Key Findings of iNEMI MEMS Roadmap
Michael Gaitan, NIST Chair, iNEMI and ITRS MEMS Technology Working Groups
iNEMI MEMS Workshop
“Driving Next Level Results Through Collaboration”
May 10, 2012
MEMS Technology Roadmapping
• What is Technology Roadmapping?
• What are the conditions that should be met for successful Technology Roadmapping?
• How can we roadmap MEMS Technology?
• What are Technology Requirements Tables?
• What are Showstoppers?
• Conclusions
What is a Technology Roadmap?
• A technology roadmap is a plan that matches goals with specific technology solutions to meet those goals.*
• A consensus about a set of needs and the technologies required to satisfy those needs
• A mechanism to help experts forecast technology developments in targeted areas
• A framework to help plan and coordinate technology developments both within a company or an entire industry
*Garcia, M.L. and Bray, O.H. (1997), Fundamentals of Technology Roadmapping. Strategic Business Development Department. Sandia National Laboratories.
Three Phases to Roadmapping
1. Preliminary activities satisfy the necessary conditions, identify leadership/sponsorship, define the scope.
2. Develop the roadmap identify the product that will be the focus, develop the systems requirements, drivers, targets, timelines, showstoppers, alternatives, write the roadmap.
3. Follow-up critique and validate the roadmap, develop an implementation plan, review and update
What are Required Conditions?
1. (FOM) restricted set of figures of merit.
2. (ECO) existence of a community of players.
3. (SHR) willingness to share information.
4. (WAT) potential market of significant size indicating a wide applicability of the roadmap.
5. (LEP) convergence of opinion among a majority of the key players on the progress of trends.
“More than Moore” White Paper, http://www.itrs.net
Threat as Motivation to Cooperate?
1986: Prompted by several years of slipping U.S. semiconductor market share, the Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) hold a joint meeting and issue a call for cooperation to provide the U.S. semiconductor industry with the capability of regaining world-leadership in semiconductor manufacturing.
1986 Present
http://www.sematech.org Thomas Friedman, The World is Flat
“More than Moore” White Paper, http://www.itrs.net
But … How Can We Roadmap MEMS?
• MEMS are too diverse
• We don’t need/want any standards
• MEMS are one process, one device
• Every product/company has a “secret sauce”
• There is no common ground
• MEMS companies are fiercely competitive, how will they cooperate?
• What is the scope for the ITRS roadmap of More than Moore?
A Turning Point
• Spring 2010: MEMS Industry Group (MIG) METRIC Meeting.
– MIG adopts a focus to assess needs for MEMS device testing.
• Summer 2010: iNEMI establishes a MEMS Technology Working Group (TWG).
• Winter 2010: The iNEMI MEMS chapter is completed. ITRS starts a MEMS pilot TWG.
• Spring 2011: MIG holds a MEMS Testing workshop. ITRS establishes a formal MEMS TWG.
• Winter 2011: The ITRS MEMS chapter is completed.
Integration Path
We will forecast MEMS device performance
metrics and the associated requirements
for advances in the manufacturing
technologies required
•as discrete MEMS devices advance in
performance
•evolve towards multimode sensors (e.g.,
inertial with electronic compass),
•which will require advances in packaging
and integration technologies,
•towards the goal of a “smart phone on a
chip”
“Smart Phone on a Chip”
The Continuing Evolution of the Microprocessor towards Mobile
Consumer MEMS
Phones and Tablets
• Accelerometers
• Gyroscopes
• Electronic Compass
• Pressure Sensors
• Microphones
• Micro speakers
• Auto focus
• (Pico) Projectors
• RF MEMS
Automotive MEMS
Medical MEMS Lab On A Chip Technologies
MEMS Technology Working Group
Arthur Morris
Asif Chowdhury
Bill Bottoms
Brian Gerson
