click to view the pdf emcsi 2015 final program

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www.emc2015usa.emcss.org

PLENARY SESSION

Four respected expert will present technical keynote speeches highlighting the advances and upcoming challenges in EMC and SI.

Thursday, March 19 starting at 8:30 AM in Grand Ballroom G

See page 27 for details.

PANEL OF EXPERTS

Have questions that you need answered? Sit in on one of our five panel discussions to hear the thoughts and experiences from authorities in their respective fields. With the variety of topics offered, you are guaranteed to find one of interest and come away with knowledge to benefit your own profession.

Tuesday, Wednesday & Thursday Afternoon in Grand Ballroom E


Welcome to the 2015 IEEE Symposium on Electromagnetic Compatibility & Signal IntegritySilicon Valley, California • Santa Clara Convention CenterMarch 15-20, 2015

The EMCSI 2015 committee welcomes you to the heart of the Silicon Valley for a week of learning, collaboration and networking with industry peers. The Symposium attracts a vast audience; from novice to veteran, across all industries and academia. As you browse through this program, we hope you are as enthusiastic about the selection of sessions as we are.

We are looking forward to a great week together!

KEYNOTE SPEAKER

Keynote Presentation by Dr. Thomas Lee, Stanford University

The Carrington Event, H-bombs, Telstar and the Great Geomagnetic Storm of 1989Tuesday, March 17 starting at 8:30 AM in the Mission City Ballroom 1

Our keynote presentation will describe the history of three events that accentuate the fragility of Earth’s electronics systems and how these potential occurrences can be a threat to our civilization.


Welcome

ASK THE EXPERTS

We will again hold the popular ‘Ask the Experts’ panel discussion. Bring your questions concerning all aspect of EMC and SI/PI.

Tuesday, March 17 at 3:30 PM in the Exhibit Hall.

See page 50 for details. VISIT EMCTV.TV FOR DAILY UPDATES!

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Welcome to EMCSI 2015Welcome to EMCSI 2015. . . . . . . . . . . . . .3

Keynote Presentation by Dr. Thomas Lee. . .3

Plenary Session. . . . . . . . . . . . . . . . . . . . .3

Panel of Experts . . . . . . . . . . . . . . . . . . . .3

Chairman’s Message . . . . . . . . . . . . . . . .7

2015 Symposium Committee . . . . . . . . . .8

2015 Technical Committee . . . . . . . . . . . .9

Welcome to Santa Clara, California. . . . .11

Symposium at a Glance . . . . . . . . . . . . .12

Patrons and Sponsors . . . . . . . . . . . . . . .13

Getting Around Santa Clara . . . . . . . . . .14

General Information . . . . . . . . . . . . . . . .15

Convention Center Floor Plan . . . . . . . . .16

Hyatt Meeting Rooms Floor Plan . . . . . . .17

Technical ProgramTechnical Program Welcome . . . . . . . . . .18

Technical Paper Review Team. . . . . . . . . .19

Best Symposium Paper Finalists . . . . . . . .20

Mobile Symposium . . . . . . . . . . . . . . . . .23

Technical Program Guide . . . . . . . . . . . .24

Keynote Presentation . . . . . . . . . . . . . . . .26

Plenary Sessions . . . . . . . . . . . . . . . . . . .27

Panel of Experts . . . . . . . . . . . . . . . . . . .28

Workshops and Tutorials . . . . . . . . . . . . .30

IEEE Senior Member Elevation Event. . . . .46

IEEE Senior Member Application Workshop. . . . . . . . . . . . . . . . . . . . . . . .46

IEEE Eta Kappa Nu . . . . . . . . . . . . . . . . .46

Best Student Paper Finalists . . . . . . . . . . .47

Technical Sessions. . . . . . . . . . . . . . . . . .48

Experiments and Demonstrations . . . . . . .64

Clayton R. Paul Global University. . . . . . .68

Technical Program continued

Technical Committee Meetings. . . . . . . . .70

Collateral Meetings Schedule. . . . . . . . . .72

iNARTE Workshop, Examinations and Events . . . . . . . . . . . . . . . . . . . . . . .74

ANSI C63® Workshops. . . . . . . . . . . . . .75

IEEE EMC Young Professionals . . . . . . . . .76

Professional Development . . . . . . . . . . . .77

Social EventsWelcome Reception. . . . . . . . . . . . . . . . .78

Gala Event . . . . . . . . . . . . . . . . . . . . . . .78

EMC Young Professionals Party . . . . . . . .78

Chapter Chair Dinner . . . . . . . . . . . . . . .79

Founders and Past Presidents Luncheon . .79

EMCS Chapter Chair Training . . . . . . . . .79

EMC Society Band. . . . . . . . . . . . . . . . . .80

Team EMC . . . . . . . . . . . . . . . . . . . . . . .80

Team EMC Bike Map. . . . . . . . . . . . . . . .61

Companion ProgramFor Our Companions . . . . . . . . . . . . . . .80

ExhibitorsExhibit Chair Message. . . . . . . . . . . . . . .81

Exhibitor Hall Floor Plan . . . . . . . . . . . . .82

Exhibitor List . . . . . . . . . . . . . . . . . . . . . .83

Exhibitor Profiles . . . . . . . . . . . . . . . . . . .85

Patrons and AdvertisersAdvertisements . . . . . . . . . . . . . . . . . . .124

Thank You! . . . . . . . . . . . . . . . . . . . . . .146

Advertisers Index. . . . . . . . . . . . . . . . . .146

Table of ContentsTable of Contents

www.emc2015usa.emcss.org 7

Welcome to Silicon Valley, the land of sunshine and great wine. Did you know that it used to be called Santa Clara Valley before it became the symbol of high tech startups?

This is an unusual year where we have a USA-based symposium in Santa Clara, CA and the International one in Dresden, Germany. Although it is only seven months since the 2014 Raleigh symposium, the size of this symposium is comparable to the International symposium, running from Monday to Friday with the combination of EMC and Signal/Power Integrity topics. We have three unique special events planned for this symposium. Our featured Keynote Speaker is Dr. Thomas H. Lee, graduate of MIT and current electronic engineering professor at Stanford University. Dr. Lee will be summarizing three historical events that have proven the fragility of the Earth’s electronics systems which is a subject that greatly affects us all. Our Technical Committee has worked hard to plan an excellent program including new Plenary Sessions with four technical keynote speakers and a Panel of Experts that will offer very informative dialogue about topics relevant to our industry.

While visiting the workshops/tutorials, the high quality Technical paper presentations, which will include unique Industry papers, and then passing through the Special Sessions, don’t forget to visit the Exhibit Hall where Product Show Cases and Experiments & Demos might inspire you to your next innovation.

The Symposium Organizing Committee has planned and designed the EMCSI 2015 Symposium with the goal of ensuring the most enriching technical and professional networking opportunities possible through multiple exhibits, technical programs, companion programs, and social events. We are offering three days of top-rated, peer-reviewed technical papers presented by experts in multi-track sessions and more than two days of practical workshops and tutorials, plus experiments and demonstrations presented by industry professionals.

Also included are collateral industry meetings and a full exhibit hall to learn about the latest offerings in EMC products and services. In addition to the number of regular sessions, special sessions and workshop/tutorial sessions on ‘standard EMC’ and ‘Signal and Power Integrity’, there will also be papers on Radio-Frequency Interference and Wireless EMC, Uncertainty Quantification in Computational EM and Signal/Power Integrity Verification, and many more topics! There is certainly something new for everyone, regardless of your interests, within the broad EMC & SI world.

Our Welcome Reception will feature the EMC band, providing you the atmosphere to relax and chat with friends and colleagues. The Gala will include a limited Awards presentation while you are being treated to true Californian cuisine. You may also choose to join in our Team EMC Bike Ride or catch a cab to Santana Row, one of the area’s premiere shopping and dining destinations.

I would also like to extend a welcome to the Santa Clara Valley IEEE EMC Chapter where many of our officers are also volunteering at this conference. If you have a chance, come join us on the second Tuesday of the month for the monthly chapter technical meeting.

Welcome!

Caroline ChanCaroline ChanEMCSI 2015 General Chair

General Chair’s MessageGeneral Chair’s Message

Friends and Colleagues

Caroline Chan, General Chair

2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program8

2015 Symposium Committee

GENERAL CHAIRCaroline ChanLockheed [email protected]

VICE CHAIRBob DavisLockheed [email protected]

SECRETARYDana CraigIntel [email protected]

ADVISORBruce ArchambeaultMST & ARCH EMI/[email protected]

TREASURER/FINANCE CHAIRJohn LaSalleNorthrop [email protected]

PUBLICATIONS CHAIR/CONTENTJohn RohrbaughNorthrop [email protected]

MARKETING CHAIRMike VioletteWashington [email protected]

MARKETING CO-CHAIRAshleigh O’ConnorIn Compliance [email protected]

CONFERENCE MANAGERJohn VanellaConference Directjohn.vanella@ conferencedirect.com

WEBSITE/DESIGNKelly OlsonATG [email protected]

WEBSITE MAINTENANCEJoseph [email protected]

EXHIBITS CHAIRJim BaerComply Tek, Inc. [email protected]

ARRANGEMENTS CHAIRRhonda RodriguezETS-Lindgrenrhonda.rodriguez@ ets-lindgren.com

ARRANGEMENTS VICE CHAIRDennis [email protected]

SOCIAL CHAIREriko [email protected]

COMPANION PROGRAMSue [email protected]

REGISTRATION CHAIRMark [email protected]

VOLUNTEER COORDINATORStephen [email protected]

VOLUNTEER COORDINATORAlpesh [email protected]

California is the leading U.S. producer of bell and chili peppers. The state produces 51 percent of U.S. field-grown bell pepper volume (9.9 million cwt) and 2.5 million cwt of chili peppers. The combined crops are worth more than $500 million!

ABOUT CALIFORNIA

www.emc2015usa.emcss.org 9

2015 Technical Committee

TECHNICAL PROGRAM CHAIRDr. Jun FanMissouri University of Science and Technology [email protected]

TECHNICAL PAPERS CHAIRDr. Chuck BuntingOklahoma State University [email protected]

TECHNICAL PROGRAM VICE CHAIR ON SIPIZhiPing [email protected]

TECHNICAL PROGRAM VICE CHAIR ON SIPIXiaoning [email protected]

TECHNICAL PROGRAM VICE CHAIR ON EMERGING NEW TECHNOLOGIESYihong QiDBJ [email protected]

TECHNICAL PROGRAM VICE CHAIR ON EMERGING NEW TECHNOLOGIESBrice AchkirCisco [email protected]

TECHNICAL PROGRAM VICE CHAIR ON INDUSTRY PAPERSDan OhAltera [email protected]

SPECIAL SESSIONS CHAIRChunfei [email protected]

WORKSHOPS & TUTORIALS CHAIRBruce ArchambeaultMST & ARCH EMI/[email protected]

EXPERIMENTS & DEMONSTRATIONS CO-CHAIRBob [email protected]

EXPERIMENTS & DEMONSTRATIONS CO-CHAIRGiuseppe [email protected]

GLOBAL UNIVERSITY CHAIRDale [email protected]


Welcome to Santa Clara, California

Located in the heart of the Great Silicon Valley, Santa Clara is home to thousands of the largest high-tech companies in the United States. The region is one of the top research and development centers in the world. This makes the area a perfect location to host the EMCSI 2015 Symposium. We are so glad you decided to join us to stay abreast of the current EMC & SI technology and trends.

The United States IEEE EMC Society welcomes you to this most valuable conference to connect with like-minded individuals and to learn from respected industry professionals. This is a great way to enhance your knowledge and improve your skills. Your companions will enjoy the chance to explore everything Santa Clara has to offer. From its eight beautiful Missions, where the city got its name, to Levi Stadium, shopping at Santana Row or the Intel Museum, Santa Clara is truly a city with something for everyone!

It is with great pleasure for me to officially welcome the EMCSI attendees and IEEE to our city. On behalf of the Santa Clara Chamber of Commerce & Convention-Visitors Bureau, the Santa Clara Convention Center, and our entire hospitality community, we want to thank you for choosing Santa Clara as the site for your EMCSI 2015 Program.

The City of Santa Clara has a long history dating back to the late 1700’s. Prior to 1852 when the city was incorporated, Santa Clara and Mission Santa Clara de Asis became the first outpost of Spanish civilization in the Santa Clara Valley. Santa Clara’s mission is the eighth of the 21 built in the state of California by the Spanish Franciscans.

Santa Clara is central to anything and everything. You are minutes to a wide variety of visitor attractions, restaurants, and incredible shopping venues, including Westfield Valley Fair and Santana Row. Two major Factory Outlets are also within a close drive.

Transportation is easy and accessible. You are three miles

to Mineta San Jose International Airport, 35 miles to San Francisco International Airport, and 39 miles to Oakland International Airport. Santa Clara is surrounded and serviced by ACE commuter service, CaiTrain, and Valley Transportation Authority Light Rail and Bus Service. The 42-mile light Light Rail stops right in front of our Convention Center.

Please be sure to visit santaclara.org for more information on what to do during your stay with us or visit our Chamber of Commerce for personalized information. We thank you for staying with us and enriching our community with your wisdom.

Have a pleasant stay and please let me know how we may further assist you.

Steve Van DornPresident & CEO, Chamber of Commerce

Letter from the Chamber of Commerce

EMCSI 2015 Conference Attendees: Greetings and Welcome!

As Mayor of Santa Clara, and on behalf of the entire City Council, it gives me great pleasure to welcome you to the City of Santa Clara for the EMCSI 2015 Conference. We are proud to be hosting your conference at the Santa Clara Convention Center.

We would like to share with you our pride and enthusiasm in an area rapidly growing as a favorite meeting place and convention destination. The Santa Clara area offers visitors a myriad of activities within a short distance. From the high tech world of the Intel Museum to the historical charm of the Santa Clara Mission, our award winning community Library at Central park, and our year round mild climate will provide attendees an opportunity to enjoy every major attraction in the picturesque Santa Clara Valley.

Many significant developments have taken place recently, notably the 49ers Levi’s Stadium next door to the Convention Center with Super Bowl 50 planned for 2016.

I would like to take this opportunity to extend my heartfelt wishes to the organizers and attendees for a successful and enjoyable event. I hope that the pleasant experience in our City will encourage you to return time and time again.

Jamie L. MatthewsMayor, City of Santa Clara

Letter from the Mayor of Santa Clara

Symp

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Symposium at a Glance

2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program

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Patrons and Sponsors


Established 1981

®

ENR / Seven Mountains Scientific Inc.

EspressoEngineering

Evaluation Engineering (EE)

In Compliance - Same Page Publishing, Inc.

ITEM - Interference Technology

Microwave Journal

Safety & EMC Magazine

Webcom Communications Corporation

Wireless Design & Development, ECN

MEDIA SPONSORS

Patrons and Sponsors

THE 2015 IEEE NATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY COMMITTEE EXTENDS OUR GRATITUDE TO THIS YEAR’S PATRONS AND SPONSORS FOR THEIR SUPPORT.

14 2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program

Getting Around Santa ClaraGe

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Infor

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THINGS TO DO IN SANTA CLARA

1) Check out Levi’s Stadium

2) Visit the historic Mission Santa Clara de Asis

3) Explore the Intel Corp Museum

4) Stroll the Shops at Santana Row

Go to www.santaclara.org for dining, entertainment, and area attractions.


General InformationGeneral Information

Registration HoursSunday - 2:00 PM - 6:00 PMMonday – Thursday - 7:00 AM - 5:00 PMFriday - 7:00 AM - 11:00 AM

Registrants will be required to wear badges to access the various sessions. Some of the programs require an additional fee such as Global University and some of the social events. If they are required, additional fees are listed within this Final Program.

Exhibit Hall Hours The Exhibit Hall is located in the Santa Clara Convention Center - Halls A, B & C

Tuesday, 10:00 AM – 5:00 PMWednesday, 9:00 AM – 5:00 PMThursday, 9:00 AM – NOON

Speaker’s Ready Room7:00 AM - 5:00 PMConvention Center, Room #205

Companion/Hospitality Room 8:00 AM – 10:00 AM, Hyatt, Camino Real

First Aid and AssistanceAll of the Santa Clara Convention Center Security persons are First Aid and CPR qualified. A City Fire Station is ¼ mile away. City fire crews are qualified paramedics. Response time is generally within 5 minutes. The nearest hospitals are about 15 minutes away.

Volunteer Check-In• Arrive at Convention Center one half-hour before

your scheduled start time

• Once you have received your badge from registration, proceed to the Symposium Committee Room #207 to receive your Pin and Shirt. We will have a schedule posted and a contact there to answer questions about assignment, etc. Please arrive at the designated time.

• The Symposium Office will be serving breakfast and lunch for the volunteers one half-hour before the start of each shift and snacks in between. Monday thru Friday meals will be served and snacks only on Sunday.

• Specific volunteer position instructions, besides what is mentioned here (such as for Registration volunteers), will be provided in the Symposium Committee Room during the half-hour period prior to the start of your assignment. Please make sure to arrive at least one half-hour early. Sunday volunteers will get their instructions in the Registration area.

See page 23 for more details!

Gene

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Convention Center Floor Plans


SANTA CLARA CONVENTION CENTER

5001 Great America Pkwy, Santa Clara, CAPhone: (408) 748-7000www.santaclara.org/conventioncenter

General Information

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Hyatt Meeting Rooms Floor Plan


HYATT REGENCY SANTA CLARA5101 Great America Parkway, Santa Clara, CAPhone: (408) 200-1234www.santaclara.hyatt.com

SANTANA ROW Visit Santana Row, less than 10 minutes from downtown San Jose and enjoy shopping, dining, spas, theatres and more!

When you arrive, visit the Santana Row Concierge located in the via between Left Bank Brasserie and Sino restaurants and pick up your exclusive VIP Passport. Your passport will include shopping and dining incentives and a $10 Santana Row Gift Card, good at all the shops and restaurants.

www.santanarow.com

Santana Row Concierge - 408.551.4611

Second Level

Techn

ical P

rogram

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WELCOME! On behalf of myself and the Technical Program Committee, we welcome you to the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMCSI2015) in Santa Clara, California! This symposium is a special venue for those who may not be able to travel to Dresden, Germany, for the annual IEEE International Symposium on EMC. However, as a result of the superior effort from everyone including the authors/speakers, reviewers, Technical Advisory Committee and Technical Program Committee members, the planned technical program is the excellent quality you have come to expect! As you will find in this Final Program, there are a variety of activities, from the traditional paper sessions and workshops/tutorials to the new elements of plenary session and panel discussions. I am confident that the technical program will bring many of the leading researchers in our field together for a productive technical exchange.

For the first time ever, we are introducing Industry Papers! Due to the practical nature of our field, a high level of professional involvement is essential for the success of our symposium. Considering the fast-paced environment in today’s high-speed industry, allowing the industry authors to submit abstracts for review has attracted high-quality contributions to the technical program. Over one third of all the accepted papers are Industry Papers, and I anticipate their focus on the cutting-edge challenges and solutions will provide unique benefits for the attendees. Our goal is to create a technical program to allow the industry to meet with the academia (then magic occurs). In the new plenary session, the attendees have the chance to hear the visions from four well-recognized professors in our field on the development of new technologies as well as the latest research outcomes. The newly designed panel sessions cover several focused topics and also allow more interactions among the panelists and the audience. We have 17 student papers competing for the best student paper award, and the winner of the Student EMC Hardware Design Competition will also be announced at the symposium!

Lastly, but not the least, I would like to thank the members of the Technical Program Committee and the Technical Advisory Committee for their willingness to devote long hours to creating a unique and educational program despite the extremely tight schedule due to the two EMC symposia this year. I would also like to thank all the authors and presenters for their diligence and care in writing and preparing presentations. Welcome again to all the attendees! I hope you enjoy this symposium and take full advantage of the unique learning opportunities it presents.

Sincerely, Jun Fan Technical Program Chair [email protected]

Technical Program Welcome


Jun Fun, Technical Program Chair

Technical Program

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Technical Paper Review Team

Brice AchkirPoul AndersenGiulio Antonini

Vil ArafilesBruce Archambeault

Dave ArnettSeungyong Baek

Dale BeckerAlpesh BhobeColin Brench

Chuck BuntingSpartaco Caniggia

Johan CatrysseZhong Chen

Ji ChenDuo Chen

Daehyung ChungAntonio Ciccomancini

Samuel ConnorRobert Davis

Francesco de PaulisXiaoqing DongAlistair DuffyKaren DybergA. Ege EnginRaul EnriquezTom FaganGang FengJohn Flavin

Heyno GarbeGabriele Gradoni

Sanjeev GuptaEdward Hare

Anand HaridassJiangqi He

Fred HeatherMike HoffmanBob Hofmann

H. Robert Hofmann

Dan HoolihanZeng Hua

Shaowu HuangTodd Hubing

Dan JiaoBob Johnk

David JohnsZulfiqar KhanJingook Kim

Namhoon KimJim Knighten

Galen KoepkeMarina Koledintseva

Ravi KolliparaDarryl KostkaJohn KraemerDoug Kramer

An-Yu KuoYoung Kwark

Hai LanErping Li

Joy LiJane LimClara Lim

Hui LiuCathy Liu

John MaasWenjie Mao

Franco MoglieRajen Murugan

Ross MyrehnJim Nadolny

Dan OhMichael Oliver

Antonio OrlandiFrank PagliaLuis N PerezGhery Pettit

Davy Pissoort

David PommerenkeWilliam PriceJudy Priest

Bill RadaskySergiu RaduL RaimondoFangyi RaoJihong Ren

Vittorio RicchiutiGerardo RomoSourajeet Roy

Albert E. RuehliEdward SavageWerner Schaefer

Venkatesh SeetharamGiuseppe SelliJamal Shafii

Yujeong ShimWeifeng ShuHarry SkinnerDave Staggs

Manfred StecherGregory TaitPiero TriverioMin WangYong WangJames West

Kimball WilliamsKai Xiao

Jianyong XieJianfeng Xu

Wei XuZhiping YangChunfei Ye

Xinjun ZhangJi Zhang

Jianmin ZhangHanqiao Zhang

Olena Zhu


The IEEE EMCSI 2015 Committee extends our gratitude to all the people who took time out of their busy schedules to review our technical papers. Your efforts lend professionalism and technical expertise to our program and are much appreciated.

Special Thanks to the Technical Paper Review Team

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Modal Expansion Basis for Statistical Estimation of Maximum Expected Field Strength in Enclosures

Presented during TU-AM-5 Electromagnetic Environment and ESD Grand Ballroom E at 10:30 AM

Paul Bremner, Robust Physics, Del Mar, CA, USA

2D Imaging System With Optical Tracking for EMI Source Localization**

Presented during TU-PM-2 Electromagnetic Interference Control Grand Ballroom B at 3:30 PM

Hui He, Victor Khilkevich, and David Pommerenke, Missouri University of Science and Technology, Rolla, MO, USA

A Planar Low-Profile Meander Antenna Design for Wireless Terminal Achieving Low Self-Interference

Presented during TH-PM-1 Wireless Testing and RF Interference Grand Ballroom A at 2:30 PM

Yihong Qi1, Jun Fan2, YeHai Bi3, Fred Yu1, and James Drewniak2, (1) DBJ Technologies, Zhuhai, China, (2) Missouri University of Science and Technology, Rolla, MO, USA, (3) Shenzhen Sunway Communication Co.,Ltd, ShenZhen, China

Robust and Efficient RLGC Extraction for Transmission Line Structures with Periodic Three-Dimensional Geometries

Presented during WED-AM-5 Applications of Numerical Modeling Grand Ballroom E at 9:00 AM

Yunhui Chu1, Jason Zhenwei Yu2, and Zhiguo Qian3, (1) Intel Corp, Hillsboro, OR, USA, (2) Intel, Seattle, WA, USA, (3) Intel Corporation, Chandler, AZ, USA

An Augmented Electric Field Integral Equation Formulation for Dielectrics and Conductors at Low Frequencies**

Presented during WED-AM-5 Applications of Numerical Modeling Grand Ballroom E at 9:30 AM

Tian Xia1, Hui Gan1, Michael Wei1, Weng Chew1, Henning Braunisch2, Zhiguo Qian2, Kemal Aygun2,and Alaeddin Aydiner3, (1) University of Illinois, Urbana-Champaign, Urbana, IL, USA, (2) Intel Corporation, Chandler, AZ, USA, (3) Intel Corporation, Hillsboro, OR, USA

Maximum Received Power Statistics within RF Reflective Enclosures for HERO/EMV Testing

Presented during TH-AM-1 EMC Measurements and Calibration Grand Ballroom A at 11:30 AM

Carl Hager, IV and Gregory Tait, NSWC Dahlgren, Dahlgren, VA, USA

Near-field Coupling Estimation by Source Reconstruction and Huygens’s Equivalence Principle**

Presented during TH-PM-1 Wireless Testing and RF InterferenceGrand Ballroom A at 3:30 PM

Liang Li1, Jingnan Pan1, Chulsoon Hwang3, Gyuyeong Cho2, Hark Byeong Park2, YaoJiang Zhang1, and Jun Fan1, (1) Missouri Science and Technology, Rolla, MO, USA, (2) Samsung Electronics, Suwon, South Korea, (3) Samsung Electronics, Suwon GyengGi-Do, South Korea

Best Symposium Paper Finalists


BEST EMC PAPER AWARD FINALISTS

Technical Program

21


On-Chip Linear Voltage Regulator Module (VRM) Effect on Power Distribution Network (PDN) Noise and Jitter at High-Speed Output Buffer

Presented during TU-AM-3 Jitter/Noise Modeling and Analysis I Grand Ballroom C at 11:00 AM

Heegon Kim1, Sukjin Kim1, Changwook Yoon2, Jingook Kim3, Brice Achkir4, Joungho Kim1, and Jun Fan5, (1) Korean Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, (2) Altera Corporation, San Jose, CA, USA, (3) Ulsan National Institute of Science and Technology, Ulsan, South Korea, (4) Cisco Systems, Inc., San Jose, CA, USA, (5) Missouri University of Science and Technology, Rolla, MO, USA

Quality Assurance of S-parameters and Rational Function Models for Transient Simulations

Presented during TU-AM-4 Numerical Modeling and Simulation Techniques I Grand Ballroom D at 11:30 AM

Sanghoek Kim, Gerardo Romo Luevano, Kevin Roselle, and Tim Michalka, Qualcomm Inc., San Diego, CA, USA

Effective Equalization of a High Speed Differential Channel with Re-driver - Screening and RSM DOE Method Applied to a Real System**

Presented during TU-PM-3 High Speed Link Design I Grand Ballroom C at 2:00 PM

Maria Garcia1, Raul Enriquez2, and Jose A. Ramos2, (1) CINVESTAV, Zapopan, Mexico, (2) Intel Tecnologia de Mexico, Zapopan, Mexico

Method for Accurate and Efficient Signaling Analysis of Nonlinear Circuits


Dan Jiao1 and Jianfang Zhu2, (1) Purdue University, West Lafayette, IN, USA, (2) Intel, Hillsboro, OR, USA

Fast Structure-Aware Direct Time-Domain Finite Element Solver for Large-Scale On-Die Power Grid Simulation**

Presented during TH-AM-3 Modeling and Simulation for Large-Scale and Multi-Scale Power Delivery Network Grand Ballroom C at 9:30 AM

Woochan Lee and Dan Jiao, Purdue University, West Lafayette, IN, USA

Vectorless Transient Power Grid Verification: A Case Study with IBM Benchmarks

Presented during TH-AM-3 Modeling and Simulation for Large-Scale and Multi-Scale Power Delivery Network Grand Ballroom C at 11:00 AM

Xuanxing Xiong1 and Jia Wang2, (1) Synopsys, Inc., Mountain View, CA, USA, (2) Illinois Institute of Technology, Chicago, IL, USA


BEST SIPI PAPER AWARD FINALISTS

Santa Clara is the site of the eighth of 21 California missions, Mission Santa Clara de Asís, and was named after the mission.

ABOUT SANTA CLARA

22

A Hybrid 3D/ Equivalent 2D Finite Element Analysis for Vias Passing Through a Parallel Plate Pair Filled with Multilayer Dielectric*

Presented during TH-PM-2 Numerical Modeling and Simulation Techniques II Grand Ballroom B at 3:30 PM

Liehui Ren1, Peng Shao1, Kelvin Qiu1, Jane Lim1, Rick Brooks1, YaoJiang Zhang2, and Jun Fan2, (1) Cisco Systems, Inc, San Jose, CA, USA, (2) Missouri University of Science and Technology, Rolla, MO, USA

Effective Power Delivery Filtering of Mixed-Signal Systems with Negligible Radiated Emission*

Presented during TH-PM-3 Power Integrity and Power Delivery Network II Grand Ballroom C at 2:30 PM

Mohammad Ali Khorrami1, Paul Dixon1, John Song2,and Keith Johnson3, (1) Laird, Randolph, MA, USA, (2) Laird, Schaumburg, IL, USA, (3) Laird, Cleveland, OH, USA



System Level Modeling of Supply Noise Induced Jitter for High Speed Clock Forwarding Interface*


Yujeong Shim and Dan Oh, Altera Corporation, San Jose, CA, USA

Using Co-Design Techniques to Minimize IC Package Cost without Compromising Performance: Simulation and Measurement Validation*

Presented during TU-PM-4 SI/PI/EMC Co-Simulation and Co-Design Grand Ballroom D at 2:30 PM

Jie Chen, Robert DeMoor, Minhong Mi, and Rajen Murugan, Texas Instruments, Inc., Dallas, TX, USA

Challenges and Solutions for Core Power Distribution Network Designs*

Presented during WED-AM-4 Power Integrity and Power Delivery Network I Grand Ballroom D at 8:30 AM

Dan Oh and Guang Chen, Altera Corporation, San Jose, CA, USA

A Novel Approach to Evaluate Link Performance using IBIS-AMI Model with Measured Waveform*

Presented during TH-AM-2 High Speed Link Design II Grand Ballroom B at 10:30 AM

Weifeng Shu1, Chunfei Ye2, and Xiaoning Ye3, (1) Intel Asia Pacific Research and Development Ltd, Shanghai, China, (2) Intel Co., DuPont, WA, USA, (3) Intel Corporation, Hillsboro, OR, USA

BEST INDUSTRY PAPER AWARD FINALISTS

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Mobile Symposium

EMCSI 2015 Personal SchedulerUsing the Personal Scheduler, you can search or browse events scheduled for the Symposium, create your own schedule of events, check it for conflicts and record notes, and download to your Personal Digital Assistant (PDA). The Personal Scheduler is simply a planning tool, not a way to register for sessions. Entry into each session at the meeting is on a first-come, first-served basis.

Features

Browse/Search: You have several options for searching or browsing the program. Search to quickly find particular speakers or topics of interest. Browse to learn what else has been scheduled.

My Schedule:

A concise display of the events that you have chosen to attend. The details of your schedule can be saved on your hard drive and then loaded into the datebook on your desktop and PDA; or it can be printed.

My Bookmarks:

You will probably find more events of interest than you can possibly attend at the meeting. The personal scheduler allows you to add those events to a hyperlinked list of bookmarks for future reference.

EMCSI 2015 Mobile App This new EMCSI 2015 mobile app gives you complete schedules of the symposium, session details and the ability to add presentations to your calendar. The full exhibitor list with contact information is included with an interactive map to help you find the booth you are seeking. In addition, the app allows you to pull up meeting room maps, search for sessions by name and much more.

Features • View the agenda and create a personal schedule • Take notes in the presentations and exhibitors modules• Message app users• View exhibitor information and interactive floor plan• Receive alerts & updates for the meeting• View maps of the venue and surrounding area• Access supplementary resources and more! Search for IEEE EMCSI 2015 in your iTunes or GooglePlay app store.

To learn more about both apps and for download/installation instructions go to www.emc2015usa.emcss.org/eventapps


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Technical Program Guide


Technical Program

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Technical Program Guide



Keynote PresentationTec

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The Carrington Event, H-bombs, Telstar and the Great Geomagnetic Storm of 1989Keynote Presentation by Dr. Thomas H. Lee, Stanford University

TUESDAY, MARCH 17 8:30 AM - 10:00 AM

Mission City Ballroom 1

Dr. Thomas Lee, Keynote SpeakerOver the last century, electronics has so insinuated itself into the fabric of civilization that hardly any aspect of our lives is not dependent on it. This talk will present the history of three events that underscore the fragility of what we have built. We’ve

been remarkably lucky so far, but perhaps we should have a strategy, too.

Starfish Prime answered the question of what detonating an H-bomb above ground might do to electronics. On 9 July 1962, the US exploded a 1.4-megaton thermonuclear device a few hundred miles above Johnston Atoll in the Pacific Ocean. The effects were much stronger and more varied than anticipated. Radio communications as far away as Australia and California were disrupted. EMP knocked out or otherwise caused to malfunction hundreds of traffic lights in Honolulu, as well as numerous garage-door openers and microwave telephone relays. Perhaps its most famous victim, however, was Telstar, the first active telecommunications relay satellite, which had the misfortune of launching a day after Starfish Prime. The large flux of high-energy electrons produced by Starfish rapidly degraded Telstar’s electronics, and rendered the bird silent within four months.

Hazards of this scale are not all due to avoidable human action. In 1859, telegraphers were shocked -- figuratively and literally -- by dramatic and puzzling phenomena. Sparks jumped across the gaps of telegraph keys; links functioned even when batteries were disconnected; and messages were received that had not been sent. At the same time, brilliant auroral displays were visible at unusually low latitudes. The British amateur astronomer Richard Carrington connected these occurrences to a solar flare he’d observed on 1 September. Today we know that a huge coronal mass ejection (CME) from the sun was ultimately responsible for these effects. A reminder that dangerously powerful CMEs are by no means rare came in 1989. A large CME-induced geomagnetic storm hit Quebec on 9 March, causing a massive regional power blackout within 90 seconds. Had it been a Carrington-level event, the damage could have been as high as a trillion dollars. That risk remains unmitigated today.

Thomas H. Lee is an electrical engineering professor at Stanford University. In 1994 he founded the Stanford Microwave Integrated Circuits Laboratory. He has written and co-authored several books and papers, and recently concluded a tour of duty as the director of DARPA’s Microsystems Technology Office.


