designing fpgas & asicsweb.eecs.utk.edu/~dbouldin/courses/551/overview-slides... · 2010. 8....
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DESIGNING FPGAS & ASICSDESIGNING FPGAS & ASICS
HDLarchitecture behavior of control is
if left paddle then
Overview of FPGAs and ASICsOverview of FPGAs and ASICs
Prof. Don Bouldin, Ph.D.SCHEMATIC
ANDORAND
if left_paddle then n_state <= hit_state elsif n_state <= miss_state end if;
SYNTHESIS
Electrical & Computer Engineering
PHYSICAL LAYOUTPLACE & ROUTE
University of TennesseeTEL: (865)-974-5444FAX: (865)-974-5483FAX: (865) 974 5483
©2010 -- Don Bouldin11
A VARIETY OF ICS ARE POSSIBLEA VARIETY OF ICS ARE POSSIBLE
©2010 -- Don Bouldin22
APPLICATIONS MAY USESTANDARD ICs or FPGAs/ASICs
Standard IC(off-the-shelf)
ASIC(User-specified)
SSI/MSI LSI/VLSISemicustom Custom
StandardLibrary Cells
Analog/DigitalMixed-SignalUser-programmable
StructuredASICs
PLDs FPGAs (All Masks)
©2010 -- Don Bouldin33
FAB FOUNDRIES COST BILLIONSFAB FOUNDRIES COST BILLIONS
• Intel spent $3 billion to construct and equip its integrated equip its integrated circuit fabrication facility in Chandler, Arizona.Arizona.
• The foundry produces 300-mm wafers using feature wafers using feature sizes of 45 nanometers.
http://www.intel.com/
©2010 -- Don Bouldin44
MASK CHARGES COST MILLIONSMASK CHARGES COST MILLIONS
A di t S T h • According to SemaTech, a mask set for 65-nm costs $3 million. $
©2010 -- Don Bouldin55
http://www.tsmc.com/
THE COST PER GATE DECREASES AS THE DENSITY OF AN I.C. INCREASES
• Microprocessors and other off-the-shelf LSI/VLSI chips are the the-shelf LSI/VLSI chips are the most cost-effective because millions of gates are available in a single chip. ($0.0001/gate; a single chip. ($0.0001/gate; 20,000 gates/pin)
• SSI/MSI glue logic chips are the least cost-effective because only a few gates are available in y ga single chip. ($0.01/gate; 1-3 gates/pin)
PENTIUMPENTIUM
©2010 -- Don Bouldin66
PENTIUMPENTIUM
SYSTEM FUNCTIONS ARE OFTEN SPLIT BETWEEN THE CPU AND AN ASIC
• The most economical
means of implementing
MicroprocessorSlow Inputs Slow Outputs
p g
logic functions is to use a
microprocessor. p
Control& Feedback
SlowInputs
• When the microprocessor
is too slow or too busy to
handle some fast inputs
ASICFast Inputs Fast Outputs
handle some fast inputs
and outputs, an ASIC can
be used to implement p
high-speed concurrent
operations.
©2010 -- Don Bouldin77
REAL-TIME EMBEDDED SYSTEMSREAL TIME EMBEDDED SYSTEMS
A l t i t t i i CPU ith t ti • An electronic system containing a CPU without an operating system visible to the end-user.
• It interacts with peripheral devices within fixed time constraints.
• A minimum of resources are employed to perform the required tasks.required tasks.
• In addition to functionality and cost, other constraints include power management, fault tolerance, quality of e i e e it etservice, security, etc.
©2010 -- Don Bouldin88
ECE 551-552ECE 551-552
• ECE 551:– Pairs create project using VHDL– Simulate pre-synthesis and post-layoutSimulate pre synthesis and post layout– Demonstrate using 200K-gate Xilinx FPGA
on Spartan3 Board with I/O– Implement on screen only using Altera FPGAp y g
• ECE 552:– Team of 4 will create and reuse IP blocksTeam of 4 will create and reuse IP blocks– Programmable SoC design with DSP– Demonstrate using 1M-gate Virtex2-Pro/XUP– Lectures on alternate weeks– Lectures on alternate weeks
©2010 -- Don Bouldin99
ECE 651 - 652ECE 651 - 652
• ECE 651:– Perform custom IC design (but not submit for fab)– Compare manual design vs. automated tools– Study nanometer design issues (cross-talk, power)
• ECE 652:– Extend our System-on-Chip platform
i bl f– Design Testable ASIC for nanometer process– Optimize SoC at both synthesis and physical levels– Lectures on alternate weeks
©2010 -- Don Bouldin1010
PROGRAMMABLE LOGIC DEVICES ARE BEST FOR SMALL DESIGNS WITH I/O
• Vendor prefabricates multiple sets of ANDs and ORs with programmable connections
PLDs
• User specifies connections to implement desired logic functionsAND
• Replaces 200 to 8,000 gates with single package of 20-84 pins
AND
OR p g p
• Electrically programmable (and erasable) by the user one at a time within minutes
AND
AND
the user one at a time within minutes
• PC-based development system costs $1K
©2010 -- Don Bouldin1111
RECONFIGURABLE COMPONENTS ARE ADAPTABLE
Th i t l l i d i t t f fi bl The internal logic and interconnect of a reconfigurable component (FPGA) may be specified by the user and changed at any time.
