Features • ComplianttoXFPMSA• Compliant to IEEE 802.3ae 10GBASE-LR for 10GbE,

10.3125Gb/s• Compliantto10GFC1310nmSerialPMD,type1200-

SM-LL-L,10.51875Gb/s• Compatiblewith11.3GoperationforFECfunctionality• AvagoTechnologies’uncooled1310nmDFBLaserand

PINPhotodiode• CompliantXFI10GSerialelectricalinterface• LCDuplexopticalconnectorinterfaceconformingto

ANSITIA/EIA604-10(FOCIS10)• 1.5Wtypicalpowerdissipation• Superior Thermal and EMI integrity performance to

supporthighportdensities• Customizableclip-onheatsinktosupportavarietyof

linecardenvironments• -5to+70°Ccaseoperatingtemperaturerange• Capableofextendedtemperature(-10Cto+85Ccase)

operation**• Hardwarepinsareavailableforthefollowingcontrol

signals: -Transmitterdisable -Modulepowerdown/RESET -Receiverlossofsignal -Modulenotready -Programmableinterrupt• 2-wireserialmanagementinterfaceprovidesrealtime

monitorsof: -TransmittedOpticalPower -ReceivedOpticalPower -LaserBiasCurrent -ModuleTemperature• LinkLengthsupto10kmwith9µmfiber• IEC60825-1Class1/CDRHClass1lasereyesafety.

**Note:Longtermreliabilityatelevatedtemperaturesisnotguaranteed.

DescriptionThe1310nmXFPtransceiverisahighperformance,costeffectivemoduleforserialopticaldatacommunicationsapplicationsspecifiedforsignalratesof10.30Gb/sto10.52Gb/s.It iscomplianttoXFPMSARev4.5.Themoduleisdesignedforsinglemodefiberandoperatesatanominalwavelengthof1310nm.Thetransmittersectionincorpo-ratesAvagoTechnologies’uncooleddirectlymodulated1310 nm distributed feedback laser (DFB).The receiversection uses AvagoTechnologies’ MOVPE grown planarSEDETPINphotodetectorforlowdarkcurrentandexcel-lentresponsivity.IntegratedTxandRxsignalcondition-ersprovidehigh jitter-tolerancefor fullXFIcompliance.TheinternallyaccoupledhighspeedserialI/Osimplifiesinterfacing to external circuitry.The electrical interfaceismadeusinganindustrystandard0.8mmpitch30-pinrightangleconnector.OpticalconnectionismadeviatheduplexLCconnector.

Applications• FiberChannelSwitches• HostBusAdapterCards• MassStorageSystemandServerI/O• EthernetSwitches• CoreRouters

HFCT - 721 XPD10GbE/10GFC 1310 nm XFP 10 Gbit/s Optical Transceiver

Data Sheet

The product also offers digital diagnostics using the 2-wireserialinterfacedefinedintheXFPMSA.Theproductprovidesrealtimetemperature(moduleandlaser),supplyvoltage,laserbiascurrent,laseraverageoutputpowerandreceivedinputpower.Thedigitaldiagnosticinterfacealsoaddstheabilitytodisablethetransmitter(TX_DIS),powerdownthemodule,monitorformodulefaultsandmonitorforReceiverLossofSignal(RX_LOS).Transmitterdisable,interrupt,powerdown/reset, receiver lossofsignalandmodulenotreadyarealsohardwiredpinsonthe30-pinrightangleconnector.

Installation

TheHFCT-721XPDcanbeinstalledinanyXFPportregard-lessofhostequipmentoperatingstatus.TheHFCT-721XPDis hot-pluggable, allowing the module to be installedwhilethehostsystemisoperatingandon-line.Theclip-onheatsinkisdesignedtoclipontotheXFPcagewithoutamodulepresent.

Upon insertion, the transceiver housing makes initialcontactwiththehostboardXFPcage,mitigatingpotentialdamageduetoElectro-StaticDischarge(ESD).Oncefullyinserted into the XFP cage, the top surface of the XFPmodulemakescontactwiththeheatsinkthroughacutoutinthetopofthecageensuringaneffectivethermalpathformoduleheat.

