
F
T223
2H
FT
2232
HL
U23
DIVR
EG
IN50
VR
EG
OU
T49
DM
7
DP
8
RE
F6
RE
SE
T#
14
EE
CS
63
EE
CLK
62
EE
DA
TA
61
OS
CI
2
OS
CO
3
TE
ST
13
AD
BU
S0
16
AD
BU
S1
17
AD
BU
S2
18
AD
BU
S3
19
VPHY4
VPLL9
VCORE12
VCORE37
VCORE64
VCCIO20
VCCIO31
VCCIO42
VCCIO56
AGND 10
GND 1
GND 5
GND 11
GND 15
GND 25
GND 35
GND 47
GND 51PW
RE
N#
60
SU
SP
EN
D#
36
AD
BU
S4
21
AD
BU
S5
22
AD
BU
S6
23
AD
BU
S7
24
AC
BU
S0
26
AC
BU
S1
27
AC
BU
S2
28
AC
BU
S3
29
AC
BU
S4
30
AC
BU
S5
32
AC
BU
S6
33
AC
BU
S7
34
BD
BU
S0
38
BD
BU
S1
39
BD
BU
S2
40
BD
BU
S3
41
BD
BU
S4
43
BD
BU
S5
44
BD
BU
S6
45
BD
BU
S7
46
BC
BU
S0
48
BC
BU
S1
52
BC
BU
S2
53
BC
BU
S3
54
BC
BU
S4
55
BC
BU
S5
57
BC
BU
S6
58
BC
BU
S7
59
L3
600o
hm 5
00m
A
L3
600o
hm 5
00m
A12
R4
10k
SM
/R_0
603
R4
10k
SM
/R_0
603
R31
0 DI
R31
0 DI
R1
10k
SM
/R_0
603
R1
10k
SM
/R_0
603
R11
0 DI
R11
0 DI
C12 0.1u
FD
I
C12 0.1u
FD
I
R43
0 DI
R43
0 DI
U22 S
TG
3693
QT
R
U22 S
TG
3693
QT
R
1S2
1
123S
EL
3
2S1
4D
25
2S2
6
GN
D11
3S1
7
D3
8
3S2
9
4SE
L10
4S1
12
D4
13
4S2
14
VC
C2
1S1
15
D1
16
C3
0.1u
FC
30.
1uF
R55
0 DI
R55
0 DI
C56
18pF
DI
C56
18pF
DI
R7
100k
DI
R7
100k
DI
R14
0 DI
R14
0 DI
R20
0 DI
R20
0 DI
R98
12k
DI
R98
12k
DI
R8
0 DI
R8
0 DI
C9
0.1u
F DI
C9
0.1u
F DI
R26
2.2k
R26
2.2k
C13 4.7u
FD
I
C13 4.7u
FD
I
U1
M93
C46
-WM
N6T
P
SO
IC-8
DI
U1
M93
C46
-WM
N6T
P
SO
IC-8
DI
CS
1
SK
2
DIN
3
DO
UT
4
VC
C8
NC
7
OR
G6
GN
D5
C6
10nF
DI
SM
/C_0
603
C6
10nF
DI
SM
/C_0
603
R56
0 DI
R56
0 DI
R3
10k
SM
/R_0
603
R3
10k
SM
/R_0
603
C58
0.1u
FD
I
C58
0.1u
FD
IR
15
0 DI
R15
0 DI
R36
3.3k
DN
I
R36
3.3k
DN
I
R35
0 DI
R35
0 DI
C57
0.1u
F DI
C57
0.1u
F DI
R47
0 DI
R47
0 DI
C5
10nF
DI
C5
10nF
DI
R16
0 DI
R16
0 DI
R13
0 DI
R13
0 DI
C55
18pF
DI
C55
18pF
DI
L1 Fer
rite_
bead
SM
/R_0
603
DI
L1 Fer
rite_
bead
SM
/R_0
603
DI
C51
3.3u
FD
I
C51
3.3u
FD
I
R30
2.2k
DI
R30
2.2k
DI
J1U
SB
_MIN
I_B
DI
TY
PE
_B
J1U
SB
_MIN
I_B
DI
TY
PE
_B
VC
C1
D-
2
D+
3
GN
D5
NC
4
CA
SE
7
CA
SE
8
CA
SE
9
CA
SE
6
MH
110
MH
211
X3
12M
HZ
DI
X3
12M
HZ
DI1
13
3
G1
2G
24
C54
0.1u
FD
I
C54
0.1u
FD
I
R21
0 DI
R21
0 DI
13
MachXO2 Pico Development Kit User’s Guide