Technical ProgramPlenary Sessions

FormatFour, 45 minute talks in a half-day session.

THURSDAY, MARCH 19 8:30 AM - 12:00 PM

Grand Ballroom G

Co-Chair: Dale Becker, IBM, Poughkeepsie, NY, USA Co-Chair: Jun Fan, Missouri University of Science and Technology, Rolla, MO, USA

THE FUTURE OF EMC AND SI ENGINEERINGBruce Archambeault, Missouri University of Science and Technology, Rolla, MO, USA

As data rates increase into the tens of GHz range, and many devices are becoming smaller and including various wireless radios, the traditional approaches to EMC and SI design will not be sufficient to meet the functional and regulatory requirements. This presentation will discuss the future trends and some possible design approaches beyond traditional simple shielding.

CHALLENGES AND OPPORTUNITIES FOR POWER DELIVERY

Madhavan Swaminathan, Georgia Institute of Technology, Atlanta, GA, USA

With a multitude of applications emerging, power delivery is becoming a major challenge. With the power levels ranging from high, medium, low and ultra-low, a single power delivery scheme cannot be used for all applications. Power delivery consists of three major parts namely, source, distribution and load with control circuitry connecting these sub-blocks. With integration within the chip, package and printed circuit board, these sub-blocks need to be co-designed and co-optimized, without which

an efficient power delivery scheme is not possible. This presentation discusses the challenges and opportunities for power delivery in the context of electronic systems. The importance of educating the next breed of engineers in this rapidly growing field will be highlighted as well.

NANOTECHNOLOGY IN EMCEr-Ping Li, Zhejiang University & Institute of High Performance Computing, Singapore

Recently, nanomaterial is a topic of very attractive research fields from science to potential applications in microwave and electromagnetic compatibility. This paper briefly overviews the graphene and other nanomaterials research for EMC applications. In particular, 2D nanomaterial Graphene is a single layer of carbon atoms bound in a hexagonal lattice structure with extraordinary mechanical properties, superior carrier mobility, and high thermal conductivity. The extraordinary properties and freelance hybridization with other materials make graphene one of the most promising candidates for the future applications in EMC.

ADVANCED PACKAGING FOR EMC/SI/PIJames Drewniak, Missouri University of Science and Technology, Rolla, MO, USA

Increasing data rates and design densities together with new enabling technologies necessitate new approaches in packaging, materials, and design for SI, PI, and EMC to meet design specifications, cost pressures, and regulatory requirements. This presentation will highlight several technologies and examples that are enabling data rates that will soon exceed 50 Gbps over a single lane and very high design densities that result in increasing challenges in packaging, materials, tools, and design methodologies for achieving specifications.

Join us for a half-day plenary session highlighting the advances in EMC and SI and the challenges facing us. Four excellent speakers will give insight from their experience on addressing electrical emissions, propagation and susceptibility across a broad range of emerging technologies. This session will give the attendees a great appreciation for the breadth of components and designs and the innovative techniques for analysis and characterization and get them thinking about the application to their own research and development.


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Panel of Experts

Abstract

This panel will provide an analysis of regulatory processes for product compliance with regulatory bodies in Brazil (ANATEL and INMETRO ), and Mexico (NYCE and IFETEL). The panel will also discuss regulatory information about rapidly evolving WEEE compliance in Latin America.

An in-depth review of laws covering 2.4 GHz – 5 GHz, 900 MHz and DFS bands and a description of EMC testing, RF Testing, Safety testing (over voltage test), and plug type will included, as well as best practices to successful product certification in both countries.

Included in the discussion are the Telecommunications Trends in the region, infra-structure investment to address the growth of mobile use and the regulations that are needed to support that growth. Topics such as the adoption of 700 MHz band, UWB, Femtocell, adoption of 4G technology and new antenna laws will be dis-cussed. Brazilian and Mexican Testing laboratory representatives will be part of the panel providing a great opportunity for attendees to get answers straight from the in-country testing laboratories.

An expert in WEEE compliance in Latin America will share regulations on pack-aging, waste and hazardous substances and provide in-depth information on waste/recycling policies in Latin America.

Objectives

• To provide the most in-depth regulatory and technical workshop in relation to Brazilian regulatory bodies ANATEL and INMETRO, and Mexico NYCE and IFETEL. In addition provide important WEEE Take Back Program laws for Latin America.• To share the latest regulatory changes and telecommunications trends that will affect the development and deployment of equipment. • To share proven steps to follow for successful product certification in Brazil

The EMCSI 2015 committee has identified current matters relevant to various industries in EMC and SI and we have invited a group of panelists with specialized experience in each area. The response from our experts has been extremely enthusiastic and we hope you are as eager to attend as we are to introduce this new event. Let’s get some great dialogue started!

TUESDAY, MARCH 17 1:30 PM - 3:00 PM

OPTIMIZING INTERFERENCE CONTROL USING MATERIAL SCIENCE Grand Ballroom E

Chair: Mark Montrose, Montrose Compliance Services, Inc., Santa Clara, CA, USA

Abstract

Material science plays a significant role in all aspects of a system design. This panel discusses the use of different construction materials found in every system design to minimize development and propagation of unwanted EMI in addition to enhancing immunity protection.

The first panelist will discuss emerging hybrid EMI shielding structures and their feasibility for high volume applications. The second panelist will present aspects of absorber material and their principles of operation including various test methodologies for quantifying absorber effectiveness. A third panelist will discuss printed circuit board construction material that affects signal integrity and which is the primary cause of common-mode current development in high-speed circuit designs. The fourth panelist covers carbon nanotube/graphene based composite materials for EMI shielding applications. The final panelist will present uses of composite materials for both shielding and immunity protection utilized in transportation systems.

3:30 PM - 5:00PM

BRAZIL AND MEXICO REGULATORY UPDATES, TRENDS AND BEST PRACTICES FOR SUCCESSFUL PRODUCT CERTIFICATIONGrand Ballroom E

Chair: Elizabeth Perrier, ORBIS Compliance LLC, Morgan Hill, CA, USA

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Headline Example

Clayton R. Paul Global University


WEDNESDAY, MARCH 18 1:30 PM - 3:00 PM

ARE EMC/SI/PI CLOSELY RELATED NOW OR IN THE FUTURE?Grand Ballroom E

Chair: Bruce Archambeault, Archambeault EMI Enterprises, Four Oaks, NC, USA

Abstract

In the past, the disciplines of EMC, Signal Integrity (SI) and Power Integrity (PI) were separate and analysis was usually performed by completely different engineers. However, the time has already come where for most system designs these disciplines can not be separate and must be considered together. This panel will discuss how and why these areas need to be considered simultaneously and the dangers of not doing so.

3:30 PM - 5:00PM

ELECTRICAL CHARACTERIZATION OF HIGH FREQUENCY INTERCONNECTS AT BANDWIDTHS UP TO 50 GHZGrand Ballroom E

Chair: Xiaoning Ye, Intel Corporation, Hillsboro, OR, USA

Abstract

As high speed interconnect data rates increase (up to 25Gbps and above beyond 25 Gb/s), the need for an accurate interconnect measurement is ever critical. However, there is a lack of standard practices on how to measure interconnects at high frequencies:

Most instruments (such as VNA, TDR/TDT) can make good measurements at the end of a coaxial cable. However, test fixtures need to be inserted between an instrument’s coaxial interface and the DUT (PCB, package, connector, cable, etc.). There are various de-embedding approaches already commercially available, however, the de-embedding algorithms are often proprietary, and verification of the accuracy of the computed S parameters is left to the user.

A poorly designed test-fixture can lead to inaccurate de-embedded S parameters. An IEEE standard is needed to specify the electrical requirements of a properly designed test fixture to achieve high quality de-embedding.

The quality of measured S parameters of a DUT can vary widely. There is no IEEE standard to check and validate the quality of S parameters before they are distributed for use. This has created many complications for engineers who are constructing models for high speed interconnect analysis. An IEEE standard is needed to check S parameters quality right after they are obtained in lab measurement.

In this panel discussion, the panelists will share their thoughts on how to address the above challenges of ensuring the quality of measured data for high frequency interconnects at bandwidths up to 50 GHz. This might include but not be limited to: recommended design of test fixturing, methods and processes for ensuring the accuracy and consistency of measured data for broadband signals with frequency content up to 50 GHz.

THURSDAY, MARCH 19 1:30 PM - 3:00 PM

ESD IN DATA CENTERSGrand Ballroom E

Chair: David Pommerenke, Missouri University of Science and Technology, Rolla, MO, USA

Abstract

To initiate a broader discussion on ESD David Pommerenke will present on a study of the relationship between humidity and ESD severity focusing on data centers. At low humidity the risk for ESD inflicted damage or upsets increases. Material will be presented that analyzes the risk of upset or damage as a function of humidity for data centers and shows how flooring and foot wear can control the risk. Further, it provides data on the charge voltage and probability distribution for ESD induced by walking and other ESD causing events, such as sitting up from a chair. A broader discussion will follow that relates to ESD damage and upset on displays, test methods for displays and other ESD topics requested by the audience or the panelists.

Panel of ExpertsTechnical Program


Workshops and Tutorials

requires electric fields to be zero on perfect electric conductors, a short discussion on skin effect, and harmonic content of digital signals are discussed.

2) Grounding OverviewTodd Hubing, Clemson University, Clemson, SC, USA

Topics to be covered: What is a ground? What is its purpose(s)? Ground versus current return paths. Practical grounding issues – bonding, corrosion control, current levels, sizing, etc. Grounding and circuits – PCBs, digital, analog, RF, power supplies. Grounding for systems – automotive vehicles, aerospace vehicles, naval vehicles.

3) ShieldingTodd Hubing, Clemson University, Clemson, SC, USA

Topics to be covered: An introduction to the theory of shielding; absorption and reflection loss, the difference between electric and magnetic field shielding in the near field and shielding in the far-field; the influence of apertures and holes on shielding effectiveness; shielding materials, gaskets, and enclosures, effective and ineffective techniques of implementing a shield.

4) Fundamentals of Signal Integrity (SI)Xiaoning Ye, Intel, Portland, OR, USA

Topics to be covered: Description of why SI is important, its potential causes and effects upon component/system operation. Discussion of typical corrective actions in the design stage to minimize the development of SI issues and possible mitigation strategies that can be used during system development.

MONDAY MORNING 8:30 AM - NOON

MO-AM -1

FUNDAMENTALS OF EMC & SIGNAL INTEGRITYSponsored by ESACFormat: Full-day TutorialGrand Ballroom A

Chair: Mark Steffka, University of Michigan – Dearborn, Dearborn, MI, USA

Abstract

This tutorial is an introduction and overview of many of the major topics that need to be considered when designing a component or system for EMC and to minimize potential SI/PI issues. The tutorial will present the foundational physics and provide an overview of the significance and relevant mathematics that need to be understood to successfully evaluate, diagnose, and solve both EMC and SI/PI issues. After the “background” material on causes of emissions is covered, specific examples of the application of the theory will be discussed in dedicated sessions on grounding, shielding, printed circuit board (PCB) design, as well as important considerations in designing for SI/PI, and the tutorial will conclude with an overview of typical EMC test equipment.

Presentations

1) Basic EMI and the Source of Emissions

Lee Hill, Silent Solutions LLC, Amherst, NH, USA

Topics to be covered: Maxwell’s equations, Ampere’s law, Faraday’s law and how it defines inductance. Current flows in path of least impedance (least resistance at DC and least inductance at high frequencies, and where this transition occurs). Boundary conditions and how this


ABOUT SILICON VALLEY

The garage in which Bill Hewlett and Dave Packard developed HP’s first product in 1939, the Model 200A audio oscillator, is now California Historic Landmark No. 976 in Palo Alto, California. HP’s first customer was Walt Disney Studios. The company purchased HP’s 8 audio oscillator, which is an electronic test instrument used by sound engineers, for the classic movie “Fantasia”.


Technical ProgramWorkshops and Tutorials

MO-AM-2

CALIBRATION OF EMC TEST FACILITIES AND MEASUREMENT INSTRUMENTATION TUTORIAL Sponsored by TC-1Format: Half-day Tutorial Grand Ballroom B

Chair: Frans Stork, ETS-Lindgren, Cedar Park, TX, USACo-chair: Janet O’Neil, ETS-Lindgren, Cedar Park, TX, USA

Abstract

This tutorial will present detailed information about the state of the art in calibration of EMC measurement equipment and test facilities required by many current international standards. Specific requirements and nuances that can challenge even the most experienced EMC practitioner will be discussed, and methods for practical implementation for real-world application will be shared with attendees. Speakers will include experts who are actively involved in using, writing and maintaining the standards in which the requirements are established.

All new material will be presented, representing activity within the related standards committees, including CISPR, ISO, ANSI ASC C63® and IEEE. This tutorial will take a novel approach to equipment and facility calibration by delving into implementation of specific characteristics and requirements, as opposed to a general treatment of calibration.

Calibration issues related to a variety of test facilities and measurement equipment and the associated standards will be included, including antennas per ANSI C63.5; LISNs according to ISO; field probes according to IEEE 1309; test sites used for antenna calibration and reference test sites, per revision being developed for CISPR 16-1-5 and future CISPR 16-1-6. Clarification will be provided about distinguishing LISNs and AMNs separately, since many engineers and technicians use these terms interchangeably.

Attendees can expect to improve their understanding of both the background of the latest requirements for calibration of EMC measurement equipment

and facilities and practical aspects of performing or specifying the required calibrations.

Planned topics and speakers:

1) CISPR 16 Radiated Emissions > 1 GHz (CISPR 16-1-4, 16-1-5, 16-1-6)

Martin Wiles, ETS-Lindgren, Stevenage, England, United Kingdom

2) How to Specify an ISO 17025 Accredited Calibration of a LISN

Peter Drembelas, Fischer Custom Communications, Torrance, CA, USA

3) Calibration of Field Probes for EMC Measurements (IEEE 1309)

Zhong Chen, ETS-Lindgren, Cedar Park, TX, USA

4) Traceability of Antenna Measurement and Introduction to Methods in CISPR 16-1-6 for Frequencies Below 1 GHz

David Knight, NPL, Middlesex, England, United Kingdom

5) Verification of Test Chambers for Radiated Emission Testing (ANSI C63.4, C63.25)

Greg Kiemel, Northwest EMC, Hillsboro, OR, USA

MO-AM -3

PRODUCT EMC CHALLENGES FOR EMERGING WIRELESS TECHNOLOGIES Sponsored by SC-4Format: Half-day TutorialGrand Ballroom C

Co-chair: Kefeng Liu, General Test Systems Inc., Shenzhen, ChinaCo-chair: Seth J. Seidman, Food and Drug Administration, Silver Spring, MD, USA

Abstract

While we are enjoying the benefits from the advent of newer and faster wireless transmissions, design issues related to product converged performance, coexistence with other wireless devices, and compatibility with current EMC regulatory rules are becoming hot topics up for discussion. This workshop,



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implications. The format will be a conference presentation style (lecture) followed by questions moderated by the chairman. It is designed for both academics and people from industry who will be involved in radiated emission or immunity testing of commercial or military systems using reverberation chambers and will be valuable to personnel evaluating the use of reverberation chambers as a complement to or replacement for other types of radiated test facilities and for personnel who are trying to use statistical methods to characterize the electromagnetic environments.

Planned Speakers and Topics

1) Introduction – Rationale for RC Testing,Vignesh Rajamani, Chuck Bunting, and Gustav J. Freyer (consultant), Oklahoma State University, Stillwater, OK, USA

2) Overview of Reverberation Chamber TheoryChuck Bunting, Vignesh Rajamani, and Gustav J. Freyer (consultant) Oklahoma State University, Stillwater, OK, USA

3) Using Reverberation Chambers for Broadband (4G/LTE) Immunity Testing on Devices: Lessons Learned

J. Ladbury, J. Coder, and William Young, National Institute of Standards and Technology (NIST), Boulder, CO, USA

4) Evaluation of Material Shielding Effectiveness Using Coupled Reverberant Cavities

Carl Hager and Greg Tait, Naval Surface Warfare Center, Dahlgren, VA, USA

5) Complex Cavity Measurement Techniques for Precision Metrology Applications and Aircraft/Vehicle Electromagnetic Environment Assessments

Dennis Lewis, Boeing, Seattle, WA, USA

6) Optimizing Reverb Chamber Design for DO160

Garth D’Abreu, ETS Lindgren, Cedar Park, TX, USA

sponsored by SC4 EMC for Emerging Wireless Technologies, will outline the challenges facing the existing 4th Generation (4G), the emerging 4G LTE Advanced, and the 5G wireless technologies. Updates will be provided on the recent developments in test and measurements and standardization activities.

Presentations

1) An Overview of Coexistence Problem from Emerging Wireless Technologies

Bill Young, Jason Coder, John Ladbury, and Galen Koepke, National Institute of Standards and Technology (NIST), Boulder, CO, USA

2) Living with a Complex Electromagnetic Environment

Harry Skinner, Intel, Hillsboro, OR, USA

3) RF Desensitization in Wireless Devices Jun Fan, Missouri University of Science and Technology, Rolla, MO, USA

4) Updates on Development of Test and Measurement Techniques for Emerging Wireless Technologies

Kefeng Liu, General Test Systems Inc., Shenzhen, China

MO-AM-4

APPLICATION OF REVERB CHAMBERSFormat: Half-day TutorialGrand Ballroom D

Chair: Vignesh Rajamani, Oklahoma State University, Stillwater, OK, USA

Abstract

This tutorial will provide an introduction to recent applications of reverberation chambers. It is intended to provide EMC engineers who are interested in applying reverberation chambers to various measurement issues and the extension of reverberation chambers to solve a variety of EMC problems.

This half-day tutorial provides a brief overview of Reverb Chamber (RC) theory, followed by recent applications of RCs. The tutorial material will be updated to reflect recent research results and



4) Lightning Observations at Wind Farms in Japan

Takatoshi Shindo Central Research Institute of Electric Power Industry (CRIEPI), Nagasaka, Japan

5) Lightning Protection of Wind Turbine Blades Søren Madsen, Global Lightning Protection Services A/S, Hedehusene, Denmark

6) Grounding of Wind Turbines Kazuo Yamamoto, Chubu University, Aichi, Japan

MONDAY AFTERNOON 1:30 PM - 5:30 PM

MO-PM-1

FUNDAMENTALS OF EMC & SIGNAL INTEGRITY (CONTINUED) Sponsored by ESACFormat: Full-day TutorialGrand Ballroom A

Chair: Mark Steffka, University of Michigan – Dearborn, Dearborn, MI, USA

Abstract

This tutorial is an introduction and overview of many of the major topics that need to be considered when designing a component or system for EMC and to minimize potential SI/PI issues. The tutorial will present the foundational physics and provide an overview of the significance and relevant mathematics that need to be understood to successful evaluate, diagnose, and solve both EMC and SI/PI issues. After the “background” material on causes of emissions is covered, specific examples of the application of the theory will be discussed by dedicated sessions on grounding, shielding, printed circuit board (PCB) design, as well as important considerations in designing for SI/PI, and the tutorial will conclude with an overview of typical EMC test equipment.

MO-AM-5

LIGHTNING PROTECTION OF WIND TURBINES Sponsored by TC-5Format: Half-day TutorialGrand Ballroom E

Co-chair: Marcos Rubinstein, Institute of Information and Communication Technologies, Yverdon-les-bains, SwitzerlandCo-chair: Farhad Rachidi, Swiss Federal Institute of Technology in Lausanne (EPFL), Lausanne, Switzerland

Abstract

Lightning protection and modeling of modern wind turbines exhibit a number of new challenges due to the large size of the blades, the use of carbon-reinforced plastics (CRP) in them, the current reflections at the top, the bottom and at different junctions along the structure, and the growing number of new installations worldwide. In addition, risk assessment estimates are based essentially on downward flashes, even though upward lightning represents a considerable fraction of the flashes to wind turbines. This workshop presents the current knowledge and challenges related to lightning protection of modern wind turbines.

Planned Topics and Speakers

1) Cloud-to-Ground Lightning and Wind Turbines Farhad Rachidi, Swiss Federal Institute of Technology in Lausanne (EPFL), Lausanne, Switzerland and Marcos Rubinstein, Institute of Information and Communication Technologies, Yverdon-les-bains, Switzerland

2) Challenges of Lightning Protection of Modern Wind Turbines

Marcos Rubinstein, Institute of Information and Communication Technologies, Yverdon-les-bains, Switzerland and Farhad Rachidi, Swiss Federal Institute of Technology in Lausanne (EPFL), Lausanne, Switzerland

3) Lightning Damages to Wind Turbines Joan Montanya, Technological University of Catalonia, Barcelona, Spain


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Topics to be presented

5) Basic EMC Test EquipmentKenneth Wyatt, Wyatt Technical Services LLC, Woodland Park, CO, USA

Topics to be covered: Overview and examples of the major types of EMC test and support equipment, associated hardware, and their use in typical test set-ups. Specific items to be covered include spectrum analyzers, EMC receivers, Line Impedance Stabilization Networks (LISNs), antennas (monopole, loop, bi-conical, log-periodic), test chambers, and cables.

6) -Power Integrity Concepts for High-Speed Design - Multi-Layer PDBs

James Drewniak, Missouri University of Science and Technology, Rolla, MO, USA

Topics to be covered: Description of why PI is important, its potential causes and effects upon component/system operation. Discussion of typical corrective actions in the design stage to minimize the development of PI issues and possible mitigation strategies that can be used during system development.

7) PCB Effects for Power Integrity Bruce Archambeault, Archambeault EMI/EMC Enterprises, Four Oaks, NC, USA

Topics to be covered: A brief introduction to the main concepts behind good SI/PI design of PCBs, decoupling for EMI and SI, methods to improve the design of PCBs; typical pitfalls.

MO-PM-2

TESTING OF WIRELESS DEVICES IN THE MODERN WORLD Format: Half-day Tutorial Grand Ballroom B

Co-chair: Janet O’Neil, ETS-Lindgren, Cedar Park, TX, USACo-chair: Jari Vikstedt, ETS-Lindgren, Cedar Park, TX, USA

Abstract

With the continuous development of wireless technologies and their tight integration with various electronic/

computer/communication devices, EMC issues, at both the system and the intra-system levels, become increasingly important. This tutorial will provide an overview and primer on testing wireless devices, the biggest challenges the test labs face with testing wireless devices and their techniques for addressing those challenges. Planned topics include interference from digital to wireless, noise mitigation (EMC design) through system planning and wireless performance testing methodologies. Planned speakers include experts active in the ETSI, CTIA and ANSI ASC C63® standards committees on wireless devices, test engineers and managers from Silicon Valley based EMC and wireless commercial test labs, as well as experts from other wireless “hot bed” areas including Portland, San Diego and Seattle.

Planned Presenters and Topics

1) Practical Considerations for RFI/EMC Testing of Modern Electronics Equipment

Fermin A. Romero Jr., Cetecom, Milpitas, CA, USA

2) Wireless Coexistence Design for Optimal Performance

Harry Skinner, Intel, Hillsboro, OR, USA

3) Understanding Radiated Spurious Emissions (RSE) Testing

Garth D’Abreu and Jack McFadden, ETS-Lindgren, Cedar Park, CA, USA

4) FCC and Industry Canada UpdatesMark Briggs, UL, Fremont, CA, USA

5) ETSI 300 328 V1.8.2, ETSI 301 893 V1.7.2, Burst Power Sensors and Software Demonstration

Jack McFadden, ETS-Lindgren, Cedar Park, TX, USA

6) Radiated Performance Assessment of Wireless Communications Devices - An Operator’s Perspective

Scott Prather, AT&T, Redmond, WA, USA

ABOUT SANTA CLARA



5) Acquiring Test Equipment & Developing a Low-Cost EMC Troubleshooting Kit

Patrick André, André Consulting Inc., Seattle, WA, USA and Kenneth Wyatt, Wyatt Technical Services LLC, Woodland Park, CO, USA

6) Panel DiscussionAll Presenters

MO-PM-4

SMART GRID EMC UPDATE Format: Half-day TutorialGrand Ballroom D

Chair: Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USA

Abstract

Smart Grid continues to be a hot topic worldwide. This tutorial will review the latest EMC activities of key organizations and meetings on the topic. The focus will be on the EMC implications including what are being accepted and what are not. It will discuss what EMC compatibility level is desirable for all grid connected devices, especially those that are part of the communication channel passing power usage data and use in both directions. The tutorial also brings two speakers who reside on West Coast US to interact with an expected West Coast attendance. Finally, the tutorial will place in perspective the EMC status and the work still needed to be done to make it an integral part of the Smart Grid roll out.

MO-PM-3

EMC CONSULTANT’S TOOLKITFormat: Half-day TutorialGrand Ballroom C

Chair: Jerry Meyerhoff, JDM Labs LLC, Buffalo Grove, IL, USA

Abstract

As more engineering and design firms outsource and reduce staff, more qualified EMC engineers are finding themselves “homeless”. As well, there are hundreds of companies that do not have the resources to hire a full-time EMC engineer. The purpose of this workshop is to provide an introduction to the technical, business and marketing skills to interested EMC engineers so that they can successfully locate, market and provide effective services to these companies at a fair profit and with job satisfaction.Presentations

1) Marketing YourselfJerry Meyerhoff, JDM LABS LLC, Buffalo Grove, IL, USA

2) Presenting Yourself ProfessionallyPatrick André, André Consulting Inc., Seattle, WA, USA

3) Win-Win Methods for Quoting EMC Consultancy

Keith Armstrong, Cherry Clough Consultants Ltd., Stafford, United Kingdom

4) Networking, Branding & Providing Customer Value

Kenneth Wyatt, Wyatt Technical Services LLC, Woodland Park, CO, USA

Levi’s® Stadium is home to the San Francisco 49ers, and also serves as one of the world’s best outdoor sports and entertainment venues. The new stadium in Santa Clara is the next generation of stadium design. One of the most unique features of the facility is the green roof atop the suite tower on the west side of the stadium. The three solar bridges, connecting the main parking area to the stadium, include hundreds of solar panels. Levi’s Stadium will host Super Bowl 50 on February 7, 2016.


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Presentations

1) Introduction to Smart Grid Interoperability Panel (SGIP) 2.0 Activities

Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USA

2) SGIP Electromagnetic Interoperability Issues (EMII) Working Group the NIST Smart Grid Framework 3.0

William Young and Galen Koepke, National Institute of Standards and Technology (NIST), Boulder, CO, USA

3) EMC Testing of Intelligent Electronic Devices for Substation and Distribution

Jerry Ramie, ARC Technical Resources, Inc., San Jose, CA, USA

4) Immunity for Power Station and Substation Environments

Bill Radasky, Metatech, Goleta, CA, USA

5) International Standards View of Smart Grid EMC

Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USA

MO-PM-5

INTENTIONAL ELECTROMAGNETIC INTERFERENCE (IEMI) UPDATESponsored by TC-5Format: Half-day TutorialGrand Ballroom E

Chair: Frank Sabath, Bundeswehr Research Institute for Protective Technologies and NBC-Protection (WIS), Munster, Germany

Abstract

The objective of this tutorial is to inform members of the IEEE EMC community of the threat of Intentional Electromagnetic Interference (IEMI) and methods which can be employed to analyse the IEMI Risk, protect IT-Systems and validate IEMI immunity. The tutorial starts with a brief discussion of the IEMI threat and reported IEMI attacks and similar incidents. The following presentations include an update on standardization activities and the presentation of methods for the systematic analysis of the IEMI Risk. The tutorial closes with detailed discussion of the IEEE

Std 1642 on recommended practice for protection and a discussion of IEMI immunity test and verification methods.

Presentations

1) Description of the IEMI Threat William A. Radasky, Metatech, Goleta, CA, USA

2) What can be Learned from Documented Intentional Electromagnetic Interference (IEMI) Attacks?

Frank Sabath, Bundeswehr Research Institute for Protective Technologies and NBC-Protection (WIS), Munster, Germany

3) Review of IEMI Standardization William A. Radasky, Metatech, Goleta, CA, USA

4) IEMI Risk Analysis at the System LevelFrank Sabath, Bundeswehr Research Institute for Protective Technologies and NBC-Protection (WIS), Munster, Germany

5) IEEE 1642 Recommended Practice for Protecting Public Accessible Computer Systems from Intentional EMI

William A. Radasky, Metatech, Goleta, CA, USA

6) IEMI Immunity Test and Verification MethodsMatthias Kreitlow, Bundeswehr Research Institute for Protective Technologies and NBC-Protection (WIS), Munster, Germany

WEDNESDAY AFTERNOON1:30 PM - 5:30 PM

WED-PM-1

TIME DOMAIN EMISSION MEASUREMENTS AND MODELINGFormat: Half-day TutorialGrand Ballroom A

Co-chair: Janet O’Neil, ETS-Lindgren, Cedar Park, TX, USACo-chair: Zhong Chen, ETS-Lindgren, Cedar Park, TX, USA



Abstract

Test equipment that uses time domain techniques for measuring electromagnetic emissions and presents the data in frequency domain terms for compliance with CISPR and FCC standards has emerged onto the market with remarkable popularity in recent years. Such equipment has great potential to improve measurement efficiency, thereby reducing test time. Accuracy of test results must not be sacrificed for efficiency, however. All indications are that accuracy is maintained. The time domain emission measurements method in EMC and site validations will be discussed.

Numerical modeling is increasingly used in design to identify potential EMC issues. Time-domain techniques are ideal for simulating transient susceptibility effects such as ESD and broadband radiated emissions. We will demonstrate how time domain numerical modeling can also be used to model site validations above 1 GHz. Wave propagation will be visualized to identify and isolate reflections and verify how time domain data processing in real measurements can achieve the same effects. Practical considerations in measurements will be discussed and validation will be shown through numerical simulations.

Planned speakers include an expert in EMC software as well as an expert in time domain measurements who is chair of ANSI ASC C63® Subcommittee 1 “Techniques and Development” and also a member of the working group developing the new draft standard on time domain measurements.

Planned Presenters and Topics

1) Time Domain Emission Measurements and Modeling

David P. Johns, CST of America Inc, Framingham, MA, USA

2) Time Domain sVSWR Measurements and Model Verification


3) Understanding Time Domain / Frequency Domain Transformation and Data Processing

Bob Johnk, Institute for Telecommunication Sciences (NTIA/ITS), Boulder, CO, USA

4) Update on Latest Work for Draft ANSI C63.25 Standard: Validation Method for EMC Radiated Emission Test Sites


WED-PM-2

CAPTURING PULSED/INTERMITTENT SIGNALS WITH FREQUENCY SWEPT, FREQUENCY STEPPED, AND TIME DOMAIN SCAN METHODOLOGIESFormat: Half-day TutorialGrand Ballroom B

Chair: Faride Akretch, Rohde & Schwarz USA Inc., Kildeer, IL, USA

Abstract

Pulsed and/or intermittent signals are difficult to detect and even more difficult to properly characterize the amplitude across frequencies. The ability to properly capture and characterize these intermittent signals is an important capability to the EMC engineer. There are several methods to perform the task and each has its own strengths and weaknesses. Thorough understanding of the method of measurement is necessary. During this technical session, we will compare three methodologies, namely Frequency Swept, Frequency Stepped and Time Domain Scan. We will demonstrate the details of each for a pulsed signal stimulus and provide insight for best measurement techniques for each method

Presentations

1) Frequency Swept Scan MethodologyBill Wangard and Darren McCarthy, Rohde & Schwarz USA, Inc., Kildeer, IL, USA)

This first section focuses on the anatomy of a pulsed signal from a time/frequency correspondence and on understanding how time domain characteristics affect the frequency domain content. We will explore the architecture employed by traditional spectrum analyzers to measure the spectrum by continuously sweeping across frequency. Demonstrations will point out the effects that sweeping through the spectrum has on characterization of pulse/intermittent signals.

2) Frequency Stepped and Time Domain Scan Methodology

Bill Wangard and Darren McCarthy, Rohde & Schwarz USA, Inc, Kildeer, IL, USA)


WED-PM-4

INTEGRATED ESD DEVICE AND BOARD LEVEL DESIGN Sponsored by: ESD AssociationFormat: Half-day TutorialGrand Ballroom D

Chair: Gianluca Boselli, ESD Association, Rome, NY, USA

Abstract

Efficient ESD design for system level ESD can only be achieved if board and device level protection circuitry coincide. The purpose of this tutorial is to develop an understanding of board/IC interaction under IEC 61000-4-2 testing conditions and to discuss useful design strategies supported by appropriate tools. This is meant to be beneficial both for ESD engineers of ICs and board designers responsible for EMC/ESD compliant design of the system.

While it has clearly been pointed out that even elevated IC level HBM targets are insufficient for achieving the required IEC 61000-4-2 ESD level, more awareness has to be developed for the detailed turn-on and clamping behavior of IC level and board level ESD protection components. High current characterization of board protection and IO circuit by TLP is a first step. This enables the board designer to assess the behavior of IC pins and select appropriate board protection elements. The design optimization should be based on high current models of board components and IC IOs and the numerical simulation of the protection network under ESD conditions. Finally, various test methods are available to evaluate the efficiency of implemented protection on board level quantitatively.

Planned Presentations

1) The Effect of Humidity on ESD Occurrence and Severity in Data Centers

David Pommerenke, Missouri University of Science and Technology, Rolla, MO, USA

2) Integrated ESD Device and Board Level Design: Part 1

Harald Gossner1 and David Johnson2, (1) Intel Mobile Communication GmbH, Neubiberg, Germany, (2) Intel, Portland, OR, USA

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In this section we will focus on the architectural differences going from a frequency swept method to a frequency stepped method and the corresponding considerations of spectrum characterization. Provide a background of FFT methodology, commonly referred to as Time Domain Scan, and the important parameters in the FFT algorithms to the EMC community. Demonstration in this section will make clear the differences between time domain scan and frequency swept/stepped on spectrum characterization of pulsed/intermittent signals

WED-PM-3

WORKING EMC ENGINEER SKILLSSponsored by TC-1Format: Half-day TutorialGrand Ballroom C

Chair: Kimball Williams, IEEE Southeastern Michigan Section, Dearborn, MI, USA

Abstract

Explore some of the more critical aspects of working as an EMC engineer that are of a non-technical nature. These skills are not taught in any engineering curricula but, can be critical to building a successful engineering career.