Functional Description

Transmitter Section

Thetransmittersectionincludesa1310nmDFB(Distrib-uted Feedback Laser) light source, a transmitter drivercircuit and a signal conditioner circuit on the TX datainputs.(seeFigure1)Opticalconnectiontothetransmit-terisprovidedviaaLCconnector.TheopticaloutputiscontrolledbyacustomICthatdetectsthelaseroutputviathemonitorphotodiode.ThisICprovidesbothdcandaccurrentdrivetothelasertoensurecorrectmodulation,eyediagramandextinctionratioovertemperature,supplyvoltageandoperatinglife.

TX_DIS

Assertingpin5,TX_DIS,willdisablethetransmitteropticaloutput.Thetransmitteroutputcanalsobedisabledandmonitoredviathetwo-wireserialinterface.

Eye Safety Circuit

Undernormaloperatingconditions laserpowerwillbemaintained below Class 1 eye-safety limits. Should acatastrophiclaserfaultoccurandopticalpowerbecomeuncontrolled, the micro-controller will detect the fault,shutdownthelaser,powerdownthemoduleandassertthehard-wiredMOD_NRflag.TheTX_FAULToutputinthe2-wireserialinterfacewillalsobeasserted.

Figure 1. Transceiver Functional Diagram

PIN

Laser RFdriver

CWdriver

Opt

ical

rece

ptac

les

Elec

tric

al c

onne

ctor

Mon. PIN

ROSA

TOSAEEPROM

Microcontroller

A/D

ESA

Heat sink

Ana

log

sign

al

cond

ition

ers

Main housing

Analog bus

Digital 10Gb/s electricalI/O

Digital lowspeed bus orsignal

Analog signal

Powersupply

control

TIATIA

+.VSignal

Conditioner

Signal

Conditioner

Receiver Section

ThereceiversectionincludesaPINdetectorwithamplifica-tionquantizationsignalconditionercircuits.(seeFigure1)OpticalconnectiontothereceiverisprovidedviaaLCopticalconnector.

RX_LOS

The receiver section contains a loss of signal (RX_LOS)circuit to indicate when the optical input signal powerisinsufficientforreliablesignaldetection.Ahighsignalindicateslossofmodulatedsignal,indicatinglinkfailuresuchasabrokenfiberornonfunctionalremotetransmit-ter.RX_LOScanalsobemonitoredviathetwo-wireserialinterface(byte110,bit1).

XFP Module

Host Board

OptionalHost +5 V

4.7 µH VCC5

0.1 µF 22 µF 0.1 µF

Host +3.3 V 4.7 µH VCC3

0.1 µF 22 µF 0.1 µF

OptionalHost +1.8 V

4.7 µH VCC2

0.1 µF 22 µF 0.1 µF

OptionalHost -5.2 V

4.7 µH VEE5

0.1 µF 22 µF 0.1 µF

GND

XFP

Con

nect

or

Figure 2. MSA recommended power supply filter

Electrical Pinout

GND

RD-

RD+

GND

VCC2

P_DOWN/RST

VCC2

GND

REFCLK+

REFCLK-

GND

GND

TD-

TD+

GND

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

GND

RX_LOS

MOD_NR

MOD_ABS

SDA

SCL

VCC3

VCC3

GND

VCC5

TX_DIS

INTERRUPT

MOD_DESEL

VEE5

GND

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

TOWARDASIC

TOWARDBEZEL

Figure 4. Host PCB XFP Pinout Top View

Functional Data I/O

AvagoTechnologies’HFCT-721XPDfiber-optictransceiverisdesignedtoaccept industrystandardelectrical inputdifferentialsignals.Thetransceiverprovidesac-coupled,internally terminated data input and output interfaces.Biasresistorsandcouplingcapacitorshavebeenincludedwithinthemoduletoreducethenumberofcomponentsrequiredonthecustomer’sboard.

