Features• Floating channel designed for bootstrap operation

Fully operational to +600 VTolerant to negative transient voltage dV/dt immune

• Application-specific gate drive range:Motor Drive: 12 V to 20 V (IRS2127/IRS2128)Automotive: 9 V to 20 V (IRS21271/IRS21281)

• Undervoltage lockout• 3.3 V, 5 V, and 15 V input logic compatible• FAULT lead indicates shutdown has occured• Output in phase with input (IRS2127/IRS21271)• Output out of phase with input (IRS2128/IRS21281)

CURRENT SENSING SINGLE CHANNEL DRIVER

VOFFSET 600 V max.

IO+/- 200 mA / 420 mA

VOUT 12 V - 20V 9 V - 20 V (IRS2127/IR2128) (IRS21271/IR21281)

VCSth 250 mV or 1.8 V

t on/off (typ.) 150 ns & 150 ns

Typical Connection

www.irf.com 1

Packages

IRS2127/IRS21271

IRS2128/IRS21281

8-Lead PDIP 8-Lead SOIC

IRS212(7, 71, 8, 81)(S)PbF

Data Sheet No. PD60299

DescriptionThe IRS2127/IRS2128/IRS21271/IRS21281 arehigh voltage, high speed power MOSFET and IGBTdrivers. Proprietary HVIC and latch immune CMOStechnologies enable ruggedized monolithic construc-tion. The logic input is compatible with standardCMOS or LSTTL outputs, down to 3.3 V. The protec-tion circuity detects over-current in the driven powertransistor and terminates the gate drive voltage. Anopen drain FAULT signal is provided to indicate thatan over-current shutdown has occurred. The output

Product Summary

VCC V B

CS

HO

V SCOM

IN

FAULT

V CC

IN

FAULT

VCC V B

CS

HO

V SCOM

IN

FAULT

V CC

IN

FAULT

(Refer to Lead Assignments for correct pin configuration).These diagrams show electrical connections only. Pleaserefer to our Application Notes and DesignTips for propercircuit board layout.

driver features a high pulse current buffer stage designed for minimum cross-conduction. The floating chan-nel can be used to drive an N-channel power MOSFET or IGBT in the high-side or low-side configuration whichoperates up to 600 V.

• RoHS compliant

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 2

Symbol Definition Min. Max. UnitsVB High-side floating supply voltage -0.3 625

VS High-side floating offset voltage VB - 25 VB + 0.3

VHO High-side floating output voltage VS - 0.3 VB + 0.3

VCC Logic supply voltage -0.3 25 V

VIN Logic input voltage -0.3 VCC + 0.3

VFLT FAULT output voltage -0.3 VCC + 0.3

VCS Current sense voltage VS - 0.3 VB + 0.3

dVs/dt Allowable offset supply voltage transient — 50 V/ns

PD Package power dissipation @ TA ≤ +25 °C8-Lead DIP — 1.0

8-Lead SOIC — 0.625

RthJA Thermal resistance, junction to ambient8-Lead DIP — 125

8-Lead SOIC — 200

TJ Junction temperature — 150

TS Storage temperature -55 150

TL Lead temperature (soldering, 10 seconds) — 300

Absolute Maximum RatingsAbsolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measuredunder board mounted and still air conditions.

Symbol Definition Min. Max. Units

VB High-side floating supply voltage (IRS2127/IRS2128) VS + 12 VS + 20

(IRS21271/IRS21281) VS + 9 VS + 20

VS High-side floating offset voltage Note 1 600

VHO High-side floating output voltage VS VB

VCC Logic supply voltage 10 20

VIN Logic input voltage 0 VCC

VFLT FAULT output voltage 0 VCC

VCS Current sense signal voltage VS VS + 5

TA Ambient temperature -40 125 °C

Note 1: Logic operational for VS of -5 V to +600 V. Logic state held for VS of -5 V to -VBS. (Please refer to the Design TipDT97-3 for more details).

Recommended Operating ConditionsThe input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within therecommended conditions. The VS offset rating is tested with all supplies biased at 15 V differential.

