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Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Conductive Adhesive sheetTSC200
CONFIDENTIAL
TOYOCHEM CO.,LTD.
Converting material Div.
Ver.1s
2012.7
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Conductive Adhesive Sheet TSC200This electrical conductive adhesive sheet for FPC has excellent humidity resistance /
excellent flexibility / excellent electrical conductivity
Ideal for Mobile Phone Hinge, which requires less noise / Camera Module
Release filmConductive adhesive layer
Single Release film type
CONFIDENTIAL
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Structure
CONFIDENTIAL
Release Film
Conductive Adhesive Layer
Structure material / feature Thickness
Release film White PET one side non-silicone resin coated 54μm
Conductive adhesive layerUrethane based containing conductive
filler(Isotropic conductive)
40μm;Before press60μm;Before press
Toyo original Urethane based
Dispersion conductive filler
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Properties
CONFIDENTIAL
Product name TSC200
Release film 54μm PETConductive adhesive layer Urethane resin basedThickness of Adhesive layer 40μm ±5 (before press)/60μm±5 (before press)Surface resistance Less than 300mΩ/□Peel Strength (PI) More than 10 N/cmPeel Strength (Cu) More than 10 N/cmSolder resistance260℃ solder floating
Excellent(More than 60sec.)
Resin flow amount170℃,2MPa,5min.press
50μm
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Features
CONFIDENTIAL
1.Excellent adhesion for PI, SUS, Cu, Ni-Gold plate
2.Excellent Heat durability
3.Electorical conductive reliability
4.Storage stability
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Adhesive and Solder test
CONFIDENTIAL
180°peel
[Adhesive test condition]Sample width:10mmPeel speed:50mm/minPeel angle:180°
[Solder reflow Profile] [Solder floating]
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Test TSC200 CBF300
1)Peel Strength180°Peel 50mm/min
15 N/cm 11 N/cm
2)Solder reflow260℃20second peak reflow 2pass
Appearance OK OK
Peel Strength 14 N/cm 13 N/cm
3)Solder floating260℃5second 3pass
Appearance OK OK
Peel Strength 14 N/cm 13 N/cm
4)Solder floating288℃5second 3pass
Appearance OK OK
Peel Strength 13 N/cm 13 N/cm
Picture after peel test TSC200Between TSC200 and SUS
Picture after peel test CBF300Between CBF300 and SUS
Adhesive and Solder test-1 / PI cover-lay
CONFIDENTIAL
CCLPolyimide cover-layTSC200/CBF300SUS(nickel‐plated)
Test Structure
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Test TSC200 CBF300
1)Peel Strength180°Peel 50mm/min
9 N/cm 6 N/cm
2)Solder reflow260℃20second peak reflow 2pass
Appearance OK NG
Peel Strength 8 N/cm Delaminate
3)Solder floating260℃5second 3pass
Appearance OK NG
Peel Strength 8 N/cm Delaminate
4)Solder floating288℃5second 3pass
Appearance OK NG
Peel Strength 8 N/cm Delaminate
Picture after peel test TSC200Between TSC200 and Ni-Gold plate
Picture after peel test CBF300Between CBF300 and Ni-Gold plate
Adhesive and Solder test-2 / Ni-gold plate
CONFIDENTIAL
CCLNi-Gold plate(Ni;1um,Gold;0.3um)TSC200/CBF300SUS(nickel‐plated)
Test Structure
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
3) Solder floating 260℃3PassBetween PI and Cu (CCL)
4) Solder floating 288℃3PassBetween PI and Cu (CCL)
2) Solder reflow 2passBetween TSC200 and Ni-Gold plate
Adhesive and Solder test-2 / Ni-Gold pate TSC
CONFIDENTIAL
PI(CCL)
TSC200
SUS(nickel‐plated)
Nickel Gold
CCL
TSC200
SUS(nickel‐plated)
Nickel Gold Cu (CCL)
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
CONFIDENTIAL
Adhesive and Solder test-2 / Ni-Gold plate CBF
3) Solder floating 260℃3Pass 4) Solder floating 288℃3Pass2) Solder reflow 2pass
Gold
CCL
CBF300
SUS(nickel‐plated)
Nickel
Delaminate at between CBF and Ni-Gold plate in any conditions
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Conductivity
CONFIDENTIAL
TSC200 CBF300
Surface resistance After press 84 mΩ/□ N/A
Ground connected resistance
Land diameter 1.2mmφ
X-Y 53 mΩ 240 mΩ
Z 50 mΩ 233 mΩ
[Ground connected resistance]
Cu:18um
Surface: Ni-Gold Plate
Cover-lay : PI25um,Adhesive 35um(total:60um)
Cover-lay Land diameter : 1.2mmφ
Distance of pole : 4mm
Width of Adhesive sheet : 10mm
Press conditions
170℃-2MPa-5min press and 160℃-1hr baking
Comparison conductive performance
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Ground connected resistance
CONFIDENTIAL
0
10
20
30
40
50
60
1 2 3
Land diameter mmφ
Resi
stac
e [