Figure 11. MachXO2 Banks 0-1, LCD, I2C Temperature
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Tm
p_I2
C_A
LER
T
LCD
_CO
M0
LCD
_CO
M1
LCD
_CO
M2
LCD
_CO
M3
LCD
_5LC
D_6
LCD
_9LC
D_1
0
LCD
_11
LCD
_12
LCD
_7LC
D_8
LCD
_CO
M1
LCD
_CO
M0
LCD
_CO
M0_
LP
LCD
_CO
M1_
LP
LCD
_CO
M2
LCD
_CO
M2_
LP
LCD
_CO
M2_
LPLC
D_C
OM
3_LP
LCD
_7_L
PLC
D_8
_LP
LCD
_5_L
PLC
D_6
_LP
LCD
_11_
LPLC
D_1
2_LP
LCD
_9_L
PLC
D_1
0_LP
LCD
_CO
M0_
LPLC
D_C
OM
1_LP
Tm
p_I2
C_A
LER
T
LCD
_CO
M3
LCD
_CO
M3_
LP
LCD
_5_L
P
LCD
_6_L
P
LCD
_5
LCD
_6
LCD
_7_L
P
LCD
_7
LCD
_10_
LP
LCD
_10
LCD
_11_
LP
LCD
_12_
LP
LCD
_11
LCD
_12
LCD
_8_L
P
LCD
_8
LCD
_9_L
P
LCD
_9
PW
R_I
2CS
PI
PW
R_I
2CS
PI
PW
R_I
2CS
PI
US
B_S
DA
[pg3
,5]
US
B_S
CL
[pg3
,5]
XO
2_T
DO
[pg5
]
XO
2_T
MS
[pg5
]X
O2_
TC
K[p
g5]
XO
2_T
DI
[pg5
]US
B_1
2MH
Z[p
g3]
US
B_S
DA
[pg3
,5]
US
B_S
CL
[pg3
,5]
PR
OT
O_C
10[p
g5]
PR
OT
O_B
13[p
g5]
PR
OT
O_A
13[p
g5]
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
64
XO
2 B
ank
0-1,
LC
D,
I2C
Tem
p
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
64
XO
2 B
ank
0-1,
LC
D,
I2C
Tem
p
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
64
XO
2 B
ank
0-1,
LC
D,
I2C
Tem
p
MA
CH
XO
2 P
ico
Boa
rdEA
Lo
wP
ass
Filt
er
4 C
har
LC
D
Tem
per
atu
re S
enso
rS
lave
Ad
dr
1001
010
R17
0 DI
R17
0 DI
C32
0.01
uFD
I
C32
0.01
uFD
I
R87
5.49
kD
I
R87
5.49
kD
I
C40
0.01
uFD
I
C40
0.01
uFD
I
Bank0
LCM
XO
2-12
00-C
SB
GA
132
U10
A
Bank0
LCM
XO
2-12
00-C
SB
GA
132
U10
A
PT
9AA
2
PT
9BB
3
PT
10A
A3
PT
10B
C4
TD
OA
4
TD
IB
4
PT
11A
B5
PT
11B
C6
TC
KB
6
TM
SA
6
PT
12A
/PC
LKT
0_1
A7
PT
12B
/PC
LKC
0_1
B7
PT
12C
/SC
L/IO
2/P
CLK
T0_
0C
8
PT
12D
/SD
A/IO
3/P
CLK
C0_
0B
8
PT
15A
C9
PT
15B
A9
PT
15C
/JT
AG
EN
BB
9
PT
15D
/PR
OG
RA
MN
C10
PT
16A
A10
PT
16B
C11
PT
16C
A11
PT
16D
B12
PT
17A
C12
PT
17B
A12
PT
17C
/INIT
NB
13
PT
17D
/DO
NE
A13
C28
0.01
uFD
I
C28
0.01
uFD
I
C33
0.01
uFD
I
C33
0.01
uFD
I
R76
5.49
kD
I
R76
5.49
kD
I
R83
5.49
kD
I
R83
5.49
kD
I
C34
0.01
uFD
I
C34
0.01
uFD
I
R77
5.49
kD
I
R77
5.49
kD
I
R84
3.3k
DI
R84
3.3k