°C/W

W

°C

V

www.irf.com 3

IRS212(7, 71, 8, 81)(S)PbF

Symbol Definition Min. Typ. Max. Units Test Conditions

VIHLogic “1” input voltage (IRS2127/IRS21271)Logic “0” input voltage (IRS2128/IRS21281)

VILLogic “0” input voltage (IRS2127/IRS21271)Logic “1” input voltage (IRS2128/IRS21281)

VCSTH+CS input positive (IRS2127/IRS2128) 180 250 320 mV

going threshold (IRS21271/IRS21281) 1.5 1.8 2.1

VOH

High level output voltage, VBIAS - VO

— 0.05 0.2

VOL

Low level output voltage, VO — 0.02 0.1

ILK

Offset supply leakage current — — 50 VB = VS = 600 V

IQBS

Quiescent VBS supply current — 300 800

IQCC

Quiescent VCC supply current — 60 120

IIN+

Logic “1” input bias current — 7.0 15 VIN = 5 V

IIN-

Logic “0” input bias current — — 5.0 VIN = 0 V

ICS+

“High” CS bias current — — 5.0 VCS = 3 V

ICS-

“High” CS bias current — — 5.0 VCS = 0 V

VBSUV+VBS supply undervoltage (IRS2127/IRS2128) 8.8 10.3 11.8positive going threshold (IRS21271/IRS21281) 6.3 7.2 8.2

VBSUV-VBS supply undervoltage (IRS2127/IRS2128) 7.5 9.0 10.6negative going threshold (IRS21271/IRS21281) 6.0 6.8 7.7

IO+

Output high short circuit pulsed current 200 290 —

VO = 0 V, V IN = 5 VPW ≤ 10 µs

IO-

Output low short circuit pulsed current 420 600 —

VO = 15 V, V IN = 0 VPW ≤ 10 µs

Ron,FLT

FAULT - low on resistance — 125 — Ω

Symbol Definition Min. Typ. Max. Units Test Conditionston Turn-on propagation delay — 150 200 VS = 0 V

toff Turn-off propagation delay — 150 200 VS = 600 V

tr Turn-on rise time — 80 130

tf Turn-off fall time — 40 65 ns

tbl Start-up blanking time 550 750 950

tcs CS shutdown propagation delay — 65 360

tflt CS to FAULT pull-up propagation delay — 270 510

Dynamic Electrical CharacteristicsVBIAS (VCC, VBS) = 15 V, CL = 1000 pF and TA = 25 °C unless otherwise specified. The dynamic electrical characteristicsare measured using the test circuit shown in Fig. 3.

Static Electrical CharacteristicsVBIAS (VCC, VBS) = 15 V and TA = 25 °C unless otherwise specified. The VIN, VTH, and IIN parameters are referenced toCOM. The VO and IO parameters are referenced to VS.

2.5 — —

VIN = 0 V or 5 V

µA

mA

V

V— — 0.8 VCC = 10 V to 20 V

IO = 2 mAV

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 4

Functional Block Diagram IRS2127/IRS21271

DOWNSHIFTER

PULSEGEN

UVDETECT

PULSEFILTER

PULSEGEN

BUFFERHV

LEVEL

VB

HO

VS

CS

RS

R Q

VCC

IN

UPSHIFTERS

COM

FAULT -+

PULSEFILTER

VB

DELAY

SQ R

Q RS

SHIFT

Functional Block Diagram IRS2128/IRS21281

DOW NSHIFTER

PULSEGEN

UVDETECT

PULSEFILTER

PULSEGEN

BUFFERHV

LEVEL

VB

HO

VS

CS

RS

R Q

VCC

IN

UPSHIFTERS

COM

FAULT -+

PULSEFILTER

VB

DELAY

SQ R

Q RS

SHIFT

5V

www.irf.com 5

IRS212(7, 71, 8, 81)(S)PbF

Lead Definitions Symbol Description

VCC Logic and gate drive supply

IN Logic input for gate driver output (HO), in phase with HO (IRS2127/IRS21271)out of phase with HO (IRS2128/IRS21281)Indicates over-current shutdown has occurred, negative logic

COM Logic ground VB High-side floating supply HO High-side gate drive output VS High-side floating supply return CS Current sense input to current sense comparator

Lead Assignments

8 Lead PDIP 8 Lead SOICIRS2127/IRS21271 IRS2127S/IRS21271S

FAULT

8 Lead PDIP 8 Lead SOICIRS2128/IRS21281 IRS2128S/IRS21281S

1

2

3

4

8

7

6

5

VCC

I N

FAULT

COM

VB

HO

CS

VS

1

2

3

4

8

7

6

5

VCC

I N

FAULT

COM

VB

HO

CS

VS

1

2

3

4

8

7

6

5

VCC

I N

FAULT

COM

VB

HO

CS

VS

1

2

3

4

8

7

6

5

VCC

I N

FAULT

COM

VB

HO

CS

VS

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 6

Figure 4. CS Shutdown Waveform Definitions

90%

CSVCSTH

tcs

HO

Figure 5. CS to FAULT Waveform Definitions

90%

CSVCSTH

tflt

FAULT

Figure 2. Switching Time Waveform Definition

IN

HO

90% 90%

10% 10%

50%50%

tr tfton toff

50% 50%IN(IRS2128/IRS21281)

