wacker chemical expands its biotech manufacturing operations
TRANSCRIPT
Munich, Germany — Wacker ChemieAG has expanded its biotech manu-facturing operations through the ac-quisition of SynCo Bio Partners B.V.,in Amsterdam. The new site joins
Wacker Biotech GmbH’s facilities inJena and Helle, Germany. The facili-ty effectively doubles WackerBiotech’s capacities.
Divided into four segments, the
Wacker Group manufactures sili-cones, polymers, polysilicon, and cre-ates tailored biosolutions for a vari-ety of high-growth end-user sectors.Markets served include photo-voltaics, electronics, and pharmaceu-ticals, as well as household and per-sonal care.
In 2019, the group generatedsales of roughly $5.5 billion, withabout 50 percent of sales generated
Cambridge, MA — A new system de-vised by researchers at MIT canmonitor the behavior of all electricdevices within a building, ship or fac-tory, determining which ones are inuse at any given time and whetherany are showing signs of an immi-nent failure. When tested on a U.S.Coast Guard cutter, the system pin-pointed a motor with burnt-outwiring that could have led to a seri-ous onboard fire.
The new sensor, whose read-ings can be monitored on an easy-to-use graphic display called a NILM(non-intrusive load monitoring)dashboard, was described in theMarch issue of IEEE Transactionson Industrial Informatics, in a paperby MIT professor of electrical engi-neering Steven Leeb, recent gradu-ate Andre Aboulian MS ‘18, and sev-en others at MIT, the U.S. Coast
Guard, and the U.S. Naval Academy.The system uses a sensor that
is attached to the outside of an elec-trical wire at a single point, withoutrequiring any cutting or splicing ofwires. From that single point, it cansense the flow of current in the adja-cent wire, and detect the distinctive“signatures” of each motor, pump orpiece of equipment in the circuit byanalyzing tiny, unique fluctuationsin the voltage and current whenevera device switches on or off. The sys-tem can also be used to monitor ener-gy usage, to identify possible efficien-cy improvements and determinewhen and where devices are in use orsitting idle.
The technology is especiallywell-suited for relatively small, con-tained electrical systems, such asthose serving a small ship, building,or factory with a limited number ofdevices to monitor. In a series oftests on a U.S. Coast Guard cutterbased in Boston, the system provideda dramatic demonstration.
About 20 different motors anddevices were being tracked by a sin-gle dashboard, connected to two dif-ferent sensors, on the cutter USCGCSpencer. The sensors, which in thiscase had a hard-wired connection,showed that an anomalous amount
THE GLOBAL HI-TECH ELECTRONICS PUBLICATION May, 2019
Wacker Biotech B.V. is a full-service contract manufacturer of biopharmaceutical proteins on microbial systems.
New Monitor Finds ElectricalFailures Before They Happen
Wacker Chemical Expands itsBiotech Manufacturing Operations
Continued on page 6
Next Month’s Focus
Components and
Distribution
Munich, Germany — Transistors areeverywhere, but they often operateonly within a restricted currentrange. Ludwig-Maxmilians-Univer-sitaet (LMU) physicists have now de-veloped an organic transistor thatfunctions under both low and highcurrents.
The pressure to reduce econom-ic and environmental costs in circuitdesign has caused regular inorganicsemiconductor dimensions of below100 nanometers to become standard.However, organic semiconductorshave not been able to keep up. Theirperformance, in terms of charge-car-rier transport, is considerably worse.
Organic structures offer otheradvantages. They can be printedeasily on an industrial scale, theirmaterial costs are lower and theycan be applied transparently to flex-ible surfaces.
Thomas Weitz, LMU physicsprofessor and member of the Nano-systems Initiative Munich, and histeam are working intensively on theoptimization of organic transistors. Intheir latest publication in NatureNanotechnology, they describe thefabrication of transistors with an un-usual structure, which are tiny, pow-erful and versatile. By carefully tai-loring a small set of parameters dur-ing the production process, they havebeen able to design nanoscale devicesfor high or low current densities. Theheart of the innovative concept is theuse of an atypical geometry, which al-so facilitates assembly of thenanoscopic transistors.
“Our aim was to develop a tran-
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Page 18
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For decades, Gordon Moore’s prediction that the number of transistors onan integrated circuit doubles about every two years, has held true. In1965, Moore, then the director of R&D at Fairchild Semiconductor,
wrote an internal paper that predicted that the number of components on achip would double every year until 1975. In 1975, at an IEEE InternationalElectron Devices meeting, Moore revised his prediction to a doubling everytwo years, due to changes in photolithography, the size of wafers and what hetermed “circuit and device cleverness.”
“Moore’s Law,” as it was labeled by Caltech professor Carver Mead, hascontinued to progress on track. Recently, however, experts have predictedthat once commercial chip features shrink to around five nanometers in 2020,the investment in R&D and new process technology may be too great to justi-fy going any further. Another problem is that at this scale, quantum physicscomes into play and the behavior of electrons becomes somewhat unpre-dictable. Electrons “tunnel” through transistors’ gate oxide layers, making itdifficult to control their on and off states.
For years, we have been speculating about the future after Moore’s Law.Peter Lee, vice president of AI and research at Microsoft once quipped,“There’s a law about Moore’s Law; the number of people predicting the deathof Moore’s Law doubles every two years.” Multigate and tri-gate transistormodels have been developed to help extend the life of the law, as well as mul-tiprocessor and multicore systems, but fundamentally new types of computingare required.
Currently, quantum computing is being explored as a solution by compa-nies that include IBM, Google, Rigetti Computing, and Intel, among manyothers. Quantum computers use quantum bits, typically electrons or photons,to represent combinations of 1 and 0 through the phenomenon of superposi-tion. Other possibilities include optical communication, using light ratherthan electricity to communicate inside a chip, and neuromorphic computing, aconcept developed by Mead that attempts to model computing systems on theneurons in the human brain.
It is likely that we will see a range of new types of chips that are special-ized for different tasks, such as machine vision and cloud computing. This was-n’t as necessary when conventional micro-processors were advancing regularly, offer-ing reliable increases in speed. Now, asMoore’s Law winds down, flexibility willhave to make up the difference. r
If you are one of the 3.2 billion people on Earth that use the internet, youare both a consumer and a product. Over the last few years, the term “da-ta broker” has come to define a type of business that scoops up users’ per-
sonal information from search results, purchase histories, publicly availablegovernment records, social media activity, and many other sources, and sellsit. These companies analyze and classify huge swathes of data, which can beused by their customers to target consumers with advertisements, assessthe riskiness of each individual’s lifestyle or determine their eligibility for anew job.
The problem is that this enormous amount of data collection and tradinghas been going on behind the scenes, without any direct relationship betweenthe broker and the subjects of these detailed profiles. Consumers in the U.S.have little to no power over the breadth of data collected, its longevity or howit is traded. However, new regulation is finally in sight.
In a landmark piece of legislation that went into effect in February, Ver-mont has become the first state in the country to pass a law requiring busi-nesses that collect and sell residents’ data to register as data brokers. As ofMarch this year, 121 companies had registered. While the law doesn’t requirebrokers to provide an opt-out of data collection — or to specify what they col-lect, about whom, and who buys it — it does require them to make it easy fora consumer to find opt-out policies, provided they have one.
These 121 companies make up a motley crew, including ZoomInfo andWhite Pages, two people-search services, Equifax and Experian, the credit re-porting agencies, and Acxiom, Oracle and Innovis, which are some of thelargest names in advertising and marketing.
Acxiom, for example, compiles up to 3,000 attributes to build a personalprofile that it provides to customers. This profile includes age, gender, educa-tion, employment, 45 years of historical name changes and residential infor-mation, the number of purchases made with a credit card in the previous 24months, religion, health interests, political views, relationship status, andnumber of children, to name only a few.
This information is then used to infer more attributes, such as whethera couple is planning to have a baby or adopt a child, if somebody is likely tofile taxes in April, further details about the person’s home, including numberof bedrooms, and if they are more of a social “influencer” or more socially “in-fluenced.”
Two of the most prominent figures in tech recently addressed the issueof consumer data protection in separate op-eds, Apple CEO Tim Cook, andFacebook CEO Mark Zuckerberg. From Cook’s point of view, individualsshould have much more control over the data that companies collect, how it isstored, and if it will be sold. He believes the Federal Trade Commission shouldcreate a clearinghouse that requires all data brokers to be registered, an ex-panded version of Vermont’s recent regulation.
“Consumers shouldn’t have to tolerate another year of companies irre-sponsibly amassing huge user profiles, data breaches that seem out of controland the vanishing ability to control our own digital lives,” wrote Cook in Time,in January.
In the Washington Post Zuckerberg argued that “Effective privacy anddata protection needs a globally harmonized framework,” in support of ex-panding the EU’s General Data Protection Regulation into the United States.The GDPR includes provisions for consumers to obtain copies of their datafrom businesses, as well as the right to be forgotten, known as Data Erasure.
These comments instantly came under fire as “self-serving,” as a wayfor each of these tech giants to hedge their bets and be in control of policy asit develops, rather than suffer with their competitors. Regardless, it seemsobvious that some regulation is necessary, no matter who brings up the dis-cussion.
In some ways it could be better that tech companies have a hand in de-veloping policy, rather than leaving it to an uninformed and inexperiencedfederal or state committee. On the other hand, it appears that “some restric-tions apply” already, if only one lives in the EU. r
Page 4 May, 2019www.us- tech.com
SOUNDING OFF
By Michael Skinner
Editor
I am a Commodity
Tech-Op-edTech-Op-ed
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By Jacob Fattal
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No Moore: The End of a Law
May, 2019 Page 5www.us- tech.com
See at NEPCON China, Booth 1G01 and SMTconnect, Hall 4 Booth 546
Kaiserslautern, Germany — In early2018, cybersecurity researchers dis-covered two security flaws they saidwere present in almost every high-end processor made and used by ma-jor companies. Known ominously asSpectre and Meltdown, these flawswere troubling because they repre-sented a new type of breach not pre-viously known that could allow hack-ers to infer secret data — passwords,social security numbers and medicalrecords — from the way computerspre-calculate certain data using ar-chitectural features called “out-of-or-der execution” and “speculative exe-cution” to speed up their processes.
Spectre and Meltdown attackshave emerged in the past year andmore are expected. In the “covertchannel attacks,” no data everchanges hands between the hackedprocessor and the attackers trying tosteal data. The information is inferredin the way that an answer in a cross-
word puzzle can be guessed, despitenot knowing it. Such hacks, therefore,are nearly impossible to spot.
Computer scientists at TUKaiserslautern, Germany, in collabo-ration with researchers from Stan-ford University in California, havetaken a novel approach to exposingpotential flaws in new chip designs.It is an algorithm called Unique Pro-gram Execution Checking (UPEC).
UPEC analyzes micro-architec-tural side effects of design decisionsand detects if they can be exploited tocreate covert channels. What is keyis that UPEC is exhaustive. It takesinto account all possible programsthat can run on the processor.
In real-world tests, the researchteam had UPEC analyze severalopen-source chip designs and identi-fied a number of previously unknownflaws. The team also demonstratedthat such weaknesses easily resultfrom normal design processes andcan affect virtually any processor —
not just high-end processor types.Web: https://engineering.stanford.edu r
of power was being drawn by a com-ponent of the ship’s main diesel en-gines called a jacket water heater.
At that point, according to Leeb,crewmembers were skeptical aboutthe reading but went to check it any-way. The heaters were hidden underprotective metal covers, but as soonas the cover was removed from thesuspect device, smoke came pouringout, and severe corrosion and brokeninsulation were clearly revealed.
The system is designed to beeasy to use with little training. Thecomputer dashboard includes dialsfor each device being monitored, withneedles that will stay in the greenzone when things are normal, butswing into the yellow or red zone
when a problem is spotted.Detecting anomalies before they
become serious hazards is the dash-board’s primary task, but Leebpoints out that it can also performother useful functions. By constantlymonitoring which devices are beingused at what times, it could enableenergy audits to find devices thatwere turned on unnecessarily whennobody was using them, or spot less-efficient motors that are drawingmore current than their similarcounterparts. It could also help en-sure that proper maintenance andinspection procedures are being fol-lowed, by showing whether or not adevice has been activated as sched-uled for a given test.
Web: https://news.mit.edu r
Tech-Op-Ed ........................... 4
Tech Watch ........................... 10
People.................................... 12
Business News......................... 14
Business Briefs........................ 15
Management......................... 16
EMS .................................... 18
Electronic Mfg. Prods............. 26
Production............................ 56
Partnering............................. 58
Distribution........................... 60
New Products....................... 108
High-Tech Events................... 120
Editorial Calendar................. 120Advertisers Index................... 122
Special Focus:
SMT and Production.................. 62
Product Preview:
Multishow.................................. 78
Page 6 May, 2019www.us- tech.com
Contents
Monitor Finds Electrical Failures Before They HappenContinued from page 1
Algorithm AutomaticallySpots Hacks in Chips
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by the group’s silicones division.The global production and serv-
ice network operated by WackerBiosolutions now comprises seven pro-duction sites and four technical cen-ters in Germany, Singapore, the U.S.,and China. The integrated site inBurghausen, Germany, suppliesfine chemicals and polyvinyl ac-etate solid resins, with other resinsprovided from the company’s facili-ty in Nanjing, China. The Ed-dyville site in Iowa, U.S., producescyclodextrins and the León site inSpain makes L-cystine.
30 Years of Biotech
The red brick walls in south-east Amsterdam have been hometo biotech facilities for 30 years.The recently acquired site’s historybegan in 1989 with the founding ofEuroCetus B.V. by the US Cetus Cor-poration, targeting commercial pro-duction of the cancer drug ProLeukinII in Europe.
Shortly after approval for theactive was obtained in 1992, the com-pany was taken over by Chiron Cor-poration and renamed Chiron B.V.After Novartis acquired Chiron Cor-poration in 2000, SynCo Bio Part-ners B.V. was spun off as an inde-pendent full-service contract manu-facturer. Wacker then took over 18years later.
Some 110 employees work atthe Amsterdam site today. The plantconsists of two fermentation lines, asingle-use equipment line, and a fill-and-finish facility for filling sterilesolutions into vials. The site has pro-duction rooms that comply with thehighest cleanroom classification —
Class A.The Amsterdam site also has a
lyophilization facility, where active in-gredient solutions can be freeze-dried.This often improves their stability, i.e.their shelf life. Amsterdam’s threeproduction lines have a combined fer-menter volume for pharmaceutical ac-tives of some 2,000 liters.
The company’s biopharmaceuti-cals business has seen strong per-formance. Since 2014, sales haverisen by an average of 19 percenteach year. Among the company’s corecompetencies are the production oftherapeutic chemical actives, livebacteria and vaccines, including qual-ity control and quality assurance.The service portfolio also includes thedevelopment and validation of newproduction processes and the build-
up of cell lines and cell banks.
Increased U.S. Footprint
The company has also made re-cent major investments in NorthAmerica. In 2016, the companyopened a $2.5 billion polysilicon pro-
duction site in Charleston, Tennessee,which churns out around 20,000 met-ric tons of pure polysilicon per year.This polysilicon is then used in theproduction of silicon wafers and solarcells.
The Wacker Group’s U.S. head-quarters are located in Adrian, Michi-gan. The 240-acre site has been pro-ducing elastomers, silicone fluids andsilicone emulsions since 1969. The fa-cility offers a comprehensive range ofservices, including Wacker Academy,a program that shares the company’sextensive collective knowledgethrough tailored seminars.
This year, the company expectsto further enhance capacity for liquidsilicone rubber, high- and room-tem-perature-vulcanizing silicones andthermally conductive silicones at itsproduction sites worldwide. Recentlyit was reported that Wacker wasevaluating the option of building aplant for solid silicone rubber at itsCharleston site.
In the electronics industry, thecompany’s silicones bond and seal,offering protection from dirt, mois-ture, radiation, and heat. This sili-cone is also used in electrical insula-tion, elastomers, fluids and gels forpower transmission and distributionnetworks, wires, and cables. Wack-er’s silanes are key materials for themanufacturing of electronic devices.Their high purity and low concentra-tion of metal impurities make themexcellent for many processes in semi-conductor production.
Contact: Wacker ChemicalCorp., 3301 Sutton Road, Adrian,MI 49221 % 517-264-8500 Web: www.wacker.com r
Continued from page 1
Wacker Chemical Expands its Biotech Operations
With last year’s takeover of SynCoBio Partners B.V., Wacker Biotech
has doubled its capacity.
sistor design which combines theability to drive high currents that istypical of classical transistors withthe low-voltage operation requiredfor use as artificial synapses,” saysWeitz. With the successful assemblyand characterization of vertical or-ganic field-effect transistors with ex-actly selectable dimensions and anionic gating, this goal has now beenachieved.
Potential areas of applicationfor the new devices include OLEDsand sensors where low voltages, highon-state current densities or large
transconductances are required.Their possible use in so-called mem-ristive elements is of special interest.
“Memristors can be thought ofas artificial neurons, as they can beused to model the behavior of neu-rons when processing electrical sig-nals,” explains Weitz. “By fine-tun-ing the geometry of a memristive de-vice, it could be applied in a varietyof contexts, such as learning process-es in artificial synapses.” The re-searchers have already submitted apatent application for the device toenable them to develop the new tran-sistor architecture for industrial use.
Web: www.uni-muenchen.de r
High and Low Current Organic SemiconductorsContinued from page 1
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Government agencies are notknown for moving quickly,and the RMF accreditation
process is a prime example. For de-fense contractors and integratorstasked with developing new tech-nologies for the Department of De-fense (DoD) and other governmentagencies, this step alone can takenine to twelve months or longer.
The glacial pace of accreditationis due to the manual nature of the re-view process tasks, as well as signifi-cant documentation and systemhardening required to meet securitypolicy mandates. Without this step,projects cannot move to Authoriza-tion to Operate (ATO). In short, anydelays impact deployment of new de-fense technologies in the field.
New automated software toolsare eliminating weeks and monthsfrom the RMF accreditation processby virtually eliminating the time ofthe initial hardening while also pro-
viding the required documentation.By doing so, technology integratorscan significantly reduce the time tobuild, test, and deploy new technolo-gies in STIG-compliant environments.
RMF Accreditation
The DoD introduced the RiskManagement Framework (RMF) in2014 to assist federal agencies to bet-ter manage risks associated with op-erating information systems. As partof this process, systems must be hard-ened to standard Security TechnicalImplementation Guide (STIG) bench-marks. The STIGs provide configura-tion specifications for operating sys-tems, database management systems,web servers and network devices usedby government agencies.
The problem is STIGs are longand detailed. Often containing hun-dreds of pages, adhering to or up-grading software or systems to a par-ticular STIG has been a highly spe-
cialized manual process that cantake many weeks to accomplish.
According to Brian Hajost, pres-ident of SteelCloud and an expert inautomated STIG compliance, thereare many misconceptions and confu-
sions surrounding system hardening.Only in rare instances do appli-
cations have specified STIGs. Oneexample is Microsoft Word, whichwhen used in secure environmentsmust be hardened. Instead, mostSTIGs apply to the “applicationstack,” which includes the operatingsystem (Windows, Linux) the appli-cation is built upon as well as webbrowsers, databases, and other com-ponents required for the applicationto function.
So, when an application is im-plemented in a STIG hardened envi-ronment it inevitably runs into con-flicts that can cause the applicationto “break.” When the application isan electronic document, that may beproblematic, but for a military firingsystem, it can be a matter of life anddeath. It is for this reason that RMFaccreditation requires hardening thesystem, as well as providing signifi-cant documentation of the hardeningand the details of all CAT 1/2/3 con-trols — a categorization of the degreeof security risk.
Automating the Process
Given the manual nature and ex-pertise involved in hardening and doc-umenting all changes, it would be easyto assume that multiple, competingsoftware solutions already exist. Thisis not the case. Vulnerability scanningsoftware is available that can comparegeneric STIG signatures to identifycontrols. This only serves to highlightthe problem areas but does nothing toresolve issues.
Scripting automation tools canbe used but are expensive and not pur-pose-built for STIG compliance or ac-creditation. Because they do not pro-duce documentation, these tools mustoften be used in conjunction with vul-nerability scanning software.
ConfigOS from SteelCloud, forexample, hardens all CAT levels(1/2/3) in about an hour, including pro-ducing a domain-independent XMLsignature and documentation of all re-quired waivers. In this step alone,weeks or months of manual work iseliminated.
Once developed, the encryptedXML signature can be securely usedacross the DoD in all networks and
domains, without changes to existingsecurity or infrastructure. The signa-ture can also easily be included withapplications as they are transferredto disparate infrastructures from onemission partner to another.
Using the signature, scanning,remediation, and compliance reportsare accomplished in about a minute.Because STIGs are updated every 90days, the software also simplifies up-dating systems in production as well.The product has already been li-censed by most of the largest defensecontractors, as well as agencies with-in the DoD and DHS.
“You basically have to moldthese controls, and there are hun-dreds of them, around your applica-tion stack,” says Hajost. “Essentiallyyou have to figure out what will‘break’ the application and correctthe control — and software can auto-mate that process.”
Hajost says the DoD will noteven authorize the issuance of an au-thority to operate (ATO), for exam-ple, of systems with an unmitigatedCAT 1 vulnerability except under ex-treme and rare circumstances. Thiscan mean sending a project back intodevelopment to address the issue.
“Now a ‘fix’ that would have cost$500 in the initial development cancost the government many thou-sands of dollars,” says Hajost, addingthat is the primary reason to addressSTIG hardening as early in the De-vOps process as possible, even beforeaccreditation. “We estimate CAT 1scost the government and the DoDthousands of dollars, per application,per year to maintain.”
As for CAT 2 and CAT 3 con-trols, they must also be hardened, or— if there is a reason the risk mightnot apply — waiver requests must besubmitted for review and acceptanceby accrediting authorities.
“We have seen examples wheredevelopers have even said, ‘We’rejust going to waiver all the CAT 3sbecause we don’t have the time ormoney to detect and remediatethem,’” explains Hajost.
However, with the speed of au-tomated identification and remedia-tion, more time can be shaved offtimelines by keeping waiver requeststo a minimum. While many in gov-ernment accept long delays as a factof life, shaving months from the RMFaccreditation process ultimatelyspeeds the implementation ofweaponry, communication and othersystems.
Contact: SteelCloud, LLC,20110 Ashbrook Place, Suite 170,Ashburn, VA 20147 % 703-674-5500fax: 703-674-5506 E-mail: [email protected] Web: www.steelcloud.com r
Tech WaTch
Page 10 May, 2019www.us- tech.com
Tech WaTch
Streamlining RMF Accreditation to SpeedDeployment of New Defense Technologies
By Jeff Elliott
New automated softwaretools are eliminating weeksand months from the RMF
accreditation process...
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PeoPle in the news
Mark Larson Receives ERA LifetimeAchievement AwardElk Grove Village, IL — The Electronics Representatives Association (ERA)has announced that Mark Larson, vice chairman of Digi-Key Electronics is therecipient of ERA’s “Lifetime Achievement Award.” The award was created torecognize individuals who play an integral role in supporting the manufactur-ers’ representative model in the electronics industry. Digi-Key joined ERA in2016 as one of the organization’s first global distributor members, in supportof its efforts to help facilitate the working relationship between the ERA repcompany members, the corporate headquarters of distribution companies andtheir local branch operations.
Web: www.www.digikey.com
KIC Announces New LeadershipSan Diego, CA — Philip Kazmierowicz, KIC’s co-owner, has decided to take onthe position of president. KIC is taking a leap in product development andtechnology. The markets are changing, challenges are getting tougher and theworld of the smart factory and Industry 4.0 is here. The company is expand-ing its product portfolio and escalating its roadmap. KIC is an industry leaderin automated thermal process tools and systems for reflow, wave, curing, andsemiconductor thermal processes.
Web: www.kicthermal.com
Sunstone Appoints Two New VPsMulino, OR — Sunstone Circuits® has promoted Nancy Viter to vice president ofoperations and Mathew Stevenson to vice president of sales and marketing. Ms.Viter and Mr. Stevenson have helped to contribute to Sunstone’s growth and willcontinue to play a key role in the company’s success in the PCB industry. In hernew role, Ms. Viter will focus on organizational excellences, guiding Sunstonethrough processes, such as ISO, technology and partnership growth. Mr. Steven-son will be responsible for growing the company’s revenue, partnerships andleading excellent customer experiences.
Web: www.sunstone.com
FLITE Appoints Sherry Stepp U.S. AmbassadorGlasgow, UK — Female Leaders in Tech, Everywhere (FLITE) has appointedKYZEN’s global marketing manager Sherry Stepp as its ambassador to theU.S. Ms. Stepp has more than 25 years of experience in business and deepelectronics industry knowledge. FLITE is a voluntary organization dedicatedto creating global communities to provide women in engineering, manufactur-ing and technology with a platform to connect. Founded in March 2017,FLITE recently celebrated its second anniversary. In that time, the organiza-tion has grown to include more than 700 members around the world.
Web: www.weareflite.com
Cirtronics Names Dave Patterson as New President and CEOMilford, NH — Cirtronics has appointed Dave Patterson president and CEO.Founder and former CEO, Gerardine Ferlins will remain with the company aschief governance officer and chair of the board of directors. Mr. Pattersonjoined Cirtronics in 2010 as director of global sourcing and was named chiefoperating officer two years later. He has a successful track record at Cirtron-ics, including development of a global supply chain organization and guidingthe company to achieve ISO 13485 certification and FDA registration.
Web: www.cirtronics.com
Rubadue President Sue Welsh RetiresLoveland, CO — After a long and successful career at Rubadue Wire, includ-ing 13 years as company president, Sue Welsh has announced her retirement.The leadership change went into effect in March. Sue has been an integralpart in leading the company through many years of growth, including the2018 move to a newer, larger manufacturing facility in Loveland, Colorado.Through her knowledge and leadership, the company found growth in emerg-ing technologies and expanded into global markets. Current vice presidentSean Toland will assume the position of president.
Web: www.rubadue.com
Sherry Meyer Promoted to Office Manager of CDMTurnersville, NJ — CDM Electronics has promoted Sherry Meyer to office man-ager, effective immediately. In her new role, Ms. Meyer will be responsible for thehiring, training and skills development of CDM’s companywide administrativeand sales support staff. She is also charged with providing ongoing support anddirection for workload, customer service and resource scheduling activities. Ms.Meyer reports directly to Lori Maeder, vice president of CDM. Ms. Meyer joinedCDM in 2009 and brings a unique scope of expertise to the position. For the pre-vious six years, she was CDM’s marketing services coordinator.
Web: www.cdmelectronics.com
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May, 2019www.us- tech.com
Business newsBusiness news
Whizz SystemsCelebrates20th YearSanta Clara, CA — Whizz Systems,Inc., a premier provider of electronicproduct design, development andmanufacturing services is celebrat-ing its 20th year in business. Locatedin the heart of Silicon Valley, WhizzSystems was founded in 1999 by ateam of elite engineers specializingin high-mix, low-volume electronicsmanufacturing services.
“It’s been a pleasure to haveworked with the who’s who of thetech industry over the years,” statedMuhammad Irfan, president ofWhizz Systems. “We have built re-markable relationships, learned alot, and feel great having contributedto the success of so many clients.”
Whizz Systems provides its cus-tomers with an efficient path to
Hamburg, Germany — YXLON Inter-national, a division of the SwissComet Group, is now collaborating
with Nagoya Electric Works (NEW).The partnership includes the devel-opment and distribution of special-ized X-ray systems for the semicon-ductor industry.
Both companies, YXLON andNEW, are leaders in advanced elec-tronics X-ray technology. YXLONbrings its expertise in high-resolutionX-ray tubes and image analysis, as
well as an excellent global sales andsupport network into the partnership.NEW is an expert in automated X-ray
inspection systems, offering accuratemanipulation, extremely precisemeasurements and advanced soft-ware. The first products coming out ofthis collaboration are YXLON’s FF70CL, FF65 CL and FF65 IL. They werelaunched at SEMICON China inShanghai 2019 through a live presen-tation of the FF70 CL.
“This collaboration will help us
to fulfill the growing demand of ourcustomers from the semiconductorand also SMT industry, especiallywhen it comes to analyzing continu-ously smaller features with highspeed. We are excited to use theknowledge and experience of bothcompanies to offer the best solutionsfor the market,” said Eike Frühbrodt,vice president of product and projectmanagement, YXLON.
NEW is a well-known manufac-turer of inspection systems for thesemiconductor and SMT industries.The company has built up a reputa-tion for advanced AOI and AXI sys-tems. Based in Nagoya, Japan, thecompany also offers a broad portfolioof products and services for trafficmanagement.
YXLON International, a part ofthe Comet Group since 2007, designsand produces radioscopic and CT in-spection systems for a wide variety ofapplications and fields. CT systemshave been an integral part of its prod-uct portfolio since 2003. CT provides3D insight into inspected items, en-abling the analysis of inner structures,dimensional measurement tasks inmetrology applications or actual-to-nominal comparisons to CAD data.
Contact: Comet Group Lab One,3055 Orchard Drive, San Jose, CA95134 % 408-325-8770 E-mail: [email protected] Web: www.comet-group.com r
YXLON and Nagoya ElectricWorks Develop Specialized X-Ray Systems
Dr. -Ing. Thomas Wenzel, General Manager, YXLON International (left) and Takaaki Hattori, president,
Nagoya Electric Works Co., Ltd. (right).
Smart Sonic Relocates to ClevelandCleveland, OH — Following thetransfer in ownership of Smart Sonicand SMT Detergent in December2016, the new owners have movedthe company from Canoga Park, Cal-ifornia to Cleveland, Ohio. While theoffice and manufacturing facility re-located to Cleveland, the 440-R-SMTdetergent will continue to ship fromSanta Fe Springs, California. Thecurrent owners have other business-es in the Cleveland area, so it madesense to move Smart Sonic to the ex-isting location in Cleveland.
Since the company relocated,Smart Sonic continues to thrive. Itsfocus remains the same — providingquality products and services at rea-sonable prices. The company contin-ues to be a leading manufacturer ofeffective stencil and pallet cleaningequipment, as well as its 440-R VOC-free detergent.
In response to customer re-quests/inquiries to reduce equipmentlead time, production staff beganmanufacturing a couple stencil/palletcleaners for stock. Smart Sonic cur-
rently has the Model 529 and theModel 6000 in process. These unitswill include the most commonly pur-chased options for each model. Sincethese are currently in production, thelead time dropped from six to eightweeks for the 529 and eight to tenweeks for the 6000, down to abouttwo weeks for each.
Contact: Smart Sonic Corp., 837E. 79th Street, Cleveland, OH 44103% 818-610-7900 fax: 818-610-7909E-mail: [email protected] Web: www.smartsonic.com r
HARTING Expands E-Mobility InfrastructureElgin, IL — The Geneva Interna-tional Motor show saw the launch ofthe latest vehicle study by Swiss ve-hicle visionary Frank M. Rinder -knecht, the “microSNAP.” HART-ING was also there to present ele-ments of its infrastructure for auto-mated charging, which is systemat-ically expanding its e-mobility tech-nology. Rinspeed’s microSNAP is amodular concept vehicle whosechassis and bodies can be swappedout easily at any time, offering anew solution for delivery vehiclesand taxis.
Rapid charging technology is aprerequisite for ensuring that vehi-cles in the future are supplied withsufficient power, not in hours, butin minutes.
HARTING has developed anautomatic charging solution, whichuses robot-assisted guidance tobring the DC connector into the ve-hicle’s charging socket. After thecharging process, the robot pulls offthe connector and the vehicle isready to go. The high-power DCsupply is adapted optimally to thecharging assistant.
HARTING and Rinspeed havebeen collaborating since 2016.HARTING’s MICA® was integratedinto the Etos vehicle for au-tonomous emission and conditionmonitoring. In 2017, HARTINGused the miniMICA to support Rin-speed’s Oasis vehicle. Last year, thecompany provided rapid chargingtechnology for the SNAP.
Contact: HARTING NorthAmerica, 1370 Bowes Road, Elgin,IL 60123 % 847-717-9217 E-mail: [email protected] Web: www.harting.com r
Page 14
Muhammad Irfan, president ofWhizz Systems.
launching a product by taking anidea and turning that into a work-able, shippable product. The compa-ny’s services are unique in that thecompany manages the entire processof a product starting with develop-ment all the way to prototyping andmanufacturing.
Irfan added, “We remain com-mitted to the success of our cus-tomers, our team, and to be the bestin our space. We want to thank allour customers for their business andloyalty. We also want to thank all ofour team members for having con-tributed to our success.”
Contact: Whizz Systems, Inc.,3240 Scott Boulevard, Santa Clara,CA 95054 % 408-980-0400 E-mail: [email protected] Web: www.whizzsystems.com r
Detlef Sieverdingbeck, generalmanager of communications,
HARTING (left), and Frank M.Rinderknect, founder and CEO,
Rinspeed AG (right).
Business Briefs
New INGUN Subsidiary in TurkeyOpened Doors January 1Istanbul, Turkey — The Turkish subsidiary INGUN Test Cözümleri A.S. wasofficially opened at the beginning of the year. This marked the start of even bet-ter customer support in Turkey. As the managing director, Nahit Büyüksahinis the contact person for all Turkish customers, and will be supported by YunusEmre Deniz in the newly-founded customer service department. INGUN’sTurkish customers can now look forward to the same level of professional andlocal support available elsewhere in the world, along with reduced customscosts and faster deliveries.
Contact: INGUN USA, Inc., 252 Latitude Lane, Suite 105-106, LakeWylie, SC 29710 % 803-831-1200 fax: 803-656-5080 E-mail:[email protected] Web: www.ingun.com
JBC Signs Rep Agreement with Southwest SystemsDallas, TX — Southwest Systems Technology has signed an exclusive manufac-turers’ representative agreement with JBC Tools. Under the agreement, South-west Systems will represent JBC in the U.S. states of Arkansas, Louisiana,Oklahoma, and Texas. Southwest Systems now provides sales and service forJBC’s line of soldering and rework equipment. Now in its 30th year, SouthwestSystems has offices in Texas and Mexico, serving the electronic and semicon-ductor manufacturing industries.
Contact: Southwest Systems Technology, Inc., P.O. Box 14008, Dallas, TX75214 % 972-881-8006 fax: 972-881-9199 E-mail: [email protected] Web: www.swsystems.com
ETI Acquires RF Techniques, Inc. ofSan Jose, CAClearwater, FL — Electro Technik Industries, Inc., (ETI) has acquired RF Tech-niques, Inc., of San Jose, California. The newly acquired company will be partof the Electro Technik, RF/Microwave Group and report to Alen Fejzuli, presi-dent. RF Techniques has been in business for more than 30 years and has de-veloped an outstanding reputation in the industry for designing and deliveringhigh-reliability microwave components. Their products will complement Res-net Microwave’s existing offerings by adding a family of brazed attenuators, re-sistors and terminations, as well as thin-film capabilities.
Contact: Electro Technik Industries, Inc., P.O. Box 18802, Clearwater, FL33762 % 727-530-9555 E-mail: [email protected] Web: www.electrotechnik.com
Super PCB Partners with Horizon Sales in MidwestPlano, TX — Super PCB has appointed Horizon Sales as its manufacturers’ rep-resentative in the Midwestern states of Eastern Iowa, Florida, Illinois, Indiana,Kentucky, Ohio, Michigan, Western Pennsylvania, and Wisconsin. For more than25 years, Horizon has supplied state-of-the-art equipment and supplies to its cus-tomers. Super PCB serves the telecom and wireless, transportation, medical,lighting, consumer electronics, energy, and Internet of Things (IoT) industries.
Contact: Super PCB, 2222 W. Spring Creek Parkway, Suite 101, Plano,TX 75023 % 214-550-9837 fax: 214-377-6223 E-mail: [email protected]: www.superpcb.com
85 Years of Tech Innovation andGrowth at IndiumClinton, NY — Indium Corporation employees around the world are markingthe company’s 85th anniversary. The company was founded in 1934 by Dr.William S. Murray, in Utica, New York. Dr. Murray dedicated his life to inves-tigating and developing the uses of indium metal. Since those early days, thecompany has continued to lead and support the advancement of technologies onwhich we rely. Today, the company has more than 900 employees and 12 sitesaround the world. Indium is a premier materials manufacturer and supplier tothe global electronics, thin-film and thermal management markets.
Contact: Indium Corp., 34 Robinson Road, Clinton, NY 13323 % 315-381-7524 E-mail: [email protected] Web: www.indium.com
Specialty Coating Systems Signs Repfor KY, MI and OHIndianapolis, IN — Specialty Coating Systems (SCS) has appointed Quality As-sociates as its newest manufacturers’ representative. Based in Michigan, theagency will represent SCS’ PrecisionCoat spray and dispense line, cure ovensand ionic contamination test systems in the states of Kentucky, Michigan andOhio. Quality Associates was founded in 1990 by Steve Neumaier. The compa-ny primarily focuses on capital equipment but has also represented some con-sumable and distribution lines as well.
Contact: Specialty Coating Systems, 7645 Woodland Drive, Indianapolis,IN 46278 % 317-472-1290 E-mail: [email protected] Web: www.scscoatings.com
May, 2019 Page 15www.us- tech.com
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Globalization and the rapid paceof technological advancementhave created extraordinary op-
portunities for entrepreneurs and ad-vanced manufacturing businesses ofall sizes. These opportunities havefueled manufacturing competitive-ness that is fiercer than ever and cre-ated new challenges for internationaladvanced technology manufacturersvying for economic prosperity.
To create sustainable and prof-itable long-term growth, these com-panies must transform their organi-zations to address the clear trendstoward automation, advanced manu-facturing, and digital marketing tocapitalize on these new opportuni-ties, and to navigate the challengesof the Americas marketplace.
The State of the Americas Market
Positive macroeconomic condi-tions, trends toward automation, rela-
tively low loan interest rates for secur-ing capital, and strong incentives to“reshore” have fueled a manufacturingrevival in the Americas. At the sametime, geopolitical tensions, trade dis-putes, and uncertain longer-termmacroeconomic trends have fosteredthe perception of a volatile U.S. manu-facturing environment. Because ofthis perception, international compa-nies are often hesitant to explore ex-pansion into the Americas and maymiss a chance to fully participate inthe manufacturing resurgence.
Rapid technological changes,high costs of doing business, politicalpolarization, and overregulation areonly a few of the concerns that com-panies deem as major threats to theirinvestment into an American pres-ence. Yet, despite these risks, theU.S. is perhaps the greatest place inthe world for advanced technologymanufacturers seeking financial
growth and expanded market share.According to SelectUSA, a gov-
ernment-wide program led by the U.S.Department of Commerce with a mis-sion to facilitate job-creating businessinvestment into the U.S., the UnitedStates is the world’s most attractiveconsumer market with an annualGDP of $20 trillion and a population ofover 325 million, offering unmatcheddiversity, a thriving culture of innova-tion and one of the most productiveworkforces in the world.
As demonstrated by the follow-ing rankings, the U.S. is positionedas the top country for global invest-ment and the most important for cor-porate growth prospects in the areasof: GDP, global competitiveness,highest research and developmentexpenditures, and foreign direct in-vestment confidence.
To capitalize on the opportuni-ties in the Americas, internationaladvanced manufacturing companiesmust familiarize themselves with themost pervasive, yet often misunder-stood, challenges that can deter com-panies from accomplishing accelerat-ed growth and profitability, despitethe current opportunities.
Vast Geographic Territory
The United States and Europeare actually quite similar in landmass,however, the combined landmass ofNorth and South America is morethan four times the size of Europe.Population densities of the two regionsvary dramatically, with vast areas ofthe Americas that are sparsely popu-lated, yet economically vital.
These enormous geographic dif-ferences strongly influence site selec-tion, sales channels, travel expenses,cultural considerations, and market-ing approaches.
Lease Rates. Companies tendto place high priority on the cost ofoffice and manufacturing space whenselecting a location. While facility ex-penses are certainly a factor to con-sider, it is important not to overlookequally important factors, such asthe availability of educated workers,overall quality of life within an area,access to capital, state and local in-centives, and the location’s proximityto targeted sales and distribution ac-counts. Failure to fully assess theseconsiderations may lead to unneces-sary financial and resource invest-ments that can impede growth andlead to misaligned expectations.
Access to Key Accounts. Pri-or to establishing an American-basedoperation, it is crucial that interna-tional companies research the geo-graphic concentration of their targetindustry, thought leaders and key ac-count targets. Like Europe, specific in-dustries may have geographic concen-tration of manufacturing, engineering,
and related decision-makers that mayinfluence site selection, travel costs,and sales channel strategy. Withoutsound knowledge of a target industry’sgeographic distribution and key ac-count density, companies may exposethemselves to much higher travel ex-penses, inadequate sales channels,and employee frustration, due to unre-alistic expectations.
Distribution and DigitalCommunication. Many global or-ganizations assume that they cantransfer their regional sales channelapproach to the North Americanmarket, but that can be a costly mis-take. With an expansive geographicarea to cover and with the ease of do-ing business becoming increasinglyessential, international companiescannot ignore the role and impor-tance of digital communicationswithin their sales channel approach.With Forrester Research forecastingthat one million U.S. B2B salespeo-ple will lose their jobs to self-serviceeCommerce by the year 2020, compa-nies must adapt their sales channelapproach to accommodate the real-time, global buying landscape of theAmericas. American buyers and en-gineers demand electronic communi-cation and product selection toolsthat are easy to use, available24/7/365, and perpetually up to date.Standard products must be availablefor immediate delivery, and a net-work of respected distribution part-ners is essential to success in manyindustries. The sales channel land-scape must reflect the buyer arche-types of each company’s particularproducts and industry.
Cultural Differences. Evenwithin Canada, the U.S. and Mexico,there are notable cultural variationsin communication, etiquette and orga-nizational hierarchy. These differ-ences can present a challenge whencreating and managing effectivemultinational teams. Whereas a Euro-pean parent company may have hun-dreds of employees with well-definedand relatively narrow scope of respon-sibility, a typical American operationwill have far fewer employees — manywith cross-functional responsibilitiesand decision-making authority. Recog-nizing how cultures differ from thoseabroad can help global organizationsavoid misunderstandings with col-leagues and clients that have distinctattitudes and expectations of organi-zational hierarchy in a cross-function-al matrix organization. Alliance Tech-nologies can provide actionable stepsfor companies to improve their out-comes in the Americas.
Contact: Alliance Technologies,LLC, 26 Davis Hill Road, Weston,CT 06883 % 203-226-8895 E-mail: [email protected] Web: www.allianceamericas.com r
Page 16 www.us- tech.com
ManageMentManageMent
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Navigating the Challenges of the Americas Market: The Impact of a
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Page 18 May, 2019www.us- tech.com
ElEctronic Mfg SErvicESElEctronic Mfg SErvicES
ACC Electronix has been providing world-class electronics manufacturing services(EMS) to a diverse customer base for more
than 40 years. It is an ISO 9001-2015 certified con-tract manufacturer that got its start in 1976 byproviding quality equipment to the broadcast in-dustry. In 1992, the company expanded on thisfoundation and began providing its electronicmanufacturing and assembly services to otherindustries. Today ACC serves customers in theindustrial, agricultural, off-road, construction,mining, and medical markets.
From prototypes to proven designs, ACCcan help its customers achieve their goals forquality improvement, on-time delivery, invento-ry control and cost reduction. The company de-velops a custom formula to assist each cus-tomer.
ACC’s process engineers work constantlyto improve their manufacturing processes. Im-provements range from selecting new manufac-turing equipment to selecting solder with im-proved formulations. Other benefits of workingwith ACC include design for manufacturability,design for testability and manufacturingprocess selection.
ACC supports customers who have envi-ronmental concerns and need hardened elec-
tronic products (potting, conformal coating, adhe-sives, etc.). According to Mike Parker, vice presi-dent of manufacturing, ACC has experiencedtremendous growth over the past two years as top-line revenue has grown over two and a half times.ACC has generated this growth by investing in thebest equipment and capabilities, which adds value
for customers in terms of speed, quality and lowercost. Parker adds, “We show no signs of slowingdown in 2019, based on current new productlaunches, as well as new customer demand.”
Keeping up with Growth
To keep up with this rapid growth, ACC need-ed to purchase new equipment. The companylooked to its existing partner Kurtz Ersa. In2019, ACC purchased its first dual-pot ErsaVersaFlow 4/55. Based on its excellent perform-ance, the company purchased and installed asecond machine 12 months later.
Parker stated that ACC chose this samemachine over any competitive systems becauseof Ersa’s long history in providing selective sol-der systems and its reputation for robust designand quality.
ACC is already noticing measurable benefitsfrom having two of Ersa’s systems in its facility.“Our customers’ need for two-sided, mixed tech-nology with extremely tight component spacinghas increasingly eliminated wave soldering as aneffective process solution. The control and re-peatability of our VersaFlow machines allows ourprocess engineering team to dial in the solderprocess for each joint, resulting in consistent
Ersa Helps ACC Along a Path of Continual Improvement
ACC values its employees and provides regular training to help improve efficiency
across the facility.
By Curt Williams, Vice President of Sales, ACC Electronix, Inc.
Continued on next page
quality,” says Parker. “Originally, we wereconcerned about throughput of the selectivesoldering process, but with the modular designof the VersaFlow and its ability to have unitsat each stage of the process — flux, preheatand solder — we have been thrilled with thespeed and quality output.
Focus on Flexibility and Quality
Meeting customers’ needs, while beingflexible and providing high quality is an im-portant part of ACC’s mission. From hand-built products to prototypes and on to high-volume production, the company has the nec-essary resources.
