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December 2006 Rev 4 1/30
30
TSA1203
Dual-channel 12-bit 40Msps 215mW A/D converter
Features■ Low power consumption: 215 mW@40 Msps
■ Single supply voltage: 2.5 V
■ Independent supply for CMOS output stage with 2.5 V/3.3 V capability
■ SFDR = -75 dBc @ Fin = 10 MHz
■ 1GHz analog bandwidth track-and-hold
■ Common clocking between channels
■ Dual simultaneous sample and hold inputs
■ Multiplexed binary word outputs
■ Built-in reference voltage with external bias capability
DescriptionThe TSA1203 is a new generation high-speed, dual-channel analog-to-digital converter implemented in a mainstream 0.25 µm CMOS technology that offers high performance and very low power consumption.
The TSA1203 is specifically designed for applications requiring a very low noise floor, high SFDR and good insulation between channels. It is based on a pipeline structure and digital error correction to provide high static linearity at FS = 40 Msps, and Fin = 10 MHz.
Each channel has an integrated voltage reference to simplify the design and minimize external components. It is nevertheless possible to use the circuit with external references.
The ADC binary word outputs are multiplexed in a common bus with a small number of pins.A tri-state capability is available for the outputs, allowing chip selection. The inputs of the ADC must be differentially driven.
The TSA1203 is available in extended temperature range (-40° C to +85° C), in a small 48-pin TQFP package.
Applications■ Medical imaging and ultrasound
■ 3G base station
■ I/Q signal processing applications
■ High-speed data acquisition systems
■ Portable instrumentation
D0(LSB
)
GN
DBE
D5
D6
D7
D8
D9
D10
D11(MSB)
AVCCB
indexcorner
1
2
3
4
5
6
7
8
9
10
11
32
31
30
29
28
27
26
13 14 15 16 17 18 19 20 21 22
47
25
33
12
23 24
35
34
36
48 44 43 42 41 40 39 38 3746 45
TSA1203
VCCBE
GNDBE
AGND
INI
AGND
AGND
IPOL
AGND
AGND
INBQ
INIB
AGND
INQ
D2
D3
REFM
I
OE
B
AVC
C
REFP
I
INC
MI
AVC
C
VCC
BI
VCC
BI D1
VCC
BE
SELEC
T
CLK
DG
ND
RE
FPQ
AGN
D
AVC
C
DG
ND
DV
CC
DV
CC
INC
MQ
RE
FMQ
GN
DBI
D4
7x7mm TQFP48
CLK
D
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Contents TSA1203
2/30
Contents
1 Schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
8 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1 Additional functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1.1 Output enable mode (OEB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1.2 Select mode (SELECT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.2 References and common mode connection . . . . . . . . . . . . . . . . . . . . . . . 16
8.2.1 Internal reference and common mode . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.2.2 External reference and common mode . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.3 Driving the differential analog inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8.4 Clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.5 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.6 Layout precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.7 EVAL1203/BA evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.7.1 Evaluation board operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.7.2 Consumption adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.7.3 Single and differential inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.7.4 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9 Practical application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9.1 Digital interface applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9.2 Medical imaging applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
TSA1203 Contents
3/30
10 Definitions of specified parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Static parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Dynamic parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
11.1 TQFP48 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
12 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Schematic diagram TSA1203
4/30
1 Schematic diagram
Figure 1. TSA1203 block diagram
Figure 2. Timing diagram
Timing
BuffersIPOL
CLK+2.5V/3.3V
VINI
VINBI
OEB
VINCMI
GND
VINQ
VINBQ
VINCMQ
AD 12I channel
AD 12Q channel
12
12 12
12
MUX
REF I
REF Q
SELECT
VREFPI
VREFPQ
Polar.
VREFMI
VREFMQ
common mode
common mode
D0TOD11
VCCBE
GNDBE
N-1N
N+1
N+6
N+7N+2
N+5
N+3
N+4
N+8
CLK
Tpd I + Tod
N+9N+10
N+11
N+12N+13
DATAOUTPUT
sample N+1I channel
sample NQ channel
sample N+1Q channel
sample N+2I channel
sample N+2Q channel
sample N+3I channel
OEB
Simultaneous sampling on I/Q channels
SELECT
sample N-9I channel
sample N-8I channel
sample N-7Q channel
sample N-6Q channel
CLOCK AND SELECT CONNECTED TOGETHER
Tod
I
Q
TSA1203 Pin descriptions
5/30
2 Pin descriptions
Table 1. Pin descriptions (TQFP48 package)Pin nb
Name Description ObservationPin nb
Name Description Observation
1 AGND Analog ground 0 V 25 GNDBE Digital buffer ground 0 V
2 INII channel analog input
26 VCCBEDigital buffer power supply
2.5 V/3.3 V
3 AGND Analog ground 0 V 27D11(MS
B)Most significant bit output
CMOS output (2.5 V/3.3 V)
4 INBII channel inverted analog input
28 D10 Digital outputCMOS output (2.5 V/3.3 V)
5 AGND Analog ground 0 V 29 D9 Digital outputCMOS output (2.5 V/3.3 V)
6 IPOLAnalog bias current input
30 D8 Digital outputCMOS output (2.5 V/3.3 V)
7 AVCC Analog power supply 2.5 V 31 D7 Digital outputCMOS output (2.5 V/3.3 V)
8 AGND Analog ground 0 V 32 D6 Digital outputCMOS output (2.5 V/3.3 V)
9 INQQ channel analog input
33 D5 Digital outputCMOS output (2.5 V/3.3 V)
10 AGND Analog ground 0 V 34 D4 Digital outputCMOS output (2.5 V/3.3 V)
11 INBQQ channel inverted analog input
35 D3 Digital outputCMOS output (2.5 V/3.3 V)
12 AGND Analog ground 0 V 36 D2 Digital outputCMOS output (2.5 V/3.3 V)
13 REFPQQ channel top reference voltage
37 D1 Digital outputCMOS output (2.5 V/3.3 V)
14 REFMQQ channel bottom reference voltage
0 V 38 D0(LSB)Least significant bit output
CMOS output (2.5 V/3.3 V)