Table 1. Electrical Pin Definitions

Pin Name Logic Function/Description Notes

1 GND ModuleGround 1

2 VEE5 -5.2Vpowersupply.Notinternallyconnected.

3 Mod-Desel LVTTL-I ModuleDe-select;Whenheldlowallowsthemoduletorespondto2-wireSerialinterfacecommands

4 Interrupt LVTTL-O Interrupt;Indicatespresenceofanimportantconditionwhichcanbereadovertheserial2-wireinterface 2

5 TX_DIS LVTTL-I TransmitterDisable;TransmitterLaserSourceTurnedOff

6 VCC5 5Vpowersupply.Notinternallyconnected.

7 GND ModuleGround 1

8 VCC3 +3.3VPowerSupply

9 VCC3 +3.3VPowerSupply

10 SCL LVTTL-I TwoWireInterfaceClock 2

11 SDA LVTTL-I/O TwoWireInterfaceDataLine 2

12 Mod_Abs LVTTL-O LVTTL-OMod_AbsIndicatesModuleisnotpresent.GroundedintheModule 2

13 Mod_NR LVTTL-O ModuleNotReady;IndicatingModuleOperationalFault 2

14 RX_LOS LVTTL-O ReceiverLossOfSignalIndicator 2

15 GND ModuleGround 1

16 GND ModuleGround 1

17 RD- CML-O ReceiverInvertedDataOutput

18 RD+ CML-O ReceiverNon-InvertedDataOutput

19 GND ModuleGround 1

20 VCC2 +1.8VPowerSupply.Notinternallyconnected.

21 P_Down/RST LVTTL-IPowerdown:Whenhigh,themoduleisputintoalowerpowermode.Serialinterfaceisfunctionalinthelowpowermode.Reset:ThefallingedgeinitiatesacompleteresetofthemoduleincludingtheserialInterface,equivalenttoapowercycle.

22 VCC2 +1.8VPowerSupply.Notinternallyconnected. 1

23 GND ModuleGround

24 RefCLK+ PECL-I ReferenceClockNon-InvertedInput,accoupledonthehostboard 3

25 RefCLK- PECL-I ReferenceClockInvertedInput,accoupledonthehostboard 3

26 GND ModuleGround 1,3

27 GND ModuleGround 1

28 TD- CML-I TransmitterInvertedDataInput

29 TD+ CML-I TransmitterNon-InvertedDataInput

30 GND ModuleGround 1

Notes:1. ModulegroundpinsGndareisolatedfromthemodulecaseandchassisgroundwithinthemodule.2. OpenCollectorshouldbepulledupwith4.7K-10Kohmstoavoltagebetween3.15Vand3.6Vonthehostboard.3. RefCLK+/-areinternallyterminated(50Ω)

Absolute Maximum Ratings

Parameter Symbol Minimum Typical Maximum Unit Notes

StorageTemperature(non-operating) TS -40 +85 °C 1,2

AmbientOperatingTemperature TA -40 +85 °C 1,2

RelativeHumidity RH 10 90 % 1

SupplyVoltage VCC3 0 3.6 V 1,2

LowSpeedInputVoltage VIN -0.5 VCC+0.5 V 1

Parameter Symbol Minimum Typical Maximum Unit Notes

PowerSupplyNoiseRejection(peak-peak)under1MHz

PSNR 2%ofVCC mV 5

PowerSupplyNoiseRejection(peak-peak)1MHzto10MHz

PSNR 3%ofVCC mV 5

Modulesupplycurrent ICC 680 mA

PowerDissipation PDISS 1.5 2100 mW

Low Speed Outputs:MOD_NR,RX_LOS,MOD_ABS,INTERRUPT

VOHVOL

Host_VCC-0.50.0 0.01

Host_VCC+0.30.4

VV

67

Low Speed Inputs:TX_DIS,MOD_DESEL,P_DOWN/RST

VIHVIL

2.0-0.3

VCC3+0.30.8

VV

89

Parameter Symbol Minimum Typical Maximum Unit Notes

CaseOperatingTemperature TC -5 +70 °C 3

SupplyVoltage VCC3 3.135 3.465 V 4,5

DataRate 9.953 10.52 Gb/s 4

OpticalInputPowerMax Pinmax 6 dBm 1,2

Notes:1. AbsoluteMaximumRatingsarethosevaluesbeyondwhichdamagetothedevicemayoccuriftheselimitsareexceededforotherthanashort