Its production facility is designed to ef-ficiently handle diverse customer productionrequirements, product testing and final prod-uct assembly. The company views itscustomers as partners. Parker saysthat ACC acts as an extension oftheir electronics manufacturing de-partments. “ACC’s personalized cus-tomer service is most effective whenwe are partnered with our cus-tomers,” he says. “By involving ourmanufacturing experts early in thedesign process, we can provide valu-able assistance that will significantlyreduce startup problems, increasequality and reduce cost. ACC will useour ISO-certified procedures to buildcustomers’ product.”
As a result, ACC knows how im-portant strong service is to the suc-cess of any partnership. Parker saysthat after the initial trip to Kurtz Er-sa, he knew that Ersa was going to bea good fit. ACC was impressed not on-ly with the equipment, but also withthe people and support of the Ersateam. Parker adds that ACC has re-ceived quick, informative responsesto application questions wheneverneeded, and that Ersa’s service hasbeen excellent.
ACC’s facility is customizedspecifically for electronics manufac-turing and runs updated programs tomaximize quality and efficiency. Oth-er facility features include high-effi-ciency lighting for maximum illumi-nation in the hand assembly area, airlocks and power humidifiers for tem-perature/humidity control, conduc-tive floors for maximum ESD protec-tion, and an ESD program in whichfoot/wrist straps and conductive jack-ets are worn to dissipate electrostaticenergy in a controlled manner into itsconductive floors and work benches.
Also, ACC uses online work in-structions to eliminate paperworkand control documents, as well as cellworkgroups to improve efficiency andquality by eliminating batch process-ing. Finally, all employees continual-ly attend lean training to further im-prove efficiency.
ACC provides a variety of elec-tronics manufacturing services. Whilefull product assembly is its specialty,PCB assembly is core to everythingbuilt by ACC. This includes surfacemount assembly as well as fine-pitchplacement, BGA/LGA placement,through-hole assembly hand-built pro-totypes, product verification builds (pi-lot runs), high-volume production, in-circuit testing, functional testing, mon-itored burn-in, conformal coating, finalassembly services (box builds), full-range manufacturing services and in-warranty/out-of-warranty repair. Asadditional resources, the company pro-vides design for manufacturability as-sistance and design for testability rec-ommendations.
Quality is a major focus at ACCElectronix. It is ISO 9001-2015-certi-
fied and committed to the ISO concept ofcontinuous improvement. The company usesIPC-A-610E as its soldering and assemblystandard and, depending on customer need,it solders to either IPC Class 2 or Class 3 in-dustry standards.
Contact: ACC Electronix, Inc., 420 Wylie Drive, Normal, IL 61761 % 309-888-9990 E-mail: [email protected] Web: www.accelectronix.com and Kurtz Ersa North America, Inc., 1779 Pilgrim Road, Plymouth, WI 53073 % 920-893-1779 fax: 920-893-1562 E-mail: [email protected] Web: www.ersa.com r
See at SMTconnect, Hall 4 Booth 111and Hall 5 Booth 434B
May, 2019 Page 19www.us- tech.com
Continued from previous page
Ersa Helps ACC Along Path of Continual Improvement
ACC has purchased two VersaFlow4/55 soldering systems.
Page 20 May, 2019www.us- tech.com
Apart of the Elsysko Group andsister company of elektron sys-teme, optical control is a full-
service EMS company based in Weis-senohe, Germany. The company has160 employees, four SMT lines andtwo through-hole lines. It was found-ed in 2009, and in 2011, optical con-trol formed a sales and service organ-ization for the OC-SCAN®CCX (com-ponent counter X-ray) products.
The company focuses solely ondevelopment and manufacturing ofX-ray component counting machines.Recently it launched a North Ameri-can division, which is a direct resultof its growth in the region. Still inthe process of finalizing Optical Con-trol Americas, the company initiallyprojected that it would take aboutthree years to reach its current level.Even with a great product and excel-lent reps, optical control still relieson the machine to speak for itself.
My role with with company wasto take a product that was somewhatof an unknown in all areas except Ger-many and a few other European coun-tries and globalize it. This began in theUnited States, but soon after hiringmy counterpart in Asia, the growththere has increased significantly.
Since the beginning of 2019, op-tical control has added three new repcompanies. These are some of thebest reps in the industry. All of them
carry only “best-in-industry” prod-ucts. As the company’s reputationgrows it expects that more sales repswill be attracted to the X-ray compo-nent counter.
Accurate Inventory Management
While there are many othercompetitive machines, optical controlwas the first to create the technology.Its sister company is an EMSprovider with four SMT lines, so the
X-ray component counter can be runin live production during a three-shift per day, five-day work week.Thousands and thousands of reels gothrough the machine, which have al-lowed the company to develop robustalgorithms, compared with other so-lutions. The machine does not re-quire a library and relies entirely onlogical algorithms.
It is critical to understand exactinventory numbers. Keeping SMTlines running is the bottom line and
the driving factor for exact inventorycontrol. The world is automatingeverything. Parts of the industry,such as board feeding, screen print-ing, AOI, pick-and-place, and reflowhave been automated for years, butinventory management and controlhave fallen behind. Suddenly, howev-er, there is high demand to automateand control this process. A companymay have the best line techs andequipment in the industry, but if itdoes not have components, it ismeaningless. Automating inventorymanagement solves this issue.
Also, the popularity of inventorystorage units along with componentcounters is at an all time high. Previ-ously, one would purchase compo-nents, manually enter the quantityinto the ERP system and then putthem away. When that componentwas needed, it would be removed frominventory, set up on feeders, sent toproduction, and then returned to in-ventory. The problem was that therewas so much handling in betweeneach process and counting would onlybe involved sometimes.
Often, only the so-called “impor-tant” or “expensive” componentswere counted because there was notenough time to count 100 percent ofthem. Even though some componentswere being counted at factories, it
OC-SCAN CCX X-ray component counting system.
Using X-Ray Component Countingto Accurately Manage Inventory
By Todd O’Neil, Vice President of Business Development, optical control
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C 4:53 PM Page 1Continued on next page
was extremely slow and inaccurate. Itcould take three to five minutes tocount an average reel and even up toeight or 10 minutes to count a reel of50,000 01005s.
The main objective of inventorycontrol is to keep the lines running, soimagine if you have a reel of compo-nents that you believe has 100 remain-ing and you need 92, but in realitythere are only 80, what happens? Theline stops. Production stops. Peoplescramble. Maybe boards and solderpaste must be scrapped, etc. Parts mayneed to be ordered overnight, which isexpensive, and difficult with today’sparts shortages, possibly delayingshipments to customers.
Configurable Levels of Automation
With the growing popularity ofIndustry 4.0 and the smart factory,optical control’s X-ray componentcounter can be a standalone unit withno communication to anything, orcompletely tied into factory ERP sys-tems and storage units through soft-ware.
The machine can communicatewith just about any type of softwarethat a factory may use. It is alreadycommunicating with other softwarepackages and equipment. The ma-chine can be completely automated,whether it be with a programmablerobotic handling system, trolleys,conveyors, or an AGV that can driveto and from the machine. It all de-pends on how much automation thecustomer wants. These systems arealso a big part of traceability, whichis increasingly important.
Using logical algorithms, themachine requires no libraries or pro-gramming. It is truly a plug-and-playmachine. When optical control’s tech-nicians install a machine, the proce-dure is simple: uncrate it. The touch-screen monitor is installed along withthe barcode reader and label printerand then the machine is plugged intoa standard 110V outlet. All the ma-chines are FDA-certified and thecompany performs a radiation test atstart up. Reels can then be loaded.Since the machine is entirely algo-rithm-based, it can even count un-known components.
Customers can start counting assoon as the machine turns on. In fact,at the recent IPC APEX Expo severalcompanies brought unknown compo-nents and loaded their own reels andsome odd-shaped components intothe machine with no issues.
Many visitors reported that thismachine was the only one able tocount their parts. For example, onecompany brought plastic cases withrandom parts inside. The cases didnot need to be opened. They weresimply placed into the machine, thebutton was pressed and the machinecounted them.
The machine is also extremelyfast. The latest update to the CCX.3allows customers to put any type ofcomponent in the machine and 10seconds later the result will be on thescreen. It could be a 7-, 13- or 17-inchreel, a JEDEC tray, three JEDECtrays, a component tube or 20 compo-nent tubes. It will always take only10 seconds. The only time the ma-chine will take 12 seconds is whenrunning four seven-inch reels simul-taneously. It also makes no differenceif a reel has 100 components or50,000.
Protecting Sensitive Components
The machine also uses a muchlower-powered X-ray tube than othersand turns it on for only a second, whichresults in much less exposure to sensi-tive components.
optical control works with anyclient that has components to count,which makes all OEMs and CMs po-tential customers. The company has al-so been very successful in the militaryand aviation markets because of themachine’s design.
The lower amount of radiation ex-posure is important to these cus-tomers. In reality, most componentsare not a concern, but anything that isprogrammable or used in aviation and
May, 2019 Page 21www.us- tech.com
Using X-Ray Component Counting to Manage InventoryContinued from previous page
The OC-SCAN CCX can count four reels simultaneously in 12 seconds. Continued on page 23
Page 22 May, 2019www.us- tech.com
Founded in January of 1960 andincorporated in the state ofMichigan, independent manu-
facturers’ representative Murray A.Percival Co. has maintained a singu-lar guiding philosophy.
The company believes thatwhile anyone can offer products, fewcan provide measurable results thatpositively affect their customers’ bot-tom line. “We strive to carry on thatphilosophy by taking care of our fam-ily, our employees and their families,and our ever-growing family of satis-fied customers,” says Murray A. Per-cival Jr., president. “The same phi-losophy that built our company in1960 is still present today.
Focus on Family
59 years ago, Murray PercivalSr. was approached by the Electro-vert Corporation, which the companystill represents to this day, to sell itsprinted circuit board wave solderingequipment. At the time, the use ofPCBs was still relatively rare andthe foresight to enter the businesswas not without risk. The industryhad yet to emerge.
Today, PCBs are crucial compo-
nents in most of everyday life, usedin automobiles, medical equipment,military equipment, avionics, com-munications, computers, appliances,and entertainment products. Elec-
tronics are ubiquitous, increasinglymobile, and growing in complexityand popularity every day.
The decision to represent Elec-trovert earned Murray Percival the ti-tle of “pioneer,” servicing an emergingindustry, and one that has becoming akey component in the worldwide mar-
ket of manufactured goods. Today, thecompany is a leading supplier to theMidwest’s electronics industry and of-
fers thousands of products, many ofwhich can be purchased directly fromits website.
The Murray Percival Co. wasbuilt on Murray Sr.’s strong founda-tion of honesty, integrity, loyalty,and a commitment to doing what’sright. His goal in business was notonly to provide for his family, but al-so to be a provider to his employeesand their families. He often said thattheir families were his and it was im-portant to him that they were given achance to grow along with the compa-ny. Growth was not just measured fi-nancially, but morally and spiritual-ly as well.
Today, the company is managedby Murray Sr.’s three children: Mur-ray Jr., Mark Sr., and Pam. Now rep-resenting a third generation areMark Jr., Matt and Murray III. Thephilosophy is significant: family-owned businesses represent 64 per-cent of U.S. GDP and 78 percent ofnew job creation.
As a third-generation family-owned business, the company hasevolved from hardware provider toprocess enabler, delivering to its cus-
Three Generations of Quality and Respect Strengthen
Murray Percival’s FoundationBy Michael Skinner, Editor
From left: Murray Percival III, Matt Percival, Murray Percival Jr.,Mark Percival Sr., and Mark Percival Jr.
Continued on next page
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tomers and using the most up-to-date tools andprocesses.
“The Power of One”
“When I joined the agency, there was just me,my father and an administrative person. We onlyhad two lines, I did all of the inside stuff, taking or-ders over the phone, shipping and receiving, load-ing, and unloading trucks,” says Murray Jr. Com-pare that beginning with a personnel profile of theagency today and the differences are striking. “I’mobviously from the second generation of the Perci-val family. My brother Mark is my partner and oursister Pam is the agency controller. On top of thatwe now have the third generation with the compa-ny. That group, which is known as‘3G,’ is made up of Murray Sr.’sgrandsons, Murray III, Mark Jr. andMatt. Altogether we are 15 strongand currently adding several newemployees,” he says.
When describing the dynamicsof different generations working to-gether toward a common goal, Perci-val believes that they have done agood job of understanding who andwhat the company is. He adds thatwhen a question or problem comesup, they will look at it, have a conver-sation with no one person taking astrong stance, and come up with aplan. “Sure, there are generationaldifferences,” he says. “Perhaps theyounger generation wants to getthings done faster. But, over theyears we’ve been able to avoid argu-ments and pull together as a family.”The direction that the family pulls to-gether is in supplying capital equip-ment, engineered materials andproven solutions to clients.
The company accomplishes thisby using what it calls “The Power ofOne.” This represents one resource,one shipment and one low price. Cen-tral to the company’s philosophy, ThePower of One is designed to help cus-tomers deliver products that make theworld safer, healthier and more enjoy-able. Murray Jr. adds that they makea difference by living their core valueseveryday, as well, which come down tothree simple, powerful concepts: root-ed in loyalty, driven to believe, and
connected through hard work.The company strives to provide great value. It
accomplishes this in many ways, including offeringan extensive supplier base to help solve customerproblems. The company provides many years of ex-perience. It continually trains its people so theycan help customers better and faster, and it in-vests in key technologies to make work more effi-cient and effective, supplying both materials andequipment to support business growth and needs.Murray Percival Co. interacts as a team so thattheir knowledge bank is constantly updated. Thisallows them to provide solutions to customersquickly. Finally, each member of the team findsmuch satisfaction in helping people, and will goout of his or her way to do so. Respect, flexibilityand understanding of this level is difficult to find
these days, which is a reason that Murray PercivalCo. stands out from its competition.
When customers choose Murray Percival Co.,they know they will receive the best the companyhas to offer, and that they will benefit from a con-venient and efficient resource for thousands ofMRO products and equipment at the best prices.They also know that they will receive a proventechnical sales force to answer their questions andoffer solutions. Most importantly, they know thatthey will get a partner with nearly 60 years of ex-perience to save them time, reduce their costs andimprove their processes.
Contact: Murray Percival Co., 2014 BrownRoad, Auburn Hills, MI 48326 % 248-276-9970 E-mail: [email protected] Web: www.murraypercival.com r
May, 2019 Page 23www.us- tech.com
FACT: HELUKABEL’s JZ-602 RC-PUR and JZ-602 RC-C-PUR control cables are
Three Generations, Murray Percival CompanyContinued from previous page
military must take radiation limitsinto consideration.
Over the next five years, com-ponents will continue to shrink andoptical control will continue to runtests and enhance its algorithms.Currently, completing simple au-tomation is a goal of the company.optical control focuses on one thing:counting components. There is norepertoire of products. As an EMScompany as well as developer of theX-ray component counting machine,optical control performs nonstop re-search and development using itsown component inventory. The com-pany’s mission is simple: keep linesrunning.
Contact: optical control, 9 MainStreet, Suite 182, Atkinson, NH03811 % 833-932-6868 E-mail: [email protected] Web: www.optical-control.de r
See at SMTconnect, Hall 4ABooth 135
Using X-RayComponentCounting...Continued from page 21
Page 24 May, 2019www.us- tech.com
With headquarters near Dallas,Texas, National Circuit As-sembly (NCA) is an AS9100D-
certified circuit assembly companythat provides fully integrated PCB, ca-ble and electromechanical manufactur-ing and test services.
National Circuit Assembly servesOEMs in the aerospace, defense, secu-rity, consumer electronics, semicon-ductor, telecommunications, medical,industrial control, and other high-techindustries.
NCA is focused on quality, test-ing and speed to market for commer-cial and industrial products and of-fers world-class manufacturing, aswell as state-of-the-art supply chainmanagement. It is National CircuitAssembly’s mission to contribute toits customers’ success by being astrategic electronic manufacturingservices partner, flexible to theirneeds, without comprising excellencein quality, and customer service. Ad-ditionally, the company strives to es-tablish strong, long-term business re-lationships with customers throughconsistent performance, superiortechnical support, exceptional cus-tomer service, and ongoing develop-ment of custom solutions that simpli-fy outsourcing complexity.
Understanding the Value of Employees
To accomplish this goal, Nation-al Circuit Assembly relies on its ex-
perienced team of exceptional em-ployees. The company was foundedon the premise that to be successful,its management must understandthe value of employees. National Cir-cuit Assembly believes in working to-gether as a team to deliver the high-
est quality results to its customers.Based on that belief, the companyempowers its employees through in-tensive training and recognition.
The company’s workforce is con-tinually trained and crossed-trainedto meet customer expectations to en-
sure and maintain consistentlymeasurable high standards of quali-ty, productivity and on-time delivery.National Circuit Assembly’s diversecultural working environment, alongwith using the latest technologicallyand advanced equipment, is an ex-
ample of the many components thathelp form its customer-driven foun-dation.
“We are passionate about mak-ing every transaction between ourcustomers and our team as smoothand effective as possible,” says Mike
T. Tieu, CEO. He adds that the com-pany will always strive to provide ex-ceptional quality services to itsclients and to do its very best to en-sure it is using and managing itsprocess to provide clients with cost-effective solutions. “NCA operateswith your vision in mind and ourmission at heart to create your prod-uct with the ultimate goal of earninga long-lasting business relationshipwith your company,” says Tieu.
End-to-End Solutions
Other benefits include end-to-end solutions. The company can getcustomers’ products into the hands ofconsumers quicker, make emergencyproduction changes on the fly, andsupport its customers’ business inways they never believed possible. Italso provides highly rated manufac-turing services. The company offers aspecial combination of quality, com-fort and industry experience. Finally,it is a flexible, U.S.-based company.Tieu said, “With more than 100,000total square feet of U.S. manufactur-ing space, the only difference be-tween National Circuit Assemblyand a tier one EMS company is ourability to offer customers highly cus-tomized, flexible solutions.”
Customers can choose from avariety of services, including PCB de-sign, electromechanical assembly, ca-ble and wire harnesses, cabinet/rack
NCA believes that its team is its most valuable resource. It continuallytrains employees to ensure and maintain high standards.
The Higher the Better: National Circuit Assembly’sStandards Help Exceed Customer Expectations
Continued on next page
By Gavin Subel, President, National Circuit Assembly
and stack, control panels manufac-turing, engineering services, supplychain management, aftermarket
services, and third-party logistics.NCA’s PCB design services pro-
vide consistent, high-quality resultsto meet the most specialized require-ments and the company offers as-
sembly services from system compo-nents, modules and subsystems tobox build and card cages.
Cable assembly and intercon-nect solutions are provided for virtu-ally all market sectors. The compa-ny’s engineering services offer asmooth, secure ramp up to compre-hensive project management. NCA’sbroad logistics management experi-ence makes it able to simplify eventhe most complex supply and after-market service challenges.
National Circuit Assembly com-bines advanced, flexible manufactur-
ing services with quality. The compa-ny is ITAR-registered with the U.S.Department of State, and it is a ULfacility. The company effectively usescontinuous improvement programscoupled with state-of-the-art inspec-tion and test equipment.
Employees are certified to IPCand J-STD-001 workmanship stan-dards by two dedicated in-house certi-fied trainers. Additionally, NationalCircuit Assembly recently becameAS9100D Aviation, Space and Defensecertified. The certification differenti-ates the company from many other
contract manufacturers, because the“D Revision” is a big leap from the pre-vious C certification. It is much moreinvolved, and companies certified tothe D Revision must also meet variousadditional requirements includingproduct safety, counterfeit parts pre-vention, human factors, configurationmanagement, and more.
Contact: National Circuit As-sembly, 2908 National Drive, Suite 100, Garland, TX 75041 % 888-278-8890 E-mail: [email protected] Web: www.ncatx.com r
May, 2019 Page 25www.us- tech.com
Quality and consistent, repeatable results play an
important role in NCA’s success.
National Circuit Assembly’s Standards Help Exceed Customer ExpectationsContinued from previous page
Opto DiodeIntroduces NarrowSpectrumUVLEDsCamarillo, CA — Opto Diode Corpo-ration, an ITW company, has intro-duced the third device in a series ofnarrow spectral output ultravioletlight-emitting diodes (UVLEDs), theOD-265-003. The UVLED with lensprovides a narrow radiation patternand total power output of 0.5 mW(minimum) to 0.58 mW (typical). Thenewest device in Opto Diode’s familyof ultraviolet LEDs is housed in ahermetically-sealed TO-46 package,making it convenient to integrate in-to existing or new systems.
Electro-optical characteristics(at 77°F [25°C]) include emissionwavelengths ranging from 260 nm(minimum) to 270 nm (maximum),with a typical peak emission at 265nm. The spectral bandwidth is 13 nm(typical), the half-intensity beam an-gle is only 9°, forward voltage is 5V(typical) to 6.5V (maximum), and ca-pacitance is 350 pF (typical).
The new, narrow spectral out-put UVLED offers long-lifetime oper-ation and is well-suited for disinfec-tion applications.
All devices in Opto Diode’sUVLED family have operating tem-perature ranges from –22 to +176°F(–30 to +80°C) and storage tempera-ture ranges from –40 to +212°F (–40to +100°C).
Contact: Opto Diode, 1260 CalleSuerte, Camarillo, CA 93012 % 805-499-0335 fax: 805-499-8108 E-mail: [email protected] Web: www.optodiode.com
See at NEPCON China, Booth 1H45 and SMTconnect, Hall 4 Booth 101
ElEctronic Mfg Products
Page 26 www.us- tech.com
ElEctronic Mfg Products
May, 2019
Colorado Springs, CO — Virtual In-dustries is now offering its PEN-VAC™ kit, which includes eightprobes, cups and vacuum pen holder.The kit is an excellent solution forhandling small parts.
The V8901-KIT-B PEN-VAC kit is completely self-con-tained. There are no batteries orhoses to get in the way of the op-erator. It is affordable and easyto use. The user simply selects atip with a rubber vacuum cupthat is slightly smaller than thepart to be moved. The probe isplaced on the tip of the vacuumpen, and when the pen’s buttonis pressed, vacuum is engagedand the part can be moved.When the button is pressed asecond time, the vacuum disen-gages, releasing the part.
Virtual Industries’ product linecontains many hand tools that replacetweezers or other gripping means.These tools are portable and eliminatethe need for vacuum hoses or powercords. This makes them suitable forergonomic manipulation of parts dur-ing assembly, inspection, rework, andservice operations. In addition to thehand tools, the company offers a broadline of accessories, including minia-ture rubber vacuum cups, PEEKwafer handling tips and precision-ma-
chined handling tips for critical han-dling applications.
For customers who do not re-quire portability, the company offers aselection of benchtop systems that are
powered by line voltage, compressedair, batteries, or in-house vacuumsources. These tools use a vacuum penthat is tethered by a small-diametervacuum line. Parts that range in sizefrom 0.005 to 11.8 in. (0.13 to 300 mm)can be handled easily.
Contact: Virtual Industries, Inc.,2130 Victor Place, Colorado Springs,CO 80915 % 719-572-5566 fax: 719-572-5504 E-mail: [email protected] Web: www.virtual-ii.com
Virtual: Small Parts Handling with PEN-VAC
V8901-KIT-B PEN-VAC vacuum pen kit.
Santa Clara, CA — Whizz Systemshas implemented an automatedwarehouse system supplied by JukiAutomation Systems. The automatedwarehouse, consisting of eight ISM2000 Fortresses and an ISM 500 in-telligent storage system, replacesWhizz’s warehouse of shelving andracks, while reducing the amount ofspace required.
The Fortress is designed for op-timal management of all reels, re-gardless of the reel diameter orthickness. Now, Whizz Systems’ au-tomated warehouse will store all ofthe necessary material to run com-plex, high-mix, low-volume, high-changeover, NPI assemblies that thecompany manufactures regularly.
Whizz Systems has improvedefficiency by reducing the time andlabor spent trying to locate parts, aswell as realizing quality improve-ments by always picking the correctparts. With the Fortress, there is nolonger the risk of any human-errorselecting the incorrect part, ensuringthat the correct reel is available dur-ing production runs.
Designed for the optimal man-agement of all reels for productionrequirements, the Fortress offers theflexibility to support a combination of7 in. (17.8 cm) reels from 0.3 to 0.6 in.(8 to 16 mm) in height, 13 and 15 in.
(33 and 38 cm) reels up to 3.5 in. (8.8cm) in height, as well as JEDECtrays.
With the possibility of configur-ing up to 640 different positions, inthe ISM500 intelligent static ware-
house it is possible to insert 7, 13 and15 in. (17.8, 33 and 38 cm) reels,JEDEC trays, SMT and PTH tubes,screen printing frames and foils,printed circuits, and PTH compo-nents.
Contact: Whizz Systems, Inc.,3240 Scott Boulevard, Santa Clara,CA 95054 % 408-980-0400 E-mail: [email protected] Web: www.whizzsystems.com
ISM500 intelligent storage system.
Whizz Increases Productionwith Juki Storage Towers
See at NEPCON China, Booth 1H45 and SMTconnect, Hall 4 Booth 101
San Jose, CA — SHENMAO has introduced sever-al new products, including its PQ10 series low-temperature solder paste, PW215 water-solublesolder paste, SMF-WC53 water-soluble, ball-at-tach flux and solder sphere, and water-based wavesoldering flux and water-based cleaner.
The PQ10 series low-temperature solderpaste is made with modified tin-bismuth alloy,which has a lower melting point range. In compar-ison with SnAgCu, PQ10 offers reduced peak re-flow temperature, energy consumption andwarpage of PCBs and components. In comparisonwith the Sn42/Bi58 eutectic alloy, PQ10 series of-fers better ductility, finer microstructure and in-creased drop and thermal reliability.
The P250 series is designed to reduce voidsand improve solderability, especially for automotiveapplications. With a wide process window, it is suit-able for complex PCB designs. Features include:zero halogens; excellent voiding per-formance; excellent solderability;head-on-pillow issue reduction; andimproved insulation reliability.
PF719 provides excellent ther-mal fatigue reliability. The alloy of-fers a similar operating temperaturewindow to typical SAC alloys.SHENMAO’s PW215 solder paste isa specially designed water-soluble,zero-halogen, lead-free solder paste.With its wide reflow window, it canfit easily into the process for compli-cated SMT or IC assembly substratedesigns. Features include: consistentprinting performance; low residue;low voiding; long stencil life; and ex-cellent testability.
SMF-WC53 flux is a halogen-free, water-soluble flux designed foruse in ball-attach processes. It alsoworks well in printing and transferapplications, and offers excellentsolderability on all substrate sur-
face finishes. SHENMAO’s high-reliability series solder
sphere has excellent thermal and impact reliability.
It can be used in a wide range of solder applicationswith various sizes from 2 to 30 mil (50 to 760 µm).
SM-901W water-based, no-clean, liquid fluxis rosin and resin-free. It is designed for lead-freeand tin-lead wave soldering. SM-901W containslow solid contents, including a special organic ac-tivator to improve solderability and reduce fluxresidue. The SMCW series cleaner is designed toremove flux residues and other smudges.
Features include: excellent defluxing per-formance on power electronics and PCBs; halogen-free; excellent cleaning; nontoxic with no flashpoint; and nonflammable and safe on any cleaningequipment.
Contact: SHENMAO America, Inc., 2156Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 fax: 408-684-5477 E-mail: [email protected] Web: www.shenmao.com
May, 2019 Page 27www.us- tech.com
SHENMAO Debuts New Pastes and Fluxes
Midland, MI — Dow Performance Sil-icones has introduced two new ther-mally-conductive silicone technolo-gies: DOWSIL™ TC-3015 thermalgel and DOWSIL TC-5888 thermallyconductive compound. TC-3015 is aone-part, heat cure, silicone basedmaterial with good reworkability.The material can be peeled off easily,completely, and without residue dur-ing the rework process.
TC-5888 combines excellentthermal management with a flowprofile that enhances productivity.This thermally conductive materialfacilitates the design of slimmer,smaller devices that must deliverhigh performance and functionality.
Dow Performance Silicones, abusiness unit of The Dow ChemicalCompany, delivers a portfolio of per-formance-enhancing solutions toserve the diverse needs of customersand industries around the world. Thebusiness uses innovative silicon-based technology to provide solutionsand ingredients to customers in com-mercial construction and high-per-formance building, consumer goods,silicone elastomers, and pressure-sensitive industries.
Contact: The Dow ChemicalCompany, 2211 H.H. Dow Way,Midland, MI 48674 % 989-636-1000Web: www.dow.com
Dow IntrosThermallyConductiveSilicones
Lead-free solder paste.
Compete at a higher level with NT100Ge. Available in solder bar and wire, NT100Ge
has an identical chemical composition and is a seamless drop-in replacement for the
well-known SN100C® solder. Produced with the highest quality raw materials and
delivering the industry’s best price-performance ratio, NT100Ge lowers cost of
ownership, raises competitiveness and produces high-integrity interconnects.
Additional solder alloys:SAC305 / SAC0307 / Sn63 / 99C / NT100GeX
www.nathantrotter.com
Solder SmarterA seamless replacement for SN100C®
NT100Ge
LRO Offers CustomizedMedical Laser Optics
Providence, RI — Laser Research Op-tics (LRO), a division of Meller Op-tics, Inc., has introduced a line ofOEM-quality, fused silica laser opticsthat can be ordered in custom shapesto fit a wide range of surgical instru-ments.
LRO fused silica laser opticsoffer excellent transmission from UVto IR up to approximately 0.1 mil (2.1µm), with a high degree of purity andoutstanding resistance to thermalshock. Well-suited for use in surgicalinstruments, fused silica is highlydurable and can be fabricated in avariety of custom shapes in sizesfrom 0.5 to 4 in. (1.3 to 10.2 cm) O.D.
Manufactured to specification,LRO fused silica laser optics have 10-5 scratch-dig surface quality on bothfaces and an anti-reflective coating.They can incorporate various mount-ing edge treatments and be polishedto lambda/10 or lambda/20 as re-quired.
Contact: Laser Research Optics,120 Corliss Street, Providence, RI02904 % 888-239-5545 fax: 401-331-4004 E-mail: [email protected] Web: www.laserresearch.net
Page 28 May, 2019www.us- tech.com
Corelis Updates Boundary Scan Software
Cerritos, CA — Corelis has launchedversion 9.2 of its ScanExpress™boundary scan tool software suite.The new update contains TeradyneHSSub, ScanExpress icons andScanExpress JET.
Teradyne HSSub support hasbeen significantly improved. TheHSSub can now be configured withup to four TAPs to support systemswith multiple TAPs. A new fast flashprogramming feature has beenadded to significantly improve flashin-system programming speed whenusing the HSSub.
The HSSub parallel IO channelscan now be used as additional bound-ary scan IO devices. Test coverage canbe added by connecting HSSub paral-lel IO channels to boundary scan pinson the unit under test (UUT).
ScanExpress icons have been
updated to provide an improved, con-sistent identity. Updates include ap-plication shortcuts, file icons andmore. The new icon set will be visibleon installation of the Scan Expresssoftware suite.
ScanExpress JET can now sup-port 64-bit ARM Cortex processors.The first in this series is Xilinx ZynqUltraScale+ MPSoC, with basic RAMand flash support. In addition to 64-bit CPUs, Microsemi SmartFusion2SoC FPGAs are now supported. Ex-isting Corelis customers with a validmaintenance contract can now accessthe new software version throughCorelis’ support website.
Contact: Corelis, Inc., 13100Alondra Boulevard, Cerritos, CA90703 % 562-926-6727 E-mail: [email protected] Web: www.corelis.com
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Prevent connection failures in thick PCB substrates with plasma treatment
New VIA™ Series 2.5 cleans deep, narrow vias where other processes can’t go VIA™ Series 2.5
Plasma System
Medical laser optics.
May, 2019 Page 29www.us- tech.com
Waltham, MA — Excelitas Technologies® Corp. offers aportfolio of UV LED curing systems. The OmniCure LX500UV LED spot curing system is available in either two- orfour-head system configurations with up to 16 W/cm2 peakirradiance. The system is designed to provide optical stabil-ity with its Intelli-Lamp® LED technology.
The LX500 is suitable for use in medical devices, suchas catheters, cannulas, endoscopes and syringes, electroniccomponents, such as OPU, smartphones and tablets, andgeneral-purpose, small component applications, such asbonding and coating.
The company’s OmniCure AC8-HD (high dose) seriesof UV LED curing systems offer higher optical power andenhanced performance in the same air-cooled mechanicalenclosure as the AC8 and AC9 models.
The AC8-HD delivers over 50 percent more dose withexcellent uniformity. The company’s patented control tech-nology for addressing individual UV LED modules enablestight irradiation across the UV-emitting length, as well as
between heads.Excelitas’ OmniCure AC5 series of UV LED
curing systems is designed with high-output LEDsand custom optics.
The OmniCure AC550/P and OmniCureAC575/P air-cooled UV LED curing systems providehigh irradiance (14 W/cm2), enabling manufacturersto achieve outstanding productivity and reduce run-ning costs using LEDs with long lifetime and lowerelectrical consumption.
OmniCure AC5 Series LED Systems are idealfor curing inks, adhesives and coatings in printingapplications, such as labels, barcoding and packageprinting, and for industrial and electronics manu-facturing applications.
Contact: Excelitas Technologies Corp., 200West Street, Waltham, MA 02451 % 781-996-5925 E-mail: [email protected] Web: www.excelitas.com
Excelitas Offers UV LED Curing Solutions
Santee, CA — StratEdge’s packagesare designed to meet the extremeneeds of gallium nitride (GaN) andgallium arsenide (GaAs) devices andthe critical requirements of the tele-com, mixed signal, VSAT, broadbandwireless, satellite, military, test andmeasurement, automotive, down-hole, and MEMS markets.
The company offers a line of post-fired, ceramic, low-cost molded ceram-ic and ceramic QFN packages. Strat-Edge also has a new ISO 9001:2015-certified facility with a Class 1000cleanroom, including Class 100 workareas with ESD control for performingsensitive operations.
The company’s LL family ofleaded laminate copper-moly-copper(CMC) base packages are designed to
provide enhanced thermal dissipa-tion for high-power gallium nitridedevices and come in fully hermeticversions in over 200 standard out-lines.
StratEdge’s post-fired andmolded ceramic packages for high-re-liability and military devices operatefrom DC to greater than 63 GHz.These packages have electrical tran-sition designs that ensure exception-ally low electrical losses and operateefficiently, even at very high frequen-cies. All packages are lead-free andmost meet RoHS and WEEE stan-dards.
Contact: StratEdge Corp., 9424Abraham Way, Santee, CA 92071 % 858-569-5000 E-mail: [email protected] Web: www.stratedge.com
StratEdge:Post-Fired,Molded Ceramic and CeramicPackages
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See at SMTconnect, Hall 4A Booth 530
Page 30 May, 2019www.us- tech.com
www.westbond.com1551 S. Harris Court Anaheim, CA 92806 Tel 714·978·1551
Manufactured in the U.S.A. since 1966
Ucamco Develops Formatfor PCB Drill Data
San Francisco, CA — Ucamco, KiCadand Pentalogix have developed XNC,a format for PCB drill data, with thesupport of Graphicode, Cuprum andZofzPCB. XNC is a strict subset ofthe ubiquitous NC or Excellon data.Freely available and simple to imple-ment, XNC is designed to take theconfusion out of CAD software devel-opment and the CAD-CAM drill dataexchange process.
From CAD development to CAMengineering processes, existing NCdrill data CAD-CAM transfer process-es are deeply flawed, due to the use ofinappropriate data format specifica-tions. The simplest solution would beto use the Gerber format to transferdrill data instead of NC formats. How-ever, for decades, drill information hasbeen transferred using formats suchas Excellon that are similar to the1985 IPC-NC349 specification, andmuch legacy software is still in use.
The problem is that so many NCfiles are of deplorable quality. This isbecause the NC format, designed as amachine driver rather than for datatransfer, contains all sorts of infor-mation that is confusing and irrele-vant for CAD-CAM. Not least for theCAD software developer, whose job itis to wade through overcomplicatedformats and pick the parts that couldserve the CAD-CAM data transferprocess, inevitably including morethan necessary, thereby adding fur-ther confusion, for fear of missing outon important elements.
The first step towards improv-ing the NC drill chaos is to develop asimple, clear specification based onan existing format that can be read
by all decent PCB drill input soft-ware. To this end, some of the world’sleading CAD software houses havetogether developed the CAD/CAMExchange NC format (XNC), a com-plete, compact and unequivocal sub-set of IPC-NC-349 that transfersCAD/CAM drill information withoutthe need for additional sidecar files.
They have added to this thepower of Gerber-type attributes thatprovide machine-readable metadataon complete files, tools or individualholes, that describe their characteris-tics in a standard, flexible way. XNCfiles can be added seamlessly to Ger-ber X2 data sets, while also ensuringthat the format is compatible withsoftware that does not read attributes.
With XNC, CAD developers cancreate output software easily andquickly, using formats that are al-ready well-known, but without hav-ing to choose from a bewilderingarray of possibilities and functionali-ties, or reverse engineer from multi-ple incomplete and confusing NCfiles. Its designers guarantee that ifCAD developers limit themselves tousing just the XNC format, they willgive their clients exactly what theyneed: a tight, unequivocal problem-free specification that will improvethe CAD-CAM data transfer processovernight, and an NC reference thatpaves the way to a common standardfor NC files.
Contact: Ucamco USA, 1388Gough Street, Suite 407, San Francisco, CA 94109 % 415-508-5826 E-mail: [email protected] Web: www.ucamco.com
See at SMTconnect, Hall 4A Booth 530
May, 2019 Page 31www.us- tech.com
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Greer, SC — Creform Corporationhas designed a stepped ESD flowrack as part of an overall evaluationof new accessories and options for alongstanding customer. The rack hasfour levels for product presentation.Each of the four levels has threelanes, while the top level allows theempty container to be returned to theservice aisle.
The flow rack is built with ESDlight gray pipe and nickel-platedmetal joints per the assembler’s anti-static requirement. Each of the flowrack’s lanes include Creform’s ESDskatewheel conveyor rollers.
The rack’s lanes have physicalseparators on both sides, so boxes arecontained and separated as they flow
smoothly. Each supply lane has anextra angle at the picking position forenhanced view and for easier compo-nent selection. Label holders for eachlane are included for the front andback to ensure accurate loading andaccurate picking.
With the stair-stepped design,each level can be raised or loweredwithout changing the length of theconveyor. This greatly simplifies ad-justment when needed. The rack andits levels can be repositioned withsimple tools.
The supply lanes have an EF-2018 pivoting stop (an anti-back de-vice). This gravity “stopper” allowsmaterial to be loaded unimpeded andthen flips up to keep the container
securely in its lane. The swing arm ofthe EF-2018 rests in the up position.The flow rack has six heavy-dutystem casters, which allow for ease ofmovement and relocation.
The flow rack pictured meas-ures 70 x 77 x 46 in. (178 x 196 x 117cm) and is designed to hold up to 800lb (363 kg). Higher-capacity, customrack sizes and configurations arealso available. Creform flow racksare available as a kit or an assem-bled structure or in the componentform for a complete DIY solution.They are suitable for warehouse ormanufacturing plant use and areused to present production parts to amanufacturing cell, assembly line oruse for order picking or kitting.
The Creform system is used tocreate any array of material han-dling and efficiency enhancing de-vices and is a proven component incontinuous improvement and leanmanufacturing programs. The com-pany partners with customers in de-veloping and implementing theseprograms.
Contact: Creform Corp., P.O. Box 830, Greer, SC 29652 % 800-839-8823 E-mail: [email protected] Web: www.creform.com
Page 32 May, 2019www.us- tech.com
Creform Designs ESD Flow Rack
CRE-610 ESD stepped flow rack.
CircuitronicsExpands ConformalCoating CapabilitiesIrving, TX — Circuitronics recentlyexpanded its production facility. Thecompany has added to its conformalcoating production area to furthersupport acrylic-based conformal coat-ing solutions.
Circuitronics can now betterserve customers that require theirproducts to be reliable in high-hu-midity environments or have con-cerns about other environmental fac-tors. The company uses an automat-ed PVA machine for CNC coating ap-plication, as well as a curing ovenand UV curing.
Circuitronics also performs man-ual processes, such as spray or dip,and visual inspection using UV reac-tive coatings. The blacklights installedin the production booth provide visualfeedback for quality control.
Contact: Circuitronics, Inc.,1920 Hurd Drive, Irving, TX % 214-460-0817 E-mail: [email protected] Web: www.circuitronics.com
Circuitronics’ conformal coatingarea, Irving production facility.
May, 2019 Page 33www.us- tech.com
See at NEPCON China, Booth 1J50 and SMTconnect, Hall 4 Booth 221
Page 34 May, 2019www.us- tech.com
PDR Enhances ThermoActive Software
Shingle Springs, CA — PDR haslaunched new software features thatcomplement its award-winning Ther-moActive Suite software. The new
“Events Module” offers enhancedaudio, visual and machine functionactivation tools that allow the opera-tor to set up audio tones, visual oper-ator messaging and machine func-tion activities, such as forced air cool-ing and vacuum pump activation, inan easy-to-use operator interface.
PDR’s ThermoActive Suite Plusoffers simplicity, while providingpowerful behind-the-scenes controlto achieve maximum rework produc-tivity.
With six PDR-supplied generalprofiles, PDR’s dynamic software au-
tomatically adjusts the wattage re-quired to achieve high-yield small-,medium-, and large-board rework.
The ThermoActive Suite Plus
does not require a “teach/learn”mode, meaning it is capable of self-adjusting thermal output to reachsafe reflow temperatures automati-cally. As a result, users see a reduc-tion in time and effort required forprecision process/profile develop-ment. In “auto profile” mode, thesoftware dynamically responds by in-creasing or decreasing maximumheat relative to the environment,ramp rate and temperature limits.
Contact: PDR Americas, 3869Dividend Drive, Shingle Springs, CA95682 % 530-676-6262 E-mail: [email protected]
PDR’s ThermoActive software offers powerful control of the rework process.
May, 2019 Page 35www.us- tech.com
The Hanwha/ESE US-2000XF is a fully automatic printer for Smart Factory and Industry 4.0, and offers auto-changeover of up to 8 stencils meaning that eight different jobs can be preloaded and the machine will do each one without an engineer touching it. It also does under-board support tooling in less than 3
minutes for maximum efficiency, and lowest cost of operation.
Paperless cleaning saves money and time, and quick change-out cartridges can be replaced in less than 5 seconds. The Hanwha/ESE’s adjustable
stencil rails eliminate the need for expensive stencil adapt-ers that are time-consuming to setup and
can get lost, bent or dam-aged.
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See at NEPCON China, Booth 1H55 and SMTconnect, Hall 4A Booth 310
Page 36 May, 2019www.us- tech.com
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Vacuumschmelze IntrosAutomotive-Qualified
Standard CoresHanau, Germany — The trend to-wards electromobility is accompa-nied by a strong expansion of thecharging infrastructure and the in-creasing demand for future-oriented
technical solutions for a large num-ber of applications. The latest prod-uct developments from Vacuum-schmelze (VAC) are highly perme-able, nanocrystalline cores for com-mon-mode suppression. This stan-dard series, automotive-qualified ac-cording to AEC Q200, is now avail-able in a sample case.
The cores were developed foruse on the high-voltage DC batteryor on the DC output of the drive in-verter, as well as on the AC output ofthe drive inverter in hybrid and elec-
tric vehicles. The new series is avail-able in two permeability levels, thevalues for toroidal cores are µ =30,000 and µ = 100,000, for oval coresthey are µ = 30,000/70,000. The de-
signs take into account “TechnicalCleanliness” according to VDA 19Part 2 and the ZVEI guideline “Tech-nical Cleanliness in Electrical Engi-neering.” The sample case containsboth, ring and oval cores, in all avail-able dimensions.
Contact: VacuumschmelzeGmbH & Co. KG, Grüner Weg 37,63450 Hanau, Germany % +49-6181-0-38-2342 E-mail:[email protected] Web: www.vacuumschmelze.com
See at PCIM, Hall 7 Booth 123
Nanocrystalline cores for common-mode suppression.
May, 2019 Page 37www.us- tech.com
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SCHURTER Intros Versatile Power Entry
ModuleSanta Rosa, CA — SCHURTER haslaunched its most versatile power
entry module (PEM), series DG12,extending its DG11 series to includea mains filter. The new PEM inte-grates an IEC inlet, circuit breaker,and mains filter, with optional IPprotection. The compact design, withits many features, consolidates dis-crete power components into onespace-saving unit, suitable for a vari-ety of applications.
The DG12/DG11 contains a re-cessed, two-pole, on/off rocker switchcircuit breaker with one- or two-poleovercurrent protection. Various col-ors and markings for both illuminat-
ed and non-illuminated switches areavailable. Current ratings range
from 0.05 to 15A.The IP67 unit in-
cludes a circuit breakerwith a factory-mountedseal cover and frame withinlay gasket, designed tomount tightly to the frontpanel with sealed screws.Mounting options includesnap-in, 0.04 to 0.1 in. (1to 3 mm), screw-mount,front or rear panel withtop/bottom, or side flange.
The DG12 includes astandard and low-leakagemains filter, as well asstandard and higher in-ductive performance op-tions. The filters are avail-able in current ratingsfrom 1 to 10A at 250 VACaccording to IEC, and 15Aat 250 VAC according to
UL/CSA. The filter series is availablein standard or medical versions forProtection Class I and II. Applica-tions include IT or telecom systemsaccording to IEC 90650, and medicaldevices according to IEC 60601-1.The series is compatible with V-lockcord retention connection cables.
Contact: SCHURTER, Inc., 447Aviation boulevard, 95403 Santa Rosa, CA % 707-636-3000 E-mail: [email protected] Web: www.schurterinc.com
See at EDS, Suite B56
DG12 series power entry module.