(IRS2127/IRS21271)

Figure 1. Input/Output Timing Diagram

HO

CS

IN

FAULT

IN(IRS2128/IRS21281)

(IRS2127/IRS21271)

Figure 3. Start-Up Blanking Time WaveformDefinitions

HO

CS

INtbl

90%

50%

FAULT

50%

(IRS2127/IRS21271)

IN(IRS2128/IRS21281)

www.irf.com 7

IRS212(7, 71, 8, 81)(S)PbF

Typ

Max

0

50

100

150

200

250

300

-50 -25 0 25 50 75 100 125

Temperature (°C)

Figure 6A. Turn-On Delay Time vs.

Typ

Max

0

50

100

150

200

250

300

10 12 14 16 18 20

Supply Voltage (V)

Figure 6B. Turn-On Delay Time vs. Voltage

Typ

Max

0

50

100

150

200

250

300

-50 -25 0 25 50 75 100 125

Temperature (°C)

Turn

-Off

Del

ay T

ime

(ns)

Figure 7A. Turn-Off Delay Time vs.

Typ

Max

0

50

100

150

200

250

10 12 14 16 18 20

Supply Voltage (V)

Figure 7B. Turn-Off Delay Time vs. Voltage

T ur n

- On

D el

ay T

ime

( ns )

T ur n

- On

D el

ay T

ime

( ns )

Tu

rn-O

ff D

elay

Tim

e (n

s)

Temperature

Temperature

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 8

Typ

Max

020

406080

100120140

160180

-50 -25 0 25 50 75 100 125

Temperature (°C)

T u r n

- O

n

R i s

e Ti

me

(ns)

Figure 8A. Turn-On Rise Time vs. Temperature

Typ

Max

020

406080

100120140

160180

10 12 14 16 18 20

Supply Voltage (V)

Figure 8B. Turn-On Rise Time vs. Voltage

Typ

Max

010

203040

506070

8090

-50 -25 0 25 50 75 100 125

Temperature (°C)

Figure 9A. Turn-Off Fall Time vs.

Typ

Max

0

10

20

30

40

50

60

70

80

10 12 14 16 18 20

Supply Voltage (V)

Figure 9B. Turn-Off Fall Time vs. Voltage

Turn

-Off

Fall T

ime

(ns)

T u

r n

- O

n

R i s

e Ti

me

(ns)

Turn

-Off

Fall T

ime

(ns)

Temperature

TemperatureTemperature

www.irf.com 9

IRS212(7, 71, 8, 81)(S)PbF

Min

Typ

Max

0

200

400

600

800

1000

1200

-50 -25 0 25 50 75 100 125

Temperature (°C)

S t a r

t -

U p

B l a n

k i

n g T

i m

e

( n s )

Figure 10A. Start-Up Blanking Time vs.

Min

Typ

Max

0

200

400

600

800

1000

1200

10 12 14 16 18 20

Supply Voltage (V)

Figure 10B. Start-Up Blanking Time vs. Voltage

Typ

Max

050

100150200250300350400450500

-50 -25 0 25 50 75 100 125

Temperature (°C)

CS

Shu

tdow

n Pr

op. D

elay

(ns)

Figure 11A. CS Shutdown Prop. Delay vs .

Typ

Max

0

50

100

150

200

250

300

350

400

10 12 14 16 18 20

Supply Voltage (V)

Figure 11B. CS Shutdown Prop. Delay vs.

S t a r

t -

U p

B l a n

k i

n g T

i m

e

( n s )

C

S S

hutd

own

Prop

. Del

ay (n

s)

Temperature

Temperature Voltage

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 10

Typ

Max

0

100

200

300

400

500

600

700

800

-50 -25 0 25 50 75 100 125

Temperature (°C)

C S

t o F A

U L T

P u l l

- U p

P r o p

. D e l

a y (

n s

)

Figure 12A. CS to FAULT Pull-Up Prop. Delay

Typ

Max

0

100

200

300

400

500

600

10 12 14 16 18 20

Supply Voltage (V)

Min

0

0.5

1

1.5

2

2.5

3

-50 -25 0 25 50 75 100 125

Temperature (°C)

L o g i

c " 1

" (

" 0

" f

o r 2

1 2

8 )

V

Thre

shol

d (V

)I H

Figure 13A. Logic "1" ("0" for 2128) VIH Threshold

Min

0

0.5

1

1.5

2

2.5

3

10 12 14 16 18 20

Supply Voltage (V)

L o g i

c " 1

" (

" 0

" f

o r

2 1 2

8 )

VI H T

hres

hold

(V)

Figure 13B. Logic "1" ("0" for 2128) VIH Threshold vs.

