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Chemical Mechanical PlanarizationProcess control | Cleanliness | Uptime optimization | Uniformity
CMP or Chemical Mechanical
Planarization in semiconductor
and hard disk drive manufacturing
environments continues to evolve
and gain critical importance as
the geometry and spacing of the
wafer and substrate designs become
more complex. To enable these
advancements, Entegris offers a
wide range of products that provide
solutions for:
• In fab delivery of bulk and point-
of-use CMP slurries to CMP tools
• Removal of particles and gels
from CMP slurries prior to contact
with the wafer
• Conditioning the CMP pad
• Removal of residue and waste
from the wafer surface post CMP
Chemical Mechanical Planarization
ENTEGRIS INC. «» CMP «» 1
table of contentsSection 1: About Entegris
Creating a Material Advantage ................................................... 2
Global Presence ........................................................................... 3
Enabling Innovation .................................................................... 4
Close to Our Customers .............................................................. 5
CMP Solutions .............................................................................. 6
Section 2: Product/Solutions
PURITYPlanargard® Filter Family ...................................................... 8
Planarcap® Filter Family ....................................................... 10
Solaris® Filter Family ............................................................. 12
AMC Tool-Top Filters .............................................................. 14
MATERIALS MANAGEMENTMicroenvironment Control Solutions ................................... 16
Planarcore® PVA Brushes ....................................................... 18
Planargem® Pad Conditioners ............................................... 20
Tube and Pipe Fittings ........................................................... 22
PrimeLock® Fittings ............................................................... 24
Flaretek® 90° Sweep Elbows ................................................ 26
Tubing and Pipe ....................................................................... 28
CR4, CR8 and CH8 Manual and Pneumatic Valves ............ 30
PROCESS CONTROLNT® Electronic Flowmeters, Model 4400 ............................. 32
NT Integrated Flow Controllers, Models 6510 and 6520 .... 34
NT Control Modules ................................................................ 36
NT Pressure Transducers ....................................................... 38
CR-288® Concentration Monitors .......................................... 40 CMP Cleaning Part Services .................................................. 42
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 32
With 2,800 employees worldwide, Entegris thrives on the challenge to meet our customers’ expectations through a global network of service, technology, manufacturing and applications support teams, all built upon a tradition of product and process innovation.
global presence
lab capabilities
Europe and Israel
Dresden
Moirans
Kiryat-Gat
Montpellier
Limonest
Asia and Japan
SingaporePenang
Kulim
Osaka
Tokyo
YonezawaSeongnam-si
Beijing
FukuokaShanghai
Tainan
TaoyuanHsinchu
Wonju-si
North America
Colorado Springs
San DiegoDecatur
FranklinBurlington
BillericaChaskaMinneapolis
Pleasant Hill
Analytical Services Product Testing Material Science• Airborne molecular contamination • Performance testing • New material development
• Surface contamination • Particle testing • Material characterization
• Applications support • Electrostatic charge • Material selection
• Root-cause analysis • Vibration • Material incoming inspection
• Flow rate optimization • Applications support
• Applied statistics
• Safety and industry standardization
• DOT and UN regulations
• CE marking
Entegris provides innovative materials science-enabled solutions for applications across key semiconductor processes to help chip makers solve manufacturing challenges, enhance yield and gain sustainable competitive advantage.
purify, protect and transport
bulk chemicalAs wafer sizes continue to increase and line widths shrink, purity requirements become more stringent and precise chemical blending becomes more critical. Whether it’s transport or storage, mixing or dispense, Entegris has solutions to meet bulk chemical handling needs.
chemical mechanical planarizationFrom filtration, liquid and slurry handling, Entegris products enable the CMP process.
wet etch and cleanUltrapure liquids and gases are purified, protected and transported with Entegris filters, purifiers, valves, fittings and sensing and control products.
substrate handlingEntegris provides wafer handling products to protect and transport prime wafers, wafers being processed, finished wafers, bare die and packaged devices. Products include wafer carriers, wafer shippers, mask and reticle carriers, bare die trays, horizontal wafer shippers, chip trays and film frame shippers.
photolithographyEntegris’ broad product line enables lithography processing with gas filters and diffusers, purifiers and purification systems, wafer and reticle handling, liquid filtration, purification and control.
Entegris 2012Industries Served: Semiconductor,
Compound Semi/LED, Data
Storage, Flat Panel, PV Solar,
Energy Storage, Life Sciences
Sales: $716 million
Patents: Holds 287 U.S. patents
and 593 patents in other
countries
Employees: 2,800 worldwide
Stock Listing: ENTG on NASDAQ
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 54
The technology roadmaps to produce the next generation of semiconductor devices and microelectronics are presenting unprecedented technological challenges, as well as ever increasing pressure to improve yields and productivity. As the leading provider of contamination control products and services to the global semiconductor and microelectronics industry, Entegris is using its analytical and materials science expertise to develop comprehensive solutions to address critical contamination issues in the fab.
Electronics that are smaller, faster, cheaper and more functional
ITRS 2010 2012 2014 2016
Node 32 22 14 10
DRAM 1/2 Pitch (nm) 45 32 25 20
Critical Particle Size (nm) 20 15 10 5
Critical Metal Ions (ppt) 1000 1000 100 TBD
Molecular Contaminants Surface Airborne Airborne Airborne
Leveraging our materials science expertise
Entegris TechnologiesLiquid and Gas Filtration Continuous Improvement and Purification Filtration products: smaller pore size, higher flow, higher retention
Purification products: volatile organics, AMC, moisture
Wafer Handling Advanced 300 mm Microenvironment Control 450 mm prototypes
Mask Handling Carriers to prevent reticle haze EUV mask carriers
Fluid Handling Components for a wider range of process conditions, precise real-time sensing and control
Coatings New coating technologies for components used in next generation semiconductor processing
Application and Process�Knowledge
We Respond�Quickly with Prototypes
We Develop Relevant Final Solution
Relevant,Trusted,
TechnologyPartner
We Listen
Customer�views Entegris as solutions provider
Customer shares sensitive product
roadmap information
Customer enters� problem-solving�
relationship
Customer provides feedback
on prototype performance
Pilot Capability�at Most Sites
Expand Applications�Excellence
Direct Engagement�
by Engineering Teams
Faster New Product
Development
Entegris Milestones1966: Founded as Fluoroware, Inc.
2000: Begins trading under the ENTG
symbol on NASDAQ
2005: Merges with Mykrolis Corporation,
a leading provider of liquid filtration
and gas purification products and
systems
2006: Expands manufacturing facility in
Kulim, Malaysia
2007: Acquires Surmet Corporation’s high-
purity semiconductor coatings business
2008: Acquires Poco Graphite, an industry
leader in high-performance graphite
and silicon carbide
2009: Acquires PureLine Co., a fluid
handling component manufacturer,
in Kangwon-do, Korea
2011: Opens manufacturing facility in
Hsinchu, Taiwan
2012: Opens the Advanced Technology
Center, manufacturing for 450 mm
and EUV, in Colorado Springs, CO
Acquires Entegris Precision Technology,
a HDPE drum blowmolding facility,
in Yangmei, Taiwan
Opens new facility to provide
specialized silicon and diamond-
like coatings in Lyon, France
2013: Acquires Jetalon Solutions, a precision
chemical sensor and analyzer maker
Direct sales and local support gives us the opportunity to achieve customer intimacy.
