digital integrated circuits © prentice hall 1995 manufacturing process cmos manufacturing process
TRANSCRIPT
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
CMOSManufacturing
Process
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
CMOS Process
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Circuit Under Design
This two-inverter circuit (of Figure 3.25 in the text) will bemanufactured in a twin-well process.
VDD VDD
Vin Vout
M1
M2
M3
M4
Vout2
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Circuit Layout
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Process Flow
These slides only present only a couple of snapshots of the
manufacturing process for the circuits presented in the textbook.
For a complete overview of all 62 steps, please refer to:
http://tanqueray.eecs.berkeley.edu/~ehab/inv.html.
Credits for these pictures go to Ehab Hakeem, Prof. Andrew Neureuther and the Simpl program.
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Start Material
Starting wafer: n-type withdoping level = 10 13/cm3
* Cross-sections will be shown along vertical line A-A’
A
A’
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
N-well Construction
(1) Oxidize wafer(2) Deposit silicon nitride(3) Deposit photoresist
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
N-well Construction
(4) Expose resist using n-wellmask
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
N-well Construction
(5) Develop resist(6) Etch nitride and(7) Grow thick oxide
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
N-well Construction
(8) Implant n-dopants (phosphorus)
(up to 1.5 m deep)
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
P-well Construction
Repeat previous steps
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Grow Gate Oxide
0.055 m thin
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Grow Thick Field Oxide
Uses Active Area mask
Is followed by threshold-adjusting implants
0.9 m thick
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Polysilicon layer
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Source-Drain Implants
n+ source-drain implant(using n+ select mask)
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Source-Drain Implants
p+ source-drain implant(using p+ select mask)
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Contact-Hole Definition
(1) Deposit inter-level dielectric (SiO2) — 0.75 m
(2) Define contact opening using contact mask
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Aluminum-1 Layer
Aluminum evaporated (0.8 m thick)
followed by other metal layers and glass
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Digital Integrated Circuits © Prentice Hall 1995Manufacturing ProcessManufacturing Process
Advanced Metalization