direct printing tools for flexible hybrid electronics assembly€¦ · · 2017-03-14direct...

Direct printing tools for flexible hybrid

electronics assembly

David Grierson, Ph.D.

President & CTO of systeMECH, LLC

We solve the problem of placing ultra-thin, high-performance Si devices onto flexible substrates by providing direct transfer printing tools. Our tools allow device manufacturers to assemble

flexible hybrid electronic (FHE) devices.

Unlike competing approaches, our technology enables the transfer of ultra-thin Si devices from the fabrication substrate to the flexible substrate in a single step.

Copyright systeMECH, LLC 2016

Solution: direct transfer printing

SOI

Handle wafer

Oxide

Device layer


Multi-step die transfer


Lithography and

oxide removal

SOI

Handle wafer

Oxide

Device layer

Thin die




Lithography and

oxide removal

Transfer to

carrier or stamp

SOI

Handle wafer

Oxide

Device layer

Handle or stamp

Thin die

Thin die




Lithography and

oxide removal

Transfer to

carrier or stamp

Transfer again to

flexible substrate

SOI

Handle wafer

Oxide

Device layer

Handle or stamp

Thin die

Adhesive

Thin die

Thin die

Flexible substrate




Handle wafer

Oxide

Device layer

Lithography and

oxide removal

Transfer to

carrier or stamp

Transfer again to

flexible substrate

Handle or stamp

Thin die

Adhesive

Flexible substrate

Thin die

Direct transfer Thin die

Rolling-based

Spatially controlled

SOI


Flexible substrate

Thin die

Flexible substrate

Thin die

Multi-step die transfer Direct transfer approach

Transfer thin die and layers (100 nm – 10 µm)

with diverse geometries and architectures

Improve throughput and yield by eliminating intermediate handling/transfer steps

Reduce cost of materials and waste by removing need for temporary handling materials

Scalable to high rates and large areas

Value proposition


Direct transfer approach

Rolling-based

Spatially controlled

Roller

WaferWeb

2 mm

Rolling-based direct transfer

Technology


Roller

WaferWeb

2 mm


Technology

200 µm

R = 1 cm

←decoupled→

200 µm

0 1 2 3 4

0

100

200

300

400

500

x (m)

z (

nm

)

SiNM

x (nm)

z (

nm

)

20 μm

20 μm


Technology

Spatially controlled direct transfer

Roller

WaferWeb

2 mm


200 µm

R = 1 cm

←decoupled→

200 µm

0 1 2 3 4

0

100

200

300

400

500

x (m)

z (

nm

)

SiNM

x (nm)

z (

nm

)

Indenter

Chip

20 μm

20 μm


200

µm

20 μm

20 μm

Technology

Roller

WaferWeb

2 mm

←decoupled→

200 µm

150 µm

R = 1 cm

200 µm

R = 1 cm

20 µm

0

390 nm

200 µm

0 1 2 3 4

0

100

200

300

400

500

x (m)

z (

nm

)

SiNM

x (nm)

z (

nm

)


Spatially controlled direct transfer

Indenter

Chip


FHE: A rapidly growing market


FHE spans several rapidly growing market segments, including wearable technology ($15-$60B within 10 years), medical devices ($6.3B in 2013), and IoT ($2B $17.6B by 2020)

FHE enables a wide range of applications, from consumer devices (e.g., flexible phones and tablets), to imaging and sensing, to health care and homeland security

Emerging FHE manufacturing technologies will be implemented commercially within the equipment market for printed and flexible electronics (>$1B in 2020)

Spin-off from the University of Wisconsin-Madison

>$1M in STTR support (AFOSR & NSF) to take our core technology from concept to prototype

Printing services now available using our in-house tools

Seeking NSF Phase II and follow-on funding for commercialization

Looking for strategic partners that are developing FHE devices

David Grierson, Ph.D.

President & CTO

[email protected]

Prof. Kevin Turner

Co-founder and Chief

Advisor

Company/Team


Thank you.

Thank you

Check us out at Booth S19 in the Silicon Innovation Village

www.systemech.com [email protected]

phone: 1.608.571.4327

Advancing our ability to manipulate matter at the micro- and nano-scales

150 µm

R = 1 cm

200 µm

R = 1 cm


http://www.systemech.com/

direct printing tools for flexible hybrid electronics assembly€¦ · · 2017-03-14direct...

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