data sheet sky66288-11: 5150 to 5925 mhz high-efficiency 4 … · 2019-02-14 · data sheet •...

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203477E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 11, 2017 1

DATA SHEET

SKY66288-11: 5150 to 5925 MHz High-Efficiency 4 W Power Amplifier Applications

LTE small cell applications for Band 46

LTE advanced for unlicensed spectrum, LAA, and LTE-U

Driver amplifier for micro-base and macro-base stations

Active antenna array and massive MIMO

Features

High efficiency: PAE = 25% @ +28 dBm

High linearity: +28 dBm with < 50 dBc ACLR with pre-distortion (2x 20 MHz LTE)

Gain @+28 dBm output power: 34.5 dB

Excellent input and output return loss: to 50 system

Integrated active bias: performance compensated over temp

Integrated enable On/Off function: PAEN = 1.7 to 2.5 V

Single supply voltage: 5.0 V

Pin-to-pin compatible PA family supporting all 3GPP bands

Compact (16-pin, 5 5 1.3 mm) package (MSL3, 260 C per JEDEC J-STD-020)

Skyworks GreenTM products are compliant withall applicable legislation and are halogen-free.For additional information, refer to SkyworksDefinition of GreenTM, document number SQ04–0074.

VCC1

VCC2

VCC3VBIAS PAEN

Active Bias

RFIN RFOUT

Stage 1/2 PA

Stage 3 PA

Stage 4 PA

InputMatch

OutputMatch

203477C-001

Figure 1. SKY66288-11 Block Diagram

Description The SKY66288-11 is a high-efficiency fully input/output matched power amplifier (PA) with high gain and linearity. The compact 5 5 mm PA is designed for the unlicensed spectrum, LTE-advanced small cell base stations operating from 5150 to 5925 MHz. The active biasing circuitry is integrated to compensate PA performance over temperature, voltage, and process variation.

The SKY66288-11 is part of the high-efficiency, pin-to-pin compatible PA family supporting all 3GPP bands.

A block diagram of the SKY66288-11 is shown in Figure 1. The device package and pinout for the 16-pin device are shown in Figure 2. Table 1 lists the pin-to-pin compatible parts in the PA family. Signal pin assignments and functional pin descriptions are described in Table 2.

Table 1. Pin-to-Pin Compatible PA Family

Part Number Frequency (MHz) 3GPP Band

SKY66296-11 700 to 800 Bands 12, 13, 14, 17, 29, and 44

SKY66289-11 791 to 821 Band 20

SKY66295-11 800 to 900 Bands 5, 18, 19, 26 and 27

SKY66298-11 900 to 990 Band 8

SKY66291-11 1805 to 1880 Bands 3 and 9

SKY66299-11 1900 to 2000 Bands 2, 25, 33, 36, and 37

SKY66294-11 2000 to 2300 Bands 1, 4, 10, and 23

SKY66292-11 2300 to 2400 Bands 30, 40

SKY66297-11 2490 to 2690 Bands 7, 38, and 41

SKY66293-21 3400 to 3800 CBRS, Bands 22, 42, 43, and 48

SKY66288-11 5150 to 5925 Band 46, LAA, LTE-U

DATA SHEET • SKY66288-11: 5150 TO 5925 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 September 11, 2017 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203477E

1

2

3

4

5 6 7 8

9

10

11

12GND

RFIN

GND

GND

VBIA

S

PAEN

GND

GND

RFOUT

GND

GND

VCC3

GND

VCC2

GND

VCC1

203477C-002

16 15 14 13

Figure 2. SKY66288-11 Pinout (Top View)

Table 2. SKY66288-11 Signal Descriptions1

Pin Name Description Pin Name Description

1 GND Ground 9 RFOUT RF output port

2 RFIN RF input port 10 GND Ground

3 GND Ground 11 GND Ground

4 GND Ground 12 VCC3 Stage 4 collector voltage

5 VBIAS Bias voltage 13 GND Ground

6 PAEN PA enable 14 VCC2 Stage 3 collector voltage

7 GND Ground 15 GND Ground

8 GND Ground 16 VCC1 Stage 1 and Stage 2 collector voltage 1 The center ground pad must have a low inductance and low thermal resistance connection to the application’s printed circuit board ground plane.

