deformation & damage of lead-free solder joints cost 531 final meeting, 17th-18th may 2007,...

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Deformation & damage Deformation & damage of lead-free solder joints of lead-free solder joints COST 531 Final Meeting, COST 531 Final Meeting, 17th-18th May 2007, Vienna 17th-18th May 2007, Vienna J. Cugnoni J. Cugnoni 1 , J. Botsis , J. Botsis 1 , , V. Sivasubramaniam V. Sivasubramaniam 2 , J. Janczak-Rusch , J. Janczak-Rusch 2 1 1 Lab. Applied Mechanics & Reliability, EPFL, Lab. Applied Mechanics & Reliability, EPFL, Switzerland Switzerland 2 Füge- und Grenzflächentechnologie, EMPA, Füge- und Grenzflächentechnologie, EMPA, Switzerland Switzerland

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Page 1: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Deformation & damage Deformation & damage of lead-free solder jointsof lead-free solder joints

COST 531 Final Meeting,COST 531 Final Meeting,

17th-18th May 2007, Vienna17th-18th May 2007, Vienna

J. CugnoniJ. Cugnoni11, J. Botsis, J. Botsis11, , V. SivasubramaniamV. Sivasubramaniam22, J. Janczak-Rusch, J. Janczak-Rusch22

1 1 Lab. Applied Mechanics & Reliability, EPFL, SwitzerlandLab. Applied Mechanics & Reliability, EPFL, Switzerland22 Füge- und Grenzflächentechnologie, EMPA, Switzerland Füge- und Grenzflächentechnologie, EMPA, Switzerland

Page 2: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

OutlineOutline

Overview of the project:Overview of the project: Global goals & achievementsGlobal goals & achievements

Methods & developments:Methods & developments: Experimental techniquesExperimental techniques ModellingModelling

Key resultsKey results Elasto-plastic characterization of SAC405Elasto-plastic characterization of SAC405 Constraining & size effectsConstraining & size effects Ductile failure: effect of voidsDuctile failure: effect of voids

FutureFuture Bridging the length scales & the disciplinesBridging the length scales & the disciplines

Page 3: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Deformation & damage of lead-free solder jointsDeformation & damage of lead-free solder joints

Manufacturing

Siz

e / C

onst

rain

ing

Effe

cts

Thermo-

mechanical H

istory

Micro S

tructure

Inte

rface

Nature of Irreversible Deformations

ConstitutiveEquations

Global Project

?

Objectives

Size & constraining effectsSize & constraining effects Tensile / shear jointsTensile / shear joints

Effect of microstructure:Effect of microstructure: Effect of porosity contentEffect of porosity content

Failure mechanisms:Failure mechanisms: Ductile fractureDuctile fracture

Studied system:Studied system: SAC 405 / Cu substratesSAC 405 / Cu substrates

Page 4: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Methods & developments: overviewMethods & developments: overview

Elasto-plastic

characterization of SAC 405Effe

cts

of v

oids

on

the

relia

bilit

y of

join

ts

Inve

stig

atio

ns o

n Siz

e Effe

cts

Effects of Constraints

Modelling

Experimental

Finite Element Model

Constitutive LawType

Inverse Num. / Exp.Identification

Micro StructureAnalysis

OpticalStrain

Measurement

Designof

Experiments

Page 5: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Key results: overviewKey results: overview

Manufacturing

Siz

e / C

onst

rain

ing

Eff

ects

Thermo-

mechanical H

istory

Micro S

tructure

Inte

rfac

e

Nature of Irreversible Deformations

ConstitutiveEquations

Global Project

Page 6: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Thoughts about the future….Thoughts about the future….

Short term:Short term:Time / temperature dependent properties.Time / temperature dependent properties.Interfacial failure: cohesive elementsInterfacial failure: cohesive elements

Mid-Long term:Mid-Long term:

Bridging the length scales & disciplinesBridging the length scales & disciplines

Meso

Micro

Macro

Thermodynamics, phase diagrams

Diffusion, interfaces, solidification, microstructure

Continuum mechanics, damage, fracture…

Homogenization

Solidification /diffusion simulation ?

Need more transversal research !!