Brian Jamieson
Buzz Hardy
Chengkuo Lee
Chris Apanius
Chris van Hoof
Chuck Richardson
Dave Howard
Dimitrios Peroulis
Dominique Schinabeck
Don DeVoe
Edward Chiu
Fabio Pasolini
Fabrice Verjus
Fumihiko Nakazawa
Gilles Poupon
Goro Nakatani
Hebert Bennett
Henne van Heeren
Wispry
Analog Devices
3MTS, Packaging TWG
PMC-Sierra, RF/AMS TWG
SB Microsystems
MEMSCAP
National U of Singapore
Promeus
IMEC
iNEMI
Jazz Semiconductor
Perdue
Acutronic
University of MD
Asian Pacific Microsystems
ST
KFM Technology
Fujitsu, JEITA
LETI
Rohm, JEITA
NIST, RF/AMS TWG
enablingMNT
Hiroshi Yamada
Ingrid De Wolf
Jack Pekarik
Jae Sung Yoon
Jim Spall
Jim Mrvos
Jianmin Miao
John Rychcik
Josh Molho
Juergen Wolf
Karen Lightman
Kevin Chau
Koji Fukumoto
Marcie Weinstein
Mark Crockett
Michel Brillouet
Monica Takacs
Patric Salomon
Raffaella Borzi
Raj Gupta
Raji Baskaran
Toshiba
IMEC
IBM, RF/AMS TWG
KIMM
Delphi
Lexmark
NTU
Solidus
Caliper
Fraunhofer Institute
MEMS Industry Group
MEMStaff
Sony, JEITA
Akustica
SEMI, MEMSmart
LETI
MEMS Industry Group
4m2c
IMEC
Volant Technologies
Intel
Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Rakesh Kumar
Robert De Nuccio
Ron Lawes
Sacha Revel
Scott Bryant
Shawn Blanton
Snezana Jenei
Stephane Donnay
Steve Breit
Steve Greathouse
Steve Tilden
Steve Walsh
Takashi Mihara
Tetsu Tanaka
Tony Stamper
Veljko Milanovic
Wei-Leun Fang
Wendy Chen
Xiaoming Wu
Yasutaka Nakashiba
Global Foundries
ST
Imperial College
Accutronic
MANCEF
Carnegie Mellon University
Infineon
IMEC
Coventor
Plexus
LTXCredence
MANCEF
Micromachine Center
Tohoku Univ., JEITA
IBM
Mirrorcle Technologies
NTHU
KYEC
Lexmark
Renesas Electronics, JEITA
MEMS Technology Working Group
Arthur Morris
Asif Chowdhury
Bill Bottoms
Brian Gerson
Brian Jamieson
Buzz Hardy
Chengkuo Lee
Chris Apanius
Chris van Hoof
Chuck Richardson
Dave Howard
Dimitrios Peroulis
Dominique Schinabeck
Don DeVoe
Edward Chiu
Fabio Pasolini
Fabrice Verjus
Fumihiko Nakazawa
Gilles Poupon
Goro Nakatani
Hebert Bennett
Henne van Heeren
Wispry
Analog Devices
3MTS, Packaging TWG
PMC-Sierra, RF/AMS TWG
SB Microsystems
MEMSCAP
National U of Singapore
Promeus
IMEC
iNEMI
Jazz Semiconductor
Perdue
Acutronic
University of MD
Asian Pacific Microsystems
ST
KFM Technology
Fujitsu, JEITA
LETI
Rohm, JEITA
NIST, RF/AMS TWG
enablingMNT
Hiroshi Yamada
Ingrid De Wolf
Jack Pekarik
Jae Sung Yoon
Jim Spall
Jim Mrvos
Jianmin Miao
John Rychcik
Josh Molho
Juergen Wolf
Karen Lightman
Kevin Chau
Koji Fukumoto
Marcie Weinstein
Mark Crockett
Michel Brillouet
Monica Takacs
Patric Salomon
Raffaella Borzi
Raj Gupta
Raji Baskaran
Toshiba
IMEC
IBM, RF/AMS TWG
KIMM
Delphi
Lexmark
NTU
Solidus
Caliper
Fraunhofer Institute
MEMS Industry Group
MEMStaff
Sony, JEITA
Akustica
SEMI, MEMSmart
LETI
MEMS Industry Group
4m2c
IMEC
Volant Technologies
Intel
Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Rakesh Kumar
Robert De Nuccio
Ron Lawes
Sacha Revel
Scott Bryant
Shawn Blanton
Snezana Jenei
Stephane Donnay
Steve Breit
Steve Greathouse
Steve Tilden
Steve Walsh
Takashi Mihara
Tetsu Tanaka
Tony Stamper
Veljko Milanovic
Wei-Leun Fang
Wendy Chen
Xiaoming Wu
Yasutaka Nakashiba
Global Foundries
ST
Imperial College
Accutronic
MANCEF
Carnegie Mellon University
Infineon
IMEC
Coventor
Plexus
LTXCredence
MANCEF
Micromachine Center
Tohoku Univ., JEITA
IBM
Mirrorcle Technologies
NTHU
KYEC
Lexmark
Renesas Electronics, JEITA
Subgroup Leaders
•Inertial Sensors – Philippe Robert, LETI •Microphones – Jainmin Miao, NTU •RF MEMS – Robert Tsai, TSMC •Emerging MEMS – Chris van Hoof, IMEC •Design and Simulation – Steve Breit, Coventor •Packaging and Integration- Raji Baskaran, Intel •Testing – John Rychcik, Solidus
MEMS Technology Working Group
Arthur Morris
Asif Chowdhury
Bill Bottoms
Brian Gerson
Brian Jamieson
Buzz Hardy
Chengkuo Lee
Chris Apanius
Chris van Hoof
Chuck Richardson
Dave Howard
Dimitrios Peroulis
Dominique Schinabeck
Don DeVoe