periodoftime.SeeReliabilityDataSheetforspecificreliabilityperformance.2. BetweenAbsoluteMaximumRatingsandtheRecommendedOperatingConditionsfunctionalperformanceisnotintended,devicereliability

isnotimplied,anddamagetothedevicemayoccuroveranextendedperiodoftime.3. TheAmbientOperatingTemperaturelimitationsarebasedontheCaseOperatingTemperaturelimitationsandaresubjecttothehostsystem

thermaldesign.4. RecommendedOperatingConditionsarethosevaluesforwhichfunctionalperformanceanddevicereliabilityisimplied5. VccconditionappliestosupplyvoltageattheXFPmodule6. FilterperXFPspecificationisrequiredonthehostboard.7. 4.7kto10kW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IOH(max)=-2mA.8. 4.7kto10kW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IOL(max)=2mA.9. 4.7kto10kW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IOL(max)=10µA.10.4.7kto10kW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IIH(max)=-10µA.

Transceiver Electrical Characteristics(TC=-5°Cto+70°C,VCC3=3.3V±5%)

Recommended Operating Conditions

Transmitter Electrical Input Characteristics(TC=-5°Cto+70°C,VCC3=3.3V±5%)

Parameter Symbol Minimum Typical Maximum Unit Notes

DifferentialInputImpedance Zd 100 W

TerminationMismatch DZM 5 %

DifferentialInputAmplitude DVQDO 120 820 mV peaktopeak(1)

DifferentialInputReturnLoss SDD11 20 dB 0.05to0.1GHz

DifferentialInputReturnLoss SDD11 8 dB 0.1to5.5GHz

DifferentialInputReturnLoss SDD11 8-20.66log10(f/5.5)finGHz

dB 5.5-12GHz

CommonModeInputReturnLoss SCC11 3 dB 0.1to15GHz

DifferentialtoCommonModeConversion SCD11 -10 dB 0.1to15GHz

JitterandEyeMask XFPMSACompliant

Parameter Symbol Minimum Typical Maximum Unit Notes

DifferentialInputImpedance Zd 100 W

TerminationMismatch DZM 5 %

DifferentialOutputAmplitude 340 850 mV peaktopeak(1)

DCCommonModePotential Vcm 0 3.6 V

OutputACCommonModeVoltage 15 mV RMS

OutputRise/Falltime(20%to80%) tRH,tFH 24 ps

Commonmodeoutputreturnloss SCC22 3 0.1to15GHz

Differentialoutputreturnloss SDD22 20 dB 0.05to0.1GHz

Differentialoutputreturnloss SDD22 8 dB 0.1to5.5GHz

Differentialoutputreturnloss SDD22 8-20.66log10(f/5.5)finGHz

dB 5.5-12GHz

JitterandEyeMask XFPMSACompliant

Receiver Electrical Output Characteristics

Note:1. ThedifferentialinputandoutputamplitudesareperXFPMSAmaskatpointsB’andC’.

Transmitter Optical Characteristics 10 GbE/10GFC(TC=-5°Cto+70°C,VCC3=3.3V±5%)

Parameter Symbol Minimum Typical Maximum Unit Notes

OpticalOutputPower Pout -5.2 dBmOMA 1,2

AverageOpticalOutputPower Pout -8.2 0.5 dBm 1,2,3

ExtinctionRatio ER 3.5 dB 1,2

SpectralWidth-rms s,rms 0.2 nmRMS 3

CenterWavelength λC 1260 1310 1355 nm

Transmitteranddispersionpenalty TDP 3.2 dB 1,3

Sidemodesuppressionratio 30 dB 1

Opticaloutputpower(min)inOMA-TDP -6.2 dBmOMA 1,3

RIN12(OMA) RIN -128 dB/Hz 1

OpticalEyeMask CompliantwithIEEE802.3ae10GBASE-LXFPMSA

Parameter Symbol Minimum Typical Maximum Unit Notes

AverageReceivepower -14.4 0.5 dBmmean 1

Stressedreceiversensitivity -10.3 dBmOMA 1

Receiversensitivity PIN -12.6 dBmOMA 3

MaxReceiverReflectance -12 dB 1

Wavelength λC 1260 1310 1355 nm

Notes:1. 10GFC1200-SM-LL-L/IEEE802.3ae10BASE-LRcompliant2. Theseparametersareinterrelated:seeIEEE802.3ae3. Forinformationonly