CONTROLC
SIGNAL PROC.ARITHMETIC
©2010 -- Don Bouldin1212
STRUCTURED ASICSSTRUCTURED ASICS
USER LOGICUSER LOGIC
©2010 -- Don Bouldin1313
http://www.rapidchip.com/ Available from Fijitsu
STANDARD-CELLS ARE BEST FOR HIGH-QUANTITY APPLICATIONS WITH RAM
• Vendor develops library disk files of logic functions (and internal RAM or cache).Standard-Height
Lib C ll • User selects cells and specifies two layers of interconnections
Library Cells
• After place & route, masks are made for alllayers
• Replaces 20,000 to 2,000,000 gates (or more)
k i b d d lRAM • Workstation-based development system costs more than $ 200K
T d ti f t t i 8 k
RAM
©2010 -- Don Bouldin1414
• Turnaround time for prototypes is 8 weeks
STANDARD-HEIGHT CELL CHIPS CAN ALSO USE EMBEDDED RAM
Space between rows for wiring wiring can be varied as needed.
©2010 -- Don Bouldin1515
SPECIAL TECHNIQUES ARE USED FOR LAYOUT OF ANALOG CIRCUITS
• Layouts use multi-gate fingers and common-fingers and commoncentroid symmetry to improve matching of devicesdevices.
• Poly2-Poly1 capacitors save space.
• Switched-capacitor circuits replace large resistors.resistors.
• Guard rings reduce noise.
©2010 -- Don Bouldin1616
SHARING MASK/WAFER COSTSSHARING MASK/WAFER COSTS
©2010 -- Don Bouldin1717
http://www.mosis.org/ http://www.ssec.honeywell.com/
MIXED-SIGNAL ICS USE BOTH ANALOG AND DIGITAL CIRCUITS
• Solar cells provide power.
• Analog circuit detects when sufficient energy sufficient energy is available.
• Digital circuit provides for series of pulses.
• Infrared LEDs • Infrared LEDs emit output that is detectable 1
il
©2010 -- Don Bouldin1818
mile away.
MICROELECTRONIC SYSTEM DESIGN CONSISTS OF ITERATIVE REFINEMENTS CONSISTS OF ITERATIVE REFINEMENTS
OF SYNTHESIS AND VERIFICATION
Requirements
Architectural Specifications
Design Review
Behavioral Description
Behavioral Simulation
i lTRENDS Logic Synthesis
Physical
Logic-Level Simulation
Trans.-Level
TRENDS
Physical Implementation
Prototype
Trans. Level Simulation
Measurement
©2010 -- Don Bouldin1919
yp
CUSTOM IC DESIGN FLOWCUSTOM IC DESIGN FLOW
1--SCHEMATIC1--SCHEMATIC 2--PRE-LAYOUT LOGIC SIMULATION2--PRE-LAYOUT LOGIC SIMULATION
3—MANUAL LAYOUT3—MANUAL LAYOUT 4--POST-LAYOUT TRANS. SIMULATION4--POST-LAYOUT TRANS. SIMULATION
©2010 -- Don Bouldin2020
SEMI-CUSTOM DESIGN FLOW OF DIGITAL FPGAS/ASICS
1—HDL 1—HDL 2--PRE-SYNTHESIS SIMULATION2--PRE-SYNTHESIS SIMULATIONCASE w ISCASE w IS
WHEN "00" => y <= "1000" ;
WHEN "01" => y <= "0100" ;
WHEN "10" => y <= "0010" ;
WHEN OTHERS => y <= "0001";
WHEN "00" => y <= "1000" ;
WHEN "01" => y <= "0100" ;
WHEN "10" => y <= "0010" ;
WHEN OTHERS => y <= "0001";
3—SYNTHESIS/AUTO LAYOUT3—SYNTHESIS/AUTO LAYOUT
END CASE ;END CASE ;
4--POST-LAYOUT SIMULATION4--POST-LAYOUT SIMULATION
©2010 -- Don Bouldin2121
A HARDWARE DESCRIPTION LANGUAGE CAN BE SYNTHESIZED
• The desired functionality and timing may be described using a hardware description languagesuch as VHDL or Verilog and then synthesized into the structural level for a specified device.
• Synthesis involves: (1) translation into Boolean equations,
(2) optimization for area/delay, and then
(3) mapping to a FPGA or ASIC process (library).
• The physical level is then implemented automatically using a placement and routing program.