DI
C36
0.01
uFD
I
C36
0.01
uFD
I
R62
5.49
kD
I
R62
5.49
kD
I
C37
0.01
uFD
I
C37
0.01
uFD
I
R86
5.49
kD
I
R86
5.49
kD
I
R72
5.49
kD
I
R72
5.49
kD
I
R63
5.49
kD
I
R63
5.49
kD
I
R80
3.3k
DI
R80
3.3k
DI
U7
LCD
-S40
1M16
KR
U7
LCD
-S40
1M16
KR
CO
M0
1
CO
M1
2
CO
M2
3
CO
M3
4
1D,1
E,1
G,1
F5
DP
1,1C
,1B
,1A
6
2D,2
E,2
G,2
F7
DP
2,2C
,2B
,2A
8
3D,3
E,3
G,3
F9
DP
3,3C
,3B
,3A
10
4D,4
E,4
G,4
F11
CO
L,4C
,4B
,4A
12
C29
0.01
uFD
I
C29
0.01
uFD
I
Bank1
LCM
XO
2-12
00-C
SB
GA
132
U10
B
Bank1
LCM
XO
2-12
00-C
SB
GA
132
U10
B
PR
2AB
14
PR
2BC
13
PR
2CC
14
PR
2DD
12
PR
3AE
12
PR
3BE
14
PR
4AE
13
PR
4BF
12
PR
4CF
13
PR
4DF
14
PR
5AG
12
PR
5BG
14
PR
5C/P
CLK
T1_
0G
13
PR
5D/P
CLK
C1_
0H
12
PR
8AJ1
2
PR
8BJ1
4
PR
8CJ1
3
PR
8DK
12
PR
9AK
13
PR
9BK
14
PR
9CL1
4
PR
9DM
13
PR
10A
M12
PR
10B
M14
PR
10C
N13
PR
10D
N14
C39
0.01
uFD
I
C39
0.01
uFD
I
R78
10k
DI
R78
10k
DI
U5
TM
P10
1D
I
U5
TM
P10
1D
I
VC
C4
GN
D2
AD
D0
5S
CL
1
SD
A6
ALE
RT
3
R82
5.49
kD
I
R82
5.49
kD
I
C20
0_1u
F
DI
C20
0_1u
F
DI
R22
0 DI
R22
0 DI
C43
0.01
uFD
I
C43
0.01
uFD
I
R74
5.49
kD
I
R74
5.49
kD
IC31
0.01
uFD
I
C31
0.01
uFD
I
R23
0 DI
R23
0 DI
R68
5.49
kD
I
R68
5.49
kD
I
R67
5.49
kD
I
R67
5.49
kD
I
C42
0.01
uFD
I
C42
0.01
uFD
I
14
MachXO2 Pico Development Kit User’s Guide
Figure 12. MachXO2 Banks 2-3, Capacitor Pads, Expansion Header, SPI
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Cap
Btn
2C
apB
tn1
Cap
Btn
3C
apB
tn4
Pus
hBtn
PR
OT
O_K
1P
RO
TO
_K3
XO
2_S
PI_
CLK
XO
2_S
PI_
OU
T
XO
2_S
PI_
IN
XO
2_S
PI_
CS
0
PR
OT
O_B
1P
RO
TO
_B2
PR
OT
O_C
1P
RO
TO
_C3
PR
OT
O_C
2P
RO
TO
_D1
PR
OT
O_M
7P
RO
TO
_N8
Cap
Btn
1
Cap
Btn
4C
apB
tn3
Cap
Btn
2
Pus
hBtn
PR
OT
O_K
1P
RO
TO
_K3
PR
OT
O_M
7P
RO
TO
_N8
PR
OT
O_B
1P
RO
TO
_B2
PR
OT
O_C
1P
RO
TO
_C3
PR
OT
O_C
2P
RO
TO
_D1
XO
2_S
PI_
INX
O2_
SP
I_C
LK
XO
2_S
PI_
OU
T
XO
2_S
PI_
CS
0
XO
2_S
PI_
INX
O2_
SP
I_C
LK
XO
2_S
PI_
OU
T
XO
2_S
PI_
CS
0
XO
2_S
PI_
SN
XO
2_S
PI_
SN
XO
2_S
PI_
INX
O2_
SP
I_C
LK
XO
2_S
PI_
OU
T
XO
2_S
PI_
CS
0
VC
CIO
_EX
T
VC
CIO
_EX
TV
CC
IO_E
XT
VC
CIO
_EX
T
VC
CIO
_EX
T
VC
CIO
_EX
T
+3.
