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ILD related R&D Activities @ IFCA Future Linear Collider Workshop, Sevilla, Feb. 10th
E. Currás, J.González, D. Moya, F. J. Muñoz, I. Vila, A. L. Virto., J.GonzálezInstituto de Física de Cantabria (CSIC-UC)
G. Carrión, M. Frövel.Instituto Nacional de Técnica Aeronautica (INTA)
M. RitzertUniversity of Heidelberg.
S. Hidalgo, P. Fernández, A. Merlos, D. Quirion, G. Pellegrini, V. Greco,Instituto de Microelectrónica de Barcelona (CSIC)
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Outline— A structural and environmental
monitor for Belle-2 vertex detector based on Fiber Optic Sensor (FOS)
—R&D on microstrips sensors (resistive & low signal gain)
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013, DESY. 2
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L-shape basics — Temperature & strain to displacement transducer
with custom geometry for integration in PXD— Readout speed from zero to 1KHz (vibrations)— Currently three demonstrators manufactured
[email protected], 13th DEPFET Workshop, June 12-15h,2013, RingBerg.
Contact surface
Contact ball
Locked partFBG sensors
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L-Shape Demostrators
[email protected], 13th DEPFET Workshop, June 12-15h,2013, RingBerg.
One millimiter Diameter Quartz contact ball
L-shape tipball
glued
Clamping system
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FOS Monitor Timeline2009 Oct FOS Monitor proposal
2010 Jan Omega-shape proposal
2010 Oct. FOS radiation hardness study (1.5 GRads ,3.3 1015 p/cm2)
2011 January First omega mechanical dummies
2011 Sept. FOS radiation hardness study ( 10 Mrads )
2011 Dec Proof-of-concept-prototype omega
2012 Feb Omega calibration.
2012 March New transducer design L-shape
2012 May Test in depfet mock-up at IFIC
2012 October L –shape calibration
(resolution less 1 um ,accuracy≈10 um )
2013 May Test in mock-up at IFIC (N2 atmosphere)
2014 January commissioning at PXD-SVD common test beam
D.Moya, LC2013 Tracking-Vertex session, Desy May. 30th 2013
,
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Thermal calibrations & temperature compensation
[email protected], 13th DEPFET Workshop, June 12-15h,2013,
RingBerg.
— Calibration using a SIKA thermocouples calibrator. — The sensitivity of three sensors was constant and near the same
(difference<0.6%) Maximum deviation < 3 pm (0.3 ºC)
Error X 10Error X 10
Error X 10
— Trivial approach to temperature compensation
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Displacement Calibration
[email protected], 13th DEPFET Workshop, June 12-15h,2013, RingBerg.
D.Moya, LC2013 Tracking-Vertex session, Desy May. 30th 2013
Contact ball
Contact surface
Micrometric stage
L-shape
— Displacement measured with Michelson interferometer for high precision calibration (tenth of a micron)
— Readout of L-shape compared with true position (interferometer)
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L-shape Output Stability — Short term studies (temperature constant ± 0.1° )— Continuous readout of the sensor output.— Stabilities below or about 1um (convolution with
mechanics stability)
[email protected], 13th DEPFET Workshop, June 12-15h,2013, RingBerg.
RMS ≈ 0.6 um RMS ≈ 1.1 um
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L-shape Linearity vs. Displacement — Calibration over a range of 1mm— Resolution (readout resolution) 0.5 um.— Accuracy (diff. Between inter & L-shape) ≈ 2 um
[email protected], 13th DEPFET Workshop, June 12-15h,2013, RingBerg.
Sensitivity 1.2 pm/um
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PXD – SVD Integrated test beam
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
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PXD – SVD Integrated test beam
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
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FOS Monitor: DAQ – SC integration
— Optical routing of the sensors up to the interrogating units— Readout integrated in EPICS (dedicated driver over
Ethernet ). The integration went very smooth ready since the January 6th
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
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FOS Monitor: Data: MARCO in-let & out-let lines
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
Zero degrees cooling
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FOS Monitor Data: Ambient Temp
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
Zero degrees cooling
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FOS Monitor: Ambient Temp+%RH
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
N2 injection
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FOS Monitor:Humidity measurements
— Comparing the wavelength shift of ambient sensors (naked fibers) vs. commercial Humidity sensors inside the dry box.
— Excellent linearity and sensibility after temperature compensation
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
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[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013, DESY.
Conclusions— A FOS-based temperature and humidity monitor
read-out through EPICS commissioned and running smoothly since the beginning of the test beam.
— Most of the R&D activities required for the implementation of FOS monitor (environmental and displacement) are completed. Still some more “academic “ loose ends to be completed this year.
— Next: System-wise activities for mechanical integration in Belle-II.
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PART 2 - R&D ON MICROSTRIPS
—Microstrip sensors with resistive electrodes.
—Low Gain Microstrip Sensors.
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
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R&D Motivation— Charge division in microstrips:
_ Long microstrips ladders (several tens of centimeters) proposed for the ILC tracking detectors.
_ Getting the particle hit coordinate along the strip using the charge division method.
_ Avoid the complexity of double sided sensors and the additional material of a second layer of sensors.
— Low gain segmented p-type pixels (strips) _ Implementing a small gain in the segmented diode so
we can reduce the thickness of the sensors without reducing the signal amplitude
_ Smaller contribution to the material budget.
21E. Currás - LC Workshop 27-31 May 2013, DESY
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22
Simple single-side AC-coupled microstrip detectors
X-coordinate: cluster-finding algorithms for strip detectors.
Aluminiumx
L
S1
S1=f(y)S2=f(L-y)
with resistive coupling electrodes.