See at SMTconnect, Hall 4A Booth 530
Page 38 May, 2019www.us- tech.com
Parylene (XY) polymers provide robust, dielec-tric, micron-thin conformal coatings for aconsiderable range of electronic devices, most
prominently printed circuit boards (PCBs). XY’sunique chemical vapor deposition (CVD) applica-tion method synthesizes in-process, depositinggaseous parylene deep into a substrate’s surface.
CVD occurs on a molecule-by-molecule basis,conforming to all underlying contours, regardlessof shape or position — to the nanometer, if neces-sary. Pre-synthesized liquid coatings lack many ofparylene’s performance properties, having far lessability to successfully and conformally penetratecrevices in the substrate.
Additional CVD advantages include:
l Room-temperature processing, allowing damage-free coating of even the most delicate components.
l Vaporous XY flows anywhere there is air, coating under parts, inside small crevices andsemi-sealed areas.
l Sub-surface penetration seals crevices and irregular, tightly confined areas, while forming an additional layer of protection.
l Micro-thin films coat exceptionally confinedtopographies, without forming bridges, drippingor running like liquid coating materials.
Although there are two basic kinds of pary-lene dimer — C and N — other formulations exist,including D, F and HT. Each displays specifiedperformance metrics, characterized by differentelectrical and physical properties.
Types of Parylene
Of parylene types, Type HT has the highestpenetrating ability, as well as the lowest coeffi-cient of friction and dielectric constant. It is also
expensive to make and used essentially for special-ized purposes, limiting its application for a widerange of conformal coating assignments.
Of the more common XY varietals, ParyleneN is the base structure of the parylene group, offer-ing a higher dielectric strength than C, F or D. Inaddition, it penetrates crevices and other cracks orgaps in substrate surfaces more capably than theothers. Type N does this because enhanced molec-ular activity occurs during CVD, in comparison tothe remaining XY varieties, allowing more efficientcoating of relatively deep recesses, blind holes,tubes and small openings.
Parylene C is used more frequently than anyother XY variety. It offers better performanceacross most metrics, generating exceptional pro-tection from corrosive gases, due to low chemical,moisture, and vapor permeability.
Depositing quickly on most substrate sur-faces, C’s lesser throw capability can reducecrevice penetration activity. It provides less crevicepenetration than Type N. With chlorine atomsadded to its benzene ring, Parylene D film hasgreater thermal stability than N, F or C. Crevicepenetration capacities are lower in comparison toother XY varietals.
With a chemical structure of four fluorineatoms on the aromatic carbons, Type F providesgood crevice penetration. Its dimer is also very ex-pensive, limiting its use for many conformal coat-ing projects.
CVD processes convert powdered parylenedimer into a vapor. The resultant coating substance
Diagram showing the contrast between a liquid and parylene coating.
Conformal Coating Crevice Penetration Using Parylene
Continued on next page
By Sean Horn, Diamond-MT Parylene Coating Services
Morrisville, NC — SCHUNK Electronics Solutionshas introduced its ILR-2200, a fully automatic, in-line depaneling machine that separates individualPCBs from large panels using a milling module.
The machine is modular, allowing manufac-turers to buy a cost-effective basic version andretrofit the machine at any time with milling andgripping modules, a camera system or a second, oreven a third, PCB handler. The machine is de-signed to grow as a company’s needs change.
ILR-2200 users benefit from short cycle times.The panels reach the machine’s interior in less thantwo seconds, propelled by a linear motor and high-speed feed. There, a milling module separates thePCBs with an accuracy of ±0.004 in. (±0.1 mm). Dueto the linear motor axes and moderncontrol technology, the modulesachieve a traverse speed of 6.6 ft/s (2
m/s) when milling and 33 ft/s (10 m/s) when sawing.The separated PCBs are placed on a conveyor
belt or in a shuttle system by a gripper to be trans-ported for further processing. The gripper workswith a programmable angular position andachieves positioning accuracy of ±0.0008 in. (±0.02mm). This corresponds to a third of the diameter ofa human hair. The modular system allows millingand sawing to be done in a single machine and itsaccuracy ensures that sensitive components arenot damaged.
Contact: SCHUNK, 211 Kitty Hawk Drive,Morrisville, NC 27560 % 919-767-2013 E-mail: [email protected]: www.schunk.com
See at NEPCON China, Booth 1F08
May, 2019 Page 39www.us- tech.com
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responds with reliable conformity tosurface geometries, including crevices,hidden areas, points, sharp edges, andexposed internal surfaces.
Only XY offers this level ofadaptability to highly complex coat-ing problems, generating precise con-formance to substrate topographywithout bridging or pooling. Appliedin micron-thin layers, parylene’s pin-hole-free coverage penetrates andcoats complex surfaces to a degreeimpossible with liquid conformal filmmaterials.
Ultimately, CVD is responsiblefor XY’s exceptional crevice penetra-tion. Since the film is formed as avapor from a molecular state, and de-posits on a molecule-by-moleculebasis, it readily adapts to the preciseconfigurations of substrate topogra-phy. It accommodates and fillscrevices and fissures on the surface,whether they are a designed aspectof the board or a production accident.In any case, the gap is filled with adurable, micron-thin parylene con-formal film, regardless of surfacecomplexity.
Contact: Diamond-MT, 213Chestnut Street, Johnstown, PA15906 % 814-535-3505 fax: 814-535-2080 Web:www.paryleneconformalcoating.com r
ConformalCoating Penetrationwith ParyleneContinued from previous page
The modular ILR-2200 depaneling machinecan be easily adapted to production changes.
SCHUNK Introduces Modular Depaneling Machine
Your story.Your reprint.From U.S. Tech.Articles appearing in
U.S. Tech are provided to
contributors as reprints, both
in hard copy and as PDFs.
It’s our way of saying thanks.
Contact Michael Skinner, Editor, with your thoughts on a contributed article.
See at NEPCON China, Booth 1G20 and SMTconnect, Hall 4 Booth 101
Vista, CA — APEM has introduced itsJC series multi-axis Hall effect joy-
stick. Designed specifically for key-board integration, the JC series meas-
ures just 1 in. (26 mm) below panelmaking it an excellent solution wherespace is limited and precision controlis required. Applic ations in-clude security and surveillancecameras, medical devices andmeasurement systems.
The JC series utilizesproven Hall effect technologyto provide up to five millionlifecycles of control. With overa dozen handle options, the JCseries may be configured withup to three axes and two push-buttons. The JC series has aprecision spring centeringmechanism that provides anoptimal return-to-center volt-age of 80 mV. The JC series isintended for clean environmentindoor applications with an operatingtemperature ranging from –13 to+176°F (–25 to +80°C).
The JC series will replaceAPEM’s best-selling HFX Side Plateseries. The JC series includes identi-
cal mounting cut out dimensions andis backwards-compatible with allHFX Side Plate series applications.
Contact: APEM, Inc., 970 ParkCenter Drive, Vista, CA 92081 % 877-246-7890E-mail: [email protected]
Web: www.apem.com
See at EDS, Suite 21-046
Orlando, FL — A fully functional“Simon Says” game was the result ofa recent joint project of the U.S.Army Armament Research, Develop-ment and Engineering Center(ARDEC), Army Research Laborato-ries (ARL), and nScrypt, Inc., to di-rect digitally manufacture (DDM) a3D printed circuit structure.
The team used an nScrypt Fac-tory in a Tool (FiT), which simultane-ously runs multiple tool heads withvarious materials for material extru-sion, precision microdispensing, pre-cision micro-milling, pick-and-place,thermal processing, and vision feed-back, in a single machine.
The team first extruded thegame’s main structure with ABS,then milled the surface to accept themain circuitry and dispensed 3.9 to7.9 (100 to 200 µm) conductive traces,
using NovaCentrix Metalon HPS-FG57B, dispensed conductive pads forbattery terminals, and then extrudedfour colors of PLA, leaving open cavi-ties for LEDs and a button, resistorand microcontroller, which the ma-chine inserted by pick and place. Toprovide an electrical connection to thecomponents, fresh material was dis-pensed on all pads where they attach.
The team’s results are reportedin a paper titled “Direct Digital Man-ufacturing for 3D Electronic Packag-ing,” authored by James Zunino,ARDEC, Jaret Riddick, ARL, KenChurch, CEO, nScrypt, and nScryptengineers Sam Leblanc, CaseyPerkowski and Dasan Costandi.
The paper distinguishes be-tween 3D electronic packaging, whichstacks semiconductor chips in, essen-tially, a 2.5D approach, and true-3D-printed circuit structures. The teamenvisions electronics “permeatingthrough structures, providing sens-ing, controls and smart features,” anddevices that “feel, smell, see, hear,communicate, and actuate.”
Contact: nScrypt, Inc., 12151Research Parkway, Suite 150, Orlando, FL 32826 % 407-275-4720 E-mail: [email protected] Web: www.nscrypt.com
Page 40 May, 2019www.us- tech.com
nScrypt and U.S. Army3D Print Circuit
Structure
3D-printed circuit structure, thebasis for a “Simon Says” game.
See at EWPTE, Booth 1761 and BIOMEDevice, Booth 414
komaxgroup.com
MIRA 340wire stripper
The programmable Mira 340 is designed for
universal use while maintaining maximum precision. It is perfect
for processing wires and insulation material with demanding requirements.
The Mira 340 is fitted with a rotary head with 4X-blades and offers unique
functions designed to reduce production time and increase quality. Thanks to sequential
processing, multi-conductor cables and multi-layer insulation material can be processed quickly,
thereby saving time and increasing productivity.
APEM Launches Multi Axis Hall Effect Joystick
JC series Hall effect joysticks.
See at EWPTE, Booth 1131
May, 2019 Page 41www.us- tech.com
© Copyright 2018 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement.
US, Canada, Mexico: panasonicfa.comEurope, Global: industrial.panasonic.com
More inputs, tighter accuracy and expanded capabilityThe NPM-WX series delivers new innovative technology—combining speed and autonomous control with single- and dual-beam motion—into a cost-effective, high-mix solution for the Small- to Mid-market.
Optimized efficiency• Remote access to error conditions and recovery• Automatic recovery to improve your OEE• Seamless MES integration across full-line solutions via iLNB
Speed and power• Speeds up to 86,000 CPH• Versatile board handling and size capabilities• High-capacity feeder capability• Full-spectrum component range
Compatibility• Utilize with Panasonic and third-party equipment• Seamless pairing with the W2, D3 and TT2 models• Combine NPM-WX with NPM-DX for greater output in less
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See at NEPCON China, Booth 1C55, SMTconnect, Hall 4 Booth 311 and PCIM Hall 6 Booth 345
Page 42 May, 2019www.us- tech.com
Delaware, OH — Engineered Materi-al Systems, Inc., has introduced itsNR-5000 series of liquid nega-tive photoresists for microflu-idics and wafer-level metalliza-tion processes. These materialformulations have viscositiesoptimized for wafer coatingsfrom 0.2 to 2 mil (5 to 50 µm) inthickness.
The NR-5000 series dry-film resist also can be used tocreate various permanent fea-tures on wafers. When used inconjunction with the 412-17
EMS adhesion promoter, the resist iscapable of surviving HAST testing on
silicon wafers. This liquid resist iscapable of extreme fine line andspace definition in complex patternswith resolutions down to 0.1 mil (3µm). The cured chemistry can with-stand harsh environments, includingresistance to extreme moisture con-ditions and corrosive chemicals.
EMS NR-5000 series liquid re-sists are tougher (less brittle) thanother negative photoresists on themarket with glass transition temper-atures ranging from 248 to 392°F(120 to 200°C). The material is hy-drophobic in nature, providing chem-ical and moisture resistance. EMSliquid resists are compatible withand can be used in contact with theEMS line of dry-film negative tonephotoresists.
The NR-5000 series negativephotoresists are the latest addition toEngineered Materials Systems’ fullline of film and liquid negative pho-toresists formulated for lift off process-es, via sealing and making microflu-idic channels on MEMS devices.
Contact: Engineered MaterialsSystems, Inc., 100 Innovation Court,Delaware, OH 43015 % 740-203-2947 E-mail: [email protected]: www.emsadhesives.com
EMS Intros Spin-OnLiquid Negative
Photoresist
Diagram of silicon coated with layersof photoresist.
Chicago, IL — ACL Staticide® has in-troduced knit ESD gloves to its ESDworkbench product line. Thegloves protect against static dis-charge and are useful for detailedassembly and inspection work.Washable and reusable, thegloves are offered with and with-out polyurethane fingertips.
Lightweight and seamlessin construction, the knit ESDgloves provide a comfortable,breathable fit with low moistureabsorption. The micro-knit fin-gertips offer superb dexterity forworking in ESD-sensitive areas.
Made from blended nylonconductive yarn, the gloves areavailable in small to double-XLsizes with color-coded wristbandsfor easy identification. They arepackaged six pairs per pack (sixpacks per case).
ACL Staticide has supplied elec -tronics manufacturers for 50 yearswith products for the automotive,avionics, medical device, plastics, andtelecommunications industries. ACLoffers a range of products that includestatic control products designed for
ESD-protected areas, contaminationcontrol products for critical environ-
ments and enhanced precision prepa-ration products for PCB rework, re-pair and prototyping.
Contact: ACL Inc., 840 W. 49thPlace, Chicago, IL 60609 % 847-981-9212 E-mail: [email protected] Web: www.aclstaticide.com
Knit ESD gloves with polyurethane fingertips.
Find Electronic Failures with Vibration Testing
Benchtop Vibration Table
Contact us for more info.
Cincinnati Sub-ZeroCincinnati, OH
(p) 513-772-8810www.cszindustrial.com
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To obtain electrical impedance ofa device under test, techniciansand engineers often employ a
technique called “four-wire sensing,”“Kelvin measurement,” or the “four-probe method.” While it is possible touse four individual probes, by using
certain INGUN probes and contacts,this task may be completed by usingonly two coaxial probes instead.
Four-wire measurement uses apair of voltage-sensing and current-carrying pins to make more accuratemeasurement than a two-wire meth -od. The effects of the wire length areeffectively calibrated out of the meas-urement. This type of sensing is usedin some ohmmeters, impedance ana-lyzers, wiring for strain gauges, andresistance thermometers.
One typical application forthese contacts and probes is produc-tion line testing of individual batterycells, for example in the automotiveindustry. The weld joint in some ofthose cells (for example, the hugelypopular 18650 cells) contributes tothe overall performance of an assem-bled battery pack.
A loose connection or defectivejoint could increase the internal re-sistance. Quite often, those resist-ances are very small and thus hardto detect with conventional methods.
Kelvin Sensing
Four-wire Kelvin connectionsuse a pair of current connections,which are known as force connec-tions. These, according to Ohm’s law,generate a voltage drop across theimpedance that has to be measured.The pair of the sense connections forvoltage is run adjacent to the forceconnection, so there is no voltagedrop in the force leads.
This is where the INGUNprobes come in and why they are sohandy for these types of measure-ments. Both the outer conductor andthe center conductor travel the samedistance and have the same length(e.g., the INGUN DPS probe series).
Such a probe can be placed eas-ily on individual battery cells orother components, where four-wiremeasurements are needed. The outerconductor usually has a higher cur-rent (force) connection, whereas thecenter conductor is used for voltage(sense). Of course, one is not limitedto battery cells, as there are also clipconnector probes available that canmate with a variety of high-current
and high-voltage blade connectors(INGUN VKF series) or even roundconnector posts with safety pin(INGUN HKR series — R designates“round”). Lastly, one can also usefour individual probes, such as theGKS-112 M probe series, which is alower-cost alternative to other op-tions, or the GKS-503 M series, witha continuous plunger and thus verylow resistance design.
The INGUN probes provide areliable and repeatable temporary
electrical interconnect for end-of-linetesting. While there are severalprobes available by the manufactur-ers of four-wire test equipment, al-most none of these can be imple-mented in a semi or fully automatedtester for end-of-line testing. Usuallythose probes consist of handheld nee-dles with banana plug connectionsfor the tester.
This is where the INGUN probesshine, because their spring contactsallow them to be easily disconnected
after the test is done. The probes themselves do not
have retention force, as this is appliedby the test fixture.
Recommended Probes and Contacts
INGUN offers coaxial typeprobes in its DPS, HFS and HSS se-ries, where two probes are needed:DPS-215 M, DPS-465 M, HFS-010,HFS-110, and the HSS-624 M. Flat
May, 2019 Page 43www.us- tech.com
Four-wire sensing for voltageand current.
Four-Wire Measurement with INGUN’sKelvin Probe and Contact Series
By Matthias Zapatka, INGUN USA
Continued on next page
See at NEPCON China, Booth 1J20 and SMTconnect, Hall 4A Booth 120
Page 44 May, 2019www.us- tech.com
Four-Wire Measurementwith INGUN’s Kelvin Probeand Contact Seriesblade contacts are available in theHKF and VKF series, with twoprobes needed: VK-541 M and VKB-
635. Round pin contacts are avail-able in the HKR series, with twoprobes needed: VKR-672 M.
For single-probe contact, thecompany offers its GKS and HSS se-ries, with four probes needed: GKS-112 with a conventional probe de-sign, HSS-118 M, which has a con-ventional design and high current ca-pacity, and the GKS-503 M, with a
continuous plunger design.It is recommended to pair these
probes and contacts with a corre-
sponding receptacle (socket), whichallows for easy replacement. Inser-tion tools to install the probes shouldalso be used.
Contact: INGUN USA, Inc., 252Latitude Lane, Suite 105-106, Lake Wylie, SC 29710 % 803-831-1200 fax: 803-656-5080 E-mail: [email protected] Web: www.ingun.com r
A flat blade probe, INGUN VK-541 M series with wiping action to break oxidation layers.
Torrance, CA — Seika Machineryis now offering the SPS-10 solderpaste softener from MALCOM.MALCOM’s latest system is anew version of its proven solderpaste softener that the companyhas supplied for many years.
The updated system nowcan store up to nine condition set-tings and the digital time can beset in 10-second intervals. TheSPS-10 creates centrifugal forcethat causes solder paste to re-peatedly fold over on itself, soft-ening it and bringing it up toroom temperature.
The system’s auto balance func-tion will work with containers insizes of 1.1 to 2.2 lb (0.5 to 1 kg). Sol-der paste can be conditioned from therefrigerator to prepared for produc-tion in approximately 10 minutes.
Contact: Seika Machinery, Inc.,3528 Torrance Boulevard, Suite 100,Torrance, CA 90503 % 310-540-7310fax: 310-540-7930 E-mail: [email protected] Web: www.seikausa.com
Seika Offers New MALCOMSolder Paste Softener
MALCOM SPS-10 solder paste softener.
Continued from previous page
Mulino, OR — ExpressPCB® is excit-ed to announce a reduced-cost flatrate two-day shipping option throughUPS for its latest versions of both Ex-pressPCB Classic and Plus.
ExpressPCB continues to addfeatures and services that allow de-sign engineers to be as efficient aspossible. The company helps bringcustomers’ ideas to life with freeCAD software, coupled with thehighest quality and lowest manufac-turing costs possible. Reducing de-sign cycles and validation time canhave a huge impact on the cost of agiven project.
ExpressPCB is an establishedleader in providing software andmanufacturing solutions for high-quality, low-cost, and quick-turn-around prototyping.
With 20 years of experience andnearly one million completed proj-ects, the company delivers easy-to-use PCB design software and high-quality, on-time PCB prototypes.
ExpressPCB is committed toimproving the prototyping processfor design engineers of all levels andabilities.
ExpressPCB’s schematic andlayout tools are simple and unen-cumbered by multiple layers ofmenus, options and settings thatmore advanced PCB design suites re-quire mastering before a project be-gins.
Contact: ExpressPCB, LLC,13626 S. Freeman Road, Mulino, OR97013 % 503-759-2338 E-mail: [email protected] Web: www.expresspcb.com
ExpressPCB Now OffersTwo-Day Flat Rate Shipping
See at EDS
May, 2019 Page 45www.us- tech.com
EA Launches Displaysfor Low-Power Devices
Gilching, Germany — Display spe-cialist Electronic Assembly haslaunched a multifaceted EA DOGproduct family of displays designedfor low-power handheld devices.
They operate at 3.3V standard andrequire approximately 150 to 350 µA.Optional LED illumination is alsodesigned for 3.3V. The brightestwhite LED starts at 3 mA.
The panels, which are only 0.08in. (2 mm) thick, are currently avail-able as text and graphic displays inten different sizes and five differentdisplay technologies — as transmis-sive, reflective or blue STN, as wellas positive or negative FSTN. Alltechnologies are standard and avail-able starting from a single unit. Thedisplays can be combined with sixseparate backlights in white, amber,blue, red, yellow/green, and full color,by simply plugging them together.
Due to the compact design, an ex-tremely flat display module with amaximum height of 0.23 in. (5.8 mm)is obtained when combined with light-ing. Without any additional mounting,it can be soldered directly to the circuitboard with a 0.1 in. (2.5 mm) grid.
The text displays are suppliedwith 1 x 8, 2 x 16, 4 x 10 (switchableto double font height of 2 x 10), as wellas 4 x 16, and 4 x 20 characters. The
graphic variants are available in theresolutions of 122 x 32, 102 x 64, 160x 104, 240 x 64, and, 240 x 128 pixels.The outer dimensions vary from 1.5 x1.6 in. (39 x 41 mm) and 3.7 x 2.6 in.
(94 x 67 mm). All displays areequipped with an SPI interface. Thetext displays also have a four- oreight-bit interface, and some modelsare equipped with I2C interfaces.
With integrated temperaturecompensation, the thermal applicationrange of the new displays is from –4 to+158°F (–20 to +70°C). Individual EADOGs support English, European andCyrillic character sets in a single dis-play. They are available in both largeand small quantities at short notice.The company guarantees long-termavailability of up to ten years.
Developers have access to a USBtest board with PC connection andsuitable Windows software, includinga free simulator and a great deal of Cand microcontroller codes for easysystem start up and prototyping.
Contact: Electronic AssemblyGmbH, Zeppelinstrasse 19, 82205Gilching, Germany % +49-0-8105-77-8090. fax: +49-0-8105-77-8099 E-mail: [email protected] Web: www.lcd-module.com
See at EDS, Suite B28
EA DOG displays for low-power handheld devices.
See at EDS
During manufacturing of integrated circuits(ICs), it is necessary to perform many depo-sition and etching steps to build the internal
structures. Among the most common are ashing, orstripping, to remove photoresist from etchedwafers, as well as the “descum” process to removeany residue.
Although solvents can be used to remove pho-toresist in a “wet” process, alternatives that allowfor dry processing are often sought out, due to re-ducing chemical handling and acquisition costs.Among the alternatives for dry processing areplasma tools that apply ionized energy forwafer ashing and descum.
Advanced and automated plasmaetchers have been available since the ear-liest days of the semiconductor industry.However, plasma processing has been ex-panded to include the removal of polymers,SU-8 removal and sacrificial layers forwafer cleaning, chip carrier cleaning, en-capsulation and flip chip underfill, and forwafer stress relief, chip side healing (CSH)and passivation for ultra-thin wafer tech-nologies.
Given the maturity of the market andthe refinement of processing techniques,plasma etchers — at least on the front-end— are relatively standardized, with fixedformat, off-the-shelf options. However, withthe addition of more back-end applicationsalong with the explosion of MEMs, mi-crofluidic devices, power devices, HB-LED, PLED,and photovoltaics that utilize similar manufactur-ing techniques and tools, more semi-customized so-lutions are now required to adapt to the varyingsizes, substrates and other manufacturing chal-lenges.
Plasma Ashing and Descum
Plasma ashing is the process of removing thephotoresist by “burning off” the organics. Using aprocessing tool, monatomic plasma is created byexposing oxygen or fluorine gas at a low pressureto high-power radio waves, which ionize it. Thisprocess is performed under vacuum to create aplasma that turns the photoresist to ash.
Two forms of plasma ashing are typically per-formed on wafers. High-temperature ashing, orstripping, is performed to remove as much photore-
sist as possible, while the “descum” process re-moves residual photoresist. The main differencebetween the two processes is the temperature thewafer is exposed to while in an ashing chamber.
According to Suraiya Nafis, head of sales forsemiconductor equipment for PVA TePla America,
however, the choice of tool and semi-customizationrequired is illustrated in selecting units for eventhese similar processes.
PVA TePla America specializes in advancedplasma systems and has an extensive history inthe U.S., Europe and Asia dating back more than50 years. The company originally started out as In-ternational Plasma Corporation (ICP) and thenlater through acquisitions and mergers was knownas Dionex, Gasonix, Metro Line, and TePla.
As mentioned, high-powered radio waves ion-ize the oxygen or fluorine gas. For photoresist re-
moval, this leads to a critical decision be-tween radio frequency (RF) or microwave-based units. When photoresist is removed,the underlying layers may be sensitive andcould be damaged if the right choice is notmade.
“Some devices are sensitive to plasmadamage,” says Nafis. “If the device is not sen-sitive, you can use an RF generator, but if itis then you can use microwaves.” In general,RF-based units are superior for strippingphotoresist. RF plasma etches the surfacethrough a physical process achieved by es-sentially bombarding the surface with plas-ma in a specific direction.
Microwave-based units, on the otherhand, are gentler because the plasma appli-cation does not have the same physical as-
pect to it. Instead, microwaves mainly deliveran isotropic chemical approach, which meansthey permeate everywhere.
This also makes it more ideal for remov-ing material from the underside of items, such asflip chips, that cannot be reached through directphysical bombardment. Microwaves are alsospecifically useful for removing SU-8, a commonly
Page 46 May, 2019www.us- tech.com
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Plasma systems are used for wafer etching, stripping, cleaning, and surface preparation.
Plasma Wafer Processing Tools
Continued on next page
By Jeff Elliott
See at EWPTE, Booth 1138
May, 2019 Page 47www.us- tech.com
used epoxy-based negative photoresist. With nega-tive photoresist, parts exposed to UV become poly-merized, while the remainder of the film remainssoluble and can be washed away.
SU-8 Photoresist
SU-8 was developed specifically to providethe high-resolution masks required for microflu-idics, MEMs and other microelectronics applica-tions. “Among the many merits of SU-8 photoresistis its chemical stability, which can also make it dif-ficult to remove,” explains Nafis.
As a result, he says PVA TePla had to devel-op a process and technology that would removeSU-8 with dry plasma ashing. Microwaves wereused, due to their isotropic etch property, whichwas an advantage to remove sacrificial layers andundercut the top layer. Another critical factor wasmore precise temperature controls. In the past,plasma etchers often measured tem-perature, but provided little to nocontrol.
“The microwave plasma strippermust have very exact temperaturecontrols, because if the temperatureis too high SU-8 becomes very hardand even more difficult to remove,”says Nafis.
In addition to the choice be-tween RF and microwave, ashing anddescum require different types of pro-cessing with one being more suitableto single wafer processing and theother for batches.
Unlike photoresist stripping, de-scum is used to remove minuteamounts of material in a more exactprocess. In doing so, it is importantthat critical dimensions of the waferremain unaffected. This means thatdescum must be performed one waferat a time.
Plasma Cleaning
When it comes to wafer process-ing, ashing/descum is essentially asimilar process to cleaning. Both in-volve the removal of organic material.With this in mind, plasma is alsoused to remove particulates and othercontaminates from glass and sap-phire carrier wafers used to provideflat support during the manufactur-ing of ultra-thin silicon wafers.
During manufacturing, the sili-con and carrier wafers are temporari-ly bonded. Once the process is com-plete, UV laser de-bonding separatesthe two substrates, leaving behind asilicon wafer just 50 microns thick.Because the glass and sapphire sub-strates can be expensive, cleaningand reusing them is ideal.
“Currently the cleaning of thecarrier wafers is mostly a wet processusing solvents, so it’s much more ex-pensive and you have to dispose of thechemicals when you are done withthem,” says Nafis. “It is much easierto clean it with dry processing withplasma and it will remove all the ad-hesive.”
Customization
The ultimate lesson is that plas-ma tools are not one-size-fits-all.Each application will often have avery different set of requirements.However, because semiconductormanufacturing has so many fixed for-mats, some providers stick only to off-the-shelf options and provide little tono customization. “If you have any-thing that is not fixed-format, it is abit hard to get some suppliers to putin the engineering time,” Nafis says.
For companies like PVA TePlathat are willing to customize, theequipment manufacturer must invest
in research and development engineers, facilitiesand equipment to propose appropriate solutions.
This includes being able to provide singlewafer or batch processing systems, RF or mi-crowave, various size chambers and solutions frommanual to semi-automated to fully automated,high speed production systems.
Even details such as fixturing, types of load-ing/unloading systems, temperature controls andthe ability to run multiple size wafers in a singlesystem play a critical role. “When a customercomes to us, they often don’t know which tool theyneed,” says Nafis. “So, we find out about the appli-cation and we can suggest the tools that will workthe best and fits within their budget.”
Contact: PVA TePla America. 251 CorporateTerrace, Corona, CA 92879 % 951-371-2500 E-mail: [email protected] Web: www.pvateplaamerica.com rPVA TePla’s Ion 10V plasma
system, pictured open.
Plasma Wafer Processing ToolsContinued from previous page
See at NEPCON China, Booth 1E50 and SMTconnect, Hall 4 Booth 551
Grödig, Austria — Two major topicsat the AdoptSMT booth at SMTcon-nect 2019 will be the acquisition oflabel supplier Nortec Group by CCLDesign and AdoptSMT’s step-in serv-ice for older SIPLACE machines,which have been discontinued by themanufacturer.
Since 2019, the company hasbeen working closely with NortecGroup, a manufacturer of industriallabels and masking products. CCLDesign acquired Nortec in June 2018and is continuing its close sales coop-eration with AdoptSMT. CCL Designis part of CCL Industries, which in-cludes Avery Zweckform with officeproducts and Checkpoint with RFIDsolutions for retail businesses.
CCL Design not only punchesand prints labels from standard ma-terials, but also coats label materialsand manufactures customer-specificlabels with special multilevel securi-ty systems. By using other printingtechniques in addition to thermaltransfer printing, AdoptSMT is nowable to supply multi-color, preprintedlabels for the high-temperature,rugged market, meeting precise cus-tomer-specific color specifications.
AdoptSMT continues to sellCCL polyimide masking materialsand has been able to expand its port-folio, especially for small masking la-bels with or without peel-off lugs. Asa Hover-Davis distributor for DACHand many other European markets,
AdoptSMT continues to ensure trou-ble-free automated label mountingon PCBs. With Hover-Davis also sell-ing CCL labels with the AxiumMedia Presenter in other markets,the three-way relationship betweenAdoptSMT, Hover-Davis and CCLhas become even stronger.
AdoptSMT is now offering serv-ice for discontinued ASM SIPLACEsystems, including the HF, HS, S, F,and C series. The company has manyparts in stock for these machine gener-ations. Suppliers for premium partshave been established. Within thescope of the AdoptSMT RENEW pro-gram, the company repairs and over-hauls a broad range of major assem-blies, such as placement heads, cam-
eras, axis controllers, tape cutters, andcommunication units for feeder trol-leys. Feeder service will also be offeredfor the discontinued S feeders.
Contact: AdoptSMT EuropeGmbH, Untersbergstrasse 1, A-5082Grödig, Austria % +43-6346-72440-0E-mail: [email protected] Web: www.adoptsmt.com
See at SMTconnect, Hall 4ABooth 530
Page 48 May, 2019www.us- tech.com
AdoptSMT Highlights Label Solutions and SIPLACE Service
AdoptSMT offers multicolor,preprinted labels for
high-temperature applications.
Pewaukee, WI — To complement itsline of fully automatic machines,Schaefer Megomat has introduced itsSSC-3 crimp system. This system isdesigned for stripping, sealing andcrimping three-wire cables in a sin-gle machine cycle. A variety of appli-cations and high flexibility are possi-ble, due to the easy conversion be-tween products.
The company is also offering itsEPS 15000 eccentric press. Thispress is designed for processing ca-bles with large cross sections. Itsmodular design provides high dura-bility, short set up times and allowsfor the addition of various options.
The company’s K1002 hotmeltmolding machine is designed to over-mold connectors, cable grommets,circuit boards, etc. These are only afew of the wide variety of applica-tions that will allow connection sys-tems to withstand harsh environ-mental conditions, such as dust, heatand moisture.
Contact: Schaefer MegomatUSA, Inc., W233 N2830 Roundy Circle West, Pewaukee, WI 53072 % 262-524-1100 E-mail: [email protected] Web: www.schaefer.biz
See at EWPTE, Booth 1221
SchaeferMegomat Intros CrimpSystem
Email | [email protected] Phone | 734.973.0099aventools.com
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See at BIOMEDevice, Booth 1014
Roswell, GA — Rehm is introducing alineup of soldering and coating sys-tems at SMTconnect 2019, includingthe VisionXP+, CondensoXC, Conden-
soXS smart, Nexus, Securo Minus,ProtectoXP, and the ProtectoXC.
The VisionXP+ convection re-flow soldering system has been en-hanced with new EC fan motors,which are not only quieter and moresustainable, but also enable compre-hensive production data collection, amore effective cooling zone and de-sign optimization.
The CondensoXC vapor phasesoldering system has a compact struc-ture, due to its innovative processingchamber. Using Rehm’s patented in-jection design, precise amounts ofGalden® are supplied for optimal pro-filing. With a closed-loop filter system,the medium can be recovered and fil-tered with nearly 100 percent efficien-cy. The system is fully suitable for vac-uums and has an integrated processrecorder for traceability.
The new CondensoXS smartsystem is based on the chamber de-sign of the CondensoXC to ensurehigh process stability. An enlargedprocess chamber, with a significantlyreduced overall footprint, enableshigher throughput and shorterprocess times.
The Nexus vacuum soldering sys-tem is designed for pore-free and flux-free soldering at up to 842°F (450°C)with a variety of process gases. Thewet-chemical activation with formicacid is available as an option. It is pos-sible to use lead-free or lead-containing
preforms and pastes. Contact solderingis used in advanced packaging andpower electronics.
Rehm has developed the Securorange to analyze the reliability ofsensitive electronics under extremetemperatures. Securo Minus is de-ployed in the context of the cold func-tion test to check the winter perform-ance of electronic assemblies, for ex-ample. The electronic componentsare exposed to cold air or nitrogen attemperatures down to –67°F (–55°C)in the system and brought to the op-timal temperature for checking. The
system can be combined with anymeasurement equipment.
Rehm’s selective Protecto con-formal coating system is designed toprotect sensitive electronic assemblygroups from damage by corrosion orother environmental influences, suchas humidity, chemicals or dust.
Even with minimal throughput,ProtectoXC provides reliable coatingprocesses. Due to its compact con-struction, it can be integrated as abatch or inline variation. Rehm willpresent the ProtectoXC coating sys-tem with ViCON system software at
SMTconnect for the first time. Thenew operating concept simplifiesimage creation for coating and in-cludes numerous features for an easy-to-create, reproducible coating result.
Contact: Rehm Thermal Sys-tems, LLC, 3080 Northfield Place,Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail: [email protected] Web: www.rehm-group.com
See at NEPCON China, Booth 1D55, and at
SMTconnect, Hall 4A Booth 100
May, 2019 Page 49www.us- tech.com
Rehm’s 2019 product portfolio.
Rehm Unveils Lineup of Solderingand Coating Systems
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See at BIOMEDevice, Booth 1014
Pontypridd, UK — Laser Wire Solutions is show-casing its most extensive range of laser wire strip-ping equipment to date at EWPTE. It will be dis-playing five laser wire stripping systems at Schle-uniger’s booth, 2133, while also exhibiting systemsat its own booth, 2351.
With Schleuniger, the systems that LaserWire Solutions is exhibiting include the estab-lished Mercury line of polymer insulation laserstrippers, which are now successfully deployedacross a wide range of industries. Two fairly newadditions to the range, the Mercury-5 and Mercu-ry-6 laser wire strippers tackle new wire strippingchallenges in the electric vehicle market.
Another highlight is the Odyssey-4 machine.This UV wavelength laser system meets the needof medical devices manufacturers to accurately,consistently and cleanly strip fine-gauge enamelcoated wires used in sophisticated medical de-
vices, such as RF ablation catheters and pace-maker electrodes.
At Laser Wire Solutions’ booth, the companywill exhibit brand-new laser capabilities. An inlineOdyssey-4 system will demonstrate how it can beeasily automated to strip and cut wires on a reel-to-reel transport system.
The company has also branched out into lasermicro-soldering and will show how their Odysseysystem can be adapted not only just to strip butalso to solder very fine medical wires.
Other new products will be the Odyssey-7system, a four-beam UV laser system specificallydesigned to cut thin foil and braid wrapped cables,and the Mercury-4E, which is an extended versionof the highly versatile Mercury-4 laser wire strip-per. The Mercury-4E has double the processingarea to accommodate twice the volume of wireswhile minimizing increased machine footprint.
Contact: Laser Wire Solutions, Ltd., Unit 12Business Development Centre, Main Avenue, Tre-
forest Industrial Estate, Pontypridd,CF37 5UR, South Wales, UK % +44-1443-841-738 E-mail: [email protected] Web: www.laserwiresolutions.com
See at EWPTE, Booths 2351 and 2133
Page 50 May, 2019www.us- tech.com
LOCTITE® GC 18 – THE GAME CHANGERLOW VOIDING, TEMPERATURE-STABLE SOLDER PASTE
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IMPROVED REFLOW IN AIR
• Excellent coalescence in long, hot profiles for 0201 and 0.4 mm pitch components
• Minimal hot slump at 190°C
IMPROVED PASTE MANAGEMENT
• Exceptional on-line paste utilization
• Eliminates refrigerated pre-production and warehouse storage
TY
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S., Germany and elsewhere.© 2019 Henkel Corporation. All rights reserved. (3/19)
For more information, contact 1-800-562-8483 or visit us online at henkel-adhesives.com/electronics
Laser Wire Solutions Showcases Wire Strippers
Odyssey-4 inline laser wire stripping machine.
Westmoreland, NH — Polyonics, amanufacturer of specialty coatedproducts, coatings, films, adhesives,and laminations, is scheduled tohighlight its family of high-perform-ance PCB labels at SMTconnect2019. With over 20 years at the fore-front of PCB label technology, thecompany’s materials are specificallydesigned and manufactured to meetthe durability requirements of PCBmanufacturers for the accuratetracking of boards and componentsthrough harsh processes.
The REACH- and RoHS-compli-ant tracking labels maintain the in-tegrity of printed barcodes and im-ages, helping manufacturers accu-rately control their PCB inventory.Engineered for harsh environments,the dimensionally stable PCB labelmaterials exceed the high tempera-ture requirements of today’s most ad-vanced reflow and wave solderprocesses.
Non-yellowing, non-softeningcoatings resist abrasion if contactedat elevated temperatures and with-stand highly corrosive, highly activefluxes. The result is high contrastbarcodes that remain readable post-heat.
Polyonics PCB labels are of-fered with a wide selection of aggres-sive, pressure-sensitive adhesivesthat allow the labels to remain firm-ly affixed through multiple passes inextreme temperatures and fully re-sistant to the most concentratedcleaning chemistries. They are avail-able in 1 and 2 mil (25.4 and 50.8 µm)thicknesses, in a variety of finishes,and meet the unique specifications ofvarious industry, military and ASTMstandards.
Contact: Polyonics, Inc., 28 In-dustrial Park Drive, Westmoreland,NH 03467 % 603-352-1415 fax: 603-352-1936 E-mail: [email protected]: www.polyonics.com
See at SMTconnect, Hall 4Booth 122
Polyonics:Durable, HighPerformancePCB Labels
See at PCIM, Hall 7 Booth 500
Carteret, NJ — Sarcon® PG25A isone of Fujipoly’s softest, most com-pressible and affordable thermal gapfiller materials. It offers gel-like con-sistency in a convenient sheet form.The product is excellent for applica-tions that have delicate componentsand high compression rates.
When it is sandwiched betweencomponents of varying shapes andsizes and a nearby heat sink or
spreader, this compliant 2.5 W-mKthermal interface material (TIM) ex-
hibits a thermal resistance as low as0.42°C in2/W at 14 psi.
Sarcon PG25A is well-suited forapplications that require materialcompression between 30 and 50 per-cent. It is available in four thickness-es from 0.04 to 0.2 in. (1 to 5 mm)with maximum sheet dimensions of11.8 x 7.9 in. (30 x 20 cm).
Sarcon can also be ordered die-cut to fit almost any shape. It ex-hibits a UL94 flame retardant ratingof V-0 and has an operating temper-ature range of –40 to +302°F (–40 to+150°C).
Contact: Fujipoly AmericaCorp., 900 Milik Street, Carteret,NJ 07008 % 732-969-0100 fax: 732-969-3311 E-mail: [email protected]: www.fujipoly.com
May, 2019 Page 51www.us- tech.com
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Ultra-Soft Thermal Gap Filler from Fujipoly
Eltville, Germany — EMIL OTTO isexpanding its lineup of multifluxeswith the EO-B-010 flux. The flux canbe used in wave, selective and manu-al soldering processes, as well ascable manufacturing.
EO-B-010 contains a specialsynthetic resin, which has a particu-larly positive effect on residue. Theflux has been developed specificallyfor organic solderability preservative(OSP) circuit boards. On theseboards, a water-based organic com-pound is used, which bonds selective-ly to the copper of the exposed con-
ductor tracks and forms an organic-metallic protective coating. Thiscoating protects the copper duringthe soldering process. In addition,the EO-B-010 reduces the develop-ment of solder beads.
The flux is available in A, B andC versions. The individual variantsdiffer in their solid content to matchthe scope of each application.
The A version has a low solidcontent of 2 percent. This version hasbeen developed especially for full-ni-trogen tunnel applications, and dueto a wide process window and tem-perature stability, guarantees an ex-cellent soldering result under full ni-trogen.
The B versions are standard,with a solid content of 2.6 percent,which is for general-purpose applica-tions. The B version is also availablein a dosing pen or bottle for use insmall applications.
The C version has a solid contentof 4 percent and is aimed at powerelectronics applications, for whichlarge component bodies have to be sol-dered at a low assembly density.
Contact: EMIL OTTO Flux- u.Oberflächentechnik GmbH, EltvillerLandstrasse 22, 65346 Eltville, Germany % +49-6123-7046-0 E-mail: [email protected] Web: www.emilotto.de
EO-B-010A flux.
EMIL OTTOIntroduces Alcohol-BasedFluxing Agents
Newton, MA — C&K has introduced an expansiveswitch portfolio for designers of gaming controllersand accessories. The company offers a broad rangeof miniature tactile, ultra-miniature tactile andmicro-miniature tactile switches for PCB mount-ing. Designed for the most demanding applica-tions, the switches can be customized to achieve aparticular sound and feel.
The KMT0 series nano-miniature SMT top-actuated switch comes with a small footprint andthickness and an integrated actuator. With operat-ing life to a million cycles, excellent haptics, andability to withstand harsh environments and oper-ating conditions, it is an excellent switch for high-performance gaming equipment and accessories,
such as virtual reality (VR) headsets and mobilegaming controllers.
Other popular switch choices for both mobile-and console-based gaming products include theKXT3 and KSC series tactile switches. The KXT3series ultra-low-profile top-actuated tactile switchis reliable and long-lasting, built to meet the spe-cific needs of engineers creating the next genera-tion of gaming devices. The switch has a 0.12 x0.08 in. (3 x 2 mm) footprint, 0.024 in. (0.6 mm)thickness and a high number of cycles. The KSC2and KSC4 series of sealed tactile switches areIP67-rated and have soft actuators for the hapticexperience preferred by most gamers. They meetthe size and performance requirements of products
with small surface areas, but can alsowithstand harsh usage conditionssuch as vibration and shock.
Contact: C&K, 15 Riverdale Avenue, Newton, MA 02458 % 617-969-3700 Web: www.ckswitches.com
See at EDS, Andros B
Page 52 May, 2019www.us- tech.com
TECHNICA, U.S.A.Ful�lling Manufacturing Needs Throughout the Electronics Industry
•Fast setup & changeover
•Simple operation
•Stable & reliable print process
•Fine pitch printing capability
•Excellent print definition
•Powerful off-Line programming
•User friendly interface
•Exceptional pickup reliability
•100% ball & lead inspection
•Optimal performance & accuracy
xcellent choice for High Mix, Medium Volume Production
1-800-909-8697www.technica.com
Available in the United Statesexclusively through Technica U.S.A.
C&K Introduces Robust and Ultra-Compact Tactile Switches
Compact tactile switches.
Rohnert Park, CA — LEMO has en-hanced its range of Halo connectorswith additional product sizes andmodels. Initially launched in the Bseries, this connector is now avail-able in the T series — watertight andIP68-rated.
The new product range, config-urable through the embedded elec-tronics, comes in a wide range of col-ors with an RGB indicator arrangedin a ring around the connector. Thethree different designs are designat-ed LEG, LMG (with a standby light)and LNG (with a narrow, ring-shaped light).
The customer can decide whatinformation is to be displayed by theHalo LEDs. Status (on/off or blink-ing), light intensity and colors can allbe customized. The multiplexed indi-cator’s PWM, consisting of red, greenand blue LEDs, can be adjusted togenerate the color of choice out of 16million possible shades. The indica-tor’s behavior can be modified laterby using software.
Contact: LEMO USA, Inc., 635Park Court, Rohnert Park, CA94928 % 707-578-8811 fax: 707-206-3774 E-mail: [email protected] Web: www.lemo.com
See at EDS, Suite E43
Configurable Halo connectors.
LEMO USAHalo LEDConnectorAvailable inThree NewDesigns
Los Alamitos, CA — Practical Compo-nents has added a new SMTA solderpaste test vehicle for miniaturizedSMT applications to its array ofdummy components, solder trainingkits and PCB evaluation kits.