3Vor
Bat
PW
R_I
2CS
PI
DS
Vre
fVcc
[pg2
]D
SIn
Vcc
[pg2
]
DS
Out
Vcc
[pg2
]
DS
Vre
fVcc
o[p
g2]
DS
InV
cco
[pg2
]
DS
Out
Vcc
o[p
g2]
EnA
MP
[pg2
]E
nI2C
SP
I[p
g2]
BD
BU
S2
[pg3
]B
DB
US
3[p
g3]
BD
BU
S4
[pg3
]B
DB
US
5[p
g3]
BD
BU
S6
[pg3
]B
DB
US
7[p
g3]
BD
BU
S1
[pg3
]B
DB
US
0[p
g3]
XO
2_T
DO
[pg4
]U
SB
_TD
O[p
g3]
US
B_T
DI
[pg3
]
XO
2_T
CK
[pg4
]X
O2_
TM
S[p
g4]
XO
2_T
DI
[pg4
]
US
B_T
CK
[pg3
]U
SB
_TM
S[p
g3]
US
B_S
DA
[pg3
,4]
US
B_S
CL
[pg3
,4] PR
OT
O_B
13[p
g4]
PR
OT
O_A
13[p
g4]
PR
OT
O_C
10[p
g4]
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latt
ice
Sem
icon
duct
or A
pplic
atio
nsE
mai
l: te
chsu
ppor
t@La
ttice
sem
i.com
Pho
ne (
503)
268
-800
1 -o
r- (
800)
LA
TT
ICE
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
65
XO
2 B
ank
2-3,
Cap
Pad
s, E
xpan
sion
Hea
der,
SP
I
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latt
ice
Sem
icon
duct
or A
pplic
atio
nsE
mai
l: te
chsu
ppor
t@La
ttice
sem
i.com
Pho
ne (
503)
268
-800
1 -o
r- (
800)
LA
TT
ICE
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
65
XO
2 B
ank
2-3,
Cap
Pad
s, E
xpan
sion
Hea
der,
SP
I
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latt
ice
Sem
icon
duct
or A
pplic
atio
nsE
mai
l: te
chsu
ppor
t@La
ttice
sem
i.com
Pho
ne (
503)
268
-800
1 -o
r- (
800)
LA
TT
ICE
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
65
XO
2 B
ank
2-3,
Cap
Pad
s, E
xpan
sion
Hea
der,
SP
I
MA
CH
XO
2 P
ico
Boa
rdEA
Cap
acit
ive
To
uch
Pad
s
GS
R/W
ake
fro
m S
tan
db
y
Part Number:EVQ Q2K03W
Panasonic SMD
Hea
der
Pac
kage
: SO
IC8
(WID
E)
Pac
kage
: UD
FN
4MB
it S
PI
(R
efer
to
Ap
pen
dix
D. L
imit
atio
ns)
U12
Cap
Tou
ch
U12
Cap
Tou
ch
Cap
Btn
1
R93
100k
DN
I
R93
100k
DN
I
R33
0D
IR
330
DI
Bank2
LCM
XO
2-12
00-C
SB
GA
132
U10
C
Bank2
LCM
XO
2-12
00-C
SB
GA
132
U10
C
PB
20D
/SI/S
ISP
I/IO
0P
13P
B20
C/S
NN
12
PB
20B
P12
PB
20A
M11
PB
18D
P11
PB
18C
M10
PB
18B
N10
PB
18A
M9
PB
15D
N9
PB
15C
P9
PB
15B
M8
PB
15A
P8
PB
11B
/PC
LKC
2_1
N8
PB
11A
/PC
LKT
2_1
M7
PB
11D
N7
PB
11C
P7
PB
9B/P
CLK
C2_
0P
6P
B9A
/PC
LKT
2_0
N6
PB
9DM
5P
B9C
N5
PB
6D/S
O/S
PIS
O/IO
1N
4P
B6C
/MC
LK/C
CLK
M4
PB
6BP
4P
B6A
N3
PB
4DM
3P
B4C
/CS
SP
INP
3
PB
4BN
2P
B4A
P2
C48
0.1u
FD
NI
C48
0.1u
FD
NI
R37
68D
IR
3768
DI
C50
0.1u
FD
NI
C50
0.1u
FD
NI
U3
HE
AD
ER
16X
2
U3
HE
AD
ER
16X
2
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 3132
R44
10k
DIR44
10k
DI
R48
0D
IR
480
DI
U13
Cap
Tou
ch
U13
Cap
Tou
ch
Cap
Btn
1
C10
0_1u
FD
IC10
0_1u
FD
I
S1
Glo
balR
eset
PC
B F
ootp