Technical Description The matching circuits are contained within the device. An on-chip active bias circuit is included within the device for both input and output stages, which provides excellent gain tracking over temperature and voltage variations.

The SKY66288-11 is internally matched for maximum output power and efficiency. The input and output stages are independently supplied using the VCC1, VCC2, and VCC3 supply lines (pins 16, 14, and 12, respectively). The DC control voltage that sets the bias is supplied by the VCBIAS signal (pin 5).

Electrical and Mechanical Specifications The absolute maximum ratings of the SKY66288-11 are provided in Table 3. Recommended operating conditions are specified in Table 4, and electrical specifications are provided in Table 5 (5200 MHz) and Table 6 (5850 MHz).

Typical performance characteristics are shown in Figures 3 through 26.



Table 3. SKY66288-11 Absolute Maximum Ratings1

Parameter Symbol Minimum Maximum Units

RF input power (CW) PIN +10 dBm

Supply voltage (VCC1, VCC2, VCC3, VBIAS) VCC 5.5 V

Operating temperature TC -40 +100 C

Storage temperature TST -55 +125 C

Junction temperature TJ +150 C

Power dissipation PD 2.2 W

Device thermal resistance JC 25 C/W 1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set

at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.

ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD handling precautions should be used at all times.

Table 4. SKY66288-11 Recommended Operating Conditions

Parameter Symbol Test Condition Min Typ Max Units

Supply voltage (VCC1, VCC2, VCC3, VBIAS) VCC1, VCC2, VCC3, VBIAS 4.75 5 5.25 V

PA enable:

ON OFF

PAEN

1.7

2.0 0

2.5 0.5

V V

PA enable current IENABLE 1 12 A

Operating frequency (CW, TCASE = +85 °C) f 5150 5925 MHz

Operating temperature (CW, TCASE = +85 °C) TC -40 +25 +85 C

RF turn-on/turn-off time (CW, TCASE = +85 °C)

On time: 50% of PAen voltage to 90% of RF power

Off Time: 50% of PAen voltage to 10% of RF power

1.5 5 us



Table 5. SKY66288-11 Electrical Specifications1 (VCC1 = VCC2 = VCC3 = VBIAS = 5 V, PAEN = 2.0 V, f = 5200 MHz, TC = +25 C, Input/Output Load = 50 , Unless Otherwise Noted)


Small signal gain |S21| PIN = 30 dBm 33.5 dB

Gain @+28 dBm Gain@+28dBm POUT = +28 dBm 33 35 dB

Input return loss |S11| PIN = 30 dBm 6.5 8 dB

Output return loss |S22| PIN = 30 dBm 8 9 dB

Reverse isolation2 |S12| PIN = 30 dBm 50 dB

ACLR @ +28 dBm ACLR POUT = +28 dBm (20 MHz LTE, 8.5 dB PAR signal) -32 -28 dBc

ACLR 2C @ +28 dBm2 ACLR 2C POUT = +28 dBm (2x20 MHz LTE, 8.5 dB PAR signal) -30 dBc

Saturated output power2 PSAT CW, PIN = 8 dBm +36 dBm

Output power at 3dB gain compression P3dB CW, reference to small signal gain (PIN = -30 dBm) +34 +35 dBm

2nd harmonic2 2fO CW, POUT = +28 dBm -40 dBc

Power-added efficiency PAE CW, POUT = +28 dBm 22 25 %

Quiescent current ICCQ No RF signal 95 mA 1 Performance is guaranteed only under the conditions listed in this table. 2 Not tested in production. Verified by design.

Table 6. SKY66288-11 Electrical Specifications1 (VCC1 = VCC2 = VCC3 = VBIAS = 5 V, PAEN = 2.0 V, f = 5887.5 MHz, TC = +25 C, Input/Output Load = 50 , Unless Otherwise Noted)


Small signal gain |S21| PIN = 30 dBm 28 dB

Gain @+28 dBm |S21|@+28dBm POUT = +28 dBm 29 30 dB

Input return loss |S11| PIN = 30 dBm 9 10 dB

Output return loss |S22| PIN = 30 dBm 10 12 dB

Reverse isolation2 |S12| PIN = 30 dBm 50 dB

ACLR @ +28 dBm ACLR POUT = +28 dBm (20 MHz LTE, 8.5 dB PAR signal) -33 -29.5 dBc

ACLR 2C @ +28 dBm2 ACLR 2C POUT = +28 dBm (2x20 MHz LTE, 8.5 dB PAR signal) -31 dBc