Consumer demand has acceler-ated the pace of the miniaturizationof electronics, compelling assemblersto develop robust capabilities for01005 (0402 metric) and 0.012 in. (0.3mm) pitch array packages, in order toremain competitive.
To optimize the stencil printingand reflow aspects of SMT assembly,given the challenging new realities, aprocess evaluation tool has been de-
veloped that provides a turnkey solu-tion for solder paste performancetesting.
This new kit can be configured ina variety of ways to meet customers’needs. It also includes pads for 0.02 in.(0.5 mm) pitch BGAs down to 008004(0201 metric). This vehicle is availablewith ENIG ImAg, OSP, ImSn, andSnPb HASL finishes and a stencil setis also available.
Contact: Practical Components,Inc., 10762 Noel Street, Los Alamitos, CA 90720 % 714-252-0010 E-mail: [email protected]: www.practicalcomponents.com
May, 2019 Page 53www.us- tech.com
SMTA solder paste test vehicle for miniaturized SMT assembly.
Practical Components Offers Mini SMT Test Board
Lake Barrington, IL — The BLRT, alightweight, comprehensive measure-ment tool, from MK Test Systems hasachieved a new approval milestonefrom The Boeing Company.
The BLRT system is now ap-proved to perform EME HIRF/light-ning build verification testing for allprescribed tests that are to be per-formed in a safe environment. TheBLRT may be used as a replacement
for previously available loop resist-ance testers (LRTs) in both productionand maintenance uses on all Boeingcommercial aircraft.
The BLRT provides fully auto-mated data collection capabilities onthe integrated PC. The system is ca-pable of guiding users through com-plete test sequences using graphicand textual user prompts for test setup and measurement. Results can beautomatically recorded to customernetwork resources.
These enhancements allow usersto make two-man jobs a single-personassignment that can be completedmore accurately.
The BLRT may only be used insettings that do not require UL 913Class1, Div 1 certification (fueled air-craft) or for testing on fire bottle in-stallations that include a squib orany potential hazardous energy.
Contact: MK Test SystemsAmericas, 22102 Pepper Road, Lake Barrington, IL 60010 % 773-569-3778 E-mail: [email protected] Web: www.mktest.com
See at EWPTE, Booth 1718
MK Test’sBLRT SystemAchievesBoeing Co.Approval
WACKER’s extensive product portfolio provides enhanced performance and reliability for:
• Wearable Devices – ELASTOSIL® LR self-adhesive liquid silicone rubber provides unique device construction flexibility and economics
• Electronic Component Protection – SEMICOSIL®, SilGel® and SILPURAN® products o�er reliable protection for sensitive components
• Die-Attach Adhesives – SEMICOSIL® adhesives for MEMS applications• Optical Applications – LUMISIL® for primary/secondary optics and optical bonding adhesives
for enhanced design flexibility• Sensor Technology/EAP – ELASTOSIL® film for tomorrow’s high-precision application requirements
To learn more about WACKER’s portfolio of silicone rubber compounds, contact our specialists today.
Wacker Chemical Corporation, 3301 Sutton Road, Adrian, MI 49221, USATEL: +1 888 922 5374, www.wacker.com/electronics-lighting, [email protected] , @wackerchemcorp
INNOVATIVE SILICONE SOLUTIONS FOR ENHANCED DEVICE PERFORMANCE AND RELIABILITY.
CREATING TOMORROW’S SOLUTIONS
BLRT bond, loop and joint test system.
Page 54 May, 2019www.us- tech.com
DON’T BE SO SENSITIVE
Personal Chemistry
Polyonics® ESD-safe polyimide labels eliminate product
loss associated with ESD events. And they end the costs
that come with label failure and rework.
• ANSI S20.20 compliant• Withstand highly-active fluxes and chemicals• Meets critical ANSI/ESDA standards
Get the ultimate in ESD protection. polyonics.com/ESD for more information.
603.352.1415 [email protected]
We have the ultimate protection for ESD sensitive components.
Nordson MARCH: Plasma Treatment System
Has High CapacityConcord, CA — Nordson MARCH hasintroduced its FlexTRAK®-SHS auto-mated plasma treatment system.The plasma system includes a 585in.3 (9,586 cm3) large-volume F3-Sprocess chamber that can be config-ured for larger strips or can treat
more strips per cycle, yielding higherthroughput and increased productiv-ity for semiconductor and electronicspackaging.
The FlexTRAK-SHS system’sadvanced automation enables high-throughput processing of leadframes, high-density substrates andother strip-type electronic compo-nents. The system handles simulta-neous strip buffering and plasmaprocessing for greater chamber uti-lization. Advanced process controls,
interchangeable electrode configura-tions and plasma modes provide ap-plication flexibility.
The plasma chamber of theFlexTRAK-SHS employs the samearchitecture and technology as thesmaller FlexTRAK platforms for a
seamless transition as production de-mands more capacity. It is capable ofprocesses that include surface clean-ing, oxidation removal, organic con-tamination removal, and surface ac-tivation. FlexTRAK-SHS is CE-marked and meets SEMI S2/S8(EH&S/Ergonomics) standards.
Contact: Nordson MARCH,2470-A Bates Avenue, Concord, CA94520 % 925-827-1240 E-mail: [email protected] Web: www.nordsonmarch.com
FlexTRAK-SHS automated high-capacity plasma treatment system.
See at SMTconnect, Hall 4 Booth 122
May, 2019 Page 55www.us- tech.com
www.hammondmfg.com (716) 630-7030
Hammond Manufacturing is a leading sup-plier of enclosures, transformers and datacommu-nications infrastructure with stocking distributors across the globe. Plus with over 10,000 products in stock in our massive distribution center, we have what you need when you need it now.
Call your favorite authorized Hammond distributor for fast service.
We’re Ready For You
Need It Now?
See at EDS, Martinique A
Page 56 May, 2019www.us- tech.com
Production
One of the biggest developments in the world of technology over the lastfew years has been that of digital twins. A digital twin is a virtual repli-ca of a physical system, process or product. The technology essentially
provides a real-time look at how a physical asset is performing. Digital twins are already being adopted in industries such as manufac-
turing, automotive and construction. Consequently, organizations in these re-spective industries are using digital twin technology to evaluate the perform-ance of given physical assets and then identify where improvements can bemade to reach more favorable outcomes for the future.
Interested in emerging tech-nologies, digital marketing spe-cialists Reboot Online analyzedthe latest findings from researchfacilities provider Catapult, whosurveyed engineers (from a vari-ety of disciplines) to better under-stand the components they be-lieve are the most necessary fordigital twin technology to func-tion effectively.
Survey Findings
Reboot Online found that aphysical asset (71 percent) is thecomponent engineers think is themost necessary for a digital twin.After that, 52 percent of expertsview a live data set as an essen-tial feature for the functionalityof digital twins. 45 percent be-lieve that an offline data set is avery important component forthe technology.
Interestingly, with a digitaltwin being a pairing of the virtu-al and physical worlds, 45 per-cent of engineers rate 3D repre-sentation as a must-have vari-able for the technology. On a sim-ilar note, 31 percent state that2D graphic representation isneeded for the digital twin towork properly.
Only 39 percent place trendanalysis of historical data as avital attribute for a digital twin.Even less (32 percent) feel that pre-diction of future events is a criticalaspect that can push the technolo-gy to achieve desired objectives.
Reboot Online also wanted to identify the stages in the product lifecyclethat can gain the greatest value from the integration and use of digital twins.
The research found that maintenance, repair and operations (77 percent)is the stage in the product life cycle where majority of engineers believe digi-tal twin technology adds the greatest value. Thereafter, engineers view man-ufacturing (70 percent) as the next most likely process to benefit from the uti-lization of digital twin technology.
62 percent of engineers think digital twin technology can be harnessed dur-ing the simulation of a model that predicts the current and future behavior of agiven physical asset. Slightly below, 60 percent feel digital twin technology canbe highly practical for quality control testing. Interestingly, 59 percent considera digital twin to be impactful in the design phase of a product/system.
In contrast, finance and procurement (13 percent) is the step in the prod-uct life cycle that engineers think will be able to capitalize the least from thecapabilities of digital twin technology. Just above, only 19 percent of engineersplace sales and marketing as a key operation which can experience significantgains from deploying digital twins.
We are in an era of rapid technological development. At the forefront of thathas been the rise and evolution of digital twins. With the technology having theability to cover the entire life cycle of a physical system, process or product, it pro-vides businesses with a powerful analytical tool which can thoroughly assess keyperformance indicators and provide insights as to where enhancements can bemade. In the long-run, the lessons and suggestions taken from digital twins willdrive a variety of opportunities for innovation and growth.
Contact: Reboot Online Marketing, Ltd., Unit 503, Centennial Park,Centennial Avenue, Elstree, Herts, WD6 3FG, UK % 0203-397-1948 E-mail: [email protected] Web: www.rebootonline.com r
The Impact of Digital TwinTechnology on Product Development and InnovationBy Naomi Aharony, Managing Director, Reboot Online
Survey results reflect the respondents’ views on the most
necessary components for digital twin technology.
May, 2019 Page 57www.us- tech.com
YAMAHA’s YSi-SP High Performance 3D Solder Paste Inspection (SPI) System
P recise 3D SPI Measurement for SMT Process Optimization!
YA M A H A’s YSi-SP offers true volumetric measurement and powerf u l
process optimization capability. The YSi-SP performs high-speed,
high-accuracy 2D and 3D solder paste inspection with a single head,
employing image high-resolution switch-over for
exceptional flexibility in a single machine.
True 3D volumetric measurement; powerful process optimization tools
Exceptional precision by comibining 2D and 3D measurements
High-speed, high-accuracy inspection with a single head
Easy switch-over to super high-resolution technology
Built-in SPC for a wide range of statistical processing
Auto conversion of adhesive inspection data from the dispenser
M2M Features such as automatic changeover & closed loop feedback to screen printer
Optional bonding and foreign matter inspection
Y Page 1
See at NEPCON China, Booth 1E45 and SMTconnect, Hall 4 Booth 319
Page 58 May, 2019www.us- tech.com
Air conditioning systems are re-quired to cool off hot cars with-in a short period of time during
the summer months, to dehumidifythe air in the autumn rain and toprovide heat within a few minutesduring the winter. Each of thesefunctions means heavy work for theblower controllers of the fan motorsinstalled in the air duct or in themotor mount of an automobile. Al-though they are not visible, thermal-ly conductive adhesives offer an im-portant contribution to making thisprocess work.
Sitronic, a supplier of powerelectronic components, manufac-tures blower controllers used in ve-hicles. In addition to the controllers,the automotive electronics specialistalso produces control and operatingsystems, lighting technology, andsensors, like dew point and wind-shield temperature sensors to pre-vent fogging.
From its development and pro-duction sites in Germany and its rep-resentative offices in the U.S., SouthKorea and China, the family-ownedcompany not only provides products
to Tier 1 suppliers, such as Densoand Valeo, but also to OEMs that in-clude General Motors, Volkswagenand BMW.
Small Heat Sinks
To ensure they deliver the re-quired performance, a great deal ofcurrent must flow through the blow-er controllers, which are partly fittedwithout screws. The company offersvarious performance classes withload currents between 18 and 35A.The voltage is either 12V for passen-ger cars or 24V for commercial vehi-cles. Since space in cars is scarce,Sitronic relies on compact heat sinks.Given the heat accumulation in asmall space, a thermally optimizeddesign is crucial.
An optimized heat dissipationcan be achieved through thermallyconductive bonding between the print-ed circuit board and the heat sink. Be-cause these various requirementsneeded to be met, Sitronic had beenlooking for an adhesive with particu-larly good thermal conductivity, resist-ance to peak temperatures of up to320°F (160°C), as well as good adhe-
sion to the copper inlays of the PCBand to the die cast aluminum heatsink. In addition to all of the core re-quirements, the adhesive also had tobe suitable for joining the heat sinkand the housing made of high-per-formance PA66 GF30 plastic material.
The specified adhesive proper-ties, including thermal conductivity,temperature resistance, and adhesion,were tested in a thermal cycling testwith 12,000 cycles and temperaturesvarying from –22 to +257°F (–30 to+125°C), a shaker test and a final func-tion test regarding heat dissipation.
Benefits in Processing
Following these three suitabili-ty tests with different products,Sitronic opted for the thermally con-ductive DELO MONOPOX AD292epoxy resin from DELO IndustrialAdhesives. This robust adhesive isspecially designed with more fillersfor increased thermal conductivity,meeting Sitronic’s specific needs. Inaddition, it provides considerablebenefits for efficient processing.
The adhesive can be processedeasily as a one-component product,
because mixing systems are not re-quired. It is also silicone-free, a prop-erty generally desired by the automo-tive industry that eliminates the riskof outgassing in downstream process-es. The product is able to cure in oneprocess step — for example within 40minutes at 302°F (150°C) — and canbe used for both bonds, due to its uni-versal adhesion. This simplifiesplant construction, since only onedispensing system is needed, whichcan be used for bonding the heat sinkto both the PCB and the housing.
Sitronic starts its blower con-troller production by subjecting thecomponents to atmospheric pressureplasma pre-treatment. This increasesthe surface energy of the componentsand improves adhesion. Immediatelyafterwards, the adhesive is dispensedthrough an eccentric screw valve. Thecomponents are joined before the ad-hesive is finally heat-cured.
The air convection tunnel ovenused to cure the adhesive ensureshigh throughput and efficient pro-duction. Because of this, Sitronic canachieve the high volumes required toserve the numerous OEMs and Tier 1suppliers it works with.
Contact: DELO Industrial Adhesives, LLC, 144 North Road, Suite 2650, Sudbury, MA 01776 % 978-254-5275 Web: www.delo-adhesives.com/us r
PartneringPartnering
Thermally Conductive Adhesive for Air Conditioning Power
Electronics Keeps the Air FlowingBy Alexander Wörner, Head of Sales, DELO
DELO MONOPOX AD292requires no mixing system and is silicone-free, elimi-
nating the risk of out-gassing during down-
stream production.
Lost your news item of interest?Find it once again at www.us-tech.com
SCS PRECISIONCOAT V
See at BIOMEDevice, Booth 620
Page 60 May, 2019www.us- tech.com
Distribution
BTU Adds Reps in U.S. NortheastNorth Billerica, MA — BTU International has hired JT Technologies as itsnewest manufacturers’ representative. John and Tom Kintner will representBTU’s PYRAMAX reflow ovens in the territory and states of Eastern Pennsyl-vania, New Jersey and New York. Based in New York, JT Technologies pro-vides technical sales representation for equipment used to assemble, solder,clean, inspect, and test PCBs. The Kintners have more than 50 years of com-bined experience working in the electronics industry in their territory.
Contact: BTU International, Inc., 23 Esquire Road, North Billerica, MA % 978-667-4111 fax: 978-667-9068 Web: www.btu.com
Speedprint Appoints Quiptech ForMexico and Central EuropeTampa, FL — Speedprint Technology has appointed Quiptech as its author-ized distributor for the entire range of Speedprint products in Mexico andacross most countries in Central and Eastern Europe. The agreement wassealed at the most recent APEX Expo. For more than 25 years, Quiptech hasbeen a leading distributor of equipment and consumables in the electronicsand medical device manufacturing sectors, with a geographical footprint thatprovides support in Europe and Mexico. Quiptech will take on the distributionof the Speedprint product portfolio and provide field support in Mexico, Cen-tral Europe and Eastern Europe.
Contact: Speedprint Technology, 519 US Highway 301 South, Tampa,FL 33619 % 813-664-0686 E-mail: [email protected] Web: www.speedprint-tech.com
New Yorker Electronics Stocking New CDE CapacitorsNorthvale, NJ — New Yorker Electronics is now stocking the new Cornell Du-bilier Electronics (CDE) Type RA multilayered polymer capacitors for 257°F(125°C) operation. The capacitors are constructed using stacked metallizedpolyester and protected by an impregnable sealant, which eliminates the needfor an external case. This rugged package style offers the highest energy den-sity technology available for switching power supplies, DC-DC converters andother high ripple current applications. New Yorker also distributes CDE’sType RA Angstor® radial PET film capacitors for 257°F (125°C) operation.
Contact: New Yorker Electronics, 209 Industrial Parkway, Northvale,NJ 07647 % 201-750-1171 E-mail: [email protected] Web: www.newyorkerelectronics.com
Exact Metrology Distributes GOM CTin U.S.Brookfield, WI — Exact Metrology is now a distributor of the GOM CT scannerin the U.S. GOM is an established global company and leader in structured lightscanning technologies. The company develops, produces and distributes soft-ware, machines and systems for industrial and automated 3D coordinate meas-uring technology, 3D CT, and 3D testing, based on the latest research resultsand innovative technologies. The CT scanner provides 3D data of internal andexternal component geometries in exceptionally high resolution. It is designed toproduce the finest details visible throughout the component, simplifying initialsampling, tool correction and inspection tasks during production.
Contact: Exact Metrology, Inc., 20515 Industry Avenue, Brookfield, WI53045 % 614-264-8587 E-mail: [email protected] Web: www.exactmetrology.com
Senet and Arrow Join Forces for IoT ConnectivityPortsmouth, NH — Senet, Inc., and Arrow Electronics are now working to-gether to simplify the process of purchasing and deploying connected IoT so-lutions. Through this global agreement, Arrow is now offering low-power widearea network (LPWAN) gateways preconfigured to operate on the Senet net-work. This allows application providers and end customers to shorten theirdeployment cycles knowing they are working with hardware and network con-nectivity that has been prequalified to be interoperable.
Contact: Senet, Inc., 100 Market Street, Suite 302, Portsmouth, NH03801 % 877-807-5755 E-mail: [email protected] Web: www.senetco.com
TTI Stocking Molex FFC/FPC ConnectorsFort Worth, TX — TTI is now stocking Molex easy-on FFC/FPC connectors in abroad range of pitch options to meet a wide variety of space and usage needs forapplications in all markets. For applications demanding small pitch sizes withhigh reliability, these connectors offer 0.008 to 0.08 in. (0.2 to 2.0 mm) pitches,which are excellent for tight packaging applications. They also deliver featuresthat include positive locks and a dual-contact design to ensure a reliable connec-tion. Molex’s FFC/FPC connectors are available with zero insertion force and lowinsertion force actuator options, which are preassembled and covered.
Contact: TTI, Inc., 2441 Northeast Parkway, Fort Worth, TX 76106 % 800-225-5884 E-mail: [email protected] Web: www.ttiinc.com
For all your workbench needs.
Most Popular Hand Crank Adjust
Electric Adjust Packaging Benches1proline.com PH: 800 739 9067
See at BIOMEDevice, Booth 943
May, 2019 Page 61www.us- tech.com
See at NEPCON China, Booth 1H35 and SMTconnect, Hall 4A Booth 140
The demand to make cars safer,more fuel-efficient, environ-mentally-friendly, comfortable,
intelligent, connected and reliable isfueling the growth of automotiveelectrification. Whether it beadvanced driver assistance systems(ADAS), emerging so-called “autopi-lot” cars, new battery technology forelectric and hybrid electric vehicles,or slick infotainment systems — all ofthis comes down to next-generationelectronics integration.
In fact, the vast majority of inno-vation occurring in the automotivesector today has to do with electronicsinnovation. In order for all of thesesystems to perform as expected,robust materials that connect, protectand cool everything from lithium-ion(Li-ion) batteries, camera systemsand radars to engine control units andeverything in between are required.
ADAS: A Safer Ride
Milestones on the way to driver-less vehicles are being marked atbreakneck speed, with ADAS as keyenablers, allowing acceleration andauthentic autonomous control.Forward-collision and lane departurewarnings, parking assistance, rearmonitoring, blind spot detection,adaptive cruise control, and nightvision systems are now relativelycommon in current car models.
Beyond the gadget and “cool”appeal of ADAS are measurable ben-efits for the global population, withsafety being top among them.Already, implementation of ADAStechnology has had a profoundimpact on automotive safety. PassiveADAS, which includes post-crashprotection, such as air bags and seat-belts, has cut fatalities nearly in halfover the last 40 years.
With active and predictiveADAS now enabling greater collisionprevention, it is expected that as self-driving cars become common, trafficfatalities could drop by as much as 90percent. Potentially this could saveas many as 10 million lives perdecade.
For leading materials suppliers,all of this is welcome, though not sur-
prising, news. For example, Henkel’shigh-impact solutions and processexpertise have played central roles inthe facilitation of today’s advancedautomotive electronics and, in particu-lar, ADAS. In fact, within every ADAS
product — from passive seat-belt andair bag sensors to predictive forwardcollision avoidance systems — high-performance materials are integral tofunction and long-term reliability.Advanced electronic materials, suchas thermal interface materials (TIMs),conductive inks, gasketing, potting,bonding and coating solutions are allnecessary for dependable, efficientsystem performance.
Making ADAS Work
At the foundation of each ADASproduct is a printed circuit board(PCB) that enables electronic capabili-ty. Here, a full range of materials for
the entire PCB assembly materialsecosystem is required. Advanced sol-der pastes facilitate robust connectionof components to the board substrate,and underfill materials are dispensedbeneath array devices, such as BGAsand CSPs, to protect the delicate sol-der joints and provide long-term relia-bility. These PCBs are packing morepower into increasingly smallerspaces, making the requirement to
effectively dissipate the resulting ther-mal load a top priority.
Insulated metal substrates(IMS) help alleviate heat produced atthe board level in devices thatinclude power steering modules,while Henkel’s BERGQUIST® GAPPAD® and liquid gap filler thermalinterface materials move heat awayfrom active components. Withoutthese critical materials, overheatingwould result, which could ultimatelymean device failure.
Outside of the PCB, electricallyconductive inks and robust adhesivesare found in other parts of variousADAS devices, such as vision sys-tems. For the multiple cameras — asmany as 10 per car — that areonboard today’s ADAS-equippedvehicles, non-conductive adhesivesare used to bond the various lensesand housings, providing strong adhe-sion for failure-resistant function.These, in addition to a multitude ofother electronic materials are essen-tial for camera capability.
Advanced display designs andhuman-machine interface (HMI)technologies play a key role inenhancing passenger comfort andinfotainment. Innovative opticalbonding materials allow automotivesystem suppliers to improve visualclarity of these displays.
Real-Time Data Analysis
Behind all of the image capture,braking function and blind spotdetection indicators is the need tochurn the data, analyze and respondin real time for effective accident pre-vention. This is the role of proces-sors, analog integrated circuits (ICs)and discrete power devices, whichencompass some of the powerful com-ponents of modern ADAS chipsets.
The increase of semiconductorcontent in automobiles — which Intelprojects could have a market size ofnearly $70 billion for autonomous autosystems, data and servers by 2030 — isthe driver behind the slew of chipmak-ers investing in leading automotivetechnology firms. Intel’s recent deci-sion to acquire camera and laser-
Electronic Materials put Automobiles on the Road to Safety, Comfort and
Fuel-Efficiency
A variety of adhesive, thermal interface and shielding materials areneeded in the cameras of today’s ADAS-equipped vehicles.
By Holger Schuh, Thermal Interface Material (TIM) Business Development Manager — EIMEA, Henkel Corporation
Page 62 May, 2019www.us- tech.com
Continued on next page
May, 2019 Page 63www.us- tech.com
based sensor powerhouse Mobileye, Qualcomm’spurchase of NXP and Samsung’s move to bring U.S.-based auto parts leader Harman into the fold allpoint to the expanding role of semiconductors inauto electronics — not only for ADAS and vehicleintelligence, but infotainment, drivetrain and vehi-cle connectivity as well.
Electronic materials innovation is instru-mental at the PCB and product assembly level,but also at the semiconductor package level.The small silicon dice — which are the basis forsemiconductor devices — must be connected,often to other dice within the same package andthen from the package to the substrate. Die con-nection requires specialized attach adhesives,which is a core competency Henkel has main-tained with leading-edge paste and film dieattach solutions for well over 30 years.
In terms of sheer capability — from thesemiconductor to the PCB to the camera assem-bly and display — the reality is thatautonomous driving and the materials to sup-port it exist today, at least insofar as vehicle,sensor, imaging and processing technology isconcerned. To date, what is missing from a moreholistic and true autonomous driving experi-ence is the infrastructure.
Until modern transportation routes aretransformed and international regulatory bod-ies remove roadblocks, adoption and prolifera-tion of driverless vehicles will be limited. Thatfact has not prevented automotive OEMs frompreparing for its eventual existence, however,by installing V2X (vehicle-to-vehicle or vehicle-to-infrastructure) communication processorsand sensors today, laying the groundwork for ahands-free, safe, comfortable, and efficient futuredriving experience.
New Energy Vehicles
While ADAS are effectively saving lives andmaking driving more enjoyable, high-performancebattery technology is contributing to a cleaner
environment and less dependence on fossil fuels.The global drive to reduce carbon dioxide emis-sions combined with consumer demand for lowergasoline consumption has hastened growth in thealternative energy vehicle market, spurring theadoption of hybrid electric vehicles (HEVs).
Hybrids remain a popular choice among auto
consumers but newer, rechargeable and light-weight Li-ion battery cell technology, like thatused in the batteries for computers and smart-phones, has given new life to the electric vehicle(EV). Battery packs are becoming increasinglymore affordable and lighter with a boost in rangeand power, allowing today’s electric vehicles totravel over 200 miles on a single charge.
Accelerated development of Li-ion batterytechnology has increased both the power and ener-gy density of the devices to unprecedented levels.For high-voltage Li-ion batteries to work properly,thermal management of the various components isessential. Overheating of any of the parts — partic-ularly those that are flammable, such as the elec-
trodes within the battery cells — at a mini-mum could result in a shorter work life and, atworst, a dire safety issue.
This demand for reliable thermal controlof new energy vehicle (NEV) battery systemsis a main reason why the world’s top automo-tive electronics manufacturers have partneredwith leading thermal management innovatorslike Henkel.
Proven, adaptable TIMs — both in liquidand pad form — help control heat generated bythe cells within and produced by the batterymodule, which has an interface to the batterypack. Robust, capable thermal managementsolutions optimize the life of the battery, pro-vide insulation for safe in-use functionalityand contribute to reliable, road-ready EVs andplugin HEVs.
Not too Hot, Not too Cold
Optimizing the operation of Li-ion batter-ies, however, isn’t simply about thermal con-trol when the vehicle is running. Several Li-ion battery systems are temperature-con-trolled and must be at a specific temperaturerange at any given time, which makes startingthe car in freezing conditions problematic.Warming the battery to approximately 50°F
(10°C) before use is often required to avoid damagefrom cell degradation.
New printed ink development efforts haveyielded a novel, positive temperature coefficientink that is self-regulating, meaning that it will notrise above its set temperature. The rapid heatingcapability of the ink helps warm the battery cells
Continued on page 67
Electronic Materials Improving AutomobileSafety, Comfort and Fuel-Efficiency
Gasketing (1), thermal interface (2 and 3) and potting (4) materials play key roles in Li-ion battery
module performance and reliability.
Continued from previous page
See at SMTconnect, Hall 4A Booth 230
Page 64 May, 2019www.us- tech.com
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The miniaturization of electronic componentshas led to the use of copper pillars, smallerbump sizes and narrower pitches. This has
resulted in lower flexibility of joints and more sen-sitivity to the influence of coefficient of thermalexpansion (CTE) mismatch. Component tilt, opensolder joints and cracks with the use of extremelow-K (ELK) dielectric materials are defects thatincrease with this trend.
BTU’s solution, TrueFlat technology, whichuses negative pressure reflow is designed to allevi-ate yield losses due to CTE mismatch duringreflow soldering. Advanced thermal control (ATC)is introduced to control the rates of heat transferfor processes sensitive to abrupt expansion andcontraction.
ATC is an enhancement of existing control forheating and cooling rates to achieve continuous,uniform heat transfer. This provides the ability tocontrol the abrupt expansion and contractionstress produced by micro spikes.
Challenges of Miniaturization
Silicon flip chip and thin organic substrateshave significantly different CTEs. CTE mismatchfor flip chip on thin substrates has been a chal-lenge for more than 10 years. Controlling defectsin mass reflow caused by warpage- and CTEstress-related cracks has long been the focus ofreflow process engineers. Other reflow techniques,such as thermal compression bonding, are avail-able. However, these processes are expensive andhave low throughput, which makes mass reflow apreferred process.
Existing mass reflow methods to alleviate theeffects of CTE mismatch consist of a solid carrieracting as a heat spreader, a cover plate to attemptto hold down the substrate during reflow and the
use of a slow cooling process to control the rate ofcontraction. This method is being challenged asminiaturization continues.
The use of a reduced or negative pressure(pressure below atmosphere) below the carrierthroughout the entire reflow process enhances thecontact of the substrate on the carrier and helps tokeep the substrate flat.
This enhances localized contact below thechip, where a cover plate is not effective. Moreeffective heat spreading produces greater temper-ature homogeneity and reduces the impact ofabrupt expansion and contraction due to CTE mis-
match. Ensuring contact with the carrier helps tokeep the substrate flat and reduces deformation.
Negative Pressure Reflow
To demonstrate experimentally, this requirestwo stages. The first stage is to ensure effectivecontact of the substrate to carrier. The second is tocontrol the heating rates for the reflow process.The objective of negative pressure reflow is to gen-erate a continuous suction from the start of heat-ing to the end of the cooling process within theheated chamber. A slow cooling rate profile isadopted to minimize the impact of heat spikes.
Figure 1 demonstrates the gas flow to gener-ate effective suction with edge rail conveyors.Redirection of gas flow on the bottom of the processproduces a suction box effect, and a pressure belowatmosphere, directly below the conveyor and prod-uct — hence the name “negative pressure reflow.”
The carrier design is important for uniformsuction and heating. A large suction hole size cre-ates localized heat spikes. The recommended layoutis 0.04 in. (1 mm) diameter hole grid below the sub-strate. There are window and mesh top covers usedin standard reflow ovens without suction. Mesh hasthe advantage of holding down the edges of eachchip but has less flexibility and costs much more toproduce. Window covers hold down the edges of thesubstrate and allow different layouts of chips on thesubstrate. The center of the substrate is subjected todeformation, as there is nothing ensuring propercontact of the substrate to the carrier.
Pressure should be measured below the carri-er with a room temperature fixture overlaid onto aramp to spike (RTS) slow-cool temperature profile— measured in the same oven. If the suctionremains effective throughout the process, it
Reducing CTE Mismatch Defects in Flip Chip Reflow
Figure 1: Negative pressure reflow design.
By Patrick Gao, Shoubing Ni, Thomas Tong, and Joe Yang, BTU International, Inc.
Continued on next page
See at EWPTE, Booth 2309
ensures intimate contact of the sub-strate with the carrier above the Tgof the substrate where the deforma-tion is at its worst.
As temperature increases, suc-tion force will be reduced. This is anormal phenomenon as air densityincreases with higher temperature,reducing the efficiency of suction. Witha normal tin-silver-copper (SAC)reflow profile, the suction reductionwill be about 30 percent. However,this is still sufficient to keep the hottersubstrate held down on the carrier.This can be demonstrated with a ther-mocouple (TC) mounted on the carrier,just below the TC on the top side of thesubstrate.
The top of Figure 2 shows theheating of the substrate as humps,due to the absence of the heat spread-ing effect as the substrate lifts off fromthe carrier as it deforms. With suction,effective heat spreading occurs, whichevens out the temperature.
Advanced Thermal Control (ATC)
Below are the heat transfer for-mulas related to mass reflow ovens.
Convection heat delivered:
Target heat absorbed:
This produces S-curve heattransfer characteristics and the heat-ing rate will reduce when the targettemperature approaches the convec-tion temperature. Common parame-ters for mass reflow ovens based onthe parameters for the above trans-fer are: M = mass of the product andcarrier; Cp = specific heat capacity ofcarrier; A = exposure area; t = expo-sure time; H = coefficient of convec-tion; and T = temperature.
Control of the heating rate canbe achieved by adjusting the reflowparameters. The mass (M) of theproduct is an important factor. It isnecessary to reduce excess area andweight of the carrier to minimizeeffects of forward heat sinking andbackward conduction, which impactthe thermal uniformity along thedirection of flow.
It is typical to see the rear of theproduct with a higher temperaturethan the leading edge. The rear willact as a heat sink for the leadingedge, while the leading edge will con-duct heat to the rear as it gets hotter.This effect can be reduced withsmaller temperature setting differ-ences between the zones and avoid-ing high ramp rates, but may requirelonger zones or a longer oven.
With the oven size, conveyorspeed and the product and carriermass held as constant, the nextparameter to investigate is the coeffi-cient of convection (H). The variablesfor convection heat transfer will bethe area of coverage and impingementpressure. Plenum orifice size and dis-tance from target will determine theimpingement force on the product. Byoptimizing the orifice size, distribu-tion and distance from product, thethermal transfer rate can be opti-mized to a preferred condition. Thiscreates a controlled heating and cool-ing rate for the reflow process.
Figure 3 (page 67) displays theprofiles with similar settings andsome fine-tuning to accommodate thecritical areas to control reflow andCTE differences. Unformed joints arenot sensitive to CTE mismatch dur-ing heating. The area of critical con-trol starts from the reflow ramp atzone 5 to the end of the oven coolingzones. The calculations for heatingand cooling rates are made over fivesecond intervals.
The control of the time aboveliquidus (TAL) is believed to influ-
May, 2019 Page 65www.us- tech.com
A division of Illinois Tools WorksLearn more at www.itweae.com
Meeting the increasing demands of electronics manufacturersManufacturers are demanding improvements in throughput, yield and performance. Miniaturization and other technical challenges require continuous advancement in
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ITW EAE is focused on developing technology that addresses these needs. We have a strong relationship with the world’s leading manufacturers and work directly with them to identify areas that need further innovation. We are actively pursuing the bene�ts to be realized by Industry 4.0 and the resulting improvements in yield, overall equipment e�ectiveness, and
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See our latest developments at Nepcon China - Booth 1H47, April 24-26 and SMT Connect, Nuremberg - Booth 4-229, May 7-9
Reducing CTE MismatchDefects in Flip Chip ReflowContinued from previous page
Figure 2: Window cover without suction (top) and with suction (bottom).Continued on page 67
See at NEPCON China, Booth 1H47 and SMTconnect, Hall 4 Booths 229 and 329
www.us- tech.com May, 2019Page 66
There is a confluence of factorsleading the backend of the semi-conductor and SMT industries
to begin to merge. Main drivers arevery high-end electronics and semi-conductors. Chip stacking, miniatur-ization of components, silicon sur-faces, and reflective components arebeginning to play a role in electronics.
An exciting aspect is thatFortune 100 companies, high-endsmartphone companies, high-endelectronics manufacturing companies,and semiconductor fabs are all unhap-py with the solutions available todayfor inspection and measurement. Thisis fertile ground for those of us whocan address these challenges.
Inspection and Measurement
Customers want more thaninspection and a pass/fail report.What they really need to know ispoint-to-point distance and line-to-line distance. They are asking ques-tions that historically the electronicsindustry or even the backend of thesemiconductor industry had notasked previously.
Now, manufacturers are seek-
ing x/y/z measurements and deter-mining what it means for theirprocesses if the measurement is off.
They are considering what they feedback to their processes and how theycan better control their processes.
This presents opportunities forthe companies with advanced tech-nologies, which is where CyberOptics
thrives. The industry dynamics arecreating a real need for highly accu-rate 3D measurements, not just opti-cal inspections, but optical measure-ments at high speeds as well. This iswhere CyberOptics’ proprietary 3Dmulti-reflection suppression (MRS)sensor technology is highly valued. Itis faster and more accurate than any
other 3D conventional technologyand mitigates reflection-based meas-urement distortions for metrology-grade image quality.
Customers value the combina-tion of speed, accuracy and resolu-tion that CyberOptics offers.
Customers worldwide havebeen rapidly adopting the 3D MRS-enabled SQ3000™ multifunction sys-tem for AOI, SPI and CMM (coordi-nate measurements) and recognize itas a premier process control solution,particularly for the most challengingapplications. The multifunction sys-tem can identify critical defects andmeasure critical parameters, in orderto fix what can be found and controlwhat can be measured. Ultimately,CyberOptics enables significant im -provements in yields, quality andoperational efficiencies in customers’manufacturing facilities.
Proprietary Sensor Fuels Growth
CyberOptics’ 2018 revenue in -creased 21 percent over 2017. Fourthquarter 2018 sales of inspection andmetrology systems increased 46 per-cent year-over-year. In this category,sales of 3D MRS-enabled SQ3000 AOIsystems, including the SQ3000 CMMthat incorporates AOI with metrologyfunctionality, rose 40 percent year-
The industry dynamics are creating a real need for highlyaccurate 3D measurements, not just optical inspections,
but optical measurements, at high speeds as well.
Critical Inspection and Measurement: The Convergence of the Semiconductor
and SMT MarketsBy Dr. Subodh Kulkarni, President and CEO, CyberOptics Corporation
Continued on page 70
CyberOptics’ three-micron sensor can deliver precise inspection andresolution for features down to 30 microns in size.
See at SMTconnect, Hall 4 Booth 346 and EWPTE, Booth 2050
ence the spread size of the solderjoint. This determines the area ofinterface between the substrate andbump and will be more prone tocracks if the timing is too long.Typical TAL values are between 50and 60 seconds.
It can be seen in Figure 3 thatthe cooling rates achieved with thecontrolled cooling from ATC are moreconsistent, even as those comparedto the standard PYRAMAX TrueFlatoven. These spikes over short dura-tions of five seconds are called microspikes. How critical are these microspikes to the reflow process?
If the pitch is wide, such as³120 micron copper pillars or simplyby using soft solder bumps, the effectof these spikes may be less detri-mental. With further miniaturiza-tion, brittle ELK dielectric with cop-per pillars and much finer pitchmeans less flexibility and more sen-sitivity to CTE-related cracks. Suchproducts will require tighter controlof the cooling rate.
TrueFlat negative pressure
reflow technology ensures that thinsubstrates on carriers are kept flat toreduce die tilt and in direct contactfor effective heat spreading duringthe reflow process. ATC comple-ments TrueFlat technology in reduc-ing micro spikes for optimal controlof CTE mismatch-related defects.
Contact: BTU International,Inc., 23 Esquire Road, NorthBillerica, MA 01862 % 978-667-4111 Web: www.btu.com r
See at NEPCON China, Booth 1E50, and at
SMTconnect, Hall 4 Booth 551
May, 2019 Page 67www.us- tech.com
Figure 3: Profile comparison — standard vs. ATC.
Reducing CTE MismatchDefects in Flip Chip ReflowContinued from page 65
prior to starting the vehicle, therebyavoiding damage. These technologiesare currently being evaluated byleading automotive electronics man-ufacturers, with promising results.
Beyond the battery pack is thepower inverter, which draws storedpower from the battery to drive theelectric motor. Like the battery com-ponents, effective heat dissipationthrough the use of TIMs is critical toDC-DC inverter performance. Inaddition, because the inverters areconducting such high switching fre-quencies, highly-reliable intercon-nect materials that offer an alterna-tive to tin-lead solders (which couldbe phased out as early as 2023) arerequired.
Henkel silver sintering pastesare already being integrated for thispurpose. Elsewhere, in the batterymanagement engine control units(ECUs), other advanced materials,such as solder, conformal coatingchemistries, potting compounds,sealants, and inks, combine to maxi-mize the operation of NEVs.
Throughout the entire automo-tive system, advanced electronicmaterials are present, providing reli-able performance of ADAS technolo-gies. These include long-lastinginterconnects for electrical function-ality, temperature management ofcritical battery components, and pro-tection and sealant materials to keepharmful environmental influencesfrom diminishing functionality.Together with today’s leading auto-motive electronics manufacturers,materials innovators are drivingtoward a world with improved roadsafety, better vehicle control andcomfort, and reduced emissions.
Contact: Henkel ElectronicMaterials LLC, 14000 JamboreeRoad, Irvine, CA 92606 % 714-368-8000 E-mail: [email protected]: www.henkel-adhesives.com r
ImprovingAutomobilesContinued from page 63
Page 68 May, 2019www.us- tech.com
Hand soldering is the process of joining twometals using a filler material, known as sol-der. The solder is typically a metal alloy
with a lower melting point than the metals beingjoined. This is sometimes confused with weld-ing, but the main difference between solderingand welding is that in soldering the joined met-als are not melted.
This process has been in use for millennia,as experts agree that hand soldering wasemployed as early as 5,000 years ago in Egypt.The use of soldering as an assembly processgrew in popularity around 4,000 years agowhen tin was discovered as a flowable metaljoining material.
This technique for soldering quicklyexpanded from the Mediterranean region andwas introduced to the Roman Empire, Swissand Hungary. The soldering process hasimproved from culture to culture and from gen-eration to generation. Yet, for all this experi-ence, today’s electronic assembly still suffersfrom manufacturing issues caused by this age-old process for joining metals.
Standards for Safety
The electronics industry has implementedmany standards over the years to ensure that theproducts we build meet our customers’ needs forsafe and reliable operation. As manufacturers, wemust allow for profits to be achieved to keep our
production line running and our investors happy.One of our largest overhead items is the cost toprovide industry-standard training to assemblyoperators who practice the art of soldering daily.
Typically, these standards are based on the visualappearance of the final soldering joint.
Many operators will only gain this expertiseafter years of experience and many training ses-sions. That being said, hand soldering is still anart and dependent upon human behavior.Unfortunately, as humans we are fallible and
despite training, practice and inspection, we candeliver products with latent defects.
As an example, in December 2015, FordMotor company issued a recall for 313,000 older
cars for headlight failures linked to 11 crashes.The automaker recalled 2003 to 2005 FordCrown Victorias and Mercury Grand Marquisto replace the lighting control module. Themodules’ solder joints could crack and inter-rupt power to the headlights, increasing therisk of a crash at night.
The reliability of solder interconnectionsdepends on intermetallic compound (IMC) for-mation which is a function of time and temper-ature. The reflow peak temperature and thetime above liquidus are two critical variablesin determining the IMC thickness. The IMC isnecessary for good solder joint interconnectionand its presence provides a bonding layerbetween the solder and component termina-tion and/or board substrates. Solder joint reli-ability can be affected by both the lack of anIMC layer and too thick an IMC layer. If athick IMC layer was formed within the solder
joint, its brittleness can cause solder joint reliabil-ity concerns.
Connection Validation
The Connection Validation (CV) soldering sys-tem was designed by Metcal to allow for the repeat-
IPC-CFX Process Control andTraceability: Real-Time Risk Mitigation
in Hand Soldering By Hoa Nguyen, CTO, OK International, and Ed Zamborsky, Regional Sales Manager, Metcal
Continued on next page
Intermetallic compound layer (IMC) of a solder joint.
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able creation of the intermetallic layer of the solderjoint and to provide feedback to the operator whenthe solder joint is acceptable. In addition, the CVsystem can also warn the operator when the tip andoperating temperature that he or she has selectedwill not create the proper intermetallic. This createsa closed-loop system to assist the operator to meetthe correct soldering parameters of an acceptablysoldered connection.
Data is the fuel of today’s factories. One of themany features of CV is its ability to collect datafrom the hand soldering operation and the perform-ance of the soldering cartridge and its operatingtemperature on the assembly being soldered. Someof the parameters that can be captured and storedin the CV cartridge include: cartridge part number,lot code, serial number, idle tip temperature, solderjoint count, total run time, actual tiptemperature and time during each sol-der event, and ESD detection, addingup to process control and traceabilityof the final product.
Data collection is the process ofgathering and measuring informa-
tion about variables of interest in anestablished, systematic fashion thatenables one to answer statedresearch questions, test hypothesesand evaluate outcomes. Many com-munication protocols have beendeveloped over the last six decadesand are still being used today.
OEMs collect proprietary dataand encrypt it the way they specify.In some cases, this was done to dis-courage users from using equipmentfrom other OEMs. Since data struc-ture is different, the limitation ofsharing data across devices createsdifficulty to draw conclusions usingdata analytics methods. The existingarchitecture does not support the cur-rent trend of automation and dataexchange to drive manufacturing,maintenance, inventory tracking andother types of activities across theentire manufacturing network.
With the introduction of theInternet of Things (IoT), advancedanalytics and machine learning arechanging the landscape of industrialmachine interaction. The data cap-tured is only valuable if it is able to beshared. A common language is needed.
Speaking the Same Language
In 2017 the IPC began develop-ing an international standard forcommunication from machine tomachine called Connected FactoryExchanged (CFX). IPC-CFX is anelectronic manufacturing industrydeveloped standard forming the foun-dation and backbone of Industry 4.0applications. IPC-CFX simplifies and
standardizes machine communication, while alsofacilitating machine-to-business and business-to-machine solutions.
Since it is an industrial standard, there willbe no proprietary format and/or encryption aseveryone would share it in the public domain. An
NDA is no longer required. If machines are CFX-compatible, then they can communicate with eachother. Information can be shared. Manufacturingwill no longer be required to run different applica-tions to collect data. All data can be stored on acentral database.
Last September, at the CFX proceedings,large machine manufacturers presented on howtheir equipment was able to communicate. Butthis was mostly proprietary information designedto assist the technician on how to best run thatmachine — replace a reel, add solder paste, etc.
When it was Metcal’s turn to present, weshowed how the new Connection Validation hand sol-dering system can communicate with the IPC-CFXserver on the status of the simple soldering iron, andat the same time provide information on the quality
May, 2019 Page 69www.us- tech.com
Real-Time Risk Mitigation in Hand Soldering...Continued from previous page
Continued on page 72
Meet the new MYPro Line™Wherever the future might take you, the path just got shorter. With the MYPro Line, you can jet print perfect solder joints at the highest speeds. Ensure non-stop production with intelligent storage and proactive replenishment. And eliminate defects with 3D inspection systems that monitor and improve your process over time. It’s the best of Mycronic in a single integrated manufacturing solution for the most demanding build schedules, enabling maximum utilization with machine-to-machine communication and factory connectivity. The shortest path to a smarter future starts here.