C S

t o F A

U L T

P u l l

- U p

P r o p

. D e l

a y (

n s

)

vs. Temperature vs. VoltageFigure 12B. CS to FAULT Pull-Up Prop. Delay

Voltagevs. Temperature

www.irf.com 11

IRS212(7, 71, 8, 81)(S)PbF

Max

00.1

0.20.30.4

0.50.60.7

0.80.9

-50 -25 0 25 50 75 100 125

Temperature (°C)

Logi

c "0

" ("1

" for

212

8) V

IL T

hres

hold

(V)

Figure 14A. Logic "0" ("1" for 2128) VIL

Max

00.1

0.20.30.4

0.50.60.7

0.80.9

10 12 14 16 18 20

Supply Voltage (V)

Logi

c "0

" ("1

" for

212

8) V

IL T

hres

hold

(V)

Figure 14B. Logic "0" ("1" for 2128) VIL

Min

Typ

Max

0

0.05

0.1

0.15

0.2

0.25

0.3

0.35

-50 -25 0 25 50 75 100 125

Temperature (°C)

CS

Inpu

t Pos

itive

Goi

ng V

olta

ge (V

)

Figure 15A. CS Input Positive Going Voltage

Min

Typ

Max

0

0.05

0.1

0.15

0.2

0.25

0.3

0.35

10 12 14 16 18 20

Supply Voltage (V)

Figure 15B. CS Input Positive Going Voltage vs.

CS

Inpu

t Pos

itive

Goi

ng V

olta

ge (V

)

Threshold Threshold vs. Voltagevs. Temperature

vs. Temperature Voltage

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 12

Typ

Max

0

0.05

0.1

0.15

0.2

0.25

0.3

-50 -25 0 25 50 75 100 125

Temperature (°C)

H i g

h L e

v e

l O

u t

p u

t (

I O

= 2

m A )

( V)

Figure 16A. High Level Output (IO = 2 mA)

Typ

Max

0

0.05

0.1

0.15

0.2

0.25

10 12 14 16 18 20

Supply Voltage (V)

Hig

h Le

vel O

utpu

t (I O

= 2

m A)

(V)

Figure 16B. High Level Output (IO = 2 mA) vs .

Typ

Max

0

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0.16

-50 -25 0 25 50 75 100 125

Temperature (°C)

Low

Lev

el O

utpu

t (I O

= 2

m A )

( V )

Figure 17A. Low Level Output (IO = 2 mA)

Typ

Max

0

0.02

0.04

0.06

0.08

0.1

0.12

10 12 14 16 18 20

Supply Voltage (V)

Low

Lev

el O

utpu

t (I O

= 2

m A

) (V)

Figure 17B. Low Level Output (IO = 2 mA) vs .

vs. Temperature Voltage

vs. Temperature Voltage

www.irf.com 13

IRS212(7, 71, 8, 81)(S)PbF

Max

0102030405060708090

100

-50 -25 0 25 50 75 100 125

Temperature (°C)

O ff s

e t S

uppl

y Le

ak a

ge C

ur r e

nt ( µ

A)

Figure 18A. Offset Supply Leakage Current vs. Temperature

Max

0

10

20

30

40

50

60

0 100 200 300 400 500 600

Supply Voltage (V)

VB

S S

uppl

y C

urre

nt (

µA)

Figure 18B. High-Side Floating Well Offset Supply Leakage vs. Voltage

Typ

Max

0

100

200

300

400

500

600

-50 -25 0 25 50 75 100 125

Temperature (°C)

VB

S S

uppl

y C

urre

nt (

µA)

Figure 19A. VBS Supply Current vs.

Typ

Max

0

100

200

300

400

500

600

700

10 12 14 16 18 20

Supply Voltage (V)

VB

S S

uppl

y C

urre

nt (

µA)

Figure 19B. VBS Supply Current vs. VoltageTemperature

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 14

Typ

Max

0

20

40

60

80

100

120

140

160

-50 -25 0 25 50 75 100 125

Temperature (°C)

VC

C S

uppl

y C

urre

nt (

µA)

Figure 20A. VCC Supply Current vs.