15 INCMQQ channel input common mode
39 VCCBEDigital buffer power supply
2.5 V/3.3 V - see Table 14.
16 AGND Analog ground 0 V 40 GNDBE Digital buffer ground 0 V
17 AVCC Analog power supply 2.5 V 41 VCCBIDigital buffer power supply
2.5 V
18 DVCC Digital power supply 2.5 V 42 CLKD Data clock inputIdle at high level2.5 V or 3.3 V
19 DGND Digital ground 0 V 43 OEB Output enable input2.5 V/3.3 V CMOS input
20 CLK Clock input2.5 V CMOS
input44 AVCC
Analog power supply
2.5 V
21 SELECT Channel selection2.5 V CMOS
input45 AVCC
Analog power supply
2.5 V
22 DGND Digital ground 0 V 46 INCMII channel input common mode
23 DVCC Digital power supply 2.5 V 47 REFMII channel bottom reference voltage
0 V
24 GNDBI Digital buffer ground 0 V 48 REFPII channel top reference voltage
Dynamic characteristics TSA1203
6/30
3 Dynamic characteristics
Dynamic characteristics are measured under the following conditions, unless otherwise specified: AVCC = DVCC = VCCB = 2.5 V, FS = 40 Msps, Fin=10.13 MHz, Vin@ -1 dBFS, VREFP=0.8 V, VREFM=0 V, Tamb = 25° C.
4 Timing characteristics
Timing characteristics are measured under the following conditions, unless otherwise specified: AVCC = DVCC = VCCB = 2.5 V, FS = 40 Msps, Fin=10.13 MHz, Vin@ -1 dBFS, VREFP=0.8 V, VREFM=0 V, Tamb = 25° C.
Table 2. Dynamic characteristics
Symbol Parameter Min Typ Max Unit
SFDR Spurious free dynamic range -75 -59.5 dBc
SNR Signal to noise ratio 60.7 67 dB
THD Total harmonics distortion -73 -58 dBc
SINAD Signal to noise and distortion ratio 56.5 66 dB
ENOB Effective number of bits 9.1 10.8 bits
Table 3. Timing characteristics
Symbol ParameterTest
conditionsMin Typ Max Unit
FS Sampling frequency 0.5 40 MHz
DC Clock duty cycle 45 50 55 %
TC1 Clock pulse width (high) 22.5 25 ns
TC2 Clock pulse width (low) 22.5 25 ns
TodData output delay (clock edge to data valid)
10 pF load capacitance
9 ns
Tpd I Data pipeline delay for I channel 7 cycles
Tpd Q Data pipeline delay for Q channel 7.5 cycles
TonFalling edge of OEB to digital output valid data
1 ns
ToffRising edge of OEB to digital output tri-state
1 ns
TSA1203 Absolute maximum ratings
7/30
5 Absolute maximum ratings
6 Operating conditions
Table 4. Absolute maximum ratings
Symbol Parameter Values Unit
AVCC Analog supply voltage (1)
1. All voltage values, except differential voltage, are with respect to network ground terminal. The magnitude of input and output voltages must not exceed -0.3 V or VCC.
0 to 3.3 V
DVCC Digital supply voltage (1) 0 to 3.3 V
VCCBE Digital buffer supply voltage (1) 0 to 3.6 V
VCCBI Digital buffer supply voltage (1) 0 to 3.3 V
IDout Digital output current -100 to 100 mA
Tstg Storage temperature -65 to +150 °C
ESDHBM: human body model(2)
2. Electrostatic discharge pulse (ESD pulse) simulating a human body discharge of 100 pF through 1.5 kΩ..
2kV
CDM: charged device model(3)
3. Discharge to ground of a device that has been previously charged.
1.5
Latch-up Class(4)
4. ST Microelectronics corporate procedure number 0018695.
A
Table 5. Operating conditions
Symbol Parameter Min Typ Max Unit
AVCC Analog supply voltage 2.25 2.5 2.7 V
DVCC Digital supply voltage 2.25 2.5 2.7 V
VCCBE External digital buffer supply voltage 2.25 2.5 3.5 V
VCCBI Internal digital buffer supply voltage 2.25 2.5 2.7 V
VREFP I VREFP Q
Forced top voltage reference 0.94 1.5 V
VREFM I VREFM Q
Forced bottom reference voltage 0 0.4 V
VINCM IVINCM Q
Forced input common mode voltage 0.2 1 V
Electrical characteristics TSA1203
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7 Electrical characteristics
Electrical characteristics, unless otherwise specified, are measured at AVCC = DVCC = VCCB = 2.5 V, FS = 40 Msps, Rpol = 18 kΩ, Fin = 2 MHz, Vin@ -1 dBFS, VREFP=0.8 V, VREFM=0 V, and Tamb = 25° C.