Customer intimacy helps us better understand our customers’ needs through direct feedback and roadmap sharing.
By aligning our material science, engineering and R&D initiatives, we can develop indispensable contamination control solutions to solve our customers’ roadmap challenges.
close to our customersenabling innovation
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 76
Our expertise in material science and contamination control enables our customers to meet the demands of the market by reducing costs, enhancing yields, increasing productivity, and improving process control.
The following pages highlight 18 products and services designed to solve your fab challenges by providing best-in-class purification, materials management and process control solutions.>>>
Challenge
Purity Materials Management Process Control
Plan
arga
rd®
Filte
r Fam
ily
Plan
arca
p® F
ilter
Fam
ily
Sola
ris®
Filte
r Fam
ily
AMC
Tool
-Top
Filt
ers
Spec
tra™
FOU
P
Plan
arco
re®
PVA
Brus
hes
Plan
arge
m®
Pad
Cond
ition
ers
Tube
and
Pip
e F
ittin
gs
Prim
eLoc
k® F
ittin
gs
Flar
etek
® 90
° Sw
eep
Elbo
ws
Tubi
ng a
nd P
ipe
CR4/
CR8/
CH8
Man
ual &
Pne
umat
ic V
alve
s
NT®
4400
Ele
ctro
nic
Flow
met
ers
NT 6
510/
6520
Inte
grat
ed F
low
Con
trol
lers
NT
Cont
rol M
odul
es
NT
Pres
sure
Tra
nsdu
cers
CR-2
88®
Conc
entr
atio
n M
onito
rs
CMP
Clea
ning
Par
t Se
rvic
e
Customer Challenges
Proc
ess
Improve yield | Defect reduction
• • • • • • • • • • • • •
Improve start-up time with new products • • • • • • •
Process flexibility • • • • • • • • • • • • •
Man
ufac
turin
g
Improve wafer throughput • • • • •
Improve tool uptime • • • • • • • • • • • • •
Maintain and control operating conditions and process parameters
• • • • • • • • • • •
Maintain clean wafer environment • • • • • • • • •
Equi
pmen
t Reduce calibration of sensors and equipment • • •
Reduce scheduled and unscheduled maintenance • • • • • • • • • •
Cost
Chemicals and gases
Consumables • • • • • •Energy (Electricity / Air) • • • • •Components •
Slurry Blending
DI Water Loop
Integrated CMP Tool
Bulk Slurry
For over 40 years, Entegris has been at the forefront of providing comprehensive microcontamination control solutions – with products and services that surround key processes such as wet etch and clean, lithography, CMP and substrate handling.
CMP solutions
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 98
PUR
ITY
Entegris’ Planargard® melt-blown graded density slurry filters provide CMP applications the critical performance balance between the removal of defect-causing agglomerate gels and the delivery of the necessary slurry solution to the wafer surface.
• Excellent retention of agglomerates
• Removal of disruptive particles only
• No action on the particle size distribution of working particles
Optimized for bulk filtration of CMP slurries
FEATURE ADVANTAGE BENEFITGraded-density depth filter design
• Defect-causing agglomerates retention in the four layers of the filter
• Reduced potential premature filter "plugging"
• Longer filter lifetime
Disruptive particle removal • No particle size distribution change of the desired slurry particles after filtration
• Consistent slurry delivery to the process
Compatible with Chemlock® housing
• Bowl and cartridge are removed as a single unit
• Easy and rapid changeout• Space saving
Planargard® Filter Family
performance• Depth filter with four-layer construction
to trap particles and ensure long filter life. Critical slurry particles pass through all four layers and are delivered to the polishing tool
Four layer depth filterfrequently asked questionsHow do I choose the appropriate Planargard filter for my application?You should consider slurry characteristics, such as abrasive types, particle distribution and solid concentration to determine the appropriate Planargard filter for your application. For any question, please contact your local representatives.
What is the lifetime of a Planargard filter?The lifetime varies by the process condition. If you want to know the lifetime of using Planargard filters in your applications, please contact our local representatives for filter analysis and testing.
Product Planargard NMB Filter
Planargard CL Bulk Filter
Planargard CMP Filter
Planargard CS Bulk Filter
Application Ceria and colloidal silica bulk slurry applicationsSub-fab CDS filtration
Materials Membrane: PolypropyleneSupport: PolypropyleneCartridge o-ring: EPR, Silicon, 2-222
Membrane, core, sleeve,endcaps: PolypropyleneCartridge o-ring: EPR, 2-222
Filter element: All-polypropylene constructionCartridge o-ring: EPR
Filter element: All-polypropylene constructionCartridge o-ring: EPR, 2-222
Maximum operating temperature
80°C (176°F)
Maximum forward differential pressure
0.48 MPa (4.8 bar, 70 psi) @ 25°C (77°F)
Maximum reverse pressure
0.15 MPa (1.5 bar, 22 psi) @ 20°C
Available sizes 10", 20", 30", 40" 5", 10", 20", 30" 10", 20", 30" 5", 10", 20", 30"
Available retention ratings
0.3, 0.5, 0.7, 1.0 μm 0.2, 0.3, 0.5, 0.7, 1.0 μm
Tailored to application needs
performance (continued)• Particles results of tests conducted by
Entegris demonstrate that Planargard cartridges do not affect the particle size distribution of working particles.
• Filters tighter than CMP1 can remove desirable working particles, causing premature plugging and reduced removal rates.
100
90
80
70
60
50
40
30
20
10
0
CMP1 CMP3 CMP7
CMP9
CMP11
CMP13
CMP16
CMP5
0 5 10 15 20 3025
Planargard CMP Cartridge Filters
Particle Size (µm)
Rete
ntio
n (%
)
Planargard CMP Cartridge Filters
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 1110
PUR
ITY
Planarcap® Filter Family
Entegris’ Planarcap® family of CMP slurry filters are designed for point-of-dispense (POD) applications. Planarcap filters provide the critical performance balance between the removal of defect-causing agglomerate gels and the delivery of the necessary slurry solution to the wafer surface.
• Pleated design providing best combination of surface area and media gradient
• Longer lifetime with improved flow
Optimized for copper, STI, ILD and tungsten applications to capture particles in silica, ceria or alumina slurries.
FEATURE ADVANTAGE BENEFITPleated depth filter design • Defect-causing particles retention
• Multi-stage, graded-density design• Superior lifetime• Superior flow
High-retention disposables • Reduction of micro-scratches and total defects
Focused application development
• Designed specially for: - alumina and silica abrasives
containing slurries- ceria and colloidal slurries
• Defect-causing particles removal• Low pressure drop• Higher lifetime
performance• Planarcap KPX is designed to maintain a long
lifetime and a high particle removal efficiency even in the most hard-to-filter slurries.
10
9
8
7
6
5
4
3
2
1
0200 40 60 80 9010 30 50 70 100
Normalized Time
Pres
sure
(PSI
)
1.5 µm Planarcap KPX1.5 µm competitor filter
Relative Lifetime of 1.5 µm POD Filters
frequently asked questions
Can Planarcap be used in a bulk chemical system?No, Planarcap filter is better used for small volume applications. It is not adequate for bulk chemical systems.