Edward Chiu
Fabio Pasolini
Fabrice Verjus
Fumihiko Nakazawa
Gilles Poupon
Goro Nakatani
Hebert Bennett
Henne van Heeren
Wispry
Analog Devices
3MTS, Packaging TWG
PMC-Sierra, RF/AMS TWG
SB Microsystems
MEMSCAP
National U of Singapore
Promeus
IMEC
iNEMI
Jazz Semiconductor
Perdue
Acutronic
University of MD
Asian Pacific Microsystems
ST
KFM Technology
Fujitsu, JEITA
LETI
Rohm, JEITA
NIST, RF/AMS TWG
enablingMNT
Hiroshi Yamada
Ingrid De Wolf
Jack Pekarik
Jae Sung Yoon
Jim Spall
Jim Mrvos
Jianmin Miao
John Rychcik
Josh Molho
Juergen Wolf
Karen Lightman
Kevin Chau
Koji Fukumoto
Marcie Weinstein
Mark Crockett
Michel Brillouet
Monica Takacs
Patric Salomon
Raffaella Borzi
Raj Gupta
Raji Baskaran
Toshiba
IMEC
IBM, RF/AMS TWG
KIMM
Delphi
Lexmark
NTU
Solidus
Caliper
Fraunhofer Institute
MEMS Industry Group
MEMStaff
Sony, JEITA
Akustica
SEMI, MEMSmart
LETI
MEMS Industry Group
4m2c
IMEC
Volant Technologies
Intel
Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Rakesh Kumar
Robert De Nuccio
Ron Lawes
Sacha Revel
Scott Bryant
Shawn Blanton
Snezana Jenei
Stephane Donnay
Steve Breit
Steve Greathouse
Steve Tilden
Steve Walsh
Takashi Mihara
Tetsu Tanaka
Tony Stamper
Veljko Milanovic
Wei-Leun Fang
Wendy Chen
Xiaoming Wu
Yasutaka Nakashiba
Global Foundries
ST
Imperial College
Accutronic
MANCEF
Carnegie Mellon University
Infineon
IMEC
Coventor
Plexus
LTXCredence
MANCEF
Micromachine Center
Tohoku Univ., JEITA
IBM
Mirrorcle Technologies
NTHU
KYEC
Lexmark
Renesas Electronics, JEITA
MEMS Industry Group
MEMS TWG
Subgroups: Devices, Design and Simulation, Packaging and
Integration, and Testing
Integration Path for Inertial Sensors
Year of Production 2011 2013 2015 2017
Integration path at the package level
6 DOF (accelero + magneto or accelero +
gyro)
9 DOF (3 axis accelero
+ gyro + magneto)
10 DOF (accelero +
gyro + magneto + pressure)
Integration path at the chip level
3-axis accelero and gyros
Integrated 6 DOF Product
Integrated 9 DOF Product
Integrated 10 DOF Product
DOF = Degrees of freedom. For example, a 10 DOF product is a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a pressure sensor.
State of the Art: 10 DOF Board Level
June 16, 2011 Analog Devices ADIS16407 iSensor MEMS-based inertial measurement unit combines a tri-axis accelerometer, a tri-axis gyroscope, a tri-axis magnetometer, and a pressure sensor in a single unit.
May 18, 2011 STMicroelectronics’ Three MEMS Sensors Provide 10 DoF. The three ST MEMS sensors include a geo-magnetic module, a gyroscope, and a pressure sensor.
Analog Devices STMicroelectronics
Grand Challenges Difficult Challenges Potential Solutions
Integration of MEMS in the Package • Standardization for MEMS packaging to support integration.
• Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity.
• Package data that can be used to accurately predict the effect of the package on device performance.
Testing of MEMS • More testing towards the wafer level. • Validated tools to predict device device
performance from wafer tests. • Methodologies for “Design for Test” or
“Design for NO Test.”
Validated accelerated life testing for MEMS
• More knowledge of the physics of failure is required to develop accelerated life tests.
• Need to share information. Individual solutions exist but are not being generalized across the industry.
Design Fabrication (Foundry)
Assembly and
Packaging
Design for test
Wafer Level Testing
Device Testing
Testing in the Manufacturing Process
Systems Integrator
Conclusion
• The back-end (packaging and test) typically consumes 2/3 of the manufacturing cost for MEMS devices.
• Most R&D investment has been in the front end (device and process development).
• The issues at the back-end which may be useful in (re)focusing future R&D efforts.
Packaging and
Testing
Device Fabrication
MEMS Manufacturing Cost R&D Investment
Device and Process
Development
Packaging and Testing