rint =
SM
T_S
W
DI
S1
Glo
balR
eset
PC
B F
ootp
rint =
SM
T_S
W
DI
14
23
R94
100k
DN
I
R94
100k
DN
I
R70
0 DI
R70
0 DI
R88
100k
DN
I
R88
100k
DN
I
C49
0.1u
FD
NI
C49
0.1u
FD
NI
U9
AT
25D
F04
1A-S
H-B
U9
AT
25D
F04
1A-S
H-B
S1
Q2
W3
Vss
4
Vcc
8
D5
C6
Res
et7
R25
10k
DI
R25
10k
DI
U14
Cap
Tou
ch
U14
Cap
Tou
ch
Cap
Btn
1
U17
AT
25D
F04
1A-M
H
U17
AT
25D
F04
1A-M
H
S1
Q2
W3
Vss
4
Vcc
8
D5
C6
Res
et7
C47
0.1u
FD
NI
C47
0.1u
FD
NI
R69
0 DI
R69
0 DI
C11
0.1u
FD
I
C11
0.1u
FD
I
U11
Cap
Tou
ch
U11
Cap
Tou
ch
Cap
Btn
1
R71
0 DI
R71
0 DI
R2
0D
IR
20
DI
R90
100k
DN
I
R90
100k
DN
I
Bank3
LCM
XO
2-12
00-C
SB
GA
132
U10
D
Bank3
LCM
XO
2-12
00-C
SB
GA
132
U10
D
PL1
0DM
2P
L10C
M1
PL1
0BL3
PL9
B/P
CLK
C3_
0K
3P
L9A
/PC
LKT
3_0
K1
PL8
DK
2P
L8C
J3
PL8
BJ2
PL8
AJ1
PL5
DH
3P
L5C
H1
PL5
B/P
CLK
C3_
1H
2P
L5A
/PC
LKT
3_1
G3
PL4
DF
3P
L4C
F1
PL4
BF
2P
L4A
E3
PL3
DE
2P
L3C
E1
PL3
B/P
CLK
C3_
2D
1P
L3A
/PC
LKT
3_2
C2
PL2
D/L
_GP
LLC
_IN
C3
PL2
C/L
_GP
LLT
_IN
C1
PL2
B/L
_GP
LLC
_FB
B2
PL2
A/L
_GP
LLT
_FB
B1
R32
0D
IR
320
DI
R95
0 DI
R95
0 DI
R66
0 DI
R66
0 DI
15
MachXO2 Pico Development Kit User’s Guide
Figure 13. MachXO2 Power
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
VC
C_I
O
VC
C_C
OR
EV
CC
_CO
RE
VC
C_I
O
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
66
XO
2 P
ower
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
66
XO
2 P
ower
MA
CH
XO
2 P
ico
Boa
rdEA
Dat
e:
Siz
eS
chem
atic
Rev
ofS
heet
Titl
e
Latti
ce S
emic
ondu
ctor
App
licat
ions
Em
ail:
tech
supp
ort@
Latti
cese
mi.c
omP
hone
(50
3) 2
68-8
001
-or-
(80
0) L
AT
TIC
E
Boa
rd R
ev
Pro
ject
Frid
ay, M
arch
4, 2
011
B
66
XO
2 P
ower
MA
CH
XO
2 P
ico
Boa
rdEA
Bo
ard
Lo
go
sB
oar
d M
ou
nti
ng
Ho
les
G4
Latti
ce L
ogo
DI
G4
Latti
ce L
ogo
DI1
C41
0.1u
FD
I
C41
0.1u
FD
I
G5
E-F
riend
ly
DI
G5
E-F
riend
ly
DI1
C46
0.1u
FD
I
C46
0.1u
FD
I
G6
WE
EE
DI
G6
WE
EE
DI1
MH
10
M_H
OLE
1D
IIW
_MN
T0
MH
10
M_H
OLE
1D
IIW
_MN
T0
1
C35
0.1u
FD
I
C35
0.1u
FD
I
MH
9
M_H
OLE
1D
IIW
_MN
T0
MH
9
M_H
OLE
1D
IIW
_MN
T0
1
C44
0.1u
FD
I
C44
0.1u
FD
I
MH
11
M_H
OLE
1D
IIW
_MN
T0
MH
11
M_H
OLE
1D
IIW
_MN
T0
1
MH
12
M_H
OLE
1D
IIW
_MN
T0
MH
12
M_H
OLE
1D
IIW
_MN
T0
1
LCM
XO
2-12
00-C
SB
GA
132
U10
E
LCM
XO
2-12
00-C
SB
GA
132
U10
E
GN
DL2
GN
DG
2
GN
DD
2
GN
DB
11
GN
DD
13
GN
DH
13
VC
CP
14
VC
CA
1
NC
C7
GN
DA
5
VC
CA
14
GN
DL1
3
GN
DP
10
GN
DP
5
VC
CN
1
VC
CIO
0C
5
VC
CIO
0A
8
VC
CIO
0B
10
VC
CIO
1L1
2
VC
CIO
1H
14
VC
CIO
1D
14
VC
CIO
2N
11
VC
CIO
2M
6
VC
CIO
2P
1
VC
CIO
3L1
VC
CIO
3D
3
VC
CIO
3G
1C
380.