Is there any special treatment needed for Planarcap filters?Normally no special treatment is needed for using Planarcap filters. However, you may need pressure activation for sub 1 µm filters. Please contact our local representatives for instructions.
Product Planarcap KPX Filter Planarcap LPX Filter Planarcap TPX Filter
Application CMP slurry filtrationPOD and POU filtration
Copper, ILD, STI and tungsten CMP applications
STI and Cu CMP
Materials Medium: Polypropylene Medium: Pleated depth polypropylene
Medium: Pleated depth polypropylene
Core, cage, shell: Polypropylene
Maximum operating temperature
40°C (104°F)
Maximum forward differential pressure
0.27 MPa (2.7 bar, 40 psi) @ 25°C
Maximum forward /reverse pressure
0.27 MPa (2.7 bar, 40 psi) @ 20°C (68°F)
Available sizes 2.5", 5" 2.5", 5"
Available retention ratings
1.0, 1.5 μm 1.0, 2.0, 3.0, 5.0 μm 0.1, 0.2, 0.3 μm
Tailored to application needs
Relative lifetime of 1.5 μm Planarcap KPX compared to a competitor 1.5 μm POD filter
100
90
80
70
60
50
40
30
20
10
01.0 µm Planarcap KPX 1.5 µm Planarcap KPX
Filter Type
Rete
ntio
n (%
)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Pres
sure
Dro
p (p
si)
Pressure drop at 1 L/minin DI water
Retention (%) of 1.0 µm SS12 slurry particles
performance (continued)Furthermore, tighter filtration is seen to have a very significant affect on wafer level defectivity.
• Specifically, scratch defects are seen to be reduced by over 50% when switching to a 1.0 µm Planarcap KPX from a 1.5 µm Planarcap KPX.
• Given the affect of tighter filtration at POD on wafer-level defectivity, the benefits of increased filter life and high retention efficiency provided by the Planarcap KPX product line are evident.
Retention efficiency and pressure dropof Entegris POD filters
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 1312
PUR
ITY
Entegris’ Solaris® graded density CMP slurry filters provide point-of-use (POU) CMP applications the critical performance balance between the removal of defect-causing agglomerate gels and the delivery of the necessary slurry solution to the wafer surface.
• Designed to meet the needs of next-generation point-of-use (POU) slurries
• Self-venting in vertical installation for optimum flow characteristics
• All-polypropylene construction with melt-blown wrapped depth filtration media
• Retention range from 0.3 µm to 5.0 µm
Optimized for copper, STI, ILD and tungsten applications.
Solaris® Filter Family
FEATURE ADVANTAGE BENEFITOptimized depth media • Superior agglomerate gel holding
capability• Longer filter lifetime
Self-venting filtration • Eliminates dead space and potential for slurry dry-out in the filtration media, ensuring longer life
• More efficient startup • Less slurry handling
Disposable, Connectology® design
• Compact stable design• Quick installation
• Minimizes downtime• Safer installation
performance
Particle Size (µm)
Rete
ntio
n (%
)
100
80
60
40
20
00.2 0.6 1.0 1.4 1.81.60 0.4 0.8 1.2
Solaris NMB RetentionSolaris NMB Filters
Flow Rate (L/min) — 1 cP @ 20°C (68°F)
GPM
Diff
eren
tial P
ress
ure
(kPa
)
Diff
eren
tial P
ress
ure
(psi
d)
40
30
20
10
0
5
4
3
2
1
00 0.5 1.0 1.5 2.0
0 0.1 0.2 0.3 0.4
0.1 µm
0.2 µm
0.2 µm0.1 µm
Note: Characterize media retention by Entegris proprietary protocol of PSL beads solution
frequently asked questionsDoes the Solaris filter family have a connectology option?Yes. All of the Solaris filters can be specified with a connectology manifold.
Can the Solaris Filter Family be used for POD (Point-of-dispense) process?Yes, you need to consider the space of dimension to install Solaris filters in your POD process.
Product
Solaris NMB Disposable Filters
Solaris CL Depth Filters
Solaris CM Depth Filters
Solaris SCR Filters
Materials Media: Melt-brown polypropylene
Media: Wrapped melt-blown polypropylene
Media: Polypropylene depth filter
Media: Melt-blown polypropylene
O-ring: EPR O-ring: EPR Shell: Polypropylene O-ring: EPR
Maximum operating conditions
Maximum forward differential pressure: 50 psi @ 20°C (68°F)
Maximum forward differential pressure: 50 psi @ 20°C (68°F)
Maximum operating temperature: 50°C (122°F)
Maximum forward differential pressure: 50 psi @ 20°C (68°F)
Maximum liquid service pressure: 3.5 bar @ 20°C (68°F)
Available sizes 5" 5" 5" 5", 10"
Available retention ratings
0.1, 0.2 μm 0.3, 0.5, 0.7, 1.0, 3.0 μm 0.3, 0.5, 0.7, 1.0, 3.0, 5.0 μm
1.5, 3.0 μm
Tailored to application needs
Solaris NMB Retention Curve
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 1514
PUR
ITY
AMC Tool-Top Filters
FEATURE ADVANTAGE BENEFITHigh removal efficiency (>95%) • Removes critical acids, bases and organics
from the fab ambient air• Reduces contamination risk
Proprietary chemistry developed with key OEMs
• Protects optics and process • Qualified by leading fabs
High surface area • Low pressure drop • Reduces energy requirements and cost
Optimized blend of treated, untreated activated carbons and ion-exchange media
• Balanced mix to match lifetimes for all contaminant classes
• Provides targeted contaminant removal
Data-driven See it. Control it. methodology
• Clearly identifies critical AMC levels in customer’s facility
• Provides tailored, application-specific filtration solutions
Product backed by Entegris OEM certified, ISO 17025 accredited laboratory services
• Product performance windows are clearly defined
• Provides assurance that all performance claims are verified with supporting data
Available in a range of sizes to satisfy various installation requirements, including tool-top, fan filter unit, tool interface or in-tool housing in all equipment front-end modules (EFEM) and process modules
• Field tested and proven • Easy to implement and install
performanceFilter lifetime estimate: actual filter life is determined by measuring the fab’s chemical challenge concentration, downstream quality and testing of returned filters.
Pressure Loss vs. Velocity
Velocity (ft/min)
Pres
sure
Los
s (P
a +/
- 25
%)
120
100
80
60
40
20
00 50 100 150 200
100
95
90
85
80
75
70
Typical Lifetime
Lifetime (ppb-hrs ±25%)
Rem
oval
Eff
icie
ncy
(%)
0 100,000 200,000 300,000 400,000 500,000
Acids
Organics
Bases
A unique chemistry removes critical contaminants at a low pressure drop for production tools.
• High removal efficiency >95%
• Removes critical acids, bases and organics from the fab ambient air to reduce contamination risk
• Long life
• Removes a comprehensive array of AMCs in a single filter cell
Optimized for process tool Airborne Molecular Contamination control.Entegris AMC tool-top filters provide AMC protection for all semiconductor process tools including: wafer metrology, reticle inspection, ALD, EPI, diffusion, CVD, PVD, wet etch, wafer clean, dry etch and CMP.
frequently asked questionsHow do I choose the correct filter for my application?Our recommendation is based on different parameters such as: AMC targeted, flow rate, maximum pressure drop acceptance, mechanical dimensions and expected lifetime.
