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DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES

Michael [email protected]

Semicon Taiwan2015

See Beyond the Horizon

mailto:[email protected]


LINX BACKGROUND



Linx Consulting

1. We help our clients to succeed by creating know ledge and developing unique insights at the intersection of electronic thin film processes and the chemicals industry

2. The know ledge is based on a core understanding of the semiconductor device technology; manufacturing processes and roadmaps; and the structural industry dynamics

3. This know ledge is leveraged to create advanced models, simulations and real-world forecasts

4. Our perspectives are by direct research and leveraging our extensive experience throughout the global industry value chain, including:

• Experience in global electronics and advanced materials and thin film processing industries • Experience in the global chemicals industry• Experience at Device Producers• Experience at OEMs



Linx Consulting Service Portfolio• Multi-Client Reports

– IC Materials• CMP• Deposition• Patterning• Cleaning• Gases

– III-Vs, TSV, WLP, Solar

• Proprietary Projects– Market Planning– M & A– Growth and Diversification– Supply Chain Optimization– Technology Commercialization– Strategic Planning– Voice of the Customer

• Econometric Semiconductor Forecast– Financial planning– Sales and Operational planning– Forecasting

Hilltop Economics LLC

• Cost Modeling– Client demand modeling– Product development– Bill of Materials quantification

IC Knowledge, LLC

– Semi– LCD

– Packaging– PV

– Nano Technology– LED/ Compound Semi



Industry Analysis Reports Offered

1. Advanced Cleaning and Surface Preparation: Technologies and Markets (5th Edition)2. Advanced Patterning Forecasting (Semi-Annual)3. Advanced Thin Films for FEOL and BEOL Applications (5th Edition)4. Chemicals and Materials for WLP and TSV Applications5. CMP in TSV (2nd edition)6. CMP Technologies and Markets to the Sub-10nm Node (6th edition)7. Electronic Specialty Gases8. Global Market for MO Precursors9. Specialty Abrasives in CMP (4th edition)10. Wafer Polishing Technologies and Markets

11. The Econometric Semiconductor Forecasting Service

12. Strategic Cost Model



SEMI INDUSTRY TRENDS



3D Processing and New Materials Drive Scaling

3D Packaging

Gate Architecture

New Memory

EUV



Better Inspection Tools are Impacting Chemicals

• Optical (particle detection) systems such as SP3 and SP5 are identifying new defects• Optical (particle detection) performance improvements have enabled wafer fabs, to “see”

and identify more a greater number of process defects• It is expected the most advanced detection capability will reach 10-15nm particle detection

as well as enhanced capabilities to pick up micro-scratches• In general, many new defects are driven by the introduction of new materials and processes • A lot of the particle related challenges in the future will be driven by introduction of new

devices (not yet in production) with many different new materials. Examples of new devices include the following:

– Advanced DRAM structures with new transistors, capacitor dielectrics and capacitor electrodes

– STTMRAM, a possible replacement for DRAM – VNAND (3D NAND), which will have a lot of challenges due to the high aspect ratios

and deep structures will be a challenge• Based on the above, the industry will need to use very pure chemicals, with greater dilution

to lower metallic and particulate contamination



Logic Growth Drivers

• IMEC has demonstrated the integration of high-mobility channel InGaAs n-channel and Ge p-channel metal–oxide–semiconductor field-effect transistors. Also possible - all Ge High Mobility Structures

• CVD Co improves Cu wetting and extends Cu gap fill. CVD Co is thin, continuous, conformal layer that repairs any discontinuities for barrier/seed

• A cross-section TEM of a 50-nm trench structure coated with a ~5nm Ru:TaN liner followed by ECD copper. The filling characteristics are equivalent to seeded copper, and direct plated films possess generally larger grain size characteristics

Sources: Applied Materials, IMEC and Albany NanoTech



Emerging Logic Operations (1000s)

2014 2015 2016 2017 2018 2019

THO

USA

ND

S O

F W

AFER

S

Planar With RMG FINFET with RMG



Total Cu, Co via and Co Containing Operations (1000s)

2014 2015 2016 2017 2018 2019

THO

USA

ND

S O

F W

AFER

S

Total Copper Copper with Co Liners CO Via Bulk Fill



Memory Growth Drivers

• Ru electrodes may be used with novel dielectrics for DRAM

• DRAM scaling comes to an end within ~ 5 years. TSV technology can be used to continue to scale density. HMC, etc.

