Transcript

Advanced Routingin Changing Technology

LandscapeHardy Leung, MagmaISPD 2003

Overview

•Introduction- Problem solved?

•Routing Challenges (selected)- Complex spacing rules- Transitional pitches- Process antenna rules

•Opportunities (selected)- Redundant vias- Wire spreading, widening, and filling- OPC- and PSM-aware routing

•Conclusion

Introduction

•The Routing Flow- Global routing

Focused on congestion, capacity, prediction (for placement)

Global view, supply/demand-based

- Detailed routing Focused on design-rule correctness (DRC) Local view, model complex design rules, pins

- Track routing (optional) Bridge the gap between GR and DR Optimization opportunity for timing, noise

- Other combinations Simultaneous GR-TR-DR, hierarchical routing, …

Introduction (cont.)

•Academic Focus- Net-based topology generation- Congestion analysis- Global routing

•Industrial Focus- Detailed routing with complex design rules- Very high capacity (10M gates and beyond)

•The disconnect- Industry has not benefited from academia for a

while in this area- The classical DR problem is perceived as “solved”

(only grunt work or implementation details remain)

Introduction (cont.)

•Classical Detailed Routingobstacle

pin

Introduction (cont.)

•Classical Detailed Routing- Mapped into a graph problem- Solved with Dijkstra’s algorithm or variants- Common thought

nanometer design rules merely implementation details

•Reality – Devil’s in the Detail- 90nm brings about a new set of challenges- New rules- Tightening of existing rules- Capacity- Prototype of a router may take 3 months; Maturity will take

5 years- Appreciation for nanometer routing problem is much

needed Design rules are KEY Must handle high capacity

Overview

•Introduction- Problem solved?

•Routing Challenges (selected)- Complex spacing rules- Transitional pitches- Process antenna rules

•Opportunities (selected)- Redundant vias- Wire spreading, widening, and filling- OPC- and PSM-aware routing

•Conclusion

Routing Challenges

•Complex Spacing Rules- Width-dependency, length-dependency, halo

•Transitional Pitches- Drastic difference in pitches and consequences

•Process Antenna Rules- Complex rules, tightened constraints

•Routing in Uncertainty (physical OCV)- How to reduce sensitivity to process variation

•Interaction Between Complex Design Rules- Redundant via addition antenna violations- Antenna fixing timing closure issues (due to addition of

vias)- Transitional pitches Hard to fix antenna with jumpers

•… (many more) …

Complex Spacing Rules

•Evolution of Spacing Rules- Per-layer constant

- “Fatwire” spacing Special spacing for very fat wire (20X minimum width)

- Width-dependent spacing Spacing is expressed as a function of max(W1, W2)

- WW-dependent spacing Spacing is expressed as a function of W1, W2

- WL-dependent spacing Spacing is expressed as a function of L, max(W1, W2)

Complex Spacing Rules (cont.)

•Evolution of Spacing Rules (II)- Parameters are tighter

0.18u Default width is 0.4u, fatwire is 10.0u (ratio = 25X)

0.13u Default width is 0.2u, fatwire is 0.3u (ratio = 1.5X)

- Additional modifiers are introduced Halo (disconnected vs. connected) Parallel run-length (and how it should be measured)

Complex Spacing Rules (cont.)

•Consequence- Fatwire will be created and complex spacing rules

will be triggered by signal router No longer a static concept

- Notch and hole filling cannot be post-processed Must be modeled, detected, and filled (or avoided) during

routing

- Advanced polygon analysis is needed during routing False positive and false negative are both unacceptable

- Failure to avoid and/or detect fatwire correctly may cause non-convergence Route DRC detected Route again DRC again …

Complex Spacing Rules (cont.)

•Case I – Notch Filling- Need polygon-based

fatwire analysis with halo

- Actual violation is far away from the notch

notch

fatwirehalo

Fatwire DRC

Complex Spacing Rules (cont.)

•Case II – Tricky Pin Geometries- Pins may be designed just one notch shy of

fatwire

- Any non-trivial connection may result in spacing violations

Complex Spacing Rules (cont.)

•Case III – Fatwire Created During Routing- Individual wires and vias look clean

- Not if combined

0.9u

M4

M5

M6 M6M5

M4

0.9u

1.8u

Complex Spacing Rules (cont.)

