GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 1
GLAST Large Area TelescopeGLAST Large Area TelescopeData Acquisition SubsystemGamma-ray Large Gamma-ray Large
Area Space Area Space TelescopeTelescope Electronics, Data Acquisition &
Instrument Flight Software Peer Critical Design ReviewMarch 19-20, 2003
Nick VirmaniNaval Research Lab, Washington DCDAQ EEE Parts Manager
[email protected](202) - 767 - 3455
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 2
OutlineOutline
• EEE Parts Requirements• EEE Part Implementation Plan• EEE Parts Status • Plastic Encapsulated Microcircuits (PEMs)• Process Flow Chart for ASICs• Process Flow Chart for PEM screening• EEE Parts Concerns• Radiation Testing• Radiation Testing Results
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 3
EEE Parts RequirementsEEE Parts Requirements
• Requirements Summary– Parts screening and qualification per GSFC 311-INST-001,
Level 2,– Additional requirements outlined in the LAT EEE parts
program control plan, LAT-MD-00099-1 – Review and approve EEE Part Lists.– Derate EEE Parts per PPL-21
• Review and approve derating information before drawing sign-offs.
– Perform stress analysis– Parts Control Board (PCB) Approach, a partnership
arrangement with NASA/GSFC parts engineer and code 562.
• Part lists are reviewed and approved by the project PCB prior to flight procurements.
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 4
DAQ EEE Parts Approval PlanDAQ EEE Parts Approval Plan
• DAQ parts approval process– Parts of DAQ boards are submitted combined, by LAT,
into lists organized by part types (C, R, IC, connector, etc)• Contain all parts requested to be used by DAQ
engineers– This parts list has been reviewed by the PCB – Second step is to link the approved parts back to the
individual assemblies by the LAT (in progress)– Submission of assembly parts-lists containing already
approved parts (before CDR)– Advantage is that engineers use as many common and
approved parts as possible
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 5
EEE Parts StatusEEE Parts Status
• Resistor – total 93 types of resistors submitted– 91 approved– 2 not approved and require additional screening and
testing. • Capacitor – total 70 types of capacitors submitted
– 45 approved– 4 require a part number change– 14 are approved with remarks for special procurement
clauses– 7 not approved (won’t be used)
• Discrete Components – total 18 types of discrete components submitted– 8 approved– 10 not approved, suggested MIL spec part numbers for
commercial parts.
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 6
EEE Parts StatusEEE Parts Status
• Integrated Circuit – total 33 types of ICs submitted– 15 approved– 18 not approved yet
• Connectors – total 17 types of connectors submitted– 6 approved– 11 require additional screening and qualification as per
311-INST-001.• Actel FPGA’s – total 2 types (54SXA32, 54SXA72)
– Approval in progress
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 7
EEE Parts StatusEEE Parts Status
• Discussing EEE parts availability weekly, to support fabrication schedule which includes:– Call manufacturers and suppliers to expedite delivery as
required.– Work with test facilities to expedite delivery schedule.
• Requires performing 100% incoming inspection.• Stress analysis of all parts on the parts lists yet to be performed.
This will be performed after final selection of part types for the required application on the PWB assembly.
• Perform screening and qualification tests as required.• Held regular meeting with GSFC Parts Engineer to resolve any
parts-related issues and approve parts though the Parts Control Board (PCB).
• Attribute data for screening and lot specific qualification/QCI data shall be reviewed for acceptance of parts for flight.
• Parts Identification List (PIL) and As-built parts lists is maintained after final selection of parts for PWB assemblies.
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 8
Plastic Encapsulated Microcircuits (PEMs)Plastic Encapsulated Microcircuits (PEMs)(Packaged parts, ASICs, ADC, DAC)(Packaged parts, ASICs, ADC, DAC)
• Total 5 types of PEMs used on DAQ boards.• ASICs are fabricated using Agilent processes and packaged
by ASAT Hong Kong (QML approved) will be tested, screened, and qualified by SLAC.
• ADC and DAC are manufactured by Maxim from a single wafer and assembly lot and parts are fully tested, screened and qualified prior to receipt at SLAC by NRL.
• PEM parts will be sample screened (min. 10% of lot size, lot size to be greater than 200 pieces) which includes temperature cycle, initial electrical parameters, dynamic burn-in, final electrical tests which includes static test at +25 degrees C, dynamic and functional at +25 degrees C, and switching test at +25 degrees C, CSAM, and final visual.
• Screening data shall be reviewed for use of balance quantity on the lot for flight applications.