Metcal’s Connection Validation(CV) hand soldering system.
In a demonstration, we showed howthe new Connection Validation handsoldering system could communicate
with the IPC-CFX server on the statusof the simple soldering iron, and at thesame time provide information on the
quality of the solder joint as well asthe output of the operator.
See at NEPCON China, Booth 1E60 and SMTconnect, Hall 4 Booth 349
Page 70 May, 2019www.us- tech.com
over-year in the fourth quarter by thecompetitive advantages of the MRStechnology platform.
With its rich patent portfolio andkey technology platforms addressingchallenging applications across theSMT, semiconductor and industrialmetrology markets, CyberOptics iswell-positioned for continued solidgrowth and profitability over the nextthree to five years.
MRS technology has allowedthe company to strengthen its posi-tion in existing SMT markets andparticipate in the backend semicon-ductor market, where its MRS sen-sors are integrated into KLA®’s back-end inspection systems. The compa-ny has further extended the technol-ogy into the mid-end semiconductormarket where it sees a large growthopportunity in advanced packaging.
MRS sensors can measure cracksand defects as small as 30 microns insize. This is important as electronicspackaging continues to shrink, compo-nents are more densely combined oncircuit boards, tall components areplaced near small components andvarious new stacking technologiesgrow in popularity. All of these aredriving the need for high-precisioninspection and measurement.
Mid-End Semiconductor
There are various definitions inthe market, but features that arelarger than 100 microns are typicallyseen in the backend semiconductorarea. Features that are smaller thana single micron are seen in the fron-tend area, and everything in betweenis generally referred to as the broad,mid-end area.
There is a plethora of activity inthe mid-end and advanced packagingmarket, whether it is wire bonding,stacked die, copper pillars or C4 sol-der bumps. Advanced packaging,where dice are integrating vertically,involves finer features with more lay-ers and I/Os.
There are various stacking tech-nologies; whether it is fan-in or fan-out and the packaging of the dice isstill done on the wafer, embeddeddice, or through-silicon vias (TSVs),it is clear that there is a growingneed to effectively identify and con-trol defects.
The mid-end and advancedpackaging market is growing quick-
ly. According to Yole Developpement,the advanced packaging market rev-enue is projected to grow fromaround $28 billion in 2019 to around$33 billion in 2022. With all of thecomplexity, variations of packagingtypes and continued advancements,yield challenges are increasing.Right now, the industry is demand-ing high accuracy, high resolutionand higher speed for 100 percentinspection. Volumes are increasing
in this area, due to stacking andother advanced packaging applica-tions, making speed a critical factor.
MRS Sensor Advancements
In 2015, when CyberOpticslaunched its MRS technology, its pixelwas 18 microns. From 18 microns ithas come down to three microns. Infour years, the technology has ad -vanced by a factor of six. In addition,its three-micron sensor is capable ofhandling specular surfaces. Along sidethe improvement in resolution, thecompany has also added the ability tohandle mirror-like surfaces.
CyberOptics’ latest MRS sensoris excellent for the mid-end inspec-tion area. Typically, there is a factorof ten to one — the three-micron sen-sor can deliver high precision, accu-racy and resolution for features downto 30 microns in size. The big differ-entiator is the high resolution andaccuracy that the industry needs,and the speed advantage. Cyber -Optics’ sensor technology is two orthree times faster than alternatesolutions in the marketplace.
Going forward, CyberOptics willcontinue to advance its sensor technol-ogy with various levels, includingimprovements in pixel size and fur-ther advancements in its proprietaryMRS algorithms — the secret sauce. Inthe future, the company anticipatesdelivering sub-one micron resolutionfor features smaller than five micronsto start approaching the front-endsemiconductor area.
Contact: CyberOptics Corp.,5900 Golden Hills Drive,Minneapolis, MN 55416 % 952-820-5837 E-mail: [email protected] Web: www.cyberoptics.com r
See at NEPCON China,
Booths 1E52
and 1E54
The SQ3000 system addresses AOI, SPI and coordinate measurement.
The Convergence of theSemiconductor andSMT MarketsContinued from page 66
See at NEPCON China, Booth 1D12 and SMTconnect, Hall 4 Booth 129
As the electronics manufacturing industrymoves rapidly toward Industry 4.0, inventorymanagement is becoming more critical than
ever. Unfortunately, most companies are unawareof how much time and money can be saved by usingan X-ray component counter. Accurate inventorycontrol allows production to continue with maxi-mum uptime, while minimizing excess inventoryand optimizing material flow. Scienscope offers aversatile line of X-ray component counting systemsat a competitive price point.
Batch Component Counters
The Scienscope AXC-800 7” hasbeen developed specifically to suitthe needs of smaller contract manu-facturers. The system counts 7 in.(18 cm) reels, cut strips and looseparts, which makes it well-suited forentry-level component counting. TheAXC-800 also has the capability ofsending its counted information toany material management system.
The machine also comes with abarcode template that is inter-changeable and can be integrated tomimic the customer’s current label.With an external 1D and 2D scan-ner, the system can scan a wide vari-ety of barcodes.
The parent of this machine isthe AXC-800, an all-in-one compo-nent counter. This system can count7, 13 and 15 in. (18, 33 and 38 cm)reels, cut strips, loose parts, JEDECtrays, and tubes. With its simpleinterface and efficient processing,the system can streamline theinventory staging period, wherereels sit on a shelf until they need tobe counted. The AXC-800 includesartificial intelligence (AI) technolo-gy, which allows it to scan all kindsof components, without requiring alibrary. The system automaticallydetects the type of component, withno input from the operator.
The AXC-800 II is Scienscope’stop-of-the-line batch componentcounter. With the same AI system inall three of the machines, this systemoffers internal barcode scanning.Scanning barcodes within themachine eliminates the operator taskof having to decide which barcode toscan. The machine can capture all thedata from every barcode on a reel.
Through software, the systemcan link a UID, which in turn willcarry all the information on the reel.The machine can not only transferthe barcode, but also date, time,location, and operator information.This system is designed to makecomponent counting as easy as pos-sible for any user, regardless of theirlevel of training.
While each of the AXC-800 mod-els have similar capabilities, Scien -scope tailors each machine to meetthe individual customer’s needs. TheAXC-800 systems are capable ofcounting a 7 in. (18 cm) reel in aboutseven seconds, with a barcode labelprinted out shortly after.
For the AXC-800 and AXC-800II, counting large reels takes about24 seconds. These systems aregeared more for manufacturers run-ning high-mix, medium-volume pro-duction.
Inline Systems
Scienscope offers systems tosuit all types of manufacturers. The
AXI-5100c is an inline component counting machinethat comes in three models, like the AXC-800 series.The AXI-5100c series is automated and geared spec -ifically to count components. The series has thecapability of counting 7 in. (18 cm) reels only, or 7,13 and 15 in. ( 18, 33 and 38 cm) reels, JEDECs, cutstrips, and trays. These highly intuitive systemsrequire nothing but to be loaded with a cart of 200 7in. (18 cm) reels, and one cart of 50 larger reels.
After the reels are loaded, the operator pressesstart and 40 minutes later, the 200 reels are count-ed. In the case of the AXI-5100c II, the reels can also
May, 2019 Page 71www.us- tech.com
Bottom Line: X-Ray Component CountersBoost Revenue and Reduce Downtime
By Danny Lumbreras, Chief of Service and West Coast Regional Sales, Scienscope International
Continued on next page
The VisionXP+ with vacuum option reliably removes pores, gas occlusions and voids immediately after the soldering process – while the solder is in an ideally molten state. Void rates of less than 2 % are made possible by vacuum of down to 10 mbar. Pressure and speed can be individually adjusted. This integrated solution results in a
the PCB in an external vacuum system is no longer necessary – the workpieces are transferred from the peak zones directly to the vacuum process.
www.rehm-group.com
in every production ambienceReflow convection soldering with flexibility and high throughput
Ready for
Industry 4.0
AXC-800 series batch component counters.
See at NEPCON China, Booth 1D55 and SMTconnect, Hall 4A Booth 100
of the solder joint as well as the outputof the operator. This simple solder jointdemonstration was considered revolu-tionary by the participants and the cre-ators of the CFX standard. Not one ofthe industry experts had ever consid-ered the possibility of monitoring the
hand soldering process.Questionable solder joints remain
a constant source of printed circuitboard failure. Typically, the reliabilityof the connection relies on visualinspection, operator influence andskill. Each factor involved with the for-mation of a solder joint is an element ofrisk and can affect either throughputor reliability. Mitigating the risk inhand soldering requires the identifica-tion of these factors — and with the CVsystem — a means to control them.
The time to correct defects isduring the initial soldering process.After the soldering process is com-pleted, we as an industry cannot relyon inspections performed by humansor machines to confirm solder jointformation to a standard. The highestpoint of risk is during the solderingoperation and is the formation of theintermetallic compound. Visualinspection and operator skill do notverify the correct formation of theintermetallic compound within thesolder joint. It is time to consider aclosed-loop soldering system withCFX compatibility for process controland traceability.
The overall success and qualityof IPC-CFX is a testament to theinnovation and growth taking placein the electronics industry. For thefirst time ever, all machines of alltypes from all vendors are able to usea single language, protocol andencoding method to eliminate all cus-tom interpreters and any possibilityof error to share real-time data.
Contact: Metcal, 10800 ValleyView Street, Cypress, CA 90630 % 714-799-9910 E-mail: [email protected] Web: www.okinternational.com/metcal r
Page 72 May, 2019www.us- tech.com
be labeled to communicate with thematerial management system. The
machine is able to recognize the loca-tion of the old label and to place thenew label over it, eliminating anyconfusion. With this type of machine,all component counting personnelcan be relocated elsewhere on theshop floor.
By using X-ray componentcounting systems, any size companycan boost the accuracy of its material
management system, cut costs andimprove line uptime.
Contact: ScienscopeInternational, 5751 SchaeferAvenue, Chino, CA 91710 % 603-426-6172 E-mail: [email protected] Web: www.scienscope.com r
See at NEPCON China, Booth 1H15, and at
SMTconnect, Hall 4A Booth 148
DL Technology has been the leader in micro dispensing technology for over 15 years. For more
www.dltechnology.com
216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • [email protected]
X-Ray Component Counters Boost Revenue and Reduce Downtime
Real-Time Risk Mitigationin Hand Soldering...
AXI-5100c II automated, inline X-ray component counter.
Continued from page 69
Continued from previous page
See at NEPCON China, Booth 1G51 and SMTconnect, Hall 4A Booth 324
May, 2019 Page 73www.us- tech.com
Not all manufacturing execution systems(MES) are alike. A sustainable MES hasinterfaces to leading IoT/IIoT (Internet of
Things/Industrial Internet of Things) platformsand contains features that support administra-tion, control, data collection, and analysis. Thisresults in multilayered comprehensive systems forthe smart factory. So, which functions should anintelligent MES contain?
High transparency, safety and efficiency, aswell as an increasing degree of automation in pro-duction are indispensable in many industriestoday. For example, the electronics industry is sub-ject to strong competitive pressure. The tremen-dous speed of innovation, an ever-increasing mix of variants and highregulatory compliance requirementsset the pace.
The classic core functionality ofan MES is management of the pro-duction process. Around this core, thesystems keep developing further interms of digital transformation. Anew generation of intelligent solu-tions for networking and automationof the production process is emerging.
MES Meets IIoT
By using MES solutions, pro-duction processes can be controlledand monitored in real time. The sys-tems are increasingly being expandedby applications that also includewarehousing, shipping, manpowerand much more, whereby additionaldata is being recorded and evaluated.This creates the basis for the directexecution of production orders andenables dynamic reactions to changesin the complex connected factory.
The combination of adaptable ITarchitecture and IoT/IIoT capabilityplays a central role for an MES. Inthis way, it is possible at any time toact accordingly to rapidly alteringrequirements in ever-changing facto-ry environments.
An intelligent MES, like theiTAC.MES.Suite, includes such basicfunctionalities as advanced produc-tion planning and scheduling (APS),production management, qualitymanagement, materials and logistics,traceability, tools for analyzing andevaluating data in real time, as wellas tools for an automatic notificationin case of problems.
The iTAC.MES.Suite providesthe so-called structured data from theMES data room (order data, materialdata, serial numbers, etc.). The MESensures a continuous flow of informa-tion to guarantee transparency andevaluation of production processesbased on standardized and customer-specific KPIs.
Interfaces to leading IIoT-plat-forms, in which so-called unstruc-tured data in the form of sensor data(e.g. vibration, temperature, etc.) arestored, result in intelligent overallsolutions. In combination with theanalytics functionalities of iTAC,individual use cases can be imple-mented for the specific requirementsof the electronics industry and otherbranches.
Seven Critical Capabilities
There are seven core areas thata sustainable MES should fulfill:
Production management, work-flow, execution and in-processquality. This describes the ability tocontrol and monitor the entire pro-
duction process, from order release through workin progress (WIP) and on until final completion.
Data collection, data management and inte-gration. In order to map these processes, the MESmust be able to collect and manage data, as well asexchange it bidirectionally with the shop floor inreal time. In addition, it must have a mature inte-gration model.
Traceability, including process interlocking.The MES should enable the tracing of the entireproduction development. This is made possible bytracing all production and process data. Serial or
“Must Haves” of a ContemporaryManufacturing Execution System
With MES software, production processes canbe controlled in real time, with a high degree
of visibility and traceability.
Michael Fischer, Director of Product Marketing, iTAC Software AG
Continued on page 75
See at NEPCON China, Booth 1E52
Micromachining systems are often requiredto meet an extensive range of specifica-tions. However, with a more modular
design, systems can be configured to meet particu-lar requirements without an extreme increase incost. Zorn’s expertise in handling miniature com-ponents led to the development of the Micro one, aprecision CNC machining system. The engineeringfirm’s deep knowledge of special-purposemicroassembly machines played a key role in thedesign of the new system.
Working in association with specialists fromthe machine tool sector, the company created amodular, highly flexible miniature machine tool.
The development objectives were to create a high-quality, ergonomic machine capable of handlingsmall parts, make it use resources efficiently andtake up a minimal amount of space.
Supply and Machining Modules
The designers were given free rein whendesigning the new system, without the kinds ofrequirements of conventional machine tools. Thisprocess resulted in a micromachining center with amodular structure for maximum flexibility.
The system can be split into two units, whichcan be positioned separately. The supply modulefunctions as a base, accommodating the switch
cabinet, controller, pneumatic system, coolingunit, and a minimal-quantity lubrication system,while the machining module is the active element.Placed one on top of the other, the Micro one fitsinto a space of only 9.7 ft2 (0.9m2).
If the two modules are separated, they can bearranged to form a manual seated workstation. Themachining module can also be integrated into othersetups, as well. The high-frequency spindle allows acontrolled speed of up to 75,000 rpm, enabling signif-icant cutting speeds. The high speed and feed rateare excellent for machining a wide range of materi-als, including hardened steels.
Access to the workpiece is a critical factor forboth microassembly and microma-chining. The work area of the Microone offers access in both the x and yaxes. The raised work level places thez axis in an excellent position forworkpiece access.
Even the most compact of mach -ines needs a solid base. By combining ahigh level of mechanical and thermalstability, natural granite offers a solidfoundation for the Micro one. The sys-tem’s direct drives, supplied byHeidenhain, use ultra-precise glassscales to guarantee dynamics and pre-cision. As is the case for the high-fre-quency spindles, the drives are water-cooled to ensure stable temperatureswithin a single degree.
Another special feature of themachine is its tool changer. The tools,which are engaged directly in thespindle using collet chucks, arestored in a tool changer on the mainaxis. One linear unit can accommo-date 12 tools, which are locateddirectly next to the worktable. Thisprovides exceptionally short toolchangeover times — down to threeseconds. Each tool is gauged on theworktable using a Z-Pico tool lengthmeasurement system from BlumNovotest, before being inserted. Thetool fixtures can be exchanged for aquick-change system, enabling quickaccess to a wider range of tools. A fireextinguisher and extraction systemare also available as options.
Environmental Impact
Another crucial aspect for Zornwas to develop a machine with thebest possible environmental foot-print. In addition to occupying mini-mal floorspace, the Micro one alsoreduces energy consumption. It doesthis by setting less mass in motionoverall and the direct drives, as wellas the high-frequency spindles, gen-erate little noise.
The integrated minimum-quanti-ty lubrication system rounds out themachine, reducing chemical require-ments and ensuring efficient cooling
Page 74 May, 2019www.us- tech.com
What is your PCB profile now?...and now?
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Reduced production cost
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Connected reflow process
kicthermal.comkic.cn
Making Ovens Smarter
Consistent and Modular Micromachiningwith Zorn’s Micro one™
Micro one, a modular CNC micromachining system.
By Martin Zeiher, CEO, Zorn microsolution GmbH
Continued on next pageSee at NEPCON China, Booth 1G10 and SMTconnect, Hall 4A Booth 230
and lubrication, while keeping costslow. These features are underpinnedby the CNC control system. The drive-based 840D SL CNC control fromSiemens provides sufficient perform-ance even for five-axis simultaneousmachining and opens up a widerange of options for the compactmachine.
With the addition of anautomation module, the machinecan be turned into a complete pro-duction system. Fitted with a dedi-cated control and operating system,the machine offers extensive capa-bilities for flexible finishing andmachining.
A robot cell can be mounted on asupply module and placed next to themachining module. The articulatedrobot arm can serve up to three mach -ining systems arranged around it.
In the smallest upgrade stage,which includes a Micro one and theautomation cell, a 19.4 ft2 (1.8m2)space is required. The three-machinearrangement requires about 73 ft2
(6.8m2). The machine wasdesigned from the beginning as anintegrated system, which alsoincludes additional processingsteps — from the testing station toassembly and packaging.
Contact: Zorn microsolutionGmbH, Höllstrasse 11, D-78333Stockach, Germany % +49-7771-87373-200 E-mail: [email protected] Web: www.zorn-microsolution.com r
batch number-based information,such as the start and end of the workprocess, set parameters, operator, andused materials or assemblies arerecorded and stored. Based on thisinformation, a process interlock cantake place anytime during production.
Analytics and performance —
management and visibility. Inthis area, analysis of production andquality management are carried out,among other tasks. Systems such asthe iTAC.MES.Suite offer enhancedanalytics capabilities. Parametersthat significantly influence qualityare identified and monitored duringproduction. In addition, iTAC pro-vides customers with a predictivemaintenance solution to constantlymonitor the condition of a facility andbetter plan maintenance activities.
Product suite extensions. Like theiTAC.MES.Suite, there should be ahomogenous software basis. Thismeans that new upgrades andreleases will take place globallyacross all users. Changes to the fac-tory layout, standard clients andfunctions should be freely config-urable according to the require-ments. iTAC also offers the option ofcreating individual clients and solu-tions as addons to the basic softwaresolution and provides the customerwith a development framework, aswell as integration options forHTML5 clients and microservices.
Integration — ERP, SCM, PDM,and PLM. The connection of ERP,PLM and other management sys-tems is a standard requirement. Thesimple integration with correspon-ding configurable interfaces shouldbe given.
Architecture, usability and userinterfaces. A modern MES is archi-tecturally based on standards. In addi-tion to architecture and functionalcharacteristics, strategic conceptssuch as SaaS and cloud models play arole. This can reduce investment costsfor application software and IT infra-structure, as well as lower the totalcost of ownership (TCO).
The core functionalities are thenexpanded by other features, such asresource management, manufacturingprocess management, operations intel-ligence and production planning oradvanced planning and scheduling.Integrated IoT/IIoT solutions round offthe system. This results in a compre-hensive system with which manufac-turing companies from various indus-tries worldwide can meet industry 4.0requirements.
Contact: iTAC Software, Inc.,26801 Northwestern Highway,Southfield, MI 48033 % 248-450-2446 Web: www.en.itac.de r
See at SMTconnect, Hall 4 Booth 209
May, 2019 Page 75www.us- tech.com
Must Haves ofContemporaryManufacturingExecutionSystems
Ersa VERSAFLOW 4 XLdesigned for PCB sizes of
up to 610 x 1,200 mm
Highly efficient 800 W hybrid heating head
Large-area IR Matrix bottom heaterwith 25 single heating elements (600 W each)
Process observation with up to 8 thermocouples
Automatic and precise component alignmentwith the help of machine vision
Highly accurate, motor-driven axis system
for component placement (+/- 0.025 mm)
User independent, reproduciblerepair results guaranteed
Process control and documentationvia the operator software HRSoft 2
Ersa HR 600 XLautomatic rework
on large assemblies
Ersa HRSoft 2 software package for HR 600 XLSimultaneous fluxing and solderingon PCB panels in x- or y-direction
Think BIG! –And be prepared for the future
High-end selective soldering system to integrate into in-line manufacturing concepts
Product change without downtime
VERSAFLEX solder module x/y/z-variable
Parallel process through separationof fluxing, preheating and soldering cycle
Use of up to 4 flux spray heads withtwo independent axes (2 spray heads per axis)
Max. PCB size 680 x 610 mm (option 1,200 x 610 mm)
VERSACAM for solder wave height measurement on the fly
Flexible system configuration on account of modularity of the design
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Consistent and Modular Micromachining...Continued from previous page
Continued from page 73
See at NEPCON China, Booth 1G45 and SMTconnect, Hall 4 Booth 111 and Hall 5 Booth 434B
Page 76 May, 2019www.us- tech.com
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Whether it is reducing costs, optimizing uti-lization or enhancing the customer’s expe-rience, Industry 4.0 can offer improve-
ments in almost every aspect of the manufacturingprocess. However, there is one element that is apriority for nearly everyone: improved overall pro-ductivity. Overall productivity can be significantlyimproved through the use of predictive mainte-nance tools.
Predictive Maintenance
In any manufacturing industry, mostare familiar with “preventive” maintenanceguidelines to avoid equipment failure. Thegoal is to reduce the likelihood of machinefailures that result in factory downtime.Predictive maintenance starts as a philoso-phy that utilizes the production equipment’soperating conditions to make data-drivendecisions.
With the rise of Industry 4.0, new datastreams can be leveraged with the use ofinexpensive sensors to monitor how a produc-tion equipment is performing in a variety ofnew ways. This information may include datacollection of vibrations, temperature orpower/amp fluctuations. With the use of thisdata and artificial intelligence (AI) software,we can now make predictions about futurefailures allowing operators to schedule correc-tive maintenance and prevent unexpectedequipment failures.
In the SMT industry, we can define the objec-tives of predictive maintenance as improved over-all productivity and improved maintenance effi-ciency. With the use of data collection and AI soft-
ware, we can enter into a predictive maintenanceoperation and improve overall machine uptime. Byanalyzing this data, we can trigger a variety ofbehaviors, including taking corrective action iftrends are found.
As production demands increase, many proac-tive tasks, such as machine maintenance often fallbehind. This reactive maintenance schedulingapproach has been shown to have a negativeimpact on overall production line up time by any-where from 5 to 25 percent.
With the use of predictive maintenance tools,production can continue to run until the data ana-lytics provide a warning in advance. Maintenancecan be planned around the production schedule,creating an efficient process that also translates
into fewer spare parts required to be kept on-hand,due to the prediction of failures. This then reducesoverall costs to maintain equipment as it canreduce the number of extra parts that may neverbe needed.
Improved Product Quality
Another direct benefit of implementing pre-dictive maintenance is the improvement in thequality of the product that is being manufactured.Fuji carries prediction to the manufacturing
process and creates a process analytics toolfor defect monitoring. This software moni-tors historical processes to predict potentialproduction variances at a very early stageby analyzing data from all machinesthroughout the process.
This data includes monitoring of thescreen printing, SPI, pick-and-place, AOI,and reflow processes. All data is collected inone central location and analyzed for trends,equipment performance and process con-trols. The direct result of analyzing thisdata together allows Fuji to trigger a varietyof behaviors, including taking correctiveaction if trends were found.
Possible corrective actions include:
l Part placement locations can be adjusted,due to board warpage or solder paste mis-alignment. The end result is that the place-ment process is stabilized with the continu-
ous monitoring of the data.
l Start a mask cleaning task.
l PCB panels that fail SPI inspection can be
FactoryLogix IIot/MES manufacturing
intelligence dashboard for Fuji AIMEX III.
Reducing Factory Downtime withPredictive Maintenance Tools
Continued on next page
By Tony Picciola, Technical Services Manager, Fuji America Corporation
See at EDS, Suite B28 See at SMTconnect, Hall 5 Booth 434B
skipped before they enter the pick-and-place machine.
Within the pick-and-place pro -cess, the collection of machine feeder,nozzle and head performance data canbe performed. This data can again bemoved into a central data depositoryand software used to analyze it.
Instead of using “timed” preven-tive maintenance schedules formachine components, such as feedersor nozzles, use a predictive schedulethat monitors performance of thesecomponents and tracks the numberof placements or picks.
By monitoring performance,trends can be identified immediately,and if necessary, the use of the feed-er or nozzle can be disabled until atrained maintenance person per-forms a physical inspection.
By analyzing data, a determina-tion can be made of the cause of atrend. This might be from a compo-nent, its packaging or from an opera-tor dropping components or feedersduring the process. Either way, soft-ware can monitor trends that mightoccur as a result and provide specificfeedback as to the cause.
Setting up for Success
Companies can save time and
money through the use of predictivemaintenance tools by following a fewguidelines. First, start small. Devel -op a pilot program that might startwith the use of a key vendor’s soft-ware tools. This offers an early indi-cation of how these changes can pos-itively impact a business.
Next, involve IT early. They willneed to assist with data collection,either within the cloud or on premiseservers/network ecosystem. Also,outline strategy with goals for pre-dictive maintenance from the begin-ning. Every organization has its ownunique processes and finding thebenefits for a particular company iscritical.
Finally, as part of the strategy,
companies must decide if they willwork with their production line ven-dors and use their software. In somecases, vendors are able to offer a soft-ware solution that can go outside oftheir particular processes. MES soft-ware vendors are also evolving theirsoftware to assist with analyzingdata collected from the entire line.This will continue to be the case, asstandards are established, such asIPC-CFX, which allow more data tobe exposed to anyone who wishes tocollect it.
Industry 4.0 is continuing toevolve and there are many areas tobe explored and many ways toimprove business. The use of predic-tive maintenance tools is a way to get
a company involved in Industry 4.0,as the many benefits and return oninvestment are clear. Companiesshould not be afraid to start a pilotand work with equipment suppliersto deploy what they already haveavailable in the field. Once started,the benefits can be easily measuredquickly realized.
Contact: Fuji America Corp.,171 Corporate Woods Parkway,Vernon Hills, IL 60061 % 847-821-2459 E-mail: [email protected] Web:www.fujiamerica.com r
See at NEPCON China, Booth 1G50, and atSMTconnect, Hall 5
Booths 325 and 434B
May, 2019 Page 77www.us- tech.com
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Reducing Factory Downtime...Continued from previous page
AGC ExpandsResinProductionCapacityExton, PA — AGC is significantlyexpanding its production capacity ofFluon+ EA-2000 fluorinated resin byestablishing a new facility at itsplant in Chiba, Japan. Fluon+ EA-2000 is primarily used as a materialfor 5G high-speed, high-frequencyPCBs, which will see a sharpincrease in demand as 5G networktechnology becomes widely availableby 2020. Operation of the new pro-duction facility is scheduled to beginin September 2019.
Fluon+ EA-2000 is useful forcoating and protecting PCBs, be -cause it provides enhanced electricalcharacteristics.
The production of copper-cladlaminate (CCL), a material used inprinted circuit boards for 5G applica-tions with high-frequency bands,requires materials that exhibit lowtransmission losses. When used in inprinted circuit boards the materialcan reduce transmission losses at 28GHz by more than 30 percent, whencompared with existing materials.
The resin can be applied in bothflexible and rigid CCL for use in awide variety of PCBs. The resinincludes a built-in functional adhe-sive group that enables one-step pro-cessing with other polymers and met-als. It also eliminates the need forsurface treatment or a separateadhesive layer; is heat resistant to500°F (260°C); offers excellent non-stick properties, low frictional prop-erties, and repels water and oil.
Contact: AGC ChemicalsAmericas, Inc., 55 E. UwchlanAvenue, Suite 201, Exton, PA 19341% 610-423-4300 Web: www.agcchem.com
See at SMTconnect, Hall 4 Booth 138
Page 78 May, 2019www.us- tech.com
Duluth, GA — Viscom’s extremelyfast PCB transport system, xFast -Flow, is now available for inline X-ray inspection (3D AXI). The solutionis used in the company’s X7056-IIinspection system.
The X7056-II meets the demandof electronics manufacturing compa-nies for the combination of extremelyfast assembly handling with optimalquality control. The inline X-ray sys-tem can be extended with additional
automatic optical inspection (3D AOI)within its existing housing. WithxFastFlow, the machine achieves han-dling times (in-feed and out-feed of theobject to be inspected) of down to fourseconds. Up to three PCBs can beprocessed simultaneously.
High-performance flat-panel de -tec tors — depending on the configura-tion either fixed or movable — con-tribute to high-quality 3D X-rayimages. With the help of planar com-
puter tomography, both hori-zontal and vertical layer imagesthat no longer show any disrup-tive structures, in contrast to2D results, can be extractedfrom the data volume.
The system can showslice-by-slice views of the interi-or of an array of BGA balls, forexample.
“Head-in-pillow” errors inBGA components or voids insurface soldering can be quicklyand reliably detected. Depen -ding on the requirements,inspection depth and through-put, as well as 3D and 2Dinspection, can be combined.
The system is operatedwith user-friendly vVision soft-ware from Viscom and offersnetworking options withinquality assurance processesduring manufacturing, makingit suitable for Industry 4.0 and thesmart factory.
Contact: Viscom Inc., 1775Breckinridge Parkway, Suite 500,Duluth, GA 30096 % 678-966-9835 fax: 678-966-9828
E-mail: [email protected]: www.viscomusa.com
See at NEPCON China, Booth 1J20, and at
SMTconnect, Hall 4A Booth 120
X7056-II inspection system.
Viscom: Ultra-Fast Inspection forConcealed Solder Joints
Microbond™ SMT650 Solder PasteMaximized reliability in fine pitch applications
THERE ARE SEVERAL WAYS TO REDUCE MOISTURE RISKS
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Hall 4 Booth 4-240
See at SMTconnect, Hall 4 Booth 240 and PCIM, Hall 9 Booth 533See at SMTconnect, Hall 4 Booth 149
May, 2019 Page 79www.us- tech.com
Erlanger, KY — SEHO is now offering its StartSelective, which is ideally suit-ed for those just entering automated soldering. The machine is fully equippedto start production immediately.
The StartSelective is has been designed for ease ofoperation, requiring minimal skills, as well as many tech-nical highlights. With a footprint of only 27ft2 (2.5m2), theStartSelective provides quality and reproducibility of sol-dering results for assemblies up to 20 x 20 in. (50.8 x 50.8cm) and an outstanding return on investment. The com-pact design allows users to integrate the machine in anyproduction island, or to place it as standalone system inthe corner of the production floor.
Loading and unloading of assemblies is done man-ually. All process steps are fully automated and moni-tored. All process-relevant components, such as themicro drop jet fluxer, preheat systemand maintenance-free electromagneticsoldering unit have been in use formany years in SEHO’s systems.
The bottom-side preheat sectionof the StartSelective is equipped withpulsar heaters over the full area,which offer a high energy density andquick reaction time. An additionaltop-side IR preheater ensures perma-nent and controlled heat support dur-ing long cycles to guarantee constantprocess conditions.
The electromagnetic solderingunit has a 7° soldering angle. It is suit-able for the use of non-wetted mini-wave nozzles with directed solder flow.
This provides excellent solder peel-off and effective reduction of possible solder-ing defects, even with difficult board layouts. The solder nozzles have stable and
reproducible flow properties, are maintenance-free andoffer a nearly unlimited lifetime.
A spray jet in the fluxing area, automatic waveheight control and solder level monitoring with auto-mated solder wire supply are among the system’sautomated process control features.
Contact: SEHO North America, Inc., 1445Jamike Avenue, Suite 1, Erlanger, KY 41018 % 859-371-7346 fax: 859-282-6718 E-mail: [email protected] Web: www.seho.de/en/north-america
See at NEPCON China, Booth 1D12, and atSMTconnect, Hall 4, Booth 129
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LPKF: LaserInduced DeepEtching forThin GlassTualatin, OR — LPKF’s new laser-induced deep etching (LIDE) processcan create deep microstructures inglass, without causing microcracks,stress or other surface defects. Due toits properties, glass is one of the mostinteresting materials for advanced ICand wafer-level packaging applica-tions. For a long time, glass was verydifficult to process. Production-relatedsurface defects have given it a reputa-tion of being brittle and susceptible tofracture, making it suitable only forsimple packaging tasks. The newprocess, however, is fast and precise.
According to the company, withthe use of LIDE-processed glass,more opportunities are available inheterogeneous integration ofadvanced IC and wafer-level packag-
ing. LPKF Laser & Electronics man-ufactures laser systems used in cir-cuit board, microelectronics fabrica-tion and TGV formation.
Contact: LPKF Laser &Electronics, 12555 S.W. LevetonDrive, Tualatin, OR 97062 % 503-454-4200 E-mail: [email protected] Web: www.lpkfusa.com
See at SMTconnect, Hall 5Booth 434B
Glass etched by laser-induceddeep etching (LIDE).
See at EDS, Conference Unit 215
Page 80 May, 2019www.us- tech.com
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Cleaning and ConformalCoating Equipment from Anda
Fremont, CA — Anda Technologies isnow offering cleaning and conformalcoating equipment. The company’siCoat-5 conformal coating machineprovides accuracy of 0.0008 in. (0.02
mm). Its four axes of movement and35° tilt make it a flexible workcell forhigh-mix, selective conformal coatingapplications.
The AP-460 cleaning system isdesigned to remove all impuritiesand contaminants, including dust,grease, dirt, and static electricity, toimprove surface adhesion.
The company recently won sev-eral awards for its technology,including two “Global TechnologyAwards,” two “Mexico Technology
Awards,” and an “NPI Award.”Anda Automation was founded
in 2008 with headquarters inDongguan, China. The company alsohas offices in Fremont, California,
Guadalajara, Mexico, Hong Kong,Suzhou and Changsha, China, and20 service centers worldwide.
Contact: Anda TechnologiesUSA, Inc., 47639 LakeviewBoulevard, Fremont, CA 94538 % 509-385-8765 fax: 844-546-3195 E-mail: [email protected] Web: www.anda.us
See at NEPCON China, Booth 1E40, and at
SMTconnect, Hall 4 Booth 520
AP-460 cleaning system.
See at SMTconnect, Hall 5 Booth 226
See at SMTconnect, Hall 4 Booth 308
Acton, MA — CAMI Research’s CableEye automa-tion-ready cable and harness testers are used forassembly, prototyping, production, and QC of stan-dard or custom wire cables and harnesses in avariety of applications, such as transportation,energy, medical devices, defense, scientific R&D,telecom, and more. Every CableEye tester shipswith a comprehensive software package that pro-vides test functions, graphic wiring display, con-nectors database, reporting, data logging, automa-tion scripting, and many more features.
In addition to being used to automate the testitself, this out-of-the-box automation scriptingallows managers to generate and display rich textwork instructions with images. Work instructionscan be coupled with operator text-to-speech conversion to form a totallyheads-down workstation.
CAMI offers the CableEye suiteof products complete with accessories— including auto-detected, plug-inconnector boards for fast, convenientset up and testing of standard cables.There is an extensive and growingstock library of these test fixtureboards — most of which are populatedwith families of connectors, such asthe audio market CB19.
When pre-populated boards areused, the tester GUI automatically dis-plays a graphic of the connectors andwiring under test. The tester can bereadily programmed to do the same for
custom boards and fixtures. These boards aredesigned to fit all CableEye testers.
Automation with CableEye is simple, yet
powerful. Included with every tester, CableEyesoftware offers out-of-the-box automation capabili-ties with both Macros and Javascript scripting lan-guages. By completely automating the test processafter the operator attaches the cable, customerscan eliminate any chance that testing or documen-tation will differ from one cable to the next. Now,users can create image-rich work instructions toalso reduce operator mistakes during test set up.
Contact: CAMI Research, Inc., 42 Nagog Park, Suite 115, Acton, MA 01720 % 978-266-2655 fax: 978-266-2658 E-mail: [email protected] Web: www.camiresearch.com
See at EWPTE, Booth 2309
May, 2019 Page 81www.us- tech.com
CableEye rich text work instructions.
CAMI’s CableEye Testers Display Rich Text Instructions
ITW EAE: DualLane Conveyorfor CamalotProdigyDispenserMinneapolis, MN — The CamalotProdigy dispenser is now availablewith a 50 in. (127 cm) dual-lane con-veyor. This option helps to meet thedemands of automotive manufacturerswho are looking for in creased produc-tivity. The dual-lane conveyor designallows up to six heat zones, which iscrucial for underfill applications thatrequire pre and post heat and has a15.8 x 10 (40 x 25.4 cm) capacity.
The conveyor provides multi-tasking functionality for increasedefficiency and flexibility. Dispensingoperations can be switched automat-ically between conveyor lanes forproducts that require multiple dis-pense passes of underfill and PCBtransfer time is eliminated as thedispense process can start in theadjacent lane immediately.
The Camalot Prodigy is a flexibledispenser that can be scaled to suit theuser’s productivity needs. The 50 in.(127 cm) dual-lane conveyor can becombined with the recently introducedDynamic Dual Head (DDH) for maxi-mum productivity. DDH offers theability to double dispense speed, whilemaintaining the highest level of accu-racy for both dispense pumps. Thepatented design corrects for part-to-part rotation enabling synchronousdispensing of both pumps.
Contact: ITW EAE, a division ofIllinois Tool Works, 8860 207thStreet West, Minneapolis, MN55044 % 952-469-8278 E-mail: [email protected] Web: www.itweae.com
See at SMTconnect, Hall 4 Booth 229
Take inspection toanother dimensionThe smartest way to the perfect PCBEnsure comprehensive test coverage. Minimize false calls. And drill down into powerful image library tools with advanced algorithmic assistance. With the K Series 3D automated optical inspection system, there’s virtually nowhere for defects to hide. Thanks to industry-leading inspection software and high-precision metrology,you can continously improve yield and quality on even themost complex product geometries. It’s one more partof Mycronic 4.0, and one step closer to perfection.
See at NEPCON China, Booth 1E60 and SMTconnect, Hall 4 Booth 349
West Conshohocken, PA — Based on the conductivepolymer Clevios, Heraeus Epurio and PlastComposite Consulting (PCC) have developed a coat-ing for lighting unit covers in ESD-safe and explo-sion-proof areas. This is, reportedly, the first coatingto combine conductivity with transparent surfacesealing.
In ESD environments or areas with the hazardof explosion, the requirements placed on lightingunits are extremely strict. They must remain durablyresistant to chemicals and scratches and be able toreliably dissipate static charges. The new coatingdeveloped by Heraeus Epurio and PCC is designed tooffer all-around protection, remain transparent and
is cost-effective to manufacture.Clevios is a conductive polymer additive that is
suitable for various plastics, such as PC, ABS, PMMA,and SAN. The additive gives the coated material itsdissipative properties so that no static charges canarise that could result in sparks and explosions.
The Clevios coating can be applied to plastic sur-faces using conventional methods, after which thecomponents are dried. Surfaces coated with Cleviosbecome antistatic, static dissipative or conductive,with precisely adjustable coating resistances.
Contact: Heraeus, Inc., 24 Union Hill Road, West Conshohocken, PA 19428 % 215-944-9981 E-mail: [email protected]
Web: www.heraeus-electronics.com
See at SMTconnect, Hall 4 Booth 240
Page 82 May, 2019www.us- tech.com
FASTEST & MOST ACCURATE Granite chassis eliminates vibrations
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Heraeus Offers Coating for ESD and Explosion Protection
Lighting unit covered with Clevios-based PCC coating.
Arlington Heights, IL — Noritake’stouchscreens (included on the GTseries modules) are designed to workwith gloves, thick glass or acrylicoverlays and an air gap between thetouchscreen and overlay.
This reliable sensitivity isachieved with a high signal-to-noiseratio from the fine-pitch metallictouch panel patterns. Compared withindium-tin-oxide (ITO), these panelshave lower impedance and a widertouch margin.
The panel’s touch settings canbe changed to adapt to different envi-ronments and enclosures. The touchcontroller can handle up to 10 con-current touches.
The GT series is a group ofthree different application types oftouch TFT displays (GT-1P, GT-CP,and GT-EP), designed for differentapplications and environments. TheGT-1P display type is designed as aUSB touch monitor for PC/SBCs thataccept DVI video signals through anHDMI connector. The display alsohas compliant USB touch.
The GT-CP display type is driv-en by commands sent from a hostcontroller and designed to be used inembedded GUI applications. The GT-EP display type runs on Noritake’siDevOS proprietary operating sys-tem and can act as a host controller.
Contact: Noritake Co., Inc.,2635 Clearbrook Drive, ArlingtonHeights, IL 60005 % 847-439-9020E-mail: [email protected]: www.noritake-elec.com
See at BIOMEDevice Boston,Booth 872
Noritake GT series touchscreen.
Noritake toDemonstrateSensitive andRobustTouchscreens
See at NEPCON China, Booth 1K20 and SMTconnect, Hall 4A Booth 124
May, 2019 Page 83www.us- tech.com
Elgin, IL — The M12 is the most com-mon circular connector and is well-known as an interface for data andsignals. In order to offer a similarly
compact dimensioned interface forenergy-intensive applications, theM12 is now also available in the IEC61076-2-111 standard K-coding.
With four power contacts and aPE it is possible to safely transmit 7
kW at 630V and 16A. Ongoing minia-turization is having an increasingimpact on the space-saving supply ofvoltage to compact drives, as well asnetworks, necessitating HARTING’sdevelopment of the K-coding.
In PROFINET, the M12 L-codingwith 0.75 kW at 63V and 16A is a firm-ly established standard. In order tooffer the widely used M12 form factorto device manufacturers for voltagesupply, HARTING is now supplyingthe K-coding with 7 kW at 630V and
16A, allowing the integrated trans-mission of data, signals and power.
In such a compact M12 housing,attention must be paid to clearanceand creepage distances to protectusers. This is accomplished with a PEcontact attached to the housing, whichis configured as a preleading pin in themating face in order to bleed off volt-age and conduct away flashovers onthe housing or between contacts.
With high voltages, the PCBsocket must be protected from
flashover on the contact side. In thenew connector, all the hold-downsare separated from each other by aninsulator. K-coded cable is availablein a crimp version. The connection issecured with a typical screw fitting.
Contact: HARTING NorthAmerica, 1370 Bowes Road, Elgin,IL 60123 % 847-717-9217 E-mail:[email protected]: www.harting.com
See at EDS, Trinidad A
HARTING Miniaturizes PowerInterfaces for Drives
Liberty, SC — Cornell DubilierElectronics (CDE) has introduced itsType RA multilayered film capacitorsfor 257°F (125°C) operation. Type RAcapacitors are constructed usingstacked metallized polyester protect-ed with an impregnated sealant,which eliminates the need for anexternal case. This package style
offers the highest energy density tech-nology available for switching powersupplies, DC to DC converters andother high ripple current applications.
Type RA capacitors are impreg-nated with a microcrystalline polymersealant and exterior tape wrap thatprotects the capacitor element frommoisture, allowing it to meet 185°F(85°C) and 85 percent RH require-ments for demanding applications inmilitary vehicles and aerospace.
Available in capacitance valuesranging from 0.1 to 10 µF, voltageratings of 100, 250, 400 and 500VDC, Type RA capacitors are termi-nated with radial leads to cover abroad range of applications in powerelectronics where high-densitycapacitors are needed for board-levelDC filtering.
Contact: Cornell DubilierElectronics, Inc., 140 TechnologyPlace, Liberty, SC 29657 % 864-843-2626 fax: 864-843-2402 Web: www.cde.com
See at EDS, Montego D
Type RA multilayered filmcapacitor.
CDE: TypeRA, StackedPolyesterCapacitors
M12 K-coded connector.
See at NEPCON China, Booth 1E41, SMTconnect, Hall 5 Booth 434B and PCIM, Hall 7 Booth 438
San Jose, CA — YXLON, a division of CometGroup, is launching a brand-new lineup of X-rayinspection systems dedicated to the semiconductorindustry. These systems offer advanced automated2D and 3D inspection of bumps and filled vias tolocate, identify and measure failures, includingnon-wetted bumps, voiding, and misalignments.
The FF70 CL and FF65 CL series are fullyautomated analysis systems offering ultra-highresolution and magnification for the smallest semi-conductor defect detection. The new range ofinspection systems provides automated analysis ofTSVs, C4 bumps, 3D packages and MEMS atwafer, strip or component level with maximum
throughput. Lastly, the FF65 IL with its integrat-ed loader is designed to meet the needs of volumemanufacturing, while maintaining market leadingfeatures and benefits. The systems were developedin collaboration with Nagoya Electric Works.
YXLON International designs and producesradioscopic and CT inspection systems for thewidest variety of applications and fields. Whethersituated in the aviation and aerospace, automotiveor electronics industry, the company’s customersare among the leading companies in their respec-tive fields.
Contact: Comet Group Lab One, 3055Orchard Drive, San Jose, CA 95134
% 408-325-8770 E-mail: [email protected] Web: www.comet-group.com
See at NEPCON China, Booth 1G01
Page 84 May, 2019www.us- tech.com
www.cyberoptics.com
Copyright © 2019. CyberOptics Corporation, Inc. All rights reserved.