©2010 -- Don Bouldin2222
HDL DESIGNS CAN BE TARGETED TO MULTIPLE LAYOUTS
HDLarchitecture behavior of control is
if left_paddle then t t < hit t t SYNTHESIS
LIBRARIES
TECH TECH
SYNPLICITYSYNPLIFY
SYNPLICITYSYNPLIFY
SCHEMATIC--A
n_state <= hit_state elsif n_state <= miss_state end if;
SYNTHESIS
SCHEMATIC--B
TECH A
TECH B
ANDORAND
AND
OROR
TECH A
TECH B
ALTERAPLACE & ROUTE
XILINXPLACE & ROUTE
PHYSICAL LAYOUT PHYSICAL LAYOUT
©2010 -- Don Bouldin2323
INTELLECTUAL PROPERTY BLOCKSINTELLECTUAL PROPERTY BLOCKS
Design #1 without Planned Reuse
Design #2 without Planned Reuse
Design #3 without Planned Reuse
1.5Design #2
1.8Design #3
2.1
Design # 1 For ReuseDesign #2WITH IP
Design #3WITH IP
IP blocks should have well-defined interfacesOften, IP are more like patches that must be
stitched together like a quilt
©2010 -- Don Bouldin2424
COLLABORATIVE DESIGNCOLLABORATIVE DESIGN
Designer#1Designer#3
Designer#2
Designer#4
Collaborative Design of a System-on-Chip
©2010 -- Don Bouldin2525
g y phttp://www.cs.wright.edu/~tkprasad/courses/soc.html
PROGRAMMABLE SYSTEM-ON-CHIP
• CPU integrated inside the FPGA package
– Replaces board with separate CPU and FPGA packages
– Higher bandwidth and lower Higher bandwidth and lower latency
– CPU performs control functions
CPU may lack floating point – CPU may lack floating-point capability
– Programmable System-on-Chip (S C) Pl tf(SoC) Platform
– Can prototype ASIC SoC or an embedded system
http://www.xilinx.com/
©2010 -- Don Bouldin2626
p // /
SYNTHESIS AND PHYSICAL DESIGN COUPLED
• Wire load models were previously used by synthesis to predict layout capacitance accurately. However, these models are failing today.these models are failing today.
• Now that wire delays dominate gate delays in nanometer processes, synthesis must be coupled with physical floorplanning to achieve the desired timing goals.
©2010 -- Don Bouldin2727
http://www.synopsys.com/
SIGNAL INTEGRITY AND POWER ISSUES ARE ESCALATING
Effects of Crosstalk:Effects of Crosstalk:Effects of Crosstalk:Effects of Crosstalk: Delay UncertaintyEffects of Crosstalk: Effects of Crosstalk: Delay UncertaintyDelay Uncertainty
min nom maxThresholds
8.00E-01
1.00E+00
1.20E+00
Series1
min nom max
nominal
2.00E-01
4.00E-01
6.00E-01
Volta
ge (v
) Series2
Series3
Series4
Series5
S i 6friendly
-4.00E-01
-2.00E-01
0.00E+00
1 4 7 10 13 16 19 22 25 28 31 34 37 40 43 46 49 52 55 58 61
V Series6
Series7unfriendly
SC/ABK/MSICCAD Tutorial: November 9, 20004
Time (ps)
©2010 -- Don Bouldin2828
http://vlsicad.ucsd.edu/ http://www.tomshardware.com/
OUR BASELINE SOC PLATFORMOUR BASELINE SOC PLATFORM
CPUCPUCPUCPU
IP-1IP-1
IP-2IP-2BUSBUS
SoC PackageSoC PackageSoC PackageSoC Package
External MemoriesExternal Memories
©2010 -- Don Bouldin2929
SYSTEM-ON-CHIP REQUIRES CO-DESIGN OF SW AND HW
SYSTEMC
• Traditional co-design uses C and HDL separately.
• Integration is performed on COMPILER/SIMULATOR
SYSTEMC
• Integration is performed on prototypes after using separate simulators with limited linkage.
COMPILER
C
SYNTHESIS
HDL
SIMULATOR
• SystemC is now being used for co-simulation at the behavioral level.
• The hardware portion is then CSIMULATOR
HDLSIMULATORThe hardware portion is then
automatically translated into HDL.
• The same test bench is used at l l
SIMULATOR SIMULATOR
every level.
http://www.SystemC.org/
©2010 -- Don Bouldin3030
http://www.SystemC.org/
ECE 551-552ECE 551-552
• ECE 551:– Pairs create project using VHDL– Simulate pre-synthesis and post-layoutSimulate pre synthesis and post layout– Demonstrate using 200K-gate Xilinx FPGA
on Spartan3 Board with I/O– Implement on screen only using Altera FPGAp y g
• ECE 552:– Team of 4 will create and reuse IP blocksTeam of 4 will create and reuse IP blocks– Programmable SoC design with DSP– Demonstrate using 1M-gate Virtex2-Pro/XUP– Lectures on alternate weeks– Lectures on alternate weeks
©2010 -- Don Bouldin3131
ECE 651 - 652ECE 651 - 652
• ECE 651:– Perform custom IC design (but not submit for fab)– Compare manual design vs. automated tools– Study nanometer design issues (cross-talk, power)
• ECE 652:– Extend our System-on-Chip platform
i bl f– Design Testable ASIC for nanometer process– Optimize SoC at both synthesis and physical levels– Lectures on alternate weeks
©2010 -- Don Bouldin3232