Presentations

1) Introduction to LeadershipElya Joffe, Tel Aviv, Israel and Kimball Williams, IEEE Southeastern Michigan Section, Dearborn, MI, USA

2) Code of EthicsDave Staggs, Austin, TX, USA

3) EMC for Business ManagersJoanna Hill, Hazel Park, MI, USA

4) How to Give Effective Presentations,Bruce Archambeault, Archambeault EMI/EMC Enterprises, Four Oaks, NC, USA



3) Integrated ESD Device and Board Level Design: Part 2

David Pommerenke, Missouri University of Science and Technology, Rolla, MO, USA

FRIDAY MORNING8:30 AM - NOON

FRI-AM-1

INTRODUCTION TO MEDICAL EMC Format: Half-day TutorialGrand Ballroom A

Chair: Darryl Ray, Darryl Ray EMC Consulting, Carlsbad, CA, USA

Abstract

EMC compliance of medical devices is regulated differently from that of other types of equipment, for reasons of patient and operator safety. Medical devices have unique requirements such as very low leakage current requirements (that preclude some of the usual EM mitigation design techniques) and immunity requirements that are very stringent.

The primary standard for medical EMC compliance is IEC/EN 60601-1-2. That standard has been recently revised and it will have a significant impact on the medical device industry. In addition, the IEC and EN standards now have requirements to manage safety risks that could foreseeably be caused by errors, malfunctions and faults caused by EM disturbances. Medical devices are required to comply with an EMC

risk management standard, a requirement that is not well understood at present but may become the norm for safety-related and safety-critical equipment of all types.

Medical devices have benefited from the explosion of new wireless technologies. Convergent technologies have emerged where medical devices that historically did not contain radio transceivers, now commonly have multiple radio modules. The desire for greater patient mobility dictate “cable replacement” strategies such as Bluetooth® and WiFi® on many medical devices. In addition, remote patient monitoring is highly desired to maintain sterile surgical environments or to collect telemetry data on patients outside the hospital. The wireless presentation discusses some important trends in medical wireless technologies as well as key strategies that product developers can use to successfully address the EMC regulatory requirements for their wireless medical devices.

For many medical devices, obtaining regulatory approval can be a very involved process. The FDA will share their thoughts and experiences on this issue.

Presentations

1) Introduction to Medical EMC Darryl Ray, Darryl Ray EMC Consulting, Carlsbad, CA, USA

2) Risk Management and IEC 60601-1-2

Keith Armstrong, Cherry Clough Consultants Ltd., Stafford, United Kingdom

3) Testing for Wireless Medical DevicesGreg Kiemel, Northwest EMC, Hillsboro, OR, USA

4) An FDA Perspective on EMC of Medical DevicesJeff Silberberg, US Food & Drug Administration, Silver Springs, MD, USA

Known at one time as the Valley of Heart’s Delight, Santa Clara Valley once overflowed with abundant agricultural riches. Today Santa Clara Valley is known as Silicon Valley, and is the birthplace of the high technology revolution, with a population of nearly 1.7 million within its 1,312 square miles.

ABOUT SANTA CLARA


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FRI-AM-2

BASIC EMC MEASUREMENTS Sponsored by TC-2Format: Half-day TutorialGrand Ballroom B

Chair: Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USA

Abstract

This tutorial will provide information on aspects beyond the test procedure needed in performing EMC tests by competent test labs. Included will be a discussion on the application of measurement uncertainty, measurement instrumentation and its calibration, and what constitutes an acceptable test laboratory. The latest activity in international standards related to EMC immunity measurements and application will also be presented as time allows. Where appropriate, attendees will be asked questions as to what they learned and have an opportunity for extended questioning of the speakers’ subjects at the end of the session.

Presentations

1) Measurement Instrumentation and CalibrationWerner Schaefer, Schaefer Associates, Novato, CA, USA

2) C64 C63.23, Guide for Electromagnetic Compatibility - Calculations and Application of Measurement Uncertainty

Bob DeLisi, Underwriters Lab (UL), Melville, NY, USA

3) EMCS Standards Update and Introduction to the International Electrotechnical Commission (IEC) Standardization Process

Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USA and Alistair Duffy, De Montfort University, Leicester, United Kingdom

4) Selecting a Quality EMC LabDan Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN, USA

FRI-AM-3

NANOTECHNOLOGY AND ADVANCED MATERIALS APPLIED TO EMC Sponsored by TC-11Format: Half-day TutorialGrand Ballroom C

Chair: Emmanuel Decrossas, Jet Propulsion Laboratory, Pasadena, CA, USA

Abstract

Nanotechnology is the engineering of functional systems at the molecular and atomic scale and represents a technological revolution that is shaking scientific academia, industries and almost all areas of society. Nanotechnology has the potential to develop many novel materials and devices with a vast range of applications. Over the last ten years several studies have been focused on carbon nanotubes, graphene nanoribbons, nanostructured multifunctional materials and single/ multi-phase composites filled with nanoparticles. The outstanding performance and capabilities of these novel materials have demonstrated a great impact in different EMC applications: signal integrity of electrical nano-interconnects and nano-vias for high speed electronics, multifunctional electromagnetic shields, lightweight and high performance radar absorbing materials, just to mention some examples.

The workshop is intended to introduce EMC engineers and researchers to nanoscience and nanotechnology showing how fundamental EMC topics (like measurements, transmission line, shielding and protection) should be “revisited” at nanoscale. It will present new materials, devices and processes for EMC applications, with particular attention to theoretical modelling approaches, simulation methods and experimental characterization techniques. The Tutorial will provide participants with opportunities for professional development and the chance to gain a better understanding of nanotechnology and its implications in EMC issues. The Tutorial will contribute to the development of a debate on the state-of-art as well as on future research possibilities.



Presentations

1) Application of Hexagonal Ferrites in EMC Marina Koledintseva, Oracle, Menlo Park, CA, USA

2) Applications of Carbon Nanotubes for RF and Microwave Interconnects

Michael C. Hamilton and Pingye Xu, Auburn University, Auburn, AL, USA

3) Electrical Response of Spin-Orbit Interaction on a Metasurface

Xingjie Ni, Berkeley University, CA, USA

4) Conductive Composites in the Space Environment – Material Testing Using Energetic Electrons at the Jet Propulsion Laboratory

Nelson W. Green, Wousik Kim, Pablo Narvaez, and Matthew Stumbo, Jet Propulsion Laboratory, Pasadena, CA, USA

5) Metamaterial EBG Structures for EMC Gigahertz Filtering

Miroslav Pajovic, Independent Consultant in Antennas and EMC, Sunnyvale, CA, USA

FRI-AM-4

NEW OPPORTUNITIES AND CHALLENGES FOR VALIDATION OF COMPUTATIONAL ELECTROMAGNETICS STANDARDIZATION – THE REVIEW OF IEEE STD 1597.1Sponsored by TC-9Format: Half-day TutorialGrand Ballroom D

Chair: Alistair Duffy, De Montfort University, Leicester, United Kingdom

Abstract

IEEE Std 1597.1 (Validation of computational electromagnetics computer modelling and simulation) was a first-of-its-kind standard when it was published in 2008. Since then it has gained widespread use: it is difficult to find a copy of the IEEE Transactions on Electromagnetic Compatibility without finding references to this standard (or to the FSV technique that is embedded in the standard). The standard is as

much about a process for managing the validation activity as it is about the specific techniques used to quantify any comparison. As a result, this first round of revision for the standard is looking for input about the how, why, where and when of validation of CEM as well as where the process and techniques used in the standard could be more widely applied. This workshop will encourage wider participation in the standards development process from the EMC Community by setting the scene with a number of presentations and then open the floor in a panel discussion format.

The key objective for this workshop is to encourage wide participation in the standards development process. This will both provide useful input for this standard as well as provide a means of informing the EMC community about the standards development process in the IEEE more generally.

The intended audience is attendees at the symposium who have an interest in computational electromagnetics, which is a significant proportion of EMC symposia attendees. The potential expansion of the application of the techniques used in the standard beyond computational electromagnetics to measurement comparison in a more general sense also makes the workshop of interest to Symposium attendees whose primary interest is measurement.

Presentations

1) New Opportunities and Challenges for Validation of Computational Electromagnetics Standardization - the Review of IEEE Std 1597.1

Alistair P. Duffy, De Montfort University, Leicester, United Kingdom

2) Lessons Learned Using Feature Selective Validation Technique

Bruce Archambeault, Archambeault EMI/EMC Enterprises, Four Oaks, NC, USA

3) Challenges In the Validation of Radio Propagation Measurements

Bob Johnk, Institute for Telecommunication Sciences, Boulder, CO, USA

4) Recent Developments in FSV and Difficulties to be Overcome

Alistair P. Duffy, De Montfort University, Leicester, United Kingdom

5) Panel DiscussionMembers of the working group



FRI-AM-5

CONFORMITY ASSESSMENT TOPICS FOR EMC LABORATORIESSponsored by: TC-1Format: Half-day TutorialGrand Ballroom E

Chair: Daniel D. Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN, USA

Abstract

Conformity assessment enables buyers, sellers, consumers, and regulators to have confidence that products sourced in global market meet specific requirements. It is the demonstration that specified requirements relating to a product, process, system, person or body are fulfilled. Mutual Recognition Agreements (or arrangements) (MRAs) are government-to-government trade facilitating measures aimed at a global approach to conformity assessment. Standards are interwoven into all aspects of these activities and can have a major impact on the outcome of a conformity assessment program. Conformity assessment activities form a vital link between standards (which define necessary characteristics or requirements) and the products themselves. This session is intended to provide an overview of the U.S. participation in telecom mutual recognition agreements, and to explore the conformity assessment system that underpin the agreements. Additionally, the newest information on the changes occurring in the EU with regards to the EMC and the Radio equipment Directives will be offered, along with an introduction into the new designation process being developed, which will include a formal assessment of the notified bodies.

Presentations

8:30 AM - 9:00 AM

U.S. Participation in Telecom Mutual Recognition Agreements (MRAs)

Ramona Saar, National Institute of Standards and Technology (NIST), Gaithersburg, MD, USA

• Top-level discussion of MRAs including Europe, Asia, South America and others. From a Conformity Assessment perspective. Includes brief outline of A2LA, ANSI, Lab ABs and FCC Roles.

• EU upcoming changes to the US Notified Body Designation Process

9:00 AM - 9:30 AM

Accreditation of EMC Laboratories (ISO/IEC 17025)

Brad Moore and Bethany Hackett, National Voluntary Laboratory Accreditation Program (NVLAP), Gaithersburg, MD, USA

• Brief outline of 17025 – key areas• MRA requirements perspective. Issues with MRAs such as 10-meter measurements and other technical/administrative issue.

9:30 AM - 10:00 AM

Accreditation of Product Certification Bodies to ISO/IEC 17065:2012

Adam Gouker, American Association for Laboratory Accreditation (A2LA), Frederick, MD, USA

• Brief Outline of 17065 – key areas• MRA requirements perspective. FCC, Canada, Singapore, and other countries. Program requirements for other countries.

10:00 AM - 10:30 AM

BREAK

10:30 AM - 11:20 AM

American Certification Body (ACB), EMC Directive, Radio Equipment Directive

Michael Derby, American Certification Body-Europe (ACB), Inc., Winchester, United Kingdom

• A detailed review of the technical changes in the 2014 EMC Directive and the 2014 RED.

11:20 AM - 11:50 AM

What to Expect During a Notified Body Assessment

Daniel Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN, USA

• A review of the RED checklist. Highlighting key points in the RED checklist.• A brief review of the EMC Criteria

11:50 AM - Noon

Panel Discussion



FRIDAY AFTERNOON1:30 PM - 5:30 PM

FRI-PM-1

DEBUGGING EMI TEST FAILURES Sponsored by TC-4Format: Half-day TutorialGrand Ballroom A

Chair: Ross Carlton, National Instruments, Austin, TX, USA

Abstract

This workshop will explore the challenging area of troubleshooting failures encountered during EMC testing. The objective of this workshop is to provide the EMC practitioner with insight into an area of EMC that is often neglected at the Symposium. The workshop will begin with a discussion of the challenges in managing and leading troubleshooting efforts. The following presentations will focus on the specific test categories that are most likely to result in a failure: radiated RF emissions, conducted RF emissions, radiated/conducted RF immunity, conducted transient immunity, and Electrostatic Discharge (ESD). For each test category, the presenter will discuss typical failure modes and their causes, troubleshooting at your workstation, troubleshooting at the test lab, typical fixes, and other insights, tips, tricks and tools. The format of the workshop will incorporate Q&A sessions for each category to provide an opportunity for attendees to both ask questions as well as contribute the result of their own troubleshooting experience.

The presenters for this workshop each have over 25 years of practical experience in EMC design, test and troubleshooting. Attendees from novices to test veterans will benefit from their many successes and failures by attending this workshop.

Presentations

1) Leading and Managing EMI TroubleshootingJohn Kraemer, Rockwell Collins, Cedar Rapids, IA, USA

2) Troubleshooting Radiated Immunity Issues Kenneth Wyatt, Wyatt Technical Services LLC, Woodland Park, CO, USA

3) Troubleshooting Voltage Transients and Conducted Immunity

Patrick Andre, Andre Consulting Inc., Seattle, WA, USA

4) Troubleshooting Radiated and Conducted Emissions (Simplified)

Mark Montrose, Montrose Compliance Services, Inc., Santa Clara, CA, USA

5) Troubleshooting ESD Immunity Issues Ross Carlton, National Instruments, Austin, TX, USA

FRI-PM-2

FIELD SOURCES AND THEIR APPLICATION IN COMPUTATIONAL EMC Sponsored by TC-9Format: Half-day TutorialGrand Ballroom B

Chair: David P. Johns, CST of America Inc., Framingham, MA, USA

Abstract

This workshop will discuss the use of measured and simulated fields as field sources in computational electromagnetics models. Field sources can be used to replace the geometry of detailed sources thereby reducing complexity in EM models. The workshop will give examples of using field sources to represent antennas and applying the sources in numerical models to assess installed antenna performance and co-site EMI on various platforms. The workshop will also discuss the use of PCB near field scans as field sources for radiated emissions analysis.

The workshop will gives examples of using measured antenna and PCB fields as sources in numerical models. Examples of a multi-scale approach to modeling through the use of field sources will also be given. Validation cases will be provided and the benefits and limitations of field sources highlighted.

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critical systems, especially (for example) in road/air transportation, portable medical devices, mobile life-support equipment, etc.

The new approach described in this workshop is the first practical alternative to the ‘big grey box’ approach, and adds less size and weight.

Presentations

1. EMC Risk ManagementJeffrey Silberberg, US Food & Drug Administration, Silver Spring, MD, USA

2. Introduction to Risk ManagementJeffrey Silberberg, US Food & Drug Administration, Silver Spring, MD, USA

FRI-PM-4

CROSSTALK – THEORY, MODELING, CHARACTERIZATION, AND DESIGN OPTIMIZATION Sponsored by TC-9 & 10Format: Half-day TutorialGrand Ballroom D

Co-chair: Xiaoning Ye, Intel Corporation, Hillsboro, OR, USACo-chair: Kai Xiao, Intel Corporation, Hillsboro, OR, USA

Abstract

Crosstalk is a major concern in the computer system designs that support various interfaces and speeds. As the serial I/O data rate is approaching 40 Gbps and beyond, and the single-ended memory busses (DDR) are also getting faster, it has become more and more critical to meet the signal integrity requirements and strike a balance between low cost design (form factors, routing density, etc.) and performance. This tutorial will cover fundamentals of crosstalk, modeling, simulation, characterization of crosstalk, and design techniques for crosstalk reduction and mitigation.

Presentations

1) Fundamentals of CrosstalkXiaoning Ye, Intel Corporation, Hillsboro, OR, USA

Presentations

1) An Introduction to the Field Equivalence Principle and Field Sources

David P. Johns, CST of America Inc., Framingham, MA, USA

2) Using Measured Fields as Field Sources in Computational EMC

Lars J. Foged, MVG, Pomezia, Italy

3) Multi-scale EMC Simulation Using Field Sources

Davide Talline, CST, Treviglio, ItalyDavid P. Johns, CST of America Inc., Framingham, MA, USA

4) Very Near Field Measurements as the Basis for Far-Field Computations

Ruska Patton, EMSCAN, Calgary, Canada

FRI-PM-3

EMC RISK MANAGEMENT WORKSHOP Format: Half-day TutorialGrand Ballroom C

Chair: Keith Armstrong, Cherry Clough Consultants Ltd., Stafford, United Kingdom

Abstract

Where safety risks can be increased by the effects of EMI on electronic equipment, EMC must be risk-managed for the full lifetime of the equipment/system/installation concerned, and so must take into account all foreseeable aging, wear, corrosion, faults and misuse. A consequence is that no affordable time/cost of EMC immunity testing, at any test levels, can provide the necessary design confidence required by the relevant safety standards.

Where the future EM environment is unknown (as it usually is), the traditional approach (e.g. as used by the military) is to use very rugged high-specification EM mitigation, designed to meet or exceed all possible environmental issues (shock, vibration, humidity, salt spray, temperature, EM disturbances, etc.).

However, this ‘big grey box’ approach can be too large, heavy or costly for many modern safety-

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talk, we will focus on the parameters in a vertical path that have large impact to crosstalk performance, including both single-ended and differential designs. The design parameters that will be covered in this talk include PCB stackup, via geometries, via pitch, pinout pattern, and ground via placement, etc.

4) Crosstalk Management Techniques in PCB Transmission Lines

Xiaoning Ye and Kai Xiao, Intel Corporation, Hillsboro, OR, USA

This is an advanced topic to the second topic. In this talk, we discuss the capacitive coupling and inductive coupling, the two dominant coupling mechanisms and their impact and interaction. We will then cover various techniques in controlling and reducing crosstalk in the transmission lines of a PCB. These design techniques are practical design optimization method that can be used to manage crosstalk in high-speed PCB board designs.

5) Inter-layer Crosstalk in Dual-stripline Design and Management Techniques

Kai Xiao, Intel Corporation, Hillsboro, OR, USA

Dual-stripline is gaining popularity in computer design because it provides high signaling density. A major concern of dual-stripline is the inter-layer crosstalk. In this talk, we will cover the mechanism and modeling of inter-layer crosstalk. We will also discuss the key parameters that affect the inter-layer crosstalk, and design techniques for crosstalk management.


In this talk, we will cover the fundamentals of crosstalk. First, a brief introduction will be given on the history and origin of the crosstalk, which dated back to the time when telegraph was invented. We will try to categorize crosstalk in different way, such as FEXT and NEXT, capacitive coupled crosstalk, inductive coupled crosstalk, etc. We will talk about the three key elements for coupling, aggressor, victim, and coupling path, including the key factors in these elements that determine the severity of crosstalk.

2) Crosstalk in Transmission Lines on a Printed Circuit Board


The transmission lines on a PCB, including both microstrip and stripline a major topic for signal integrity. In this talk, the transmission line theory will be reviewed, and the formulation of crosstalk between coupled transmission lines, both differential and single-ended, will be given. The difference in the stackup between microstrip and stripline will be compared, and the implication of the dielectric property on crosstalk will discussed. The advantage of differential design, especially its better immunity to crosstalk, is addressed.

3) Crosstalk in Vertical Path of High-Speed Differential Links


Vertical path, such as via, socket, etc, is a key contributor of crosstalk in a computer system. In this

In the late 1800’s, Armenians descended from the first founders of vineyards in Persia began settling in the San Joaquin Valley. The area now supplies raisins for nearly half the world, making it the largest producer anywhere. Today, of 204,191 acres of raisin grapes grown in California, 184,789 acres are Thompson Seedless (90%).

ABOUT CALIFORNIA


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IEEE Senior Member Elevation / IEEE Eta Kappa Nu

TUESDAY, MARCH 17, 2015

11:00 AM - NOON PM

IEEE SENIOR MEMBER ELEVATION EVENTRoom 201

Stacy Lehotzky of IEEE will give a presentation to explain the benefits of being a Senior Member. To be eligible for this special IEEE program you must:

• Be engineers, scientists, educators, technical executives, or originators in IEEE-designated fields;• Have experience reflecting professional maturity;• Have been in professional practice for at least ten years;• Show significant performance over a period of at least five of their years in professional practice.

The goal of this presentation is to explain the value of IEEE Senior Membership.

WEDNESDAY, MARCH 18, 2015

9:30 AM - 5:00 PM

IEEE SENIOR MEMBER APPLICATION WORKSHOPGrand Ballroom G

Need help filling out your applications to be a Senior Member of IEEE? Come to our workshop to prepare your application with our IEEE specialists. We will be completing the forms onsite at EMCSI 2015. The three required references will be provided on location by the local IEEE Section. You must bring your resume.

THURSDAY, MARCH 19, 2015

11:00 AM - NOON

IEEE-ETA KAPPU NU - ARE YOU AN EXCEPTIONAL STUDENT? Room 201

IEEE-Eta Kappa Nu (IEEE-HKN) is the student honor society of IEEE and is dedicated to encouraging and recognizing excellence in the IEEE-designated fields of interest.

Nancy M. Ostin C.A.E., Director of IEEE-Eta Kappa Nu will be giving a presentation at EMCSI 2015 to explain the benefits of this student program. All students are encouraged to learn more about this valuable IEEE opportunity. For questions, contact Nancy at (732) 465-6611 or [email protected].

photo credit: Jerry Ramie

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Best Student Paper Finalists

Conducted-Emission Modeling for a Switched-Mode Power Supply (SMPS)

Presented during TH-PM-1Wireless Testing and RF Interference Grand Ballroom A at 2:00 PM

Yansheng Wang1, Siqi Bai1, Xinyun Guo1, Shuai Jin1, Yaojiang Zhang1, Joakim Eriksson2, Lijuan Qu2, Jingyu Huang3, and Jun Fan1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Microsoft Mobile (China) Investment Co. Ltd., Beijing, China, (3) Microsoft Device Group, San Diego, CA, USA

Electrostatic Charging Caused by Standing up from a Chair and by Garment Removal

Presented during TU-AM-5Electromagnetic Environment and ESDGrand Ballroom E at 11:30 AM

Atieh Talebzadeh1, Mahdi Moradian1, Yunan Han1, David E. Swenson2, and David Pommerenke1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Affinity Static Control Consulting, L.L.C Round Rock, TX, USA

Radiation Physics from Two-Wire Transmission Lines

Presented as a Poster PaperWednesday, March 18Grand Ballroom A-D Foyer from Noon to 5:00 PM

Jing Li1, YaoJiang Zhang1, Dazhao Liu1, Alpesh Bhobe2, James Drewniak1, and Jun Fan1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Cisco Systems, Inc., San Jose, CA, USA

An Augmented Electric Field Integral Equation Formulation for Dielectrics and Conductors at Low Frequencies

Presented during WED-AM-5Applications of Numerical ModelingGrand Ballroom E at 9:30 AM


Near-field Coupling Estimation by Source Reconstruction and Huygens’s Equivalence Principle

Presented during TH-PM-1Wireless Testing and RF Interference Grand Ballroom A at 3:30 PM

Liang Li1, Jingnan Pan1, Chulsoon Hwang3, Gyuyeong Cho2, Harkbyeong Park2, Yaojiang Zhang1, and Jun Fan1, (1) Missouri Science and Technology, Rolla, MO, USA, (2) Samsung Electronics, Suwon, South Korea, (3) Samsung Electronics, Suwon GyengGi-Do, South Korea

Eliminating Non-Linear RSS Reporting Error in a Radiated RSS-Based TIS Testing Method

Presented during TH-PM-1 Wireless Testing and RF InterferenceGrand Ballroom A at 4:00 PM

Penghui Shen1, Yihong Qi2, Wei Yu2, Fuhai Li1, and Jun Fan3, (1) Hunan University, Changsha, China, (2) DBJ Technologies, Zhuhai, China, (3) Missouri University of Science and Technology, Rolla, MO, USA

2D Imaging System With Optical Tracking for EMI Source Localization

Presented during TU-PM-2 Electromagnetic Interference ControlGrand Ballroom B at 3:30 PM



BEST STUDENT PAPER AWARD FINALISTS

Technical Program

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TUESDAY MORNING 10:30 AM - 12:00 PM

TU-AM-1 EMC MANAGEMENT Grand Ballroom A Chair: Kimball Williams, Dearborn, MI, USA

10:30 AM China CCC Implementation Rules

Grace Lin, Crestron Electronics, Inc., Rockleigh, NJ, USA

11:00 AM A New Framework for the EU EMC Directive

Mark Maynard, SIEMIC, Inc., Milpitas, CA, USA

10:30 AM - 12:00 PM

TU-AM-2 PASSIVE COMPONENT MODELING AND MEASUREMENT Grand Ballroom B Chair: Jim Nadolny1 and Zhichao Zhang2, (1) Samtec, Inc., New Albany, IN, USA, (2) Intel Corp., Chandler, AZ, USA

10:30 AM Effects of Temperature and Humidity Variation on Electrical Performance of High Speed Data Cables*

Joseph Diepenbrock1, Patrick Casher1, Xin Wu1, Alan Benner2, and Sheng Xu3, (1) Lorom America, Morrisville, NC, USA, (2) IBM Corporation, Poughkeepsie, NY, USA, (3) Lorom Industrial Group, Hangzhou, China

11:00 AM Using Joint Time-Frequency Domain Analysis to Evaluate Absorber/Lossy Material Performance in Resonant Cavities*

Bruce Archambeault1, Michael Varner2, and Samuel Connor3, (1) Missouri University of Science and Technology, Four Oaks, NC, USA, (2) Rose Hulman Institute of Technology, Terre Haute, IN, USA, (3) IBM Corporation, Research Triangle Park, NC, USA

11:30 AM Suppression of Cavity Resonant Edge Effects and PDN Impedance using Absorbing Materials

Shaowu Huang1, Gary Charles1, Kai Xiao1, Beomtaek Lee2, Gong Ouyang1, and Hanqiao Zhang1, (1) Intel Corporation, DuPont, WA, USA, (2) Intel Corporation, Santa Clara, CA, USA

10:30 AM - 12:00 PM

TU-AM-3 JITTER/NOISE MODELING AND ANALYSIS Grand Ballroom C Chairs: Brice Achkir1 and Fangyi Rao2, (1) Cisco Systems, Inc., San Jose, CA, USA, (2) Agilent Technologies, Santa Clara, CA, USA

10:30 AM Reducing Power-Supply and Ground Noise Induced Timing Jitter in Short Pulse Generation Circuits

Jiwei Sun1, Hanqiao Zhang2, and Pingshan Wang1, (1) Clemson University, Clemson, SC, USA, (2) Intel Corporation, DuPont, WA, USA

11:00 AM BEST SIPI PAPER FINALISTOn-Chip Linear Voltage Regulator Module (VRM) Effect on Power Distribution Network (PDN) Noise and Jitter at High-Speed Output Buffer

Heegon Kim1, Sukjin Kim1, Changwook Yoon2, Jingook Kim3, Brice Achkir4, Joungho Kim1, and Jun Fan5, (1) Korean Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, (2) Altera Corporation, San Jose, CA, USA, (3) Ulsan National Institute of Science and Technology, Ulsan, South Korea, (4) Cisco Systems, Inc., San Jose, CA, USA, (5) Missouri University of Science and Technology, Rolla, MO, USA

Technical Sessions


* INDUSTRY PAPER ** STUDENT PAPER

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49

Technical Sessions

11:30 AM Analysis and Comparison of DDR3/DDR4 Clock Duty-Cycle-Distortion (DCD) for UDIMM and Discrete SDRAM Component Configurations*

GaWon Kim, June Feng, Marjan Mokhtaari, David Lieby, Janmejay Adhyaru, Raheel Shaikh, Balaji Natarajan, and Dan Oh, Altera Corporation, San Jose, CA, USA

10:30 AM - 12:00 PM

TU-AM-4 NUMERICAL MODELING AND SIMULATION TECHNIQUES I Grand Ballroom D Chair: Dan Jiao1, and Qinghua Bill Chen2, (1) Purdue University, West Lafayette, IN, USA, (2) Yangtze Delta Region Institute of Tsinghua University, Jiaxing, Zhejiang, China

10:30 AM Physical Interpretation of Radiation and Transfer Characterization Based on the PEEC Method**

Ying S. Cao1, Li Jun Jiang1, and Albert E. Ruehli2, (1) The University of Hong Kong, Hong Kong, Hong Kong, (2) Missouri University of Science and Technology, Rolla, MO, USA

11:00 AM Full-wave Simulation of an Imbalanced Differential Mircostrip Line with Conductor Surface Roughness

Marina Koledintseva1, Tracey Vincent2, and Sergiu Radu3, (1) Oracle, Menlo Park, CA, USA, (2) CST of America, Framingham, MA, USA, (3) Oracle, Menlo Park, CA, USA

11:30 AM BEST SIPI PAPER FINALISTQuality Assurance of S-parameters and Rational Function Models for Transient Simulations

Sanghoek Kim, Gerardo Romo Luevano, Kevin Roselle, and Tim Michalka, Qualcomm Inc., San Diego, CA, USA

10:30 AM - 12:00 PM

TU-AM-5 ELECTROMAGNETIC ENVIRONMENT AND ESD Grand Ballroom E Chair: William Radasky, Metatech Corporation, Goleta, CA, USA

10:30 AM BEST EMC PAPER FINALISTModal Expansion Basis for Statistical Estimation of Maximum Expected Field Strength in Enclosures

Paul Bremner, Robust Physics, Del Mar, CA, USA

11:00 AM Modeling Atmospheric Turbulence and Noise as Electromagnetic Interference

Robert McMillan1 and Ira Kohlberg2, (1) Retired US Army Civilian, St George Island, FL, USA, (2) Kohlberg Associates, Reston, VA, USA

11:30 AM BEST STUDENT PAPER FINALISTElectrostatic Charging Caused by Standing up from a Chair and by Garment Removal**

Atieh Talebzadeh1, Mahdi Moradian1, Yunan Han1, David E. Swenson2, and David Pommerenke1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Affinity Static Control Consulting, L.L.C Round Rock, TX, USA


ABOUT SANTA CLARA

At 3,486 ft, Mt. Umunhum is the fourth-highest peak in the Santa Cruz Mountains in California. The area covers 11,646-acres of the Santa Clara County.


50

Technical Sessions


3:30 PM Gb/s USB: RFI Risk Analysis and Test Methodologies

Pujitha Davuluri, Chung-Hao (Joseph) Chen, Kuan-Yu Chen, and Eric Gantner, Intel Corporation, Hillsboro, OR, USA

4:00 PM PC Client Platform RFI Risks and Mitigation Methodologies

Dongho Han, Hao-Han Hsu, Joseph Chen, Mike Schaffer, Chi M. Cheung, and Pujitha Davuluri, Intel, Hillsboro, OR, USA

TUESDAY AFTERNOON 1:30 PM - 5:30 PM

TU-PM-1 SPECIAL SESSION: RADIO-FREQUENCY INTERFERENCE AND WIRELESS EMC Grand Ballroom A Chairs: Harry Skinner1, David Pommerenke2, and Perry Wilson3, (1) Intel Corporation, Hillsboro, OR, USA, (2) Missouri University of Science and Technology, Rolla, MO, USA, (3) National Institute of Standards and Technology (NIST), Boulder, CO, USA

1:30 PM Measuring a Device’s Susceptibility to LTE: Preliminary Approaches

Jason Coder, John Ladbury, and William Young, National Institute of Standards and Technology (NIST), Boulder, CO, USA

2:00 PM A Review of Wireless Coexistence Test Methodologies

William Young1, Jason Coder1, and Luis Gonzalez2 (1) National Institute of Standards and Technology (NIST), Boulder, CO, USA, (2) University of Colorado, Boulder, CO, USA

2:30 PM Wearables/IOT Devices: Challenges and Solutions to Integration of Miniature Antennas in Close Proximity to the Human Body

Soji Sajuyigbe1 and Kevin J. Daniel2, (1) Intel Corporation, Santa Clara, CA, USA, (2) Intel Corporation, Hillsboro, OR, USA

3:00 PM BREAK

Ask the Experts

TUESDAY, MARCH 17 3:30-4:30 PM Rear of the Exhibit Hall

We will again hold the popular ‘Ask the Experts’ panel discussion.

Bring your questions concerning all aspect of EMC and SI/PI. Panelist will be from a wide range of EMC, SI and PI related disciplines and will provide answers to any/all questions from the audience. This is a unique opportunity to have so many experts in one place!

Panel Participants:• Bruce Archambeault (moderator)• Jun Fan• Mark Steffka• Dan Hoolihan• Don Heirman• Dale Becker• Brice Achkir

Please make it a point to attend!