•Classical Detailed Routingobstacle

pin

Complex Spacing Rules (cont.)

•Pure Graph-based Approach has Limitation- Case I – Notch filling

Not easy to model

- Case II – Tricky pin geometries Can “worst-case” it by disabling non-trivial connection

- Case III – Fatwire created during routing Not easy to model

Transitional Pitches

•Definition of routing grids- Typically at least the line-to-”via” spacing

- In general, line-to-upvia != line-to-downvia

Locallayers

Intermediatelayers

Globallayers

Transitional Pitches (cont.)

•In case of major pitch change- Recommend use of line-to-downvia for pitch

efficiency

- Global, track, detailed routers must understand and manage the pitch transition

Transitional Pitches (cont.)

•Understand and model upvias- Global Router

Minimize the use of upvias on transitional layers

- Track Router Align upvias to the same tracks if possible

- Detailed Router Change in ripup/reroute algorithms Shift vias so that it blocks 2 tracks instead of 3 tracks

- Antenna Fixer Judicious use of jumpers between layer groups

Process Antenna Rules

•Design Requirement- Total charge accumulated on metal connected to

a polysilicon gate during any stage of metalization cannot exceed a certain threshold

- Usually expressed as: WA / GA < ratio

- The antenna fixing effect of diffusion (a discharge path) can be model as: WAd / GAd < ratiod

WAd – diffusion reduces per-unit-area charge accumulation

GAd – diffusion increases the effective gate area

Ratiod – higher tolerance when diffusion is present

Process Antenna Rules (cont.)

•Antenna Fixing- Jumpers (or bridges) break long wire

- Diodes introduce diffusion

G

G

jumper

Process Antenna Rules (cont.)

•Antenna Fixing- Jumpers (or bridges) break long wire

- Diodes introduce diffusion

G

G

Diode (diffusion)

Process Antenna Rules (cont.)

•Antenna Fixing- Jumpers (or bridges) break long wire

- Diodes introduce diffusion

- Buffering (a way to break long wires)

- Sizing (to increase the gate area)

Process Antenna Rules (cont.)

•How Difficult is the Problem?- Let gate-strength(g, L) be the maximum length

of a wire with minimum width on layer L that can be connected to the gate g without causing antenna violation

- In other words, gate-strength(g, L) = ratio * g / widthL

- A related concept, diffusion-strength(d, g, L)

G

Process Antenna Rules (cont.)

•Gate and Diffusion Strengths are Functions of- process + library- foundry (different modeling, conservatism)

•Difficulty of Antenna Fixing- Gate and diffusion strengths are useful metrics to

measure how difficult it is to fix antenna violation- 0.18u

Gate strength ~ 1000u (trivial to fix) Infinite diffusion strength

- 0.13u / 90nm Gate strength ~ 100u Worst case, 15u (very poor cell design) Limited diffusion strength

Process Antenna Rules (cont.)

•Advance in Process Technology …- Reduced gate strength

Process antenna effect very easy to be violated Limited degree of freedom in antenna fixing

- Reduced diffusion strength Diffusion no longer a panacea Accurate blackbox abstraction needed (can’t waive)

- Transitional pitches surgical jumper may not be feasible due to fat

overhang

- Pervasive power mesh for IR-drop surgical jumper may not be feasible since upper layers

blocked

Process Antenna Rules (cont.)

•How to Fix it Then?- More powerful jumper techniques

- Antenna-aware global routing WARNING, most preventive implementation will not

work

- Hierarchical antenna checking and fixing

- Buffering and sizing with antenna-awareness (in addition to timing, noise, crosstalk, EM, …)

Overview

•Introduction- Problem solved?

•Routing Challenges (selected)- Complex spacing rules- Transitional pitches- Process antenna rules

•Opportunities (selected)- Redundant vias- Wire spreading, widening, and filling- OPC- and PSM-aware routing

•Conclusion

Redundant Vias

•Single-cut via Double-cut via- Improve yield and reliability

- Based on post-processing

Redundant Vias (cont.)