Page 7: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Tensile & shear specimensTensile & shear specimens

9.5 mm

1 mm

2 mm

4 mm

8 mm

g

w

L

t

Tensile specimenTensile specimenL=120 mm, w=20 mm, t=1mm, g=[0.25, 0.5, 0.75, 1.2, 2.4] mmL=120 mm, w=20 mm, t=1mm, g=[0.25, 0.5, 0.75, 1.2, 2.4] mmSolder cross section = 20x1 mm2Solder cross section = 20x1 mm2

Shear specimenShear specimenL=120mm, joint cross section=2x2 mm2joint cross section=2x2 mm2Optimized for stress uniformity Optimized for stress uniformity & simple manufacturing& simple manufacturing

thickness=2mm

Page 8: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Digital Image CorrelationDigital Image Correlation

Why optical strain measurements??Why optical strain measurements?? non-invasive measurements at a non-invasive measurements at a

small scalesmall scale

DIC algorithms developments:DIC algorithms developments:Tensile joints:Tensile joints:

Small strains, small translationsSmall strains, small translations High accuracy is neededHigh accuracy is needed Spatial Correlation with cubic Spatial Correlation with cubic

spline resamplingspline resamplingShear joints:Shear joints:

Extremely large strains, large Extremely large strains, large displacementdisplacement

Need excellent robustnessNeed excellent robustness Incremental FFT-based correlationIncremental FFT-based correlation

Advantages / DrawbacksAdvantages / Drawbacks + Versatile & simple to setup+ Versatile & simple to setup + Robust in most cases+ Robust in most cases - Resolution limited by pixel size- Resolution limited by pixel size - Need a random pattern- Need a random pattern

4 mm

Page 9: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

ESPI measurements (STSM, D. Karalekas)ESPI measurements (STSM, D. Karalekas)

Work done with Dr.Karalekas,Univ. Work done with Dr.Karalekas,Univ. Piraeus, Greece during a STSM at EPFLPiraeus, Greece during a STSM at EPFL

Advantages:Advantages: Sensitivity independant from Sensitivity independant from

magnification: excellent for global magnification: excellent for global observationsobservations

Full field measurementFull field measurement

Drawbacks:Drawbacks: Decorrelation Decorrelation Problems with creep tests Problems with creep tests

Application: Application: Evaluate boundary conditions Evaluate boundary conditions Full field displacement measurement on Full field displacement measurement on

assembliesassemblies

20 mm

Page 10: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Finite Element modellingFinite Element modelling

Modelling? why??Modelling? why?? Models have the power of Models have the power of

generalization of knowledgegeneralization of knowledge

FE modelsFE modelsAdvantages: Advantages:

Versatility: Complex geometries, multi-Versatility: Complex geometries, multi-components, components, multi-physicsmulti-physicsAbility to Ability to extrapolateextrapolate knowledge gained knowledge gained on simple test cases to much more on simple test cases to much more complex designs & geometries !!complex designs & geometries !!Multi-scaleMulti-scale modelling (homogenization) modelling (homogenization)

Drawback:Drawback:Requires an extensive & reliable set of Requires an extensive & reliable set of parameters parameters => huge characterization task=> huge characterization task

Combining Experiments & Combining Experiments & Numerical simulation is of prime Numerical simulation is of prime

importanceimportance

Page 11: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Inverse num.-exp. identificationInverse num.-exp. identification

SpecimenProduction

TensileTest (DIC)

Geometry & BoundaryConditions

FEM

ExperimentalLoad – Displacement /Stress-Strain response

SimulatedLoad – Displacement /Stress-Strain response

Global / local responseof the specimen

Optimization(Least Square

Fitting) Modelling parameters:Constitutive law,

failure model

Identification Loop

Geometric &structural effects

Experimental

In-situ characterization of constitutive parameters

Numerical Simulations

Page 12: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Constraining effects:Constraining effects:

Tensile & shear solder jointsTensile & shear solder joints

Page 13: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Constraints in tensile solder jointsConstraints in tensile solder joints

Solder joint in tension: - stiff elastic substrates- plastic solder (~=0.5)

Plastic deformation ofsolder:- constant volume=> solder shrinks in lateral directions

Rigid substrates:- impose lateral stresses at the interfaces - hydrostatic stresses=> apparent hardening=> constraining effects

Page 14: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Parametric FE study: ResultsParametric FE study: Results