Technical Program

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Technical Sessions


1:30 PM - 5:30 PM

TU-PM-3 HIGH SPEED LINK DESIGN IGrand Ballroom C Chairs: Joy Li1 and Chunfei Ye2, (1) Cadence Design Systems, San Jose, CA, USA, (2) Intel Co., DuPont, WA, USA

1:30 PM Design of Package BGA Pin-out for >25Gb/s High Speed SerDes Considering PCB Via Crosstalk

Wei Yao, Jane Lim, Ji Zhang, Kenneth Tseng, Kelvin Qiu, and Rick Brooks, Cisco Systems, Inc, San Jose, CA, USA

2:00 PM BEST SIPI PAPER FINALISTEffective Equalization of a High Speed Differential Channel with Re-driver - Screening and RSM DOE Method Applied to a Real System**

Maria Garcia1, Raul Enriquez2, and Jose A. Ramos2, (1) CINVESTAV Guadalajara, Zapopan, Mexico, (2) Intel Tecnologia de Mexico, Zapopan, Mexico

2:30 PM BEST SIPI PAPER FINALISTMethod for Accurate and Efficient Signaling Analysis of Nonlinear Circuits

Dan Jiao1 and Jianfang Zhu2, (1) Purdue University, West Lafayette, IN, USA, (2) Intel, Hillsboro, OR, USA

3:00 PMBREAK

3:30 PM DDR4 Address Bus Interconnect Optimization*

Syed Bokhari, Fidus Systems Inc., Ottawa, ON, Canada

4:00 PM Aggressive Dual Stripline Design for Single Ended Signaling*

Gong Ouyang and Kai Xiao, Intel Corp, Dupont, WA, USA

4:30 PM Signal Integrity Qualification and Optimization for High Speed Tester*

Tao Wang, Benjamin Harding, Brian Brecht, and Ray Mirkhani, Teradyne, Agoura Hills, CA, USA

1:30 PM - 5:30 PM

TU-PM-2 ELECTROMAGNETIC INTERFERENCE CONTROL Grand Ballroom B Chairs: John Kraemar1 and Ross Carlton2, (1) Rockwell Collins, Inc., Cedar Rapids, IA, USA, (2) National Instruments, Austin, TX, USA

1:30 PM Miniaturization Approach for EBG-Based Common Mode Filter and Interference Analysis

Carlo Olivieri1, Francesco de Paulis1, Antonio Orlandi1, Bruce Archambeault2,3, and Samuel Connor3, (1) University of L’Aquila, L’Aquila, Italy, (2) IBM Corporation, Research Triangle Park (RTP), NC, USA, (3) Archambeault EMI/EMC Enterprises, Four Oaks, NC, USA

2:00 PM A Study of EMI from Patterned Ground Structures

Albert Wallash and Jack Nguyen, HGST, a Western Digital Company, San Jose, CA, USA

2:30 PM A Comparison of Relative Shielding Provided by Stitching Vias and Edge Plating

Jim Chiappe, Juniper Networks, Sunnyvale, CA, USA

3:00 PM BREAK

3:30 PM BEST EMC PAPER FINALIST and BEST STUDENT PAPER FINALIST2D Imaging System With Optical Tracking for EMI Source Localization**


4:00 PM Frequency Selective Surfaces for EMI/Thermal Applications*

Paul Dixon1, Mohammad Ali Khorrami1, Yoeri Arien2, John Song3, and Keith Johnson4, (1) Laird, Randolph, MA, USA, (2) Laird, Geel, Belgium, (3) Laird, Schaumburg, IL, USA, (4) Laird, Cleveland, OH, USA


52

Technical Sessions


3:30 PM Optimization of MIM Cap Layout for Simultaneous Switching Noise Reduction*

Guang Chen and Dan Oh, Altera Corporation, San Jose, CA, USA

4:00 PM Signal and Power Integrity Challenges in Small Form Factor Mobile Devices*

Duo Chen and Fan Yu, Intel Corporation, Santa Clara, CA, USA

4:30 PM ISI and Crosstalk Challenges in FPGA Memory I/O Design*

Janani Chandrasekhar, Hui Liu, and Dan Oh, Altera Corporation, San Jose, CA, USA

WEDNESDAY MORNING8:30 AM - 10:00 AM

WED-AM-1 AUTOMOTIVE EMC MEASUREMENTS Grand Ballroom A Chair: Craig Fanning, Elite Electronic Engineering Inc., Downers Grove, IL, USA

8:30 AM On the Interplay Between the Engine Cooling Fan and Heat Exchanger for Automotive AM Band Radiated Emission Measurement

Cyrous Rostamzadeh1, Kimball Williams2, Dennis Schwaiger3, David Maciejewski4, and Mark Steffka5, (1) Bosch, Plymouth, MI, USA, (2) Retired, Dearborn, MI, USA, (3) Retired, Plymouth, MI, USA, (4) ASEE, Plymouth, MI, USA, (5) General Motors, Milford, MI, USA

5:00 PM BEST INDUSTRY PAPER FINALISTSystem Level Modeling of Supply Noise Induced Jitter for High Speed Clock Forwarding Interface*


1:30 PM - 5:30 PM

TU-PM-4 SI/PI/EMC CO-SIMULATION AND CO-DESIGN Grand Ballroom D Chairs: Olena Zhu and Duo Chen, Intel Corporation, Santa Clara, CA, USA

1:30 PM Signal Integrity and EMI Evaluations of An RFID- Sensor Tag for Internet-of-Things Applications**

Abdulhadi E. Abdulhadi1, Svetoslav Mandev2, and Ramesh Abhari2, (1) McGill University, Montreal, QC, Canada, (2) Santa Clara University, Santa Clara, CA, USA

2:00 PM Analytical PDN Voltage Ripple Calculation Using Simplified Equivalent Circuit Model of PCB PDN**

Biyao Zhao1, Chenxi Huang1,2, Ketan Shringarpure1, Jun Fan1, Bruce Archambeault1, Brice Achkir3, Samuel Connor4, Michael Cracraft5, Matteo Cocchini5, Albert Ruehli6, and James Drewniak1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Huazhong University of Science and Technology, Wuhan, China, (3) Cisco Systems, Inc., San Jose, CA, USA, (4) IBM Corporation, Research Triangle Park, NC, USA, (5) IBM Corporation, Poughkeepsie, NY, USA, (6) Missouri University of Science and Technology, Windham, NH, USA

2:30 PM BEST INDUSTRY PAPER FINALISTUsing Co-Design Techniques to Minimize IC Package Cost without Compromising Performance: Simulation and Measurement Validation*

Jie Chen, Robert DeMoor, Minhong Mi, and Rajen Murugan, Texas Instruments, Inc., Dallas, TX, USA

3:00 PM BREAK

Techn

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Technical Program

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Technical Sessions


Taiwan, (2) Intel Corporation, Portland, OR, USA

8:30 AM - 10:00 AM

WED-AM-3 JITTER/NOISE MODELING AND ANALYSIS II Grand Ballroom C Chairs: Zhiping Yang and Jihong Ren, Altera, San Jose, CA, USA

8:30 AM A Methodical Approach to DDR Clock Jitter Analysis*

Anita Ekren and Steve Stefek, Avago Technologies, Fort Collins, CO, USA

9:00 AM Duty Cycle Distortion Amplification in High Speed Data Channels*

Yan Duan1,2, Wenyi Jin2, and Jihong Ren2, (1) Iowa State University, Ames, IA, USA, (2) Altera Inc., San Jose, CA, USA

9:30 AM A Slope and Amplitude controllable Triangular-Current Generator for the Injection of a Broad-band PDN Noise*

Changwook Yoon1, Sukjin Kim2, Kiyeong Kim2, Heegon Kim2, Jingook Kim3, Joungho Kim2, and Jun Fan4, (1) Altera Corporation, San Jose, CA, USA, (2) Korean Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, (3) Ulsan National Institute of Science and Technology, Ulsan, South Korea, (4) Missouri University of Science and Technology, Rolla, MO, USA

9:00 AM Electromagnetic Susceptibility Testing on Vehicles – Effects of Testing in the Near-Field with Cavity Measurements on a Slotted Circular Cylinder*

Marsellas Waller1, Thomas Shumpert2, Robert Scharstein3, and Steve Wong4, (1) US Army Redstone Test Center, Redstone Arsenal, AL, USA, (2) Auburn University – Retired, Auburn, AL, USA, (3) University of Alabama, Tuscaloosa, AL, USA, (4) AFRL/RCM (Engility Corporation), Wright-Patterson AFB, OH, USA

9:30 AM Impact of Mismatch Loss on Mobile Phone Simulation for Automotive Testing

Keith Frazier1 and Peng Peng2, (1) Ford Motor Company, Dearborn, MI, USA, (2) Ford Motor Company (Asia Pacific and Africa), Nanjing, China

8:30 AM - 10:00 AM

WED-AM-2 PASSIVE COMPONENT MODELING AND MEASUREMENT II Grand Ballroom B Chair: Antonio Ciccomancini1 and Shaowei Deng2, (1) Apple Inc., Cupertino, CA, USA, (2) F5 Networks, San Jose, CA, USA

8:30 AM Comparison of TRL Calibration vs. 2x Thru De-embedding Methods

Se-Jung Moon1, Xiaoning Ye1, and Rex Smith2, (1) Intel, Hillsboro, OR, USA, (2) Intel, Dupont, WA, USA

9:00 AM Investigation of S21 Magnitude Extraction Methodologies by Using a Pattern Generator and Sampling Oscilloscope**

Xinyun Guo1, Ketan Shringarpure1, Fadi Daou2, and Jun Fan1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) MultiLane SAL, Santa Clara, CA, USA

9:30 AM Investigation of Signal Integrity Issues in Multi-path Electrostatic Discharge Protection Device

Yang-Chih Huang1, Chung-Hao Chen2, and Tzong-Lin Wu1, (1) National Taiwan University, Taipei,


ABOUT SILICON VALLEY

The Silicon Valley newspaper, “San Jose Mercury News” is named for the fact that near-by New Almaden used to be a mercury mine.

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Technical Sessions


9:00 AM BEST EMC PAPER FINALISTRobust and Efficient RLGC Extraction for Transmission Line Structures with Periodic Three-Dimensional Geometries

Yunhui Chu1, Jason Zhenwei Yu2, and Zhiguo Qian3, (1) Intel Corp, Hillsboro, OR, USA, (2) Intel, Seattle, WA, USA, (3) Intel Corporation, Chandler, AZ, USA

9:30 AM BEST EMC PAPER FINALIST and BEST STUDENT PAPER FINALISTAn Augmented Electric Field Integral Equation Formulation for Dielectrics and Conductors at Low Frequencies**


10:30 AM - 12:00 PM

POSTER SESSION Grand Ballroom A-D Foyer Chairs: Jingook Kim1 and Alpesh Bhobe2, (1) Ulsan National Institute of Science and Technology, Ulsan, South Korea, (2) Cisco Systems, Inc., San Jose, CA, USA

Modeling of SOL Calibration Standards for PCB Channel Probing*

Juyoung Lee, Oracle Corporation, Santa Clara, CA, USA

Handling PDN Resonance Modes* Sherman Chen1, Greg Fu2, and Tao Hu3, (1) EMC Corp., Shanghai, China, (2) Molex Corp., Shanghai, China, (3) LUXSHARE-ICT, Inc, Milpitas, CA, USA

Experimental Characterization of Supply Induced Jitter in High Speed Serial Links*


An Improved Multiple Edge Responses Method for Memory Simulation Considering Worst Case and Nonlinear Crosstalk

Shiji Pan1, and Jiangyuan Qian2, (1) Inphi Corporation, Santa Clara, CA, USA, (2) Qualcomm Technologies, Inc., San Diego, CA, USA

8:30 AM - 10:00 AM

WED-AM-4 POWER INTEGRITY AND POWER DELIVERY NETWORK I Grand Ballroom D Chairs: Dale Becker1 and Guang Chen2, (1) IBM, Poughkeepsie, NY, USA, (2) Altera Corporation, San Jose, CA, USA

8:30 AM BEST INDUSTRY PAPER FINALISTChallenges and Solutions for Core Power Distribution Network Designs*

Dan Oh and Guang Chen, Altera Corporation, San Jose, CA, USA

9:00 AM Power Archipelago for GHz Power Filtering on Printed Circuit Boards**

Christopher Ferguson and A. Ege Engin, San Diego State University, San Diego, CA, USA

9:30 AM A Multistage “Power Integrity Surgery” for Designing Complex Automotive Electronic Control Units*

Ralf Bruening1, Torsten Wagner2, and Ralf Kakerow2, (1) EMC Technology Center, ZUKEN, Paderborn, Germany, (2) Division Interior, Continental Automotive GmbH, Wetzlar, Germany

8:30 AM - 10:00 AM

WED-AM-5 APPLICATIONS OF NUMERICAL MODELING Grand Ballroom E Chairs: Vignesh Rajamani and James West, Oklahoma State University, Stillwater, OK, USA

8:30 AM Analysis of Field Probe Perturbation in a Mode Stirred Reverberation Chamber

Luca Bastianelli, Valter Mariani Primiani, and Franco Moglie, Università Politecnica delle Marche, Ancona, Italy


55

Technical Sessions


THURSDAY MORNING8:30 AM - 12:00 PM

TH-AM-1 EMC MEASUREMENTS AND CALIBRATION Grand Ballroom A Chair: Dave Arnett, Hewlett Packard, Vancouver, WA, USA

8:30 AM Characterization and Correction of Calibration Jigs for LISN Impedance Measurements

Alexander Kriz, Seibersdorf Laboratories, Seibersdorf, Austria

9:00 AM A proposal of Substitution Method for Antenna Calibrations by the Use of Absorbers on the Ground Plane at Frequencies from 1 to 18 GHz

Mitsunobu Samoto, Nobuhito Samoto, and Ikuo Makino, Liberty Labs Asia, Inc., Yokohama, Japan

9:30 AM Innovative Field Receiver Based on a New Type of Active Rod Antenna*

Domenico Festa1, Alessandro Gandolfo2, and Renzo Azaro3, (1) IBD International Business Development S.a.s., CHIARI (BS), Italy, (2) Narda Safety Test Solutions S.r.l., Cisano sul Neva (SV), Italy, (3) EMC S.r.l., Genova, Italy

10:00 AM BREAK

10:30 AM Extension and Verification of Absorbing Material Effectiveness on Reducing Electromagnetic Emissions from Cavities Measured Using a Nested Reverberation Chamber Approach

Eric Drake1, Vignesh Rajamani2, Chuck Bunting1, James West1, Bruce Archambeault2, and Samuel Connor2, (1) Oklahoma State University, Stillwater, OK, USA, (2) IBM Corporation, Research Triangle Park, NC, USA

Common-Mode Noise Reduction on Broadside-Coupled Delay Line

Ding-Bin Lin1, Chung-Pin Huang1, Hsin-Nan Ke2, and Wen-Sheng Liu3, (1) National Taipei University of Technology, Taipei City, Taiwan, (2) PEGATRON Corporation, Taipei City, Taiwan, (3) WIESON Technologies Co., Ltd., New Taipei City, Taiwan

Design of a 20 GHz Bandwidth Dual-stage Dual-FIR Channel Emulator

Wei Qian1, David Pommerenke1, Atieh Talebzadeh1, Guanghua Li1, Chong Ding2, Stephen Scearce2, Yaochao Yang3, Douglas White2, and Jianchi Zhou4, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Cisco Systems, Inc., San Jose, CA, USA, (3) Cisco Systems, Inc., San Jose, CA, USA, (4) Huazhong University of Science and Technology, Wuhan, China

Reconstruction of Currents from EMC Near-Field Measurements by Means of Continuity Equation Constraints

Martin Schmidt and Manfred Albach, Friedrich-Alexander-University Erlangen-Nuremberg, Erlangen, Germany

BEST STUDENT PAPER FINALISTRadiation Physics from Two-Wire Transmission Lines**

Jing Li1, YaoJiang Zhang1, Dazhao Liu1, Alpesh Bhobe2, James Drewniak1, and Jun Fan1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Cisco Systems, Inc., San Jose, CA, USA


EMC in the Canadian Army

WEDNESDAY, MARCH 18 11:00 AM - NOON Rear of the Exhibit Hall

Military application require very specialized EMC considerations. Kris Hatashita is the Canadian Army subject matter expert for all matters of Electromagnetic Environmental Effects (E3) and has a perspective on the topic that will be of interest to EMC engineers and specialists

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10:30 AM BEST INDUSTRY PAPER FINALISTA Novel Approach to Evaluate Link Performance Using IBIS-AMI Model with Measured Waveform*

Weifeng Shu1, Chunfei Ye2, and Xiaoning Ye3, (1) Intel Asia Pacific Research and Development Ltd, Shanghai, China, (2) Intel Co., DuPont, WA, USA, (3) Intel Corporation, Hillsboro, OR, USA

11:00 AM A Study of Trace to Via Coupling Effect in High-speed Differential Interconnects*

Kai Xiao1 and Xiaoning Ye2, (1) Intel Corp, Dupont, WA, USA, (2) Intel Corporation, Hillsboro, OR, USA

11:30 AM QSFP28 Connector Footprint Optimization of Crosstalk and ILD_rms_dB for 25+ Gpbs Signaling

Il-Young Park1,Minh Quach2, and Michael Rowlands3, (1) Cisco Systems, San Jose, CA, USA, (2) Avago Technologies,San Jose, CA, USA, (3) Molex, Inc., Lisle, IL, USA

8:30 AM - 12:00 PM

TH-AM-3 MODELING AND SIMULATION FOR LARGE-SCALE AND MULTI-SCALE POWER DELIVERY NETWORK Grand Ballroom C Chairs: Qing He1 and Xiaoning Ye2, (1) Oracle Corporation USA, Santa Clara, CA, USA, (2) Intel Corporation, Hillsboro, OR, USA

8:30 AM Dynamic Analysis of Power Delivery Network with Nonlinear Components Using Matrix Exponential Method

Hao Zhuang, Ilgweon Kang, Xinan Wang, Jeng-Hau Lin, and Chung-Kuan Cheng, University of California - San Diego, La Jolla, CA, USA

11:00 AM Received Power and Ambient Electric Field from Broadband Emissions in Reverberant Spaces

Gregory Tait, Carl Hager, IV, Timothy Baseler, and Michael Slocum, NSWC Dahlgren, Dahlgren, VA, USA

11:30 AM BEST EMC PAPER FINALISTMaximum Received Power Statistics within RF Reflective Enclosures for HERO/EMV Testing

Carl Hager, IV and Gregory Tait, NSWC Dahlgren, Dahlgren, VA, USA

8:30 AM - 12:00 PM

TH-AM-2 HIGH SPEED LINK DESIGN II Grand Ballroom B Chairs: Dan Oh1 and Shaowu Huang2, (1) Altera Corporation, San Jose, CA, USA, (2) Intel Corporation, DuPont, WA, USA

8:30 AM Effective Methodology for Correlating Measurement to Simulation for IBIS-AMI Models*

Seungyong Baek, Mike Sapozhnikov, and Amendra Koul, Cisco Systems, San Jose, CA, USA

9:00 AM Signal Integrity Considerations in Implementing USB On-The-Go for Mobile Designs*

Sudeep Puligundla1, Khang Choong Yong2, Wil Choon Song2, Vijay Kasturi1, Steven Ji3, and Xiaoning Qi3, (1) Intel Corporation, Hillsboro, OR, USA, (2) Intel Corporation, Penang, Malaysia, (3) Intel Corporation, Santa Clara, CA, USA

9:30 AM Design of Very Low Distortion Dense Routings for Skew Compensation in High Speed Interconnects*

Raul Enriquez-Shibayama, Benjamin Lopez-Garcia, Luis Nathan Perez-Acosta, Ana Sanchez-Granados, Intel, Zapopan, Mexico

10:00 AM BREAK


57

Technical Sessions


8:30 AM Technique to Improve the Accuracy of Mixed-mode S-parameters Derived from Single-Ended Results and Application to Shorter Test Coupon Design

Shaowu Huang, Intel Corporation, DuPont, WA, USA

9:00 AM USB3.1 Silicon and Channel Design Optimization using Artificial Neural Network Modeling

Mo Liu and Jennifer Tsai, Intel Corporation, Santa Clara, CA, USA

9:30 AM Modeling of Mutual Coupling between Inductors

Gundars Asmanis, Deniss Stepins, Leonids Ribickis, and Aivis Asmanis, Riga Technical University, Riga, Latvia

10:00 AM BREAK

10:30 AM Rigorous One-Port Measurement Method for the Characterization of On-chip Pad Response

Shaowu Huang1, Beomtaek Lee2, Xiaoning Ye3, and Kai Xiao1, (1) Intel Corporation, DuPont, WA, USA, (2) Intel Corporation, Santa Clara, CA, USA, (3) Intel Corporation, Hillsboro, OR, USA

11:00 AM Software-related EMI Test Pattern Auto-generation for 2-stage Pipeline Microcontroller

Yung-Chi Tang1, Cheng-Chang Chen1, and Shih-Yi Yuan2, (1) Bureau of Standards, Metrology and Inspection (BSMI), New Taipei, Taiwan, R.O.C. (2) Feng Chia University, Taichung, Taiwan, R.O.C.

11:30 AM EMC Simulations of Aircraft with Composite Materials*

Martin Vogel and C. J. Reddy, Altair Engineering, Hampton, VA, USA

9:00 AM Fast Transient Simulation of Multilayered Power Delivery Network by Using the Stabilized Explicit Method

Tadatoshi Sekine and Hideki Asai, Shizuoka University, Hamamatsu-shi, Japan n

9:30 AM BEST SIPI PAPER FINALISTFast Structure-Aware Direct Time-Domain Finite Element Solver for Large-Scale On-Die Power Grid Simulation**

Woochan Lee and Dan Jiao, Purdue University, West Lafayette, IN, USA

10:00 AM BREAK

10:30 AM System Power Noise Analysis Using Modulated CPM

Di Hu1, Yongxue Yu1, Antonio Ferrario2, Olivier Bayet3, Lin Shen1, Ravi Nimmagadda1, Felice Bonardi1, and Francis Matus1, (1) Cisco Systems, San Jose, CA, USA, (2) STMicroelectronics, Cornaredo - MI, Italy, (3) STMicroelectronics, Grenoble, France

11:00 AM BEST SIPI PAPER FINALISTVectorless Transient Power Grid Verification: A Case Study with IBM Benchmarks

Xuanxing Xiong1 and Jia Wang2, (1) Synopsys, Inc., Mountain View, CA, USA, (2) Illinois Institute of Technology, Chicago, IL, USA

11:30 AM Impulse Response Generation from S-Parameters for Power Delivery Network Simulation

Ilgweon Kang, Xinan Wang, Jeng-Hau Lin, Ryan Coutts, and Chung-Kuan Cheng, University of California - San Diego, La Jolla, CA, USA

8:30 AM - 12:00 PM

TH-AM-4 NUMERICAL MODELING APPROACHES Grand Ballroom D Chairs: Jianmin Zhang1 and Kai Xiao2, (1) Apple Inc., Cupertino, CA, USA, (2) Intel Corp, Dupont, WA, USA


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Technical Sessions


3:30 PM BEST EMC PAPER FINALIST and BEST STUDENT PAPER FINALISTNear-field Coupling Estimation by Source Reconstruction and Huygens’s Equivalence Principle**

Liang Li1, Jingnan Pan1, Chulsoon Hwang3, Gyuyeong Cho2, Harkbyeong Park2, Yaojiang Zhang1, and Jun Fan1, (1) Missouri Science and Technology, Rolla, MO, USA, (2) Samsung Electronics, Suwon, South Korea, (3) Samsung Electronics, Suwon GyengGi-Do, South Korea

4:00 PM BEST STUDENT PAPER FINALISTEliminating Non-Linear RSS Reporting Error in a Radiated RSS-Based TIS Testing Method**

Penghui Shen1, Yihong Qi2, Wei Yu2, Fuhai Li1, and Jun Fan3, (1) Hunan University, Changsha, China, (2) DBJ Technologies, Zhuhai, China, (3) Missouri University of Science and Technology, Rolla, MO, USA

1:30 PM - 5:30 PM

TH-PM-2 NUMERICAL MODELING AND SIMULATION TECHNIQUES II Grand Ballroom B Chairs: Kai Xiao1 and Gerardo Romo2, (1) Intel Corp, Dupont, WA, USA, (2) Qualcomm Technologies, Inc., San Diego, CA, USA1:30 PM Frequency Domain Interpolation of Long Structures for System-level Signal Integrity Analysis

Mikheil Tsiklauri, Mikhail Zvonkin, Nana Dikhaminjia, Jun Fan, and James Drewniak, Missouri University of Science and Technology, Rolla, MO, USA

2:00 PM Microstrip Improvement by Using Dielectric Film*

Shaowu Huang1, Olufemi Oluwafemi2, and Gary Brist2, (1) Intel Corporation, DuPont, WA, USA, (2) Intel Corporation, Hillsboro, OR, USA

THURSDAY AFTERNOON1:30 PM - 5:30 PM

TH-PM-1 WIRELESS TESTING AND RF INTERFERENCE Grand Ballroom A Chairs: Yihong Qi1 and William Young2, (1) DBJ Technologies, Zhuhai, China, (2) National Institute of Standards and Technology, Boulder, CO, USA

1:30 PM

An Effective Receiver Sensitivity Measurement** Zixin Liu1, Fuhai Li1, Yihong Qi2, and Ji Chen3, (1) Hunan University, Changsha, China, (2) DBJ Technologies, Zhuhai, China, (3) University of Houston, Houston, TX, USA

2:00 PM BEST STUDENT PAPER FINALISTConducted-Emission Modeling for a Switched-Mode Power Supply (SMPS)**

Yansheng Wang1, Siqi Bai1, Xinyun Guo1, Shuai Jin1, Yaojiang Zhang1, Joakim Eriksson2, Lijuan Qu2, Jingyu Huang3, and Jun Fan1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Microsoft Mobile (China) Investment Co. Ltd., Beijing, China, (3) Microsoft Device Group, San Diego, CA, USA

2:30 PM BEST EMC PAPER FINALISTA Planar Low-Profile Meander Antenna Design for Wireless Terminal Achieving Low Self-Interference

Yihong Qi1, Jun Fan2, Ye-Hai Bi3, Wei Yu1, and James Drewniak2, (1) DBJ Technologies, Zhuhai, China, (2) Missouri University of Science and Technology, Rolla, MO, USA, (3) Shenzhen Sunway Communication Co.,Ltd, ShenZhen, China

3:00 PM BREAK


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Technical Sessions

2:30 PM Application of a Boundary Element Method Tool in Improving Differential Channel Routing Design*

Xiao Ren1, Shaowei Deng2, Jayaprakash Balachandran2, and Bidyut Sen2, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Cisco Systems, Inc., San Jose, CA, USA

3:00 PM BREAK

3:30 PM BEST INDUSTRY PAPER FINALISTA Hybrid 3D/Equivalent 2D Finite Element Analysis for Vias Passing Through a Parallel Plate Pair Filled with Multilayer Dielectric*

Liehui Ren1, Peng Shao1, Kelvin Qiu1, Jane Lim1, Rick Brooks1, YaoJiang Zhang2, and Jun Fan2, (1) Cisco Systems, Inc, San Jose, CA, USA, (2) Missouri University of Science and Technology, Rolla, MO, USA

1:30 PM - 5:30 PM

TH-PM-3 POWER INTEGRITY AND POWER DELIVERY NETWORK II Grand Ballroom C Chairs: A. Ege Engin1 and Yujeong Shim2, (1) San Diego State University, San Diego, CA, USA, (2) Altera Corporation, San Jose, CA, USA

1:30 PM Integrated Power Supply Packaging Technique with Reduced Parasitic Inductance for On-die Voltage Regulator Design and Application

Boping Wu1 and Shaowu Huang2, (1) Intel Corporation, Hillsboro, OR, USA, (2) Intel Corporation, DuPont, WA, USA

2:00 PM Practical Aspects of Embedded Capacitance for Printed Circuit Board Power Distribution Networks*

Scott Piper1 and James Teune2, (1) General Motors, Milford, MI, USA, (2) Gentex Corporation, Zeeland, MI, USA

2:30 PM BEST INDUSTRY PAPER FINALISTEffective Power Delivery Filtering of Mixed-Signal Systems with Negligible Radiated Emission*

Mohammad Ali Khorrami1, Paul Dixon1, John Song2,and Keith Johnson3, (1) Laird, Randolph, MA, USA, (2) Laird, Schaumburg, IL, USA, (3) Laird, Cleveland, OH, USA

3:00 PM BREAK

3:30 PM Role and Performance of Interposer with Embedded Capacitors for Maintaining Power Integrity*

Toshio Sudo1, Daisuke Tanaka2, Kyoshi Mihara2, Naoyuki Kobayashi2, Sho Kiyoshige1, Wataru Ichimura1, and Toma Yamaguchi1, (1) Shibaura Institute of Technology, Tokyo, Japan, (2) Murata Manufacturing Co., Ltd., Kyoto, Japan

4:00 PM Real-time Programmable VR for Power Delivery Efficiency Enhancement

Wei Shen, Weixia Liang, and Herry Hu, Intel Corporation, Shanghai, China



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2:00 PM A Polynomial Chaos Approach for EM Uncertainty Propagation in 3D-FDTD Magnetized Cold Plasma

Bach Nguyen, Alireza Samimi, and Jamesina Simpson, University of Utah, Salt Lake City, UT, USA

2:30 PM Efficient Multi-Parameteric Uncertainty Quantification Methods for EMC/EMI Applications

Costas Sarris, Zixi Gu, Neeraj Sood, and Xingqi Zhang, University of Toronto, Toronto, ON, Canada

3:00 PM BREAK

3:30 PM Studying the Effect of Drilling Uncertainty on Signal Propagation through Vias**

Yansheng Wang1, Srinath Penugonda1, Yaojiang Zhang1, Ji Chen2, and Jun Fan1, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) University of Houston, Houston, TX, USA

Technical Sessions


1:30 PM - 5:30 PM

TH-PM-4 SPECIAL SESSION: UNCERTAINTY QUANTIFICATION IN COMPUTATIONAL EM AND SIGNAL/POWER INTEGRITY VERIFICATION Grand Ballroom D Chairs: Branislav Notaros and Sourajeet Roy, Colorado State University, Fort Collins, CO, USA

1:30 PM Efficient Multidimensional Statistical Modeling of High Speed Interconnects in SPICE via Stochastic Collocation using Stroud Cubature**

Majid Ahadi, Sourajeet Roy, and Mounica Vempa, Colorado State University, Fort Collins, CO, USA


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Computer Modeling and Simulation Demonstrations

TUESDAY, MARCH 1710:00 AM – NOON

USING SIMULATED EMC INSTRUMENTS TO DEVELOP, EDIT, AND VALIDATE EMC TEST ROUTINES

Presenter: Joe Tannehill, ETS-Lindgren, Austin, TX, USA

Abstract:

Automating the EMC test process has the benefits of improving measurement accuracy and repeatability while also increasing test throughput. EMC testing is complex and requires multiple instruments to work in unison so that data gathered is coherently assembled to determine compliance of a device under test.

Integrity of the test setup is typically done with system checks where a known signal is injected at some point in the system and compared with expected results. This approach is great for validating the entire hardware/software signal chain. Using virtual instruments, the software side of the system can be validated before assembling the instrumentation. This is a significant time saver and allows for scenario testing without tying up test equipment and chamber time.

This demonstration will show how instrument simulation can be used to setup system checks as well as validate actual EMC emissions and immunity tests.

ERC AND SRC FOR LARGE-SCALE SI ENGINEERINGPresenter: Jiang Li, Cadence Design Systems, San Jose, CA, USA

Abstract:

Software demo for advanced layout checks, ERC (electrical rule check) and SRC (simulation rule check) is proposed. ERC is geometry-domain based check showing trace impedance, coupling and reference; SRC is electrical-domain simulation based check showing Tx/Rx/NEXT/FEXT waveforms. ERC/SRC can handle large PCB designs, and provide insight into PCB’s SI performance.

This is software demo can be considered as a follow up for presentation ‘PCB check for large scale SI/PI engineering’ at 2014 IEEE EMC SI/PI symposium by the same author.

TUESDAY, MARCH 17 2:00 PM – 4:00 PM

NUMERICAL MODELING OF CROSSTALKPresenter: Scott Piper, General Motors, Milford, MI, USA

Abstract:

Unintended electromagnetic coupling, also known as crosstalk, causes a great deal of the EMC problems during product EMC testing. Crosstalk can never be eliminated especially since there is an increasing demand for smaller products so often trade-offs are made which can be investigated using numerical modeling tools. This demonstration will show how crosstalk in wiring and printed circuit boards can be modeled using various numerical modeling methods. Issues will be discussed such as which methods to use, simplification, and meshing requirements.

WEDNESDAY, MARCH 18 9:00 AM – 11:00 AM

USING METHOD OF MOMENTS FOR EMC AND SI APPLICATION

Presenter: Bruce Archambeault, Archambeault EMI/EMC Enterprises, Four Oaks, NC, USA and Missouri University of Science and Technology, Rolla, MO, USA

Abstract:

The Method of Moments (MoM) is one of the most common and popular electromagnetics simulation techniques being used. While all simulation techniques have their strengths and their weaknesses, MoM has proven to be very robust and extremely effective for certain types of simulation problems. This demonstration will use CONCEPT from Technical University of Hamburg-Harburg to demonstrate using MoM simulation technique for EMC and SI applications.

Experiments and Demonstrations


Located in Exhibit Hall

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THURSDAY, MARCH 19 9:00 AM – 11:00 AM

MODELING THE SHIELDING EFFECTIVENESS USING INTEGRAL EQUATION TECHNIQUES: SHIELDING EFFECTIVENESS OF AIRCRAFT STRUCTURES WITH CARBON-FIBER REINFORCED COMPOSITE MATERIALS

Presenter: Dr. M. H. Vogel, Altair Engineering Hampton, VA, USA

Abstract:

When lightning or high-intensity radiated fields hit an aircraft, currents will be induced in interior cable harnesses and be injected into electrical systems. This is especially a concern when the aircraft is made of composite materials, since those materials offer less shielding. We will demonstrate how the complete problem can be simulated efficiently and reliably.

Hardware Experiments and Demonstrations

TUESDAY, MARCH 17 2:00 PM – 4:00 PM

ETSI EN 300 328 V1.8.2 AND ETSI EN 301 893 V1.7.2 CLARIFIED REQUIREMENTS AND SYNCHRONIZED POWER SENSOR DEMONSTRATION

Presenter: Jack McFadden, ETS-Lindgren, Cedar Park, TX, USA

Abstract:

The ETSI EN 300 328 V1.8.2. Electromagnetic compatibility and Radio spectrum Matters (ERM); Wideband Transmission systems; Data transmission equipment operating in the 2,4 GHz ISM band and using wide band modulation techniques; Harmonized EN covering the essential requirements of article 3.2

of the R&TTE Directive and ETSI EN 301 893 V1.7.2 Broadband Radio Access Networks (BRAN); 5 GHz high performance RLAN; Harmonized EN covering the essential requirements of Article 3.2 of the R&TTE Directive has further clarified their power measurement requirements.

The ETSI explained its definition of conducted method of simultaneous data acquisition for multiple input/multiple output products (MIMO). The conducted power measurements are required to be made using synchronized (simultaneous) sensors. The minimum sampling speed of the data acquisition system is 1 Mega-Samples per second with the minimum sample of all sensors to be less than 500 nanoseconds.

The ETSI 300 328 V1.8.2 was published in April 2014 and ETSI EN 310893 V1.7.2 was published in July 2014. The compliance dates are 18 months after their release.