Thrives on a Challenge. Loves Variety.The ultimate multi-process inspector for
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SQ3000™ All-in-One SolutionLoaded with Powerful Tools that cover Inspectionand Measurement for AOI, SPI and CMM.Fast and highly accurate, repeatable and reproducible measurements for metrology applications in the manufacturing of a wide variety of products such as PCBs, semiconductors and consumer electronics. The SQ3000™ o�ers unmatched accuracy with the revolutionary Multi-Re�ection Suppression (MRS) technology by meticulously identifying and rejecting re�ections caused by shiny components. E�ective suppression of multiple re�ections is critical for accurate measurement, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.
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FF70 CL X-ray inspection system.
Ingleside, IL — IDENTCO is nowoffering durable label automationsolutions for track and trace applica-tions. The company’s electronicsidentification solutions are designedto offer extreme durability, solventand chemical resistance, and antista-tic properties for applications thatrange from PCB assembly to indus-trial automation.
The PCB and electronic compo-nent labels have been developed to
withstand the challenges presentedby high heat, fluxes and cleaningsolutions. Print-on-demand solutionsinclude printers, application-matched labels and ribbons, andlabel feeders designed for use in mostSMT pick-and-place machines.
Benefits of the labels include:100 percent traceability of PCBs dur-ing manufacturing and after process-ing in the field; durable to surviveharsh wash down processes; auto-application to remove human error;and antistatic properties.
Contact: IDENTCO, 28164 W.Concrete Drive, Ingleside, IL 60041% 815-385-0011 E-mail: [email protected] Web: www.identco.com
See at SMTconnect, Hall 4Booth 160, and at
EWPTE, Booth 2262
ELPA™ 2000 label applicator.
IDENTCOOffers LabelAutomationSolutions
See at NEPCON China, Booths 1E52 and 1E54 and SMTconnect, Hall 4 Booth 101
Alpharetta, GA — IPTE plans to par-ticipate in the “Future Packaging”production line at SMTconnect 2019.
The 10,764 ft2 (1,000m2), fully opera-tional production line is designed togive visitors at SMTconnect first-hand experience of how efficient androbust processes and technologies canbe achieved with maximum flexibility.
IPTE will be supplying all theconveying equipment to interconnectthe variety of other suppliers’ process
equipment. The integrated IPTEcomponents include bareboardloader, conveyors, turn units,buffers, workstations, and a multi-magazine loader/unloader, MLL3P/MLU 3P.
The company will demonstratea laser marker, the FlexMarker II,which can apply 2D codes, graphicsand logos to both sides of each prod-uct. IPTE will also show the pro-gramming and testing of productsusing its Easy Test Handler (ETH)and MFT 19 Multifunctional Test
Handler. The test handlers are setup as a parallel tester. The companyis also offering a new, faster, spindle-driven ETH. The MFT 19 can inte-grate ICT equipment as well as 19 in.(48.3 cm) rack and stack equipment.
In-circuit or functional test, aswell as programming processes canbe automated inline with IPTE’sETH. The ETH is practical for usewith single-circuit boards, multipleboards or corresponding carriers forcircuit boards. Both, single- or dou-ble-sided fixtures can be realized.
The fixtures can be changed quicklyand easily. For optional parallel useof more than one test handler, thetest handler can be equipped with abypass segment, providing uninter-rupted production. The bypass can beused to optimize cycle times.
Contact: IPTE USA, 5935 ShilohRoad East, Suite 100, Alpharetta,GA 30005 % 678-807-0067 fax: 678-807-0072 E-mail: [email protected]: www.ipte.com
See at SMTconnect, Hall 5,Booth 434B
May, 2019 Page 85www.us- tech.com
Find out more atwww.nordsondage.com/4600
Take control with automationOperator free handling
Eliminate alignment errorsRemove handling issuesMaximum traceability
Operator free testingTake away operator biasNo tool displacement errorsHighest test repeatability
Error Free Bond Testing
Remove all errors with our automated Bondtesters
Learn more at
SMTconnectHall 4A
Stand No. 214
IPTE Easy Test Handler (ETH).
IPTE Participates in “Future Packaging” Production Line
Houston, TX — BPM Microsystems isnow offering its WhisperTeach+™
programming solution, which won anew product introduction award ear-lier this year at IPC APEX 2019.WhisperTeach+ automates z-heightand socket locations, speeding set uptime without sacrificing quality.
With WhisperTeach+, operatorinvolvement during job set up is radi-cally improved, reducing manualteach points by 94 percent for amachine with a standard tape-in/tape-out and 48 programming sockets.
The operator teaches the inputand output locations using Whisper -Teach™, then manually places adevices in the first socket, and exe-cutes the WhisperTeach+ commandto begin the auto-teach process.
The pick nozzle then moves tothis first socket location and auto-matically detects the top of thedevice in the socket, accurate to with-in 0.6 mil (15 µm), and “learns” x, yand theta. Auto-teach then contin-ues, populating and teaching eachremaining socket. As each site istaught, the programming processbegins immediately.
With the typical scenariodescribed, teach points are reducedfrom 50 to three. WhisperTeach andWhisperTeach+ are only availablewith BPM automated programmingsystems.
Contact: BPM Microsystems,15000 Northwest Freeway, Houston,TX 77040 % 713-688-4600 E-mail: [email protected]: www.bpmmicro.com
See at SMTconnect, Hall 4Booth 245
WhisperTeachFrom BPMCan ReduceManual TeachPoints By 94%
See at NEPCON China, Booth 1G20 and SMTconnect, Hall 4A Booth 214
Haverhill, MA — Seica is now show-casing its latest lineup of electronicstest and assembly equipment, includ-ing the Pilot V8 flying probe test sys-tem, the Mini 200 benchtop ICT sys-tem and the Firefly Next> laser selec-tive soldering system. The new gener-ation of Next> series systems have arenovated and sleek design, due to theuse of premium chassis materials andinnovative electrical features.
Seica’s industrial monitoringsolution “4.0 ready” monitors currentabsorption, supply voltage, tempera-ture, light indicators, and otherparameters. These are useful to indi-cate correct operation, aid predictivemaintenance and makes the compa-ny’s systems compatible with thenew standards of Industry 4.0.
The Pilot V8 is a complete flyingprobe test platform. In its mostequipped configuration, the testeroffers up to 20 mobile test resourcesfor a PCB, including probes that cansupply up to 3A, high-resolutioncameras for automated opticalinspection, barcode reading, laser,capacitive probes, pyrometers, opti-cal fiber sensors for LEDs, flying con-nectors for boundary scan and on-board programming, and high-fre-quency probes for measurements
over 1.5 GHz.The Pilot V8 is available in a
fully-automated version, whichmakes its vertical structure suitable
for combination with boardloading/unloading modules capableof hosting from 1 to 12 magazines.
All of the automation modules arestandard and available in the Seicacatalog. The HR (high-resolution)version of the Pilot V8 allows the sys-
tem to test very small objects, downto 1.2 mil (30 µm), while the XL ver-sion expands the work area from thestandard 24 x 21.3 in. (610 x 540mm) to 31.5 x 25.6 in. (800 x 650 mm)in size.
Seica’s small, compact, econom-ical in-circuit test system, the Mini200, is a benchtop unit with up to 768
hybrid channels. It offers customersan entry point into production test.
In addition to the Mini 200 theCompact TK is also available, whichutilizes a built-in receiver for easyswap-out of fixtures. The Compactline has channel counts from 192 to4,608 in a variety of manual, inlineand combinational ICT and function-al test options.
The new generation of FireflyNext> series laser selective solderingsystems is now available. This familyof Firefly systems has an attractiveand revamped appearance and offerssignificant technological improve-ments. The system is capable of sol-dering both the top and bottom of thePCB.
The Firefly combines fouressential innovations: a high-effi-ciency laser source; a new spot angleon the board to be soldered; fully pro-grammable donut spot size; and per-fect axial integration of the laser.With vision and continuous tempera-ture feedback, the system providesoutstanding throughput comparedwith previous generations.
Contact: Seica, Inc., 110 AvcoRoad, Haverhill, MA 01835 % 603-890-6002 E-mail: [email protected] Web: www.seica-na.com
See at NEPCON China, Booth 1E55, and at
SMTconnect, Hall 4A Booth 300
Page 86 May, 2019www.us- tech.com
Learn more: www.indium.com/USTA
Contact our engineers: [email protected]
©2019 Indium Corporation
Proven Halogen-Free Products for High-Reliability Applications• Enhanced electrical reliability• No dendritic growth• Meets HKMC MS184-01
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orrlittyyStandard SIRR (J STD 004B)
Indium8.9HF Solder Paste
Seica Showcases Flying Probe Test andLaser Selective Soldering Systems
Pilot V8 flying probe test platform.
See at SMTconnect, Hall 5 Booth 310 and PCIM, Hall 6 Booth 108
Carlsbad, CA — Nordson ASYMTEK has beenselected by Gentherm, an EMS provider based inBurlington, Ontario, Canada, as its conformal coat-ing equipment supplier. Gentherm is a developer ofthermal management technologies. The companyrecently introduced new products to its manufactur-ing line and needed a conformal coating system thatcould meet production requirements.
The new equipment needed to provide moreselectivity, accuracy and increased volume capabil-ities than was previously required. After evaluat-ing suppliers, Gentherm selected NordsonASYMTEK’s Select Coat® SL-940 conformal coat-ing system for its production line.
Gentherm uses five SL-940conformal coating systems, equip -ped with SC-300, SC-350 and SC-400 applicators that are used in fourmanufacturing lines. The systemssupport the production of automo-tive modules, RV controls, medicaldevices and other consumer elec-tronic controls.
Nordson ASYMTEK’s equip-ment has enabled Gentherm to over-
come manufacturing challenges and has addedmore flexibility and yield to its manufacturingprocesses. The SL-940 conformal coating systemsoffer a wide variety of options to provide high qual-ity and productivity for automated coating process-es. The systems are designed to operate at highspeed, high accuracy and high yield.
Contact: Nordson ASYMTEK, 2747 LokerAvenue West, Carlsbad, CA 92010% 760-431-1919 fax: 760-431-2678
E-mail: [email protected] Web: www.nordson.com
See at SMTconnect, Hall 4 Booth 101
May, 2019 Page 87www.us- tech.com
Whizz Systems, is a premier provider of electronics product design, development, and manufacturing services located in the heart of the Silicon Valley. We provide our customers an efficient path to launching a product by taking an idea and turning that into a work-able, shippable product. Our services are unique in that we manage the entire process of a product starting with development and design all the way to prototypes and final manufacturing. Whizz Systems complies with the highest standards of technology including the following certifications: ISO 9001, ISO 13485, and ISO 14001.
www.whizzsystems.com
North America - Corporate Headquarters3240 Scott BlvdSanta Clara, CA. 95054 PH: +1(408) 980 0400 Kulim Hi-Tech Park (KHTP) Malaysia Lot 8 SMI Park Phase 2 Jalan Hi-Tech 4 Sambungan Kulim Hi-Tech Park 09000 Kulim, KEDAH Malaysia
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DESIGN & BUILD. IT’S WHAT WE DO.
IOT, Smart Lighting
1 1 2:41 PM
Gentherm’s production floor in Burlington,Ontario, Canada.
Gentherm Installs Nordson ASYMTEKConformal Coating Equipment
Hoffman Estates, IL — OmronAutomation Americas is now offeringa diverse solution portfolio thatencompasses traceability, flexiblemanufacturing, human-machine col-laboration, and more.
Omron’s TM series collabora-tive robot is a flexible solution forhuman-machine collaboration, whileits LD series mobile robots movematerials flexibly throughout thefactory. Both solutions help manu-facturers meet growing demands forcustomization, without completelyreconfiguring their production line.
Omron Automation is an indus-trial automation partner that cre-ates, sells and services fully integrat-ed automation solutions, includingsensing, control, safety, vision,motion, robotics, and more.
Contact: Omron AutomationAmericas, 2895 GreenspointParkway, Suite 200, HoffmanEstates, IL 60619 % 847-285-7340E-mail: [email protected] Web: www.omron.com
See at NEPCON China,Booth 1J45, and at SMTconnect,
Hall 4A Booth 346
Omron robot in pick-and-place application.
Omron OffersFlexibleManufacturingSolutions withTraceability
Page 88 May, 2019www.us- tech.com
143 Sparks Ave. Pelham, N.Y. 10803-1837
Fax: 914-738-8225E Mail:
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Electromechanical devices, suchas switches, keypads, key-boards, pointing devices, indi-
cators, and alarms, are criticalaspects of human machine interfaces(HMI). HMIs are used for controllingequipment and systems often foundwithin both consumer and industrialequipment.
Designers today face an aston-ishing range of choices in electro-mechanical components that encom-pass not only the type of device, elec-trical specifications, environmentalsealing, and mounting and termina-tion styles, but also ergonomic con-siderations, such as configuration,size, illumination, and tactile feel.
The Technology of Switch Design
A switch makes or breaks anelectrical connection or diverts cur-rent from one conductor to another,through the motion of an actuatingmechanism. A basic switch thatmakes and breaks a single circuit issaid to have one pole. The number ofpoles a switch has represents thenumber of separate circuits that canbe active through the switch.
Switches are available with nor-mally open (NO) contacts, normallyclosed (NC) contacts, or combinations
of both. When a NO contact is acti-vated the contact closes. When a NCcontact is activated the contactopens.
Gold and silver contacts areused in most switches. Gold contactscome in many forms: solid gold, gold-
over-silver, gold-plated silver, andgold-on-nickel plating. Silver con-tacts are also available in a variety offorms: solid silver, hard silver, silver-
over-silver, silver-over-palladium,and silver-nickel alloy.
These options provide contacts
suitable for various power levels andapplication requirements. But insearch of a more perfect device,switch designers had to contend withthree problems: contact arcing, weld-ing and bounce.
Three Challenges
Arcing is a discharge of electric-ity — a spark — that can occur whencontacts make or break. Weldingoccurs when contact material meltsand fuses, causing contacts to stick.Arcing and welding degrades orburns contacts, reducing useful life,and are more severe in DC than ACapplications.
Solid-gold contacts are moreeasily melted and eroded by arcing sothey are limited to low-currentswitching where there is little or noarcing. As switched current increas-es, hotter arcs form and the potentialfor erosion and contact welding isgreater. Arcing is also more severewhen handling high inrush currents.Relays, solenoids and motors mayshow high inductive inrush currentswhen powering up.
Switches for higher currentsuse gold-plated silver or all silvercontacts that resist the effects of arc-
Proper switch selection has a direct impact on operator efficiencies and end user safety.
Proper Selection of HMI ComponentsEnsures Reliable Operation and
End User Safety
Continued on next page
By Joe Torzillo, Vice President of Sales — HMI Components, EAO Corporation
ing. Minor periodic arcing with silver contacts isactually beneficial because it keeps contacts freefrom dirt and corrosion.
Another challenge in switch design is contact“bounce” or “chatter,” a condition in which a con-tact rebounds for several milliseconds before itfinally closes. This is not a concern for power cir-cuits but causes problems in logic circuits that mayinterpret on-off bounces as data streams.
Mechanical Solutions
How contacts make and break can minimizearcing, welding, and bounce. Switch designersminimize bounce by reducing the kinetic energy ofthe contact, incorporating buffer springs, air, or oilshock absorbers to dampen contact recoil, or byusing wiping or sliding type contacts. Bifurcated,fork-shaped contacts minimize con-tact bounce, while providing redun-dancy and higher reliability.Commercial switches generally limitcontact bounce duration from lessthan 1 to approximately 100 millisec-onds.
The force holding movable andstationary contacts together is criti-cal, ranging from 5 gm in miniatureswitches to more than 150 gm inheavy-duty, motor-load switches.Snap-action switching elementsreduce arcing by rapidly moving con-tacts from one spring-loaded positionto another independent of actuatorspeed. Self-cleaning contacts slideagainst each other when making orbreaking a circuit, removing contam-ination to keep contact resistancelow. On the other hand, slowmake/break switching elements, usu-ally used in emergency stop switchesand in high-power applications,employ rigid contact arms that forcenecessary contact separation to over-come contact welding.
Many switches today are modu-lar, comprised of quickly assembledcomponents including actuators,switching elements, illuminationblocks, lenses, marking plates, andmounting systems.
Electrical Ratings
Electronic switches are rated forcurrent, voltage, voltage type (AC,DC), and load type (inductive, resis-tive). They are categorized into threepower levels. Level 1, “Signal Level,”typically falls in a range up to 42V and100 mA. Level 2, “General Purpose,”switches range from 42 to 250V andup to 5A. Level 3, “Power,” switchestypically exceed 250V and 5A.
Level 1 is for low-power, logic-level applications while levels 2 and 3are for resistive and inductive powerrequirements. Continuous currentcapabilities range from up to 100 mAto 10A or more over the three levels.Switches are supplied with appropri-ate contacts for their current-carry-ing capabilities. Contacts in modularswitches are housed in a switchingelement that includes connection ter-minals and an attachment port forthe actuator.
The switching element also hascontact terminals for connecting sys-tem electrical wiring. Several differ-ent terminal methods are used andmany are offered as options whenspecifying a given switch. The mostpopular connectors include choices inscrew, soldering, quick-connect, plug-in, push-in, or PCB styles.
Actuation Preferences
The actuator assembly, includingthe front lens touch surface, is the partof a switch that directly interacts witha user. Its form is closely related to its
function. Pushbuttons, keylocks, and lever/selectorswitch actuators provide one or a combination ofswitching actions. With a momentary-action switch,
an activation force moves contacts to a new position.When the activation force is removed, the actuatorand contacts return to the original position.
With a maintained or alternate action switch,contacts move to a new position and remain thereuntil the switch is activated a second time, whichreturns actuator and contacts to the original posi-tion. For safety applications, E-Stops are a type ofmaintained-action switch that requires a pull,twist, or key to reset to the original position.
Touch-sensitive switches are totally electron-ic and use capacitive, high frequency, or piezo tech-nology rather than mechanical actuators to sensewhen they have been touched and initiate aresponse.
Switches come in ultra-miniature, sub-minia-ture, miniature, and standard sizes for various
May, 2019 Page 89www.us- tech.com
Selective Coating? Trust the Experts.Precise control of single or dual component conformal coatings with flexible spray, stream, and jetting application techniques.
Patented tilt and rotate motion allowing greater access to coat shadowed areas.
Flexible equipment configurations to accommodate multiple chemistries, custom part handling, and process control options to verify process stability.
Global support and unparalleled application expertise that spans over 20 years and thousands of selective coating
installations at the world’s largest manufacturers.
Robust switching controls are essential tohandle harsh industrial environments.
Proper Selection of HMI Components...
Continued on next page
Continued from previous page
See at NEPCON China, Booth 1E48 and SMTconnect, Hall 4 Booth 460
North Billerica, MA — BTU Inter national is show-casing its new Aqua Scrub flux management tech-nology and Profile Guardian redundant monitor-ing system, along with a PYRAMAX™ 100A con-vection reflow oven at SMTconnect 2019.
Aqua Scrub Technology is BTU’s next-genera-tion solder reflow flux management system. Thepatent-pending design uses an aqueous-based scrub-ber technology compatible with most known pasteand flux types.
The flux and solution are automatically con-tained and packaged for disposal. The Aqua Scrub isdesigned to decrease operational cost by four timesover traditional condensation systems.
Profile Guardian pairs a thermocouple probe atproduct height with software to monitor temperaturedeviation from baseline, independent from controlTCs. Monitor data is fully integrated with host com-munications (MES) from the oven.
Additionally, it provides board-level traceabilitywhen paired with barcode readers, which is arequirement for many large OEM/EMS customers.
The PYRAMAX 100A has 100 in. (2.5m) ofheated length and eight zones, 662°F (350°C) max-imum temperature, flexible platform configura-tion, low power consumption, and a comprehensivemenu of options. In addition, the PYRAMAXincludes BTU’s proprietary WINCON™ controlsystem. WINCON provides a simplified user inter-face and powerful analytic capabilities.
Contact: BTU International, Inc., 23 Esquire Road, North Billerica, MA 01862% 978-667-4111 fax: 978-667-9068 Web: www.btu.com
Page 90 May, 2019www.us- tech.com
PCB and panel-mount applications.Generally, as switch size decreases,so does its electrical rating. Commonpanel cut-outs for mounting include0.24, 0.31, 0.63, 0.89, and 1.2 in. (6, 8,16, 22.5, and 30.5 mm) diameters.Some panel-mount switches aredesigned to project above the panelsurface, with others for flush or evensub-panel mounting. Where spacebehind a panel is limited, severalswitch styles are available withsmall behind-panel depth. PCBswitches typically come in straightpin through-board mounting andSMD types.
Environmental Sealing
Where switch controls will beused determines the degree of envi-ronmental protection required.Clean, indoor environments not sub-ject to rigorous cleaning, such asoperator control rooms, generally donot need protected switchgear.Industrial, commercial, andindoor/outdoor public access, are con-siderably more challenging, whichexpose switches to oil, solvents,chemicals, cleaning solutions, water,and dust. For these conditions,rugged sealed switches are needed.With medical equipment, anti-micro-bial properties are often required toresist the development of harmfulbacteria.
Many switches conform toingress protection (IP) codes, such asIP40, which protects from granularmaterial, but not from water, whileIP69K offers the ability to resistingress of high-temperature andhigh-pressure water.
Because of the great flexibilityof modular switch designs, cus-tomization is easily achieved throughthe specification of lens colors, mate-rials and shapes, illumination typesand colors, bezel materials, actua-tors, and switching elements for abroad variety of switching configura-tions.
Contact: EAO Corp., OneParrott Drive, Shelton, CT 06484 % 203-951-4600 fax: 203-951-4601 E-mail: [email protected] Web: www.eao.com r
See at EDS, St. Croix B
ProperSelection ofHMIComponents...Continued from previous page
BTU Showcases Advanced Reflow Technologies
PYRAMAX™ 100A convection reflow oven.
See at NEPCON China, Booth 1E50,
and at SMTconnect, Hall 4 Booth 551
See at SMTconnect, Hall 4 Booth 231
May, 2019 Page 91www.us- tech.com
See at NEPCON China, Booth 1H20 and SMTconnect, Hall 4A Booths 231 and 233
Mequon, WI — ULT AG has launched its newseries of portable fume extraction units, ULT160.1. The systems are designed for small andmedium quantities of air pollutants. In addition toa new, visually appealing design and improveddevice handling, users benefit from the systems’high filtration rates, extremely low noise operationand an optimized price-performance ratio.
Special filter combinations within the ULT160.1 units increase separation efficiency and fil-ter lifetime, resulting in significant cost savings forusers. The mobile and compact system designenables flexible application at changing manualworkstations.
The ULT 160.1 units can be connected to
external systems through a D-sub interface forautomated operation, such as laser marking sys-tems, soldering machines or dispensers. ULToffers the systems as specific versions for theremoval of laser fume (LAS 160.1), soldering fume(LRA 160.1), dust (ASD 160.1), or gases, odors andvapors (ACD 160.1). Configured filter technologiesare used for each application.
ULT’s fume extraction systems help to elimi-nate airborne pollutants released during joining,separation or surface processing. The units aredesigned to remove the finest of particles andemissions in automated and semiautomated pro-duction processes, as well as manual workplaces inmany industries.
Contact: ULT, LLC, 6000 WExecutive Drive, Suite G, Mequon,WI 53092 % 414-377-1376 E-mail: [email protected] Web: www.ult-usa.com
See at SMTconnect, Hall 5Booth 214
ULT: New Generation of Mobile Fume Extraction Units
ULT 160.1 portable fume extraction unit.
Page 92 May, 2019www.us- tech.com
Rogers, MN — CIT Relay & Switch isnow offering its VM3 and subminia-ture SM3 series snap-action switch-es. Available in either SPST orSPDT, these UL/cUL recognizedswitches offer numerous actuatorstyles, including pin plunger, stan-dard, short and long hinge levers,roller and simulated roller.
Termination options include0.11 in. (2.8 mm) quick-connect, sol-der lug, PC terminal and right or leftPC terminal. Contact material on theVM3 and SM3 series is silver andboth offer choices of operating force.Ratings are up to 16A at 125/250VAC and IP67 versions are available.The company offers customization ofits snap-action switches to fit cus-tomers’ exact requirements.
CIT Relay & Switch, a divisionof Circuit Interruption Technology,Inc., manufactures a broad array ofautomotive, telecom, security, indus-trial, and audio relays and switchesin through-hole, panel and surfacemount styles.
Contact: CIT Relay & Switch,14680 James Road, Rogers, MN55374 % 763-535-2339 E-mail: [email protected] Web: www.citrelay.com
See at EDS, Suite 12-046
CIT Relay &Switch’s Snap-ActionSwitchesNow Comein Two Sizes
Snap-action switches.
See at NEPCON China, Booth 1L30 and SMTconnect, Hall 4A Booth 300
Manchester, NH — Schleuniger, Inc., is presentinga range of new wire processing equipment at theElectrical Wire Processing Technology Expo(EWPTE). The company will demonstrate itsCoaxCenter 6000, which is a fully automaticmachine for processing coaxial cables. The machineis precise, allowing it to process cables down to 42AWG micro-coax and with the length precision toprocess conformable coax.
Its QCam 360 automatically monitors strippingquality, eliminating the need for time-consumingmanual post-production quality monitoring process-es. The output of the machine is at least three timeshigher than with manual and semiautomatic equip-ment and requires considerably fewer personnel tooperate. The CoaxCenter 6000 can also processsmall, single-conductor wires easily.
The company is displaying its lat-est generation of benchtop coaxialcable stripping machines for the firsttime, including the CoaxStrip 6380,CoaxStrip 6480 and CoaxStrip 6580.With an average 20 percent increase inproduction output, this new family ofprogrammable, multistep strippingmachines allows for precise strippingof coaxial, triaxial and multi-conductorcables, as well as single-conductorwire. Additional features include“cable end detection” for strip lengthprecision, “cable diameter verification”for quality assurance, and “automaticcable retraction function” for easierprocessing of longer strip lengths. Newstripping heads ensure that even thin,hard-molded, or slightly out-of-roundinsulations can be stripped.
Schleuniger is also highlightingits S.Univ ersity, an e-learning plat-form that can help companies to edu-
cate their employees and strengthen their posi-tions in the industry.
A full complement of laser wire strippingmachines from Laser Wire Solutions will also be ondisplay. The powerful processing capabilities of theMercury-2, Mercury-4, Mercury-5, Mercury-6, andOdyssey-4 models are designed to guarantee nick-free stripping with radial and axial incision capa-bilities and provide the visitor with a better under-standing of the flexibility these machines offer.
Contact: Schleuniger, Inc., 87 Colin Drive,Manchester, NH 03103 % 603-668-8117 fax: 603-668-8119 E-mail: [email protected]: www.schleuniger.com
See at EWPTE, Booth 2133
May, 2019 Page 93www.us- tech.com
Schleuniger Debuts New Wire Processing Equipment
CoaxCenter 6000 fully automatic coaxialcable processing machine.
Wilmington, MA — Heilind Electronicsis scheduled to exhibit its portfolio ofwire and cable connector solutions atEWPTE. The company will highlightproducts from manufacturers thatinclude 3M, Alpha Wire, Bel MagneticSolutions, Brady, HARTING, Heller -mannTyton, Hirose, Molex, Panduit,TE Connectivity, and WAGO.
The company serves customersfrom startups to multinationalOEMs and is a distributor of connec-tors, relays, sensors, switches, ther-mal management and circuit protec-tion products, terminal blocks, wire
and cable, wiring accessories, andidentification products.
Contact: Heilind Electronics, 58 Jonspin Road, Wilmington, MA01887 % 978-988-3307 E-mail: [email protected] Web: www.heilind.com
See at EWPTE, Booth 1853
TE Connectivity tunnel oven.
Heilind toShow LatestInterconnectSolutions
See at NEPCON China, Booth 1H15 and SMTconnect, Hall 4A Booth 148
Wilsonville, OR — With the growth ofinternet of things (IoT) and othersmart devices, it is becoming increas-ingly complex and expensive formanufacturers to develop embeddeddistributions and applications forthese devices based on the Linux®
operating system. Siemens PLM Software has
launched its new enterprise Mentor®
Embedded Linux® (MEL) solutionthat provides electronics manufac-turers secure, scalable and config-urable distributions for industrial,medical, aerospace, and defenseapplications.
This new MEL technology is aconfigurable distribution that pro-vides a robust operating system plat-
form for embedded systems develop-ment and is a result of the continuedintegration of the recently acquiredembedded systems design capabili-ties from Mentor Graphics. The solu-tion is based on Debian, a broadlyutilized, enterprise-class, open-source Linux operating system.
The new Siemens enterprisetechnology provides the stability, fullfeatures, and ease-of-use benefits ofan enterprise solution, and the per-formance, customizability and foot-print of an embedded operating sys-tem. An internal team of embeddedLinux experts originally developedthis robust solution for use on criticalSiemens automation equipment.Now commercially available, embed-ded developers can utilize thisproven solution and mitigate thecosts and risks of moving to Linux.
The large number of pre-builtand fully-tested binary packagesintegrated in the Siemens enterpriseMEL solution provide all of the gen-eral features and parameters in thesoftware platform so a large numberof users can install it and use it withease. This can make standard imple-mentation across organizationsmuch easier and more efficient.
The Siemens binary MEL solu-tion also includes a stable kernel anda robust toolchain — both with broadcommunity support. This communitysupport, combined with the commer-cial support and development powerof Siemens, allows for increaseddevelopment productivity and agility.
Embedded developers can stayup to date with available securitypatches and product updates, ena -bling enterprise-class standardiza-tion and maintenance. The newLinux solution enables support forsecure field updates, and applicationisolation.
This solution is also multicore-enabled to consolidate multiple het-erogeneous runtime environmentsusing today’s most advanced processorarchitectures, leveraging the MentorEmbedded Multicore Framework.This helps enable embedded develop-ers to quickly build systems that inte-grate Siemens binary Linux, and theNucleus® real-time operating system(RTOS) on complex system-on-chip(SoC) processors.
The enterprise-class MEL iscloud-enabled, supporting industry-standard cloud and IoT technologiessuch as XMPP, MQTT, AMQP,CoAP, and RESTful API support.Development and analysis tools areincluded for configuration and opti-mization of the operating system socustomers can analyze the state andoperation of the embedded platform.
The industry-proven Sourcery™analyzer technology can generatetime-series data for OS/platform diag-nostics and device profiling. In addi-tion, Siemens’ embedded team ofexperts can provide support, training,and professional services, from basicsupport and updates/upgrades to criti-cal security defects patches, platformextensions and customized training.
Contact: Mentor — A SiemensBusiness, 8005 S.W. BoeckmanRoad, Wilsonville, OR 97070 % 503-685-1664 E-mail: [email protected] Web: www.mentor.com
See at NEPCON China, Booth 1E41
Page 94 May, 2019www.us- tech.com
Siemens Launches MentorEmbedded Linux Solution
See at SMTconnect, Hall 4 Booth 439
New Britain, CT — MicroCare is displaying arange of advanced flux-removing chemistries atSMTconnect 2019. These products have beendeveloped to help companies lower their PCBcleaning costs, improve product quality and meetincreasingly stringent regulatory obligations.
One highlight is the recently introducedheavy-duty flux remover SuprClean. Fast-dryingand versatile, it delivers impressive cleaning — evenon difficult jobs. Removing old-style rosin fluxes, aswell as most acrylic and urethane conformal coat-ings, it eliminates white residue, without rinsing ordrying. It also complies with the strict regulationsand worker safety rules enforced in Europe.
Another product being presented during theshow, which also meets the European F-Gas regula-tions and is REACH-, GHS-, WEEE- and RoHS-compliant is the general-purpose flux remover C™.Suitable for all types of electronics, this fluxremover can be used on a variety ofcomponents, including through-holePCBs and SMT boards, hybrids,cables, and connectors. This powerful,nonflammable cleaner is fast dryingand easy to use, removing no-cleanand rosin fluxes in benchtop cleaningapplications.
The company is also displaying
its slow-drying citrus flux remover, a natural,biodegradable, heavy-duty flux remover anddegreaser. Working on all types of fluxes, pastes,inks, oils, greases, acrylics, silicone conformalcoatings, and most glues, it is an excellent additionto the benchtop.
Complementing all MicroCare aerosol fluxremovers is the TriggerGrip™ dispensing tool.According to the company, using the TriggerGripsaves money by reducing solvent usage by 66 per-cent and ensuring that the can empties complete-ly. It also enhances worker safety by limiting expo-sure to the cleaning fluid fumes.
Contact: MicroCare Corp., 595 John DownyDrive, New Britain, CT 06051 % 860-827-0626 E-mail: [email protected] Web: www.microcare.com
See at SMTconnect, Hall 4 Booth 531
May, 2019 Page 95www.us- tech.com
Flux removers from MicroCare.
MicroCare Displays New Flux Removers
Fountain Inn, SC — AVX Corpor ationhas qualified several of its TWA seriesaxial-leaded, hermetically sealed, wetelectrolytic tantalum capacitors toMIL-PRF-39006/33A. Designed todeliver high-reliability, high-CV per-formance in harsh environments,such as military, defense, avionics,industrial, and space applications, thenew TWA M39006 series capacitorshave a cylindrical, axial-leaded casewith a hermetically sealed, weldedtantalum can and header assemblythat withstands environmental haz-ards. The capacitors function in atemperature range of –67 to +257°F(–55 to +125°C) and a cathode systemthat provides high CV/cc and stableelectrical parameters.
TWA series capacitors currentlyon the MIL-PRF-39006 qualified partslist are manufactured at the compa-
ny’s facility in Lanskroun, CzechRepublic, and include T3 and T4 casesizes with M-level reliability (failurerates of 1 percent per 1,000 hours),capacitance values spanning 470 to1,800 µF, and voltage ratings rangingfrom 25 to 75V. The capacitors alsoexhibit low DC leakage and low ESR.
Parts with P-level reliability(failure rates of 0.1 percent per 1,000hours) are currently being qualified.Additional capacitance values, voltageratings and case sizes will follow.
Contact: AVX Corp., 1 AVXBoulevard, Fountain Inn, SC 29644% 864-967-2150 E-mail: [email protected] Web: www.avx.com
See at EDS, Antigua A
TWA M39006 series capacitors.
www.eao.com
Our HMI Components and Systems are as innovative and intuitive as anyone could expect. Each product and system meets all relevant global standards and guidelines for reliable use in harsh industrial environments.
EAO Machinery
Human Machine Interfaces. Intuitive and reliable.EAO creates possibilities. Since 1947.
AVX Qualifies
Capacitors to
MIL-PRF-39006
See at EDS, St. Croix B
Page 96 May, 2019www.us- tech.com
Electronic & Engineering Materials
314.621.5700www.elantas.com/pdg
CONASHIELDTM
“Flood Coat” Technology
CONASHIELDTM
“Flood Coat” Technology
Comparable Performance to Standard Potting Systems with a 30 to 60% reduction in weight
Better Electronic Insulation and Vibration Dampening Properties than Traditional Conformal Coating Systems
Moisture and chemical resistance with heat dissipation
Protection against mechanical shock and vibration
similar to conformal coating
Reduction vs. Potting
The material matters in material handling
Minneapolis, MN — CyberOpticsCorporation is planning to demon-strate its MRS-enabled 3D SQ3000™with multi-process capabilities thatinclude 3D AOI, SPI and CMM appli-cations at NEPCON China 2019.
The SQ3000 has been widelyused for 3D automated opticalinspection (AOI) and can be used for3D solder paste inspection (SPI) foraccuracy, repeatability and repro-ducibility — even on the smallestpaste deposits.
The SQ3000 can be used toobtain highly accurate coordinate
measurements faster than a tradi-tional coordinate measurementmachine (CMM) — in seconds, nothours. The inline CMM includes acomprehensive software suite for usein industrial metrology, semiconduc-
tor, microelectronics and SMT appli-cations.
The SQ3000 offers a combina-tion of accuracy and speed with itsmulti-reflection suppression (MRS)sensor technology that meticulouslyidentifies and rejects reflectionscaused by shiny components and sur-faces. Effective suppression of multi-
ple reflections is critical for highlyaccurate measurement, making theproprietary MRS technology anexcellent solution for a wide range ofapplications with exacting require-ments.
Contact: CyberOptics Corp.,5900 Golden Hills Drive,Minneapolis, MN 55416 % 952-820-5837 E-mail: [email protected] Web: www.cyberoptics.com
KIC: Solutions for SmartFactory Integration
San Diego, CA — KIC is now offeringits Industry 4.0 solution — RPI i4.0, abuilt-in solution for automation,traceability, advanced reflowdata collection and sharing forsmart factory integration.
KIC RPI i4.0 automati-cally acquires profile datafrom each PCB soldered in thereflow or curing oven, in realtime. This new ecosystemoffers a real-time thermalprocess dashboard and trace-ability, reduced scrap andrework, fast defect trou-bleshooting, lower electricityuse, and more. Advanced data searchand communication features saveengineers valuable time.
With RPI i4.0, all relevant datacan connect to the factory MES or fac-tory data collection system to be eas-ily shared with personnel, and can beaccessed from any authorized PC or
mobile device. The enhanced level ofautomation delivers improved lineutilization and productivity.
Contact: KIC Thermal, 16120 W.Bernardo Drive, San Diego, CA92127 % 858-673-6050 fax: 858-673-0085 E-mail: [email protected]: www.kicthermal.com
See at NEPCON China, Booth1G10, and at SMTconnect,
Hall 4A Booth 230
KIC RPI i4.0 reflow software.
CyberOptics Brings AOI, SPI, CMMSystem to NEPCON China
Multifunction SQ3000 inspection and measurement system.
See at NEPCON China, Booths 1E52 and 1E54
See at SMTconnect, Hall 5 Booth 434B
Nashville, TN — KYZEN has introduced thelatest member of its AQUANOX line,AQUANOX A4727. The cleaner is designed tooffer a stable pH and predictable compatibilitythroughout its long bath life. It is engineered tobe effective, stable and predictable for reliableproduction and assembly operations.
The cleaner is the result of thousands ofhours of laboratory tests and “live” beta sitetesting, which scientifically validates itsexcellent rinsability, extended bath life andconsistently reliable, long-term performanceadvantages. The chemistry has been provento be compatible on a wide variety of compo-nents, coatings, labels, and equip-ment.
Environmentally responsible, AQUANOXA4727 is nonhazardous and biodegradable. Itcontains no CFCs or HAPs and can be used atlow concentrations to effectively remove eventhe toughest soils, and rinse easily and com-pletely. This easy-to-control and cost-effectivesolution is a good choice for both inline andbatch cleaning systems.
Contact: KYZEN, 430 Harding IndustrialDrive, Nashville, TN 37211 % 615-831-0888fax: 615-831-0889 E-mail: [email protected] Web: www.kyzen.com
See at SMTconnect, Hall 4 Booth 138
May, 2019 Page 97www.us- tech.com
AQUANOX A4727 cleaning solution.
KYZEN Introduces Next-Generation Aqueous Assembly Cleaner
Atkinson, NH — optical control’s OC-SCAN® CCX.3 component counter isnow available with automatic load-ing and unloading. The CCX X-raycomponent counter is a true plug-and-play system that can X-ray anysize reel in the same amount of time,no matter the type of component, orhow full or empty it is.
The system’s high speed andaccuracy contribute to its fast ROI.
There are no libraries required orany need for customer input to getstarted. The machine can simply beplugged in and it will be ready tobegin counting.
The machine can also be con-figured for complete automation,including integrations into othersystems, such as automated storageunits. Whether this is done by soft-ware only, using a loading andunloading unit, or complete integra-tion, is up to the customer as theynavigate toward Industry 4.0.
Contact: optical control, 9 MainStreet, Suite 182, Atkinson, NH03811 % 833-932-6868 E-mail: [email protected] Web: www.optical-control.de
See at SMTconnect, Hall 4ABooth 135
optical control:ComponentCounting andAuto BoardHandling
10:53
OC-SCAN CCX X-ray componentcounting system.
Page 98 May, 2019www.us- tech.com
SMT Displays Portfolioof Thermal Systems
Wertheim, Germany — SMT ThermalDiscoveries is displaying a completeportfolio of innovative reflow solder-ing, vacuum soldering, curing, andtemperature treatment systems atSMTconnect 2019.
The machines offer thermalsolutions in a temperature range of–58 to +662°F (–50 to +350°C). AllSMT reflow soldering systems can becontrolled with the company’s intu-itive Thermal Tools operating soft-ware. The software is designed with atwo-level structure, allowing users tonavigate to their desired page withonly two clicks. With barcode andMES connection, as well as with anew remote maintenance system,SMT is pointing the way to the smartfactory and Industry 4.0.
The newly developed verticaloven (VH8) is designed for product-
specific curing and heat treatmentfor electronic components and mod-ules. The highlights of the systeminclude its small footprint, which isup to 70 percent smaller than conven-tional horizontal ovens, and its mod-
ular design. Its modularity allows forflexible reaction to product quanti-ties, as well as providing a singlelocation for loading and unloading,benefitting lean production. Themachine is available as an inline orbatch system.
Contact: SMT Maschinen- undVertriebs GmbH & Co. KG, RoterSand 5-7, D-97877 Wertheim,Germany % +49-9342-970-0 fax: +49-9342-970-800 E-mail: [email protected] Web: www.smt-wertheim.de
See at SMTconnect, Hall 4 Booth 149
Quattro Peak L reflow soldering system.
May, 2019 Page 99www.us- tech.com
Waldenburg, Germany — Würth’swireless connectivity and sensorsdivision has introduced firmwareversion 3.4.0 of its Proteus IBluetooth module. It offers a morethan two-fold improvement in uni-versal asynchronous receiver trans-mitter (UART) baud rate, with maxi-mum data throughput increasingfrom 36 to 80 kb/s.
The newly introduced UARTflow control is designed to guaranteethat no data packets get lost on theUART. With the improvement indata throughput, the new module iscompatible with all BLE 4.2 deviceson the market. Manufacturers thatmake their products Bluetooth-enabled using the Proteus I BLEmodule can now also completely con-trol how it appears to the communi-cation partner.
The device name and icon canbe displayed to the user in the list ofpossible Bluetooth connections. Aprofile can also be added with thedevice information service (DIS) to
make more of the device’s informa-tion available with wireless technolo-gy, such as the name of the manufac-turer or the serial number.
The Proteus II 2.4 GHz BLEwireless module measure 0.4 x 0.3 x0.08 in. (11 x 8 x 2 mm) and includesBluetooth Smart, the serial port foremulating a serial cable connection.Data transmission is enabled withthe AMBER SPP-like profile, whichis based on the optional Bluetooth4.2 “data length extension” featureand increases data throughput.
Companies can assign their ownuniversally unique identifier (UUID)to make the BLE profile their own.Würth also offers customers individ-ualization of the firmware and guar-antees adherence with the relevantguidelines in the wireless domain.
Contact: Würth Elektronik eiSosGmbH & Co. KG, Max-Eyth-Strasse1, 74638 Waldenburg, Germany % +49-7942-945-5186 E-mail: [email protected] Web: www.we-online.de
See at EWPTE, Booth 1623Firmware version 3.4.0 of theProteus I Bluetooth module.
Würth Updates Bluetooth Low Energy (BLE) Module
Santa Rosa, CA — Keysight Technol -ogies has introduced its PathWaveMemory Designer, a new double datarate (DDR) memory simulation capa-bility that is part of PathWave Ad -vanced Design System (ADS). The newcapability makes it easy for developersto compare simulated data with actualmeasured results, reducing the timerequired to complete product develop-ment workflows.
DDR memory designs grow morecomplex with each generation, andsimulation and test configuration alsogrow in complexity, resulting in longersimulation and test set up times. Theadded complexity makes it harder tocorrelate simulation and test data,resulting in less confidence in designs,longer troubleshooting cycles andmissed delivery schedules. PathWaveADS Memory Designer connects simu-lation and test workflows, addressingcommon DDR memory design chal-lenges with new workflows that auto-mate routine tasks and harness dataanalytics to gain faster actionableinsight into simulated data.
Keysight’s PathWave helps cus-tomers to accelerate workflows withpowerful software that enables agile,connected design and test. PathWaveoffers open APIs and open-source com-ponents that enable customers to cus-tomize the platform and integrate withtheir current hardware and software.It has a scalable architecture and flex-ibility to run on a dedicated worksta-tion, in the public or private cloud, oron embedded instrument software.
Contact: Keysight Technologies,Inc., 1400 Fountaingrove Parkway,Santa Rosa, CA 95403 % 303-662-4748 E-mail: [email protected] Web: www.keysight.com
See at NEPCON China, Booth 1H31
KeysightIntroducesDDR MemorySimulator
• Nikon proprietary x-ray source with unlimited life cycle
• Advanced semi-sphere imaging range: 81° oblique viewing on any 360° rotational angle over entire tray surface
• Up to 3600x of geometric (non-digital) magnification
• High-Grade Amorphous-Silicon Digital Detector with true 16-bit Analog to Digital Converter
• Largest field-of-view detector in the industry (10” x 8”)
• 3D CT and 3D Laminography reconstruction
• Available in 130 kV and 160 kV
3D measurement analysis including inspection of obstructed BGAs
www.nikonmetrology.com [email protected] 1 (800) 552-6648
Revolutionizing Electronics InspectionNIKON X-RAY
See at SMTconnect, Hall 4 Booth 207
Page 100 May, 2019www.us- tech.com
SIKAMA INTERNATIONAL, INC.