1uF
DI
C38
0.1u
FD
I
C45
0.1u
FD
I
C45
0.1u
FD
I
16
MachXO2 Pico Development Kit User’s Guide
Appendix B. Bill of MaterialsItem Quantity Reference Part Footprint Populate Vendor Part Number Description
1 2 C10,C20 0_1uF SM/C_0603 DI Panasonic ECJ-1VB1C104K 0.1uF surface mount cap
2 3 C1,C2,C21 1uF SM/C_0603 DI Panasonic ECJ-2YB1A105K 1uF surface mount cap
3 2 C5,C6 10nF SM/C_0603 DI Panasonic ECG ECJ-1VB1C104K 10nF SMC
4 1 J1 USB_MINI_B TYPE_B DI Hirose UX60-MB-5ST USBType-BMiniConnector
5 35 R2,R8,R11,R13,R14,R15,R16,R17,R20,R21,R22,R23,R31,R32,R33,R34,R35,R40,R43,R47,R48,R49,R55,R56,R64,R65,R66,R69,R70,R71,R75,R89,R95,R96,R97
0 SM/R_0603 DI Panasonic ECG ERJ-3GEY0R00V Resistor 0.0 SMD 0603
6 5 R50,R58,R60,R79,R92 1k SM/R_0603 DI Vishay/Dale CRCW06031K00FKEA Resistor 1k SMD 0603
7 8 R1,R3,R4,R25,R27,R29,R44,R78
10k SM/R_0603 DI Vishay/Dale CRCW060310K0FKEA 10K 0603 SMT resistor
8 1 R59 10k SM/R_0603 DNI Vishay/Dale CRCW060310K0FKEA 10K 0603 SMT resistor
9 1 U1 M93C46-WMN6TP SOIC-8 DI STMicroelectronics M93C46-WMN6TP IC 1K EEPROM 8-SOIC
10 1 U5 TMP101 SM/SOT23_6 DI TI TMP101NA/250 IC TEMP SENSOR DIG SOT-23-6
11 1 R19 1M SM/R_0603 DI PanasonicECG ERJ-3GEYJ105V RES 1.0M1/10W5%
12 1 R53 1M SM/R_0603 DNI PanasonicECG ERJ-3GEYJ105V RES 1.0M1/10W5%
13 1 U17 AT25DF041A-MH UDFN DNI Atmel AT25DF041A-MH IC FLASH 4MBIT 70MHZ 8SOIC
14 4 MH9,MH10,MH11,MH12 M_HOLE1 IW_MNT0 DI 3M SJ-5003 (BLACK) BUMPON HEMISPHERE .44X.20 BLACK
15 6 R38,R42,R46,R51,R57,R61 2k SM/R_0603 DI Susumu Co Ltd RG1608P-202-B-T5 RES 2.0K OHM 1/10W .1% 0603 SMD
16 1 BT1 Batt_Cell_Holder BA2032_Battery_Holder
DI Linx Technologies Inc BAT-HLD-001 HOLDER BATTERY 20MM COIN CR2032
17 16 C3,C9,C11,C12,C24,C25,C26,C35,C38,C41,C44,C45,C46,C54,C57,C58
0.1uF SM/C_0603 DI TDK Corporation C1608X7R1E104K CAP CER .10UF 25V X7R 10% 0603
18 4 C47,C48,C49,C50 0.1uF SM/C_0603 DNI TDK Corporation C1608X7R1E104K CAP CER .10UF 25V X7R 10% 0603
19 12 C28,C29,C31,C32,C33,C34,C36,C37,C39,C40,C42,C43
0.01uF SM/C_0603 DI TDK Corporation C1608X7R1H103K CAP CER 10000PF 50V X7R 10% 0603
20 1 C23 0.33uF SM/C_0603 DI TDK Corporation C1608X7R1A334K CAP CER .33UF 10V X7R 0603
21 1 C7 6.8uF SM/C_1206 DI AVX Corporation TAJA685K020RNJ CAP TANTALUM 6.8UF 20V 10% SMD
22 1 C8 10uF SM/C_0805 DI Nichicon TAJA685K020RNJ CAP TANTALUM 10UF 6.3V 20% SMD
23 1 D2 Blue SM/D_0603 DI Lite-On Inc LTST-C190TBKT LED 468NM BLUE CLEAR 0603 SMD
24 1 L1 Ferrite_bead SM/R_0603 DI Laird-Signal Integrity Products
MI0603J600R-00 FERRITE 1A 60 OHM 0603 SMD
25 1 U2 MCP1703T-1202E/CB SOT-23A-3 DI Microchip Technology MCP1703T-1202E/CB IC REG LDO 1.2V 200MA SOT-23A
26 3 R5,R7,R28 100k SM/R_0603 DI Panasonic - ECG ERJ-3GEYJ104V RES 100K OHM 1/10W 5% 0603 SMD
27 4 R88,R90,R93,R94 100k SM/R_0603 DNI Panasonic - ECG ERJ-3GEYJ104V RES 100K OHM 1/10W 5% 0603 SMD
28 1 R54 4.7k SM/R_0603 DI Panasonic - ECG ERJ-3EKF4701V RES 4.70K OHM 1/10W 1% 0603 SMD
29 2 R26,R30 2.2k SM/R_0603 DI Panasonic - ECG ERJ-3GEYJ222V RES 2.2K OHM 1/10W 5% 0603 SMD
30 4 R39,R41,R45,R52 50 SM/R_0603 DI Vishay/Dale TNPW060349R9BEEA RES 49.9 OHM 1/10W 0.1% 0603