This demonstration is created to enable the viewer to understand the ETSI EN 300 328 V1.8.2 and 301 893 V1.7.2 clarified requirements as well as show how synchronized power sensors meet the ETSI power measurements.

WEDNESDAY, MARCH 18 9:00 AM – 11:00 AM

INDUCTIVE EFFECTS IN CABLESPresenter: Jerry Meyerhof, JDM Labs LLC, Buffalo Grove, IL, USA

Abstract:

The laboratory objective: Understand the practical implementation details of “cables” or “transmission lines” which are critical to EMC performance, as used between modules/units, across systems and within Printed Circuit Boards (PCBs). Demonstrated Observations:

1. Signal currents follow the path of least impedance.

2. Cable geometry effects and self-shielding.3. Conversion mechanisms between

differential and common mode signal propagation.



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4. Impact of cable mechanical end termination geometry such as “pigtail” connections.

5. Use of Common-Mode Chokes.

Analyze and Predict the observed effects

Another element of the presentation is to talk about the tasks involved in getting an educational lab to work, much like the Chris Semanson article in our EMCS magazine and his own demos in past years.

WEDNESDAY, MARCH 182:00 PM – 4:00 PM

CONSIDERATION ON THE EM NOISES BEFORE AND AFTER THE REGULAR TESTS FROM ESD GENERATOR

Presenters: Makoto Sugihashi, Noise Laboratory Co., Ltd., Kanagawa, JapanTony Tokuya, Shinyei Corp of America, New York, NY, USA

Abstract:

Electrostatic discharge (ESD) generators cause electromagnetic (EM) noises not only at ESD tests but also even before and after the tests. These phenomena may cause the unexpected test results. To explain the mechanism qualitatively, we investigated a generation source model of EM noises from an ESD generator.

MINIMIZING MAGNETIC FIELD SUSCEPTIBILITY THROUGH THE PROPER USE OF STATIC AND LOW FREQUENCY MAGNETIC SHIELDING

Presenters: Pablo Narvaez and Nelson Huang, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, USA

Abstract:

The Jet Propulsion Laboratory has participated in multiple projects whereby implementation of proper magnetic shielding has been a key component in successful space missions free of static and low frequency magnetic interference. This hardware

experiment/demonstration presents magnetic shielding methods similar to those applied on JPL hardware for typical magnetic cleanliness programs.

THURSDAY, MARCH 199:00 AM – 11:00 AM

RADIATED EMISSIONS AS A FUNCTION OF COMMON MODE CURRENT

Presenter: John McCloskey, Greenbelt, MD, USA

Abstract:

For any product, an essential part of EMI testing is the radiated emissions test. However, it is often the case that product development engineers, concerned with more visible design problems, ignore EMI concerns until the very day they take their boxes to an EMI test facility for radiated emissions testing, and then they are terribly shocked when they find that they’ve failed. At frequencies below about 200 MHz, a significant portion of the radiated energy originates from uncontrolled common mode currents on cables connected to the unit. The product development engineer may perform an early assessment of radiated emissions by directly measuring these currents. In this demonstration, a controlled current is applied to a wire above a ground plane, and the resulting electric field is measured. The transfer function of electric field per unit current (E/I) is determined and presented as a tool for predicting radiated electric fields from a simple measurement with a clamp-on current probe that may be made before the product ever leaves the development laboratory. Product development engineers are encouraged to perform these measurements in order to facilitate diagnosis of potential problems as early as possible in the product’s development cycle.




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Global EMC University was first offered at the 2007 IEEE EMC Symposium in Honolulu to provide advanced education on a variety of topics that are an important part of EMC engineering. The overwhelming response to this program caused the EMC Society to add it to the technical program every year since 2007. It has continued to receive high praise from those who attend. The Board of Directors had voted to name the Global University in honor of Clayton R. Paul, who dedicated his career to EMC/SI education and was instrumental in setting up the initial Global University. We are pleased to be able to offer Global University once again at the 2015 IEEE EMC Symposium and Signal Integrity in Santa Clara, California.

This year’s Global University offers 12 hours of instruction. Eight hours are on basic SI related topics and four hours on traditional EMC topics. The sessions are run in parallel with the traditional technical sessions at the symposium. A broader set of EMC topics will be covered at the International Symposium on EMC in Dresden, Germany on Aug 16- 22, 2015. Classes are taught by an international panel of educators, who have been selected for this program based on their reputation for excellence in areas of practical importance to EMC and SI engineers and their demonstrated ability to communicate effectively with students who are new to the field.

The targeted audience for GU SI are engineers who have been in the profession approximately 5 years, although past classes have included many veterans wanting to improve their understanding. The overall objective of this sequence of lectures and activities is to provide a comprehensive exposure to the basic concepts and skills that are necessary to be successful in the profession.

OTHER INFORMATIONA certificate of completion will be provided to students who have signed in and signed out each day thereby confirming 100% attendance at all lectures. CEUs will be assigned to this course.

Prerequisites: Engineering or Technology Degree with Electrical Theory

Audience: Engineers, technicians and professionals who want to gain insight into EMC and SI and the application to today’s technology.

Note: Attendance is based on those who pre-register for the Clayton R. Paul Global University (on-site registration limited to openings due to cancellations), pay the full symposium registration fee, and an additional registration fee for these special classes.Fees: $375.00

TUESDAY 1:00 PM - 3:00 PM

3:30 PM - 5:30 PM

WEDNESDAY 1:00 PM - 3:00 PM

3:30 PM - 5:30 PM

THURSDAY 1:00 PM - 3:00 PM

3:30 PM - 5:30 PM


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TUESDAY, MARCH 171:00 PM - 3:00 PM

CLASS I: RADIATED EMISSIONS AND CONDUCTED EMISSIONS

Lee Hill, Silent Solutions LLC, Amherst, NH, USA• Common and Differential-Mode Current• Understanding the Path of Conducted Emissions LISN Current• Understanding the Path of Radiated Emissions Antenna Current

3:30 PM - 5:30 PM

CLASS IIA: GROUNDINGTodd Hubing, Clemson University, Clemson, SC, USA

• Grounding System Topologies• Ground Loop Interaction and Coupling• Equipment and System Level Grounding

CLASS IIB: ELECTROSTATIC DISCHARGETodd Hubing, Clemson University, Clemson, SC, USA

• ESD models: human body, charged device• Examples of failures due to ESD events• Fault tolerant PCB design

WEDNESDAY, MARCH 181:00 PM - 3:00 PM

CLASS III: INTRODUCTION TO SIGNAL INTEGRITYJun Fan, Missouri University of Science and Technology, Rolla, MO, USA

• Signal Spectra • PCB/Package geometry and fabrication• Signal Propagation on Transmission Lines• Multi-conductor transmission lines and Crosstalk• Non-ideal discontinuities• Channel analysis and jitter

3:30 PM - 5:30 PM

CLASS IV: INTRODUCTION TO POWER INTEGRITYEge Engin, San Diego State University, San Diego, CA, USA

• Design for target impedance• Analysis of power/ground planes and resonances• Noise coupling mechanisms through return path discontinuities• Measurement and characterization techniques

THURSDAY, MARCH 191:00 PM - 3:00 PM

CLASS V: SI AND EMC DESIGN FOR HIGH-SPEED DIFFERENTIAL SIGNALING

Tzong-Lin Wu, National Taiwan Univeristy, Taipei, Taiwan

• High-speed differential transmission lines.• Designs of high-speed connectors.• Common-mode noise suppression techniques.• Co-designs of common-mode filter and differential mode equalizer

3:30 PM - 5:30 PM

CLASS VI: SI/PI ISSUES AND SOLUTIONS FOR HIGH-SPEED SINGLE-ENDED SIGNALING

Dan Oh, Altera Corp, San Jose, CA, USA• Proper voltage referencing schemes• Partial inductance versus loop inductance• Ground bounce in high-speed signal• Plane bounce modeling and mitigation• Issues of conventional crosstalk modeling• Crosstalk modeling based on modal analysis• Crosstalk mitigation techniques


Technical Committee MeetingsTec

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Technical Committee 5:

High Power ElectromagneticsThis committee is concerned with the effects and protection methods for electronic equipment and systems for all types of high power electromagnetic environments. These environments include electromagnetic pulse (EMP), intentional EMI environments (i.e., narrowband and wideband), lightning electromagnetic currents and fields, electrostatic discharge and geomagnetic storms. In addition this committee deals with the commercial data security issue through electromagnetic information leakage activities. Interactions with subsystems, systems and platforms are included.


Spectrum ManagementThis committee is concerned with the analysis, design, and measurement techniques for intentional RF transmitting and receiving equipment to prevent interference and promote efficient spectrum use through technology and operational based approaches, such as software design, dynamic spectral allocation, waveform control, as well as frequency coordination and management procedures.


Low Frequency EMCThis committee is concerned with low-frequency EMC including Power Quality in electric power systems. The committee is focusing on application of fundamental EMC concepts also to low frequency conducted disturbances. EMC in power systems is expected to be increasingly important. This is due to increased use of electronics in renewables, electric vehicles, energy efficient technologies and Smart Grid applications.


Computational ElectromagneticsThis committee is concerned with broad aspects of Applied Computational Electromagnetic techniques which can be used to model electromagnetic interaction phenomena in circuits, devices, and systems. The primary focus is with the identification of the modeling methods that can be applied to interference (EMC) phenomena, their validation and


EMC ManagementThis committee is concerned with the development and dissemination of Best Practices and Methodologies for the successful leadership, supervision and guidance of EMC related activities. These Best Practices and Methodologies shall be structured so as to provide assistance to all managers, and engineers. Appropriate and convenient tools shall serve as a foundation to these Best Practices and Methodologies.


EMC MeasurementsThis committee is concerned with the measurement and instrumentation requirements in EMC standards and procedures and how they are interpreted. Also concerned with the adequacy of measurement procedures and measurement instrumentation specifications for radiated and conducted emission and susceptibility tests and the rationale for performance limits for these tests.


Electromagnetic EnvironmentThis committee is to encourage research in the following areas: electromagnetic environment (EME), development of standards for EME measurement and characterization, natural and man-made sources of electromagnetic environment that comprise this environment, effects of noise (unwanted portions of EME) on systems performance, effects of international civil and military standards intended to control man-made intentional and unintentional emissions of electromagnetic energy.


EMI ControlThis committee is concerned with design, analysis, and modeling techniques useful in suppressing interference or eliminating it at its source. Bonding, grounding, shielding, and filtering are within the jurisdiction of this committee. These activities span efforts at the system, subsystem, and unit levels.

Technical Committee (TC) Meetings play an important role in the overall success of the EMC Society by promoting activities in their fields and providing expert knowledge and assistance to generate and review technical papers, organize and operate sessions at symposia, generate and develop standards, and evaluate the state of the art in EMC science. All meetings are open to everyone; join them for breakfast, a break, lunch, or dinner. Listen to the discussions and learn what they are working on. Join your peers who volunteer to make EMC better. Just by attending, you can be part of the solution and the future of EMC


Technical Committee Meetings

delineating the practical limits of their applicability. Included are low and high frequency spectral-domain techniques and time-domain methods.


Signal and Power IntegrityThis committee is concerned with the design, analysis, simulation, modeling and measurement techniques useful in maintaining the quality of electrical signals. These activities encompass all aspects of signal integrity from the integrated circuit level to the system level.


NanotechnologyThe newest technical topic area for the EMC Society, the topics include carbon nanotubes, composite materials, and other measurements, design, and analysis applications.

Special Committee 1:

Smart GridThis special committee is concerned with coordination of the EMC Society activity on providing EMC principles for those organizations and associated documentation and specifications that address the efficient use of the AC power grid including the control of power entering and in some cases exiting a house or building.


EMC for Emerging Wireless TechnologiesThis committee is concerned with the design, analysis, modeling and measurement for interference control and mitigation in emerging wireless products. The committee encourages researches including but not limited to the following areas: EMC-based system architecture design and system planning, strategic EMC performance budgeting and distribution, new system interface requirements and new system integration methods, intra-system coupling path analysis, modeling and validation, new EMC evaluation/measurement methods and standards for components/devices, Innovative component designs with integrated EMC functionalities, new EMC material requirements, applications and evaluation methods, and interdisciplinary issues involving EMC, audio, mechanical, and thermal designs.


Unmanned Aircraft Systems EMCThis committee is concerned with design, testing, modeling/simulation required for system level EMC for unmanned

aircraft systems that will be engaged in all-weather autonomous single and cooperative flight. Special emphasis is on spectrum management on intra and inter-system interactions (platform integration), mission specific data security and bandwidth requirements, and robust performance in the presence of high intensity radiated fields (HIRF). Engagement in the development of standards will be a key role of this special committee.

TECHNICAL COMMITTEE MEETINGS

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Collateral Meetings Schedule


MEETING NAME START TIME

END TIME

HOTEL OR CC ROOM NAME/#

Saturday, March 14IEEE EMC Society Board of Directors Executive Committee (ExCom) Meeting 6:00 PM 10:00 PM Hyatt Private Meeting

Sunday, March 15IEEE EMC Society Board of Directors Meeting 8:30 AM 5:00 PM Hyatt Bayshore

IEEE EMC Society Board of Directors Lunch 12:00 PM 1:00 PM Hyatt Camino Real

Photographers Meeting 1:00 PM 2:00 PM CC 201

NVLAP Assessor Training Workshop 9:00 AM 5:00 PM CC 212

Monday, March 16Technical Advisory Committee (TAC) Meeting 7:00 AM 9:00 AM CC 210

SDECom Standards Development and Education Committee 8:00 AM 11:00 AM CC 203/204

iNARTE Personnel Certifications 8:00 AM 12:00 PM CC 212

SACCom Meeting StandardsAdvisory and Coordination Committee 11:15 AM 12:00 PM CC 203/204

SDECom / ESAC Luncheon 12:00 PM 1:00 PM CC 203/204

SC6 Unmanned Aerial Systems EMC Committee Meeting 12:00 PM 1:30 PM CC 206

SC4 EMC for Emerging Wireless Technology 12:00 PM 1:00 PM CC 209

IEEE Std 377 1:00 PM 2:00 PM CC 203/204

SC-1 Smart Grid Coordination Committee 5:45 PM 6:30 PM CC 209

EMCS Chapter Chair Dinner 5:30 PM 8:30 PM CC Grand Ballroom H

ITI Technical Committee-5 Meeting 7:00 PM 10:00 PM CC 210

Tuesday, March 17Technical Committee 1 EMC Management 7:00 AM 9:00 AM CC 210

IEEE Senior Member Elevation Informational Presentation 11:00 AM 12:00 PM CC 201

Technical Committee 9 Computational Electromagnetics Committee Meeting 12:00 PM 1:30 PM CC 203/204

G46 EMC Subcommittee Meeting 12:00 PM 4:00 PM CC Mission City Ballroom 5

Wednesday, March 18ESAC Meeting 7:00 AM 9:00 AM CC 210

TILE! Users Group 7:00 AM 9:00 AM CC Mission City Ballroom 5

Technical Committee 2 EMC Measurements 7:00 AM 8:30 AM CC 209

SDECom Meeting 7:30 AM 9:00 AM CC 206

IEEE Senior Member Elevation Workshop 9:30 AM 5:00 PM CC Grand Ballroom G

SAE AE-4 Electromagnetic Compatibility Committee Meeting 12:00 PM 1:30 PM CC 206

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Collateral Meetings Schedule


MEETING NAME START TIME

END TIME


Wednesday, March 18 continued

IEEE EMC Young Professionals Luncheon 12:00 PM 1:30 PM Hyatt Alameda

Founders Luncheon 11:30 AM 1:30 PM CC 201

Technical Committee 5 High Power Electromagnetics 12:00 PM 1:30 PM CC 210

Technical Committee 10 Signal and Power Integrity 12:00 PM 1:00 PM CC 203/204

Thursday, March 19Technical Committee 6 Spectrum Management 7:00 AM 8:15 AM CC 212

IEEE ETA KAPPA Nu 8:00 AM 5:00 PM CC 201

EMCS Chapter Chair Training 12:00 PM 2:00 PM CC 210

Technical Committee 4 Interference Control 12:00 PM 1:30 PM CC 209

Technical Committee 11 Nanotechnology & Advanced Materials 12:00 PM 2:00 PM CC 206

2016 EMC Symposium Coordination Meeting 2:00 PM 4:00 PM CC 212

2015 EMCSI Santa Clara Symposium Wrap Up Session 4:00PM 5:45PM CC 203/204

Friday, March 20iNARTE Certification Examinations 8:00 AM 5:00 PM CC 209

OTHER SYMPOSIUM EVENTS START TIME

END TIME


Sunday, March 15Tote Bag Stuffing 9:00 AM 11:00 AM CC 203/204

Monday, March 15 through Friday, March 20Speaker Ready 7:00 AM 5:30 PM CC 205

Speaker’s Breakfast 7:15 AM 8:15 AM CC Grand Ballroom H

Companion Hospitality 8:00 AM 10:00 AM Hyatt Camino Real

Tuesday, March 17 through Thursday, March 19Clayton R. Paul Global University 1::00 PM 5:30 AM CC Grand Ballroom F

Thursday, March 19Exhibitor Breakfast 7:45 AM 9:00 AM CC Mission City Ballroom B5

Committee Wrap Up Meeting 4:00 PM 6:00 PM CC 203/204


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iNARTE Workshop, Examinations, and Events

Monday, March 16th

Learn more about iNARTE CertificationsThis workshop is a recommended for anyone interested in learning more about iNARTE certifications. During this workshop, you will learn more about the following iNARTE certification programs:

• EMC Engineer and Technician• EMC Design Engineer• Wireless Device Certification

Professional

You will have an opportunity to ask questions regarding application and examination for these programs, as well as an opportunity to take a practice test.

Register today to take the certification exams for all of these programs by visiting http://www.narte.org/h/examregform.asp

Identify your testing location using the “Special Event Location” feature.

Friday, March 20th

The iNARTE Certification Examinations for the following programs will be held at the Symposium from 8:00 AM to 5:00 PM

• EMC Engineer and Technician• EMC Design Engineer• Wireless Device Certification

Professional

Register for the exams by visiting http://www.narte.org/h/ examregform.aspIdentify your testing location using the “Special Event Location” feature.

If you attend The Global EMC University lectures, this is an opportunity to validate your knowledge and experience by becoming iNARTE Certified. You may take the Examination at the Symposium and apply for the certification later, or apply now and register for the exam by visiting www.narte.com

iNARTE, a product of Exemplar Global (formerly RABQSA), certifies qualified engineers and technicians in the fields of Telecommunications, Electromagnetic Compatibility/ Interference (EMC/EMI), Product Safety (PS), Electrostatic Discharge control (ESD), and Wireless Systems Installation.

iNARTE, a product of Exemplar Global, Inc. (formerly RABQSA) 600 N Plankinton Ave, Suite 301, Milwaukee, WI 53203 Phone (888) 722-2440 Fax (414) 765-8661 www.narte.org or www.exemplarglobal.org

Questions? Sal Agnello, General Manager, iNARTE, Exemplar Global [email protected]

International Association for Radio, Telecommunications,

and Electromagnetics

More information about iNARTE certifications

The iNARTE EMC certification is an international program that recognizes engineers and technicians practicing in the EMC fields to include bonding, shielding, grounding, EMI prediction, EMI analysis, conducted and radiated interference, lightning protection and more.

Learn more about the EMC program at http://www.narte.org/h/emc.asp

The iNARTE EMC Design Engineer certification is an international program that recognizes engineers practicing in EMC fields and whose main responsibility is designing electronic circuits, components, sub systems, and equipment to ensure EMC compliance.

Learn more about the EMC Design Engineer program at http://www.narte.org/h/emcdesignengineer.asp

The iNARTE Wireless Device Certification Professional (WDCP) certification is a new program that recognizes professionals who are skilled and knowledgeable of the global regulatory requirements applicable to the wide range of Wireless Devices now being introduced to market segments.

Learn more about the WDCP program at http://www.narte.org/h/wdcp.asp

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Technical Program

Registration Form Contact: Janet O’Neil

Telephone: +1 425-868-2558 Email: [email protected]

Ms./Mr._______________________________________ ______Company____________________________________________Address_____________________________________________City _______________________State_____ Zip____________Daytime Phone ___________________Email_______________________________________________Credit Card (check one): MC______Visa______Amex_______Credit Card No:______________________________________Expiration Date:______________________________________Signature:___________________________________________

Check or Credit Card Number must accompany registration.

Make checks payable to U.S. EMC Standards Corporation in U.S. dollars drawn on a U.S. bank.

NOTE: You are not registered until you receive confirmation!

C63.10/26 Workshop: March 13 (all day) AND March 14 (morning only)By February 4* $750 USD _________C63.4 Workshop: March 14 (afternoon only)By February 4*: $400 USD__________Both WorkshopsBy February 4*: $900 USD _________

Add $200 if registered after Feb. 4 $200 USD _________

Total ** $ USD ____ _____

*Please do not mail after February 13. **A 20% discount applies to ANSI ASC C63® main committee and subcommittee paid members.

ANSI C63® Workshops

Compliance Testing of Wireless Devices and Unintentional RadiatorsVisit www.c63.org for more information

This workshop covers three standards. The first full day plus a half-day wireless workshop provides an overview of the present standard C63.10 for unlicensed transmitter testing and the future standard C63.26 for licensed transmitter testing. There will be specific emphasis on new procedures. C63.26 is expected to be balloted in 2015. These two standards capture most of the procedures for testing unlicensed and licensed wireless devices to show compliance with FCC requirements. Group discussions and demonstrations will be a highlight of the wireless workshop.

The instructors have an intimate knowledge of the technology and helped in the development of these procedures.

The second half-day unintentional radiators workshop captures the procedures for testing unintentional radiators contained in the newly published standard C63.4-2014. This half-day workshop will present major changes in C63.4 from the 2009 edition to the published 2014 edition. It will be presented by the lead contributor of the standard.

While covering many of the procedures in C63.10-2013, this one and a half-day workshop will also focus on the following new material in C63.26-20XX• Instrumentation requirements • Average value of pulse emissions• Antenna requirements• Test site requirements• RF output power measurements• Modulation measurements• Occupied bandwidth procedures• Band-edge procedures• Direct and signal substitution radiated

emission measurements• Frequency stability measurements• Conducted tests at antenna port• Smart antenna system tests• Revised MIMO procedures• Test procedures for RF repeaters, amplifiers

and boosters• Annexes covering example of OOB masks,

consumer booster require-ments, ERP/EIRP guidelines, path loss characterization, sample test report, compliance tests verses regulatory requirements and other informative guidance

• In-lab demonstrations will show specific procedures for testing both licensed and unlicensed wireless devices

In the half-day C63.4 workshop, you will learn:• RF emission measurement procedures• National and international regulatory

implications• Test facility and instrumentation

requirements• Equipment test arrangements and

configurations• Differences between the 2014 edition and

the 2009 edition and earlier

Who Should AttendThose responsible for determining compliance with FCC Rules and Regulations, including:• Product managers and developers• EMC engineers and test technicians• Regulatory compliance managers• Test instrumentation developers• Calibration and measurement

accreditation bodies• Lab quality assessors• Test instrumentation and chamber

manufacturers

Host Hotel – Hyatt Regency Santa ClaraSee EMC Symposium website for details.www.emc2015usa.emcss.org

Date and Location March 13-14, 2015SIEMIC, Inc.775 Montague ExpresswayMilpitas, CA 95035+1 408-526-1188

Expert InstructorsArt Wall, Radio Regulatory Consultants, Wireless Working Group Chairman; Mark Briggs, UL Director, Wireless Certification Program; Bob Delisi, UL TCB Project Lead; Donald Heirman, Don HEIRMAN Consultants, C63.4 Working Group Chairman and workshop director

Fee IncludesShuttle service to/from SIEMIC, Inc. and the symposium host hotel, continental breakfast, lunch and breaks for both days and completion certificates. Soft copy of workshop notes only will be provided. (Fee does NOT include draft or published standards.)

AgendaC63.10/C63.26 Wireless Workshop – All day Mar 13 and Morning Only Mar 14Mar 13: Registration: 8:30 am Class: 9:00 am to 5:00 pmMar 14: Class 9:00 am to 12:00 pmC63.4 Workshop – Afternoon OnlyMar 14: Registration: 12:30 pm Class: 1:00 pm to 5:00 pm

The organizing committee reserves the right to substitute speakers, modify the program (or lecture notes), restrict attendance or to cancel the workshop(s). In the event the workshop(s) is/are cancelled, registration fees will be refunded. Substitutions are allowed.

Sponsored by ANSI ASC C63®


IEEE EMC Young ProfessionalsTec

hnica

l Prog

ram

The IEEE Electromagnetic Compatibility (EMC) Society is dedicated to the development and distribution of information, tools and techniques for reducing electromagnetic interference. The society’s field of interest involves engineering related to the electromagnetic environmental effects of systems to be compatible with themselves and their intended operational environment. This includes: standards, measurement techniques and test procedures, instrumentation, equipment and systems characteristics,interference control techniques and components, education, computational analysis, and spectrum management, along with scientific, technical, industrial, professional or other activities that contribute to this field. SI/PI courses will be offered.

If you have received your Bachelor degree or equivalent within the last 15 years, you will automatically become a member of YP EMC when you join the EMC Society. You will also be granted a complimentary membership in the IEEE YP Affinity Group.

Career Resources

• YP webinars (Monthly technical and professional topics)

• GOLDRush Blog with topics of interest

• IEEE job site (Posting from leading technology companies)

• Continuing education resources

• Scholarships for advanced degrees (Masters and PhD)

• People soft skills development

• Leadership training and opportunities

Essential Technical Information

• Yearly International EMC Symposium Conference

• Society specific magazine

• Society specific digital library

• EMC Transactions and ProceedingsSavings on standards, proceedings and books

• Savings on conference fees

• Local presentations, workshops and tutorials

Professional Development

• Education - certificate and degree programs

• Certification preparation

• Global University™ for ongoing EMC education

• Continuing Education Credits

• EMC scholarships and financial assistance

• Leadership volunteer opportunities

• Professional training opportunities

Networking and Mentoring

• Networking - Meet and socialize with your peers

• YP Summit events

• Connect with innovators and practitioners

• IEEE Member Directory

• Virtual Communities

• Mentor Connections

• IEEE special interest groups

• Participate to Social event with International YPs at the IEEE EMC Symposium

Community Programs

• Volunteer—Make a difference

• Plan, organize and lead meetings locally, regionally and nationally

• Student mentoring opportunities

• Humanitarian initiatives

• Nominate your peer to get a recognition from IEEE YP EMC

When: Tuesday, March 17th Time: 7:30 PM - 11:00 PMEvent: Bowling*Fee: Free! Includes bowling/shoes, drinks, pizza, and gamesLocation: Bowlmor Lanes, 10123 N Wolfe Rd Cupertino, CA 95014Transportation: Free Shuttle (outside of Welcome Reception)

When: Wednesday, March 18th Time: NOON - 1:30 PMEvent: EMC Troubleshooting tips and Hands-on with different EMC test stations by Mark Montrose and Ken Wyatt Fee: $10 includes Lunch Location: Hyatt, Alameda Room

Benefits of Membership

*Sponsored by: Hipotronics, Advanced Test Equipment, and AE Techron


Professional DevelopmentTechnical Program

The IEEE EMC Society is offering both Professional Development Hours (PDHs) and Certificates of Participation to IEEE EMC and SI/PI symposium attendees. A small fee and a completed evaluation form will be required to receive a certificate. In addition, PDH candidates must provide evidence of having attended each session for which credit is desired.

PDH Certificate of CompletionPDH credits can be used by licensed professional engineers to document required continuing education for their individual State Board or Certifying Body requirements. We have expanded choices with this a-la-carte menu, where you may obtain credit for attending any morning or afternoon session, any day of the week. An example is shown below.

Monday Tuesday Wednesday Thursday FridayAM 4.0 hrs 4.0 hrs 4.0 hrs 4.0 hrs 4.0 hrs

PM 4.0 hrs 4.0 hrs 4.0 hrs 4.0 hrs 4.0 hrs

To obtain PDH credits, an attendee must:• Sign up on your registration form or at the Registration Desk, and pay the processing fee* if required.• Sign in and out with the volunteer at the door to each chosen paper session or W/T session.• Complete an evaluation form for each session, morning or afternoon, that credit is desired.• Submit evaluation forms to the registration desk or scan and email to [email protected] no later than Monday, March 23, 2015. Any forms received after this date will not be processed.

The total hours attended will be calculated along with the total number of PDH credits earned, and one Certificate of Completion will be awarded by the IEEE showing the total earned PDH credits.

Certificate of ParticipationA Certificate of Participation may be useful for non-licensed professionals or college students to officially document attendance at the Symposium.

To obtain a Certificate of Participation, an attendee must:• Sign up on your registration form or at the Registration Desk, and pay the processing fee* if required.• Complete one form listing and describing all paper sessions and W/T sessions attended.• Submit form to the registration desk or scan and email to [email protected] no later than Monday, March 23, 2015. Any form received after this date will not be processed.

A Certificate of Participation will then be sent to the attendee from the IEEE.

*There is a modest $20 charge for processing PDH credits and/or CoP certificates; this fee is waived for IEEE EMC Society members only.


Social EventsSo

cial E

vents

WELCOME RECEPTION Tuesday, March 17, 6:00 PM – 8:00 PM

Join us in the gorgeous Mission City Ballroom in the Santa Clara Convention Center for an evening of wine tasting, socializing, and live music from the EMC Band!

One ticket to this event is included in all 5-Day technical registrations and the Companion Program registration. All others may purchase a ticket to the Welcome Reception as an add-on to your registration.

• An Adult Reception Ticket price: $75.00• A Junior (Age 8 to 17, inclusive) Reception Ticket is: $35.00 • Children under age 8 are free, but must be accompanied by a registered adult.

EVENING GALA EVENT Wednesday, March 18, 6:30 PM – 9:30 PM

Our evening Gala is a must attend event with an awards ceremony and our delicious California menu. This event will be in the Mission City Ballroom in the Santa Clara Convention Center.

One ticket to this event is included in all 5-Day technical registrations EXCEPT student registrations. This is a change from last year, made to keep student registration costs down. Extra tickets to the Gala may be purchased as an add-on to your registration.

• An Adult Gala Ticket is: $90.00

• A Junior (Age 8 to 17, inclusive) Gala Ticket is: $45.00 Children under age 8 are free, but must be accompanied by a registered adult.

EMC YOUNG PROFESSIONALS PARTYTuesday, March 17th, 7:30 PM -11:00 PM

Sponsored by Hipotronics, Advanced Test Equipment, and AE Techron

Show off your fancy bowling skills with your peers and other conference attendees! This sponsored event will host dedicated lanes for the young professionals group.

Event: EMC Bowl-A-Rama Fee: Free! Includes bowling/shoes, pizza, drinks, and games (Open to all attendees) Location: Bowlmor Lanes, 10123 N Wolfe Rd Cupertino, CA 95014Transportation: Shuttle provided (outside of Welcome Reception)

photo credit: Ken Wyatt



Social EventsSocial Events

EMCS CHAPTER CHAIR DINNERMonday, March 16, 5:30 PM - 8:30 PM, Grand Ballroom H

Come join us for dinner and socializing with the other chapter chairs, angels and the EMC Society Board of Directors. Each Chapter Chair or their representatives will have a chance to share their chapter’s activities for the past eight months. This is a great opportunity to exchange information and new ideas for effective chapter management, as well as to discuss best practices and suggestions for future development and growth of the EMC chapters. This is a free event open to Chapter Chairs or their representatives.

FOUNDERS AND PAST-PRESIDENTS LUNCHEONWednesday, March 18, 11:30 AM - 1:30 PM, Room 201

The Luncheon is open to the Founders of the EMC Society, Past-Presidents of the EMC Society, current members of the Board of Directors, and students. The luncheon is a chance for the old and the new to mix, exchanging experiences of the past, challenges of the future and learning about the EMC profession. A sit down lunch is provided.

EMCS CHAPTER CHAIR TRAININGThursdsay, March 19, 12:00 PM - 2:30 PM, Room 210

EMC Society Chapter Chairs are encouraged to attend this informative and interactive training session. The session provides a forum for focused training to the Chapter Chairs, the opportunity to discuss chapter issues and get group feedback, and additionally, gives the Chapter Chairs some time to get better acquainted with other Chairs from around the world. We are pleased to announce that we have two special speakers planned from the IEEE Headquarters.

• vTools Expert will give an instructional demonstration on the software used to effectively manage your chapter.• EWH Expert will train you on the IEEE web hosting and web press system.

These sessions are always very worthwhile, so please make the time in your schedule to attend. Lunch will be served during the session.

ABOUT SANTA CLARA

A new product, the semiconductor chip, was developed in the 1950’s. The resulting electronics industry, based on the silicon chip, gobbled up the remaining orchard land and changed the agricultural nature of Santa Clara and Santa Clara Valley forever.


Socia

l Eve

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80

Social Events


EMC SOCIETY BAND Tuesday, March 17, 6:00 PM – 8:00 PM

EMC Society Musicians will perform at the Welcome Reception! Come see our gifted colleagues share their musical talents!

This is a comeback event that was first featured in Austin at EMC 2009. Veteran EMC Society Band members and newcomers alike are welcome to participate.

If you would like to perform, please contact our fearless bandleader Jeff Silberberg at [email protected]. If needed, he can arrange for backup musicians to allow your talent to shine!

TEAM EMCThursday, March 19, 7:00 AM

Interested in exploring some of Santa Clara on bike with your fellow EMCS members? The third annual Team EMC bike ride is scheduled for Thursday, March 19th. Please join us for a morning ride to get some exercise and to experience part of the area in a refreshing way. Based upon participation, this year we will host two levels of escorted riding: leisure and performance. A Team EMC jersey will be included for 1st-time participants on a first come first serve basis, while quantities last. If you received a jersey on one of our past rides, please don’t forget to bring it with you.

Bike rentals are the responsibility of the rider. Rentals are available at UDC, 877.322.1667. New for this year … rental bike delivery. See UDC website for how to have your rental delivered to the hotel for $13.

Please plan on renting the bike the night before the ride since bike shops typically don’t open until 10:00 AM. You will need to provide the type of bike you want and size (or your height if you don’t know). If you have a cycling helmet, it is recommended that you bring it.