Receiver Optical Characteristics 10 GbE/10GFC(TC=-5°Cto+70°C,VCC3=3.3V±5%)

Transceiver Timing Characteristics(TC=-5°Cto+70°C,VCC3=3.3V±5%)

Parameter Symbol Minimum Typical Maximum Unit Notes

TX_DISAssertTime t_off 10 µs TimefromrisingedgeofTX_DIStowhentheopticaloutputfallsbelow10%ofnominal.

TX_DISNegateTime t_on 2 ms TimefromfallingedgeofTX_DIStowhenthemodulatedopticaloutputrisesabove90%ofnominal.

Timetoinitialize t_init 300 ms Frompoweronorhotplugaftermeetingpowersupplyspecs

Interruptassertdelay Interrupt_on 200 ms Fromoccurrenceoftheconditiontriggeringinterrupt

Interruptnegatedelay Interrupt_off 500 us Fromclearonreadinterruptflags

P_Down/RSTassertdelay

P_Down/RST_on

100 us FromPowerdowninitiation

P-Downnegatedelay P_Down/RST_off

300 ms Maxdelayfromnegatetocompletionofpowerupandreset

Mod_NRassertdelay Mod_nr_on 1 ms FromOccurrenceoffaulttoassertionofTX_NR

Mod_NRnegatedelay Mod_nr_off 1 ms FromOccurrenceofsignaltonegationofTX_NR

Mod_DeSelasserttime T_Mod_DeSel 2 ms MaximumdelaybetweenassertionofMod_DeSelandendofmoduleresponseto2-wireinterfacecom-munications

Mod_DeSelde-asserttime

T_Mod_Sel 2 ms Maximumdelaybetweende-assertionofMod_DeSelandpropermoduleresponseto2-wireinterfacecommunications

P_Downresettime t_reset 10 µs MinlengthofP-Downasserttoinitialreset

RX_LOSAssertdelay T_loss_on 100 µs FromOccurrenceoflossofsignaltoassertionofRX_LOS

RX_LOSnegatedelay T_loss_off 2.3 100 µs FromOccurrenceofpresenceofsignaltonegationofRX_LOS

SerialIDClockRate f_serial_clock 0 400 kHz

Digital Diagnostic Interface and Serial Identification

The2-wireserialinterfaceisexplicitlydefinedintheXFPMSARev4.0.2-wiretimingspecificationsandthestructureofthememorymapareperXFPMSARev2.0.Thenormal256ByteI2Caddressspaceisdividedintolowerandupperblocksof128Bytes.Thelowerblockof128BytesisalwaysdirectlyavailableandisusedfordiagnosticinformationprovidingtheopportunityforPredictiveFailureIdentifica-tion,CompliancePrediction,FaultIsolationandCompo-nentMonitoring.TheupperaddressspacetablesareusedforlessfrequentlyaccessedfunctionssuchasserialID,userwriteableEEPROM,reservedEEPROManddiagnosticsandcontrolspacesforfuturestandardsdefinition,aswellasAvagoTechnologies-specificfunctions.

Predictive Failure Identification

The diagnostic information allows the host system toidentifypotentiallinkproblems. Onceidentified,a“failover”techniquecanbeusedtoisolateandreplacesuspectdevicesbeforesystemuptimeisimpacted.

Compliance Prediction

The real-time diagnostic parameters can be monitoredtoalertthesystemwhenoperatinglimitsareexceededandcompliancecannotbeensured.Asanexample,therealtimeaveragereceiveopticalpowercanbeusedtoassess the compliance of the cable plant and remotetransmitter.