mΩ
】
TSS200
CBF300
0
10
20
30
40
50
60
1 2 3
Land diameter mm□
Resi
stac
e [
mΩ
】
TSS200
CBF300
X-Y, Land diameter:1mm,2mm,3mm
Land shape “Circle” Land shape “Square”
[Ground connected resistance]
Width of Adhesive sheet : 10mm
Surface: Ni/Gold Plate
Cover-lay : PI12.5um,Adhesive 15um(total:37.5um)
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Ground connected resistance / 85℃85%RH
CONFIDENTIAL
0
50
100
150
200
250
300
350
400
450
500
0 100 200 300 400 500 600
Time [hour]R
esi
stac
e [
mΩ
】
TSC200
CBF300
Humidity resistance 85℃85%RHGround connected resistance (Land diameter:1mmφ)
0
20
40
60
80
100
120
140
0 100 200 300 400 500 600
Time [hour]
Resi
stac
e [
mΩ
】
TSC200
CBF300
X-Y Z
[Ground connected resistance]
Width of Adhesive sheet : 10mm
Surface: Ni/Gold Plate
Cover-lay : PI12.5um,Adhesive 15um(total:37.5um)
Land diameter : 1mmφ(circle)
SUS : Ni plate treated SUS (Thickness 0.3mm)
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Cross-section SEM images
CONFIDENTIAL
CBF300
Air gap
TSC200
No Air gap
Conductive adhesive sheet
Conductive filler
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Flexibility / Embedment
CONFIDENTIAL
CBF300
Large air gap
Comparison 200um embedment ( Cross-section image x100)
~200um
50um PI film
TSC
Press conditions
170℃-2MPa-5min.press
And 160℃-1hr baking
200μmSmall air gap
TSC200
200μm
section
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0
500
1000
1500
2000
2500
0 10 20 30 40 50times
Res
ista
nce
[mΩ
]Bending test / Conductivity
CONFIDENTIAL
Cu:18um
Surface: Ni/Gold Plate
Cover-lay : PI25um,Adhesive 35um
Cover-lay Land diameter : 1.2mmφ
Distance of pole : 4mm
Width of EMI : 15mm
Press conditions170℃-2MPa-5min.press and 160℃-1hr baking.
CBF300
TSC200
Cu
Cu
Cover-lay(60um)TSC
Bending test at 360°
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Shielding performance
CONFIDENTIAL
Frequency:500MHz~18GHzASTM D4935Network-analyzer E8361ACondition:28℃60%RH
Electromagnetic wave
Test piece
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Comparison
CONFIDENTIAL
TSC200 CBF-300
Adhesive for PI,SUS ○ ○
Adhesive for Ni-Gold plate ○ ×
Solder ◎ △
Ground conductivity ◎ △
Ground conductivityHumidity conditions
○ ×
Shielding performance ○ ○
Storage Stability ○ ×
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
How to use
CONFIDENTIAL
SUS Stiffener
①Laminate on SUS Stiffener.
②Remove the release film,then laminate on FPC
for temporary fastening.
③Heat press undervacuumed condition.
Then, post cure.
SUS stiffener
FPCRelease Film
TSC
SUS stiffener
FPC
Electric oven
FPC
TSC
SUS stiffener
TSC
* If pressing time is over 60min,
post cure is unnecessary.
Lamination of TSC200 on SUS Stiffener
• Treatment using an iron, heat press, or heated rollers at 100~120℃ for over 5 seconds is recommended.
*If lamination is insufficient, crimples may be caused during the removal of the release film.
Flow chart
SUS Stiffener
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
How to use
CONFIDENTIAL
Press Condition Post Cure
Temperature Pressure Time Temperature Time
Quick Press & Post Cure
170±10℃ 1~3MPa Over 5min 160±10℃ Over 60min
Press Only 170±10℃ 1~3MPa Over 60min - -
Press condition
StorageTSC200 should be stored under 10℃ / 70%RH
*Storage at room temperature may cause the adhesive layer to stiffen, thusleading to the loss of conductivity.
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
23℃50%RH
Initial 7days 14days 21days
Peeling strength① 12 N/cm 12 N/cm 13N/cm 14N/cm
Peeling strength② 12 N/cm 12 N/cm 13 N/cm 11 N/cm
Solder float260℃①More than 60sec
OKMore than 60sec
OKMore than 60sec
OKMore than 60sec
OK
260SolderFloat℃②More than 60sec
OKMore than 60sec
OKMore than 60sec
OKMore than 60sec
OK
Solder reflow①5PassOK
5PassOK
5PassOK
5PassOK
Solder reflow②5PassOK
5PassOK
5PassOK
5PassOK
①,② on the above shows the following structure.①;PI/TSC/SUS②;Cu/TSC/SUS
Laminating condition ; 170℃-2MPa-5min.press + 160℃1hr oven curing
Excellent performance 21days after
23℃50%RH / Adhesive and Solder resistance
CONFIDENTIAL
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
CONFIDENTIAL
[Ground connected resistance]
Cu:18um
Surface: Ni/Gold Plate
Cover-lay : PI25um,Adhesive 35um(total:60um)
Cover-lay Land diameter : 1.2mmφ
Distance of pole : 4mm
Width of Adhesive sheet : 10mm
Press conditions
170℃-2MPa-5min press and 160℃-1hr baking
23℃50%RH / Conductivity
0
10
20
30
40
50
60
70
80
90
100
0 7 14 21
23℃50%RH(Day)
Res
ista
nce(
mΩ
)
XY
Z