Please sign up early to ensure availability. You are also welcome to bring your own bike. To sign up or for questions, contact John La Salle at (631) 275-3370 or [email protected]. See page 61 for the route map. A flyer of the map will be distributed to the participants on the morning of the ride.

COMPANION PROGRAM Paid Companion Club members are welcome to visit the Companion Club Room, on the second level of the Hyatt in the Camino Real room. A delicious breakfast will be served from 8:00 AM to 10:00 AM. There will be packets of information about nearby museums and local attractions with plenty of options for local transportation. A day trip to San Francisco is only a train ride away. There will also be daily raffles!

Come join us for breakfast while you visit with old friends and meet new ones.

photo credit: Ken Wyatt

I would like to personally welcome each of you to the 2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity.

Santa Clara is a wonderful location with a plenitude of local attractions and, of course, it’s the home of some of the largest high-tech companies in the United States so I expect an active exhibit hall.

I would like to offer a big round of applause to all the Exhibitors whose continued support of the IEEE EMC & SI community is very much appreciated. I would also like to give a warm welcome to all the new Exhibitors and thank you for joining our event.

The Exhibit Hall Floor Plan is fantastic with many opportunities for conference attendees to observe and experience all of the great offerings the Exhibitors are sharing. For all the attendees, I challenge you to visit as many exhibitors as you can, thank them for their participation, and ask

them about the products and services they offer. I am one hundred percent sure you will gain additional knowledge with your interaction with our exhibitors.

I look forward to a rewarding symposium for all. If you require additional information or assistance, please don’t hesitate to contact me or John Vanella, our Conference Manager. Our contact information is on the IEEE 2015 EMC&SI website and on the committee page of this program.

Jim BaerEMCSI 2015 Exhibit Chair

Exhibits

81

Welcome to the Exhibits


Jim Baer, Exhibit Chair

SIGN UP NOW TO EXHIBIT AT EMC 2015 DRESDEN!

Discounts are available for exhibitors who participate in both Santa Clara and Dresden.

EMC 2015 Dredsen Exhibit Sales Contact:VDE e.V. - Conference ServicesHatice AltintasStresemannallee 1560596 Frankfurt am MainPhone +49(0)69 6308-477Fax: +49(0)69 6308-144E-Mail: [email protected]

Learn more and download the Exhibitor Kit from: www.emc2015.org

PRODUCT SHOWCASE

New for EMCSI 2015!

Exhibitor’s products and services will now be highlighted on the internet and will be accessible at EMCTV.tv.

New videos will be added daily!

Exhib

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Exhibit Hall Floor Plan


EXHIBIT HALL HOURS

TUESDAY 10:00 AM - 5:00 PM WEDNESDAY 9:00 AM - 5:00 PM THURSDAY 9:00 AM - NOON

Go to www.emc2015usa.emcss.org and click on “Exhibits - Exhibit Hall” for a virtual Exhibitor Map to use on your tablet or laptop during the event.

Exhibits

83

Exhibitor List


Ø 3G Metalworx Inc. . . . . . . . . . . . . . . 824

Ø A.H. Systems, Inc. . . . . . . . . . . . . . . 419

Ø A2LA - American Association for Laboratory Accreditation . . . . . . . 521

Ø Advanced Test Equipment Rentals . . . 502

Ø AE Techron, Inc. . . . . . . . . . . . . . . . 420

Ø Altair Engineering Inc. . . . . . . . . . . . 411

Ø Amphenol Canada . . . . . . . . . . . . . 831

Ø ANDRO Computational Solutions. . . 320

Ø Anechoic Systems L.L.C*. . . . . . . . . . . . 7

Ø ANSI-ASC C63 Committee on EMC . 908

Ø Applied Physical Electronics LC* . . . . . . 8

Ø AR RF/Microwave . . . . . . . . . . . . . . 202

Ø ARC Technologies, Inc. . . . . . . . . . . 734

Ø AP Americas . . . . . . . . . . . . . . . . . . 102

Ø Avalon Test Equipment Corp. . . . . . . 842

Ø Boonton/Noisecom* . . . . . . . . . . . . 821 (Wireless Telecom Group)

Ø CKC Laboratories, Inc. . . . . . . . . . . 720

Ø Com-Power Corporation . . . . . . . . . 714

Ø Communications and Power Industries CPI . . . . . . . . . . . . . . . . . . . . . . . . . . . 825

Ø Comtest / DMAS . . . . . . . . . . . . . . 219

Ø CST of America, Inc. . . . . . . . . . . . . 412

Ø Cuming-Lehman Chambers, Inc . . . 925

Ø D.L.S. Electronics Systems, Inc. . . . . . 324

Ø Detectus . . . . . . . . . . . . . . . . . . . . . 812

Ø EE - Evaluation Engineering . . . . . . . 920

Ø Electro Magnetic Applications, Inc. . . 822

Ø Electro Magnetic Test, Inc. . . . . . . . . . . 1

Ø Electro Rent Corporation* . . . . . . . . . . 2

Ø Elite Electronic Engineering Inc. . . . . 837

Ø EMCoS Ltd . . . . . . . . . . . . . . . . . . . 710

Ø EMC Partner AG . . . . . . . . . . . . . . . 602

Ø EMI Solutions Inc. . . . . . . . . . . . . . . . . 3

Ø Empower RF Systems . . . . . . . . . . . . 711

Ø ENR / Seven Mountians Scientific, Inc. . 6

Ø EOS/ESD Society, Inc. . . . . . . . . . . . 909

Ø ESDEMC Technology LLC . . . . . . . . . 321

Ø Espresso Engineering. . . . . . . . . . . . 904

Ø ETS-Lindgren . . . . . . . . . . . . . . . . . 402

Ø Exemplar Global / iNarte . . . . . . . . 120

Ø Fair-Rite Products Corp. . . . . . . . . . . 742

Ø Fischer Custom Communications . . . 110

Ø Gauss Instruments GmbH . . . . . . . . 602

Ø HAEFELY HIPOTRONICS . . . . . . . . . 724

Ø HV Technologies, Inc. & Partners . . . 602

Ø IEEE 2015 International Symposium on Electromagnetic Compatibility . . . . . 924

Ø IEEE 2016 International Symposium on Electromagnetic Compatibility . . . . . 917

Ø IEEE Antenna and Propagation Society 906

Ø IEEE EMC Society . . . . . . . . . . . . . . 910

Ø IEEE EMC Society History Committee 913

Ø IEEE EMC Society Standards . . . . . . . 902

Ø IEEE PSES - Product Safety Engineering Society . . . . . . . . . . . . . . . . . . . . . . . . 4

Ø In Compliance Magazine . . . . . . . . . 624

Ø Innco Systems GmbH . . . . . . . . . . . 602

Ø Interference Technology / ITEM Media 702

Ø Keysight Technologies . . . . . . . . . . . 618

* NEW EXHIBITOR


Exhibitor ListEx

hibits

Ø Kitagawa Industries America, Inc. . . . 523

Ø Laboratory Accreditation Bureau . . . . 15

Ø Laird . . . . . . . . . . . . . . . . . . . . . . . 942

Ø Langer EMV-Technik GmbH* . . . . . . 736

Ø Liberty Calibration Corps . . . . . . . . . 835

Ø MET Laboratories . . . . . . . . . . . . . . . 13

Ø Metal Textiles Corporation . . . . . . . . 814

Ø Michigan Scientific Corp. . . . . . . . . . 124

Ø mk-messtechnik GmbH . . . . . . . . . . 907

Ø Montena Technology sa . . . . . . . . . . 602

Ø Moss Bay EDA/IBM . . . . . . . . . . . . . 808

Ø MVG . . . . . . . . . . . . . . . . . . . . . . . 202

Ø National Technical Systems (NTS) . . . 901

Ø National Voluntary Laboratory Accreditation Program (NVLAP) . . . . . . . . . . . . . . . 926

Ø NEC TOKIN . . . . . . . . . . . . . . . . . . 802

Ø Newtons4th NA* . . . . . . . . . . . . . . . . 10

Ø NEXIO . . . . . . . . . . . . . . . . . . . . . . 223

Ø NoiseKen . . . . . . . . . . . . . . . . . . . . 222

Ø Nolato Silikonteknik AB* . . . . . . . . . 718

Ø Northwest EMC Inc. . . . . . . . . . . . . . 424

Ø Oak-Mitsui . . . . . . . . . . . . . . . . . . . 820

Ø OnRule . . . . . . . . . . . . . . . . . . . . . . 732

Ø Ophir RF Inc. . . . . . . . . . . . . . . . . . 610

Ø Orbis Compliance LLC* . . . . . . . . . . 738

Ø Panashield . . . . . . . . . . . . . . . . . . . 708

Ø Pearson Electronics Inc. . . . . . . . . . . . . 9

Ø Polar Instruments . . . . . . . . . . . . . . . . 16

Ø Prana . . . . . . . . . . . . . . . . . . . . . . . 602

Ø Reliant EMC . . . . . . . . . . . . . . . . . . 841

Ø RF Exposure Lab . . . . . . . . . . . . . . . 807

Ø Rigol Technologies . . . . . . . . . . . . . . 717

Ø Rohde & Schwarz USA, Inc. . . . . . . . 102

Ø Safety & EMC China . . . . . . . . . . . . . . 5

Ø Schlegel Electronic Materials, Inc. . . . 519

Ø Schmid & Partner Engineering AG . . 811

Ø Schurter Inc. . . . . . . . . . . . . . . . . . . 712

Ø SE Labs A Tres=cal Company* . . . . . 322

Ø SGS North America . . . . . . . . . . . . . 833

Ø SIEMIC, Inc.* . . . . . . . . . . . . . . . . . . 14

Ø SIEPEL . . . . . . . . . . . . . . . . . . . . . . 602

Ø Solar Electronics Company* . . . . . . . 815

Ø Specialty Silicone Products* . . . . . . . 122

Ø Spira Manufacturing Corporation . . . 220

Ø Sunol Sciences Corp. . . . . . . . . . . . 1034

Ø TDK RF Solutions, Inc. . . . . . . . . . . . 319

Ø TDK-LAMBDA Americas-HP Division . 826

Ø Teseq Inc. – . . . . . . . . . . . . . . . . . . 212 a unit of AMETEK Compliance Test Solutions

Ø TestWorld, Inc.* . . . . . . . . . . . . . . . . 224

Ø The IET/SciTech Publishing . . . . . . . . 809

Ø Thermo Fisher Scientific . . . . . . . . . . 801

Ø TMD Technologies . . . . . . . . . . . . . . 823

Ø TUV Rheinland . . . . . . . . . . . . . . . . 810

Ø Universal Sheilding Corp . . . . . . . . . 941

Ø US Microwave Laboratories . . . . . . . . 11

Ø V Technical Textiles, Inc./ Shieldex U.S. 12

Ø Vanguard Products Corporation . . . . 323

Ø Vectawave . . . . . . . . . . . . . . . . . . . 722

* NEW EXHIBITOR


ExhibitsExhibitor Profiles

3Gmetalworx Inc.Booth 824

Granata Elisabeth90 Snow BlvdUnit 2Concord, Ontario L4K 4A2 CanadaTel: (289) 845-3506Email: [email protected]: http://www.3gmetalworx.com

ManufacturersShielding Products & Materials

3Gmetalworx manufacturers PCB-level RF/EMI shielding metalwork and microwave absorbers for electronic devices of all kinds.

A2LABooth 521

Adam Gouker5202 Presidents CourtSuite 220Frederick, Maryland 21703 USATel: (301) 644-3248Email: [email protected]: http://www.A2LA.org

Associations Societies Committees Other - Accreditation

A2LA is a non-profit membership association, established in 1978, and has accredited over 2000 organizations for various conformity assessment activities, including testing, calibration, inspection, proficiency testing, reference materials, and product certification. A2LA is recognized by the Navy as an accreditor of testing labs performing MIL-STD-461 EMI qualification testing, and by the FCC for the testing of telecommunication equipment. A2LA is

also recognized by NIST as an accreditation body for the U.S. (FCC), Canada (IC), Singapore (IDA), Hong Kong (OFCA), and Japan (MIC) product certification schemes for telecommunication equipment. Please stop by our booth for further information on our accreditation programs.

Advanced Test Equipment RentalsBooth 502

George Bollendorf10401 Roselle St San Diego, CA 92121 USATel: (888) 544-2832 Website: www.atecorp.com

Equipment Resellers/Rentals

Advanced Test Equipment Rentals (ATEC), A2LA ISO 17025 certified for calibration, supplies complete testing solutions for EMC, Electrical, Power Quality, Environmental and similar testing applications for the Aerospace, Defense, Medical, Telecom and many other industries. ATEC takes pride in serving our customers for over 30 years with invaluable expertise and technical support.

AE Techron, Inc.Booth 420

Jim Bumgardner2507 Warren St.Elkhart, IN 46516 USATel: (574) 295-9495Email: [email protected]: http://www.aetechron.com

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Manufacturers Power Supplies Test & Measurement Equipment

AE Techron: The audio-bandwidth EMC experts. AE Techron DC-enabled AC amplifiers, power supplies and test systems are designed to meet the rigorous requirements of EMC testing. Their popular 7224 linear amplifier has been recognized by Ford for use in EMC-CS-2009 testing and features a DC to 300 kHz bandwidth. The 3110 Standards Waveform Generator, when combined with one or more AE Techron amplifiers, creates a complete universal audio bandwidth test system for Aviation (DO-160, MIL-STD-461) and Automotive testing (SAE J1113-22, ISO 16750-2, MILSTD1275, GMW3172). Other products offer solutions for power susceptibility and conducted immunity testing found in Telecom (GR 1089 Section 10/ATIS-0600315.2007).

A.H. Systems, Inc.Booth 419

9710 Cozycroft Ave Chatsworth, CA 91311 USATel: (818) 998-0223 Email: [email protected] Website: http://www.ahsystems.com/

ManufacturerAntennas and Antenna Products

A.H. Systems manufactures a complete line of affordable, reliable, individually calibrated EMC Test Antennas and Current Probes that satisfy FCC, MIL-STD, VDE, IEC and SAE testing standards. Delivering high quality products at competitive prices with immediate shipment plus prompt technical support for the entire product line are goals we strive to achieve at A.H. Systems. We provide rental programs for our equipment and offer Recalibration Services

for all our antennas and probes, including others manufactured worldwide. We take pride in providing a fast turn around schedule to help minimize any down time the customer may experience during testing. 100% inventory, NEXT-DAY ON-TIME DELIVERY.

Altair Engineering Inc.Booth 411

Biba Bedi100 Exploration WaySuite 310-BHampton, VA 23666 USATel: (757) 224-0548Email: [email protected]: www.feko.info

Software Development / Products

Altair (www.altair.com) offers state of the art engineering simulation suite -HyperWorks® which is widely used in the aerospace, automotive, and shipbuilding industries. FEKO®, a comprehensive electromagnetic simulation software tool, based on state of the art computational electromagnetics techniques, has been added recently to HyperWorks suite. FEKO’s typical applications include EMC/EMI (analysis of diverse problems including shielding effectiveness of an enclosure, cable coupling analysis in complex environments, e.g. wiring in a car, radiation hazard analysis), Antennas (analysis of horns, microstrip patches, wire, reflector, conformal & broadband antennas and arrays), Antenna placement (analysis of radiation patterns, hazard zones, etc. with antennas placed on large structures, e.g. ships, aircrafts armored car) Bio-electromagnetics (analysis of homogeneous or non-homogeneous bodies, SAR extraction), RF components (analysis of waveguide structures, e.g. filter, slotted antennas, directional couplers), 3D EM circuits: analysis of

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microstrip filters, couplers, inductors, Radomes (analysis of multiple dielectric layers in a large structure), Scattering problems (RCS analyses). Please visit FEKO booth # 411 at the EMCSI symposium for more information, articles & interesting demonstrations.

Amphenol CanadaBooth 831

Tony Condello605 Milner AvenueToronto, ON M1B 5X6 CanadaTel: (416) 754-5702Email: [email protected]: www.amphenolcanada.com

ManufacturerConnectorsFiltersPassive Electronic Components

Amphenol Canada is a worldwide leader in the development and manufacture of EMI Filter Connectors. Amphenol Canada‘s filter connectors are used in all market segments; Military/Aerospace, Space, Industrial, Medical, Commercial and the Gas and Oil markets. Our products include D38999, ARINC 600, ARINC 404, D24308 D-subminiature, M83513 Micro D-subs, D83527, RJ-45, USB interfaces, Filter Micro Ribbon, Filter BNC and M55116 Audio connectors, filter plates and terminal blocks. Amphenol ACC can provide standard versions and custom solutions to meet our customer’s requirements. Visit us at booth #429 or contact us at [email protected].

ANDRO Computational Solutions, LLCBooth 320

Jessica Griffin7980 Turin Rd, Bldg 1Rome, NY 13440-1934 USATel: (315) 334-1163Email: [email protected]: http://www.androcs.com

Research and Development

ANDRO provides research, engineering, and technical services to defense and commercial industries. The independently owned company, established in 1994, is dedicated to research, development, and the application of advanced computer software for a variety of applications including electromagnetic environment effects analyses of complex systems, computational electromagnetics, cosite modeling, research and development related to spectrum exploitation, secure wireless communications for cognitive radios, multisensor and multitarget tracking, advanced radar data fusion, and sensor resource management. The company is headquartered in Rome, NY and also has offices in Syracuse and Dayton, Ohio. For more information, visit www.androcs.com

Anechoic Systems LLCBooth 7

Barbara Sanchez14934 Budwin LanePoway, California 92064 USATel: (858) 212-1238Email: [email protected]: http://anechoicsystems.com

ManufacturerAnechoic Chambers/Materials

Anechoic Systems LLC is a San Diego, CA based company that specializes in the design, construction and assembly of electromagnetic test facilities. Anechoic Systems’ technology provides Electromagnetic Design and System Integration of complex electromagnetic measurement facilities for: EMC, Antenna Measurement, Compact Range and Radar Cross Section applications.Anechoic Systems LLC is a small, women owned business.


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ANSI-ASC C63 Committee on EMCBooth 908

Daniel D. Hoolihan32515 Nottingham Court - Box 367Lindstrom, MN 55045 USATel: (651) 213-0966 Email: [email protected]: www.c63.org

Associations/Societies/Committees

A United States Committee that develops EMC standards for use by the entire world. The committee meets twice a year and consists of about 30 organizations including the FCC, FDA, ITIC, Dell, Motorola Solutions, Apple, and the IEEE. Its well-known standards include C63.4, C63.5, C63.17, C63.19, C63.18 and many more. A Committee that is a standards-developing organization (SDO). The IEEE is the Secretariat for the Committee.

AP AmericasBooth 102

Timo Greiner1500 Lakeside Parkway, Suite 100-BFlower Mound, TX 75028 USATel: (972) 295-9100Email: [email protected]: www.apamericas.com

Manufacturer Anechoic Chambers/Materials Shielding Products & Materials

AP Americas, a subsidiary of the Albatross Projects Company, GmbH, Nattheim Germany is a leading supplier of absorber materials and test chamber solutions to the RF shielding and EMC-MW test markets. Bringing over 50 years of experience to the American shielding market. Offering turnkey solutions and inspiring systems

designed to fulfill your needs in the following disciplines:

Electromagnetic Compatibility: for EMI and EMS measurements to 40GHz, including all necessary infrastructure accessories.

Microwave: chambers to determine the antenna characteristics, design of antennas and chambers for Over-The-Air (OTA) measurements.

Medical/Magnetic Resonance Imaging: MRI shielding, MRI Accessories, MRI Testing and MRI Services

Defense/Government: shielded computer rooms, shielded conference rooms and shielded C“ operation Centers.

For more information, visit www.apamericas.com

Applied Physical Electronics, L.C.Booth 8

Richard SchreibPO Box 341149Austin, Texas 78734 USATel: (512) 264-1804Email: [email protected]: http://www.apelc.com

ManufacturersTest & Measurement Equipment

Since 1998, Applied Physical Electronics, L.C. has focused on the research and development of compact deployable Marx generators. Our novel designs have produced output pulses with ultrafast rise times, moderate pulse widths, and amplitudes ranging from kilovolts to megavolts. APELC develops Marx generator-based systems to support RF test and evaluation efforts, as well as electronic-defeat applications. The mission of Applied Physical Electronics is to ensure customer success. We accomplish this by delivering and supporting the EMI/EMC test community with the most robust equipment possible through a commitment to the highest standards of quality and American ingenuity. APELC specializes in EMP simulator solutions and offers complete

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EMP simulator systems and current-injection test systems that abide by the latest MIL-STD requirements. APELC also offers trigger-pulse generators, solid-state Marx generators, coaxial high-voltage connectors, and other accessories for high-power electronics.

ARC Technologies, Inc.Booth 734

Kate Healey37 S. Hunt RoadARC Technologies. Inc.Amesbury, MA 01913 USATel: (978) 388-2993Email: [email protected]: http://www.arc-tech.com

ManufacturerAntennas & Antenna Products Conductive Materials Shielding Products & Materials

Testing/Certification

ARC Technologies Inc. offers a complete range of absorber products that provide solutions to the diverse RF and EMI problems facing today’s military, aerospace, and commercial electronics design engineers. Whether a customer is facing these problems at 50 MHz or 110 GHz, nearfield or farfield, narrowband or broadband, the company has an absorber product or will develop an application-specific product to meet its requirements.

AR RF/MicrowaveBooth 202

160 School House RdSouderton, PA 18964 USATel: (215) 723-8181Email: [email protected] Website: www.arworld.us

ManufacturerAntennas and Antenna Products Test and Measurement Equipment

AR is your one source for RF/Microwave bench top and rack mounted broadband power amplifiers, amplifier modules, complete EMC test systems, EMI receivers, military communications booster amplifiers and more.

Our global company consists of AR RF/Microwave Instrumentation, AR Modular RF, AR Receiver Systems and AR Europe.

AR RF/microwave Instrumentation in Souderton, PA manufactures and distributes products that meet the vast range of EMC and wireless telecommunication standards:

• RF Power Amplifiers, 1 – 50,000 watts, dc – 1 GHz

• Microwave Amplifiers, 1 – 10,000 watts, 0.8 – 45 GHz

• Hybrid Power Modules, 1-6 & 4 – 18 GHz and custom design

• RF Conducted Immunity Test Systems• Electromagnetic Safety Products• Radiated Immunity Test Systems • EMC Test Software, accessories and RF Test

accessories

Visit www.arworld.us for more about the product offerings of all AR companies.

Avalon Test EquipmentBooth 842

Steve McIlhon1205 Activity DriveVista, California 92081 USATel: (760) 536-0191Email: [email protected]: http://www.avalontest.com

DistributorsEquipment Resellers/RentalsTesting/Certification Rentals, sales, and service of EMC test equipment. We specialize in renting Lightning and Automotive test equipment, and we now have a pre-compliance test lab testing to military standard MIL STD 461 and RTCA/DO160.


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Boonton/Noisecom (Wireless Telecom Group)Booth 821

Maria Droge25 Eastmans RdParsippany, NJ 07054 USATel: (973) 386-9696Email: [email protected]: www.wtcom.com

CKC Laboratories, Inc.Booth 720

Todd Robinson1120 Fulton PlFremont, CA 94539 USATel: (800) 500-4362Email: [email protected]: http://www.ckc.com


Outstanding service. Unparalleled quality. Global acceptance. EMC testing for all manner of electronic products: Aerospace, Medical, Military, Audio-Video, Measurement-Test, Transmitters and ITE. We are accredited for / listed with / recognized by: ACA, IC, BSMI, FCC, CE, VCCI, RRA and more. CKC is also appointed as a Certification body for FCC (TCB), Canada (CB) and Europe (Notified Body). Our Aerospace-MIL labs provide radiated susceptibility up to 40 GHz at 200 v/M, and multi-stroke, multi-burst lightning transient testing, and 3500 V/m HIRF testing.

Communications and Power Industries CPIBooth 825

811 Hansen WayPalo Alto, CA 94304 USATel: (650) 846-3921Email: [email protected]: www.cpii.com

Com-PowerBooth 714

Travise Miranda19121 EL Toro RoadSilverado, CA 92676 USATel: (949) 459-9600/ (855) EMI-2EMCEmail: [email protected]: www.com-power.com

Equipment Resellers/Rentals Manufacturer

Antennas & Antenna Products Test & Measurement Equipment

Com-Power is a leading supplier of EMC test instrumentation. We are a resource for EMC engineers looking for wide selection of products and unique solutions. Our products are well suited for an accredited EMC laboratory or for performing pre-compliance EMC testing and debugging at the factory. Com-Power product line includes antennas up to 40 GHz, Comb Generators, LISN, CDNs, power amplifiers for conducted immunity, directional couplers, near field probes, pre-amplifiers and much more. All our products are calibrated to the latest test standards and usually available from stock for immediate delivery. For added confidence, we offer industry’s best three year warranty. Please visit our website for additional details and product specifications. All products can be ordered directly from Com-Power or from distributors listed on our website.

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Comtest / DMASBooth 219

Bas de GrootComtest EngineeringIndustrieweg 12Zoeterwoude, Zuid-Holland 2314AJ NetherlandsTel: +31 715417531Email: [email protected]: http://www.comtest.eu

Manufacturers Anechoic Chambers / Materials Shielding Products & Materials

Controlled electromagnetic environments DMAS is a supplier of high performance polystyrene microwave absorbers suited for (semi) anechoic chambers enabling our customers to make the difference. Our product range consists of both hybrid (EMC) and broadband (microwave) absorbers. DMAS polystyrene absorbers are sustainable, environmental friendly and fully compliant with REACH and ROHS.

Comtest Engineering supplies high performance anechoic chambers, reverberation chambers and RF shielded rooms. Comtest is a privately owned, second generation family business and was founded in 1985. We are a professional organization and recognized for quality and flexibility. Our high performance RF shielded doors, mode-stirrer systems and microwave absorbers have been internationally recognized as state of the art products.

The comprehensive turnkey EMC test chamber solutions we offer:

• Anechoic chambers• Anechoic chamber upgrades• Reverberation chambers• RF shielded rooms & doors

Comtest skilled and experienced team is dedicated to satisfy your need to control the electromagnetic environment!

CST of America, Inc.Booth 412

492 Old Connecticut Path, Suite 505Framingham, MA 01701 USATel: (508) 665-4400Email: [email protected] Website: https://www.cst.com

Software Development/Products

CST is a world leader in computer simulation of radiated emissions and susceptibly. CST STUDIO SUITE® provides dedicated solvers and powerful features for complex EMC analysis including coupled simulations which allow for large system analysis and installed performance studies. Many years of in house expertise support the tools and give customers confidence in simulation results.

Cuming-Lehman Chambers, IncBooth 925

Steve Barnes5800 Cumberland Hwy.Chambersburg, PA 17202-7307 USATel: (717) 263-4101Email: [email protected]: www.cuminglehman.com

ManufacturerAnechoic Chambers/Materials Shielding Products & Materials

Cuming-Lehman Chambers, Inc. (CLCI) is a wholly owned subsidiary of Cuming Microwave,


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Inc. specializing in the design and construction of anechoic chambers and host facilities “tailor made” to fit your performance needs and personal preferences. Our highly skilled project managers provide CLCI with the capacity to be the total turnkey solution for all of your testing needs.

Products and Services: EMC as well as High Frequency anechoic chambers, host facilities, shielded rooms, doors and door repairs, filters, and Microwave Absorbers, dielectric materials, artificial dielectrics and radomes.

D.L.S. Electronic Systems, IncBooth 324

Jack Black1250 Peterson Dr Wheeling, IL 60090 USATel: (847) 537-6400Email: [email protected]: www.dlsemc.com


D.L.S. provides global EMC, Environmental and Product Safety compliance testing and consulting for commercial, industrial, military and avionic industries. D.L.S. is NVLAP certified, a Notified Body for EMC and R&TTE Testing for the EU, as well as offering testing to Lightning, HIRF, EMC and Environmental testing to RTCA DO-160G, and MIL STD 461 A-F. D.L.S. also tests to FCC, EU, CE, VCCI, IC, BSMI and other worldwide EMC

Specifications. D.L.S. also performs safety testing, including environmental to UL, CE, LVD, MDD, GS, IEC/EN specifications and participates in the CB program through our partner lab affiliations. D.L.S. is an iNARTE certified organization pursuant

to NAVAIR 2450.2 and is a certificated Product Our Environmental Lab is ACLASS Accredited. Safety agency for UL and cUL applications.

DetectusBooth 812

Neill Harlen45 Voyager Court NToronto, ON M9W 4Y2 CanadaTel: +1 416-674-8970Email: [email protected]: www.detectus.se

ManufacturerTest & Measurement Equipment

Detectus offers Automated Near-Field EMC Scanning systems for Emissions and Immunity. The scanning systems have motion in all 3 axis – X, Y and Z. We measure the intensity and location of a radiation source at a component level, board level, sub-assembly, or fully assembled level. The results of such a measurement can be shown as two- or three-dimensional colored contour maps. Image overlay offers further insight into the EMC issues. Automated report generation and data export allow for sharing of information. Utilize the system for EMC problems, Design issues and Product QA. Math functions allow for comparisons to help quantify product design changes.

EE - Evaluation EngineeringBooth 920

Jim Russell, Publisher2477 Stickney Point Road, Suite 221BSarasota, FL 34231 USATel: (941) 388-7050Email: [email protected]: evaluationengineering.com

Publishers

Celebrating more than 50 years, EE is the premier publication serving engineers, engineering managers, and corporate managers

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responsible for test and quality of electronic systems. Delivering monthly print and digital editions and daily e-newletters, EE provides indepth technical information and new product coverage to buyers and specifiers of EMC, semiconductors, medical, communications, RF, microwave, and wireless applications. EMC attendees qualify for a free subscription!

Please visit us in booth #920, or: www.evaluationengineering.com/subscribe

Electro Magnetic Applications, Inc.Booth 822

Cindy Johnson7655 W Mississippi Ave, Ste 300Lakewood, CO 80226 USATel: (303) 980-0070Email: [email protected]: www,ema3d.com

Software Development/Products Testing/Certification

Electro Magnetic Applications (EMA) is a world leader in the analysis of electromagnetic effects. Our expert staff and state-of-the-art software suite have helped countless businesses and government entities solve their electromagnetic design and certification challenges. From commercial airliners to wireless communication providers, we have provided consulting and analysis solutions to a wide variety of industries. We look forward to helping you get your product to market faster and with less cost.

Electro Magnetic Test, Inc.Booth 1

Jay Gandhi1547 Plymouth StreetMountain View, CA 94043 USATel: (650) 965-4000Email: [email protected]: http://emtlabs.com

Testing / Certification

Electro Magnetic Test, Inc. is a one stop solution for testing and International approval.

• Certified Accredited Test Laboratory (CATL) / OTA (Over-The-Air)

• Mobile WWAN technologies: GSM, GPRS, EDGE, WCDMA, HSPA, A-GPS, LTE

• Wireless Technologies: Bluetooth, RFID, and ETSI (802.11 a/b/g/n ac),

• DFS• FCC/IC/VCCI/AUSTEL/CE/BSMI/KCC

Electro Rent CorporationBooth 2

Ron Johnson6060 Sepulveda BlvdVan Nuys, California 91411 USATel: (800) 688-1111 ext 4525Email: [email protected]: http://electrorent.com


Electro Rent gives you alternative ways to acquire, implement and manage your test equipment resources. We provide new and used sales, flexible equipment rental and leasing arrangements and even full service solutions. With Electro Rent you can get the equipment you need, when you need it and at a cost that’s within your budget.


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Elite Electronic Engineering IncBooth 837

Steve Laya1516 Centre Circle Downers Grove, IL 60515 USATel: (630) 495 9770Email: [email protected]: www.elitetest.com


With over 60 years of testing experience and dedication to quality service, Elite Electronic Engineering is a leading EMC and environmental stress test laboratory specializing in Automotive Component & Whole Vehicle EMC, Military & Commercial Aviation, and FCC & CE Mark Testing/Certification services.

Elite capabilities include: Approved lab for all automotive OEMs, including Chrysler, Ford, and GM. Toyota, Nissan, Honda, Mercedes, BMW, Volkswagen, CAT, CNH, Deere, International, Paccar, Volvo and Freightliner. High Powered RF Immunity Testing up to 5,000V/m. FCC, Canadian & EU Wireless Transmitter Certification Services. Combined EMC & Environmental Stress Testing. Contact us today to see how we can help resolve your compliance needs.

EMCoS LtdBooth 710

Sophia Iosava27 Pekin StTbilisi 0160 GeorgiaTel: +995 32 2389091Email: [email protected]: www.emcos.com


EMCoS focuses on generation of special simulation software. Powerful simulation tools and techniques give the user manifold possibilities to solve complex EM problems in a fast and efficient manner. EMCoS products exploit leading methods and solutions that deliver fast and accurate results. The software is widely used in automotive, aircraft and naval industries. Application areas include: EMC in large systems, antenna simulations, complex harness processing, solutions for hybrid vehicles, shielding study, and PCB simulations.

EMC PARTNER AGBooth 602

Nick WrightBaselstrasse 1604242 LaufenSwitzerlandTel: +41 61 775 [email protected]

Manufacturer Test & Measurement Equipment

As specialists in high voltage impulse technology since 1994, EMC PARTNER AG has built a reputation delivering innovative solutions for commercial and industrial EMC immunity testing, indirect lightning on aircraft and component testing for a worldwide customer base. EMC PARTNER is continually expanding through new product lines and into new geographic areas. Based on our client’s needs and the evolving market, EMC PARTNER design both traditional EMC impulse generators and impulse test systems for evolving technology such as smart grid and smart meters. We pride ourselves in our commitment to our employees, the environment and our longstanding client relationships built through many years of outstanding quality and integrity.

EMC PARTNER has always aimed to be innovative with product design, not following the convention. TRA1000 launched EMC PARTNER onto the market in 1994 as the world’s first

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fully compact test generator for the European CE mark. TRA1000 was such a success that the company was able to invest in development of a complete new product line the Modular Impulse Generator (MIG) series based around a single module which can be connected in series or parallel to increase Voltage or Current. The MIG module has formed the basis of an impulse generator series extending up to 144kV and 100kA. Probably the most innovative product has been the ESD3000 which in 2002 was the only battery operated ESD generator up to 30kV and 13 years later this is still the case. The product line is evolving with the IMU series generators offering customers a fully modular design in 4kV, 6kV and 8kV impulse levels. Using the latest color touch panel control, IMU generators are another example of EMC PARTNER leading the way.