31 2 R81,R91 500 SM/R_0603 DI Panasonic - ECG ERJ-3EKF4990V RES 499 OHM 1/10W 1% 0603 SMD
17
MachXO2 Pico Development Kit User’s Guide
32 1 R98 12k SM/R_0603 DI Panasonic - ECG ERA-3AEB123V RES 12K OHM 1/10W .1% 0603 SMD
33 3 Q1,Q3,Q4 IRLML6402PbF SM/SOT23_123 DI International Rectifier IRLML6402TRPBF MOSFET P-CH 20V 3.7A SOT-23
34 1 Q2 IRF240 SM/SOT23_123 DI International Rectifier IRLML2502TRPBF MOSFET N-CH 20V 4.2A SOT-23
35 1 S1 GlobalReset SMT_SW DI Panasonic - ECG EVQ-Q2K03W SWITCH LT 6MM 130GF H=3.1MM SMD
36 1 U8 NCP1117 SOT-223_checkpins
DI STMicroelectronics NCP1117ST33T3G IC REG LDO 1A 3.3V SOT223
37 1 U3 HEADER 16X2 Header16x2 DNI Samtec Inc TLW-108-06-G-D CONN HEADER .100" 16POS DL GOLD
38 2 C19,C30 0.047uF SM/C_0603 DI TDK Corporation C1608X7R1H473K CAP CER 47000PF 50V X7R 10% 0603
39 2 R18,R85 1 SM/R_0603 DI Vishay/Dale CRCW06031R00FKEA RES 1.00 OHM 1/10W 1% 0603 SMD
40 1 D3 NSR0530P2T5G SM/SOD_923 DNI ON Semiconductor NSR0530P2T5G DIODE SCHOTTKY 30V 0.5A SOD-923
41 1 R24 20 SM/R_0603 DNI Panasonic - ECG ERJ-3GEYJ200V RES 20 OHM 1/10W 5% 0603 SMD
42 2 R80,R84 3.3k SM/R_0603 DI Rohm Semiconductor MCR03EZPJ332 RES 3.3K OHM 1/10W 5% 0603 SMD
43 1 R36 3.3k SM/R_0603 DNI Rohm Semiconductor MCR03EZPJ332 RES 3.3K OHM 1/10W 5% 0603 SMD
44 1 U10 LCMXO2-1200-CSBGA132 CSBGA132 DI Lattice LCMXO2-1200-CSBGA132
LCMXO2-1200-CSBGA132
45 1 U7 LCD-S401M16KR LCD-S401M16KR
DI Lumex Opto/Components Inc
LCD-S401M16KR LCD custom order from [email protected]
46 12 R62,R63,R67,R68,R72,R74,R76,R77,R82,R83,R86,R87
5.49k SM/R_0603 DI Panasonic - ECG ERJ-3EKF5491V RES 5.49K OHM 1/10W 1% 0603 SMD
47 1 R37 68 SM/R_0603 DI Panasonic - ECG ERJ-3GEYJ680V RES 68 OHM 1/10W 5% 0603 SMD
48 2 C55,C56 18pF SM/C_0603 DI TDK Corporation C1608C0G1H180J CAP CER 18PF 50V C0G 5% 0603
49 1 C51 3.3uF SM/C_0603 DI TDK Corporation C1608X5R0J335K CAP CER 3.3UF 6.3V X5R 0603
50 1 C13 4.7uF SM/C_0603 DI TDK Corporation C1608X5R0J475K CAP CER 4.7UF 6.3V X5R 0603
51 1 L3 600ohm 500mA FB0603 DI Murata Electronics North America
BLM18AG601SN1D FERRITE CHIP 600 OHM 500MA 0603
52 1 U23 FT2232HL tqfp64_0p5_12p2x12p2_h1p6
DI Future FT2232H R USB UART/FIFO
53 1 X3 12MHZ crystal_4p_3p2x2p5
DI TXC CORPORATION 7M-12.000MAAJ-T CRYSTAL 12.000 MHZ 18PF SMD
54 3 U20,U21,U22 STG3693QTR QFN DI STMicroelectronics STG3693QTR IC SWITCH QUAD SPDT 16QFN
55 1 U15 LMP7708 MSOP DI STMicroelectronics LMP7708MM/NOPB IC AMP PREC R-R OUT DUAL 8-MSOP
56 2 C22,C27 220pF SM/C_0603 DI TDK Corporation C1608X7R1H221K CAP CER 220PF 50V X7R 10% 0603
57 1 U9 AT25DF041A-SH-B AT25DF041A-SOIC-8
DI Atmel AT25DF041A-SH-B IC FLASH 4MBIT 70MHZ 8SOIC
58 1 G4 Lattice Logo LOGO300_1000 DI
59 1 G5 E-Friendly EFRIENDLY_400_SM
DI
60 1 G6 WEEE WEEE_SM DI
61 4 TP1,TP2,TP3,TP4 TP LOGO300_1000 DI
62 4 U11,U12,U13,U14 CapTouch CapTouch
Item Quantity Reference Part Footprint Populate Vendor Part Number Description
18
MachXO2 Pico Development Kit User’s Guide
Appendix C. SPI Programming• In order to support SPI programing of the MachXO2 device the zero ohm resistors (R71, R70, R66, R69) will
have to be removed
• Once removed, the SPI programming pins can be accessed via the header U3 (XO2_SPI_OUT, XO2_SPI_IN, XO2_SPI_CLK, XO2_SPI_SN)
