1

Clark Field, Philippines IR Sensors, Opto-couplers, IC packaging

Built Up: 11,500 m2

Parañaque, Philippines Opto-couplers, Fiber-optics assembly & testing

Built Up: 6,000 m2

COB & MCOB assembly, raw

materials storage Land / Built Up: 6,136 m2 / 1,625 m2

Probing, Wafer processing, testing,

storage, administration Land / Built Up: 8,332 m2 / 6,406 m2

Kunshan,

Jiangsu

Bayan Lepas

Free Industrial

Zone, Penang

Iskandar

Johor

Parañaque

Clark Field

Inari South Keytech Sdn Bhd Fibre-optics components manufacture and assembly Land / Built Up: 8,094 m2 / 3,716 m2

R&D, NPI, SMT/Flip chip assembly Land / Built Up: 3,623 m2 / 3,623 m2

TnR, Storage, Drop-Ship, HR Land / Built Up: 2,074 m2 / 2,646 m2

CEEDTec Sdn Bhd ODM of electronic testing & measurement

equipment

Built Up: 3,066 m2

Amertron Technology

(Kunshan) Co., Ltd. LED Displays, IR Sensors

Built Up: 9,200 m2

Inari Technology Sdn Bhd Die Sale, RF SiP Module

Amertron Incorporated

GROUP OPERATIONS

Strategic operations located across Asia…

Corporate Profile Industry Prospects Financial Review Growth Plans Investment Merits

BUSINESS ACTIVITIES

Integrated Semiconductor (SIP)

Packaging ,Manufacturing –Wafer

Processing ,Assembly and Testing

Services

Original Design Manufacturer (ODM)

of Electronic Test and Measurement

Equipment

Fiber-Optics Research, Design,

Manufacturing ,Assembly and Testing

Optoelectronics Manufacturing,

Testing, and Assembly

Focused on supporting next-generation devices and

cutting-edge technologies…

Corporate Profile Industry Prospects Financial Review Growth Plans Investment Merits

4

Services

ONE STOP Full Turnkey HVM Provider

VMI & Drop-Ship

Product Design

& Process Development

for HVM

Wafer Back-End Process Final Test

Assembly

Design & modelling thermal,

electrical and mechanical

Automated manufacturing

process for huge strip

HVM with little or no variation

in manufacturing processes

Wafer/CuPillar Bump probing

Low stress dicing (LSD)

Wafer laser mark

Bump Die/Flip chip TnR

High speed flip chip mounter

High accuracy placement Cu pillar

flip chip mounter , +/-18um

Fine filler Molding under fill (MUF)

Functional testing

High speed rack and stack

test system

Integrated built in AOI /TnR

Vendor Managed Inventory

Direct customer drop ship

5

Key Products

Applications

BAW Filters

FBAR Filters

GPS Front-End Modules & LNAs

mmW & microWave devices

Mobile Power

WLAN/Data devices

System-in-Package for RF

Mobile Industry

Integrated Semiconductor

Packaging and Testing Services

Fiber-Optics

Research, Design,

and Manufacturing

Fiber-optics transmitters/

receivers, Active Optical Cable

Optoelectronics Manufacturing,

Testing, and Assembly

LEDs, LED Display Products,

Optical Sensors, Opto-couplers

Applications

Cloud Computing Servers

Routers

Data Center Switches for high

speed data connections

Supercomputers

Applications

Data centre

Aerospace

Defence

Industrial automation

Automotive industries

6

Packaging Technology

6 2011 2013 2015

Pit

ch (

µm

)

0201 Pitch=425um PCB pad=225x300um Pad spacing=200um

01005 Pitch=350um PCB pad=150x200um Pad spacing=150um

Fine Pitch Flip Chip Pitch=250um PCB pad=150um Pad spacing=100um

2010 2012 2014 400

20

100

200

300

Mature Technology Emerging

Technology

Future

Technology

Thru Silicon Via (TSV) Micro bump pitch=40-80um

Micro bump diameter>=20um

Cu Pillar Bump Pitch=215um PCB pad=125um Pad spacing=90um

Cu Pillar Bump Pitch=150um PCB pad=75um Pad spacing=75um

75um

75um

7

Key Processing Technology & Enabling Capability

7 2013 2014 2015

Waf

er

typ

e

Thermal Compression Die Attach

6” Cu SMT

Mature Technology Emerging Technology Future

Technology

Finer Filler Molding

In-Line Low Stress Dicing with taping and

lasermark integration

Fully Automated Wafer/ wafer bump inspection

Fully Automated Bump wafer reflow

Fully Automated multitape + wafer + carrier system

6” or 8” Cu Pillar

Very Tight Impedence Controled WB (Au/Cu)

High Speed, High Precision SMT

High Speed, Solder Volume Inspection

8

Package Technology

Integrated Multi-Chip SiP Module

Fine pitch flip chip

(solder printed bump

pitch 250um)

01005 SMT

discrete

components

Fine gold wire with

Epoxy Die Attach

6mm 4.5

mm

Very Thin Cu Pillar bump wafer/ bare wafer

Thin 7-Layer stack-up via large & wide substrate.

Thin Molded Package <0.4mm.

Material: High thermal DA epoxy, DAF, mold compound

Fully automated common platform equipment

Cu Pillar bump dice

7-layer thin stack-up

substrate

Local Penang Eco-System

I – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Tape n Reel map

sorter. High speed

pick n place from

wafer to reel for

tiny die sizes

<650um.

Precise & fully automatic

6” & 8”wafer handling

systems

High Precision

Wafer Probers for

single & dual cores.

2D/3D Auto Optical

Inspection system

for backend and

test inspections

3 YEARS GROWTH PLAN

Focus on continuous R&D to maintain position as a leading EMS provider, and to continuously

meet industry’s growing sophistication and miniaturization needs

GROWTH STRATEGY

1

Continuously increase clientele base; while also increasing range of products offered 2

Capacity expansion to meet growing demand in line with robust industry growth 3

R&D of Higher-Bandwidth Fiber-Optics

Introduce 25G Fiber Optics Active

Optical Cable

Introduce >100 Gbps 12-channel

Parallel Optics Transmitter / Receiver

Expand range of ODM Products

Multichips/Components Integrated RF

Module.

Manufacturing system automated,

proactive & preventive production floor

controls.

2015

Expanding vertical business integration,

i.e. wafer fabrication collaboration

Continued expansion with strategic

partners

Capitalising flip-chip copper-pillar

production for non RF segments.

Low cost integrated total RF testing

solutions.

2016

Continued optimization and integration of

Inari and Amertron operations

Expand R&D / NPI activities in RF and

Fibre Optics

Commence mass production in Fiber

Optics packaging

Expand customer portfolio and services

Upgrade new assembly technology

- Cu Pillar bump die.

- HVM Capacity expansion

- Equipment Modernization for higher

productivity/efficiency.

Develop strategic partnerships

2014

I – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative