CRT Process Flow ChartCRT Process Flow Chart

PANEL FUNNEL

BLACKENING P-M STABILIZING SCREEN COATING FRIT SEAL

GUN ASSEMBLY MOUNT SEALING EXHAUSTING

EMISSION / HV / YAM SHIPPING TESTING PACKING Raster Aging

BANDING & GETTER FLASH

OUTER DAG COATING

FUNNEL

MASK

GUN

BSFA

FUNNEL COATING

MASK / FRAME/ FORMING

MaskMaskInput Material Process Process Description

MASK Forming

1. Process Objective : 1.1 To form the mask with mould 1.2 Set up the mask curve

2. Control Items :

2.1 Formed mask quality 2.2 Heater mould temperature 2.3 Mask hole diameter

Mask

Mask Blackening

1. Process Objective : 1.1 Blackening the mask 1.2 To prevent the mask rusty

2. Control Items :

2.1 Oven temperature 2.2 Mesh belt speed 2.3 Nature gas pressure

PanelPanelInput Material Process Process Description

Panel

Panel & Mask Stabilizing

1. Process Objective 1.1 To stabilize the mask 1.2 To reduce the stress

2. Control Items

2.1 Oven temperature 2.2 Chain belt speed 2.3 Panel surface temperature

Phosphor, Graphite

Screen Coating 1. Process Objective 1.1 Black Coating : To form the BC size 1.2 Slurry Coating: To coat the green, blue and

red phosphor to the dot. 1.3 Aluminum Coating: Coating the aluminum

film. 2. Control items :

2.1 BC size 2.2 BC matrix 2.3 Screen quality 2.4 Al film thickness

Input Material Process Process Description Funnel

Funnel Coating

1. Process Objective : 1.1 To coat graphite on inner

funnel. 1.2 To coat frit glass on funnel

seal edge. 2. Control Items : 2.1 Neck coating length 2.2 Inner dag resistance

Frit Frit sealing 1. Process Objective : 1.1 To seal up panel & funnel with frit glass.

2. Control Items :

2.1 Panel/Funnel dislocation 2.2 Oven temperature curve

2.3 Frit Breakdown test

FunnelFunnel

Input Material Process Process Description Gun Mount sealing

1. Process Objective : 1.1 To seal up mount (gun) and bulb

(consist of panel & funnel) 2. Control Items :

2.1 Sealing length 2.2 Stress 2.3 Gun rotation 2.4 Off center

Exhausting

1. Process Objective : 1.1 To get high vacuum level (10-7 Torr)

by exhaust gas from tubes. 2. Control Items:

2.1 Gas Ratio test. 2.2 Thermal shock test 2.3 Mount Tip condition

Electron GunElectron Gun

Input Material Process Process Description Shrink Band Banding & Getter

flash

1. Process Objective : 1.1 Put on shrink band & do getter

flashing.( enhance vacuum condition )

2. Control Items :

2.1 Lug height/Lug pitch 2.2 Getter evaporation (Barium yield)

Dag Outer Dag Coating

1. Process Objective : 1.1 Coating outer dag on funnel and

outer can work as grounding purpose.

2. Control Items :

2.1 Dimension 2.2 Peeling test 2.3 Outer dag resistance 2.4 Appearance

Shrink Band & Outer DagShrink Band & Outer Dag

Input Material Process Process Description ---- Emission/HV/Raster

Aging

1. Process Objective : 1.1 To activate cathode emission ability

1.2 To clear particle from gun and avoid stray emission.

1.3 To do Electrical characteristic test. 2. Control Items : 2.1 EM/HV/RA machine setting 2.2 SE/ILC3/MIK/COEK/C.C

Emission & HVEmission & HV

Input Material Process Process Description DY & Pcm YAM

1. Process Objective : 1.1 To assemble Deflection York(DY) &

tube. ( ITC adjustment )

2. Control Items : 2.1 Left & right landing adjustment

off-setting (Purity tolerance control) 2.2 Convergence checking. 2.3 Auto focus checking to ensure Focus

quality. 2.4 Torque driver control =15kg +/-2 kg

/lb.

PE Sheet Shipping Testing

1. Process Objective : 1.1 Check 3 gun emission warm up time (EWT ) to ensure R G B electron gun current is >= 385 mA. 2 Control items : 2-1 gun emission condition. 2-2 tube appearance checking .

Yam & ShippingYam & Shipping

Input Material Process Process Description Polyform Packing

1. Process Objective :

1.1 Finish goods packing by auto Packing m/c

2. Control Items :

2.1 Lot carton label 2.2 Finishing good packing condition. 2.3 PE film wrapping

PackingPacking