– Programming is supported using Diamond Programmer\ispVM or using an external processor– As defined in “Appendix E. Limitations” on page 21 the signal XO2_SPI_CLK is recommended to have a
1K Ohm pull up to VCC_IO
19
MachXO2 Pico Development Kit User’s Guide
Appendix D. Dual Boot DemonstrationYou can demonstrate MachXO2 dual boot using the MachXO2 Pico Evaluation Board.
Before you start you will need to do the following:
1. Create a SVF file to erase only the Configuration Flash and UFM memory. Do NOT erase the Feature Row.a. Use ispVM or Diamond Programmer to create a SVF file with the which erases the device as a base-
line.b. Modify your SVF to change the following:
! Shift in ISC ERASE(0x0E) instructionSIR 8 TDI (0E);SDR 8 TDI (0C); ! Change from E=1110 to C=1100 no Feature Row
c. For more information on the Feature Row, refer to TN1204, MachXO2 Programming and Configuration Usage Guide.
2. Update the MachXO2 Pico Demo to enable dual boot.a. Using Diamond in the Spreadsheet View, Global Preference tab set MASTER_SPI_PORT=ENABLE.
3. Power-on the SPI memory on the MachXO2 Pico Evaluation Board.a. This is a low power board and if something is not used it is powered down. This can done by shorting
the south side of C25 and R97 by soldering or holding a probe on them as they are beside each other. For reference, the north side of the board has the header U3. Shorting these components provides sets the mux U21 select high powering up the SPI device.
b. For more information, refer to the board schematics in “Appendix A. Schematic” on page 10.
4. As defined in “Appendix E. Limitations” on page 21 the signal XO2_SPI_CLK is recommended to have a 1K Ohm pull up to VCC_IO.
Figure 14. MachXO2 Pico Evaluation Board SPI/I2C Bus Power Enable
R96
U21
C25 R97
20
MachXO2 Pico Development Kit User’s Guide
Demonstrating Dual Boot1. Program the MachXO2 device with the modified Pico Demo.
a. Select the operation Flash Erase, Program, Verify.b. “PICO” will display on the LCD showing that it is running.
2. Program the SPI Flash (SPI-AT25DF041A) on the board with the modified Pico Demo.a. Using ispVM or Diamond Programmer the SPI Flash can be programmed with the SPI Flash Program-
ming option.b. As defined in TN1204, MachXO2 Programming and Configuration Usage Guide, the starting address
must be 0x010000.3. Reprogram the MachXO2 device with the modified Pico Demo as the Feature Row was erased when the
SPI was programmed.4. Erase the MachXO2 Flash (and not the Feature Row) using the modified SVF file.5. Power cycle and watch dual boot in action as the MachXO2 loads the image from the SPI into the SRAM.
a. “PICO” will display on the LCD showing that it is running.b. The Flash can be read back, confirming that the SRAM image came from the SPI memory.
21
MachXO2 Pico Development Kit User’s Guide
Appendix E. Limitations• Pin A7 USB_12MHz clock should be an input unless R31 is removed to ensure FTDI device operation
• Pin B9 JTAGENB is not connected on the board
• It is recommended to have a 1K Ohm pull up on MachXO2 pin MCLK (signal XO2_SPI_CLK)