Table 6. Analog inputs
Symbol ParameterTest
conditionsMin Typ Max Unit
VIN-VINB Full scale reference voltageDifferential inputs mandatory
1.1 2.0 2.8 Vpp
Cin Input capacitance 7.0 pF
Req Equivalent input resistor 10 kΩ
BW Analog input bandwidthVin@full scale, Fs=40 Msps
1000 MHz
ERB Effective resolution bandwidth 70 MHz
Table 7. Digital inputs and outputs
Symbol ParameterTest
conditionsMin Typ Max Unit
Clock and Select inputs
VIL Logic "0" voltage 0 0.8 V
VIH Logic "1" voltage 2.0 2.5 V
OEB input
VIL Logic "0" voltage 0 0.25 x VCCBE V
VIH Logic "1" voltage 0.75 x VCCBE VCCBE V
Digital outputs
VOL Logic "0" voltage IOL=10 µA 0 0.1 x VCCBE V
VOH Logic "1" voltage IOH=10 µA 0.9 x VCCBE VCCBE V
IOZHigh impedance leakage current
OEB set to VIH
-1.67 0 1.67 µA
CLOutput load capacitance
15 pF
Table 8. Reference voltage
Symbol Parameter Min Typ Max Unit
VREFP I
VREFP QTop internal reference voltage 0.81 0.88 0.94 V
VINCM I
VINCM QInput common mode voltage 0.41 0.46 0.50 V
TSA1203 Electrical characteristics
9/30
Table 9. Power consumption
Symbol Parameter Min Typ Max Unit
ICCA Analog supply current 76 96.5 mA
ICCD Digital supply current 3.5 4.9 mA
ICCBE Digital buffer supply current (10 pF load) 6 9.4 mA
ICCBI Digital buffer supply current 100 440 µA
Pd Power consumption in normal operation mode 215 271 mW
Rthja Thermal resistance (TQFP48) 80 °C/W
Table 10. Accuracy
Symbol Parameter Min Typ Max Unit
OE Offset error 2.97 LSB
GE Gain error 0.1 %
DNL Differential non linearity ±0.52 LSB
INL Integral non linearity ±3 LSB
- Monotonicity and no missing codes Guaranteed
Table 11. Matching between channels
Symbol Parameter Min Typ Max Unit
GM Gain match 0.04 1 %
OM Offset match 0.88 LSB
PHM Phase match 1 dg
XTLK Crosstalk rejection 85 dB
Electrical characteristics TSA1203
10/30
Figure 3. Static parameter: integral non linearity(a)
FS = 40 Msps, ICCA = 60 mA, Fin = 2 MHz
Figure 4. Static parameter: differential non linearity(a)
Fs = 40 Msps, ICCA = 60 mA, Fin = 2 MH
a. For parameter definitions, see Section 10: Definitions of specified parameters on page 25.
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
0 500 1000 1500 2000 2500 3000 3500 4000
Output Code
INL
(L
SB
s)
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0 500 1000 1500 2000 2500 3000 3500 4000
Output Code
DN
L (
LS
Bs)
TSA1203 Electrical characteristics
11/30
Figure 5. Linearity vs. FSFin = 5MHz
Figure 6. Distortion vs. FSFin = 5MHz
55
60
65
70
75
80
35 40 45 50
Fs (MHz)
Dyn
amic
par
amet
ers
(dB
)
7
7.5
8
8.5
9
9.5
10
10.5
11
11.5
12
EN
OB
(b
its)
ENOB_I
SINAD_I
ENOB_Q
SNR_Q
SINAD_Q
SNR_I
-100
-90
-80
-70
-60
-50
-40
35 40 45 50
Fs (MHz)
Dyn
amic
par
amet
ers
(dB
c)
THD_ISFDR_I
THD_QSFDR_Q
Figure 7. Linearity vs. FinFS= 40MHz, ICCA = 60mA
Figure 8. Distortion vs. FinFS= 40MHz, ICCA = 60mA
50
55
60
65
70
75
80
85
90
0 20 40 60 80
Fin (MHz)
Dyn
amic
par
amet
ers
(dB
)
6
7
8
9
10
11
12
EN
OB
(b
its)
ENOB_Q
SINAD_QSINAD_I
SNR_QSNR_I
ENOB_I
-100
-90
-80
-70
-60
-50
-40
0 20 40 60 80
Fin (MHz)
Dyn
amic
par
amet
ers
(dB
c)
SFDR_I
SFDR_Q
THD_I
THD_Q
Figure 9. Linearity vs. temperatureFS=40MHz, ICCA=60mA, Fin=2MHz
Figure 10. Distortion vs. temperatureFS=40Msps, ICCA=60mA, Fin=2MHz
50
55
60
65
70
75
80
85
90
-40 10 60 110
Temperature (°C)
Dyn
amic
par
amet
ers
(dB
)
4
5
6
7
8
9
10
11
12
EN
OB
(b
its)
SINAD_QSNR_Q
ENOB_Q
ENOB_I
SNR_ISINAD_I
50
55
60
65
70
75
80
85
90
95
100
-40 10 60 110
Temperature (°C)
Dyn
amic
par
amet
ers
(dB
c)
THD_Q
SFDR_Q
THD_ISFDR_I
Electrical characteristics TSA1203
12/30
Figure 11. Linearity vs. AVCCFS=40Msps, ICCA=60mA, Fin=10MHz
Figure 12. Distortion vs. AVCCFS=40Msps, ICCA=60mA, Fin=10MHz
50
52
54
56
58
60
62
64
66
68
70
2.25 2.35 2.45 2.55 2.65
AVCC (V)
Dyn
amic
par
amet
ers
(dB
)
9
9.5
10
10.5
11
11.5
12
EN
OB
(b
its)
SINAD_I
ENOB_I
SNR_I
SNR_Q
ENOB_Q
SINAD_Q
-100
-95
-90
-85
-80
-75
-70
-65
-60
-55
-50
2.25 2.35 2.45 2.55 2.65
AVCC (V)
Dyn
amic
Par
amet
ers
(dB
c)
SFDR_QSFDR_I
THD_Q
THD_I
Figure 13. Linearity vs. DVCCFS=40Msps, ICCA=60mA, Fin=10MHz
Figure 14. Distortion vs. DVCCFS=40Msps, ICCA=60mA, Fin=10MHz
50
52
54
56
58
60
62
64
66
68
70
2.25 2.35 2.45 2.55 2.65
DVCC (V)
Dyn
amic
par
amet
ers
(dB
)
9
9.5
10
10.5
11
11.5
12
EN
OB
(b
its)
SINAD_I
ENOB_I
SNR_I
SNR_Q
ENOB_Q
SINAD_Q
-90
-85
-80
-75
-70
-65
-60
-55
-50
2.25 2.35 2.45 2.55 2.65
DVCC (V)
Dyn
amic
Par
amet
ers
(dB
c)
SFDR_QSFDR_I
THD_QTHD_I