Small Footprint • E�cient Power UseConsistent High Yields • Precise Temperature Gradient
FALCON ULTRA PROFILE 1200
REFLOW SOLDERING SYSTEMS
www.sikama.com
SEE US ATSEMICON WEST
BOOTH 5653
Founded in 2003, and located in DaytonaBeach, Florida, Creative MotorsportSolutions (CMS) has grown from being a data
system reseller to a company that now designs and
builds its own complex embedded electronics sys-tems for all types of racing vehicles in the motor-sport market.
CMS also offers services for wiring systemdesign and manufacturing, and wire harness test-ing. It is one of the few motorsport wiring housesin the U.S. to utilize a CAD solution for wiring har-ness design. CMS customers include teams racingthe Daytona 24 and Daytona 500.
Motorsport looms are usually complex andmission-critical, requiring the same level of quali-
ty of manufacturing as aerospace parts. A fewyears ago, CMS set about finding a test systemthat would be accurate and flexible enough to han-dle high-mix, low-volume testing. “At that time, we
were looking to attach a ‘primary’ connector tothe tester with up to 79 pins and use the probeto identify correctness of the other pins. We didnot want to build a mating interface for themany smaller connectors, but just have thesystem read out the name and pin number,”explains Colin Harmer, owner of CMS. “Duringour tester evaluation phase, we were drawn toCableEye’s versatility, especially its invaluableAutoBuild™ function, which allows us to havea test lab that talks to us. When set up for sec-ond-sided pinning, we probe each pin with thetest probe, and the tester reads out the pinnumber, while displaying the same informa-tion on the screen.”
Identifying Unknown Cables
CableEye allows CMS to rapidly identifythe wiring of an unknown cable or harness,using its “Learn Cable” function. This feature isespecially useful when reverse engineering
parts for customers who have lost their schematics.In one test, the customer had an issue that
pointed at the corner looms as being suspect.“These were not looms we built, but because theCableEye tester is so flexible, we could quicklyreverse engineer the loom, check it against thesupplied drawings, perform a hipot test and gener-ate test reports showing the wiring in very littletime,” says Harmer.
In general, motorsport-type builds are typical-ly low-volume, which puts a premium on flexibility
with fixtures and ease of use and is a true delineatorof the CAMI testers. CMS now easily hipot testsevery product, which ensures that clients receivegoods that are exactly to specification.
By keeping records of all the tests, the compa-ny can easily retest at a future point to ensure thatthere has been no change in the loom, for example,in post-race and post-crash diagnostics.
“We find it really easy to generate, store andprint all the test documentation we need withinCableEye,” says Harmer.
Figure 1 is an example of a device withswitches. This historic steering wheel was in needof repair. Using the CAMI CableEye hipot tester,
Improving the Quality of TestingMotor Racing Cables and Harnesses
Continued on next page
By Margaret Bishop, Ph.D., CAMI Research, Inc.
CMS customers at the 2017 HSR Classic 24 in Daytona Beach, Florida.
Figure 1: historic steering wheel test report(top), rear view and front view (bottom).
See at SMTconnect, Hall 5 Booth 322
May, 2019 Page 101www.us- tech.com
CMS can use the constant dwell option to functiontest each button before the wheel leaves the shop.
CableEye has allowed CMS to test smartlyand has contributed to its increase in productivityand growth. The company purchased the tester inDecember of 2015 and moved a year later to larg-er premises to accommodate more efficient work-space and continued growth.
Custom Test Fixtures
By mid-2016, the company made the decisionto hipot test everything before it went out the door,which is now standard. There are no off-the-shelftest interface solutions for motorsport connectors,so these have to be made.
“We make ours in-house using blank CableEyetest fixture boards from CAMI. Each board has abreakout of 64 test points. Boards are modular soyou can mix and match to fit the loomyou’re testing,” says Harmer. “We’vebuilt up a large library of these andare now often able to offer our servic-es without needing to create furthercustom tooling.”
CableEye testers have manybenefits and can be used for the test-ing of all powertrain looms, from pro-totyping and manufacturing to post-crash diagnostics. These multicon-ductor testers easily link to customtest fixtures and harnesses andinstantaneously check for faults,identify the type of faults and pin-point their locations. Depending onthe model, the testers detect anddynamically display continuity(opens, shorts, mis-wires, and inter-mittent defects), resistance, capaci-tance, diodes, dielectric breakdown,insulation resistance, and can checktwisted pairs for correct orientation.
Hipot tests (e.g. insulationresistance and dielectric breakdown)are necessary steps in qualifyinginsulation integrity. Testing forintermittent defects pre-screens thelooms for the kinds of faults that can
be stimulated by vibration.Motorsport looms are usually low-volume
and often bespoke, requiring a tester with a highdegree of flexibility to deal with unique test set-tings, connector types and combinations. Sincethese testers log the data, post-race and post-crash comparisons of loom integrities are easy.
The former ensures that there have been nochanges, giving the go-ahead for reinstallation,while the latter can be used for crash diagnosticsand the results fed back for potential designimprovement. These automation-ready testersprovide for barcode tracking and detailed, wire-by-wire, colored wiring reports, even for hipot tests.
Contact: CAMI Research, Inc., 42 NagogPark, Suite 115, Acton, MA 01720 % 978-266-2655 fax: 978-266-2658 E-mail: [email protected] Web: www.camiresearch.com r
See at EWPTE, Booth 2309
Improved Testing of Motor Racing Cables and Harnesses...
Test fixture tool chest.
Continued from previous page
Irvine, CA — TopLine is exhibiting itsline of ceramic column grid array(CCGA) PCB assembly solutions atNEPCON China. Products includeCCGAs and daisy chain BGA testvehicles. The company’s CCGA ICpackages are made with non-collapsi-ble solder columns for surface mountsoldering and provide more complian-cy than solder balls to absorb stressand increase solder joint reliabilityunder harsh operating conditions.
Solder columns can providemany benefits, including reducedstress from CTE mismatch wheninterconnecting area array packagesand the PCB. TopLine manufacturesa wide variety of daisy chain testcomponents CCGAs, particle impactvibration dampers and engineeringevaluation kits for process develop-ment, experimentation, machineevaluation, solder training, and SMTassembly practice.
Contact: TopLine Corp., 95Highway 22 W., Milledgeville, GA31061 % 800-776-9888 E-mail: [email protected] Web: www.topline.tv
See at NEPCON China, Booth 1F04
TopLineExhibitsCCGASolutions
National City, CA — TDKCorporation has added a 960W-ratedmodel to its DRF series of AC-DC
DIN rail mount power supplies. Thehigh 95 percent efficiency producesless internal waste heat enabling
electrolytic capacitors to run cooler,providing a calculated life of inexcess of eleven years with a 75 per-cent load at 230 VAC input.
The unit can supply a peak loadof 1,440W (24V, 60A) for up to fourseconds to power capacitiveand inductive loads.Applications include indus-trial process control, factoryautomation and test andmeasurement equipment.
The power supply has a24V output, adjustable from24 to 28V, using either thefront panel mounted trimpotentiometer or an external5 to 6V source. The inputrange is 180 to 264 VAC,withstanding surges of up to300 VAC for five seconds. Theoperating ambient tempera-ture is –13 to +158°F (–25 to+70°C), –40°F (–40°C) cold start, der-ating linearly above +122°F (+50°C) to75 percent load at +158°F (+70°C).The DRF series warranty is five years.
The DRF960-24-1 is 4.8 in. (12.3cm) tall, 5.5 in. (13.9 cm) deep, with anarrow 4.3 in. (11 cm) width, savingboth space on the rail and in the cab-inet. Remote on/off and a 30V, 1A-rated DC OK relay contact are pro-vided as standard. When in standbymode using the remote on/off func-tion, the power consumption is lessthan 1W. Up to five units can be con-nected in parallel using the droop
mode current share, for systems thatrequire additional power.
Input-to-output isolation is3,000 VAC, input-to-ground 1,500VAC and output-to-ground 500 VAC.The DRF960 is certified to the safety
standards of IEC/UL/CSA/EN 60950-1, UL508 and is CE-marked in accor-dance to the Low Voltage, EMC andRoHS directives. The unit is compli-ant to EN 55032-B (radiated and con-ducted emissions), EN 61000-3-2harmonics and IEC 61000-4 immuni-ty standards.
Contact: TDK-LambdaAmericas, Inc., 401 Mile of CarsWay, Suite 325, National City, CA91950 % 619-575-4400 E-mail: [email protected]: www.tdk-lambda.com
See at EDS, Suite D32
Eagan, MN — IBL Technologies is dis-playing its BLC reflow vapor phasesoldering system at SMTconnect 2019.The company offers a range ofmachines for medium- to high-volume,batch and inline production.
The company’s systems offerhigh-quality performance with asmall footprint. Many patented fea-tures are available and provide awide range of flexibility, including
low power consumption, real-timetemperature profiling, an intelligentprofiling system, excellent solderquality, fast set up, and one profilefor most operators.
IBL has been a supplier ofvapor phase technology since 1987.With ever-evolving control and man-ufacturing techniques, the companyhas created a versatile and precisesoldering process. The company cur-rently manufactures vapor phasereflow equipment in Germany andNorth America, with a support net-work worldwide.
Contact: IBL Technologies, LLC,4660 Slater Road, Suite 245B,Eagan, MN 55122 % 952-217-4407E-mail: [email protected] Web: www.ibl-tech.com
See at SMTconnect, Hall 5Booth 434B
Page 102 May, 2019www.us- tech.com
CoaxStrip Family
schleuniger.com
High-Performance Coaxial Cable Stripping MachinesWith an average 20 percent increase in production output, Schleuniger‘s new generation of programmable, multi-step stripping machines allows for precise stripping of coaxial, triaxial and multi-conductor cable, as well as single conductor wire.
. Cable end detection for precise and repeatable strip lengths. control and assurance. Automatic cable retraction for easier processing of long strip lengths. Barcode scanning function
Wire Solutions for a Connected World
EWPTEBooth 2133
IBL Displays Vapor Phase
Soldering System
BLC reflow vapor phase soldering system.
TDK Intros 960W AC-DC DIN RailPower Supply
DRF960-24-1 DIN rail power supply.
See at EWPTE, Booth 2133
May, 2019 Page 103www.us- tech.com
Key advantages✓ Drastically reduce line down time
✓ Drastically reduce counting labor
✓ Eliminate counting mistakes
✓ More productive use of manpower
✓ Direct link to factory ERP/MES
✓ Direct link to storage units
Intelligent Simple FastAutomated Component Counting
Ke✓
✓
✓
✓
Monitoring SMT lines is critical. “Line-Down” due to lack of precise inventory management is wasteful.
[email protected] | 1-833-We-Count (932-6868)
optical-control.com
Counting components shouldn’t require hours of programming. A true Plug-and-Play solution is a machine that doesn’t require libraries,
but is based on logical algorithms.
See at SMTconnect, Hall 4A Booth 135 and Hall 5 Booth 113
Page 104 May, 2019www.us- tech.com
PVA Showcases RoboticCoating and Dispensing
Cohoes, NY — PVA is showcasing itsDelta 8 coating/dispensing systemand Delta 6 conformal coating/dis-pensing system at SMTconnect2019. The Delta 6 is excellentfor selective coating, potting,bead, and meter-mix dispens-ing applications. It includes arobust, overhead, three-axismotion platform suitable forinline or batch operations.
The Delta 6 has beendesigned with a slimmer foot-print, improved structural andgantry rigidity for robustness,and easier access, and can beconfigured for SMT underfillwith the JDX jetting valve andSVX auger valve.
The JDX jet dispense valveis an extremely fast, non-contactjet valve that precisely dispens-es viscosities up to 400,000 cP,while its special diaphragmdesign saves time and money.The SVX auger valve is usefulfor dispensing all medium- tohigh-viscosity pastes, epoxiesand abrasive compounds in dotand bead patterns and can dis-pense dots as small as 0.005 in.(0.13 mm) in diameter.
The Delta 8 can be equippedwith a patented fourth axis for con-formal coating. The optional, servo-controlled four-axis motion providesvalve tilt and rotation. Designed formultiple applications, the Delta 8system is flexible beyond conformalcoating as it can easily be configuredfor custom assembly operations, suchas pick-and-place, screwdriving, scanand label applications, pressing, etc.
Improved structural and gantryrigidity has been added for robust-ness and easier access. Delta 8 has a
maximum acceleration of 0.5 g and afootprint of 41.2 x 50 x 92.6 in. (104.6x 127 x 235 cm).
Contact: PVA, One MustangDrive, Cohoes, NY 12047 % 518-371-2684 fax: 518-371-2688 E-mail: [email protected] Web: www.pva.net
See at NEPCON China, Booth 1E48, and at
SMTconnect, Hall 4 Booth 460
Delta 6 conformal coating and dispensing system.
See at PCIM, Hall 6 Booth 141
Chelmsford, MA — VJ Electronix is now offeringautomated component counting with materialhandling automation for the XQuik II AutoLoadwith AccuCount technology, along with its reliablerework system, the Summit 1800i.
The XQuik II with AccuCount technology isnow faster than ever. With VJ Electronix materialhandling automation, the XQuik AutoLoad systemautomatically counts components and eliminatesdead time, significantly reducing the cycle time tocount reels. New parallel processing techniquesallow the system to acquire images and calculatecomponent count in parallel with barcode scan,loading and labeling of reels.
The Summit 1800i is an improved version of
the company’s most popular rework system. VJEhas maintained all of the benefits of high-efficien-cy convection heating and the well-known “1-2-3-Go” interface, coupled with updated technology forgreater reliability and an improved price point.Further refinements enhance the system’s per-formance with ultra-small components, whilemaintaining its capabilities with large boards,oversized CPU sockets, connectors and large BGAsup to 3.9 x 3.9 in. (10 x 10 cm) in size.
Contact: VJ Electronix, Inc., 19 Alpha Road,Chelmsford, MA 01824 % 978-486-4777 Web: www.vjelectronix.com
See at NEPCON China, Booth 1E52
May, 2019 Page 105www.us- tech.com
Vacuum Tweezer™
SolutionsFor over thirty years we have
been a leading supplier of vacuum handling solutions to
the world’s high technology fi rms. Our patented ESD safe
products are used by clean room personnel, electronic
assemblers, semiconductor manufacturers, the optics
industry and universities around the world. Virtual Industries
success has come from developing innovative vacuum tweezer
tools to eliminate part damage and increase productivity in pick and place operations throughout high tech industries.. These
tools provide customer specifi c solutions that make assembly
and processing operations more productive and ergonomic. Parts
range in size from 0.004” (0.1mm) up to 12.0” (300mm) for
easy handling.
• Self-contained vacuum tweezers
• Portable, battery-operated continuous vacuum handling
systems
• Bench top 110/220 volt vacuum tweezer systems
• Complete kits available
Visit our website or contact us for additional information.
2130 Victor Place, Colorado Springs, Colorado 80915 USAWebsite: virtual-ii.com E-mail: [email protected] Telephone: 719-572-5566 Fax: 719-572-5504
30MORE THAN
Avnet: LTE-MConnectivitywith AI andEdge SecurityPhoenix, AZ — Avnet and Octonionhave teamed up with Orange, amobile network operator, to launchthe customized, modular, plug-and-play Avnet SmartEdge Agile IoTdevice using Octonion’s Brainiummeta-sensing artificial intelligence(AI) software, designed specificallyfor the LTE-M network.
The solution enables engineersand manufacturers deploying IoTprojects on ultra-low bandwidth net-works to benefit from the power of AIand security at the edge. This newLTE-M connectivity board includes alive booster module that has beendeveloped by Sequans Communica -tions, a 4G chipmaker, and based onits Monarch LTE-M/NB-IoT chipplatform.
By combining Avnet SmartEdgeAgile and the benefits of LTE-M con-nectivity, customers gain an opti-mized IoT device that is cost-effi-cient, certified and ready to use. Thedevice works in conjunction withOctonion’s Brainium meta-sensingsoftware, which helps developerssimplify and overcome the complexi-ty faced with IoT project develop-ment, serving as an end-to-end plat-form solution that provides AI andsecurity at the edge.
LTE-M networks have beenlaunched across many countries tosupport the rapid explosion of IoT,especially in the mobile and IndustrialInternet of Things (IIoT) markets,addressing a broad range of use-cases.Benefits of AI on the LTE-M networkinclude significantly increased batterypower saving features and cost-effec-tive design and services support. Inaddition, by bringing data analysis andprocessing closer to the source, compa-nies have the option to reduce band-width and latency requirements tomanage their information.
With Sequans’ live booster forOrange’s LTE-M network and Brain -ium software on board, Avnet demon-strates its commitment to delivering amodular hardware device with a broadrange of connectivity solutions toanswer the needs of today’s IIoT cus-tomers with Avnet SmartEdge Agile.
Contact: Avnet, Inc., 2211 S.47th Street, Phoenix, AZ 85034 % 480-643-2000 Web: www.avnet.com
See at EDS, Andros A
XQuik II AutoLoad with AccuCount technology.
VJE: Fast X-Ray Component Countingwith Automatic Material Handling
Page 106 May, 2019www.us- tech.com
Carpentersville, IL — OTTO has intro-duced its new HTWS subminiatureHall effect, proportional output,thumbwheel switches. The switchesare available with a knurled wheel,paddle wheel or paddle wheel withseal boot for added ingress protection.
Smaller than the company’sHTW and HTWM series, the HTWSis a spring return-to-center, single-axis thumbwheel that provides a lin-ear change in voltage output to actu-ator movement in either directionfrom center. The HTWS is availablewith eight output options, including
increasing and decreasing voltageoutputs from the center position tothe full travel position and single or
dual (redundant) outputs.The HTWS snaps into a 0.895 x
0.420 in. (2.27 x 1.07 cm) panel open-
ing. Electronics are sealed to IP68Sand an optional sealing boot isoffered for added protection fromdust, sand and water. The HTWSseries offers a three million cyclerotational life, operational forceoptions and excellent EMI/RFIimmunity. It is available with flyingwire leads or pin connection.
OTTO designs and manufac-tures precision switches and controlgrips, including mechanical switchesand Hall effect switches with digitaland analog output options. The com-pany’s portfolio includes sealed andlighted, high-performance, snap-action, rocker, pushbuttons, andtoggles, as well as commercial andmilitary control grips and Halleffect technology joysticks.
Contact: OTTO, 2 E. MainStreet, Carpentersville, IL 60110 % 847-654-8203 fax: 847-428-1956 E-mail: [email protected] Web: www.otto-controls.com
See at EDS, Suite 22-046
OTTO Releases New Subminiature Hall Effect Thumbwheel Switches
HTWS subminiature Hall effect thumbwheel switches.
Camarillo, CA — Binder USA, LP,has extended its Series 770 NCCproduct line with the introduction ofa female panel-mount connector. It ismounted from the back side of apanel and fastened from the frontwith a hex nut.
The company’s NCC connectorsare IP67-sealed when unmated.When the panel-mount connector ismounted it can withstand wash-downs and splashes when a cable isnot connected, making the NCC con-nector excellent for challenging med-ical and industrial applicationswhere spillages and cleanings are aregular part of the environment.
Features include: eight con-tacts; 2A rated current; 175V ratedvoltage; IP67 protection; gold contactplating; and solder or dip solder ter-minations. Binder USA, LP, is a sub-sidiary of Binder Group, a manufac-turer of circular connectors, customcordsets and LED lights. The compa-ny’s products are used around theworld in industrial environments forfactory automation, process controland medical technology.
Contact: Binder USA, 3903Calle Tecate, Camarillo, CA 93012% 805-437-9925 E-mail: [email protected] Web: www.binder-usa.com
See at SMTconnect, Hall 4 Booth 114
Binder IntrosRear PanelMount IP67Connector
Series 770 NCC IP67-protectedconnectors.
May, 2019 Page 107www.us- tech.com
Trailblazing Inspection Solutions for High-End Electronics
The automatic 3D inspection system S3088 ultra chrome is espe-cially designed for a highly precise high speed inspection and an excellent depth of inspection. Furthermore, it is intelligently linked with various Industry 4.0 interfaces along the production line. Our new S3088 ultra chrome is designed as single and dual track system. The S3088 DT system comes with an integrated monitor and enables variable sensor configurations as 3D SPI, 3D AOI and CCI.
First Choice: New In-line 3D AOI for High Volume Production
3D SPI 3D AOI 3D AXI 3D MXI 3D Bond CCI www.viscom.com
Come see us and discover your ideal inspection solution.
Stand No. 4A, 120
See at NEPCON China, Booth 1J20 and SMTconnect, Hall 4A Booth 120
May, 2019
Watsonville, CA — Applied MotionProducts has introduced a new seriesof integrated servo motors that com-bine a high torque density, low iner-tia servo motor with an onboarddrive and controller to save on space,wiring, and cost over conventionalservo systems with separate motorand drive components.
The MDX integrated servomotors provide greater design modu-larity and simplicity for a wide rangeof applications, including automatedguided vehicles and autonomousmobile robots in the accurate posi-tioning of drive and lift axes.
MDX integrated servo motorshouse control electronics at the back,near the feedback device. No otherexternal electronics package isrequired to drive or control themotor. The back of the motor alsocontains connectors for power, com-munications, and I/O.
The MDX onboard controllersutilize the same command interfacesas external motor controllers includ-ing CANopen, RS-485, Modbus, andEthernet connections, as well as dis-crete I/O interfaces like pulse anddirection. Command signals from arobot or machine’s central processingunit can be wired directly to the inte-grated servo motor.
Eliminating the need to connectmotor power and feedback cables to anexternal motor controller, MDX inte-grated servo motors free space in arobot or machine to accommodateother critical components, such asmaterial handling mechanisms, sen-sors, additional axes of motion, oroperator-inter face components. Robotdesigners can focus less on controllerplacement and wiring and more onnon-motor system components for
faster design iterations.MDX integrated mo tors benefit
the robot designer in many areas byreducing the number of components inthe system, eliminating cables or wire
harnesses, freeing valuable space,simplifying the bill of materials,enabling faster design cycles, and sav-ing money.
MDX integrated servo motorsalso provide a better solution tobrushed DC and AC inductionmotors in serving as the main drivemotors for forward/reverse motionand the material handling axes foraccurate lifting, clamping, andengagement of the payload duringtransfer to different locations. Inaddition to providing more accuratespeed and positioning than ACinduction motors, MDX integratedservo motors do not have motorbrushes that wear out.
Contact: Applied MotionProducts, 404 Westridge Drive,Watsonville, CA 95076 % 800-525-1609 E-mail: [email protected] Web: www.applied-motion.com
New ProductsNew Products
www.us- tech.com
Rohde & Schwarz AddsWireGuard to DPI LibraryColumbia, MD — ipoque GmbH, aRohde & Schwarz company, hasadded WireGuard VPN protocol to itsR&S PACE 2 deep packet inspection(DPI) library.
With this addition, the companyenables network security vendors to
detect the world’s fastest-growingVPN protocol and effectively manageVPN traffic built on it.
Already, ipoque detects 70 of thetop VPN services worldwide, and aimsto detect 100 by June 2019. Launchedin 2015, WireGuard is a next-genera-tion, general-purpose VPN tunnel.WireGuard has a relatively smallattack surface that exploits cutting-edge cryptography with ease andspeed. Running on embedded inter-faces and supercomputers alike, itscompact code base makes it fast andeasy to use cross-platform, comparedwith alternative solutions, such asIPSec and OpenVPN.
WireGuard operates entirely inkernel space, which makes it fast. Itdoes not send packets until there isreal data to send, reducing mobiledevice battery drain. It also main-tains seamless, persistent connec-tions as mobile devices change net-work interface for improved roaming.
As VPN service providers in -creasingly include WireGuard, net-work security vendors need to ensurethat they are able to manage it. Byadding the WireGuard VPN protocolto R&S PACE 2, firewall and othernetwork security vendors can noweffectively detect WireGuard VPNtunneling protocols.
Contact: Rohde & Schwarz6821 Benjamin Franklin Drive,Columbia, MD 21046 % 410-910-7800 Web: www.rohde-schwarz.com
Applied Motion IntrosIntegrated Servo Motors
MDX integrated servo motor.
PI Releases PrecisionLinear Motion Stages
Auburn, MA — PI’s new L-412/V-412linear stage family is designed forhigh-precision industrial automationand positioning applications withmedium loads. Both linear motor driv-en and ball-screw driven versions areoffered to cover high-speed motionand to provide high push/pull force for vertical appli-cations.
Both models comewith travel ranges from 2 to24 in. (5.2 to 61 cm).Applications include highdemands on dynamics, pre-cision, smooth scan motion,short settling times, andlow tracking error, which isrequired for laser cutting,scanning, digital printing,electronics assembly andinspection, AOI, automation, and flatpanel manufacturing.
The L-412 ball screw model isequipped with a synchronous servomotor, and can be re-lubricated with-out disassembly, further extendingits high reliability and long lifetime.A cover strip on the side and thepurge air connection prevent contam-ination of the working componentsby particles. An optional holdingbrake allows an increase in itsusability as a z-axis stage.
Its higher-speed V-412 siblingcontains an ironless linear motor,and comes with an optional absolutelinear encoder. The three-phase, fric-tionless magnetic direct drive pro-vides a peak force of 151 N to themotion platform. This non-cogging
motor design provides vibrationless,smooth motion at high and low veloc-ities and superior position control.Also like its ball screw family mem-ber, the V-412 has a cover strip onthe side and the purge air connectionprevents contamination of the work-ing components by particles.
Contact: PI (PhysikInstrumente) L.P., 16 Albert Street,Auburn, MA 01501 % 508-832-3456E-mail: [email protected] Web: www.pi-usa.us
Mid-size linear stage family: V-412, L-412.
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Page 108
Eagan, MN — Ironwood Electronics has introduced a new LGA socket thataddresses high-performance requirements for 0.04 in. (1.016 mm) pitchdevices — the SPT-LGA-9019. The contactor is astamped spring pin with 0.7 oz (19g) actuationforce per pin and a cycle life of 125,000 insertions.
The self inductance of the contactor is 0.93nH, insertion loss is less than 1 dB at 23 GHz andcapacitance is 0.097 pF. The current capacity ofeach contactor is 4A. The socket’s operational tem-perature range is –67 to +356°F (–55 to +180°C).The socket also has an IC guide for precise edgealignment of the processor.
The specific configuration of the package to betested is a 2.1 x 1.8 in. (52.5 x 45 mm) body size with0.04 in. (1.016 mm) pitch. The socket has a heat sinklid to dissipate appropriate power for Xeon proces-sors. The existing server board has a productionsocket that can handle 10 insertions only.
The SBT-LGA-9019 has to beused on top of an existing socket toenable screening of the processor onthe server board. During use, theinterposer board is placed on theexisting socket and the socket body ismounted with spring pins using pro-vided hardware. The IC is droppedinto the socket, heat sink lid is closedand force applied by spring-loadedhardware on four corners. The socketcan be used for hand test, screeningprocessors and validation/characteri-zation applications with the moststringent requirements.
The spring pin socket line wasdesigned to be used in the existingserver board with production socketsoldered previously. Custom designsare also available. The socket has acontact design with outside spring
and flat stamped plungers that provide a robust solution for burn-in and testapplications, including excellent electrical signal integrity to meet the
requirements of today’s demanding analog, digital,RF, Bluetooth, and medical device applications.
The socket is mounted using supplied hard-ware on the target PCB with no soldering and hasa small footprint. The small footprint allows induc-tors, resistors and decoupling capacitors to beplaced close to the device for impedance tuning.The heat sink lid incorporates a quick installationdesign that uses spring loaded hardware, allowingICs to be changed out quickly.
Contact: Ironwood Electronics, 1335Eagandale Court, Eagan, MN 55121 % 952-229-8200 fax: 952-229-8201 E-mail: [email protected] Web: www.ironwoodelectronics.com
See at BIOMEDevice Boston, Booth 1068
May, 2019 Page 109www.us- tech.com
Ironwood: Spring Pin Socket for Xeon Processor
Minneapolis, MN — BLM Tech -nologies is now offering the all-newCanon imageFORMULA CR-L1 com-pact check transport/scanner. TheCR-L1 allows financial institutionsto seamlessly provide its RDC andremote lockbox customers with a ver-satile check scanner.
This extremely functional de vicecan replace the formerly popularCanon imageFORMULA CR-50 checktransport scanner, which has beendiscontinued. Among the least expen-sive of the multi-feed scanners on themarket, the CR-L1 scanner runs up to45 checks per minute with a 50-docfeeder and 50-doc hopper.
Equally as important for RDCcustomers upgrading from priorCanon scanners is that the driversthat run the new scanner are com-patible with legacy versions. The CR-L1 scanner driver emulates the CR-50/80 scanners, enabling compatibili-ty with existing RDC software.
BLM Technologies solves tech-nology and automation challenges byproviding end-to-end solutions inimaging, payment and transaction,digital signage, onsite repairs, IToutsourcing, and project manage-ment services.
Contact: BLM Technologies,Inc., 15300 25th Avenue N., Suite600, Plymouth, MN 55447 % 800-358-5574 E-mail: [email protected] Web: www.blmtechnology.com
Canon CheckScannerAvailablefrom BLMTechnologies
SBT-LGA-9019 LGA socket.
Shrink your device with ultra low profile capacitance. Visit cde.com/flatpack for full details or contact us at (864) 843-2277.
Thin, Powerful and Frees Up Space.
Mark.
See at EDS, Montego D
Page 110 May, 2019www.us- tech.com
Gowanda Launches HighCurrent Broadband ConicalsGowanda, NY — Gowanda Electron icshas introduced new broadbandmicrowave RF conical inductors thatprovide DC current handling up to10A — reportedly, the highest level inthe industry — and low insertion loss.
The four new series, C305FL,C550FL, C750FL and C1000FL, weredisplayed at the 2019 Optical Net -working and Communication Confer -ence and Exhibition in San Diego,California.
The flying lead series weredeveloped to address market needsand industry trends calling for ever-increasing performance from broad-band conical components. Gowanda’snew series will be utilized in commu-nication applications for bias Ts (fil-ter signal, remove noise), broadbandchip manufacturing, communicationplatforms, high frequency, micro -wave circuitry, RF test setups, testand measurement, test gear, test
instrumentation, and transmissionamplifiers.
The performance ranges provid-ed by these four new wirewound con-ical series include inductance from0.30 to 22 µH (typical), Q from 30 to
66 (typical), maximum DCR from0.02 to 0.265W and current ratingfrom 1,300 to 10,500 mA DC. All fourseries have been outgassing testedper ASTM E595 and meet the TMLrequirement of 1.0 percent max.Operating temperature range is –67to +257°F (–55 to +125°C) for allseries. Standard terminations andgold terminations are RoHS-compli-ant. Customers can contact Gowandafor Pb terminations.
Contact: Gowanda Electronics,One Magnetics Parkway, Gowanda,NY 14979 % 716-532-2234 fax: 716-532-2702 E-mail: [email protected] Web: www.gowanda.com
Performance range for new high-current broadband conicals.
Microchip Intros 802.15.4Compliant Sub-GHz Module
Chandler, AZ — Microchip Technol -ogy has introduced a small IEEE802.15.4-compliant module that com-bines an ultra-low-power microcon-troller (MCU) with a sub-GHz radio,accelerating time to market and pro-viding long-lasting battery life inwireless-networked sensors. At halfthe size of the next smallest moduleon the market, the SAM R30module meets the needs ofspace-conscious designs suchas home automation sensorsand controls.
Based on IEEE 802.15.4,the SAM R30 module sup-ports proprietary networksthat can be easily customizedand configured. This is usefulfor applications where inter-operability is not desired dueto their inherent vulnerabilityto remote attacks, such asalarm systems, buildingautomation, smart cities, and indus-trial sensor networks. A key advan-tage of an IEEE 802.15.4-based net-work is that member devices cansleep for extended periods of timeand remain part of the network. TheSAM R30 module includes an ultra-low-power sleep mode, with wakefrom general-purpose input/output(GPIO) or its built-in real-time clock(RTC), while consuming approxi-mately 800 nA. Devices can sleep foryears, only waking as needed totransmit data.
Compact sensor designs can sig-nificantly reduce installation compo-nents and simplify device deploy-ment. Applications often rely on sim-ple double-sided tape for mounting,making decreasing the size of thesensor a priority. The SAM R30 mod-ule measures 0.5 x 0.43 in. (12.7 x 11mm) and includes the necessary fea-tures to drive any remote connectedsensor, eliminating the need for aseparate MCU in the design. The
device also offers up to 256 kB offlash and 40 kB of RAM, as well asserial data interfaces, USB, and digi-tal and analog I/O for advanced sen-sor development.
Operating in the sub-GHz RFspectrum, the SAM R30 module deliv-ers two times the connectivity rangeand better propagation through walls
and floors than similarly powereddevices using the 2.4 GHz frequencyband. This robustness is critical inapplications like leak detection, wherethe sensor may be buried deep in aremote cabinet, or for pool and spacontrollers, which require reliable sub-GHz solutions that can communicatethrough exterior walls.
The SAM R30 module is certi-fied with the Federal Communica -tions Commission (FCC), IndustryCanada (IC) and Radio EquipmentDirective (RED), enabling designersto reduce time to market and RFtesting certification costs. Microchipprovides developers the flexibility toimplement a proprietary pointto-point, star or self-healing mesh net-work configurations with the freeMiWi™ protocol stack.
Contact: Microchip Technology,Inc., 2355 West ChandlerBoulevard, Chandler, AZ 85224 % 480-792-7200 Web: www.microchip.com
For more information or to request a quote, email: [email protected]
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NJ Micro Electronic Testing Inc.
Presenting the One Source for Electronic Component Procurement, Testing, Upscreening and Counterfeit Detection
NJMET, Inc. Announces Quality Systems Compliance with AS9100 Rev D / ISO 9001:2015
and the Federal Aviation Administration FAA-AC-0056, AC00-56B Certification
See at BIOMEDevice, Booth 943
See at SMTconnect, Hall 4A Booth 530
San Diego, CA — AMETEK Program -mable Power has added two newmodels to its Asterion™ line of ACpower sources. The Asterion 4503supplies AC and DC output power upto 4,500 VA or 4,500 W, and theAsterion 6003 supplies up to 6,000VA or 6,000 W. Both units come in a4U chassis and can supply single- orthree-phase output power.
Like the lower-power 1U and 2Umodels, 4503 and 6003 offer a com-pelling combination of intelligence,performance and modularity thatmake them adaptable and affordable.
The key to Asterion’s perform-ance is AMETEK’s iX2™ current-doubling technology. With iX2, as theoutput voltage decreases from themaximum value to one-half the max-imum value, the available outputcurrent increases up to two times therated output current.
This allows Asterion to main-tain maximum power through thewidest range of voltages. As a result,iX2 current-doubling technologyeliminates the need to buy multiplesources or overpowered sources torun tests at different voltage levels,such as when performing low linevoltage testing.
Asterion offers wide AC and DCoutput voltage ranges up to 400 VACand 500 VDC. Load and line regula-tion are ±0.025 percent and ±0.015percent, respectively, making thepower sources versatile and accurate.
Other benefits include auto-par-alleling and clock/lock. With auto-par-alleling, users can combine up to sixunits to achieve 36 kVA of outputpower. One unit becomes the master,while the rest serve as auxiliary units.The clock/lock feature allows users toeasily configure multi-phase systems,such as split-phase, three-phase oreven higher phase count systems.
Contact: AMETEKProgrammable Power, 9250 BrownDeer Road, San Diego, CA 92121 % 858-450-0085 E-mail: [email protected] Web: www.programmablepower.com
Walpole, MA — United ElectronicIndustries (UEI) has released itsDNx-TC-378 eight-channel thermo-couple simulator board and the DNx-RTD-388 eight-channel RTD simula-tor board. Both boards are compati-ble with all of UEI’s popular “Cube,”RACKtangle® and FLATRACK I/Ochassis and further complementUEI’s extensive simulator outputofferings that include RVDT/LVDT,synchro/resolver and strain gaugeboards. All boards are covered byUEI’s 10-year availability guarantee.
The DNx-TC-378 is a high-pre-cision thermocouple (TC) simulator,offering 16-bit resolution and greaterthan 1.1°F (0.6°C) accuracy withmost thermocouple types. Each chan-nel is fully isolated from all othersand is capable of simulating the fullTC range. Built-in support for J, K,T, E, N, R, and S type TC is included.The board provides cold-junctioncompensation, so field connectionscan be made wherever required. Theboard will simulate an open TC andincludes voltage and current diag-nostic readback on each channel.
The DNx-RTD-388 simulates1,000W RTDs and is based on actualswitched resistors, precisely duplicat-ing the behavior of actual RTDs. The
board supports two, three and four-wire configurations with accuracy of0.5°F (0.26°C). The board is a solutionfor simulator/SIL applications wherean onboard device expects an RTD asan input. Both open and short circuitconditions are simulated.
The board also has built in diag-nostic current monitoring capability.The RTD-388 series simulates a1,000W RTD while the standardDNx-RTD-388-100 simulates 100WRTDs. Other resistance versions areavailable on a special-order basis.
Contact: United ElectronicIndustries, 27 Renmar Avenue,Walpole, MA 02081 % 508-921-4600E-mail: [email protected] Web: www.ueidaq.com
May, 2019 Page 111www.us- tech.com
Asterion AC power source.
AMETEKExpands ItsAsterion Lineof AC PowerSources
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See at SMTconnect, Hall 4A Booth 110
Page 112 May, 2019www.us- tech.com
Grieve Builds 500°FTop-Loading Oven
Round Lake, IL — Grieve’s new No.955 is a 500°F (260°C), electricallyheated, top-loading oven, currentlybeing used for testing electronic com-ponents at the customer’s facility.Workspace of the unit measures 26 x2 x 2 ft (7.9 x 0.6 x 0.6m). Heating ofthe oven is provided by 70 kWNichrome wire elements, while 8,000
CFM of airflow from a series of four 2HP recirculating blowers is passedthrough the oven from rear to front.
This top-loading oven has 4 in.(10.2 cm) insulated walls throughout,aluminized steel exterior and interi-or, a motor-operated, rear-hingeddoor that opens the top and front of
the oven chamber and a workspacefloor reinforced for 7,200 lb (3,266 kg)of load on its 0.25 in. (0.63 cm) steelplate surface.
The oven has a digital program-ming temperature controller with twochannels, providing two independentzones of digital control. The oven alsohas two onboard manual reset excess
temperature controllers with separatecontactors and four recirculatingblower airflow safety switches.
Contact: Grieve Corp., 500 HartRoad, Round Lake, IL 60073 % 847-546-8225 fax: 847-546-9210 E-mail: [email protected] Web: www.grievecorp.com
No. 955 top-loading oven for testing electronics.
TI Intros New Ethernet PHYsDallas, TX — Texas Instruments (TI)has introduced two new Ethernetphysical layer (PHY) transceivers,expanding connectivity options fordesigners of both space-constrainedapplications and time-sensitive net-works (TSNs).
According to the company, theDP83825I low-power 10/100 Mb/sEthernet PHY has a 44 percentsmaller package size than competingdevices and provides a 492 ft (150m)cable reach. The DP83869HM sup-ports copper and fiber media, andoffers high-temperature operation upto 257°F (125°C), which enables engi-neers to leverage the speed and reli-ability of gigabit Ethernet connectiv-ity in harsh environments.
These devices join TI’s exten-sive portfolio of Ethernet PHY trans-ceivers and allow designers to imple-ment connectivity in a variety ofchallenging designs. The small pack-age, low power consumption and longcable reach of the DP83825I enabledesigners to reduce the size and costof compact IP network camera, light-
ing, electronic point-of-sale, andother space-constrained applications,without sacrificing network reach.
The high operating temperatureof the DP83869HM, as well as itselectrostatic discharge (ESD) immu-nity and support for media conver-sion, help increase performance anddesign flexibility in factory automa-tion, motor drive and grid infrastruc-ture equipment designs.
Contact: Texas Instruments,Inc., 12500 TI Boulevard, Dallas, TX75243 % 972-995-2011 Web: www.ti.com
Ethernet PHY transceivers.
Nashua, NH — Elmo Motion Controlhas introduced an enhanced, GoldTwitter, single power source up to 95VDC, miniature servo drive. Thisallows designers to use a singlepower source for both the drive andlogic power.
As part of its continuous engi-neering efforts, the Elmo R&D teamwas able to integrate a higher volt-age internal supply into the ultra-small Gold Twitter. Gold Twitter 80and 100V versions denoted with anew P/N suffix can now operate froma single power supply. VL (controlsupply) and VP+ (power supply)operating from a single source is a
huge benefit for machine builders. The single control supply topol-
ogy contributes to lower EMI, andreduced sensitivity to poor externalwiring. Despite the changes, the newenhanced version will be completelyF3 (fit, form and function) compliant.The strict compliance with fit, formand function rules ensures transpar-ent usage for customers that current-ly use GTWI.
Contact: Elmo Motion Control,Inc., 42 Technology Way, Nashua,NH 03060 % 603-821-9979 fax: 603-821-9943 E-mail: [email protected] Web: www.elmomc.com
Elmo Motion ControlIntros Mini Servo Drive
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May, 2019 Page 113www.us- tech.com
www.xjtag.comAdvertorial
Elite Electronicswww.xjtag.com
To extend the test options availablefor customers, as well as increasingtest coverage and speeding updiagnostics, Elite’s TechnicalManager, Mark McBride, decided toadd boundary scan testing to thecompany’s capabilities. Boundaryscan testing can verify connectionsand check for correct operation ofcomponents without requiring directphysical access to device pins,delivering advantages such as shortertest duration, faster fault diagnosisand enhanced testability, particularlyif a board contains devices withhidden I/O pins, such as BGAs orChip-Scale Packages (CSPs).
After evaluating a number ofboundary scan test systems, MarkMcBride decided that XJTAG wasthe best choice for Elite’s testdepartment. “The structure of thesystem, the user interface, and thetraining and support providedconvinced us to select XJTAG,”he confirms. “Our engineers havebecome productive quickly, workingat a high level without needing to beboundary scan experts.”
Embedded computing boards aretypical of the types of assembliesbuilt on Elite’s production lines. Thesecontain components such asprocessors, FPGAs, DSPs andapplication-specific chips, many ofwhich are boundary scan compliantand so can be tested directly usingthe XJTAG system. The boards alsocontain other non-JTAG devices,and so take advantage of XJTAG’sextended capabilities for testing these
via nets connected to boundary scancompliant devices. These includememory ICs, Digital-to-AnalogueConverters (DACs), Ethernetcontrollers, connectors, switches,LEDs and many others. XJTAG is alsoable to program devices such asFlash chips and CPLDs.
“One of the most valuable aspectsof using XJTAG is the system’s abilityto determine the precise locationsof faults within processor-basedassemblies,” adds Keith Irvine, TestSupervisor. “This helps us identify thecauses of any defects quickly, andthen determine remedial action.”
In particular, Elite’s engineers werekeen to use boundary scan fortesting BGA devices. Since BGA I/O
pins cannot be probed, pinpointing afaulty connection can be extremelydifficult. “The XJAnalyser tool isextremely useful for examining BGAconnections. We can set and togglepin values, and trace signals easilywith the help of colour coding andvariable zoom levels, to identifyfaults such as shorts and opens.”
The team at Elite also promotesXJTAG to customers, so thatdesigners can optimise for boundaryscan testing at the early stages ofeach new product lifecycle. “So farwe have encouraged four of ourcustomers to make contact withXJTAG, and invited them to our on-sitetraining, to see how they can takeadvantage of the gains in productivityand quality that can be achieved.”
“The structure of the system, the user interface, and the trainingand support provided convinced us to select XJTAG. Ourengineers have become productive quickly, working at a high levelwithout needing to be boundary scan experts.”“One of the most valuable aspects of using XJTAG is the
system’s ability to determine the precise locations of faults. Thishelps us identify the causes of any defects quickly.”“So far we have encouraged four of our customers to make
contact with XJTAG, to see how they can take advantage of thegains in productivity and quality that can be achieved.”
Elite Electronic Systems of Enniskillen, Northern Ireland,provides Electronic Manufacturing Services to customerslocally and worldwide, offering facilities for advanced high-speed surface-mount assembly and final box build, as well asdesign and production of bespoke cables and harnesses. Itscustomers are active in diverse markets, and include leadingbrands in power generation, power monitoring, audio,scientific, and medical equipment sectors.
Elite Electronics selects XJTAG boundary scan for accuracy and ease-of-use
“Electronic Manufacturing Services Provider, Elite Electronics, based in Northern Ireland and the USA,specialises in building advanced assemblies for high-tech customers, particularly in the medical and powerelectronics sectors. Seeking to enhance in-house test capabilities by adding boundary scan, Elite’s engineerschose XJTAG for its powerful user-friendly features and excellent support.”
DataBank
Company Elite Electronic SystemsHQ Northern Ireland
Nature of Leading provider of Contractbusiness Electronics Manufacturing servicesMain product PCB Assembly, Customised Test
Solutions, Cable Assembly, GlobalProcurement, Worldwide Logistics
Customers Diverse range of market sectorsincluding Power, Medical, AudioAutomotive, Industrial, Consumer...
Locations Enniskillen, Northern IrelandRidgeway, South Carolina, USA
Incorporated 1986Web site www.elitees.com
opinion Mark McBride, Tech ManagerKeith Irvine, Test SupervisorElite Electronics
Page 114 May, 2019www.us- tech.com
Large-Format Floor-MountedFume Hoods from HEMCO
Independence, MO — HEMCO’s cus-tomized UniMax floor-mount fumehoods are designed forusers that have large/tallequipment or processesthat require being isolated,contained and vented foruser safety.
UniMax custom floor-mount fume hoods can haveaccess from one side, or fromthe front and rear for a dual-entry style, or on all sides.Their modular constructionallows them to ship disas-sembled and be field assem-bled easily.