Saturated output power PSAT CW, PIN = 8 dBm +34 dBm

Output power at 3dB gain compression P3dB CW, reference to small signal gain (PIN = -30 dBm) +32 +33.5 dBm

2nd harmonic2 2fO CW, POUT = +28 dBm -40 dBc

Power-added efficiency PAE CW, POUT = +28 dBm 20 24 %

Quiescent current ICCQ No RF signal 95 mA 1 Performance is guaranteed only under the conditions listed in this table. 2 Not tested in production. Verified by design.



Typical Performance Characteristics (Vcc1 = Vcc2 = Vcc3 = Vbias = 5 V, PAEN = 2.0 V, Tc = +25 C, Input/Output Load = 50 , Unless Otherwise Noted)

24

26

28

30

32

34

36

38

5150 5175 5200 5225 5250

Smal

l Sig

nal G

ain

(dB)

Frequency (MHz)

-40 °C+25 °C+85 °C

2034

77-0

03

Figure 3. Small Signal Gain @ Low Band (PIN = -30 dB)

2034

77-0

05

20

22

24

26

28

30

32

34

36

38

5150 5170 5190 5210 5230 5250

Gain

(dB)

Frequency (MHz)

-40 °C+25 °C+85 °C

40

Figure 5. Large Signal Gain @ Low Band (POUT = +28 dBm, CW)

2034

77-0

07

-20

-18

-16

-14

-12

-10

-8

-6

5150 5175 5200 5225 5250

Outp

ut R

etur

n Lo

ss (d

B)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 7. Output Return Loss @ Low Band (PIN = -30 dB)

2034

77-0

04

24

26

28

30

32

34

36

38

5725 5750 5775 5800 5825 5850 5875 5900 5925

Smal

l Sig

nal G

ain

(dB)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 4. Small Signal Gain@ High Band (PIN = -30 dB)

2034

77-0

06

20

22

24

26

28

30

32

34

36

38

40

5725 5750 5775 5800 5825 5850 5875 5900 5925

Gain

(dB)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 6. Large Signal Gain @ High Band (POUT = +28 dBm, CW)

2034

77-0

08-40 °C+25 °C+85 °C

-20

-18

-16

-14

-12

-10

-8

-6

5725 5750 5775 5800 5825 5850 5875 5900 5925

Outp

ut R

etur

n Lo

ss (d

B)

Frequency (MHz)

Figure 8. Output Return Loss @ High Band (PIN = -30 dB)



2034

77-0

09

-11

-10

-9

-8

-7

-6

5150 5175 5200 5225 5250

Inpu

t Ret

urn

Loss

(dB)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 9. Input Return Loss @ Low Band (PIN = -30 dB)

2034

77-0

11

20

22

24

26

28

30

32

34

36

38

40

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38

Gain

(dB)

POUT (dBm)

-40 °C+25 °C+85 °C

Figure 11. Gain vs Output Power @ 5200 MHz

2034

77-0

13

POUT (dBm)

20

22

24

26

28

30

32

34

36

38

40

-4 -2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36

Gain

(dB)

-40 °C+25 °C+85 °C

Figure 13. Gain vs Output Power @ 5887.5 MHz

2034

77-0

10

-17

-15

-13

-11

-9

5725 5750 5775 5800 5825 5850 5875 5900 5925

Inpu

t Ret

urn

Loss

(dB)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 10. Input Return Loss@ High Band (PIN = -30 dB)

2034

77-0

12

Gain

(dB)

POUT (dBm)

20

22

24

26

28

30

32

34

36

38

40

-4 -2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36

-40 °C+25 °C+85 °C

Figure 12. Gain vs Output Power @ 5787.5 MHz

POUT (dBm)

0

4

8

12

16

20

24

28

32

36

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

PAE

(%)

2034

77-0

14-40 °C+25 °C+85 °C

Figure 14. Power-Added Efficiency vs Output Power @ 5200 MHz



2034

77-0

15

0

4

8

12

16

20

24

28

32

36

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

PAE

(%)