Figure 15. Linearity vs. VCCBIFS=40Msps, ICCA=60mA, Fin=10MHz
Figure 16. Distortion vs.VCCBIFS=40Msps, ICCA=60mA, Fin=10MHz
50
52
54
56
58
60
62
64
66
68
70
2.25 2.35 2.45 2.55 2.65
VCCBI (V)
Dyn
amic
par
amet
ers
(dB
)
9
9.5
10
10.5
11
11.5
12
EN
OB
(b
its)
SINAD_I
ENOB_I
SNR_I
SNR_Q
ENOB_Q
SINAD_Q
-90
-85
-80
-75
-70
-65
-60
-55
-50
2.25 2.35 2.45 2.55 2.65
VCCBI (V)
Dyn
amic
Par
amet
ers
(dB
c)
SFDR_QSFDR_I
THD_QTHD_I
TSA1203 Electrical characteristics
13/30
Figure 17. Linearity vs. VCCBEFS=40Msps, ICCA=60mA, Fin=5MHz
Figure 18. Distortion vs. VCCBEFS=40Msps, ICCA=60mA, Fin=5MHz
60
61
62
63
64
65
66
67
68
69
70
2.25 2.75 3.25
VCCBE (V)
Dyn
amic
par
amet
ers
(dB
)
8
8.5
9
9.5
10
10.5
11
11.5
12
EN
OB
(b
its)
SINAD_I
ENOB_I
SNR_ISNR_Q
ENOB_Q
SINAD_Q
-110
-100
-90
-80
-70
-60
-50
-40
2.25 2.75 3.25
VCCBE (V)
Dyn
amic
Par
amet
ers
(dB
c)
SFDR_Q SFDR_I
THD_QTHD_I
Figure 19. Linearity vs. duty cycleFS=40MHz, ICCA=60mA, Fin=5MHz
Figure 20. Distortion vs. duty cycleFS=40MHz, ICCA=60mA, Fin=5MHz
40
50
60
70
80
90
100
48 49 50 51 52
Positive Duty Cycle (%)
Dyn
amic
par
amet
ers
(dB
)
4
5
6
7
8
9
10
11
12
EN
OB
(b
its)
SINAD_Q
SNR_Q
ENOB_Q
ENOB_I
SNR_I SINAD_I
-100
-90
-80
-70
-60
-50
-40
48 49 50 51 52
Positive Duty Cycle (%)
Dyn
amic
par
amet
ers
(dB
c)
THD_QSFDR_Q
THD_ISFDR_I
Electrical characteristics TSA1203
14/30
Figure 21. Single-tone 8K FFT at 40 Msps - Channel Q Fin = 5MHz, ICCA = 60mA, Vin@-1dBFS
Figure 22. Dual-tone 8K FFT at 40Msps - Channel Q Fin1 = 0.93MHz, Fin2 = 1.11MHz, ICCA = 70mA, Vin1@-7dBFS, Vin2@-7dBFS, IMD = -69dBc
2 4 6 8 12 14 16 18 2010
-20
-40
-60
-100
-80
-140
0
-120
Frequency (MHz)
Pow
er s
pect
rum
(dB
)
2.5 5 7.5 10 15 17.5 2012.5
-20
-40
-60
-100
-80
0
-120
Frequency (MHz)
Pow
er s
pect
rum
(dB
)
TSA1203 Application information
15/30
8 Application information
The TSA1203 is a dual-channel, 12-bit resolution high speed analog-to-digital converter based on a pipeline structure and deep sub-micron CMOS process to achieve the best performance in terms of linearity and power consumption.
Each channel achieves 12-bit resolution through the pipeline structure which consists of 12 internal conversion stages in which the analog signal is fed and sequentially converted into digital data. A latency time of 7 clock periods is necessary to obtain the digitized data on the output bus.
The input signals are simultaneously sampled, for both channels, on the rising edge of the clock. The output data is delivered on the rising edge of the clock for channel I, and on the falling edge of the clock for channel Q, as shown in Figure 2: Timing diagram on page 4. The digital data produced at the various stages must be time-delayed according to the order of conversion. Finally, a digital data correction completes the processing and ensures the validity of the ending codes on the output bus.
The TSA1203 is pin-to-pin compatible with the dual 10 bits/20 Msps TSA1005-20, the dual 10 bits /40 Msps TSA1005-40 and the dual 12 bits/ 20 Msps TSA1204.
8.1 Additional functionsTo simplify the application board as much as possible, the following operating modes are provided:
● Output enable (OEB) mode
● Select mode
8.1.1 Output enable mode (OEB)
When set to low level (VIL), all digital outputs remain active and are in low impedance state. When set to high level (VIH), all digital output buffers are in high impedance state while the converter goes on sampling. When OEB is set to a low level again, the data arrives on the output with a very short Ton delay. This mechanism allows the chip select of the device.
Figure 2: Timing diagram on page 4 summarizes this functionality.
If you do not want to use OEB mode, the OEB pin should be grounded through a low value resistor.
8.1.2 Select mode (SELECT)
The digital data output from each of the ADC cores is multiplexed to share the same output bus. This prevents an increase in the number of pins and allows to use the same package as for a single-channel ADC like the TSA1201.
The information channel is selected with the "SELECT" pin. When set to high level (VIH), the channel I data is present on the D0-D11 output bus. When set to low level (VIL), the channel Q data is delivered on D0-D11.
By connecting SELECT to CLK, channel I and channel Q are simultaneously present on D0-D11, channel I on the rising edge of the clock and channel Q on the falling edge of the clock. (refer to Figure 2: Timing diagram on page 4).
Application information TSA1203
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8.2 References and common mode connectionVREFM must always be connected directly to ground externally for most applications.
8.2.1 Internal reference and common mode
In the default configuration, the ADC operates with its own reference and common mode voltages generated by its internal bandgap. It is recommended to decouple the VREFP and INCM pins in order to minimize low and high frequency noise (see Figure 23).
Figure 23. Internal reference and common mode setting
8.2.2 External reference and common mode
Each of the voltages VREFP, VREFM and INCM can be fixed externally to better fit the application needs (refer to Table 5: Operating conditions on page 7 for min/max values). It is possible to use an external reference voltage device for specific applications requiring even better linearity, accuracy or enhanced temperature behavior.
The VREFP and VREFM voltages set the analog dynamic range at the input of the converter that has a full scale amplitude of 2*(VREFP-VREFM).
The INCM voltage is half the value of VREFP-VREFM.
The best signal-to-noise performance is achieved with a dynamic range at its maximum value. To obtain this, VREFM can be connected to GND, and VREFP can be set up to 1.5 V maximum. However, signal to noise performance is a trade-off with the THD, with a possibility of degraded THD under these conditions.
To obtain the highest performance from the TSA1203 device, we recommend implementing the configuration shown in Figure 24 with the STMicroelectronics TS821 or TS4041-1.2 Vref.
TSA1203VIN
VINBVREFM
0.89V
VREFP330pF 4.7μF10nF
INCM330pF 4.7μF10nF
0.46V
TSA1203 Application information
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Figure 24. External reference setting
8.3 Driving the differential analog inputsThe TSA1203 is designed to deliver optimum performance when driven on differential inputs. An RF transformer is an efficient way of achieving this high performance.
Figure 25 describes the schematics. The input signal is fed to the primary of the transformer, while the secondary drives both ADC inputs. The common mode voltage of the ADC (INCM) is connected to the center-tap of the secondary of the transformer in order to bias the input signal around this common voltage, internally set to 0.46V. It determines the DC component of the analog signal. Being a high-impedance input, it acts as an I/O and can be externally driven to adjust this DC component. The INCM is decoupled to maintain a low noise level on this node. Our evaluation board is mounted with a 1:1 ADT1-1WT transformer from Mini circuits. You might also use a higher impedance ratio (1:2 or 1:4) to reduce the driving requirement on the analog source.
Each analog input can drive a 1.4 Vpp amplitude input signal, so the resulting differential amplitude is 2.8 Vpp.
Figure 25. Differential input configuration with transformer
1kΩ
TSA1203VIN
VINBVREFM
VREFP
externalreference
VCCA
330pF 4.7μF10nF
TS821TS4041
1.2V
TSA1203VIN
VINBINCM
50Ω 33pF
330pF 470nF10nF
Analog source 1:1ADT1-1
channelsI or Q
Application information TSA1203
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Figure 26. AC-coupled differential input
Figure 26 represents the biasing of a differential input signal in an AC-coupled differential input configuration. Both inputs VIN and VINB are centered around the common mode voltage, which can be left internal, or fixed externally.
Figure 27. DC-coupled 2 Vpp differential analog input
Figure 27 shows a DC-coupled configuration with forced VREFP and INCM to the 1V DC analog input while VREFM is connected to ground; the differential amplitude obtained is 2 Vpp.
8.4 Clock inputThe quality of your TSA1203 converter is very dependent on your clock input accuracy, in terms of aperture jitter; the use of a low jitter crystal controlled oscillator is recommended.
Further points to consider in your implementation are:
● The duty cycle must be between 45% and 55%.
● The clock power supplies must be independent from the ADC output supplies to avoid digital noise modulation on the output.
● When powered-on, the circuit needs several clock periods to reach its normal operating conditions. Therefore, it is recommended to keep the circuit clocked to avoid random states before applying the supply voltages.
50Ω 10nF
TSA1203
VIN
VINB
INCM33pF100kΩ
100kΩ
50Ω 10nF
commonmode
TSA1203
VIN
VINBINCM
330pF 4.7µF10nF
analog
DC
AC+DC VREFP
VREFM
VREFP-VREFM = 1 V
DC
analog
VINCM = 0.5 V
TSA1203 Application information
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8.5 Power consumption optimizationThe internal architecture of the TSA1203 makes it possible to optimize power consumption according to the sampling frequency of the application. For this purpose, an external resistor is placed between IPOL and the analog ground pins. Therefore, the total dissipation can be optimized over the full sampling range (0.5 Msps to 40 Msps).
The TSA1203 combines the highest performance with the lowest consumption at 40 Msps when Rpol is equal to 18 kΩ. This value is nevertheless dependent on the application and the environment.
In the lower sampling frequency range, this value of resistor may be adjusted in order to decrease the analog current without any degradation of dynamic performance.
Table 12 gives some values to illustrate this.
8.6 Layout precautionsTo use the ADC circuits most efficiently at high frequencies, some precautions have to be taken for power supplies:
● The implementation of 4 proper separate supplies and ground planes (analog, digital, internal and external buffer ones) on the PCB is mandatory for high speed circuit applications to provide low inductance and low resistance common return.
The separation of the analog signal from the digital output part is essential to prevent noise from coupling onto the input signal. The best compromise is to connect AGND, DGND, GNDBI in a common point whereas GNDBE must be isolated. Similarly, the AVCC, DVCC and VCCBI power supplies must be separate from the VCCBE power supply.
● Power supply bypass capacitors must be placed as close as possible to the IC pins in order to improve high frequency bypassing and reduce harmonic distortion.
● All inputs and outputs must be properly terminated with output termination resistors; thus, the amplifier load is resistive only and the stability of the amplifier is improved. All leads must be wide and as short as possible especially for the analog input in order to decrease parasitic capacitance and inductance.