Fault Isolation

Thediagnosticinformationcanallowthehosttopinpointthelocationofalinkproblemandacceleratesystemser-vicingandminimizedowntime.

Component Monitoring

Aspartofhostsystemqualificationandverification,realtimetransceiverdiagnosticinformationcanbecombinedwithsystemlevelmonitoringtoensureperformanceandoperatingenvironmentaremeetingapplicationrequire-ments.

Transceiver Internal Temperature

TemperatureismeasuredontheHFCT-721XPDusingsens-ingcircuitrymountedontheinternalPCB.ThemeasuredtemperaturewillgenerallybecoolerthanlaserjunctionandwarmerthanXFPcaseandcanbeindirectlycorrelatedtoXFPcaseorlaserjunctiontemperatureusingthermalresistanceandcapacitancemodeling.Thismeasurementcanbeusedtoobservedriftsinthermaloperatingpointortodetectextremetemperaturefluctuationssuchasafailureinthesystemthermalcontrol.Formoreinforma-tiononcorrelatinginternaltemperaturetocaseorlaserjunctioncontactAvagoTechnologies.

Transmitter Laser dc Bias Current

Laserbiascurrentismeasuredusingsensingcircuitrylo-catedonthetransmitterlaserdriverIC.Normalvariationsin laser bias current are expected to accommodate theimpactofchangingtransceivertemperatureandsupplyvoltageoperatingpoints.TheHFCT-721XPDusesaclosedlooplaserbiasfeedbackcircuittomaintainconstantopticalpower.Thiscircuitcompensatesfornormallaserparametricvariationsinquantumefficiency,forwardvoltageandlasingthresholdduetochangingtransceiveroperatingpoints.

Transmitted Average Optical Output Power

VariationsinaverageopticalpowerarenotexpectedundernormaloperationbecausetheHFCT-721XPDusesaclosedlooplaserbiasfeedbackcircuittomaintainconstantopticalpower.Thiscircuitcompensatesfornormallaserparametricvariationsduetochangingtransceiveroperatingpoints.Onlyunderextremelaserbiasconditionswillsignificantdriftingintransmittedaverageopticalpowerbeobserv-able. Therefore it is recommended Tx average opticalpowerbeusedforfault isolation,ratherthanpredictivefailurepurposes.

Received Average Optical Input Power

Receivedaverageopticalpowermeasurementsareavalu-ableassetforinstallerstoverifycableplantcompliance.Driftsinaveragepowercanbeobservedfromthecableplant and remote transmitter for potential predictivefailureuse.Receivedaverageopticalpowercanbeusedforfaultisolation.

10

Figure 5b. Module Drawing

Mechanical Specifications

Package Dimensions

Figure 5a. Module Drawing

11

Figure 6. XFP host board mechanical layout

1

Figure 7. XFP Assembly Drawing

Clip

Host Board

Heat Sink

Cage Assembly

Module

Bezel

EMI Gasket(not shown)

Connector

1

Application Support

AnEvaluationKitandReferenceDesignsareavailabletoassistinevaluationoftheHFCT-721XPD.Pleasecontactyour localFieldSalesrepresentativeforavailabilityandorderingdetails.

Regulatory Compliance

ThetransceiverRegulatoryComplianceperformance isprovidedinTable2asafigureofmerittoassistthede-signer.Theoverallequipmentdesignwilldeterminethecertificationlevel.

Electrostatic Discharge (ESD)

TherearetwoconditionsinwhichimmunitytoESDdam-ageisimportant.Table13documentstheESDimmunitytobothoftheseconditions.

Regulatory Compliance

Thefirstcondition isstaticdischargetothetransceiverduringhandlingsuchaswhenthetransceiverisinsertedintothetransceiverport.Toprotectthetransceiver,itisimportanttousenormalESDhandlingprecautionsinclud-ingtheuseofgroundedwriststraps,workbenches,andfloor mats in ESD controlled areas. The ESD sensitivityoftheHFCT-721XPDiscompatiblewithtypicalindustryproductionenvironments.

Thesecondconditionisstaticdischargetotheexteriorofthehostequipmentchassisafter installation. Totheextent that the duplex LC optical interface is exposedtotheoutsideofthehostequipmentchassis,itmaybesubjecttosystem-levelESDrequirements.

TheESDperformanceoftheHFCT-721XPDexceedstypicalindustrystandards.

Feature Test Method Performance

ElectrostaticDischarge(ESD)totheexterioroftheXFPmodule

JEDECJESD22-A114-B 500Voltstothehighspeedpins,2000Voltstothelowspeedpins

ElectrostaticDischarge(ESD)totheDuplexLCReceptacle

VariationofIEC61000-4-2 Typically,nodamageoccurswith25kVwhentheduplexLCconnectorreceptacleiscontactedbyaHumanBodyModelprobe.

ElectrostaticDischarge(ESD)totheOpticalConnector

GR1089 10contactsof8KVontheelectricalfaceplatewithdeviceinsertedintoapanel.

ElectrostaticDischarge(ESD)totheOpticalConnector

VariationofIEC801-2 Airdischargeof15kV(min)contacttoconnectorw/odamage

ElectromagneticInterference(EMI)

FCCClassBCENELECEN55022ClassB(CISPR22A)VCCIClass1

Systemmarginsaredependentoncustomerboardandchassisdesign.

Immunity VariationofIEC61000-4-3 Lessthan0.5dBofRxsensitivitydegradationandlessthan10%marginreductionofTxmaskat10V/m,10MHZto1GHzw/ochassisenclosure

LaserEyeSafetyandEquipmentTypeTesting

USFDACDRHAELClass1US21CFR,SubchapterJperParagraphs1002.10and1002.12.

(IEC)EN60825-1:1994+A11+A2(IEC)EN60825-2:1994+A1(IEC)EN60950:1992+A1+A2+A3+A4+A11

CDRHcertification#TBDTUVfile#933/510312/02

ComponentRecognition UnderwritersLaboratoriesandCanadianStandardsAssociationJointComponentRecognitionforInformationTechnologyEquipmentIncludingElectricalBusinessEquipment

ULcertificatenumber05012004-E173874

Immunity

Thetransceivershaveashieldeddesigntoprovideexcellentimmunitytoradio-frequencyelectromagneticfieldswhichmaybepresentinsomeoperatingenvironments.

Electromagnetic Interference (EMI)

Most equipment designs using the HFCT-721XPD aresubject to the requirements of the FCC in the UnitedStates,CENELECEN55022(CISPR22)inEuropeandVCCIinJapan.ThemetalhousingandshieldeddesignoftheHFCT-721XPDminimizesEMIandprovidesexcellentEMIperformance.

Eye Safety

TheHFCT-721XPDtransceiversprovideClass1eyesafetybydesign.AvagoTechnologieshastestedthetransceiverdesignforregulatorycompliance,undernormaloperat-ing conditions and under single fault conditions. SeeTable2.

Flammability

TheHFCT-721XPDiscomplianttoUL94V-0.

Caution

The HFCT-721XPD contains no user serviceable parts.Tampering with or modifying the performance of theHFCT-721XPDwillresultinvoidedproductwarranty. ItmayalsoresultinimproperoperationoftheHFCT-721XPDcircuitry,andpossibleoverstressofthelasersource.Devicedegradation or product failure may result. Connectionof theHFCT-721XPDtoanon-approvedopticalsource,operatingabovetherecommendedabsolutemaximumconditions may be considered an act of modifying ormanufacturingalaserproduct.Theperson(s)performingsuchanactisrequiredbylawtorecertifyandreidentifythe laser product under the provisions of U.S. 21 CFR(SubchapterJ)andtheTUV.

Ordering Information

Pleasecontactyour localfieldsalesengineeroroneofAvagoTechnologiesfranchiseddistributorsfororderinginformation.Fortechnicalinformation,pleasevisitAvagoTechnologies’WEBpageatwww.avagotech.comorcontactAvagoTechnologiesSemiconductorProductsCustomerResponseCenterat1-800-235-0312.Forinformationre-latedtoXFPMSAdocumentationvisitwww.xfpmsa.org

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-2468EN AV01-0237EN - June 15, 2006