POUT (dBm)

-40 °C+25 °C+85 °C

Figure 15. Power-Added Efficiency vs Output Power @ 5787.5 MHz

2034

77-0

17

18192021222324252627282930

5150 5170 5190 5210 5230 5250

PAE

(%)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 17. PAE @ POUT = +28dBm (CW) vs. Low Band Freq. over Temperature

2034

77-0

19

0200400600800

100012001400160018002000220024002600

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37

Iop

(mA)

POUT (dBm)

-40 °C+25 °C+85 °C

Figure 19. Total Current vs Output Power @ 5200 MHz

2034

77-0

16

0

4

8

12

16

20

24

28

32

36

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

PAE

(%)

POUT (dBm)

-40 °C+25 °C+85 °C

Figure 16. Power-Added Efficiency vs Output Power @ 5887.5 MHz

2034

77-0

18

18192021222324252627282930

5725 5750 5775 5800 5825 5850 5875 5900 5925

PAE

(%)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 18. PAE @ POUT = +28dBm (CW) vs. High Band Freq. over Temperature

2034

77-0

20

POUT (dBm)

0200400600800

100012001400160018002000220024002600

-4 -2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36

Iop

(mA)

-40 °C+25 °C+85 °C

Figure 20. Total Current vs Output Power @ 5787.5 MHz



2034

77-0

21

0

200

400

600

800

1000

1200

1400

1600

1800

2000

-4 -2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36

-40 °C+25 °C+85 °C

POUT (dBm)

Iop

(mA)

Figure 21. Total Current vs Output Power @ 5887.5 MHz

2034

77-0

23

-35

-34

-33

-32

-31

-30

-29

-28

-27

-26

-25

23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 27.5 28.0 28.5 29.0

ACLR

(dBc

)

POUT (dBm)

5725 MHz5787.5 MHz5850 MHz

Figure 23. ACLR vs. Output Power for Mid Band (LTE, 1x20 MHz, PAR = 8.5dB)

2034

77-0

25

-65-63-61-59-57-55-53-51-49-47-45-43-41-39-37-35

5150 5170 5190 5210 5230 5250

2nd

Harm

onic

s (d

Bc)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 25. Second Harmonic @ POUT = +28dBm (Low Band, CW)

2034

77-0

22

-35

-34

-33

-32

-31

-30

-29

-28

-27

-26

-25

23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 27.5 28.0 28.5 29.0

ACLR

(dBc

)

POUT (dBm)

5150 MHz5200 MHz5250 MHz

Figure 22. ACLR vs. Output Power for Low Band (LTE, 1x20 MHz, PAR = 8.5 dB)

2034

77-0

24

-35

-34

-33

-32

-31

-30

-29

-28

-27

-26

-25

23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 27.5 28.0 28.5 29.0

ACLR

(dBc

)

POUT (dBm)

5850 MHz5887.5 MHz5925 MHz

Figure 24. ACLR vs. Output Power for High Band (LTE, 1x20 MHz, PAR = 8.5dB)

2034

77-0

26

-65-63-61-59-57-55-53-51-49-47-45-43-41-39-37-35

5725 5775 5825 5875 5925

2nd

Harm

onic

s (d

Bc)

Frequency (MHz)

-40 °C+25 °C+85 °C

Figure 26. Second Harmonic @ POUT = +28dBm (Low Band, CW)



Evaluation Board Description The SKY66288-11 Evaluation Board is used to test the performance of the SKY66288-11 PA. An Evaluation Board schematic is provided in Figure 27. Table 7 provides the Bill of Materials (BOM) list for Evaluation Board components.

An assembly drawing for the Evaluation Board is shown in Figure 28. Board layer details are shown in Figure 29. Layer detail physical characteristics are noted in Figure 30.

Circuit Design Considerations

The following design considerations are general in nature and must be followed regardless of final use or configuration:

Paths to ground should be made as short as possible.

The ground pad of the SKY66288-11 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Because the circuit board acts as the heat sink, it must shunt as much heat as possible from the device.

Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required.

NOTE: A poor connection between the ground pad and ground increases junction temperature (TJ), which reduces the life of the device.