How do we determine filter lifetime?Entegris provides on site and post mortem analysis to optimize filter changeouts.
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 1716
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performance
Microenvironment control: A system approach
• Entegris Barrier Material (EBM) to improve purge duration, quicker purge down time and less absorption/desorption of outgassing from wafers
• Snorkel purge option to rapidly purge down to low moisture and oxygen levels while directing airflow between the wafers
• Clarilite® Wafer for maintaining low moisture or oxygen conditions for extensive time frames
Microenvironment Control Solutions
The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides high-performance wafer transport, optimum automation integration and low cost of ownership for your facility.
• High-strength assembly
• Wafers protected against shock and vibration
• Meets all applicable SEMI® standards
• Uses STAT-PRO® 3000 carbon-filled PEEK™ material at all wafer contact points
• One piece molded shell
• Optional configuration available for a conductive shell to increase protection
• Microenvironment control
Optimized for below 45 nm processing.
frequently asked questions
What kind of identification options are offered?• Various shell colors for segregation• Colored inserts on handles• License plate• Molded-in bar code• Print-on-demand labels• Laser marking
Why 25+1 slots instead of 25?One slot can be used for a test or monitor wafer
FEATURE ADVANTAGE BENEFIT
New latch mechanism
Dual action wafer retainer
Wafer contacts are all PEEK
Wafer edge contact only
Purge capable
• Increases FOUP sealing and conductance• Increases ESD protection• Reduces airborne molecular
contamination (AMC) and backside particles
• Improves yields
Molded one-piece carbon-filled PEEK wafer supports integrated with shell
• Greatly reduced tolerance issues• Precise wafer plane performance
• Increases tool uptime• Improves reliability and
interoperability on loadports• Improves tracking through
molded-in barcodes and RF tags
Simple, reliable pod assembly • Has minimum part count and no metal parts
• Snap fit parts
• Improves COO• Improves cleaning and drying
cycle time• Field replaceable units for FOUP
refurbishing
EBM configuration • Allows significant extension of purged environment (low moisture)
• Quicker purge down time
• Protects wafers longer from conditions that allow corrosion or hazing due to moisture
Snorkel purge • Higher airflow• Directs airflow between wafers
• More effective purge than traditional techniques
Purging with inert gas will remove moisture and oxygen during or between critical process steps. Etching and deposition steps are prime examples.
• Reduces corrosion and hazing issues
• Improves yield
• Improves queue processing time
• Helps control environmental contamination due to:
- Outside contamination (atmosphere) - Outgassing of the wafers - Outgassing of the FOUP (humidity)
Challenges in wafer microenvironment control O2 and H2O control
0
5
10
15
20
25
30
35
40
45
0 10 20 30 40 50 60 70 80 90
Standard PC FOUP
EBM FOUP
100 110 120 130 140Time (min)
Hum
idity
(% R
H)
Relative humidity (H2O) recovery over time after a FOUP purge
EBM Spectra-S
Process Acid Base Organic O2 H2O Dopant
Gate Oxide • • •Ultra Shallow Junction • • • •Copper seed to plate interface •Exposed Copper Corrosion • •Reticle Storage • •HSG (hemispherical glass) Poly • • •Salicide contact formation • • • •SiGe • • •EPI/Pre-EPI • • •Lithography (photoresist sensitivity)
•
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 1918
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FEATURE ADVANTAGE BENEFITMolded-through-the-core design
• Allow rapid and consistent installation on tools
• Eliminate alignment and gapping problems• Remain dimensionally stable
• Reduce system downtime• Increase system throughout• Keep concentricity during use
High-purity PVA • Allow for more efficient cleaning of PVA in manufacture
• Reduce brush break-in and flush-up time• Low extractable and reduced particle counts
on wafers
• Deliver the most consistent performance
• Quicker CMP tool startup
Close molded technology • Very good core flow equalization • No risk of non-repeatable and non-predictable performance due to inconsistent flow rates through the length of the brush
Designed for use with Applied Materials®, Ebara® and Ontrak® CMP equipment, Planarcore® PVA brushes feature molded-through-the-core construction for superior performance and wafer-to-wafer cleaning consistency.
• Easy installation
• Reduce downtime on tool
• Decrease defectivity on wafer
• Consistent cleaning for the period of brush life
Optimized for the needs of next-generation copper and ILD applications.
Planarcore® PVA Brushes
performance
The results of an accelerated tribological stress evaluation (48-hour marathon run) of PVA brushes show the following:
• The post-CMP cleaning comparative evaluation of Planarcore in a Cu/Low-k process was found to be similar or better than the fab POR slip-on-the-core design brushes in a third-party characterization of brushes
• The total variation range of dynamic coefficient of friction (COF) for Planarcore seems to be minimum vs. slip-on-the-core PVA sleeve design of two other suppliers.
What is the cleanliness of our brush?We have low impurity with metals, ions and particles.
What are the main differences or advantages vs. competitors?The major advantages we have, compared to our competitors include ease of use, brush break-in process, wafer-to-wafer consistency and longer lifetime.
frequently asked questions
3500
3000
2500
2000
1500
1000
500
0POR Total Entegris PVA Total
Nor
mal
ized
Def
ect
Coun
t
Brush Type
Roughness/corrosion Scratch Particle/residue
No defect found/unknown Non-CMP
Average AIT XP pareto of defects for two PVA brush types
Brush C (MTTC Design) COF Results1.0
0.8
0.6
0.4
0.2
0
-0.22 8 36244 48
COF
(Mea
n an
d To
tal R
ange
)
Scrubbing Time (Hours)
Brush C (MTTC design) COF resultsMolded-through-the-core (MTTC) design PVA brushClose molded PVA and working surface with nodules
Integrally molded stay-in-place core/mandrel
PVA flow equalization and anchor layer
Flow channelFluid flow
through core
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 2120
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Designed to maintain constant surface morphology and consistent material removal rate, preventing "glazing".
• Infinite pattern design flexibility
• Tuned diamond film properties
• Reduced scratch defects
• Consistent pad cut rate performance
• Longer lifetime
Optimized for harsh environments and chemistries such as in-situ Tungsten, as well as configuration for sub-20 nm technologies requiring gentle conditioning when polishing extremely sensitive surface features.
Planargem® Pad Conditioners
FEATURE ADVANTAGE BENEFITPolycrystalline CVD Diamond Film
• Enable long life• Chemically clean and stable in process
chemistry• Stronger than natural diamond grit
• Reduce work per facet• No internal defects
Textured Silicon Carbide Substrate
• Flexible topography design• No diamonds to fall out or break off into
polishing process• Significantly improved disc to disc
repeatability
• Tailored to fit customer process• Provide reduced CMP process
variability
Segment Design • Assembly flatness• Keep 'flatness'
• Cost efficient• High design flexibility
What is the pad cut rate drop performance?• CVD Film and engineered substrate contribute
to stable performance and eliminate conditioner break-in
• Provides savings on both pad and conditioner life• Tunability of features and coating enable
throughput maximization
What are the main differences or advantages vs. competitors?Our key product benefits include: performance flexibility, lower defectivity, consistency, cleanliness and extended lifetime.
frequently asked questions
performance
Nor
mal
ized
Pad
Cut
Rat
e (µ
m/h
r)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
0 2 4 6 8 10 12Conditioning Time (hr)
Planargem
CVD Competitor
Standard Conditioner A
Standard Conditioner B
Pad Conditioner - Cut Rate UniformityPad Conditioner - Cut Rate Uniformity
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 2322
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Entegris has the broadest range of configurations and sizes available for Flaretek, FlareLock®II and PureBond® PFA fittings.