AluminiumResistive material
x y
L
S1
S2
Y-coordinate: Resistive charge division method.
Resistive material: high doped polysilicon
** V. Radeka, IEEE Transaction on Nuclear Science NS-21 (1974) 51
** Electrode resistance >> preamplifier impedance.
y A2L A1+A2
=
Charge Division in uStrips
E. Currás - LC Workshop 27-31 May 2013, DESY
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23
• 256 channels• peaking time =
25ns• S/N≈20 for
standard no irradiated detectors
ALIBAVA DAQ system for microstrip detectors, based on
the Beetle analogue readout ASIC
2 Beetle chips
Pulsed DFB laser λ=1060nm
• Gaussian beam spot width ≈ 15 μm
• pulse duration 2ns
3D axis stage with displacement accuracy ≈ 10 μm
Clean room laboratory at IFCA, Santander
Proof-of-Concept Prototype
E. Currás - LC Workshop 27-31 May 2013, DESY
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Equivalent Electrical Circuit
24E. Currás - LC Workshop 27-31 May 2013, DESY
Peaking time 25ns (Beetle chip ALIBAVA DAQ
system).• rise time 2ns• Q~4fC
Detector (p+-on-n) model ***80 cells 250 μm
long
p
Vbias
e-
h+
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Signal Propagation – Linearity (Simulation)
25E. Currás - LC Workshop 27-31 May 2013, DESY
t tt1
t2
V
ParticleS1 S2 2 mm
S1
S2
y
18 mm
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26E. Currás - LC Workshop 27-31 May 2013, DESY
Systematic error=>
Ballistic deficit
R/l=2.8 Ω/μm R/l=12.2 Ω/μm
20000 events ∀measurement
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27E. Currás - LC Workshop 27-31 May 2013, DESY
Longitudinal spatial resolution for 6 MIPs signal
σA1=1.83 ADU σA2=1.80 ADU
R/l=2.8 Ω/μm R/l=12.2 Ω/μm
1.1% L => 220 μm 1.2% L => 240 μm
A2
A1+A2
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28E. Currás - LC Workshop 27-31 May 2013, DESY
• Test beam at CERN SPS Pion Beam, Nov 2012
• First successful integration and synchronization with AIDA MIMOSA pixel telescope
• Prelimirary results:• Monitoring of beam profile.
• Currently in progress:• Efficiency and resolution using tracking
information.
Test Beam Characterization
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Poly
Mimosa
Transparente
Haz RMS de 12 mm
Vista frontal del setup a escala (aproximada)
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30E. Currás - LC Workshop 27-31 May 2013, DESY
s/n test beam vs s/n radioctive source Resistive strips detector
Conventional strips detector
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Tracking (Telescopio)
Proyección plano DUT
Trazas del telescopio proyectadas en el plano del DUT
Distribución del número de trazasTotales por evento del telescopio
en el plano del DUT
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Tracking (PolyA)
Distribución del número de clustersDetectados en el DUT:Corte de 4 y 2 sigmas
No hay corte en tiempo 0-100 nsCon un corte de 20-40 ns (selecciono
el pico), no varían las resoluciones.
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X Resolution (transversal)
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Y resolution (logitudinal)
Se usan sólo los clusters que machean previamente el la posición transversal,Se toma un corte de 5 sigmas (0.025 mm).
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Summary
— In terms of position resolution the sensors behaves as predicted. Is it enough ?
— No result on efficiency due to problems with the timing sensor and wrong sensor biasing.
[email protected], 5th PXD-SVD Joint Workshop, January 22-24,2013,
DESY.
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SEGMENTED P-TYPE SENSORS WITH CHARGE AMPLIFICATION
36E. Currás - LC Workshop 27-31 May 2013, DESY
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37
Charge Multiplication- pixel detectors
We are starting the fabrication of new p-type pixel detectors with enhanced multiplication effect in the n-type electrodes, very low collection times and with no cross-talk.Three different approaches:
1.Thin p-type epitaxyal substrates2.Low gain avalanche detectors 3.3D with enhanced electric field.
Two projects funded by CERN RD50 collaboration to work on these technologies.
E. Currás - LC Workshop 27-31 May 2013, DESY
http://rd50.web.cern.ch/rd50/
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38
Low gain avalanche detectors (LGAD)
Implating an n++/p+/p- junction along the centre of the electrodes. Under reverse bias conditions, a high electric field region is created at this localised region, which can lead to a multiplication mechanism (impact Ionization).
E. Currás - LC Workshop 27-31 May 2013, DESY
285 um
N+
P
High Electric Field region leading to
multiplication
P. Fernandez et al, “Simulation of new p-type strip detectors with trench to enhance the charge multiplication effect in the n-type electrodes” , Nuclear InstrumentsandMethodsinPhysicsResearchA658(2011) 98–102.
Advantages = Thinning while keeping same S/N as standard detectors.
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39
Standard Strip Strip with P-type diffusion
0 5 10 151012
1013
1014
1015
1016
1017
1018
1019
Dopi
ng C
once
ntra
tion
(cm
-3)
Depth (µm)
Phosphorus Boron Net Doping
Strip with P-type diffusion: 2D and 1D doping profiles
Simulation of the Electric Field
E. Currás - LC Workshop 27-31 May 2013, DESY
- To obtain the manufacture parameters (doping profiles)
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40
Red laser TCT characterization
E. Currás - LC Workshop 27-31 May 2013, DESY
285 ume-
h+
Red laser (1060 nm)
Bottom injectionStandard diode n on p P-type diffusion diode
5ns
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Red laser TCT characterization
41E. Currás - LC Workshop 27-31 May 2013, DESY
Charge collection efficiencyStandard diode P-type diffusion diode