Evaluation Board Test Procedure

Turn-On Sequence

1. Connect 50 Test Equipment or Load to the input and output RF ports of the Evaluation Board.

2. Connect the DC ground.

3. Connect all VCCs and VBIAS lines to a +5 V supply. Connect PAEN to a 2.0 V supply.

4. Without applying RF, turn on the 5 V supply, then turn on the 2 V PAEN.

5. Apply RF signal data at –30 dBm and observe that the gain of the device is approximately 34.5 dB. Begin measurements.

Turn-Off Sequence

1. Turn off the RF input to the device.

2. Turn off PAEN (set to 0 V).

3. Turn off all VCCs and VBIAS.

NOTE: It is important to adjust the VCC voltage sources so that +5 V is measured at the board. High collector currents drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate.



203477-027

1GND

2

GND2

3

4

GND1

C11 C10

11

9

10

GND7

C3

C6 C7 C8

RFOUT

GND3

17

GND4

12

13141516

RFIN

J8

RFOUT

GND8

PAEN

VBIA

S

GND5

GND6

VCC3

876

C4

5

L1

J7

SMA

GND_PAD

PAEN

SKY66288

VCC1

VCC2

C9C12

PAEN1

2

3

4

5

6

7

8

8 Header

U1

C1

Notes: 1. The C1 component shown in this assembly is a 0 Ω resistor. 2. The L1 component shown in this assembly is DNI.

VCC1

VCC1

VCC2

VCC3

VCC2

VCC3

VBIAS

VBIAS

Figure 27. SKY66288-11 Evaluation Board Schematic

Table. 7. SKY66288-11 Evaluation Board Bill of Materials (BOM)

Component Description Size

C1 Resistor, 0 , 0.063 W 0402

C3 Ceramic capacitor, 1 F, 16 V, ±10% 0402

C4, C7, C9, C11 Ceramic capacitor, 3300 pF, X7R, ±10%, 50 V 0402

C6 Ceramic capacitor, 100 pF 0402

C8, C10, C12 Ceramic capacitor, 10 F, 16 V, ±10% , X7R 1206

L1 DNI DNI

J8J19

C12 C10

C6C8

C7C11

C1

L1

C4C3

U1

C9

J1

203477-028

PAEN VBIAS GND VCC1 GND VCC2 GND VCC3

Notes: 1. Evaluation Board Gerber files are available on request.2. The C1 component shown in this assembly is a 0 Ω resistor. 3. The L1 component shown in this assembly is DNI.

RF INRF OUT

Figure 28. Evaluation Board Assembly Drawing



2034

77-0

29

Layer 1 Layer 2

Layer 3 Layer 4

Figure 29. Evaluation Board Layer Details

Cross Section Name Thickness (mm) Materials

TMaskL1DielectricL2DielectricL3DielectricL4BMask

0.0100.0350.2500.0350.3500.0350.2500.0350.010

Solder ResistCu, 1 oz.R04350Cu, 1 oz.FR4Cu, 1 oz.FR4Cu, 1 oz.Solder Resist

50 Ohm

W = 0.500 mm

203477-030

Figure 30. Layer Detail Physical Characteristics



Application Circuit Notes Center Ground. It is extremely important to sufficiently ground the bottom ground pad of the device for both thermal and stability reasons. Multiple small vias are acceptable and work well under the device if solder migration is an issue.

GND (pins 1, 3, 4, 7, 8, 10, 11, 13, and 15). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout allows. Multiple small vias are acceptable and will work well under the device if solder migration is an issue.

VCBIAS (pin 5). The bias supply voltage for each stage, nominally set to +5 V.

RFOUT (pin 9). Amplifier RF output pin (ZO = 50 ). The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module.

VCC1, VCC2, and VCC3 (pins 16, 15, and 12, respectively). Supply voltage for each stage collector bias is nominally set to 5 V. The evaluation board has inductors L1 and L2. These are place holders, and should be populated with 0 resistors. Bypass and decoupling capacitors C6 through C12 should be placed in the approximate location shown on the evaluation board assembly drawing, although exact placement is not critical.

RFIN (pin 2). Amplifier RF input pin (ZO = 50 ). The module includes an internal DC blocking capacitor. All impedance matching is provided internal to the module.

Package Dimensions The PCB layout footprint for the SKY66288-11 is shown in Figure 31. The typical part marking is shown in Figure 32. Package dimensions are shown in Figure 33, and tape and reel dimensions are provided in Figure 34.

Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.

The SKY66288-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 250 C. It can be used for lead or lead-free soldering. For additional information, refer to Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752.

Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format.



Stencil ApertureTop View

Pin 16Pin 1 Indicator

0.20 X 45°Pin 1

Package Outline

0.8 mm Pitch

Stencil aperture size for center ground pad should be80% to 100% (by area) of the solder mask opening

0.125 mm Typ

9X ø0.875 mm

5.3 mm

16X 0.5 mm16X 0.67 mm

5.3 mm

Pin 16

5.3 mm

7X 0.67 mm7X 0.5 mm

5.3 mm0.6 mm Pitch

0.8 mm Pitch 0.25 mm Typ

Package Outline

Thermal via array Ø0.3 mmon 0.6 mm pitch improves

thermal performance

0.6 mm Pitch

MetallizationTop View

Pin 1

Pin 16Pin 1 Indicator

0.20 X 45°Pin 1

0.8 mm Pitch

Package Outline

Solder Mask OpeningTop View

16X 0.6 mm16X 0.77 mm

5.4 mm

5.4 mm

2X 1.4375 mm

2X 1.4375 mmOpening size of 60% to 100%

of exposed center opening shown

Notes:

1. Thermal vias should be resin filled and capped in accordance with IPC–4761 type VII vias. 2. Recommended Cu thickness is 30 to 35 μm. 203477-031

Figure 31. SKY66288-11 PCB Layout Footprint

Pin 1Indicator

SkyworksPart Number

Lot Code

Date Code:YY = Calendar YearWW = Work WeekCC = Country Code

203477-032

66288-11XXXXXXXXXYYWW CC

Figure 32. SKY66288-11 Typical Part Marking



Pin 1 Indicator

5

5

B

C

0.15 A B C

Top View

0.42 ± 0.1

(0.1)

0.5 ±0.05 0.6 ±0.05

Metal Pad Edge

Solder Mask Edge

0.875

0.875

Solder Mask EdgesDetail BPad

Scale: 2X8X this rotation

Detail APad

Scale: 2X4X this rotation4X rotated 180°

4X rotated 90° CW4X rotated 90° CCW

4X R0.05 Max.

Side View

Detail CPad

Scale: 2X1X this rotation

Solder Mask Edges

0.875

5X R0.05 Max.

0.20 x 45°

0.875

Top

A

0.1

1.3 ±0.1

8X 2.4

4X 1.2

4X 0.4

4X 1

.2

4X 0

.4

8X 2

.4

6X 1

6X 1

Pin 1 IndicatorSee Detail C

Pin 16

See Detail B

See Detail A

16X SMT Pad

0.2 A B C

0.1 M A B C

Solder Mask Opening

Bottom View

203477-033

Notes:

1. Dimensions are in millimeters (unless otherwise specified).2. Dimensions and tolerances are in accordance with ASME Y14.5M–1994.

0

0

Pin 1

6X 1

Figure 33. SKY66288-11 Package Dimensions

1.40 ± 0.10

2.00 ± 0.10 4.00 ± 0.10

5.25 ± 0.10

8.00 ± 0.10

0.25 ± 0.20

5.50

± 0

.10

1.75 ± 0.10

12.0

0 ±

0.2

0

Ø1.50 ± 0.10

5.25

± 0

.10

Pin 1

Ø1.50 ± 0.10

Notes:1. Carrier tapes must meet all requirements of Skyworks GP01-D232 procurement spec for tape and reel shipping.2. Carrier tape shall be black conductive polycarbonate.3. Cover tape shall be transparent conductive material.4. ESD-surface resistivity shall be ≤ 1 × 1010 Ω/square per EJA, JEDEC TNR specification.5. All measurements are in millimeters.

203477-034

Figure 34. SKY66288-11 Tape and Reel Dimensions



Ordering Information Model Name Manufacturing Part Number Evaluation Board Part Number

SKY66288-11: 5150 to 5925 MHz High-Efficiency 4 W Power Amplifier SKY66288-11 SKY66288-11-EVB

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data sheet sky66288-11: 5150 to 5925 mhz high-efficiency 4 … · 2019-02-14 · data sheet •...

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