• Most complete line of flare and pipe fitting connection applications
• Flare fittings provide leak-free performance in demanding applications
• PureBond weldable pipe fittings provide a rigid, permanent, leak-free piping system
• Broad range of sizes and configurations: flare 1⁄4"– 11⁄4", PureBond 1⁄4"– 2" elbows, unions, reducers, caps, tees, crosses and adapters
Optimized for bulk distribution, valve manifold boxes mainline, wet etch and clean applications: HF, H2O2, H2SO4, H3PO4, HNO3, MAE and chemical mechanical planarization.
frequently asked questions
performance
FEATURE ADVANTAGE BENEFITPFA wetted surfaces • Provides high purity and
chemical resistance • Long product life
• Lower cost of ownership through increased productivity and throughput
Largest installed customer base of PFA fittings
• Global manufacturing and support• Assured reliability and performance
• High service levels in all regions • Lower cost of ownership through
increased manufacturing uptime
Available in a broad range of sizes and configurations
• Single source supplier for all high-purity, corrosive chemical connection needs
• Suitable for a wide variety of high-purity applications
• Reduces number of suppliers• Lower design cost
Flow Pattern Comparison Standard vs. Sweep Elbow at 5 GPM
The Computational Fluid Dynamics software analysis shows a 56% increase in flow and 60% lower pressure drop through the same size fitting at 5 GPM. Eliminating the sharp corner also reduces the shear rate of slurries.
Maximum Pressure Capabilities @ Room Temperature Values in psig (kPa)
FlareLock II Size PVDF Nut PFA Nut CPFA Nut PFA Nut1⁄4" 225 (1551) 225 (1551) 225 (1551) 225 (1551)3⁄8" 225 (1551) 225 (1551) 225 (1551 225 (1551)1⁄2" 190 (1310 190 (1310) 190 (1310) 190 (1310)3⁄4" 110 (758) 110 (758) 110 (758) 140 (965)
1" 75 (514) 75 (514) 75 (514) 90 (620)
11⁄4" 80 (552) — — N/A
What is Flaretek?The flaring process provides a permanent expansion (flare) of the tubing end, allowing insertion of the Flaretek fitting body.
What are the tools required to make a proper Flaretek connection?A heating source (air gun), mandrel and tube cutter.
What are the requirements to make a PureBond connection?A 1‘‘ or 2‘‘ Entegris PureBond tool kit.
What does a X at the end of a part number mean (e.g. E8-8FN-1X)?X means fitting body is made of PFA HP Plus and it is recommended for chemicals containing fluorinated surfactants.
When is FlareLock II recommended? For elevated temperatures >100°C or higher pressure (see chart) and before/after pumps (pulsation / vibration).
Tube and Pipe Fittings
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 2524
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PrimeLock® Fittings
The simplest, cleanest and most robust PFA fitting on the market.
• PrimeLock® fittings ensure leak-free performance in the most demanding chemical applications
• Easy to assemble, heat is not required
• The audible and visible indicator allows users to verify the proper makeup of the connection
• Broad range of sizes and configurations: ¼" to 1¼" elbows, unions, reducers, caps, tees, minimum tube unions and adapters
• Expanded on a wide range of Entegris products: Chemlock® filter housings, NT pressure transducers, CR4 ¼" and CR8 ½" series valves.
Ideal for high purity, corrosive chemical handling, low surface tension chemistries and high-temperature applications.
FEATURE ADVANTAGE BENEFITEase of assembly • Audible and visual indication of proper
fitting makeup • Consistent and repeatable
fitting makeup
PFA wetted surfaces • Broad chemical compatibility • Simplifies product selection
Robust thread design • Three backup seals• No cross threading• Quick makeup• Increased sealing forces
• Consistent leak-free connection
Unique seal design • Nonwetted insert eliminates multiple entrapment, leak points and flow interruptions
• Improved process
Capable of 200°C (392°F) temperature rating
• Simplifies product selection • Lower design cost
No heat required to flare tubing • Reduces operator variability • Saves time and money
performance
The unique seal design removes the insert from the flow stream
• Reduces entrapment
• Reduces leak points
• Eliminates flow interruptions
Backup seal 2: Surface between ID oftube and OD of insert
Primary seal
Backup seal 1: Surface between insert and fitting nose
Backup seal 3: Surface between OD of tube
and inside of fitting body
Tube insert, nonwetted
PrimeLock Cross-sectionThree backup Seals
PrimeLock Cross-section 3 Backup Seals
PrimeLock ¼"- 1" fittings are compatible with high-temperature chemical processes:
• At temperatures up to 200°C at 40 psi
• At room temperatures it is rated to 120 psi
Pressure vs. Temperature Rating
frequently asked questionsWhen should I use PrimeLock fittings?PrimeLock fittings can be used in high-purity, corrosive chemical handling, semiconductor applications, solar, LED, flat panel display and with low surface tension chemistries. Also, used in high- temperature applications up to 200°C.
How can I find the appropriate fitting? You can generate fitting part numbers based on your specifications and search the extensive online catalog on: • The web at www.entegrisfluidhandling.com• The mobile selection tool at:
m.entegrisfluidhandling.com Scan QR Code
Fittings mobile selection tool
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 2726
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FEATURE ADVANTAGE BENEFIT
Optimized 90° radius • Reduces total system pressure drop • Increases overall equipment lifetime
• Increases flow• Reduces fluid shear
• Improves yield
• Reduces dead volume • Improves yield by reducing large particles on wafers
• Decreases turbulence • Maintains chemical integrity
Flaretek® 90° Sweep Elbows
Flaretek® 90° elbow with optimized radius eliminates sharp corners to dramatically reduce pressure drop and increase flow. Manufactured from 100% virgin HP PFA material.
• No dead spots
• Increases flow rate in same footprint as standard elbows
• Decreases fluid turbulence for CMP chemical health
Optimized for high volume bulk chemical distribution and CMP slurry applications.
performance• 60% lower pressure drop through
the fitting compared to the standard 90° elbow
• Smallest footprint sweep available, making it practical for OEM tools
• Reduced footprint design saves assembly time
Achieve better results than standard 90° elbows
• Standard 90° elbow burst pressure: 644 psig (average)
• Sweep 90° elbow burst pressure: 825 psig (average)
Standard vs. Sweep Elbow
frequently asked questionsWhat fitting sizes and accessories are available?• Fitting sizes: ½", ¾" and 1"• Spacesaver or PureBond® connections available• FlareLock II, PVDF, PFA, CPFA nut available
What are the pressure and temperature ratings?Pressure and temperature ratings are the same as a standard 3⁄4" 90° elbow fitting. Visit www.entegrisfluidhandling.com for additional information.