Typ

Max

020

406080

100120140

160180

10 12 14 16 18 20

Supply Voltage (V)

VC

C S

uppl

y C

urre

nt (

µA)

Figure 20B. VCC Supply Current vs. Voltage

Typ

Max

02468

101214161820

-50 -25 0 25 50 75 100 125

Temperature (°C)

Logi

c "1

" Inp

ut B

ias

Cur

rent

(µA

)

Figure 21A. Logic "1" Input Bias Current vs.

Typ

Max

0

2

4

6

8

10

12

14

16

10 12 14 16 18 20

Supply Voltage (V)

L o g i

c " 1

" I

n p

u t

B i a

s C

u r r e

n t

( µ

A )

Figure 21B. Logic "1" Input Bias Current vs . Temperature

Temperature

Voltage

www.irf.com 15

IRS212(7, 71, 8, 81)(S)PbF

Max

0

1

2

3

4

5

6

-50 -25 0 25 50 75 100 125

Temperature (°C)

Logi

c "0

" Inp

ut B

ias

Cur

rent

(µA

)

Figure 22A. Logic "0" Input Bias Current vs.

Max

0

1

2

3

4

5

6

10 12 14 16 18 20

Supply Voltage (V)

Figure 22B. Logic "0" Input Bias Current vs .

Max

0

1

2

3

4

5

6

-50 -25 0 25 50 75 100 125

Temperature (°C)

Logi

c "1

" CS

Bias

Cur

rent

(µA)

Figure 23A. Logic "1" CS Bias Current vs .

Max

0

1

2

3

4

5

6

10 12 14 16 18 20

Supply Voltage (V)

L o g i

c " 1

" C

S

B i a s

C u r

r e

n t

( µ A

)

Figure 23B. Logic "1" CS Bias Current vs.

Logi

c "0

" Inp

ut B

ias

Cur

rent

(µA

)

VoltageTemperature

Temperature Voltage

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 16

Max

0

1

2

3

4

5

6

-50 -25 0 25 50 75 100 125

Temperature (°C)

Logi

c "0

" CS

Bias

Cur

rent

(µA)

Figure 24A. Logic "0" CS Bias Current vs .

Max

0

1

2

3

4

5

6

10 12 14 16 18 20

Supply Voltage (V)

L o g i

c " 0

" C

S

B i a s

C u r

r e

n t

( µ A

)

Figure 24B. Logic "0" CS Bias Current vs.

MinTypMax

0

2

4

6

8

10

12

14

-50 -25 0 25 50 75 100 125

Temperature (°C)

VB

S U

V T

hres

hold

(+) (

V)

Figure 25A. VBS UV Thre shold (+) vs.

MinTypMax

0

2

4

6

8

10

12

14

10 12 14 16 18 20

Supply Voltage (V)

VB

S U

V T

hres

hold

(+) (

V)

Figure 25B. VBS UV Threshold (+) vs. VoltageTemperature

Temperature Voltage

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 17

Min

Typ

Max

0

2

4

6

8

10

12

-50 -25 0 25 50 75 100 125

Temperature (°C)

VB

S U

V T

hres

hold

(-) (

V)

Figure 26A. VBS UV Threshold (-) vs. Temperature

Min

Typ

Max

0

2

4

6

8

10

12

10 12 14 16 18 20

Supply Voltage (V)

VB

S U

V T

hres

hold

(-) (

V)

Figure 26B. VBS UV Threshold (-) vs. Voltage

Min

Typ

0

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

-50 -25 0 25 50 75 100 125

Temperature (°C)

Out

put S

ourc

e C

urre

nt (A

)

Figure 27A. Output Sourc e Current vs . Temperature

Min

Typ

00.05

0.10.15

0.20.25

0.30.35

0.40.45

0.5

10 12 14 16 18 20

Out

put S

ourc

e C

urre

nt (A

)

Supply Voltage (V)F igure 27B. O utput Source Current vs.