• 2D and 3D NAND will be integrated simultaneously. 2D structures will require higher planarity and 3D will open up new W polishes as well as oxide steps

• MRAM provides non-volatile storage, high read write speeds, lower energy dissipation and high write endurance

Sources: Matheson, JG Park, UMC/Sematech



3D NAND W CMP Operations (1000s)

2014 2015 2016 2017 2018 2019

THO

USA

ND

S O

F W

AFER

S

3D NAND



MATERIALS COST TRENDS IN LEADING EDGE SEMICONDUCTOR DEVICES


Advanced Logic – Wafer Fab Materials

$0

$50

$100

$150

$200

$250

$300

$350

$400

65nm 45nm 32nm 22nm 14nm

ALD CMP CVD PVD & ECD Litho Process chemicals

$ per Wafer by Node


Advanced Logic – Wafer Fab Materials Growth

393%

15%

27%

9%

47%

20%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

Compound Growth Rate by Node

ALD CMP CVD PVD & ECD Litho Process chemicals

Wafer Fab Materials Node to Node Growth Rate


DRAM – Wafer Fab Materials

$0

$20

$40

$60

$80

$100

$120

$140

$160

$180

$200

68nm 58nm 48nm 32nm 26nm 20nm

ALD CMP CVD PVD & ECD Litho Spin-on Materials Process chemicals

$ per Wafer by Node


DRAM – Wafer Fab Materials Growth

32%

7%

2%

7%

17%

1%

15%

0%

5%

10%

15%

20%

25%

30%

35%

Compound Growth Rate by Node

ALD CMP CVD PVD & ECD Litho Spin-on Materials Process chemicals

Wafer Fab Materials Node to Node Growth Rate


CHEMICALS AND MATERIALS MARKETS



Materials Demand Drivers

Multipliers FinFETs 6 x CMP steps2 x Epi depositions

3D NAND 32x layer stack – or more!1 x separation etch1x planarization dep4x W dep and CMP

Cu interconnect 6-14x Logic wafersCobalt integration2-4x Memory

Litho Extensions Multiple litho stepsMultiple cut masksSADP/SAQP

2x depositionsCut masks3x etches

Divisors 450mm 1/ 2.25 wafer starts


Econometric Semiconductor Forecast –Materials Demand Track Silicon

Source: Hilltop Economics LLC

The mean absolute error is an exceptionally low 3.5%, an indication that the model and forecasting process has effectively captured

semiconductor MSI’s relationship to the macro economy.


ESF 2015 Q3 Forecast(August 2015)

2015Q2 2015Q3F 2015Q4F 2016Q1F 2016Q2F

MSI 2702 2646 2521 2573 2766%Change 2.2% -2.1% -4.7% 2.1% 7.5%%Change vs prior year

4.4% 1.9% -1.1% -2.4% 2.4%

1,600

1,800

2,000

2,200

2,400

2,600

2,800

3,000

3,200

2009 2010 2011 2012 2013 2014 2015 2016 2017

SEMI MSIESF Q3 2015 Forecast (August)

Annual Percent Change In MSI2012 2013 2014 2015 2016 2017-0.1% 0.4% 11.4% 4.1% 5.0% 7.7%History: SEMI

Forecast: Hilltop Economics


FEOL Wafer Fab Materials

$0

$2,000

$4,000

$6,000

$8,000

$10,000

$12,000

$14,000

$16,000

$18,000

2014 2015 2016 2017 2018

Total Wafer Fab Materials Market $M

ALD & Advanced CVD Clean CMP (incl PCMP) Litho PVD, SOD & Plating ESG Semi Bulk Gases



Growing Importance of Process Materials

Source: Hendry Intel SMC 2014

Materials Segment

Special Commodities

Specialty Chemicals

Driver • Large volume• Consistency• Cost

• Low volume• High service requirements• Proprietary products

• not easily substituted

• Purchased for performance• Profit margins are higher

Key technologies

• High volume manufacturing

• Proprietary formulations• Synthesis• Applications expertise

Wafer fab materials supply in the semiconductor industry has segmented into discrete segments• Special Commodities, which will cycle• Specialty Materials, which solve

problems, but are limited by small scale production

• Wafer fab materials represent about 20% of the cost for a 200mm logic wafer and about 10% of the costs for a 300mm logic wafer

Chemicals and Materials that can differentiate and still considered to be specialty chemical products as they are enabling integrations and device structures



Capital Spending ad Customer Concentration

Source: SEMI ad Linx

• Based on future trends in capex, buyer power / (CMP) consumable intensity will continue in Taiwan and Korea and remain stable in the USA

• Customer concentration may offset specialties model

CMP Markets & Technologies 2015 External Disclosure Not Permitted

Slurries ($M) Pads ($M)

Fab Capex by Region 2014 Leading buyers of CMP Consumables


Conclusions

• Good semi industry growth outlook over the next several years

• New applications in both memory and logic will continue to drive the opportunities for advanced materials going forward

• Lithography materials continue to represent largest percentage of cost

• ALD materials have the fastest growth rate

• Two chemical/materials business models – specialties and commodities will exist– Each model has its own challenges


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