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 9
Plastic Encapsulated Microcircuits (PEMs)Plastic Encapsulated Microcircuits (PEMs)(Packaged parts, ASICs, ADC, DAC)(Packaged parts, ASICs, ADC, DAC)
• Each screened PEM type will be qual tested which includes DPA, preconditioning, temperature cycling, HAST, CSAM, and electrical test.
• Assembled PWB will be subjected to environmental stress screening (ESS) prior to conformal coating, which includes thermal cycling, dynamic burn-in at –30 degrees C to + 85 degrees C, and 100% visual inspection.
• All parts will be handled using ESD precautions and will be stored in nitrogen cabinets.
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 10
Process Flow Chart for ASICs (3 Types)Process Flow Chart for ASICs (3 Types)
WAFERS RECEIVE FROM MOSIS USING
AGILENT PROCESS
INSPECTIONWAFER MOUNT
PROCEDURE
WAFER SAW
PROCEDURE
OPTICAL QC GATE
2ND OPTICAL
INSPECTION
DIE ATTACH
ADHESION
CONTROL MONITORS
LEAD FRAME SELECTION
DIE ATTACH
CURE
WIREBOND WIREBOND MONITOR
3RD OPTICALQC GATE
DIE ATTACH
MONITOR
3RD OPTICAL
INSPECTION
MOLDING
Scanning Electron
Microscope (SEM)
Inspection
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 11
Process Flow Chart for ASICs (3 Types)Process Flow Chart for ASICs (3 Types)
Molding Compound
Molding
Molding Monitor
Post Mold Cure
Trim
Trim Monitor
Mark
Mark Monitor
Mark Cure Plating
Plating Monitor
Strip Visual
Trays / Tubes
Form
Form Monitor
Final Inspection
QA Scan Buy-off
Lead Scan
Dry Bake
Final Visual QC Gate
Inspection Pack
Packing Material
Ship to testing facility
(NRL/subcontractor) for testing
CSAM20 pcs.from lot
Decision for acceptance
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 12
PEM (ASICs, ADC, DAC) Screening FlowPEM (ASICs, ADC, DAC) Screening FlowSingle Wafer Lot and Single Manufacturing LotSingle Wafer Lot and Single Manufacturing Lot
CSAM from sample lot
20 samples for each part type
Prepare test fixtures for burn-in, prepare test programs and
verify the functionality of burn-in boards for 10% screening of parts
100% Thermal cycle-30 degrees C to
125 degrees C (20 cycles) unpowered
100% Functional test at room temperature
Select samples 10% from this lot and store 90% in N2
purge control room after baking
Radiograph (20 pieces)
100% Receiving Inspection
LAT instrument requirement Qual –30 degrees C to +50 degrees C, acceptance -20 to 40 degrees C, operational +25 degrees C, Radiation testing TID – 4.5K, SEE immune LET > 37 mev/mg/cm2, Humidity Control 30 to 45%, and 100% GSFC Parts Branch Involvement. 100% screening on 10% of lot size. Lot size should be > 200 pieces, otherwise perform screening on the entire lot.
Destructive Physical Analysis.
Sample includes radiography
Burn-in 168 hours for 10% part at 100
degrees C but do not exceed junction temp.
