datasheet raystar rc1602b bperw esx

: 42878 25 5F WEB: http://www.Raystar-Optronics.com 5F, No.25, keya Rd. Daya Township, Taichung E-mail: [email protected] Tel:886-4-2565-0761 Fax886-4-2565-0760 County, Taiwan

RC1602B-BIW-ESX

SPECIFICATION CUSTOMER:

APPROVED BY PCB VERSIONwww.DataSheet4U.com

DATEFOR CUSTOMER USE ONLY

SALES BY

APPROVED BY

CHECKED BY

PREPARED BY

ISSUED DATE:

Page 1 , Total 28 Pages

RC1602B-BIW-ESX

Contents1. Revision History 2. General Specification 3. Module Coding System 4. Interface Pin Function 5. Outline dimension & Block Diagram 6. Display Control Instruction 7. Character Generator ROM Pattern 8. Instruction Table 9. Timing Characteristics 10. Initializing of LCM 11. Optical Characteristics 12. Absolute Maximum Ratings 13. Electrical Characteristics 14. Backlight Information 15. Reliability 16. Inspection specification 17. Precautions in use of LCD Modules www.DataSheet4U.com 18. Material List of Components for RoHs Page 3 4 5 6 7 8 11 12 13 15 17 18 18 19 20 21 25 26


1. Revision HistoryDATE 2008.06.17 VERSION 1 REVISED PAGE NO. Note First issue

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2. General SpecificationThe Features is described as follow: Module dimension: 80.0 x 36.0 x 13.2 (max.) mm3 View area: 66.0 x 16.0 mm2 Active area: 56.20 x 11.5 mm2 Number of Characters: 16 characters x 2 Lines Dot size: 0.55 x 0.65 mm2 Dot pitch: 0.60 x 0.70 mm2 Character size: 2.95 x 5.55 mm2 Character pitch: 3.55 x 5.95 mm2 LCD type: STN Negative, Blue Transmissive, Duty: 1/16 View direction: 6 oclock Backlight Type: LED white

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3. Module Coding SystemR 1 C 2 1602 3 B 4 B 5 I 6 W 7 ESX 8

Item Description RRaystar Optronics Inc. 1 CCharacter Type 2 Display GGraphic Type Number of dotsCharacter 16 words, 2 Lines. 3 4 Serials code PTN Positive, Gray NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green BSTN Negative, Blue FFSTN Positive TFSTN Negative AReflective, N.T, 6:00 KTransflective, W.T,12:00 DReflective, N.T, 12:00 1Transflective, U.T,6:00 GReflective, W. T, 6:00 4Transflective, U.T.12:00 JReflective, W. T, 12:00 0Reflective, U. T, 6:00 3Reflective, U. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 HTransflective, W.T,6:00 NWithout backlight PEL, Blue green TEL, Green DEL, White CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00 2Transmissive, U. T, 6:00 5Transmissive, U.T,12:00 YLED, Yellow Green ALED, Amber WLED, White OLED, Orange

5

LCD

Polarizer Type, 6 Temperature range, direction

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7

Backlight

8

FCCFL, White GLED, Green ES: English and European standard font. Special code X: Without Negative Voltage.


4. Interface Pin FunctionPin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol VSS VDD VO RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K Level 0V 5.0V H/L H/L H,HL H/L H/L H/L H/L H/L H/L H/L H/L Ground Supply Voltage for logic H: DATA, L: Instruction code H: Read(MPUModule) L: Write(MPUModule) Chip enable signal Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line LED + LED Description

(Variable) Operating voltage for LCD

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5. Outline Dimension &Block Diagram4.95 7.55 12.45 8.0 P2.54*15=38.1 3.0 1.8 16-O1.0 PTH1

80.0 0.5 71.2 66.0(VA) 56.2(AA) 13.2Max 2.5 8.6 2

16

K 36.0 0.5 25.2 16.0(VA) 11.5(AA) 5.08

A 4-O1.0 2.5 40.55 75.0 3.55 2.95 0.6 0.55 4- 2.5 PTH 4- 5.0 PAD 1.6 LED B/L 0.6

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Vss Vdd Vo RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K

12.55

10.3

5.7

15.76

18.3

The non-specified tolerance of dimension is5.95 5.55 0.7 0.65

31.0

0.3mm.

0.4

DOT SIZE SCALE 5/1

RS R/W MPU www.DataSheet4U.com E DB0~DB7 80 series or 68 series

Com1~16

Controller/Com Driver HD44780 or Equivalent

16X2 LCDSeg1~40 Seg41~80

VR 10K~20K

Vdd Vo Vss

Bias and Power Circuit

D M CL1 CL2 Vdd,Vss,V1~V5

Seg Driver

External contrast adjustment.