● To keep the capacitive loading as low as possible at digital outputs, short lead lengths of routing are essential to minimize currents when the output changes. To minimize this output capacitance, use buffers or latches close to the output pins.
● Choose component sizes as small as possible (SMD).
Table 12. Total power consumption optimization depending on Rpol value
FS (Msps) 30 35 40
Rpol (kΩ) 38 28 18
Optimized power (mW) 145 180 215
Application information TSA1203
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8.7 EVAL1203/BA evaluation boardThe EVAL1203/BA is a 4-layer board with high decoupling and grounding level. The schematic of the board is shown in Figure 30 and its top overlay view in Figure 29. The board has been characterized with a fully devoted ADC test bench as shown in Figure 28.
All characterization measurements are made with:
■ SFSR=1 dB for static parameters,
■ SFSR=-1 dB for dynamic parameters.
Figure 28. Analog to digital converter characterization bench
Note: The analog input signal must be filtered to be very pure. The dataready signal is the acquisition clock of the logic analyzer. The ADC digital outputs are latched by the octal buffers 74LCX573.
Figure 29. Evaluation board printed circuit
Sine Wave Generator
HP8644
ADC evaluation
board
Pulse Generator
Logic Analyzer
Sine Wave GeneratorHP8644
HP8133
Vin
Clk
Data
Clk
PC
TSA1203 Application information
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Figure 30. TSA1203 evaluation board schematic
RI1
50
R2 1K
R3
50
CI1
33pF
C2 330p
F
C3 470n
F
C4 10nF
CI8
330p
F
CI9
10nF
CI10
470n
FCI
11
330p
F
CI12
10nF
CI13
470n
F
C14
330p
F
C15
10nF
C16
470n
F
Raj1
47K
C17
330p
F
C18
10nF
C19
470n
F
J4 CLK
OEB
1
D0
2
D1
3
D2
4
D3
5
D4
6
D5
7
D6
8
D7
9
GN
D10
LE11
Q0
19
Q1
18
Q2
17
Q3
16
Q4
15
Q5
14
Q6
13
Q7
12
VCC
20
U2
74LC
X57
3
OEB
1
D0
2
D1
3
D2
4
D3
5
D4
6
D5
7
D6
8
D7
9
GN
D10
LE11
Q0
19
Q1
18
Q2
17
Q3
16
Q4
15
Q5
14
Q6
13
Q7
12
VCC
20
U3
74LC
X57
3
R11
47K
C25
330p
F
C27
10nF
C28
470n
F
+
C29
10µF
DO D7
D8
D9
D10
D11
CI30
330p
F
CI31
10nF
CI32
470n
F
+
C34
47µF
+
C35
47µF
AV
CC
VCC
B2
VCC
B1
C26
330p
F
C39
10nF
C37
470n
F
VCC
B3
C33
330p
F
C40
10nF
C38
470n
F
C41
10µF
+C4
247
µF
CLK
D1
D2
D3
D4
D5
D6
C20
330p
F
C21
10nF
C22
470n
F
C23
10µF
+
C36
47µF
1
43
26TI
2
T2-A
T1-1
WT
JI1B
InIB
R5 50
J25
CKD
ATA
12
J27
CON
2
RI19
50
S4SW
-SPS
TVCC
B1
GndB1VccB1GndB2VccB2GndB3VccB3
J17
BUFP
OW
D0
GN
D
D1
GN
D
D2
GN
D
D3
GN
D
D4
GN
D
D5
GN
D
D6
GN
D
D7
GN
D
D8
GN
D
D9
GN
D
D10
GN
D
D11
GN
D
CLK
GN
D
AV
CC
C5
100n
F
CI6
NM
VCC
B2
C51
330p
F
C52
10nF
C53
470n
FRS
I5 0 N
CRS
I6 0
RSI7
0
RSI8
0 RSI9
0 N
C
NM
: non
soud
éan
alog
inpu
tw
ith tr
ansf
orm
er (d
efau
lt)RS
5 R
S6 R
S7 R
S8 R
S9
C
C
C
C
C
C
C
sin
gle
inpu
tdi
ffer
entia
l inp
ut
12
J26
CON
2
AG
ND
1
INI
2
AG
ND
3
INBI
4
AG
ND
5
IPO
L6
AV
CC7
AG
ND
8
INQ
9
AG
ND
10
INBQ
11
AG
ND
12
REFPQ 13
REFMQ 14
INCMQ 15
AGND 16
AVCC 17
DVCC 18
DGND 19
CLK 20
SELECT 21
DGND 22
DVCC 23
GNDBI 24
GN
DBE
25V
CCBE
26D
11(M
SB)
27D
1028
D9
29D
830
D7
31D
632
D5
33D
434
D3
35D
236
D137 D0(LSB)38 VCCBE39 GNDBE40 VCCBI41 VCCBI42 OEB43 AVCC44 AVCC45 INCMI46 REFMI47 REFPI48
8-14
bits
AD
C
J9
AD
C D
UA
L12B CD
333
0pF
CD2
10nF
CD1
470n
F
1 Q
RQ1
50
CQ1
33pF
CQ8
330p
F
CQ9
10nF
CQ10
470n
F
CQ11
330p
F
CQ12
10nF
CQ13
470n
FCQ
30
330p
F
CQ31
10nF
CQ32
470n
F
1
43
26TQ
2
T2-A
T1-1
WT
JQ1B
InQ
B
RQ19
50
CQ6
NM
RSQ
5
0 N
CRS
Q6
0
RSQ
7
0 RSQ
8
0
RSQ
9
0 N
C
AV
CC
C10
330p
F
C11
10nF
C13
470n
F
C31
10µF
+
C32
47µF
DV
CC
DV
CCDV
cc
R21
0NM
R22
0NM
R23
0NM
R24
0NM
REFPREFMINCM
JI2
VRE
FI
REFPREFMINCM
JQ2
VRE
FQ
GN
DV
CCJA AN
ALO
GIC
GNDVCC
JDDIG
ITA
L
VCC
B1
SW1
S5 SW-S
PST
IN Vcc
GN
DS1S2 D
U1
STG
719
VCC
B2
VCC
B2
R12
47K
C43
10µF
+
C44
47µF
VCC
B3
VCC
B2Sw
itch
S4
O
EB M
ode
Ope
n
N
orm
al m
ode
Shor
t
H
igh
Impe
danc
e ou
tput
mod
e