Correlation between Constraining Effect ratio & Triaxiality ratio of stress field

y = 0.9686x - 0.4707

R2 = 0.9938

0

1

2

3

4

5

6

7

0 1 2 3 4 5 6 7 8

Triaxiality ratio, R

Co

ns

tr. e

ffe

ct r

ati

o, Q

=> Constraining effects are due to the the triaxiality (hydrostatic part) of the stress field in the solder induced by the substrate

Page 15: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Parametric FE study: ResultsParametric FE study: Results

Constraining effects are inversely proportionnal to the gap to thickness ratio G in tensile joints

Constraining effect ratio in function of Gap / Thickness ratio

0

1

2

3

4

5

6

7

8

- 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00

Gap / Thickness ratio, G

Co

ns

tra

inin

g e

ffe

ct

rati

o, Q

Q = 0.151G-1.3

R2 = 0.988

Page 16: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Shear: constraining effectsShear: constraining effects

0

5

10

15

20

25

30

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

eng. shear strain [-]

no

m.

sh

ea

r s

tre

ss

[M

Pa

]

1mm

0.75mm

0.35mm

Parametric FE simulation of shear joint response

Pure shear = isochoric deformation => no significant effects of constraints !!

Page 17: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Shear: Gap – ultimate stress relationshipShear: Gap – ultimate stress relationship

Shear: Shear: No significant effect of solder gap on ultimate stress No significant effect of solder gap on ultimate stress

Ultimate shear stress as a function of gap

y = 0.236x + 21.339

0

5

10

15

20

25

30

0.3 0.5 0.7 0.9 1.1 1.3Gap (mm)

Ult.

she

ar s

tres

s

Page 18: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Size effects:Size effects:

Tensile & Shear solder jointsTensile & Shear solder joints

Page 19: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Identified constitutive stress-strain curves

0.00E+00

1.00E+07

2.00E+07

3.00E+07

4.00E+07

5.00E+07

6.00E+07

7.00E+07

0 0.005 0.01 0.015 0.02 0.025 0.03 0.035 0.04

strain (-)

stre

ss (

Pa)

0.25 mm

0.50 mm

0.70 mm

1.20 mm

2.00 mm

Bulk Specimen

Identified elasto-plastic law / size effectsIdentified elasto-plastic law / size effects

Mechanical properties decreasing for smaller joints:combination of scale effects & porosity

Manufacturing process is also size dependant

Tensile joints

Page 20: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Identified elasto-plastic law / size effectsIdentified elasto-plastic law / size effects

Tensile / shear joints: - similar elasto-plastic behaviours- similar size effects (manufacturing?)

Shear joints

Size effect

Page 21: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Deformation & damage mechanisms in lead-free Deformation & damage mechanisms in lead-free solder jointssolder joints

Page 22: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Microstructure & FractographyMicrostructure & Fractography

Microstructure before testing Fractography

2.4mm

0.7mm

0.5mm (vacuum)Pores:

• created during manufacturing and grow with plastic deformation

• introduces large scatter in experimental data => model void !!

If porosity cannot be eliminated

=> Include it in models as a « random » variable

Page 23: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Porous metal plasticity: Gurson-Tvergaard modelPorous metal plasticity: Gurson-Tvergaard model

Porosity content is an internal variable of the model: Porosity content is an internal variable of the model: f= density ratio = 1- void_fractionf= density ratio = 1- void_fraction

01)(2

3cosh2

)(2

321

2

fq

pqfq

plyply

eq

Yield surface

Yield function without pores Hydrostatic pressure

Effect of voids

Evolution of porosity

nuclgr fff

I:)1( plgr ff Growth

eqpl

eqplnucl Af )(

2

2

1exp

2)(

N

Neqpl

N

Neqpl ss

fA

Nucleation

Page 24: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Shear joint response & porous metal plasticityShear joint response & porous metal plasticity

Plastic Yielding Void

growth Void nucleation

Ult. strain

Changes in initial porosity %

Page 25: Deformation & damage of lead-free solder joints COST 531 Final Meeting, 17th-18th May 2007, Vienna J. Cugnoni 1, J. Botsis 1, V. Sivasubramaniam 2, J

Ductile failure simulationDuctile failure simulation

Porous metal plasticity model can 1. Predict the progressive ductile failure of metal up to rupture2. Simulate shear band formation & localization3. Introducing « random » initial porosity => statistical estimate of the failure

strain in a given assembly

Plastic Yielding

Void growth

Void nucleation

Ult. strain