•Many Different Choices- 1x2, 2x1, centered, biased- 70% to 80% coverage even for very congested

designs

•Observations- Need room on only one of the two adjacent layers- Rare to see congestion on all layers everywhere

•Additional Degree of Freedom- DR creates local detour, or enforce double vias in

uncongested regions- TR assigns track in redundant-via friendly ways- GR avoids congestion on both layers whenever

possible (good to do so for routability anyway)

Redundant Vias (cont.)

•More Aggressive Redundant Vias- Can achieve 90% coverage

•Caveats- Foundry technology may negatively impact

feasibility If redundant vias have fat via overhang

- Redundant vias may introduce antenna violation Dramatically tightened antenna rules on via layers

- Redundant vias will change timing Speed up some paths, slow down some Therefore, it needs to be done within P&R framework

Wire Spreading and Widening

•Again, for Yield and Reliability- Detailed router (or post-processing) can spread

wires whenever possible

- Better result if global router and track router spread the wires in a more global scope

- Potential consequence in timing, crosstalk, … Therefore, it needs to be done within P&R framework

Wire Spreading and Widening (cont.)

•Spreading and Widening

Metal Filling

•Objective- Satisfy metal density requirement

•Evolution of Density Requirements- 0.18u – 20% to 80%, whole chip

- 0.13u – 20% to 80%, sliding window of 300u x 300u (150u step size)

- 90nm – 25% to 75%, 300u x 300u

- 90nm – 30% to 70%,1000u x 1000u

- 90nm – 45% to 50%, whole chip

Metal Filling (cont.)

•More Requirements- Metal filler (transitively) tied to power/ground

No floating metal

- Shallow ties no big branch dangling from power/ground mesh Big branches behave like floating metal

- Metal filling with minimal impact on timing Stay away from signal geometries whenever possible

- Other Idea Metal fillers as additional power mesh for better IR-

drop? Hmm…

Metal Filling (cont.)

•Hard Problem (much harder than before)- Density requirement hard to be fulfilled

Customers complained that foundry-recommended dummy floating patterns will FAIL their requirements

Low-density area is easy to fill High-density area already satisfies the requirements Medium-density, fragmented regions are problematic

- Need Adaptive density-driven (PG-tied) metal filling

Metal Filling (cont.)

Metal Filling (cont.)

Metal Filling (cont.)

Metal Filling (cont.)

Metal Filling (cont.)

OPC- and PSM-Aware Routing

•Impact of Lithography on Design Rules- Many tricky design-rules

Guardbands, workarounds to discourage or prohibit undesirable features, and to allow effective application of RET

Rules are more and more complicated

- Rules are absolute DRC deck – pass or fail But what about “recommended rules”?

- Opportunity Recommended rules

•Redundant vias, wire spreading Understanding of yield-and-manufacturability within routers

or post-processors produce high-quality layout (added value)

OPC- and PSM-Aware Routing (cont.)

•Routing with PSM Consideration- Not a concern in 0.13u, arguable in 90nm

- Will be needed in 65nm

- Can the router help? Maybe

- Idea – Most routing are done in preferred direction How about extra width and spacing requirement in the

preferred direction so that there is never a need to phase-shift any geometry in non-preferred direction?

Extra resource consumption may be negligible

OPC- and PSM-Aware Routing (cont.)

•Direction-dependent Width and Spacing

Overview

•Introduction- Problem solved?

•Routing Challenges (selected)- Complex spacing rules- Transitional pitches- Process antenna rules

•Opportunities (selected)- Redundant vias- Wire spreading, widening, and filling- OPC- and PSM-aware routing

•Conclusion

Conclusion

•Problem Solved? Not•Challenges? Definitely

- Complex spacing rules- Transitional pitches- Process antenna rules- … (many more) …

•Opportunities? Plenty- Redundant vias- Wire spreading, widening, and filling- OPC- and PSM-aware routing- … (many more) …

Conclusion (cont.)

•How can Academia Help?- Build real routing system

New techniques Must handle non-trivial capacity Must handle at least the most basic rules – spacing,

width, vias

- Understanding and appreciation of nanometer rules Observation – GR written by researchers with DR

experience are in general of much higher quality

- Take advantage of routing as a yield optimization technique Significant opportunity and added value

Thank You


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