defense systems take flight with intelligent rf integration

14
Mark Moffat Peregrine Semiconductor Europe Managing Director EuMW Space and Defense

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Mark Moffat

Peregrine Semiconductor Europe

Managing Director

EuMW Space and Defense

Peregrine: Solving the World’s Toughest RF Challenges

Peregrine Semiconductor Proprietary 2

Fabless semiconductor company

• Pioneered use of CMOS SOI for RF

• Performance on par with GaAs, with all the

benefits of CMOS

• Perfected technology over 25 years

Serving multiple end-markets

• Leading innovator in the mobile handset space

• Bringing RF innovation to aerospace,

automotive test & measurement and other

industrial markets

• Initial Public Offering August 2012

• Headquarters in San Diego, CA

• 300+ employees

Mobile

High Performance

Analog (HPA)

Intellectual

Property Rights

Company Overview: Driving the RF SOI Revolution

3

Global 1

Snapshot: EuMW Space & Defense 2012

Peregrine Semiconductor Proprietary 4

Expanding Opportunities for RADAR: Even since 2012

Peregrine Semiconductor Proprietary 5

Ground Weather Radar

Military SAR Radar Space X Band

SAR – Earth Observation

Commercial Airborne Radar

Storm Tracking

Existing

NEXRAD

Proposed CASA

RADAR

Cosmo SkyMed

Pro

toty

pe

Pere

grin

e S

em

ico

nd

ucto

r Pro

prie

tary

2

Seri

al B

us

Inte

rfa

ce

CLK

DATA

EN

VDD

VSS

TX_IN

RX_OUT TX_OUT

RX_IN

768

483

391

345

179

100

1000

Ro

nC

off

20% Improvement Target

253

Production Release Year

113

Why mmwave on UltraCMOS® Technology

Cgd

Cgs

Cbd

Cbs

gbs

gdsgm

Cgd

Cgs

Cgb

gdb

rd

rs

Gate Bulk

Source

Drain

The small signal model is simplified with the

removal of the shaded elements associated

with the bulk node.

UltraCMOS®• Insulating

substrate

• CMOS Digital,

Analog, RF

• Logic functions

• High yielding

• High ESD rating

• Processed in

multiple fabs

• High Q insulating substrate

• Allows RF Integration

• High Q passives (L/C)

• Lange Couplers

• Wilkinson Combiners

• RF Hybrids

UltraCMOS® Linearity

UltraCMOS® Technology UltraCMOS® Integration

Standard

CMOS

UltraCMOS®

Results in High Linearity

Microwave blocks

Frequency (GHz)

( phase S21-phase S31 ) deg

Example of Microwave Distributed Structures

• Lange Physical Length = 1600 um

• Line width = 7 um, Line separation = 9 um

• EM Simulated over DC to 100 GHz

7

P1

P3

P4

P2

Frequency (GHz)

Magnitude Balance

dB(S21)

dB(S31)

Frequency (GHz)

Return Loss

dB(S33)

dB(S22)

dB(S11)

Integration of Microwave Elements

• Integration of high performance coupler structures

relies on a low loss substrate

• UltraCMOS loss tan is < 0.00014 @ 19 GHz

- Better than Alumina at 0.0012

• Capability can be used in other distributed circuits

• Wilkinson power dividers

• Broad band baluns

8

7um W&S

PE82670 – Introducing the first Peregrine core-chip

Peregrine Semiconductor Proprietary 9

Part #RF Freq

(GHz)

DSA

Bits

Phase

Shift bits

Insertion

loss (dB)

Isolation

(dB)Package

Export

Status

Release

Status

PE82670 9.0-10.1 6 6/10 14 50 Bare die UKAS – Feb 15

FP – Jul 15

Die on Test Board

Monolithic solution

Built on UltraCMOS ®

Silicon-on-sapphire

technology

Accurate

Reliable

Repeatable

performance, chip to

chip, lot to lot, for the

lifetime of your product

Seri

al B

us

Inte

rfa

ce

CLK

DATA

EN

VDD

VSS

TX_IN

RX_OUT TX_OUT

RX_IN

Current Performance – Phase range

Peregrine Semiconductor Proprietary 10

Phase and amplitude adjustment

Peregrine Semiconductor Proprietary 11

PHASE ADJUSTMENT ON LINEAR SCALE

- 10.6 GHZ (+90 DEG FOR CLARITY)

- 9.6 GHZ

- 8.6 GHZ (-90 DEG FOR CLARITY)

AMPLITUDE ADJUSTMENT (DB)

Isolation –Key Performance Parameter

Peregrine Semiconductor Proprietary 12

TX_IN TO RX_OUT ISOLATION

BLUE TRACE – SIMULATED PCB

RED TRACE – MEASURED PCB

LOWER TRACES – DE-EMBEDDED DIE

PERFORMANCE

In Summary

Peregrine Semiconductor Proprietary 13

• Peregrine discussed these concepts back in 2012

• Since 2012, we have developed fundamental MMIC design capabilities

• Successfully developed an X-Band core chip

• Implemented multiple functions on a single die

• MMIC design elements: Lange Coupler

• RF design elements: Tx/Rx switches

• Analog Design elements: Voltage regulation

• Digital elements: Control interface

• Performance that matches or exceeds that of existing solutions

• Peregrine has now shown that UltraCMOS® technology is a viable

solution for integrated high-frequency products

Thank YouNASDAQ: PSMI

psemi.com