EMI Solutions Inc.Booth 3

Robert Ydens13805 Alton Parkway #BIrvine, CA 92618 USATel: (949) 206-9960Email: [email protected]: www.4EMI.com

ManufacturersConnectorsFerrite/Suppression ProductsFilters

EMI Solutions is a manufacturer of High Quality Filtering solutions for the Military, Aerospace and Medical Markets. We manufacture “drop In” Filter inserts as well as many levels of Filtered Connectors to meet your EMI Filtering needs. We offer Chip Capacitor up through Pi Filtering solutions with Many Custom designs and applications.

Empower RF SystemsBooth 711

Jason Launius316 West Florence AvenueInglewood, CA 90301 USATel: (310) 412-8100Email: [email protected]: www.empowerrf.com


Empower RF Systems is a leader in solid state, power amplifier solutions with frequency coverage up to 6 GHz. Our products utilize latest LDMOS and GaN device technologies and originate from an extensive library of “building block” designs with documented solutions ranging from basic function PA modules to complete, multifunction PA assemblies with embedded software and system controllers. Live demonstrations of industry leading, smallest size high power amplifiers will be underway throughout EMC & SI 2015. Visit us at Booth 711 and see for yourself - 20 to 1000 MHz, 1 kW PA in a 5U chassis and 500W in a 3U chassis, and a 1 to 3 GHz, 1 kW PA in a 5U chassis. The standard hardware and software architecture incorporated in these next generation platforms is truly unique. Customer specific configurations are also a key element of this product portfolio - stop by to discuss your requirements.


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ESD on electronic components, the Association has broadened its horizons to include areas such as textiles, plastics, web processing, cleanrooms, and graphic arts. To meet the needs of a continually changing environment, the Association is chartered to expand ESD awareness through standards development, educational programs, local chapters, publications, tutorials, certification, and symposia.

ESDEMC Technology LLCBooth 321

Fred Stevenson4000 Enterprise DriveSuite 103Rolla, Missouri 65401 USATel: (573) 202-6411Email: [email protected]: http://www.esdemc.com

Equipment Resellers/Rentals Manufacturers

Filters Power Supplies Static Control Test & Measurement Equipment Software Development / Products


ESDEMC Technology LLC develops high performance, innovative, and cost effective test and measurement solutions for ESD (Electrostatic Discharge), EMC (Electromagnetic Compatibility), high voltage, and RF applications. ESDEMC also provides top-level consulting services and customized design services.

World’s top-spec Transmission Line Pulser (TLP) System with pulse injection and IV Curve measurement up to 160A

ENR/Seven Mountains Scientific Inc.Booth 6

Tom and Jo ChesworthPO Box 650Boalsburg, PA 16827 USATel: (814) 466-6559Email: [email protected]: http://7ms.com

Publishers

The Electromagnetic News Report (ENR) is the oldest commercial publication in the EMC field and has proudly served the EMC community since 1972. If you need the latest industry news, advice from industry experts, products or publications, then you need to read ENR. Available in print or online digital PDF with digital archives for your convenience in the office or on the go. Published by Seven Mountains Scientific and EMC expert Dr. E. Thomas Chesworth, ENR is a bi-monthly journal read by about 1,000 senior EMC engineers, managers, purchasing and marketing executives, and testing lab personnel worldwide. Contact us for a free trial online digital PDF subscription.

EOS/ESD Association, Inc.Booth 909

Lisa Pimpinella7900 Turin Road, Building 3Rome, NY, 13440-2069 USAPhone: (315) 339-6937Email: [email protected]: www.esda.org


Founded in 1982, the ESD Association is a professional voluntary association dedicated to advancing the theory and practice of electrostatic discharge (ESD) avoidance. From fewer than 100 members, the Association has grown to more than 2,000 members throughout the world. From an initial emphasis on the effects of

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ETS-LindgrenBooth 402

Mark Prchlik1301 Arrow Point DrCedar Park, Texas 78613 USATel: (512) 531-6400Email: [email protected]: http://www.ets-lindgren.com

Manufacturers Anechoic Chambers / Materials Antennas & Antenna Products Filters Shielding Products & Materials Test & Measurement Equipment Software Development / Products

Testing / Certification Training & Seminars

ETS-Lindgren is an industry leader in the design, manufacture, and installation of systems and components for test and measurement. Our turnkey solutions are used worldwide for EMC/EMI/RFI/EMF/IEMI test and measurement applications as well as for medical, industrial, wireless, and governmental RF shielding requirements. Popular products include antennas; field probes, monitors, and positioners; RF and microwave absorber; shielded enclosures; and anechoic chambers, to name a few. Innovative software offered includes TILE!™ for automated EMC test lab management and EMQuest™ for fully automated 2- and 3-D antenna pattern measurement. Services provided include calibration at our A2LA accredited calibration lab and wireless testing at our CTIA Authorized Test Lab (CATL). Educational offerings include courses on EMC Fundamentals, Wireless/OTA and MIL-STD-461F that feature classroom study and hands-on lab sessions.

Visit us in booth 402 to see our new products: the EMField™ Generator - a unique, integrated solution for radiated immunity testing including

World’s top-spec Very-fast Transmission Line Pulser System (VF-TLP) with ultra-fast rise time, 60 ps, and analog measurement bandwidth, ≥ 6 GHz

World’s first commercial Cable Discharge Event (CDE) evaluation system

Innovative and cost-effective ESD Simulator with Current Probe

Universal Wideband Current Probe

Characterization System up to 4 GHzHigh voltage supply, measurement, and customized system design up to 100 kV

Customized high speed or RF system design up to 30 GHz

Electrostatic control and measurement solutions

EspressoEngineeringBooth 904

Mike Violette6731 Whittier Ave, Suite C110Mclean, VA 22101 USATel: (240) 401-1388Email: [email protected]: espressoengineering.tv

Associations/Societies/CommitteesEquipment Resellers/RentalsManufacturersTesting/CertificationTraining & Seminars

EspressoEngineering is the media channel forWashington Laboratories and American Certification Body. We specialize in covering engineering events, focusing on the live reporting of symposia, conferences and technical gatherings. At EMCS & SI 2015, we’ll be covering manufacturers, engineering companies and technical experts and feeding daily updates to our site at espressoengineering.tv.

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Fair-Rite Products Corp.Booth 742

Paul Zdanowicz One Commercial Row Wallkill, NY 12589 USATel: (845) 895-2055 Toll Free: (888) 324-7748Email: [email protected] Website: www.fair-rite.com

ManufacturerAntennas & Antenna ProductsFerrite/Suppression ProductsShielding Products & Materials

Fair-Rite Products Corporation manufactures a comprehensive line of ferrite components in a wide range of materials and geometries for EMI Suppression, Power Applications, and Antenna/RFID Applications. Fair-Rite is the first U.S. soft ferrite manufacturer to receive ISO/TS 16949:2002 certification. We place the highest value on quality, engineering, and service and are dedicated to continual improvement. In addition to our standard product offering, Fair-Rite can provide custom designs and shapes to meet your specific requirements. We have an experienced team of engineers to assist you with new design and technical support. Please visit fair-rite.com to view our new online catalog and find contact information for customer service, applications engineers, local sales representatives, and local distributors.

IEC/EN 61000-4-3; the EMCenter™ - a flexible platform that reduces system complexity and provides centralized control for making RF measurements; and DuraSorb™ polystyrene hybrid absorber – ideal for MIL-STD-461, ANSI C63.4, CISPR 16 and CISPR 25 test applications as well as for 3 and 5 meter range chambers.

Exemplar Global/iNARTEBooth 120

Sal Agnello600 N. Plankinton AveSuite 301Milwaukee, WI 53201 USATel: (414) 272-3937Email: [email protected]: http://narte.org

Associations Societies Committees Testing / Certification

Exemplar Global is the world’s largest non-profit accredited personnel certification body, offering a wide range of professional certifications, including iNARTE.

iNARTE, now a program of Exemplar Global, has certified qualified engineers and technicians for over 30 years. Current certification fields include Telecommunications, Electromagnetic Compatibility/Interference (EMC/EMI), Product Safety (PS), Electrostatic Discharge control (ESD) and Wireless Systems Installation. More than 16,000 engineers and technicians have met iNARTE’s certification requirements of education, training, experience, peer references and examination.

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ManufacturerTest & Measurement EquipmentSoftware Development/Products

Training & Seminars

As a leading manufacturer of EMC test receivers and customized test solution provider GAUSS INSTRUMENTS established the next generation of EMI test receivers during the last decade boosting your EMC test capabilities ahead by its unrivaled technology and speed. Bringing a novel, well approved, technological approach to the settled EMC test and product certification market our instruments provide a blazing measurement speed - a factor of 64000 faster than previous receiver technologies.

The instruments can be used for final product certification measurements as well as precertification testing according to civil (e.g. CISPR, EN, ...) as well as military or avionic (e.g. MIL461 or DO160) standards. GAUSS INSTRUMENTS products are saving time and money during your product development as well as final product certification process. Increasing the quality of precertification measurements makes final product certification more relaxed, especially when tested with the most modern EMI test receivers of GAUSS INSTRUMENTS setting the benchmark in measurement speed and accuracy in EMC testing. The multifunctionality of having a combined EMI receiver, click rate analyzer, spectrum analyzer, real-time spectrum analyzer and an oscilloscope in a single box allows to fulfill all the demands of advanced analysis and testing of today’s most complex electronic equipment, systems and beyond. We develop and manufacture high-performance instruments tailored to your specific requirements and complex measurement tasks and providing an additional benefit by accelerating test and measurement procedures, increasing the performance and boosting the capabilities of today’s testing for compliance as well as product development.

Fischer Custom CommunicationsBooth 110

David Fischer20603 Earl StreetTorrance CA 90503 USAPhone: (310) 303-3300Email: [email protected] site: www.fischercc.com

Manufacturer

Fischer Custom Communications, Inc. is the leading designer and manufacturer of• Current Monitor Probes• Bulk Current Injection Probes• LISN’s• CDN’s• EM Injection Clamps• TLISN’s• TEM Cells• CMAD’s• Telecom Surge CDN’s

Our calibration laboratory is accredited to ISO/IEC 17025:2005 by A2LA

GAUSS INSTRUMENTS GmbH Booth 602

Arnd FrechAgnes-Pockels-Bogen 1Munich, Bavaria 80992 GermanyTel: +49 89 5404 6990Email: [email protected]: www.gauss-instruments.com

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HV TECHNOLOGIES, IncBooth 602

Jason Smith 8526 Virginia Meadows DrManassas, VA 20109 USA Tel: (703) 365-2330Email: [email protected] Website: www.hvtechnologies.com

Manufacturer Test & Measurement Equipment

HV TECHNOLOGIES, Inc. (HVT), with our partners: EMC Partner, Prana, Gauss, Montena, Innco Systems, Siepel, and Pontis EMC are focused on providing our clients with top quality, full compliant EMC test instruments. Our staff has been supporting the EMC testing community by designing, producing, and distributing the best in EMC test instruments for over two decades. We cover all aspects of EMC testing for immunity and emissions. When using our products, customers experience the most reliable test instruments with the cleanest most repeatable measurements. This has been possible through innovative product design and the deployment of unique leading-edge technologies. The highest level of support is our main focus and part of every product. Offering Equipment: ESD, Surge, EFT, Lightning, EMI Receivers, Class A amplifiers, Reverberation and Anechoic Chambers, Turntables, Antenna Masts, Hardened Camera EMC Systems, Antennas, EMP Systems… We have the products, delivery, and support you need today and for years to come.

HAEFELY HIPOTRONICSBooth 724

Jay Patel1650 Route 22 NBrewster, NY 10509 USATel: (845) 230-9240Email: [email protected]: www.hipotronics.com


As a leader in the field of EMC, HAEFELY HIPOTRONICS has a full range of conducted immunity test equipment designed to simulate the effects of interference sources on electronic, electrical and telecommunications products. Most prevalent and included in both IEC and EN product standards are the “classic” EMC tests for electrostatic discharge (ESD), electric fast transient/burst (EFT), lightning surge, magnetic fields (MF), and power line quality. Our objective is to provide the best-in-class range of instruments that are flexible enough to be used in many applications including CE Marking, product development, type verification, product safety, component and production testing for IEC, EN, IEEE, ANSI, UL, and other standards.

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Exhibitor Profiles


For the first time ever, the 2016 IEEE International Symposium on Electromagnetic Compatibility & Signal Integrity will be held in Ottawa, Canada from 25 – 29 July 2016. The Ottawa Region is known as Silicon Valley North and is a hub of technological enterprise and government research making it an ideal location for hosting EMC 2016.

The premier event of the IEEE EMC Society will be building on past successes and joining with the Signal Integrity / Power Integrity community to once again present a joint symposium.

The General Chair for EMC 2016, Kris Hatashita and the Vice Chairs, Wahab Almuhtadi and Qiubo Ye, invite EMC and SI professionals, academics and researchers to convene with hundreds of international experts in the field to learn, exchange ideas and engage in professional development in Canada’s Capital City.

IEEE Antenna and Propagation SocietyBooth 917

Levent SevgiOkan University Akfirat - TuzlaISTANBUL, Tuzla 34959 TurkeyTel: 0 (216) 677 16 30 - 2020 Ext: 2468Email: [email protected]: http://www.ieeeaps.org


The IEEE Antennas and Propagation Society consists of 8,000 members and over 100 chapters worldwide. The society offers a field of interest with strong relevance to the EMC community. Focus areas include antenna analysis, design, development, measurement, calibration and testing. APS also encompasses radiation, propagation, and the interaction of electromagnetic waves with discrete and continuous media. The society further focuses on applications and systems pertinent to antennas, propagation, and sensing, such as applied optics, millimeter- and sub-millimeter-wave techniques, antenna signal processing and

IEEE 2015 International Symposium on Electromagnetic CompatibilityBooth 924

Janet O’Neil c/o VDE e.V. - Conference ServicesStresemannallee 15 Frankfurt am Main, non 60596 Germany Tel: +49 (0)69 6308 381Email: [email protected] Website: www.emc2015.org Associations/Societies/Committees The IEEE EMC Symposium is taking a journey to the heart of Europe to team up with EMC Europe, the well-established forum for the European EMC Community. Don’t miss the first IEEE International EMC Symposium hosted in Central Europe connecting EMC experts from around the globe in the beautiful baroque city of Dresden. Papers have been reviewed by a high level technical committee consisting of the IEEE EMC Society AND EMC Europe technical committees. Attendees will have the opportunity learn about the latest developments in global EMC. There will be a special focus on Automotive EMC and new requirements due to e-Mobility as well as the increasing use of Wireless Technologies, Electromagnetic Pulse (EMP), Intentional Electromagnetic Interference (IEMI), Computational Electromagnetics, Signal and Power Integrity (SI/PI) and EMC Measurements. The social events will be hosted in some of Dresden’s most charming locations and offer plenty of networking opportunities with your EMC colleagues from around the world.

IEEE 2016 International Symposium on Electromagnetic Compatibility Booth 916

Kris HatashitaPO Box 13159Ottawa, Ontario K2K1X3 CanadaTel: (613) 791-9001Email: [email protected]: http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=19963

Associations Societies Committees Other - IEEE Symposium

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IEEE EMC Society StandardsBooth 902

Alistair [email protected]: www.emcs.org/standards/index.html

Associations Societies Committees

The role of standards and standardization within the IEEE EMC Society has several strands, which include:1. It is a measure of the impact of the work of

the Society membership2. It encourages common techniques to be used

throughout the profession3. It encourages research and development in

areas of interest and relevance to the EMC community

The EMC Society works towards achieving this through two main committees:

• The Standards Development and Education Committee (SDECom) which is the official sponsor for, and oversees the development of, EMC standards as well as undertaking education and training activities on standards themselves and the development of standards.

• The Standards Advisory and Coordination Committee (SACCom) is responsible for providing technical liaison between the IEEE EMC Society Standards Development Committee and various non-IEEE entities involved with EMC standards activities.

Come by the booth to see what the EMC Society is doing in standards currently, what it has produced and to discuss how you can be involved.

control, radio astronomy, and propagation and radiation aspects of terrestrial and space-based communication, including wireless, mobile, satellite, and telecommunications.

IEEE EMC SocietyBooth 910

Robert (Bob) Davis (VP for Member Services)8415 Woodbox RdManlius, NY 13104 USATel: (315) 456-1085Email: [email protected]: www.ieee.org/emcs


The EMC Society Sponsors a Membership Booth that is there to answer membership related questions and general questions on the EMC Society, including Society activities. The Membership Booth also distributes membership related information, including providing applications for new members to join. The EMC Society also runs a promotion for FREE new one year IEEE and EMC Society memberships; details are provided in a flyer located in your tote bag.

IEEE EMC Society History CommitteeBooth 913

Daniel D. HoolihanPO Box 367Lindstrom, MN 55045 USATel: (651) 213-0966

The EMC Society’s History Committee sponsors a booth that distributes information on the history of the EMC Society. It includes a small display of older EMC test equipment and usually you can find a Founder or a Past-President of the Society populating the booth. Stop by and learn from the experienced members of the EMCS about the “old days” in the EMC Society.

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Exhibitor Profiles


Innco systems GmbH Booth 602

Thorsten SchloderErlenweg 12Schwarzenfeld, Bavaria 92521 GermanyTel: +49 9435/301659-0Email: [email protected]: www.inncosystems.com

ManufacturerAnechoic Chambers/MaterialsAntennas & Antenna ProductsShielding Products & MaterialsTest & Measurement Equipment

Innco Systems GmbH is one of the world’s leading manufacturers of positioning systems for EMC (EMI/EMS), Wireless, OATS, RF, RCS and HF, Measurement and Testing Applications. The company specializes in the design and manufacture of positioning systems, from standard products to custom designs. With all products manufactured in Germany, only the highest quality system is provided to a worldwide customer base.

Interference Technology/Item MediaBooth 702

Graham Kilshaw1000 Germantown Pike Suite F2Plymouth Meeting, PA 19462 USATel: (484) 688-0300Email: [email protected]: http://www.interferencetechnology.com/

Publishers

Interference Technology specializes in EMI (Electromagnetic Interference) and EMC (Electromagnetic Compatibility) with a unique focus on solving EMI problems in today’s electronic equipment. Keep up-to-date on the latest information by registering for their free newsletter and publications at www.interferencetechnology.com. Interference Technology is also the host of EMC LIVE, a series of practical, online, and free-to-attend EMC events. Learn more today at www.emclive2015.com.

IEEE PSES - Product Safety Engineering Society Booth 4

Thomas Ha154 South Cypress StreetOrange, CA 92866 USATel: (714) 628-1020Email: [email protected]: http://ewh.ieee.org/soc/pses/

Associations Societies Committees Checked

The IEEE Product Safety Engineering Society focuses on the theory, design, development and practical implementation of product safety engineering methodologies and techniques for equipment and devices. This includes the study and application of analysis, techniques, construction topologies, testing methodologies, conformity assessments and hazard evaluations. The Society provides a focus for cooperative activities, including the promotion of product safety engineering for the benefit of humanity.

In Compliance MagazineBooth 624

Sharon Smith531 King St. Suite 5Littleton, MA 01464 USATel: (978) 486-4684Email: [email protected]: http://incompliancemag.com

Publishers

In Compliance is a leading source for news, information, and resources for electrical engineering professionals. We provide coverage on the latest standards updates, global compliance news, and engineering developments as well as technical explanations & guidance to over 17,500 electrical engineering professionals worldwide. Discover the latest design practices and testing tips, stay current with important updates, learn fundamental concepts, explore current events, and more!

Visit incompliancemag.com to start exploring and to activate your free subscription.

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management products as well as plastic components. We offer a wide variety of EMC solution products such as EMI Absorbers, EMI Gaskets, EMI Tapes, EMI Ferrites, Cable Shielding Materials, and EMI Grounding Components. The thermal solutions we offer are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, medical devices, power supplies, wireless devices, and the automotive industry. New products will be displayed at the show, including our CPAG series, dual-function silicone-free thermal and vibration management material.

Laboratory Accreditation Bureau Booth 15

Pat Douglass 11617 Coldwater Rd. Ste 101Fort Wayne, IN 46845Tel: (260) 637-2705Email: [email protected] Website: www.l-a-b.com

Associations/Societies/Committees Testing/Certification

Laboratory Accreditation Bureau (L-A-B) is proud to announce that the FCC’s Office of Engineering and Technology (OET) now accepts L-A-B accreditation for testing laboratories seeking recognition by the Commission to perform testing of telecommunications equipment subject to the Commission’s rules. L-A-B’s accredited EMC laboratories in this program may test product to be placed on the market with no further government approval for EMC criteria. This recognition is an honor and a result of many years of hard work by our dedicated professional staff and expert technical advisory group. Laboratory Accreditation Bureau (L-A-B) is the A-S-B division that accredits testing and calibration laboratories. L-A-B is a multi-service laboratory accreditation division covering many different fields with related disciplines. The laboratory accreditation division is specified by regulators and specifiers for the delivery of ISO/IEC 17025 accreditation.

Keysight Technologies Booth 618

Lenora Brown-Scott3750 Brookside Parkway, Suite 100Alpharetta, GA 30022 USATel: (404) 244-3137Email: [email protected]: keysight.com


Keysight Technologies Technology is advancing at a rapid pace and EMC testing is necessary to the success of this progress. No longer are the boundaries of EMC testing relegated to open area test sites, C30 laboratories and text books; they are becoming part of our daily lives. Join us in booth 618 along with industry peers to understand how Keysight’s design and test solutions contribute to the progress.

KITAGAWA INDUSTRIES America, Inc. (formerly Intermark (USA), Inc.)Booth 523

Rina Tsujimoto2325 Paragon Drive, Suite 10San Jose, CA 95131 USATel: (408) 971-2055Email: [email protected]: www.kgs-ind.com

ManufacturerConductive MaterialsFerrite/Suppression ProductsFiltersPassive Electronic ComponentsShielding Products & Materials

Training & Seminars

Intermark USA Inc (A Kitagawa Company) is a leading provider of EMI solution products, thermal solution products, shock/vibration

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Langer EMV-Technik GmbH is a German company that focuses on research, development, production and further training in the field of electromagnetic compatibility (EMC).Our interference emission and interference immunity EMC measurement technology as well as the IC test system are used mainly in the development stage and are in worldwide demand. The EMC know-how and measurement technology from Langer EMV-Technik GmbH allow developers and designers to gain new insights into and establish more efficient work strategies for module and IC development.

The individual consultancy services provided by Langer EMV-Technik GmbH in the field of EMC during development help developers and designers find solutions to complex EMC problems in IC, device and module development fast.

We make our research results and comprehensive EMC know-how available to the public via practical experimental EMC seminars and in-house events.

Liberty Calibration CorpsBooth 835

Michael Howard1346 Yellowwood RoadKimballton, IA 51543 USATel: (712) 773-2199Email: [email protected]: http://www.libertycalibrationcorps.com


The Liberty Calibration Corps group consisting of Liberty Labs, World Cal, & ISOCAL Labs can now offer complete calibration service for all your electronic and mechanical/dimensional instruements at any of our 3 locations or onsite at your facilities location. Please check out our website for more details.

LairdBooth 942

Karl von Gunten3481 Rider Trail SouthEarth City, MO 63045 USATel: (636) 898-6000Email: [email protected]: www.lairdtech.com

ManufacturerAntennas & Antenna ProductsConductive MaterialsFerrite/Suppression ProductsPassive Electronic ComponentsStatic ControlShielding Products & Materials

Laird is a global technology company focused on providing systems, components and solutions that protect electronics from electromagnetic interference and heat, and that enable connectivity in mission critical systems through wireless applications and antenna systems. Products are supplied to all sectors of the electronics industry including the smartphone, telecommunications, data transfer, information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.

Laird, a unit of Laird PLC, employs over 9,000 employees in more than 50 facilities located in 19 countries.

Langer EMV-Technik GmbHBooth 736

Jörg HackerNöthnitzer Hang 31Bannewitz, Saxony 01728 GermanyTel: +49 351 430093 0Email: [email protected]: http://www.langer-emv.com

Manufacturers Shielding Products & Materials Test & Measurement Equipment

Software Development / Products Training & Seminars

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RF testing. MET is an A2LA-accredited and a FCC-designated Telecommunication Certification Body (TCB), fully authorized to test and certify to all applicable FCC regulations, and an Certification Body (CB) for Industry Canada. MET has developed numerous international MRAs, issuing EMC test reports accepted by many countries outside of North America. As a Conformity Assessment Body (CAB), MET can issue Notified Body Opinions to the R&TTE and EMC Directives.

Michigan Scientific Corp.Booth 124

321 East Huron StreetMilford, MI 48381 USATel: (248) 685-3939 Fax: (248) 684-5406Email: [email protected]: www.michsci.com

Fiber-Optic LinksManufacturer

Michigan Scientific Corporation is a leading manufacturer of Fiber-Optic Systems that provide RF immunity for signals that are linked to/from equipment under test during automotive component and full-scale vehicle electromagnetic compatibility (EMC) engineering and testing.

MSC Fiber-Optic Systems have earned a reputation for superior stability and immunity that is necessary for monitoring equipment when it is used for EMC testing.

On display are F-O Links for Monitoring/Sourcing Analog, Digital, Video and Audio signals. Other Links provide the means for Stimulus/Control and Latching Relays for remote ON/OFF Power and Signal Switching. A FO-CAN Link with differential CAN Signals rates up to 1Mbit/s is also displayed.

Metal Textiles CorpBooth 814

Rick Witty970 New Durham RoadEdison, New Jersey 08818 USATel: (732) 287-0800Email: [email protected]: http://www.metexcorp.com

ManufacturerConductive MaterialsStatic ControlShielding Products & Materials

Metal Textiles Corp. has been solving EMI/RFI/ESD interference problems for Engineers since 1944. We manufacture Standard & Engineered Shielding products for Military, Government, Manufacturing, and Commercial Electronic Industries. Our complete product line includes wire mesh and metal tape, wire mesh gasketing, combo strips, metalized fabric over foam, conductive elastomers, conductive foam, fingerstock, EMI windows, vent panels, and value added assemblies.

We are an ITAR, ISO/TS 16949, and ISO 9001 registered company, we offer technical and customer support with competitive pricing and on time delivery.

MET Laboratories Inc.Booth 13

Sara Lincoln914 W. Patapsco Ave.Baltimore, MD 21230 USATel: (410) 354-3300Email: [email protected]: http://www.metlabs.com


MET Labs, an independent ISO/IEC 17025 laboratory, provides testing and evaluation of products according to a broad range of domestic, foreign, commercial, and military EMC/EMI specifications, including wireless and

Exhibits

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Exhibitor Profiles


Montena Technology sa Booth 602

François Voleryroute de montena 891728 RossensSwitzerland Tel : +41 26 411 84 84Fax : +41 26 411 17 79Email: [email protected]

Manufacturer

Test & Measurement Equipment

Montena Group has been active in manufacturing of capacitors, light bulbs, high voltage, and process automation since the 1960s. In 1975, Montena began laying its foundation and core competencies in EMC. Today, Montena is a leader in EMC technology in Switzerland with more than 30 years of experience in electromagnetic compatibility, radio-communications, and in the electrical safety of such equipment. Montena technology, specialized in the field of high voltage and high speed pulse generators, combines competences in electrical and mechanical engineering. Montena’s engineering staff masters many technologies such as pulse generators ranging from picoseconds (10¯¹² ) to microseconds (10¯⁶) rise time, with high voltage – current discharge and very precise waveforms (square, damped sinus, double exponential).Montena offers products for Avionics, Military, Automotive, Telecom, Commercial, CE Mark, Medical Electronics, IT Electronics, RF Test and Measurement, Protective Devices, and Components.

mk-messtechnik GmbHBooth 907

Torsten SchneiderZeppelinstrasse 1Notzingen, Baden-Württemberg 73274 GermanyTel: +49 7021 9566-925Email: [email protected]: http://www.mk-messtechnik.com

Fiber-Optic LinksManufacturers

FiltersTest & Measurement Equipment

Since 1999, the mk-messtechnik GmbH develops and produces electronic test and measurement equipment with a high immunity against electromagnetic fields.

Our high in-house production depth lets us generate the best solutions for reasonable prices at short notice.

We either can adapt our existing equipment to your needs or we develop and produce a new system according to your requirements.

Our core products are:Optical Transmission Camera - and Audio Systems (very small)

• Full-HD with 30fps or SD (Video, built-in Audio and Remote over one Fiber)• SD and HD Switch Matrix Systems with up to 20 Channels as well as cheap one Channel Solutions• Many optional functions: OSD, Recording, Motion Detection, network or joystick control,

Optical Transmission of Digital Signals in the Automotive Industry (automotive links)

• Standard optoCAN-LS/-SW/-HS/-FD / LIN / Flex etc as well as optoLVDS links

Optical Transmission of Analog Signals for Diverse Setups

• High Frequency Range, high Dynamic Range and/or many Channels at small Dimensions at a time

Optical Transmission of Industry Interfaces• optoUSB / LAN / LAN-GB as well as optoRS232 / 485 etc.

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antenna, RCS , and radome testing as well as wireless device certification.

Our products include full turn-key test systems, multi-probe arrays, anechoic chambers, antennas, software, positioning equipment, RF absorbers, and RF safety monitoring devices. We are also expanding our microwave technology into industrial material inspection. Our strengths are our broad product portfolio, worldwide presence, and integrated project management.

We are dedicated to supporting the Aerospace and Defense, Satellite, Telecom, and Automotive industries and well as academic R&D, RF safety and industrial material production.

National Technical Systems (NTS) Booth 901

24001 Ventura Boulevard, 200Calabasas, CA 91302 USATel: (800) 270-2516Email: [email protected]: www.nts.com

Software Development/ProductsTesting/CertificationTraining and Seminars

NTS is the largest independent provider of EMC services in North America with 8 locations to provide you with world-class product compliance services. Our state-of-the-art labs offer EMC, Product Safety, Wireless and Telecommunications engineering and compliance testing. Our expert engineers and test technicians take the time and put forth the effort to understand your business, your needs and your goals and combines this knowledge with our own compliance and testing expertise to help you create successful products.

Moss Bay EDA/IBM Booth 808

Gene Garat23889 NE 112th Cir #2Redmond, WA 98053 USATel: (206) 779-5345Email: [email protected]: www.mossbayeda.com


Provider of software tools to automate PCB EMC design review and improve first pass yields at the board level. Software is developed and maintained by IBM for their internal use and external sales. Use what IBM uses, corporate wide, to achieve 99% first pass yield at the board level.

MVGBooth 202

John Estrada2105 Barrett Park Drive Suite 104Kennesaw, Georgia 30144 USATel: (678) 797-9172Email: [email protected]: http://www.microwavevision.com/

Manufacturers Anechoic Chambers / Materials Antennas & Antenna Products Shielding Products & Materials Test & Measurement Equipment

MVG, or The Microwave Vision Group (SATIMO, ORBIT/FR, AEMI and REMC) delivers a range of innovative measurement solutions for EMC,

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Exhibitor Profiles


noise issues, utilizing our exclusive material technologies.

Available in thicknesses of 25 um to 1 mm , the Flex Suppressor is very effective in resolving:• RF Desense • high frequency noise generated by electronic

devices• high frequency noise generated by high

frequency current

The Flex Suppressor can be cut to desired shapes, and used in devices such as laptops, smart phones and tablets.

Newtons4th (N4L) Booth 10

3115-P N. Wilke RoadArlington Heights, IL 60004Tel: (847) 632-0992Fax: (847)-632-0993Email: [email protected]: www.newtons4th.com

ManufacturerPrecision Test & Measurement Equipment

Fully Compliant, ISO17025 Certified, Harmonic and Flicker Test Solutions to ISO61000-3-2, ISO61000-3-3, ISO61000-3-11, and ISO61000-3-12. These include single & 3-phase power analyzers, Impedance Networks, and AC+DC power sources, as well as complete dedicated systems. Newtons4th (N4L) is an established manufacturer of precision test and measurement equipment concentrating on Power and Frequency Response Analysis. Newtons4th NA handles sales, support, service and calibration for North & South America from the Chicago area.

National Voluntary Laboratory Accreditation Program (NVLAP)Booth 926

Vil Cheng100 Bureau DriveGaithersburg, MD 20899-2140 USATel: (301) 975-4016Email: [email protected]: http://www.nist.gov/nvlap

Government Agencies

The National Voluntary Laboratory Accreditation Program (NVLAP) provides third-party accreditation to testing and calibration laboratories. NVLAP’s accreditation programs are established in response to Congressional mandates, administrative actions by the Federal Government, and requests from private sector organizations and government agencies. NVLAP operates an accreditation system that is compliant wi1h ISO/IEC 17011, Conformity assessment- General requirements for accreditation bodies accrediting conformity assessment bodies, which requires that the competence of applicant laboratories be assessed by the accreditation body against all of the requirements of ISO/IEC l 7025, General requirements for the competence of testing and calibration laboratories.

NEC TOKINBooth 802

Hideyuki Inui2460 North First Street, Suite 220San Jose, CA 95131 USATel: (408) 324-1790Email: [email protected]: www.nec-tokin.com/english/

ManufacturerAnechoic Chambers/Materials Ferrite/Suppression Products Passive Electronic Components

NEC TOKIN’s Flex Suppressor is a paper-thin noise absorbing sheet that solves high frequency

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Noise Laboratory in Japan has been focusing on immunity test equipment and related solutions. Now our product lines include various types of immunity test equipment ranging from those conforming to IEC 61000-4 series standards, other international or national immunity standards and even to customer’s in-house test standards.

Nolato Silikonteknik ABBooth 718

Rodney BoydP.O. Box 179Rocky Face, GA 30740 USATel: (651) 955-9505Email: [email protected]: http://www.nolato.com/emc

ManufacturersConductive Materials Shielding Products & Materials

Successful EMI & Thermal management solutions!Nolato Silikonteknik is a world leading developer and supplier of material and know-how for EMI shielding solutions made of electrically conductive silicone. Visit our booth to learn about our experience and innovation!

NEXIOBooth 223

Olivier Roffe48 rue René SentenacToulouse 31300 France Tel: +33 561 440 247Email: [email protected]: www.nexiogroup.com


In a world of non-stop technological developments and rigorous quality requirements, EMC standards and test procedures evolve constantly. Keeping your test software up to date with all these changes can be a difficult task. NEXIO’s exclusive range of test automation software meets a wide range of current EMC emissions and immunity testing needs as well as having the flexibility to adapt to your specific testing environment. With over 120 user sites and over 20 years of experience, NEXIO can truly say that EMC is our thing. Our combination of EMC and software expertise as well as our commitment to user support has made our software a leading solution in both internal labs and accredited test houses worldwide.

NoiseKenBooth 222

Tony Tokuya1120 Avenue of the Americas 4th FloorNew York, NY 10038 USATel: (917) 484-7884Email: [email protected]: http://www.noiseken.com

DistributorManufacturer

Product Safety Compliance EquipmentTest & Measurement Equipment


NoiseKen - Specialist in pulsed EMI simulationFor over 30 years from its foundation in 1975,

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family of ultra thin laminate materials that has properties that minimize resonance, EMI, eliminates system noise, and improves signal and power integrity.

OnRuleBooth 732

Cyril Mecwan4800 Patrick Henry DriveSanta Clara, California 95054 USATel: (408) 204-2521Email: [email protected]: http://www.onrule.com/Software Development / Products

OnRule is the leading software to manage product regulatory compliance.

For Manufacturers: OnRule offers intuitive dashboards, secure document repository and collaboration tools to increase control, visibility, confidence and speed of their product certification processes.

For Test Labs and Certification Partners: OnRule provides a single platform to collaborate with customers, partners and team members. OnRule compliance partner tools are FREE for accredited labs and recognized certification partners. Visit our website and contact us to schedule a demo.

Ophir RF Inc. Booth 610

5300 Beethoven St Los Angeles, CA 90066 USATel: (310) 306-5556 x 209Email: [email protected] Website: www.ophirrf.com

ManufacturerTest and Measurement EquipmentProduct Safety Compliance EquipmentAntennas and Antenna Products

Designer and Manufacturer of High Power, Solid State RF and Microwave Amplifier modules, systems and integrated solutions


Northwest EMC, Inc.Booth 424

Alee Langford22975 NW Evergreen Pkwy Suite 400Hillsboro, OR 97124 USATel: (503) 844-4066Email: [email protected]: http://nwemc.com


Northwest EMC Inc. is an independent, accredited, commercial EMC compliance test laboratory. The company has locations in California, Minnesota, New York, Oregon, Texas, and Washington. Facilities include FCC listed 10M, 5M, and 3M chambers with a full complement of immunity and wireless testing capabilities. Visit Northwest EMC’s web site for more information.

Oak-Mitsui TechnologiesBooth 820

Robert Carter80 First StHoosick Falls, NY 12090 USATel: (513) 313-1905Email: [email protected]: www.oakmitsui.com

ManufacturerFiltersPassive Electronic ComponentsShielding Products & Materials

Oak-Mitsui Technologies is the leading global company at developing and manufacturing advanced technology ultra thin laminates for Embedded Capacitance for current and next generation PCBs, modules, and package substrates. FaradFlex® is the market leading


Panashield LLC, A Braden Shielding Systems CompanyBooth 708

Peggy Girard9260 Broken Arrow ExpresswayTulsa, Oklahoma 74145 USATel: (203) 866-5888Email: [email protected]: http://www.panashield.com

ManufacturerAnechoic Chambers/MaterialsShielding Products & Materials

Panashield, A Braden Shielding Systems Company, provides EMC facilities servicing commercial and government clients. Our products and services include RF Shielded Enclosures and EMC Chambers for radiated emissions and immunity testing, wireless, antenna measurement, automotive, military and aerospace. For 25 years we have been committed to providing our clients with expertise reflecting current developments and specifications in the global electromagnetic compliance industry.

Pearson Electronics Inc.Booth 9

Douglas Albrecht4009 Transport StreetPalo Alto, CA 94303 USATel: (650) 494-6444Email: [email protected]: www.pearsonelectronics.com


Pearson Electronics manufacturers Precision Wide Band Current Probes used for accurate

ORBIS COMPLIANCE LLCBooth 738

Elizabeth Perrier15105 Concord Circle, Suite # 230Morgan Hill, California 95037 USATel: (408) 722-6636Email: [email protected]: http://orbiscompliance.com


ORBIS Compliance is the complete Latin American product regulatory compliance solution. Our mission is to dramatically accelerate our clients’ time to revenue while providing best-in-class professional project management with complete transparency. We do this by working directly with Regulators and certifying products without intermediaries.

Strategically headquartered in Silicon Valley, ORBIS provides manufacturers access to our one of a kind compliance network, offering exceptional in-country engineering support for testing in key countries like Brazil, Mexico, Argentina and Ecuador. This key asset allows our clientele to gain back control on how their products are being tested and follow them to successful completion.

Our extensive knowledge of all country laws and regulations assures improved lead times and smooth project execution. ORBIS Compliance offer services in all South American and Central American countries including the Caribbean and Mexico.

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itsExhibitor Profiles


ManufacturerBroadband power amplifiersBulk Current injection probesCouplersSwitching matrixesRF cables

Prana, belongs to the worldwide leading manufacturers of RF Power Amplifiers for Broadband applications such as EMC testing, instrumentation and radio-communication.

Prana products are all solid state and cover a frequency range 10 kHz – 6 GHz with output power up to 12kW. Prana amplifiers are a known for their performance, reliability and quality. Prana distributes its amplifiers world-wide and has a large international network of partners to promote sales and provide the appropriate solutions and support in the shortest time possible. Their client base includes leading companies such as: Nissan (USA), Valeo (USA), Microsoft (USA), Airbus (France), Continental (Germany and France), MIRA (GB), MBtech (Germany), INTA (Spain), Mitsubishi (Japan), Toyota (Japan), Epson (Singapore), RCI (India), ITC (South Korea)...

Reliable, robust and manufactured following the ISO9001 standard, Prana amplifiers are guaranteed to provide a defined power supply, whatever the load mismatch is. Our amplifiers are designed to provide maximum power at the beginning and in the middle of the frequency range — that is, where it is needed — with low total harmonic distortion. Our team is committed to technical integrity, innovation, and continued development of our amplifier products. Our simplified service and maintenance features reduce downtime while meeting regulatory compliance requirements, and allow us to respond quickly to the changing needs of your business.

measurements of EMI, surge, lightning, pulse and other complex current wave shapes. New from Pearson Electronics is the Powerline Ripple Detector which greatly simplifies the measurement of injected ac ripple on an ac power bus required in MIL-STD-461 CS101.

Polar Instruments IncBooth 16

Geoffrey Hazelett18649 SW Farmington RoadBeaverton, OR 97007 USATel: (503) 356-5270Email: [email protected]: www.polarinstruments.com

ManufacturerTest & Measurement EquipmentSoftware Development/Products

Do you calculate impedance and signal integrityparameters for printed circuit boards? Do you need Spice models for transmission lines? Polar’s industry standard Si9000e field solver will do this for a wide variety of PCB transmission lines. Graph directly in the tool, work in a spreadsheet or output the data for additional processing.Still using a spreadsheet program for documenting your stackup to your fabricator? Stop wasting time and risking miscommunication when you can quickly, easily, and accurately document your stackup with controlled impedance information. Polar’s Speedstack does this and couples seamlessly with our field solvers and also with IPC-2581 interface enabled CAD tools. Come by our boothto judge for yourself how the efficiencies of these tools will enhance your time-to-market, and take away a full-function evaluation copy

Prana R&DBooth 602

Cyril Lagarde52 Avenue de la Libération19360 Malemort FranceTel : +335 55 86 49 97Email : [email protected] : www.prana-rd.com



Testing from both an industry and a laboratory environment. We provide SAR testing for companies and other test laboratories. We are located in Southern California.

Rigol TechnologiesBooth 717

10200 SW Allen Blvd, Suite CBeaverton, OR 97005Tel: (877) 4-RIGOL-1Email: [email protected]: www.rigolna.com

Manufacturer

Rigol Technologies is transforming the Test and Measurement Industry. Our premium line of products includes Digital and Mixed Signal Oscilloscopes, Spectrum Analyzers, Function/Arbitrary Waveform Generators, Programmable Power Supplies, and Digital Multimeters. Our test solutions combine uncompromised product performance, quality, and advanced product features; all delivered at extremely attractive price points. This combination provides our customers with unprecedented value for their investment, reduces their overall cost of test, and helps speed time to completion of their designs or projects.

Rigol’s Headquarters is in Beijing China with a new state of the art R&D and Production Facility in Suzhou. Rigol has two International subsidiaries located in Beaverton, OR, United States and Munich, Germany. Some 400 employees are serving our customers in more than 60 countries and regions worldwide.

Reliant EMC LLCBooth 841

Bruce Garofalo6501 Crown Blvd. Suite 106A9San Jose, CA 95120 USATel: (408) 916-5750Email: [email protected]: www.ReliantEMC.com

Distributor

Reliant EMC LLC is your top source for the test equipment that will enable you to reduce cost and time by self testing and self certifying your products for Electromagnetic Compliance (EMC).

Reliant EMC is proud to offer EMI/EMC products from:• DANA S.r.l.• EMC Test Design• EMCIS• Frankonia• Laplace Instruments• OnFILTER• Schwarzbeck Mess Elektronik• Spitzenberger & Spies• York EMC Services

Located in San Jose California, in the heart of Silicon Valley, Reliant EMC offers first class support for all of your Emission and Immunity Testing requirements.

RF Exposure LabBooth 807

Jay Moulton802 N. Twin Oaks Valley Rd Suite 105San Marcos, CA 92069 USATel: (760) 471-2100Email: [email protected]: www.rfexposurelab.com


RF Exposure Lab, LLC is an independent, privately owned SAR Testing Lab. We are A2LA Accredited and have significant expertise in SAR

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by the Ministry of Industry and Information Technology of PRC, and sponsored by the China Electronic Standardization Institute (CESI). SAFETY & EMC is a bimonthly publication with a cohesive, innovative, and professional workforce. It has more than 500,000 readers. Most of them are engineers, teachers, and students. Many marketing and purchasing personnel are becoming loyal readers. SAFETY & EMC has a deep understanding of this industry. Its columns are subject to professional and technical features that include: Certification & Marks, Standards and Applications, Testing & Measurements, Electromagnetic Interference Suppression Technology, Material Application in EMC, Professional Research, EMC Classroom, Conference Releases, New Products, and Company Profiles.

Schlegel Electronic Materials, Inc.Booth 519

Haydee Dibble1600 Lexington Ave.Suite 236ARochester, New York 14606 USATel: (585) 643-2000Email: [email protected]: http://www.schlegelemi.com

Manufacturers Conductive Materials Shielding Products & Materials

Schlegel Electronic Materials (SEM) invented highly conductive fabric over foam shielding gaskets in 1987, marking a major breakthrough for the electromagnetic interference shielding of electronic enclosures and has become the pre-eminent manufacturer of electromagnetic interference (EMI) shielding products.

SEM offers a full range of EMI shielding products including gaskets, I/O backplane shielding gaskets, Conductive Tapes, DYNASHEAR, DYNAGREEN, Greenshield, (Halogen Free line) Conductive FR Foams, Elastomers, EPDM Hybrid gaskets, SHIELDED CANS, ORS-II for ETHERNET applications, Transformers and Be

Rohde & Schwarz USA, Inc.Booth 102

6821 Benjamin Franklin DriveColumbia, MD 21046 USATel: (888) 837-8772Email: [email protected]: www.rohde-schwarz.com

ManufacturerAntennas & Antenna Products Test & Measurement Equipment Software Development/Products

For more than 80 years, Rohde & Schwarz has stood for quality, precision and innovation and is one of the world’s largest manufacturers of electronic test & measurement, communications and broadcasting equipment. Rohde & Schwarz offers a broad range of EMC, EMI, EMS and EMF test equipment for pre-compliance and full compliance measurements, providing accurate results across a wide frequency range. Rohde & Schwarz also provides customers with complete turnkey systems, significantly enhancing productivity and product performance by enabling precise results when measuring complex waveforms. For more information, visit www.rohde-schwarz.us/en/products/test_and_measurement/emc_field_strength/products.

Safety & EMC ChinaBooth 5

Xie HongNo. 1 Dongdajie Andingmen Dongcheng DistrictBeijing, 100007 ChinaTel: +86 108 4029073Email: [email protected]: www.semc.cesi.cn

Publishers

SAFETY & EMC Magazine was first published twenty-one years ago. It is the unique official publication (CN 11-3452/TM, ISSN 1005-9776) digitally introducing the safety and EMC technology of the electronic and electric industries currently in China. It is supervised



SCHURTER Inc.Booth 712

Brooke Philbin 447 Aviation BlvdSanta Rosa, CA 95403 USATel: (800) 848-2600Email: [email protected]: http://www.schurterinc.com/

Manufacturers Cords / Cord Sets Connectors Ferrite / Suppression Products Filters Passive Electronic Components Product Safety Compliance Equipment Shielding Products & Materials Test & Measurement Equipment


SCHURTER continues to be a leading partner of the electronics and electrical industries for passive and electromechanical components such as: fuses, circuit breakers, connectors, EMC products and input systems. Our products ensure clean and safe supply of power, as well as ease of use. Our EMC capabilities and expertise ensure that we provide products and services that prevent appliances from interfering with one another through unwanted electrical or electromagnetic effects. EMC products include power entry modules with filters, single phase block filters, 3-phase block filters, DC filters, suppression chokes, pulse transformers and EMC services.

Cu Finger stock. These enable the computer, telecommunications, military and medical, and Electronics Industries to meet global requirements for electromagnetic compatibility (EMC). NOW you can get your THERMAL INTERFACE MATERIALS through Schlegel EMI!!!

The company’s world-renowned EMI shielding gaskets are available in hundreds of profiles and unique designs, with attachment options that include mechanical self-attaching, clip, rivet, and a variety of pressure-sensitive adhesives.

Schmid & Partner Engineering AGBooth 811

Sven KuehnZeughausstrasse 43Zurich, ZH 8004 SwitzerlandTel: +41 44 245 9694Email: [email protected]: http://www.speag.com

Manufacturers Product Safety Compliance Equipment Test & Measurement Equipment Software Development / Products


Schmid & Partner Engineering AG (SPEAG) is the leading developer and manufacturer of the most reliable, efficient, user-friendly and advanced experimental (DASY, TDS, ICEy, cSAR3D, DAK, EM Phantoms) and numerical tools (SEMCAD X) for the electromagnetic near- and far-fields.

The new SEMCAD X Matterhorn is the most cutting-edge and effective electromagnetic simulation platform on the market. High-performance TDS probes are designed for measurements in the time and frequency domains with phase information covering a bandwidth from 10MHz to 6GHz.

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We are recognized as the global benchmark for quality and integrity. With more than 80,000 employees, we operate a network of more than 1,650 offices and laboratories around the world.

The SGS US EMC division works in close cooperation with the global SGS network of wireless labs to offer businesses a global one-stop shop service package. This enables device manufacturers, application developers, wireless service providers and operators to quickly launch their products on any market around the world.Capabilities: EMC, SAR/HAC, Wireless, RF, Bluetooth, WiFi, CCF, GCF, PTCRB, Product Safety, Intrinsic Safety/Hazardous Locations, Battery, Environmental, and Performance

SIEMIC, Inc.Booth 14

Mark Maynard775 Montague ExpresswayMilpitas, CA 95035 USATel: (408) 526-1188Email: [email protected]: http://www.siemic.com

Manufacturers Test & Measurement Equipment


SIEMIC is your one-source solution for worldwide market access, as a leading provider of compliance testing, product certification, international approvals, and training services. Their US headquarters is in Milpitas, California, with additional global locations in China, Taiwan, and South Korea. In twelve years SIEMIC has built a solid reputation for offering high-quality and cost-effective turnkey solutions. Featuring a top-flight staff with expertise in EMC, Wireless, RF, OTA, SAR, DFS, Telecom, and Safety, our state of the art test labs, compliance consulting services, and local technical support will result in short lead times and fast turnaround on your next product.

SE Laboratories a Trescal CompanyBooth 322

Dan Turgeon1065 Comstock StreetSanta Clara, CA 95054 USATel: (408) 844-7215Email: [email protected]: https://www.selabs.com/ http://www.trescal.com/en_US/

Global Calibration & Repair CompanySE Laboratories a Trescal Company continues to expand our EMC calibration for Immunity Equipment offering accredited calibrations for IEC 61000-3-2 & 3-3 (H&F), 4-2 (ESD), 4-4 (EFT/B), 4-5 (Surge), 4-11 (PQF), 4-12, 4-18 (Ring Wave) & CISPR 16-1-1 & 1-2. Our Santa Clara facility offers the broadest scope of accredited calibration capabilities on the West Coast.

Trescal has strategically located calibration facilities in 16 countries to support our customer’s global equipment requirements. USA operations consist of 10 calibration facilities in CA, GA, IL, MD, MI, NC, NJ, OH, TX. In addition we have 62 calibration facilities located offshore.

SGS North America, IncBooth 833

Paul Daigler620 Old Peachtree Road, Suite 100Suwanee, Georgia 30024 USATel: (770) 570-1825Email: [email protected]: http://www.sgs.com/ee/


SGS is the world’s leading inspection, verification, testing and certification company.



Solar Electronics CompanyBooth 815

Jason Watkins10866 Chandler Blvd.North Hollywood, CA 91601 USATel: (818) 755-1700Email: [email protected]: http://www.solar-emc.com


Founded in 1960, Solar Electronics Company manufactures RFI/EMC instruments, components and accessories for the RFI/EMC engineer, including current probes, LISNs, generators, capacitors, antennas, resistive devices, transformers, and EMI filters.

Specialty Silicone ProductsBooth 122

Dominic Testo3 McCrea Hill Rd Ballston Spa, NY 12020 USATel: (518) 363-5034Email: [email protected]: http://www.sspinc.com

ManufacturersConductive MaterialsShielding Products & Materials

SSP is a global supplier of particle filled EMI Shielding Elastomers. Our unique manufacturing techniques allow us to make the thinnest, most conductive, softest, and strongest EMI silicone materials in the market. SSP provides not only the standard materials associated with the Mil-DTL-83528 specification but also a differentiated line custom designed to the most common industry issues, problems, and complaints.

SIEPELBooth 602

Stéphanie JegatPA de Kermarquer, 56470 La Trinité sur Mer, FrancePh.: + 33 297 55 74 95Email: [email protected]: www.siepel.com In-house design and manufacturing of : A wide range of absorbers for multiple applications such as EMC, microwave, high fields, radar cross section, side lobe absorption. This ranges includes broadband, high power, narrowband, outdoor... absorbers suitable for use in cleanrooms.

Anechoic chambers for automotive industry, defence, space, nearfield, telecom… compliant to standards and / or to custom designs.Mode stirred reverberation chambers to perform immunity and emissions tests in compliance with international EMC standards for automotive, military, civil and aeronautics. SIEPEL is a renowned manufacturer for the quality / performances of its absorbers & test systems, the significance of its range and its ability to design and manufacture any type of chamber, dedicated to any application. Worldwide references with leading companies such as: Virgin Media, SGS, Aselsan AS, SAAB, Continental Automotive, GE, Alcatel, Thales, Nokia, Fujitsu…

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Sunol Sciences Corp.Booth 1034

Dale Guthrie6780 Sierra Court, Unit RDublin, CA 94568 USATel: (925) 833-9936Email: [email protected]: www.sunolsciences.com

ManufacturerAntennas & Antenna Products Test & Measurement Equipment

Sunol Sciences Corporation develops and manufactures antennas and positioners serving applications in:• EMC Testing;• Wireless Testing;• Special RF Measurements;• Distributed Antenna Systems.

TDK RF SolutionsBooth 319

Jim Ott1101 Cypress Creek RoadCedar Park, TX 78613 USATel: (512) 258-9478Email: [email protected]: http://www.tdkrfsolutions.com/

Manufacturers Anechoic Chambers / Materials Antennas & Antenna Products Ferrite / Suppression Products Filters Shielding Products & Materials Test & Measurement Equipment Software Development / Products


Spira Manufacturing CorporationBooth 220

Mike Kunkel, George Kunkel, William Wantz12721 Saticoy St SouthNorth Hollywood, CA 91605 USATel: (888) 98-SPIRA or (818) 764-8222Fax: (818) 764-9880Email: [email protected]: www.spira-emc.com

The Inspiration in EMI GasketsSpira Manufacturing Corporation has been serving the EMC community with quality engineered EMI/RFI shielding products for over 35 years! We are AS9100/ISO-9001 certified and offer the finest most reliable EMI/RFI shielding gaskets in the market. Spira’s strength lies in our exceptional products, on-time delivery, superior customer service, and technical support.

Spira’s patented EMI/RFI and environmental gaskets offer excellent solutions for both cost-sensitive and high-performance applications. The unique spiral design offers extremely low compression set, long life and high shielding. Gaskets available in: groove or surface mount, EMI and Environmental protection, Honeycomb Filters, Connector-Seal Gaskets, O-Rings, Die-Cut Gaskets, and custom configurations. Our shielded honeycomb filters offer the performance of a welded panel at the price of aluminum. Flexi-Shield is soft, durable and offers a rain/wind/dust seal like elastomers. Our new Connector-Seal gaskets provide the best EMI & Environmental seal on the market! Visit our website for more info, free samples and an EMI Educational seminar.



emissions testing. This includes the Milmega and IFI RF amplifiers.

We take great pride in our world-class research and development program, backed by state-of-the-art global manufacturing. Teseq Inc. is the only pulsed immunity manufacturer in North America with an ISO 17025 accredited calibration lab.

TestWorld IncBooth 224

Chris Elkins250 Technology WayRocklin, California 95765 USATel: (916) 644-1537Email: [email protected]: http://www.testworld.com


TestWorld, a long time distributor of RF and electrical test equipment, has organically entered the EMC test world through its established customer base. As a first time exhibitor to the EMC Symposium, TestWorld looks to expand its role providing test equipment rentals, leases and sales as well as expand its product offerings.

The IET / SciTech PublishingBooth 809

Dudley Kay7625 Wellesley Park N.Raleigh, NC 27615 USATel: (919) 414-3861Email: [email protected]: sci.styluspub.com

Publishers

TDK RF Solutions is a world leader in the design, development & manufacture of technical solutions for the EMC testing and Antenna measurement industries. We offer a complete range of solutions including automated test systems, anechoic chambers, RF absorber, antennas, software, RF filters, and a wide range of test products & accessories. We call it Total System Technology®, and it means TDK RF Solutions is your best choice of partner for proven solutions & services. If you are in the market for a complete turnkey solution or looking to expand your test capabilities with a new antenna, contact us to see what TDK can do for you.

TDK-LAMBDA Americas-HP DivisionBooth 826

Bonnie West405 Essex RdNeptune, NJ 07753 USATel: (732) 922-9300Email: [email protected]: http://www.us.tdk-lambda.com/hp/

Teseq Inc. – a unit of AMETEK Compliance Test SolutionsBooth 212

MaryJane Salvador52 Mayfield Ave.Edison, NJ 08837 USATel: (732)417-0501Email: [email protected]: www.teseq.com

ManufacturerAntennas & Antenna ProductsPower SuppliesTest & Measurement EquipmentSoftware Development/Products

Testing/CertificationTraining & Seminars

Teseq Inc., a unit of AMETEK Compliance Test Solutions, offers the world’s most comprehensive range of EMC systems for immunity and

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TMD TechnologiesBooth 823

Steve Olson1730 Twin Springs Rd., Suite 211Baltimore, MD 21227 USATel: (410) 242-4290Email: [email protected]: www.tmdus.com

ManufacturerPower Supplies

TMD Technologies brings over 60 years of experience and innovation in the field of high-power microwave solutions. We provide a broad portfolio of commercial off-the-shelf (COTS) and military off-the-shelf (MOTS) products, high-performance amplifiers, microwave power modules (MPMs), traveling wave tube amplifiers (TWTAs), and high-voltage power supplies (HVPS). Our design engineers and program managers can customize our products to your demanding needs and rapidly deliver solutions. For more information, contact Steve Olson at (408) 691-6557 or [email protected].

TUV RheinlandBooth 810

12 Commerce RdNewtown, CT 06470 USATel: (203) 426-0888 ext 119Fax: (203) 426-4009 Email: [email protected]: www.us.tuv.com

TÜV Rheinland is uniquely qualified to help its clients get their products to market quickly. Customers can choose conveniently located EMC labs equipped with 5 and 10 meter chambers

SciTech Publishing is an imprint of the Institution of Engineering and Technology (IET) and publisher of the SciTech Series on Electromagnetic Compatibility. This book series provides a continuously growing body of knowledge by incorporating underlying principles with best practices in electromagnetic compatibility engineering. It reflects modern developments of the last quarter century for an ever-broadening audience. With a practical real-world emphasis, books benefit non-specialist engineers and students as well as EMC veterans. Books are written by recognized authorities in their field, with every manuscript thoroughly vetted by members of the EMC Editorial Board and additional qualified advisors. Our newest title, EMI Troubleshooting Cookbook for Product Designers is scheduled to launch at the 2014 IEEE EMC conference.

Thermo Fisher ScientificBooth 801

Neil Olansky200 Research DriveWilmington, MA 01887 USATel: (978) 239-0051Email: [email protected]: http://thermoscientific.com/esd

ManufacturersTest & Measurement Equipment

Thermo Fisher Scientific is the leader in conducted immunity (EMC) solutions for regulatory compliance and quality/performance testing. Thermo Fisher EMC equipment supports global certifications such as CE Marking, and offers one of the only commercial test platforms for RTCA DO-160 indirect lightning test for avionics products. Thermo’s MiniZap-15 ESD simulator has been the best-selling product of its type for over 30 years. Additional EMC tests supported include: IEC 61000-4-XX series (ESD, EFT/B, Surge, Magnetic Field, Dips), Telecom surge for FCC and Telcordia/GR-1089, andLightning surge testing to 20kV/10kA.



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to handle a variety of products. As an EMC Notified Body (CAB) and international service provider, we offer a flexible, competent service to help you meet the requirements of the EMC directive 2004/108/EC as well as FCC and Industry Canada requirements. For wireless radio compliance needs, TÜV Rheinland is a TCB for the U.S. and an FCB for Canada and can provide the wireless product certifications required.

***All TÜV Rheinland’s EMC labs are 17025:2005 accredited, FCC listed, VCCI registered, IC recognized and our Pleasanton, California lab carries both WiFi & Zigbee accreditations.

Universal Shielding CorpBooth 941

Michael Newman 20 West Jefryn Blvd Deer Park, NY 11729 USATel: (631) 667-7900Email: [email protected] Website: www.universalshielding.com

ManufacturerAnechoic Chambers/MaterialsShielding Products and Materials

USC designs, manufactures, installs, and certifies prefabricated shielded enclosures for customers throughout the world. The enclosures meet Tempest and Hemp specifications of IEEE-299, NSA-94-106, NSA 65-5, NSA-65-6 and MIL-STD-285. The doors are of the Recess Contact Mechanism (RCM) and can be utilized for tempest, acoustic and weather resistant applications. The doors provide 100 dB of attenuation at 20 GHz. We provide a complete turnkey installation of anechoic rooms, as well as screen enclosures and shielded cabinets.

US Microwave LaboratoriesBooth 11

Claudia Fajardo7412 Summerfield Rd #303Summerfield, North Carolina 27358 USATel: (336) 582-0603Email: [email protected]: http://www.usmicrolabs.com


US Microwave Laboratories is a manufacturer of RF and microwave components and equipment. Our product portfolio includes low noise preamplifiers and RF power amplifiers suitable for EMC compliance testing. Our objective is to provide our customers with a complete, personalized solution to their needs and a high quality product at a competitive price. We offer quick turnarounds for custom equipment. All our products are designed and manufactured in the U.S.A.

V Technical Textiles Inc.Booth 12

William Hoge4502 State Route 31Palmyra, New York 14522 USATel: (315) 597-1674Email: [email protected]: http://www.vtechtextiles.com

Distributors Manufacturers Antennas & Antenna Products Conductive Materials Shielding Products & Materials RF Shielding Enclosures

V Technical Textiles Inc. (VTT) a woman owned small business and a USA manufacturing company of products made from conductive textiles. We are the leading manufacturer of RF shielding enclosures (tents), RF pouches, antimicrobial textile items, shielding garments and antimicrobial clothing. We are also the marketing and sales arm of Statex Productions



that provides robust, high level EMI shielding while providing true elastomeric mechanical properties and weather sealing in a unitized, durable construction. Our Microbridge shielding gaskets advance this ability even more by further optimizing the conductive material content and offering excellent protection from galvanic degradation. Chemical resistant and NBC compliant materials are also available, along with traditional QPL listed shielding gaskets to MIL-DTL-83528. All products are manufactured right here in the USA.

Vectawave Technology LimitedBooth 722

Mike BackUnit D The ApexSt Cross Business ParkNewport, Isle of Wight PO30 5XW United KingdomTel: +44 (0) 1983 821818Email: [email protected]: http://www.vectawave.com


Vectawave Technology Ltd is a manufacturer of robust, air cooled, class A broadband power amplifiers and components for use in industrial, military and medical applications. Our amplifier range covers 10kHz– 6GHz with powers up to 2.5 kW. Vectawave have been designing and manufacturing power amplifiers for 18 years. These amplifiers, based on proven technology, are in daily use in EMC labs and test houses around the world. Most of our amplifiers have been designed to meet the specific, in many cases, arduous EMC applications, and are ideal for integration into EMC immunity test systems.

The company also manufactures a range of unique quadrature hybrids, couplers, directional bridges and low power amplifier modules to supply the requirements of system designers.With our team of highly skilled, dedicated staff , our high tech purpose built factory is equipped with cutting edge design, build and test facilities to manufacture and support our products.

+ Vertriebs GmbH in Bremen, Germany. V Technical Textiles Inc. is located in the state of New York and the historic Town of Palmyra. VTT is a fully functional cut, sew and design facility that provides its customers the flexibility of one piece prototyping to full production capability at its new location. VTT will now be able to offer its customers precision cut pieces with it’s new Eastman Cutting system along with 3D design capabilities. VTT now can provide patterns of etched conductive traces on fabric, Zell (Sn/Cu/Ag).

VTT/Shiledex-U.S. is an exclusive wholesale distributor with over fifteen years of experience in plated conductive textiles and yarns, which provides VTT the resources to develop unlimited opportunities for product development and finished goods. Shieldex products specialize in the metalizing of yarn and fabrics. The diversity of our products include 99% pure silver, silver/copper, silver/copper/nickel and silver/copper/tin. Shieldex-U.S. can help with a multitude of conductive plated textile materials and processes. Electroless, galvanic or combination processing with variable layer thickness can be tailor-made to customer needs. Our process produces superior flexibility and adhesion. This enables SHIELDEX® metalized fabrics, yarns and fillers to withstand all textile treatments including spinning, weaving, needle felting and sewing.

Vanguard Products CorporationBooth 323

Mark Hansen87 Newtown RoadDanbury, CT 06810 USATel: (203) 744-7265Email: [email protected]: http://www.vanguardproducts.com

Manufacturers Conductive Materials Shielding Products & Materials

Vanguard manufactures a wide variety of EMI shielding gaskets and materials, along with thermally conductive elastomers. Vanguard’s Ultra-Vanshield dual elastomer EMI shielding gasket line is the original dual elastomer


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2015 EMC Dresden . . . . . . . . . . . . . . . . . . . . . 62

2016 EMC . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

3G Metalworx. . . . . . . . . . . . . . . . . . . . . . . . 145

A.H. Systems, Inc. . . . . . . . . . . . . . . . . . . . . 124

AP Americas. . . . . . . . . . . . . . . . . . . . . . . . . 141

AR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C4

Advanced Test Equipment Rentals . . . . . . . . . . 125

Altair Engineering. . . . . . . . . . . . . . . . . . . . . 126

CST. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

Com-Power . . . . . . . . . . . . . . . . . . . . . . . . . 127

Cuming Lehman Chambers. . . . . . . . . . . . . . . 141

D.L.S. Electronic Systems. . . . . . . . . . . . . . . . 145

EE-Evaluation Engineering. . . . . . . . . . . . . . . 131

ENR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

ESDEMC Technology . . . . . . . . . . . . . . . . . . . 130

ETS-Lindgren . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Elite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

Exemplar Global . . . . . . . . . . . . . . . . . . . . . . 142

Fair-Rite . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

Fischer Custom Communications, Inc. . . . . . . . 143

GAUSS Instruments. . . . . . . . . . . . . . . . . . . . 132

HAEFELY HIPOTRONICS . . . . . . . . . . . . . . . . . 144

HV TECHNOLOGIES . . . . . . . . . . . . . . . . . . . . 133

In Compliance . . . . . . . . . . . . . . . . . . . . . . . 134

Interference Technology. . . . . . . . . . . . . . . . . . 10

Michigan Scientific Corporation . . . . . . . . . . . 145

Microwave Journal . . . . . . . . . . . . . . . . . . . . 135

Microwave Vision Group . . . . . . . . . . . . . . . . 136

Montrose Compliance Services . . . . . . . . . . . . 145

Nolato . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Pearson Electronics . . . . . . . . . . . . . . . . . . . . . C2

Rigol Technologies . . . . . . . . . . . . . . . . . . . . 144

SGS North America . . . . . . . . . . . . . . . . . . . . 139

Safety & EMC Magazine . . . . . . . . . . . . . . . . 138

Schurter . . . . . . . . . . . . . . . . . . . . . . . . . . . . C3

Spira Manufacturing Corporation . . . . . . . . . . . . 6

TUV Rheinland . . . . . . . . . . . . . . . . . . . . . . . 140

Wyatt Technical Services LLC . . . . . . . . . . . . . 145

Patrons and Advertisers

Thank you!

The Committee for the 2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity extends our sincere thanks to our patrons and advertisers for their valued support.

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