The model shown has16 service fixtures, 8 tem-pered glass doors, vapor-proof and explosion-proofLED light fixtures, electrical recepta-cles, and 6 cord ports. UniMax fumehoods have chemical and fire-resist-ant composite resin wall panel con-struction. Custom sizes and designs to
meet specific requirements are avail-able upon request.
Contact: HEMCO Corp., 711Powell Road, Independence, MO64056 % 800-779-4362 E-mail: [email protected] Web: www.hemcocorp.com
Vernon Hills, IL — MitsubishiElectric Automation has released itsFRA800-R2R series of variable fre-quency drives (VFDs), developed forend users and machine designersthat need an optimized control solu-tion for continuous roll-to-roll pro-cessing. The drive builds on the per-formance and functionality of thestandard FR-A800 series VFD, withenhanced firmware engineered forunwinding and rewinding processes,such as coating, laminating, slitting,drawing, and extruding.
The drive is equipped with dedi-cated functions, including tension sen-sorless torque control and tension sen-sor feedback speed control. Variabletension is applied to the material tomaintain constant flow on the wind-ing and unwinding sides, helping toeliminate imperfections, such as wrin-kles or deformation.
These functions do not requireadditional sequence of motion con-trol programming to implement,because the FR-A800-R2R inverterhas a built-in PLC and employseasy-to-use parameters to set and
enhance functions.Industries that commonly use
roll-to-roll processing machines thatwould be well-served by the FR-A800-R2R drive, include printing, automo-tive and material handling. The coat-
ing and laminating of flexible electron-ics, as well as aluminum and copperfoils for batteries and photovoltaiccells in the clean energy industry, arealso possible applications.
Contact: Mitsubishi ElectricAutomation, Inc., 500 CorporateWoods Parkway, Vernon Hills, IL60061 % 847-478-2415 E-mail:[email protected] Web:www.mitsubishielectric.com/fa/en
FRA800-R2R VFD.
Mitsubishi Intros Series ofVariable Frequency Drives
Gardner, MA — J-Link remote serveris a proven way to debug. Customershave been using it for years to debugtarget systems thousands of milesaway, even behind firewalls. It canprovide early, shared access to a newdevice, such as silicon sitting on dis-tant hardware, where physical ship-ment is not feasible. It can be used todebug target systems that are at cus-tomer’s facilities, should the needarise, and distributed teams can makeeffective use of scarce hardware.
Cloud-based development sys-tems can debug a target system on thedeveloper’s desk. The same applies toSEGGER flash programmers. Flash -ers in use far away can be controlled,monitored and updated.
The newly released versionallows access to a J-Link by a name
chosen by the user (versus serial num-ber only) and has password protectionusing challenge-response, ensuringthe password is never visible on thewire and thus cannot be sniffed.Replay attacks are prevented.
The default tunnel server isoperated by SEGGER, which can han-dle thousands of connections simulta-neously, completely free for J-Linkusers. There is now also the option touse a customer-operated tunnel serv-er. The Remote Server software isincluded in the “J-Link Software andDocumentation Package” free withany model J-Link or J-Trace.
Contact: SEGGER Microcon -troller Systems, LLC, 101 SuffolkLane, Gardner, MA 01440 % 978-874-0299 Web: www.segger.com
SEGGER Adds SecureRemote Access to J-Link
Solutions for Electronic Assemblies and Systems
Experience the new home of the EMS industry.Visit the EMS Park at the SMTconnect! At the special showcase area you can find Indivual EMS solutions and make valuable connections in a familiar atmosphere.
Nuremberg, 7 – 9 May 2019Be part of the community: smtconnect.com
Visit us at booth 947
UniMax floor-mount fume hood.
Valencia, CA — Cicoil has introducedits new flat cable configurator.Located at www.cicoil.com/flat-
cable/configurator, this free, web-based tool lets anyone easily design a
custom flat cable. The cable configu-rator works seamlessly on all Appleand Android devices.
With a few simple mouse clicksor touch of a screen, flat cables can beconstructed of multiple elements,including power/signal conductors,shielded pairs, video, data, or coaxwires, and tubing for liquid or air. Tomake the process even simpler,Cicoil has added industry-standardmodules, including Camera Link®,Cat 6A, FireWire, and USB 3.0, tothe configurator.
As the user clicks any of themany available elements, items dy -namically appear in the “Cable Build”
area. Clear, simple graphics show theAWG wire size, insulation color, andwire type, making it easy to identifyexactly what is in the flat cable. Cabledimensions change dynamically,allowing the user to build cables up to3.75 in. (9.5 cm) wide, with widercables available by request.
An isometric cable view andparts list is also built dynamically.Any of Cicoil’s configurator elementscan be combined in any positionwithin the flat cable profile, whichmeans that over one million flatcable designs are available for imme-diate production and quick delivery.Elements can be quickly repositioned
or deleted from the cable. Once the flat cable is designed,
the configurator compiles it and gen-erates a drawing, quote and custompart number, and delivers it by e-mail. Cicoil guarantees deliverywithin two weeks for any cabledesigned using the cable configura-tor, with a 100 ft (30.5m) minimumcable length required. A guided tourof the configurator is also offered onthe website.
Contact: Cicoil Corp., 24960Avenue Tibbitts, Valencia, CA91355 % 661-295-1295 E-mail: [email protected] Web: www.cicoil.com
May, 2019 Page 115www.us- tech.com
New Cicoil Online Cable Configurator
Plano, TX — Diodes Inc. has intro-duced automotive-compliant PCI Ex -press (PCIe) 4.0 clock generators andbuffers designed with advanced fea-tures for demanding applications,such as head units, ECUs, ADAS, nav-igation, telematics, and infotainment.
The PI6CG182Q, PI6CG184Q,PI6CG188Q (PCIe 4.0 clock genera-tors) and PI6CB184Q (PCIe 4.0 clockbuffers) provide differential low-power, high-speed current steeringlogic (HCSL) outputs with on-chip ter-mination. They’re designed to gener-ate and distribute a reference clocksignal for chipsets employing PCIeGen 4 interfaces. The devices are allqualified to AEC-Q100 Grade 2, withan operating temperature range of –40to +221°F (–40 to +105°C), suitable forany automotive PCIe application.
Operating at 1.8V and withintegrated on-chip termination atevery HCSL output, the devices min-imize power consumption and re -move the need for external resistors.Designers would otherwise need toadd four resistors per output pair, orup to 32 resistors for an eight-outputdevice, and lose power through theexternal resistors. Each output alsoincludes its own enable pin to furtherimprove power management on out-puts that are unused.
The devices are based on Diodes’proprietary PLL technology, proven inmillions of products worldwide. Thisdesign includes a number of advancedfeatures, including programmable out-put slew rate and amplitude, andselectable spread-spectrum on differ-ential outputs to help minimize EMI.This can be particularly helpful whendesigning for an automotive environ-ment. These clocks were developedwith the automotive manufacturingenvironment in mind, so wettable-flank QFN packages have been used toensure compatibility with automatedvisual inspection.
Contact: Diodes, Inc., 4949Hedgcoxe Road, Suite 200, Plano,TX 75024 % 972-385-6292 E-mail: [email protected] Web: www.diodes.com
Diodes Inc.Offers LowPower PCIe4.0 Clocks
Can sit across iOS, Android and Windows devices for full platform ubiquity
For more information
888 367 9838
Properly categorize all of your content, from brochures and catalogs to user manuals.
Tight version control, so that older documentation is never presented to users of the app.
Provide a truly responsive, smartphone friendly viewing mode for smartphone users, called PhoneView.
Permission management to make sure you can control who sees what documents.
Enhanced search options for easy discoverability among readers.
YUDU’s mobile Document Center App can provide employees and customers with a single destination from which to access brochures and catalogs to user manuals and datasheets.
Organize and take control of your documents
Online flat cable configurator.
Page 116 May, 2019www.us- tech.com
RoHS
RIGOL Adds Pre-ComplianceAnalysis to Real TimeSpectrum Analyzers
Beaverton, OR — RIGOL Technol -ogies announces a significant addi-tion to its UltraReal family of real-time spectrum analyzers with therelease of an integrated EMI applica-tion mode for EMI pre-compliancemeasurements.
RIGOL’s EMI measurementapplication provides a complete EMIpre-compliance solution, allow ing engi-neers to measure, compare, analyze,and report on EMI issues throughoutthe design process. The EMI applica-tion mode allows for easy measure-ment set up. Features like integratedCISPR bandwidths and detectors, sim-ple limit line construction, automatedmulti-segment scan, and up to threesimultaneous detectors make it simpleto get initial scans and measurements.
Advanced capabilities, includ-ing real-time detector measure-ments, automated peak/limit search-es and simple correction table inte-gration make configuring more com-plex test environments and analyz-
ing results easy. Comprehensivesetup, storage and report generationcapabilities make it easy to docu-
ment, share, and repeat tests. TheEMI option is available pre- or post-purchase for either the RSA3000 orRSA5000 series spectrum analyzeras a software-enabled option.
Contact: RIGOL Technologies,8140 S.W. Nimbus Avenue,Beaverton, OR 97008 % 503-465-4626 E-mail: [email protected] Web: www.rigolna.com
RIGOL RSA3045 real-time spectrum analyzer.
San Carlos, CA — Alliance Memory isnow offering an extensive line of auto-motive-temperature SDRAMs, high-speed pseudo SRAMs (PSRAMs), andhas added to its portfolio of mobilelow-power SDRAMs, including SDR(LPSDR), double data rate (LPDDR),and DDR2 (LPDDR2) devices.
Alliance Memory also offers dis-continued Cypress SemiconductorCY62256 low-power SRAMs and end-of-life MT41K512M16 8G DDR3LSDRAMs from Micron Technology.
The company’s automotive-tem-perature CMOS SDRAMs include dou-ble data rate (DDR), DDR2 and DDR3devices in a wide range of densities.The AEC-Q100-compliant DRAMs areoptimized for high-temperature appli-cations, including ADAS, powertrain,automotive active safety and auton -omous driving, connectivity and in-vehicle networking (IVN), customizedPCs in vehicles, telematics, and info-tainment systems.
PSRAMs come in densities of 8 to
128 Mb in 0.24 x 0.28 in. (6 x 7 mm),48-ball FPBGA and 0.16 x 0.16 in. (4 x4 mm), 49-ball FPBGA packages. Thedevices offer industrial temperatureranges and fast access speeds of 70s.They operate from a single power sup-ply of 1.7 to 1.95V or 2.6 to 3.3V.Power-saving features include auto-temperature-compensated self-refresh(ATCSR), partial array self-refresh(PASR) and a deep-power-down (DPD)mode.
The company’s ICs provide reli-able, drop-in, pin-for-pin compatiblereplacements for a number of similarsolutions in industrial automotive,medical, communications, telecom,and consumer electronics. In addition,the company performs minimal or nodie shrinks, which frees up engineer-ing resources.
Contact: Alliance Memory, Inc.,511 Taylor Way, San Carlos, CA94070 % 650-610-6800 E-mail: [email protected] Web: www.alliancememory.com
Alliance Debuts Automotiveand Mobile Memory
Hanau, Germany — The number ofelectric cars on the road is steadilyincreasing. The further developmentof the infrastructure is leading toconsiderable network disturbance,which requires complex EMI filters.Vacuumschmelze (VAC®) has devel-oped patent-pending smart coils thatenable significantly higher attenua-tion, especially at high frequencies.
Smart coils are produced costeffectively in an innovative manufac-turing process. Instead of the com-monly used massive wire winding,shaped copper bars are attached tothe core. This reduces the mechani-cal stress on the core during winding,increasing attenuation. The companytypically uses VITROPERM cores,which demonstrate high permeabili-ty and low losses, along with excel-lent thermal properties.
Smart coils are used as commonmode chokes (CMCs), which offerimproved attenuation at high fre-quencies, minimized winding capaci-ty and a 10-fold improved impedanceat 10 MHz. The new design is suit-able for applications with load cur-
rents higher than 50A at high power. Contact: VAC Magnetics, LLC,
2935 Dolphin Drive, Suite 103,Elizabethtown, KY 42701 % 270-769-3118 E-mail: [email protected] Web: www.vacuumschmelze.com
VAC smart coil.
High Attenuation SmartCoils from Vacuumschmelze
See at BIOMEDevice, Booth 1068
Sunnyvale, CA — XP Power has introduced aseries of rack-mount, high-voltage DC power sup-plies able to supply up to 60 kV. Aimed at labora-tories and OEMs, the EY series of 1,200W high-voltage power supplies include flexible embeddedcontrols with low ripple and noise. They are air-insulated, fast response units with tight regulationand extremely low arc discharge currents.
For use in the medical, industrial and generalhigh-voltage areas, the most important applicationsfor the EY series are in vapor deposition, ion implan-tation, glow discharge, electrostatics, plasmasources, cyclotrons, X-ray, and other vacuum tubes.
The EY series comprises 16 models from 0 to1 kV to 0 to 60 kV at 1,200W outputpower. Typically, ripple is less than0.02 percent rms of rated voltage atfull load and off-the-line pulse-widthmodulation provides high efficiencyand a reduced parts count forimproved reliability. The first fourmodels in the range offer reversiblepolarity, and the others can be pur-chased as positive or negative polari-ty units.
XP Power’s EY series power sup-plies provide automatic crossover fromconstant-voltage to constant-currentregulation, protecting against over-loads, arcs and short circuits. Thepower supplies’ arc quench featureensures that the HV output is inhibit-ed for a short period after each loadarc to help extinguish the arc, whiletheir remote analog and digital controlthrough RS-232 and USB capabilityoffers flexibility of integration withcustomers’ systems.
Optional Ether net control pro-vides the capability of control and
monitoring from remote locations.The EY power supplies’ benchtop/2U rack-
mount format suits them for location on a test benchor for integrating with other equipment in a stan-dard 19 in. (48.3 cm) rack. With embedded microcon-troller control, front panel digital encoders on theunits provide high-resolution local adjustment ofvoltage and current program.
The power supplies can operate from singlephase AC supplies between 180 and 264V. Semi S2-93-compliant, they meet safety compliance levelsrequired for use in semiconductor manufacturingequipment.
Contact: XP Power, LLC, 990 BeneciaAvenue, Sunnyvale, CA 94085 % 408-732-7777Web: www.xppower.com
May, 2019 Page 117www.us- tech.com
The Leadership SummitMAY 7–10, 2019 ° MIRAGE ° LAS VEGAS
Four days where leaders, innovators and other bright minds connect, share, inspire and collaborate. The EDS Leadership Summit is not just about building business; it’s also elevating the discussion with ideas that drive the electronic components industry to the next level.
Register today at edsconnects.com.
EY series power supply.
XP Power Launches 60 kV Rack-Mount Power Supplies
Ashland, VA — Porvair has releasedits 2019 filtration catalog, whichshowcases its extensive range ofproducts. The new catalog highlightsthe company’s dedication to findingnew ways to meet its customers’ fil-tration requirements and developnew products. Readers can find a listof the company’s entire product offer-ing, including a new range of nomi-nal filters with housings in standardand giant configurations, as well ascompressed air filters with industrialand sterile housings.
Porvair isnow offering awide-format stylein its polymeric fil-ter range, a newfour-lug connectorfor its junior filtersand a new Micro -print™ filter.
For more than50 years, the com-
pany has delivered filtration solu-tions for the most demanding of envi-ronments, including aerospace,nuclear, food and beverage, gasifica-tion, microelectronics, pharmaceuti-cal, and printing.
Contact: Porvair FiltrationGroup, Inc., 301 Business Lane,Ashland, VA 23005 % 804-550-1600fax: 804-550-3262 Web: www.porvairfiltration.com
PorvairReleases 2019FiltrationCatalog
Page 118 May, 2019www.us- tech.com
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South Chesterfield, VA — ept’s newColibri high-speed connector is nowavailable in both 10 and 16 Gb/s ver-sions. This new board-to-board con-nector was developed by ept inresponse to the ever-increasing mar-ket demand for connectors suitablefor sophisticated high-speed trans-mission applications such as USB 3.1Gen2 and PCI Express 4.0. TheColibri COM Express has a compactdesign with a 0.02 in. (0.5 mm) pitch.
Like the 10 Gb/s version, the newhigh-speed version is available for aboard-to-board distance of 0.2 or 0.3in. (5 or 8 mm). Both the plugs andreceptacles are available for pincounts of 40, 80, 120, 160, 200, and220. There also is a 440-pin version,which is made up of two 220-pin plugsor receptacles held together by a sol-dering frame. The 16 Gb/s version iscompatible with the Colibri standardversion in terms of layout and mating.
The Colibri high-speed connec-tors are suited for all types of appli-
cations that require high data trans-fer rates. This, in particular, includesmezzanine board-to-board systems
and COM Express specifications. Thesmall, high-speed pro devices arealready being used in a wide varietyof areas, such as in industrialautomation, kiosk and POS systems,medical technology, measurementtechnology, consumer electronics andgaming, as well as in transportationand building technology.
Contact: ept, Inc., 1624 AshtonPark Drive, South Chesterfield, VA23834 % 804-530-0820 fax: 804-530-0837 E-mail: [email protected] Web: www.eptusa.com
16 Gb/s Colibri High-SpeedConnectors from ept
High-speed Colibri connector.
CUI Offers Multiple MountingOptions for Power Supplies
Tualatin, OR — CUI’s Power Grouptoday announced the addition of 3 and5W models to its line of low-power,encapsulated AC-DC power supplies.Available in board mount, chassismount, wire lead, and DIN rail config-urations, the single-output PSKS3and PSKS5B series are housed incompact packages as small as 1.46 x0.97 x 0.71 in. (37 x 24.5 x 18 mm),making them well-suited for space-constrained, low-power ITE, industri-al control, automation, and consumerelectronics applications. Designed foreasy installation, the wire leadPSKS3L and PSKS5BL series, chas-sis mount PSKS3T and PSKS5BTseries, and DIN rail mountPSKS3DIN and PSKS5BDIN seriesafford engineers additional options forsimpler design implementation.
These encapsulated modulesprovide 4 kVAC input-to-output isola-tion, a universal input voltage rangeof 85 to 264 VAC, and a wide operat-ing temperature range from –40 to+158°F (–40 to +70°C). The seriesalso offers single output voltages of3.3, 5, 9, 12, 15, and 24 VDC, alongwith over-current, over-voltage and
continuous short circuit protections.All models are certified to the
new IEC 62368-1 safety standard forICT and AV equipment, while meet-ing CISPR32/EN55032 Class A lim-
its for conducted and radiated emis-sions. Offering class II construction,these encapsulated AC-DC powersupplies have a minimum MTBF of300,000 hours at 77°F (25°C) ambi-ent, per MILHDBK217F.
Contact: CUI, Inc., 20050 SW112th Avenue, Tualatin, OR 97062% 503-612-2300 fax: 503-612-2300E-mail: [email protected] Web: www.cui.com
Encapsulated AC-DC power supplies.
Sunnyvale, CA — Alpha and OmegaSemiconductor (AOS) has expanded itsEZBuck™ series with the AOZ66 62DI-01 and AOZ6663DI-01 — high-efficien-cy, simple-to-use, synchronous buckregulators. The AOZ66 62DI-01 andAOZ6663DI-01 are both available in athermally enhanced DFN 3x3 exposedpad package, delivering output cur-rents of 2A and 3A, respectively.
The new devices offer a low on-resistant power stage, allowing coolerpower conversion for a variety of con-sumer electronics application such asLCD TVs and set-top boxes, as well asDVD players and recorders. The lowon-resistance of the internal powerMOSFETs in these devices allowshigher efficiency and less heat genera-tion. They have over 90 percent effi-
ciency at full load operation and main-tain 87 percent efficiency while in 10mA light load operation.
When operating in low outputcurrent conditions, the device will runin a proprietary pulse energy mode(PEM) to obtain high efficiency. Underheavy load steady-state conditions, thedevice will operate in a fixed frequencyand Continuous Conduction Mode(CCM). The small standby current,combined with a thermally enhancedpackage provides excellent efficiencyand thermal performance.
Contact: Alpha and OmegaSemiconductor, Inc., 475 OakmeadParkway, Sunnyvale, CA 94085 % 408-789-3233 E-mail: [email protected] Web: www.aosmd.com
AOS Continues toExpand EZBuck Family
See at EDS, Booth 510 and EWPTE, Booth 1558
Milpitas, CA — Legendary inventorDean Kamen, regarded by Forbesmagazine as a “modern-day Edison,”and creator of the Segway and hun-dreds of other innovations, will sharethe stage with other elite keynotespeakers from industry powerhousesincluding AMD, Applied Materials,IBM, and Synopsys at SEMICONWest. The conference and exhibitionis scheduled to take place from July 9to 11, 2019, at the Moscone Center inSan Francisco, California. Registra -
tion for the event is now open. Back by popular demand, the AI
Design Forum returns on July 9 forits second year at SEMICON West.SEMI Americas, the ElectronicSystem Design Alliance and AppliedMaterials are partnering to stage theevent with speakers that representthe entire computing ecosystem. Theartificial intelligence (AI) era is wide-ly expected to become the largest ofany in industry history, and thespeakers will present new approach-
es for the future of computing, frommaterials to systems.
The AI Design Forum keynotelineup includes Dr. Lisa Su, presi-dent and CEO of AMD, Dr. Aart deGeus, cofounder, chairman and co-CEO of Synopsys, and Gary Dick -erson, president and CEO of AppliedMaterials. Named last year byFortune as one of the “World’s 50Greatest Leaders,” Su will describe agrowing consensus that 2019 promis-es a historic inflection point for high-performance computing, enabled bynew design approaches that gobeyond node shrinking. Geus, a lead-ing expert on logic synthesis andsoftware simulation, will addresshow the industry can benefit from co-
optimization — from silicon to soft-ware — to fulfill the promise of AI.Dickerson, recognized by Barron’s asone of the “World’s Best CEOs,” willdiscuss how new materials and relat-ed innovations can help acceleratethe breakthroughs needed in the AIera of computing by a factor of ten.
Keynotes on July 10 include Dr.Jeff Welser, vice president and labdirector, IBM Research — Almaden,Bob Pearson, senior advisor, W2OGroup, and Dean Kamen, founder ofDEKA Research and Development.Welser will lay out the “Future ofComputing,” including the growth ofthe quantum computing ecosystem,and where microelectronics will find
Page 120 May, 2019www.us- tech.com
hi-TeCh evenTShi-TeCh evenTS
MORE SHOWS: www.topline.tv/tradeshows.cfm
2019EDITOrIAL AND
TrADEShOW CALENDAr
ISSUE EDITORIAL SHOW DATE LOCATION
Jan/Feb Assembly & AutomationAPEX PP ATX West PP
APEXDesignConATX/Electronics West/MDM
Jan. 29-31Jan. 30-31Feb. 5-7
San Diego, CASanta Clara, CAAnaheim, CA
March Test & Measurement APEC March 19-21 Anaheim, CA
April/May SMT & ProductionNepcon China PPSMT/Hybrid/PKG PPEDS PP
Nepcon China SMT/Hybrid/PKGWire Processing TechBIOMEDeviceEDS
April 24-26May 7-9May 8-9May 15-16May 15-18
Shanghai, ChinaNuremberg, GermanyMilwaukee, WIBoston, MALas Vegas, NV
June Components & DistributionATX East /MDM PP
ATX East /MDM June 11-13 New York, NY
July Production & PackagingSemicon West/Intersolar PP
SEMICON West/Intersolar July 9-11 San Francisco, CA
August PCB & Assembly Nepcon South China PP
Nepcon South China Aug. 27-29 Shenzhen, China
September Assembly & AutomationSMTAI PP
AutotestconPCB WestThe Battery ShowSMTAIIMAPS
Sept. 10-12Sept. 10-12Sept. 10-12Sept. 24-25Oct. 1-3
National Harbor, MDSanta Clara, CANovi, MIRosemont, ILBoston, MA
October SMT & ProductionProductronica PP
The Assembly ShowMDM MinneapolisProductronica BIOMEDevice San Jose
Oct. 22-24Oct. 23-24Nov. 12-15Dec. 4-5
Rosemont, ILMinneapolis, MNMunich, Germany San Jose, CA
Nov/Dec Test & MeasurementElectronics West/MDM PP
ATX/Electronics West/MDM Feb. 4-6/ 2020 Anaheim, CA
PP = Product Preview
Trade Show Calendar
May 22-23, 2019, Northern California Design-2-Part Show. * Santa Clara Convention
Center, Santa Clara, CA. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712
% 800-225-4535 Web: www.d2p.com
June 11-13, 2019, MD&M East. * Jacob K. Javits Convention Center, New York, NY.
Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200
Web: https://advancedmanufacturingnewyork.com
June 25-27, 2019, IMAPS Advanced SiP. * Monterey Marriott, Monterey, CA.
Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000
Web: www.imaps.org/sip
Sept 10-12, 2019, The Battery Show. * Suburban Collection Showplace, Novi, MI.
Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200
Web: https://thebatteryshow.com
May 7-9, 2019, SMTConnect. * NürnbergMesse, Nuremberg, Germany.
Contact: Mesago Messe Frankfurt GmbH, Rotebühlstr. 83-85, 70178 Stuttgart, Germany
% +49-711-61946-0 E-mail: [email protected] Web: www.smt.mesago.com
June 5-6, 2019, Upper Midwest Design-2-Part Show. * Minneapolis Convention
Center, Minneapolis, MN. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712
% 800-225-4535 Web: www.d2p.com
April 24-26, 2019, NEPCON China. * Shanghai World Expo Exhibition & Convention
Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F
Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070
% +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: [email protected]
Web: www.nepconchina.com
May 8-9, 2019, EWPTE. * Wisconsin Center, Milwaukee, WI. Contact: Expo Productions,
Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500
E-mail: [email protected] Web: www.electricalwireshow.com
May 7-10, 2019, EDS. * The Mirage Las Vegas, Las Vegas, NV. Contact: EDS — Where the
Electronics Industry Connects, 310 Maxwell Road, Suite 200, Alpharetta, GA 30009
% 312-648-1140 E-mail: [email protected] Web: www.edsconnects.com
Sept 10, 2019, PCB West. * Santa Clara Convention Center, Santa Clara, CA. Contact: UP
Media Group, Inc., P.O. Box 470, Canton, GA 30169 % 678-234-9859 Web: www.pcbwest.com
May 15-16, 2019, BIOMEDevice. * Boston Convention & Exhibition Center, Boston, MA.
Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200
Web: www.biomedevice.mddionline.com
May 15-16, 2019, Design & Manufacturing New England. * Boston Convention &
Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica,
CA 90405 % 310-445-4200 Web: https://dm-newengland.com
August 28-30, 2019, NEPCON South China. * Shenzhen Convention & Exhibition
Center, Shenzhen, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F
Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070
% +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: [email protected]
Web: www.nepconsouthchina.com
July 9-11, 2019, SEMICON West. * Moscone Center, San Francisco, CA. Contact: SEMI,
673 South Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 fax: 408-943-6986
Web: www.semiconwest.org
“Modern-Day Edison” Joins SEMICON West Keynote Lineup
SMTconnect LaunchesSoldering and Substrate
Technology DaysNuremberg, Germany — Two newtechnology days at SMTconnect, tobe held from May 7 to 9, 2019, inNuremberg, Germany, are scheduledto host 35 world-class speakers whowill offer insight into soldering andsubstrates. Four seminars and fourspecial sessions will be held inEnglish, focusing on the topics ofassembly and joining.
“Soldering — Challenges inPractice,” is the first technology dayand will include a 90-minute seminartitled, “Implementation of a LowMelting Point Soldering Alloy inElectronics Assembly.”
The second technology day willcontinue with two three-hour semi-nars on “Reliability of Solder Joints”and “DFM for Advanced Manufac -turing.”
Held alongside the solderingseminars, the second technology day,“Substrates — Important Carriers forComponents,” will offer informativeseminars on substrate technologies.In a 90-minute seminar, participantswill learn about recent advancementsin thin- and thick-film technology.
In addition to the four Englishseminars, four special sessions willoffer expertise on these topics. Theattendance of the sessions is includedfor seminar participants, as well asentry to the exhibition and a welcomeparty, which will be held on May 7.
Contact: Mesago MesseFrankfurt GmbH, Rotebühlstr. 83-85, 70178 Stuttgart, Germany % +49-711-61946-0 E-mail: [email protected] Web: www.smt.mesago.com r
Continued on next page
Sept 24-25, 2019, SMTA International. * Donald Stephens Convention Center,
Rosemont, IL. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344
% 952-920-7682 Web: www.smta.org
Santa Monica, CA — BIOMEDeviceBoston is headed to the BostonConvention Center May 15 to 16,2019, offering an extensive exposhowcase of medtech, design engi-neering, and embedded systemsproducts all on a single show floor. Inaddition, visitors will have the oppor-tunity to attend technical sessions,panel discussions and case study pre-sentations lead by industry expertsas part of the event’s two-track con-ference.
BIOMEDevice Boston is part ofthe greater Advanced Manufac turingBoston and runs alongside Design &Manufacturing New England andthe Embedded Systems Conference.
For 2019, BIOMEDevice Bostonwill again partner with the Massa -
chusetts Medical Device IndustryCouncil (MassMEDIC), hosting theassociation’s annual meeting thefirst day of the event at the BostonConvention Center. MassMEDIC isthe largest regional medtech associa-tion in the U.S. and an advocate forthe state’s leadership in the sector.
“Massachusetts is a thrivingmedtech hub, driving innovationwithin multiple therapeutic areas byincorporating advanced materials,new technology and processes intocutting edge devices. At BIO -MEDevice Boston, we will provideprogramming to empower medtechengineers, R&D specialists and otherindustry professionals to achievetheir objectives,” says Amy Sklar,group SVP, Advanced Manufac -
turing Communities, UBM.Over its two-day duration, the
BIOMEDevice Boston conferencewill offer two tracks focusing on dis-tinct subsets: Product Developmentand Research & Development (R&D).Track A, Product Development,emphasizes design and productdevelopment strategies that can helpcompanies create medical devicesand successfully bring them to mar-ket. Topics explored include designmethodologies, miniaturization andbetter practices for speed to marketto improve product development out-comes.
Featured track A sessionsinclude “Cracking InterdisciplinaryChallenges with MIT HackingMedicine Design Thinking Method -
ology,” which will be hosted byShriya Srinivasan, former co-directorof MIT Hacking Medicine, and“Medtech Startup Paradigm: Bring -ing Together Your Team for Speed toMarket,” held by Boris Leschinsky,vice president of product develop-ment, CorInnova, Inc.
Track B sessions include “Inno -vative Biomaterial Solutions withPolyurethanes,” to be held by AjayPadsalgikar, senior principal scientist,global innovation, DSM Biomaterials,and “Exciting, Powerful AI Tools forYour R&D Toolkit,” hosted by SrihariYamanoor, president, DesignAbly.
Contact: UBM, 2901 28thStreet, Suite 100, Santa Monica, CA90405 % 310-445-4200 Web: www.biomedevice.mddionline.com
May, 2019 Page 121www.us- tech.com
its greatest challenges and opportu-nities. Pearson will present “From AIto Uh-Oh — Major Media TrendsShaping Our Future.” Kamen willdiscuss his latest enterprises, includ-ing his Advanced RegenerativeManufacturing Institute to biofabri-cate human organs.
“’Innovation is so hard and sofrustrating, it takes the intersectionsof people with courage, vision andresources,’” says Dave Anderson,president of SEMI Americas, quotingSEMICON West keynote speakerDean Kamen. “There’s no other com-munity like SEMI for advancing theAI era, and the elite keynoters atSEMICON West promise to help theindustry accelerate better businessresults with emerging technologiesand applications.”
SEMICON West is the culmina-tion of seven progressive conferencesthat comprise SEMI’s inauguralTechnology Leadership Series of theAmericas. The year-long series, heldat strategic venues across the U.S., isdesigned to foster discussions aboutshort- and long-term technologyissues critical to the $2 trillion globalelectronics industry.
Themed BEYOND SMART,SEMICON West takes aim at indus-try disruptors with programs andpavilions focused on critical areas ofindustry growth, including smartmanufacturing, smart transportationand workforce development. Eachthemed pavilion will feature a “Meetthe Experts” theater where atten-dees can engage informally withindustry thought leaders.
SEMI® connects more than2,260 member companies and 1.3million professionals worldwide toadvance the technology and businessof electronics manufacturing. SEMImembers are responsible for theinnovations in materials, design,equipment, software, devices, andservices that enable smarter, faster,more powerful, and more affordableelectronic products.
Electronic Sys tem DesignAlliance (ESD Alliance), FlexTech,the Fab Owners Alliance (FOA), andthe MEMS & Sensors IndustryGroup (MSIG) are SEMI StrategicAssociation Part ners, defined com-munities within SEMI focused onspecific technologies.
Contact: SEMI, 673 SouthMilpitas Boulevard, Milpitas, CA95035 % 408-943-6900 fax: 408-943-6986 Web: www.semiconwest.org r
MILWAUKEEWISCONSIN
@ THE WISCONSIN CENTER
MAY8 & 9, 2019
19TH ANNUAL
The NATION’S LARGEST dedicated
WIRE PROCESSING EVENT
MAKE PLANS TO ATTEND NOWRegister Online Today! ElectricalWireShow.com
WORLD CLASS SUPPLIERS & SERVICE COMPANIES EXHIBITING!200+
#1 Reason for Coming Every Year:“ To Gain Information, Knowledge & Wisdom not available anywhere else - including the internet.”
COME MAKE CONNECTIONS. LEAVE WITH SOLUTIONS.It’s been a tradition; now it’s a necessity. The Electrical Wire Processing Industry meets in Milwaukee in May to present, evaluate and embrace new technologies, best practice applications and business growth opportunities.
• Make IPC/WHMA A-620 Work for YouTeresa Rowe, IPC
• Crimping: Beyond the Basics. Preparing for the New RealityTerry Curtis, WireProcess Specialties
• OEE (Overall Equipment Effectiveness) in the Context of Digitization as a Success Factor for CompaniesRob Boyd, Schleuniger Inc
• Trends in OvermoldingSteve Willing, ISC Engineering LLC
Gain valuable industry insight at numerous FREE seminars
Sharpen your technical skills at highly informative workshopsThe Evolution of IPC’s Cable & Harness Documents: IPC-D-620, IPC/WHMA-A-620 and IPC-HDBK-620Course Description: Often the most overlooked, ignored, and “taken for granted” component in a design, the high-quality cables and wiring harnesses, are essential to the performance and reliability of any electrical / electronic system. This presentation will be a detailed, but often light-hearted and realistic, discussion on how the IPC’s cable and harness assembly documents were created.
Register online: www.ipc.org/TechEd19-Milwaukee
Additional workshops and short courses from:Schluenger Inc*, CAMI Research Inc* and El Paso Foreign Trade Zone.
Visit ElectricalWireShow.com for more details.
*Separate registration required.
• Fully Automatic Wire Harness ManufacturingGünther Silberbauer, Komax Solutions
• Large Cable, Large Problems: Considerations for Innovation in the Large Cable MarketTodd Troutman, TE Connectivity
• Interesting and Unusual Applications of Cable and Wire Harness TestingChristopher E. Strangio, CAMI Research Inc
DON’T MISS THE EXPO WHERE YOU CAN DO IT ALL
• Immerse yourself in the broadest range of wire processing solutions from over 200 leading suppliers and manufacturers
• All equipment will be under power for hands-on experience
• Designers of that equipment will be here to reveal insight and advantages
YOUR COMPETITORS WILL BE THERE. WILL YOU?
Questions? Contact Cheryl Luck at 262-367-5500 or [email protected] Admission Online - ElectricalWireShow.com
BIOMEDevice Boston 2019 Announces Conference Content
SEMICON WestKeynote LineupContinued from previous page
Page 122 May, 2019www.us- tech.com
Advertiser..................................Page No. Advertiser..................................Page No. Advertiser...................................Page No.
ADVERTISER’S INDEXACCULOGIC . . . . . . . . . . . . . . . . . . . . . . .37
ACCUTRACE . . . . . . . . . . . . . . . . . . . . . . .123
ACCUTRACE . . . . . . . . . . . . . . . . . . . . . . .124
ACL STATICIDE . . . . . . . . . . . . . . . . . . . .34
ADVANCED INTERCONNECTIONS . . .94
ADVANCED TEST EQPT RENTAL . . . .28
ALLIANCE TECHNOLOGY . . . . . . . . . . .16
AMERICAN HAKKO PRODUCTS . . . . . .21
ANDA TECHNOLOGIES USA . . . . . . . . .43
APEM COMPONENTS . . . . . . . . . . . . . . .13
ASM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ASYS AUTOMATION . . . . . . . . . . . . . . . .72
AVEN TOOL . . . . . . . . . . . . . . . . . . . . . . .48
AVEN TOOL . . . . . . . . . . . . . . . . . . . . . . .49
BOFA AMERICAS . . . . . . . . . . . . . . . . . . .36
BTU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
CAMI RESEARCH . . . . . . . . . . . . . . . . . . .15
CAMI RESEARCH . . . . . . . . . . . . . . . . . . .64
CETAQ . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
CICOIL . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
CINCINNATI SUB ZERO . . . . . . . . . . . . .42
COMET LAB ONE . . . . . . . . . . . . . . . . . . . 5
CONECSUS . . . . . . . . . . . . . . . . . . . . . . . .20
CORELIS . . . . . . . . . . . . . . . . . . . . . . . . . .98
CORNELL DUBILIER . . . . . . . . . . . . . . .109
COUNT ON TOOLS . . . . . . . . . . . . . . . . .30
COUNT ON TOOLS . . . . . . . . . . . . . . . . .37
CYBEROPTICS . . . . . . . . . . . . . . . . . . . . .84
DATA DELAY DEVICES . . . . . . . . . . . . .122
DATEST . . . . . . . . . . . . . . . . . . . . . . . . . . .106
DESIGN-2-PART SHOWS . . . . . . . . . . . .116
DIGI-KEY . . . . . . . . . . . . . . . . . . . . . . . . . .
2
DL TECHNOLOGY . . . . . . . . . . . . . . . . . .72
DOVE ELECTRONIC COMPONENT . . .11
EAO CORPORATION . . . . . . . . . . . . . . . .95
EDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
ELANTAS . . . . . . . . . . . . . . . . . . . . . . . . . .96
ELECTRONIC ASSEMBLY GmbH . . . . .76
ERSA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
EUBANKS ENGINEERING . . . . . . . . . . .59
EXATRON . . . . . . . . . . . . . . . . . . . . . . . . .22
FKN SYSTEK . . . . . . . . . . . . . . . . . . . . . . .102
FOSTER AND JAMES . . . . . . . . . . . . . . .118
FUJI CORPORATION . . . . . . . . . . . . . . . .17
GOWANDA ELECTRONICS . . . . . . . . . .60
HAMMOND MFG . . . . . . . . . . . . . . . . . . .55
HANWHA TECHWIN . . . . . . . . . . . . . . . .35
HEIDENHAIN . . . . . . . . . . . . . . . . . . . . . .31
HELUKABEL . . . . . . . . . . . . . . . . . . . . . . .23
HEMCO . . . . . . . . . . . . . . . . . . . . . . . . . . .108
HENKEL CORPORATION . . . . . . . . . . . .50
HERAEUS ELECTRONICS . . . . . . . . . . .78
HOVER-DAVIS . . . . . . . . . . . . . . . . . . . . .110
ICAPE-DIVSYS . . . . . . . . . . . . . . . . . . . . .12
IMAGINEERING . . . . . . . . . . . . . . . . . . . . 9
INDIUM . . . . . . . . . . . . . . . . . . . . . . . . . . .86
INOVAXE . . . . . . . . . . . . . . . . . . . . . . . . . .63
IPTE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
IRONWOOD ELECTRONICS . . . . . . . . . .116
ITW/EAE . . . . . . . . . . . . . . . . . . . . . . . . . .65
JANOME INDUSTRIAL . . . . . . . . . . . . . .112
JNJ INDUSTRIES . . . . . . . . . . . . . . . . . . .104
JTAG TECHNOLOGIES . . . . . . . . . . . . . .97
JUKI AUTOMATION SYSTEMS . . . . . . .33
KEYSTONE ELECTRONICS . . . . . . . . . .79
KIC THERMAL . . . . . . . . . . . . . . . . . . . . .74
KOH YOUNG . . . . . . . . . . . . . . . . . . . . . . .91
KOKI SOLDER AMERICA . . . . . . . . . . . .80
KOMAX . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
KYZEN . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
MENTOR A SIEMENS BUSINESS . . . . .83
METCAL . . . . . . . . . . . . . . . . . . . . . . . . . . .25
MILL-MAX MFG . . . . . . . . . . . . . . . . . . . .44
MILL-MAX MFG . . . . . . . . . . . . . . . . . . . .45
MIRTEC . . . . . . . . . . . . . . . . . . . . . . . . . . .61
MOLDED FIBERGLASS TRAY . . . . . . . .96
MTA AUTOMATION . . . . . . . . . . . . . . . . .66
MYCRONIC . . . . . . . . . . . . . . . . . . . . . . . .69
NATHAN TROTTER . . . . . . . . . . . . . . . . .27
NEW ENGLAND WIRE TECH . . . . . . . .40
NIHON SUPERIOR . . . . . . . . . . . . . . . . . .90
NIKON . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
NJ MICRO ELECTRONICS TEST . . . . . .110
NORCOM SYSTEMS . . . . . . . . . . . . . . . . .112
NORDSON ASYMTEK . . . . . . . . . . . . . . .39
NORDSON DAGE . . . . . . . . . . . . . . . . . . . 3
NORDSON DAGE . . . . . . . . . . . . . . . . . . .85
NORDSON MARCH . . . . . . . . . . . . . . . . .28
OMRON ELECTRONICS . . . . . . . . . . . . . 8
OPTICAL CONTROL . . . . . . . . . . . . . . . .103
PACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
PANASONIC FACTORY SOLUTIONS . .41
PANAVISE . . . . . . . . . . . . . . . . . . . . . . . . .32
PARA-COAT TECHNOLOGIES . . . . . . . .42
PDR AMERICAS . . . . . . . . . . . . . . . . . . . .18
PI-PHYSIK . . . . . . . . . . . . . . . . . . . . . . . . .56
PICO ELECTRONICS . . . . . . . . . . . . . . . .88
PLASMA ETCH . . . . . . . . . . . . . . . . . . . . .86
POLYONICS . . . . . . . . . . . . . . . . . . . . . . .54
PRO-LINE . . . . . . . . . . . . . . . . . . . . . . . . .60
PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
PVA TEPLA AMERICA . . . . . . . . . . . . . . .104
REHM THERMAL SYSTEMS . . . . . . . . .71
SCHLEUNIGER . . . . . . . . . . . . . . . . . . . .102
SCIENSCOPE . . . . . . . . . . . . . . . . . . . . . .93
SEHO SYSTEMS GmbH . . . . . . . . . . . . . .70
SEICA . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92
SEIKA MACHINERY . . . . . . . . . . . . . . . .54
SHENMAO GROUP . . . . . . . . . . . . . . . . .38
SIERRA ELECTRONICS . . . . . . . . . . . . .45
SIKAMA INTERNATIONAL . . . . . . . . . .100
SIMPLIMATIC AUTOMATION . . . . . . . .101
SMART SONIC . . . . . . . . . . . . . . . . . . . . .67
SMT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
SMT CONNECT . . . . . . . . . . . . . . . . . . . . .114
SOLDERSTAR . . . . . . . . . . . . . . . . . . . . . .94
SONOBOND ULTRASONICS . . . . . . . . . 6
SPEA AMERICA . . . . . . . . . . . . . . . . . . . .82
SPECIALTY COATING SYSTEMS . . . . .58
SUNSTONE CIRCUITS . . . . . . . . . . . . . .19
SUPER PCB . . . . . . . . . . . . . . . . . . . . . . . .36
TECHCON . . . . . . . . . . . . . . . . . . . . . . . . .26
TECHNICA . . . . . . . . . . . . . . . . . . . . . . . .52
TEXMAC . . . . . . . . . . . . . . . . . . . . . . . . . . .34
THE TEST CONNECTION . . . . . . . . . . . .98
THERMALTRONICS . . . . . . . . . . . . . . . . .29
TOMKEN INDUSTRIES . . . . . . . . . . . . . .119
TOPLINE . . . . . . . . . . . . . . . . . . . . . . . . . .122
TOTAL POWER INT'L . . . . . . . . . . . . . . .100
ULTI-MATE CONNECTOR . . . . . . . . . . .88
UNITED RESIN . . . . . . . . . . . . . . . . . . . . .28
US TECH . . . . . . . . . . . . . . . . . . . . . . . . . .118
VI TECHNOLOGY . . . . . . . . . . . . . . . . . . .81
VIRTUAL INDUSTRIES . . . . . . . . . . . . . .105
VISCOM . . . . . . . . . . . . . . . . . . . . . . . . . . .107
VISCOTEC AMERICA . . . . . . . . . . . . . . .24
VJ ELECTRONIX . . . . . . . . . . . . . . . . . . .73
WACKER CHEMICAL . . . . . . . . . . . . . . .53
WEMS ELECTRONICS . . . . . . . . . . . . . .10
WEST-BOND . . . . . . . . . . . . . . . . . . . . . . .30
WHiZZ SYSTEMS . . . . . . . . . . . . . . . . . . .87
WIRE PROCESSING TECH . . . . . . . . . . .121
WURTH ELEKTRONIK . . . . . . . . . . . . . .68
XJTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
YAMAHA . . . . . . . . . . . . . . . . . . . . . . . . . .57
YUDU MEDIA . . . . . . . . . . . . . . . . . . . . . .115
ZOLLER & FROEHLICH GmbH . . . . . . .46
datadelay.com • t 973-773-2299 • f 973-773-9672See at NEPCON China, Booth 1F04 and
SMTconnect, Hall 4A Booth 110