100% Functional Test and PDA not to
exceed 5%
Parts Control Board (PCB) to make decision
to use the balance of part i.e., 90% of the parts on the basis of test data
review
In parallel, select 30 + 22 parts from 10% screened lot for qual. of parts and follow qual. plan, review results when testing is
complete
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 13
PEM (ASICs, ADC, DAC) Screening FlowPEM (ASICs, ADC, DAC) Screening FlowSingle Wafer Lot and Single Manufacturing LotSingle Wafer Lot and Single Manufacturing Lot
Survey and select flight qualified
assembly house, profile reflow machine and prepare sample
flight board. Check the board using test
program from previous step
Prior to assembly, verify 100% integrity of
fight board and test program, which will be
used for testing of assembled board, run
verification test on sample assembled
boards
Assemble flight boards using proven
and approved methods. Mandatory
inspection points during assembly
100% Inspection of assembled boards
100% electrical verification of flight
board using qualified test program
100%, Thermal cycle -30C to 85C
on assembled boards, unpowered
100% Visual Inspection
Bake 90% flight parts and bag parts
in nitrogen purge bags, (only if any of
the bags were opened)
Bake 10% screened parts and bag parts
in nitrogen purge bags. These parts
will be used for rework, repair of
assembled boards and for spares only
100% Dynamic burn-in boards at
85C with continuous monitoring using the same test program
Review results, calculate deviations
in the parameter from the previous
tests
100% Visual Inspection
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 14
PEM (ASICs, ADC, DAC) Screening FlowPEM (ASICs, ADC, DAC) Screening FlowSingle Wafer Lot and Single Manufacturing LotSingle Wafer Lot and Single Manufacturing Lot
Rework and replace boards, if any, using the screened parts
from 10% lot
Perform 100% electrical inspection using the same test
program after rework
Conformal coat the boards
Perform 100% electrical verification using the same test
program
Store flight boards in nitrogen purge
storage
Obtain approval of PCB
Flight boards ready for next step
Present data to the Parts Control Board
(PCB)(Screening & Qualification)
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 15
PEM Qualification on 30 + 22 Parts PEM Qualification on 30 + 22 Parts from Screened Lotfrom Screened Lot
• Preconditioning for moisture intake and reflow simulation (30pcs)
• Highly Accelerated Stress Test (HAST) (30pcs)– Unbiased HAST – 168 hrs at maximum temperature the
part can operate and 85% RH– Electrical Testing at –30 degrees C, +25 degrees C, and +85
degrees C.• C-Mode Scanning Acoustic Microscope (CSAM) as per
IPC/JEDEC, J-035 (15pcs).• Destructive Physical Analysis (5pcs)• Operation Life Test
– As per MIL-STD-883, method 1005, condition D, 1000 hrs 22 pieces from flight screening lot.
– Electrical Testing– Review qualification report and data with Parts Control
Board
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 16
EEE Parts ConcernsEEE Parts Concerns
• ASICs– Packaging of ASICs, screening, and qualification.– Certify subcontractors for packaging, testing, and
qualification.– Radiation testing (TID, SEE, and SEU)
• ADC & DAC– Screening and qualification of Maxim parts and radiation
testing.– To mitigate risk, EM sample parts were evaluated and no
anomalies were noticed.• Parts lists yet to be finalized• Derating and stress analysis to be performed after selection
of parts for each individual PWB assembly (in progress)• Thermal analysis of PWB to be performed (in progress)
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 17
Radiation TestingRadiation Testing
• All EEE parts are being reviewed by PCB and screened for radiation susceptibility against the radiation specification defined in GLAST 433-SPEC-0001
• ASIC radiation testing was performed on similar engineering parts produced using similar processes and materials.
• Maxim ADC and DAC were tested and met requirements.
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
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BackupBackup
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
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EEE Parts Implementation PlanEEE Parts Implementation Plan
• Part lists are reviewed and approved by the project PCB prior to flight procurements.
• Special considerations include:– Radiation evaluation of all active components– Radiation testing (TID and/or SEE ) when necessary– Parts stress analysis– PIND testing on all cavity devices– Destructive Physical Analysis (DPA), when applicable– Pre Cap or sample DPA on semiconductors, microcircuits
and hybrids devices as required– Life Testing if Quality Conformance Inspection (QCI) data
within one year of the lot being procured is not available– No pure tin, cadmium, and zinc plating is allowed
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
Nick Virmani 20
EEE Parts Implementation PlanEEE Parts Implementation Plan
• Special considerations include cont’d:– 50V ceramic capacitors require 850C/85RH low voltage
testing– Mandatory surge current testing on all tantalum
capacitors– Plastic Encapsulated Microcircuits requires special
evaluation as outline in the EEE parts plan– Age control requirements. Lot Date Code (LDC) older than
9101 requires DPA and room temperature re-screen– Parts traceability from procurement to assembly of
boards.– GIDEP Alerts & NASA Advisories review and disposition– Parts Identification list (PIL) includes LDC, MFR,
Radiation information on the flight lot
GLAST LAT Project DOE/NASA DAQ Peer Critical Design Review, March 19-20, 2003
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Radiation TestingRadiation Testing
• SEE Rate and Effects Analysis:– SEE rates and effects shall take place based on threshold
LET (LETth) as follows:
SEE immune is defined as a device have an LETth > 37 MeV*cm2/mg
– Our goal is to test each part type (not previously radiation tested) to the above requirements.
Device Threshold Environment to be AssessedLETth < 15 MeV*cm2/mg Cosmic Ray, Trapped Protons, Solar
Heavy Ion and Proton
LETth =15-37 MeV*cm2/mgLETth > 37 MeV*cm2/mg
Cosmic Ray, Solar Heavy IonNo analysis required