Optional

Character located DDRAM address DDRAM address

N.V. Generator

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F


6. Display Control InstructionThe LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected. RS 0 0 1 1 R/W 0 1 0 1 Operation IR write as an internal operation (display clear, etc.) Read busy flag (DB7) and address counter (DB0 to DB7) Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)

Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM. Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 808 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0

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Display position DDRAM address 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 2-Line by 16-Character Display

Character Generator ROM (CGROM) The CGROM generate 58 dot or 510 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 58 dots, eight character patterns can be written, and for 510 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.

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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1.F o r 5 * 8 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 2 ) C h a ra c te r p a tte rn ( 1 )

H ig h

Low

0

0

0

0

* 0

0

0

0

0

0

0

* 0

0

1

Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 0 1 1 0 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1

H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *

Low

0 0 0 0 0 0

C u rs o r p a tte rn

0


0

0

0

0

*

1

1

1

*

*

*

F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 0 0 0 0 0 0 0 0 1 1 1 1 4 3 2 0 0 0 0 1 1 1 1 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * 6 * * * * * * * * * * * * 5 4 3 0 0 0 0 0 0 0 0 0 * 2 Low 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 * C h a ra c te r p a tte rn 0 0 0 1 0

H ig h www.DataSheet4U.com

Low

Low

H ig h * 0 * 0 * * * * * * * * * 0 * *

0

0

0

0

* 0

0

0

0

0


: " H ig h "


7. Character Generator ROM PatternTable 2.Upper 4 bit Lower 4 bit

LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH

LLLL

CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8) CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8)

LLLH

LLHL

LLHH

LHLL

LHLH

LHHL

LHHH

HLLL

HLLH

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HLHL

HLHH

HHLL

HHLH

HHHL

HHHH


8. Instruction TableInstruction Code Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display Return Home Entry Mode Set Display ON/OFF Control Cursor or Display Shift Function Set Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAMwww.DataSheet4U.com

Description

Execution time (fosc=270Khz)

0

0

0

0

0

0

0

0

0

1

Write 00H to DDRAM and set DDRAM address to 00H from AC Set DDRAM address to 00H from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed. Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. Set cursor moving and display shift

1.53ms

0

0

0

0

0

0

0

0

1

1.53ms

0 0

0 0

0 0

0 0

0 0

0 0

0 1

1 D

I/D C

SH B

39s 39s

0

0

0

0

0

1

S/C R/L

control bit, and the direction, withoutchanging of DDRAM data. Set interface data length (DL:8-bit/4-bit), numbers of display line (N:2-line/1-line)and, display font type (F:511 dots/58 dots) Set CGRAM address in address counter. Set DDRAM address in address counter. Whether during internal operation or not can be known by reading BF. The contents of address counter can also be read. Write data into internal RAM (DDRAM/CGRAM). Read data from internal RAM (DDRAM/CGRAM).

39s

0

0

0

0

1

DL

N

F

39s

0 0

0 0

0 1

1

AC5 AC4 AC3 AC2 AC1 AC0

39s 39s

AC6 AC5 AC4 AC3 AC2 AC1 AC0

0

1

BF AC6 AC5 AC4 AC3 AC2 AC1 AC0

0s

1 1

0 1

D7 D7

D6 D6

D5 D5

D4 D4

D3 D3

D2 D2

D1 D1

D0 D0

43s 43s

Read Data from RAM


9. Timing Characteristics9.1 Write Operation

Ta=25, VDD=5.0V Itemwww.DataSheet4U.com

Symbol TC TPW TR,TF tAS tAH tDSW tH

Min 1200 140 0 10 40 10

Typ

Max 25

Unit ns ns ns ns ns ns ns

Enable cycle time Enable pulse width Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data set-up time Data hold time


9.2

Read Operation

Ta=25, VDD=5V Item Enable cycle time Enable pulse width (high level)www.DataSheet4U.com

Symbol TC TPW TR,TF tAS

Min 1200 140 0

Typ

Max 25

Unit ns ns ns ns

Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data delay time Data hold time

tAH tDDR tH

10 10

100

ns ns ns


10. Initializing of LCM

Power on Wait for more than 40 ms after VDD rises to 4.5 VBF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 1 1 0 * * * * Wait for more than 39usBF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 0 * * * * 0 0 N F * 0 * * * * * 0 Wait for more than 39 s

Function set

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 * * * Function set 0 1 0 * 0 0 0 * * * 0 0 N F * * * Wait for more than 37us

BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control * * * 0 0 * 0 0 0 0 * * * 0 * 1 D C B 0 Wait for more than 37 s

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RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 * * 0 * 0 0 * 0 0 0 * * * 0 1 0 * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 * * * 0 0 * 0 * * * 0 1 0 0 I/D SH * Initialization ends

4-Bit Ineterface


Power on W for more than 40 ms after VDDrises to 4.5 V aitBF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 39us aitBF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 37us ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D W for more than 37 s ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear www.DataSheet4U.com 0 0 0 0 0 0 0 0 0 1 W for more than 1.53ms ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends

8-Bit Ineterface


11. Optical CharacteristicsItem View Angle Contrast Ratio Response Time Symbol (V) (H) CR T rise T fall Condition CR2 CR2 Min 20 -30 Typ 3 150 150 Max 40 30 200 200 Unit deg deg ms ms

Definition of Operation Voltage (Vop)

Definition of Response Time ( Tr , Tf )

Intensity 100

Selected Wave

Non-selected Conition Intensity

Selected Conition

Non-selected Conition

Non-selected Wave

10

Cr Max

Cr = Lon / Loff100

90

Vopwww.DataSheet4U.com

Driving Voltage(V)

Tr

Tf

[positive type]

[positive type]

Conditions : Operating Voltage : Vop Viewing Angle() : 0 0 Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR2)b f = 180

l

r

= 270

= 90

= 0


12. Absolute Maximum RatingsItem Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Symbol TOP TST VI VDD-VSS VDD-V0 Min -20 -30 VSS -0.3 -0.3 Typ Max +70 +80 VDD 7 13 Unit V V V

13. Electrical CharacteristicsItem Supply Voltage For Logic Supply Voltage For LCD Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current Symbol VDD-VSS Condition Ta=-20 VDD-V0 Ta=25 Ta=70 VIH VIL VOH VOL IDD VDD=5.0V Min 4.5 3.2 0.7 VDD VSS 3.9 1.0 Typ 5.0 3.7 1.2 Max 5.5 5.2 VDD 0.6 0.4 1.5 Unit V V V V V V V V mA

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14. Backlight InformationSpecificationPARAMETER SYMBOL MIN 28.8 3.3 24 IV 5. 6 Chromaticity x y Life Time (For Reference only) Color White 30K Hr. 0.300 0.310 30 7 CD/M2 ILED=32mA TYP 32 3.5 MAX 40 3.7 5 UNIT mA V V TEST V=3.5V CONDITION

Supply Current ILED Supply Voltage V Reverse Voltage VR Luminous Intensity

ILED32mA 25,50-60%RH, (Note 1)

Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum). www.DataSheet4U.com

2.Drive from pin15,pin16

pin15 pin16

R

R

A K

B/L

LCM(Will never get Vee output from pin15)


15. ReliabilityContent of Reliability Test (wide temperature, -20~70) Environmental TestTest ItemHigh Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. time. and the thermal stress to the element for a long time. Endurance test applying the electric stress under temperature for a long time. The module should be allowed to stand at 60,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 Thermal shock resistance 30min 5min 1 cycle fixed amplitude: 15mm Vibration.www.DataSheet4U.com

Content of Test

Condition200hrs 200hrs 200hrs low -20 200hrs 60,90%RH 96hrs

Note2 1,2 1

Endurance test applying the high storage temperature for a long 80 Endurance test applying the high storage temperature for a long -30 Endurance test applying the electric stress (Voltage & Current) 70

1,2

25

70

-20/70 10 cycles

-

30min

Frequency: Endurance test applying the vibration during transportation and 10~55Hz. using. One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS= 1.5k CS=100pF 1 time 3

Vibration test

Static electricity test

Endurance test applying the electric stress to the terminal.

Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container. Page 20 , Total 28 Pages

16. Inspection specificationNO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character, dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL

01

Electrical Testing

0.65

02

2.1 White and black spots on display 0.25mm, no more Black or white spots than three white or black spots present. on LCD 2.2 Densely spaced: No more than two spots or lines within (display only) 3mm 3.1 Round type : As following drawing =( x + y ) / 2

2.5

2.5 LCD black spots, white spots, 03 contaminatio www.DataSheet4U.com n 3.2 Line type : (As following drawing) (non-display) Length Width --L3.0 L2.5 --If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. W0.02 0.02W0.03 0.03W0.05 0.05W

Acceptable Q TY Accept no dense 2 As round type Acceptable Q TY Accept no dense 3 2 0 3

2.5

Size 0.20 0.200.50 0.501.00 1.00 Total Q TY

04

Polarizer bubbles

2.5


NO 05

Item Scratches

Criterion Follow NO.3 LCD black spots, white spots, contamination

AQL

Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:

06

Chipped glass

y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:

z: Chip thickness Z1/2t

2.5

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y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is the total length of each chip.

z: Chip thickness Z1/2t


NO

Item

Criterion

AQL

Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :

y: Chip width x: Chip length y0.5mm x1/8a 6.2.2 Non-conductive portion:

z: Chip thickness 0 zt

06

Glass crack

2.5

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z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa

y: Chip width

x: Chip length


NO 07

Item Cracked glass Backlight elements

Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCBX Y

AQL 2.5 0.65 2.5 0.65 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5

08

09

Bezel

10

PCBCOB

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X * Y

datasheet raystar rc1602b bperw esx

Documents

endurance

outline dimension

viewing x18a

logic supply

high storage

chip thickness

lcd side length

bit character