How can I find the appropriate fitting?You can generate fitting part numbers based on your specifications and search the extensive online catalog on: • The web at www.entegrisfluidhandling.com• The mobile selection tool at:
m.entegrisfluidhandling.com
Flow Pattern Comparison Standard vs. Sweep Elbow at 5 GPM
¾" P/N USE12FN-3
2 x 2.20" 2 x 2.20"
Scan QR Code
Fittings mobile selection tool
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 2928
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Broad range of tubing and pipe made from 100% virgin high-purity PFA material for highly corrosive, ultrapure applications.
• Tube flaring process provides leak-free connections and offers design flexibility
• PureBond weld process is ideal when permanent connections are required
• Non-intrusive, non-contaminating and permanent serialized laser-marking allows immediate material identification
• Standard wall tubing is available in 1⁄4", 3⁄8", 1⁄2", 3⁄4", 1", 11⁄4", 11⁄2" sizes
• Pipe is available in 1⁄4", 1⁄2", 3⁄4", 1", 2" sizes
• Pipe and tubing are available in different PFA grades
Optimized for bulk distribution, valve manifold boxes mainline, wet etch and clean applications: HF, H2O2, H2SO4, H3PO4, HNO3, MAE and chemical mechanical planarization.
frequently asked questions
performance
Tubing and Pipe
Can I use the standard 4200 material with surfactant?4200 should not be used with fluorinated surfactants.
Are all tubings available as coiled tubing?Yes, the standard straight wall tubing can be coiled customized.
Is a convoluted tubing available?Yes, available in ½", ¾" and 1" sizes.
How can I identify my installed tubing? Laser marking identifies the size, and traceability to a material lot number and production inspection record (except 0.030"wall).
FEATURE ADVANTAGE BENEFIT
PFA material of construction • Broad chemical compatibility• Long product life
• Lower cost of ownership through increased productivity and throughput
Long-term performance testing at various media temperatures
• Products can be used with confidence at maximum continuous rating
• Added safety• Lower cost of ownership through
increased manufacturing uptime
Laser marked tubing • Sure method of traceability • Accurate and easy identification in critical situations
Available in different PFA grades: 4200, 4300 and 4400 (HP plus)
• Customizable in different material quality requirements
• Exact grade of PFA can be selected to best fit the application
• Increased product performance and longer product life
Pressure vs. Temperature
300
250
200
150
100
50
0
1724
1379
1034
690
345
0
37.80
50 100 150 200 250 300 350 400
65.5 93.3 121.1 148.9 176.7 204.4Fluid Temperature (°C)
Fluid Temperature (°F)
Pres
sure
(PSI
G)
AT250-047
AT375-062
*1” and 11/4” ratings vary slightly. Please consult the factory for specific rating information.
AT500-062
AT1000-062,AT1250-075*
AT750-062
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FEATURE ADVANTAGE BENEFITModular design • Ease of assembly
• Easily configured into custom manifolds• Compact footprint
• Improves serviceability• Allows tool manufacturer
to optimize space
High-temperature capability • Solves variety of critical issues including photoresist stripping
• Improves yield
Vented actuator design • Able to withstand corrosive environments • Improves reliability• Extends product lifetime
Variety of end connections • Versatility and ease in system design • Improves cost of ownership
Available in 3-way configurations
• Three-ported directional valve design • Enables simplification of system design
CR4, CR8 and CH8 valves are next generation valves specifically designed for corrosive environments.
• Modular design – manifoldable
• Small footprint
• High-temperature capability
• High-purity corrosive chemical handling
CR4 is ideal for low flow wet etch and clean applications and high temperature corrosive chemical handling. CR8/CH8 is ideal for mid flow wet etch and clean, low volume bulk chemical delivery and high-temperature applications.
CR4, CR8 and CH8 Manual and Pneumatic Valves
performance• Sealed actuator with separate actuator vent
port
• Ability to vent the actuator through a separate vent line to a controlled environment
What configurations are available?• Pneumatic, toggle or multi-turn actuators• ¼"to ¾" port sizes• Flaretek, PureBond, Pillar S300 or PrimeLock
connections • Options for position indicators, restricted open
and close, LOTO etc.
Is there a 3-way CR valve available?Yes, it is available ¼"to ¾" pneumatically actuated.
Are all CR valves actuators manifoldable?Yes, all 2-way and 3-way valve types with all actuator configurations can be manifolded.
When should I choose CH8 vs. CR8?When temperature exceeds 130°C (226°F), CH8 should be selected. CH8 can support up to 180°C (365°F).
Why should I use CR4 instead of Sg4? • CR4 has no exposed metal hardware and will
be more resistant to corrosive environments. • Higher temperature capabilities compared to
SG4 series• Improve ease of field repairability • CR4 is a direct replacement for SG4
frequently asked questions
performance (continued)
CR4 CR8/CH8
Orifice 1⁄4" 1⁄2"
Media temperature range 21°C - 160°C CR8: 21°C - 130°C CH8: 21°C - 180°C
Inlet/outlet pressure rating at RT CR4: 80 psig / 40 psig CR4 HP: 80 psig
80 psig
Cv 0.29 - 0.84 2.4 - 3.4
Reliability Tested over 2.1 million cycles Tested over 4 million cycles
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 3332
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NT® electronic flowmeters are ideal for capturing critical diagnostic information for monitoring or controlling process applications.
• Provides simultaneous measurement of outlet pressure and flow rate
• No moving parts offers reduced particle generation potential
Optimized for use in ultra high purity applications in the semiconductor industry.
NT® Electronic Flowmeters, Model 4400
FEATURE ADVANTAGE BENEFITNo moving parts • No particle generation
• Provides repeatable and reliable measurements
• Yield improvement• Throughput improvement
Flow-through design • Minimizes dead volume • Contamination potential reduction
Integral pressure transducer • Additional process information supply • Process control enhancement
performance
80%
100%
60%
40%
20%
0%
20:1
turn
dow
n(E
flow
rang
e)
10:1
turn
dow
n(T
flow
rang
e)
% F
ull S
cale
Flo
w R
ate
(Sta
ndar
d flo
wm
eter
usi
ng d
eion
ized
wat
er)
Pressure Drop (bar)
Pressure Drop (psid)
0 0.15 0.30 0.45 0.60 0.75 0.90 1.05 1.20
0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0
Pressure drop vs. flow rate
What applications can be covered by the NT electronic flowmeters?NT electronic flowmeters are best used for monitoring or controlling process applications, such as:• Chemical, DI water and slurry dispense• Precision blending and metering• Totalized flow for custody transfer• System diagnostics
What types of sensor interfaces are available?CTFE or PFA.
