chipmax group soldering reflow oven the … technology cluster soldering reflow oven standalone...
TRANSCRIPT
Package weight
Package dimensions
960
Upper3/Down2
960mm
Intelligent level sirocco and
rapid infrared heating
1
300mm
Left→Right
Net transmission+
chain transmission
0-1500 mm/min
Three phase 5 line 380V 50/60Hz
4.5KW
15 mins
Room Temperature ~300℃
PID closed-loop control
±1℃
±2℃
1460x630x470
90KGs130KGs
1500x900x650
ChipMax GroupThe Technology Cluster SOLDERING REFLOW OVEN
Standalone model of Reflow Oven with Intelligent level sirocco and rapid infrared heating
960
Model
The heating zone quantity
The length of the heating zone
The heating type
The cooling zone quantity
Maximum width of PCB board
The operation direction
Delivery options
The speed of conveyer belt
The power supply
Peak power
Initial Heat up time
Temperature control range
Temperature control mode
Temperature control accuracy
PCB temperature distribution deviation
Overall dimensions
Machine weight
Technical Specifications
Infrared emission and circulation of the hot airflow
8 Intelligent waves heating temperature
Enhanced Infrared Soldering Area
Choice for different soldering cycles
Mutli-Functions
Ø
Ø
Ø
Ø
Ø
Ø
Special heat up and temperature equalization with all designs
Features
Table-top Model Reflow Oven with Infrared heater and hot air flow method.
Technical Specifications
962A/962C
Model 962C 962A
1~8 min
0-280℃
AC220V/50~60Hz
1500W
300x320mm
430x370x260mm
500x430x330mm
14Kg
1~8 min
0-280℃
AC220V/50~60Hz
2500W
400x600mm
684x504x225mm
780x600x330mm
22Kg
Cycle Time:
Temperature Range:
Power Supply:
Rated Power:
Maximum soldering area:
Size:
Packing Size:
Gross Weight:
962C
962A
For more details www.chipmax.in
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