Voltage

www.irf.com 18

IRS212(7, 71, 8, 81)(S)PbF

Min

Typ

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

-50 -25 0 25 50 75 100 125

Temperature (°C)

Out

put S

ink

Cur

rent

(A)

Figure 28A. Output Sink Current vs . Temperature

Min

Typ

00.10.20.30.40.50.60.70.80.9

1

10 12 14 16 18 20

Supply Voltage (V)

Out

put S

ink

Cur

rent

(A)

Figure 28B. Output Sink Current vs. Voltage

www.irf.com 19

IRS212(7, 71, 8, 81)(S)PbF

01-601401-3003 01 (MS-001AB)8-Lead PDIP

Case outlines

01-602701-0021 11 (MS-012AA)8-Lead SOIC

8 7

5

6 5

D B

E

A

e6X

H0.25 [.010] A

6

431 2

4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.

NOTES:1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.2. CONTROLLING DIMENSION: MILLIMETER3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].

7

K x 45°

8X L 8X c

y

FOOTPRINT

8X 0.72 [.028]

6.46 [.255]

3X 1.27 [.050] 8X 1.78 [.070]

4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.

6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE.

MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].

0.25 [.010] C A B

e1A

A18X b

C

0.10 [.004]

e 1

DE

y

b

AA1

HKL

.189

.1497

0°

.013

.050 BASIC

.0532

.0040

.2284

.0099

.016

.1968

.1574

8°

.020

.0688

.0098

.2440

.0196

.050

4.803.80

0.33

1.350.10

5.800.250.40 0°

1.27 BASIC

5.004.00

0.51

1.750.25

6.200.501.27

MIN MAXMILLIMETERSINCHESMIN MAX

DIM

8°

e

c .0075 .0098 0.19 0.25

.025 BASIC 0.635 BASIC

IRS212(7, 71, 8, 81)(S)PbF

www.irf.com 20

C A R RI E R TA P E D IM E NS I O N F O R 8 S O I CN

C o d e M in M ax M in M axA 7 .9 0 8.1 0 0. 31 1 0 .3 18B 3 .9 0 4.1 0 0. 15 3 0 .1 61C 11 .7 0 1 2. 30 0 .4 6 0 .4 84D 5 .4 5 5.5 5 0. 21 4 0 .2 18E 6 .3 0 6.5 0 0. 24 8 0 .2 55F 5 .1 0 5.3 0 0. 20 0 0 .2 08G 1 .5 0 n/ a 0. 05 9 n/ aH 1 .5 0 1.6 0 0. 05 9 0 .0 62

M etr ic Im p er ia l

R E E L D IM E N S I O N S F O R 8 S O IC N

C o d e M in M ax M in M axA 32 9.60 3 30 .2 5 1 2 .9 76 13 .0 0 1B 20 .9 5 2 1. 45 0. 82 4 0 .8 44C 12 .8 0 1 3. 20 0. 50 3 0 .5 19D 1 .9 5 2.4 5 0. 76 7 0 .0 96E 98 .0 0 1 02 .0 0 3. 85 8 4 .0 15F n /a 1 8. 40 n /a 0 .7 24G 14 .5 0 1 7. 10 0. 57 0 0 .6 73H 12 .4 0 1 4. 40 0. 48 8 0 .5 66

M etr ic Im p er ia l

E

F

A

C

D

G

AB H

N OT E : CO NTROLLING D IMENSION IN MM

LOAD ED TA PE FEED DIRECTION

A

H

F

E

G

D

BC

Tape & Reel8-lead SOIC

www.irf.com 21

IRS212(7, 71, 8, 81)(S)PbF

ORDER INFORMATION

8-Lead PDIP IRS2127PbF8-Lead PDIP IRS21271PbF8-Lead SOIC IRS2127SPbF

8-Lead SOIC IRS21271SPbF8-Lead SOIC Tape & Reel IRS2127STRPbF

8-Lead SOIC Tape & Reel IRS21271STRPbF

LEADFREE PART MARKING INFORMATION

Lead Free ReleasedNon-Lead FreeReleased

Part number

Date code

IRxxxxxx

YWW?

?XXXXPin 1Identifier

IR logo

Lot Code(Prod mode - 4 digit SPN code)

Assembly site codePer SCOP 200-002

P

? MARKING CODE

S

The SOIC-8 is MSL2 qualified.This product has been designed and qualified for the industrial level.

Qualification standards can be found at www.irf.comIR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105

Data and specifications subject to change without notice. 6/27/2007

8-Lead PDIP IRS2128PbF8-Lead PDIP IRS21281PbF8-Lead SOIC IRS2128SPbF

8-Lead SOIC IRS21281SPbF8-Lead SOIC Tape & Reel IRS2128STRPbF

8-Lead SOIC Tape & Reel IRS21281STRPbF