frequently asked questions
Materials-wetted parts
Body: PTFESensor interface: PFA or CTFEPrimary seal: Kalrez®
Materials-nonwetted parts
Polypropylene, polyethylene, PVDF and PVC, or FEP-jacketed cable
Process temperature
10°C to 65°C (50°F to 149°F) Consult factory for higher temperatures
Electrical input
24 VDC (12-28 VDC input voltage)
Electrical output
Two 4-20 mA electrically isolated outputs, one for flow and one for outlet pressure
Process drop 3 psid at nominal flow, 10:1 turndown12 psid at nominal flow, 20:1 turndown
Operating pressure
0 to 60 psig (0 to 414 kPa)
Over-pressure limit
T100 psig (690 kPa)
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 3534
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NT® Integrated Flow Controllers, Models 6510 and 6520
FEATURE ADVANTAGE BENEFITPTFE and other high-purity fluoropolymer wetted surfaces
• Corrosion resistant • Maintains high purity process
Pressure output included • Eliminates needs for additional instrumentation
• Improves metrology • Improves process control• Lowers cost
Compact footprint • Easy for field installs and OEM designs with limited space
• Upgrades older equipment• Allows tool manufacturers to
optimize space
Discrete alarm output • Improved diagnostics • Increases tool uptime by improved systems troubleshooting
frequently asked questions
6510 6520
Sensor interface CTFE, PFA CTFE, PFA
Flow range 0-15 mL/min to 0-1250 mL/min 0-2.5 L/min to 0-40 L/min
Flow measurement accuracy
±1% full scale >20-100% of full scale flow range ±2.5% full scale 10-20% of full scale flow range
Repeatibility ±0.5% full scale >20-100% of full scale flow range ±1% full scale 10-20% of full scale flow range
Pressure measurement 0-414 Kpa (0-60 psig)
Pressure accuracy ±1% of full scale
Process temperature 10°C – 65°C (50°F -149°F)
Size 852 cm3 (smallest IFC on the market)
1744 cm3
NT® integrated flow controllers, models 6510 and 6520 are designed for critical dispense applications, chemical blending and on-demand chemical mixing applications.
• PTFE wetted surface for high-purity applications
• No moving parts offers reduced contamination potential
• Nonmetallic sensing technology based on differential pressure provides reliable measurement
• Compact design
NT model 6510 is ideal for aggressive chemical applications where accurate dispense or dosing is needed.NT model 6520 is ideal for high-flow applications such as bulk delivery or tool liquid dispense.
performance
Enhancements to valve motor and diaphragm provide improved flow control, added safety and contamination protection.
What are the NT integrated flow controller requirements?• Line pressure must be at least 10 psig• Sizing for flow control: target flow (nominal flow)
should be within 35 - 90% of a flow controller's flow range
• Maximum working pressure: 60 psig
Do bubbles affect pressure/flow measurement?No, NT Integrated flow controllers combine a differential pressure-based flowmeter and a leading edge control valve to create a closed loop flow controller.
What types of sensor interfaces are available?CTFE, PFA or CTFE (hydrofluoric acid compatible).
How do I choose the right interface for my application?• CTFE should be used for most aqueous chemical
solutions and select solvents• PFA should be used for solvents, select chemicals
and process temperatures above 40°C• CTFE (Hydrofluoric acid compatible) should be used
for HF applicationsPlease refer to chemical compatibility chart for sensing and control products: http://www.entegris.com/Resources/assets/3960-2602-0912.pdf
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 3736
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The NT® control module is an integrated display and fully programmable process controller that allows the user to fine-tune control parameters, display settings and alarm set points
• PID control
• Fully programmable
• Compact design
• Output alarms and local display
• Deviation indication
• Keypad or external set point input
• Programmable alarms and alarm delays
Optimized to meet flow control needs for chemical and slurry dispense.
NT® Control Modules
FEATURE ADVANTAGE BENEFITFully programmable • PID control parameters selection
• Settings and alarm set-points display• Process optimization
Peristaltic pump controller functionnality when used with a NT Electronic Flowmeter
• Closed-loop flow control system• Fluid flow maintenance at hte desired set
point
• No peristaltic pump calibrations• Chemical and Di water usage
reduction
Alarming display functionnality when used with an NT Integrated Flow Controller
• Alarm on the difference between actual flow and set point
• Constant flow rates maintenance
performance
What is the function of the NT control module as an alarming display?NT control modules may be used as an alarming display for NT integrated flow controllers or similar set point driven devices.
What are the major advantages of an NT control module?NT control module successfully improves process, reduces costs and increases uptime.
frequently asked questions
Accuracy ±0.2% full scale, plus 1 digit
Temperature (operating) 0°C to 50°C (32°F to 122°F)
NT® Control Module
Peristaltic Pump
Control signaloutput
Flow
Sig
nal
Flow
Set point inputfrom process
Peristaltic Pump Control
NT® Electronic Flowmeter
Example Application
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NT® pressure transducers provide accurate and reliable inert pressure measurements, and measure gas or liquid pressure, allowing you to monitor process conditions for increased safety and system performance.
• No moving parts or fill fluids help reduce contamination potential
• Nonmetallic sensing technology provides reliable measurement
• Compact design
• Dymension manifold mountable
Optimized for aggressive chemical applications.
NT® Pressure Transducers
FEATURE ADVANTAGE BENEFITAll wetted parts are constructed of PTFE, sapphire and other high-purity polymers for corrosion resistance
• Compatible with typical semiconductor process chemistries
• Improves yields by increasing particle performance
Provides compatibility and easy integration with electronic displays and monitoring systems
• Enables tool interaction with pressure transducer and offers increased accuracy in pressure measurements
• Increases overall equipment efficiency
Single port and flow through styles offered with industry standard Flaretek and Super 300 Type Pillar® fittings
• Compact design enables easy installation
• Improves system design flexibility
No moving parts or fill fluids • Reduces contamination potential • Increases tool uptime
performance• Provides reliable pressure
measurement where manual gauges only provide approximate pressure results
• Pressure transducers can help determine filter lifetime where critical contamination control is needed
frequently asked questionsWhere can I use NT pressure transducers?• System diagnostics• System pressure monitoring for tool queuing• Pressure at chemical distribution modules, valve
manifold boxes and point-of-use• Differential pressure in filtration systems• Integrated into custom valve manifolds
Can NT pressure transducers, model 4100 be used in high-temperature applications?Yes, contact Entegris for more information.
How long can model 4150 and 4250 survive 49% Hydrofluoric acid (HF) at 23°C?Estimated 10 years.
How do I choose the right interface material for my application on pressure transducers, model 4100 and 4210?• CTFE should be used for most aqueous chemical
solutions and select solvents• PFA should be used for solvents, select chemicals
and process temperatures above 40°C.• For hydrofluoric acid applications, contact Entegris
for more information.Please refer to chemical compatibility chart for sensing and control products:http://www.entegris.com/Resources/assets/3960-2602-0912.pdf
Monitor Pre-, Post- and Differential Pressure
NT Model Pressure Transducer(for inlet pressure)
NT Model Pressure Transducer(for outlet pressure)
NT Dual Channel Display
Filter Housing
Flow
Differential pressure set-point for filter replacement
Monitoring Differential Pressure To Schedule Filter Replacement
«» CMP «» ENTEGRIS INC. ENTEGRIS INC. «» CMP «» 4140
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CR-288® Concentration Monitors
FEATURE ADVANTAGE BENEFIT288-connect software package • Real-time information
• Integrated data collection and analysis• Real-time concentration and
temperature-compensated data
• Reduce process intrusion or interruption
• Provide convenient and scalable data interface and acquisition options
• Improve productivity
SEMI Standard for cleanliness, testing and calibration
• Optical sensor system• Sensors laser-marked• Factory leak-tested• Sensor calibration table
• Provide ultra high-purity fluid system components
• Provide traceability• Meet the allowable leak rate set by
SEMI Standard• Optimize performance and improve
resolution for most liquids
LCD digital display unit (DDU) • Configurable 5-volt digital I/O channels and up to for measurement points
• Optimize the measurement of concentration and temperature
For which applications can I use the CR-288 concentration monitor?Process monitoring for inline liquid chemical applications.
