chipbond analyst meeting 21h2 - mops.twse.com.tw
TRANSCRIPT
PACKAGING INDUSTRY
Au
Wire Bonding > 70%
Primary interconnecting method
Bumping
Most ICASE, SPIL, Amkor
Solder BumpsCPU and Graphic Intel and TSMC
Gold BumpLCD Driver IC, RFID
Chipbond, Nepes