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
J6
Switc
h S5
O
pen
Nor
mal
mod
e
Sh
ort
Test
mod
e
CLKD
Application information TSA1203
22/30
Table 13. Printed circuit board — list of components
8.7.1 Evaluation board operating conditions
Name Footprint Name Footprint Name Footprint Name Part FootprintType
RSQ6 0 805 CD2 10nF 603 C26 330pF 603 CQ6 NC 805RSQ7 0 805 C40 10nF 603 C20 330pF 603 CI6 NC 805RSQ8 0 805 C39 10nF 603 C33 330pF 603 U2 74LCX573 TSSOP20RSI6 0 805 CQ12 10nF 603 C25 330pF 603 U3 74LCX573 TSSOP20RSI7 0 805 CQ9 10nF 603 CI1 33pF 603 U1 STG719 SOT23-6RSI8 0 805 C52 10nF 603 CQ1 33pF 603 JA ANALOGIC connectorR3 47 603 C18 10nF 603 C34 47µF RB.1 J17 BUFPOW connectorR5 47 603 C21 10nF 603 C42 47µF RB.1 J25 CKDATA SMARQ19 47 603 C4 10nF 603 C35 47µF RB.1 J4 CLK SMARI1 47 603 C15 10nF 603 C44 47µF RB.1 J27 CON2 SIP2RQ1 47 603 C27 10nF 603 C36 47µF RB.1 J26 CON2 SIP2 RI19 47 603 C11 10nF 603 C32 47µF RB.1 JD DIGITAL connectorRSI9 0NC 805 CI9 10nF 603 C37 470nF 805 JI1 InI SMARSQ5 0NC 805 CI12 10nF 603 CQ10 470nF 805 JI1B InIB SMARSQ9 0NC 805 CI31 10nF 603 C28 470nF 805 JQ1 InQ SMARSI5 0NC 805 CQ31 10nF 603 CI10 470nF 805 JQ1B InQB SMAR24 0NC 805 CQ30 330pF 603 CQ32 470nF 805 SW1 SWITCH connectorR23 0NC 805 CI11 330pF 603 CQ13 470nF 805 S5 SW-SPST connectorR21 0NC 805 C51 330pF 603 CI32 470nF 805 S4 SW-SPST connectorR22 0NC 805 C2 330pF 603 C13 470nF 805 TI2 T2-AT1-1WT ADTR2 1K 603 C17 330pF 603 C53 470nF 805 TQ2 T2-AT1-1WT ADTR12 47K 603 CD3 330pF 603 C16 470nF 805 JI2 VREFI connectorR11 47K 603 C10 330pF 603 C3 470nF 805 JQ2 VREFQ connectorRaj1 200K CQ8 330pF 603 C22 470nF 805 J6 32Pin
CQ11 330pF 603 CI13 470nF 805C23 10µF 1210 CI8 330pF 603 C38 470nF 805C41 10µF 1210 C14 330pF 603 CD1 470nF 805 NC: non solderedC29 10µF 1210 CI30 330pF 603 C19 470nF 805
VR5 trimmer
IDC-32 connector
Part Type
Part Type
Part Type
Table 14. Board connections for power supplies and other pins
Board marking Connection Internal voltage (V) External voltage (V)
AV AVCC 2.5
AG AGND 0
RPI REFPI 0.89 <1.4
RMI REFMI <0.4
CMI INCMI 0.46 <1
RPQ REFPQ 0.89 <1.4
RMQ REFMQ <0.4
CMQ INCMQ 0.46 <1
DV DVCC 2.5
DG DGND 0
GB1 GNDBI 0
VB1 VCCBI 2.5
GB2 GNDBE 0
TSA1203 Application information
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Caution: Do not use the VB3 power supply (5 V) dedicated to the 74LCX573 external buffers to supply the VB2 of the TSA1203 which cannot exceed 3.3 V.
8.7.2 Consumption adjustment
Before beginning characterization tests, make sure to adjust the Rpol (Raj1), and therefore Ipol value, according to your sampling frequency.
8.7.3 Single and differential inputs
The test board can be driven on a single analog input, or on differential inputs. With a single analog input, you must use the ADT1-1WT transformer to generate a differential signal. In this configuration, the resistors RSI6, RSI7, RSI8 for channel I (respectively RSQ6, RSQ7, RSQ8 for channel Q) are connected as short-circuits whereas RSI5, RSI9 (respectively RSQ5, RSQ9 for channel Q) are open circuits.
Alternatively, you can use the JI1 and JI1B differential inputs. In this case, the resistances RSI5, RSI9 for channel I (respectively RSQ5, RSQ9 for channel Q) are connected as short-circuits whereas RSI6, RSI7, RSI8 (respectively RSQ6, RSQ7, RSQ8 for channel Q) are open circuits.
8.7.4 Mode selection
In order to select the channel you want to evaluate, you must set a jumper on the board in the relevant position for the SELECT pin (see Figure 31).
The channels selected depend on the position of the jumper:
● With the jumper connected to the upper connectors, channel I at the output is selected.
● With the jumper connected horizontally, channel Q at the output is selected.
● With the jumper connected to the lower connectors, both channels are selected, relative to the clock edge.
Figure 31. Mode selection
VB2 VCCBE 2.5/3.3
GB3 GNDB3 0
VB3 VCCB3 2.5
Table 14. Board connections for power supplies and other pins (continued)
Board marking Connection Internal voltage (V) External voltage (V)
SELECT
DVCCDGNDCLK
I channel
Q channel
I/Q channels
SELECT
Practical application examples TSA1203
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9 Practical application examples
9.1 Digital interface applicationsThe wide external buffer power supply range of the TSA1203 makes it a perfect choice for plugging into 2.5 V or 3.3 V low voltage DSPs or digital interfaces.
9.2 Medical imaging applicationsDriven by the increasing demand for applications requiring either portability or a high degree of parallelism (or both), this product satisfies the requirements of medical imaging and telecom infrastructures.
The typical system diagram in Figure 32, shows how a narrow input beam of acoustic energy is sent into a living body via the transducer, and how the energy reflected back is analyzed.
Figure 32. Medical imaging application
The transducer is a piezoelectric ceramic such as zirconium titanate. The whole array can reach up to 512 channels. The TX beam former, amplified by the HV TX amps, delivers up to 100 V amplitude excitation pulses with phase and amplitude shifts. The mux and T/R switch is a two way input signal transmitter/ output receiver.
To compensate for skin and tissues attenuation effects, the time gain compensation (TGC) amplifier is an exponential amplifier that amplifies low voltage signals to the ADC input range. A differential output structure with low noise and very high linearity are essential factors.
These applications need high speed, low power and high performance ADCs. 10-12 bit resolution is necessary to lower the quantification noise. As multiple channels are used, a dual converter is a must for room saving issues.
The input signal is in the range of 2 to 20 MHz (mainly 2 to 7 MHz) and the application uses mostly a 4 over-sampling ratio for spurious free dynamic range (SFDR) optimization.
The next RX beam former and processing blocks enable the analysis of the output channels versus the input beam.
Mux andT/R switches
TX beam former
Processingand display
RX beam former
ADC
TGC amplifier
HV TX amps
TSA1203 Definitions of specified parameters
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10 Definitions of specified parameters
Static parameters
Static measurements are performed using the histograms method on a 2 MHz input signal, sampled at 50 Msps, which is high enough to fully characterize the test frequency response. The input level is +1 dBFS to saturate the signal.
Differential non linearity (DNL)
The average deviation of any output code width from the ideal code width of 1 LSB.
Integral non linearity (INL)
An ideal converter exhibits a transfer function which is a straight line from the starting code to the ending code. The INL is the deviation from this ideal line for each transition.
Dynamic parameters
Dynamic measurements are performed by spectral analysis, applied to an input sine wave of various frequencies sampled at 40 Msps.
The input level is -1dBFS to measure the linear behavior of the converter. All the parameters are given without correction for the full scale amplitude performance except the calculated ENOB parameter.
Spurious free dynamic range (SFDR)
The ratio between the power of the worst spurious signal (not always an harmonic) and the amplitude of fundamental tone (signal power) over the full Nyquist band. It is expressed in dBc.
Total harmonic distortion (THD)
The ratio of the rms sum of the first five harmonic distortion components to the rms value of the fundamental line. It is expressed in dB.
Signal to noise ratio (SNR)
The ratio of the rms value of the fundamental component to the rms sum of all other spectral components in the Nyquist band (fs/ 2) excluding DC, fundamental and the first five harmonics. SNR is reported in dB.
Signal to noise and distortion ratio (SINAD)
Similar ratio as for SNR but including the harmonic distortion components in the noise figure (not DC signal). It is expressed in dB.
The effective number of bits (ENOB) is easily deduced from the SINAD, using the formula:
SINAD= 6.02 × ENOB + 1.76 dB.
When the applied signal is not full scale (FS), but has an A0 amplitude, the SINAD expression becomes:
SINAD2Ao=SINADFull Scale+ 20 log (2A0/FS)
Definitions of specified parameters TSA1203
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SINAD2Ao=6.02 × ENOB + 1.76 dB + 20 log (2A0/FS)
The ENOB is expressed in bits.
Analog input bandwidth
The maximum analog input frequency at which the spectral response of a full power signal is reduced by 3 dB. Higher values can be achieved with smaller input levels.
Effective resolution bandwidth (ERB)
The band of input signal frequencies that the ADC is intended to convert without loosing linearity i.e. the maximum analog input frequency at which the SINAD is decreased by 3dB or the ENOB by 1/2 bit.
Pipeline delay
Delay between the initial sample of the analog input and the availability of the corresponding digital data output, on the output bus. Also called data latency. It is expressed as a number of clock cycles.
TSA1203 Package mechanical data
27/30
11 Package mechanical data
In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com.
11.1 TQFP48 package
DIM.mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 1.6 0.063
A1 0.05 0.15 0.002 0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.17 0.22 0.27 0.007 0.009 0.011
C 0.09 0.20 0.0035 0.0079
D 9.00 0.354
D1 7.00 0.276
D3 5.50 0.216
e 0.50 0.020
E 9.00 0.354
E1 7.00 0.276
E3 5.50 0.216
L 0.45 0.60 0.75 0.018 0.024 0.030
L1 1.00 0.039
K 0˚ 3.5˚ 7˚ 0˚ 3.5˚ 7˚
TQFP48 MECHANICAL DATA
0110596/C
Ordering information TSA1203
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12 Ordering information
Part number Temperature range Package Packing Marking
TSA1203IFT-E -40° C to +85° C TQFP48 Tape & reel SA1203I
TSA1203IF -40° C to +85° C TQFP48 Tray SA1203I
EVAL1203/BA Evaluation board
TSA1203 Revision history
29/30
13 Revision history
Date Revision Changes
1-Feb-2003 1 Initial release.
2-Jan-2006 2Update of dynamic performance measurements in Table 2 on page 6.
26-Sep-2006 3Editorial updates. Reorganized document structure. No technical changes.
12-Dec-2006 4 Pin 42 renamed to CLKD.
TSA1203
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