What is the interface of the connection?Customers can select Flaretek, Super 300 Type Pillar and PrimeLock end connections; other end connections available upon request.
Can the sensor monitor slurries?The sensor uses refractive index technology to monitor chemical concentration and is unaffected by light dispersion through the slurry. It is able to monitor in the presence of particulates and bubbles.
frequently asked questions
Entegris CR-288® Concentration Monitor and 288-connect® software package delivers real-time information for point-of-use chemical mixing/blending, spiking and dilution without process intrusion or interruption.
• Integrated data collection, analysis and field calibration
• Improvement on productivity
• Compliant to SEMI Standard F57-0301 for cleanliness, testing and calibration
Optimized for inline liquid chemical applications.
performance
The following performance data is based on operation within the calibrated range, ±10% of the refractive index range.
Criteria Value
Refractive index accuracy (Refractive Index Units, RIU): ±5 × 10-5
Refractive index repeatability: 2.5 × 10-5
Refractive index resolution: 1.0 × 10-5
Concentration accuracy: ±0.05 wt%*
Concentration repeatability: ±0.025 wt%
Concentration resolution: Chemical dependent 0.01 wt% or better
Temperature accuracy: ±0.2°C (0.4°F)
Temperature repeatability: 0.1°C (0.2°F)
Temperature resolution: 30.05°C (0.06°F)
Response time: 1.2 sec standard, no rolling averaging enabled,rolling averaging is user-configurable
* Based on measuring semiconductor-grade chemicals, such as hydrogen peroxide, in slurries at typical environmental parameters of 25-35 psi with a maximum variation of ±0.25 psi, and temperature of 18°C – 26°C (64.4°F – 78.8°F) with maximum variation of ±0.1°C (0.2°F).
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The cryogenic cleaning process consists in projecting CO2 pellets. As the CO2 sublimates, it mechanically removes contaminates from the surface.
Cryogenic cleaning acts efficiently for the following applications
• Stripping
• Remaining burrs
• Cleaning technology
• Decontaminating the organic elements
• Removing grease on all materials
Optimized for CMP part cleaning.
Cleaning Part Services
FEATURE ADVANTAGE BENEFITUnique process • Non-abrasive • Longer part life time
• No contamination from the part to the processSandblasting alternative solution
Detergent, chemical and solvent free
• Environmentally friendly• Green treatment, no toxic waste
• No chemical elements on the part• No crosscontamination risks• No interaction with processDry cleaning
Equipment parameter hard/soft adjustment (pressure, distance, power, grid size…)
• Repeatable process • Reliable process• Parts conformity systematically
maintained
performanceCryogenic decontamination experiment on a CMP equipment blade
• Goal: Remove slurry from a part for immediate use on a machine
• Result: The blade is completely cleaned of slurry and all organic residues. An additional step of precision cleaning can be done in order to remove all particles.
• Benefit: The cleaned part is in perfect shape (no trace, no abrasion, no slurry) and ready for use.
What materials can be treated by cryogenic cleaning?Cryogenic cleaning is a dry and non-abrasive process. All materials can be cleaned without damage.For example, plexiglas and polished aluminum canbe treated without the surface becoming dull or scratched.
frequently asked questions
Before cleaning After cleaning
Area contaminated by organic contamination
Entegris®, the Entegris Rings Design®, creating a material advantage®, Planargard®, Planarcap®, Solaris®, Chemlock®, Connectology®, Planarcore®, Planargem®, PrimeLock®, CR-288®, 288-connect®, Flaretek®, FlareLock®, Spectra™, Clarilite®, STAT-PRO®, PureBond®, NT®, and Mykrolis® are trademarks of Entegris, Inc. | AMAT™ is a trademark of Applied Materials, Inc. | Ebara® is a trademark of Ebara Corporation | Ontrak® is a trademark of Lam Research Corporation | Teflon® is a registered trademark of E. I. du Pont de Nemours and Company | Pillar® is a registered trademark of Nippon Pillar Packing Company, Ltd. | PEEK™ is a trademark of Victrex PLC | Kalrez® is a registered trademark of DuPont Dow Elastomers, L.L.C. | SEMI® is a registered trademark of Semiconductor Equipment and Materials International Corporation.
NORTH AMERICA
Massachusetts Entegris, Inc. Corporate Headquarters 129 Concord Road Billerica, MA 01821 USA Tel. +1 978 436 6500 Fax +1 978 436 6735
MinnesotaEntegris, Inc. 101 Peavey Road Chaska, MN 55318 USA Tel. +1 952 556 3131 Fax +1 952 556 1880
Customer Service Tel. +1 952 556 4181 Tel. 800-394-4083 (toll-free within
North America)Fax +1 952 556 8022 Fax 800 763 5820 (toll-free within
North America)
EUROPE
FranceCustomer Service Center for Southern, Western and Northern Europe Entegris S.A.S. Parc Centr’ Alp Ouest 196 rue du Rocher de Lorzier 38430 Moirans France Tel. +33 (0) 4 76 35 73 50 Fax +33 (0) 4 76 35 73 80
germanyCustomer Service Centers for Eastern and Central Europe Entegris GmbH Hugo-Junkers-Ring 5 Gebäude 107/W Industriegebiet Klotzsche 01109 Dresden Germany Tel. +49 (0) 351 795 97 0Fax +49 (0) 351 795 97 499
IsraelEntegris Israel Limited Izmargad Street 12 Kiryat-Gat Israel Tel. +972 (0) 73 221 00 00 Fax +972 (0) 73 221 00 22
JAPAN
Nihon Entegris K.K. Regional Headquarters Mita-Kokusai Bldg. 1-4-28 Mita, Minato-Ku Tokyo, Japan 108-0073 Tel. +81 3 5442 9718 Fax +81 3 5442 9738
Nihon Entegris K.K. Shin-Osaka Prime Tower 6-1-1, Nishinakajima Yodogawa-Ku Osaka, Japan 532-0011 Tel. +81 6 6390 0594 Fax +81 6 6390 3110
Nihon Entegris K.K. Hakataekihigashi 113 Bldg. 1-13-9 Hakataekihigashi Hakata-Ku Fukuoka, Japan 812-0013 Tel. +81 92 471 8133 Fax +81 92 471 8134
ASIA/PACIFIC
ChinaEntegris (Shanghai) Microelec-tronics Trading Co., Ltd. Unit 606-609, Tower 1 German Centre No. 88, Ke Yuan Road Zhangjiang Hi-Tech Park Shanghai 201203 P.R. of China Tel. +86 21 2898 6710 Fax +86 21 5080 5598
ASIA/PACIFIC
ChinaEntegris (Shanghai) Microelec-tronics Trading Co., Ltd. Rm. 878, Poly PlazaNo.14 Dong Zhi Men South Ave. Dongcheng DistrictBeijing 100027P.R. of ChinaTel. +86 21 6552 8840Fax +86 21 6552 8840
Entegris (Shanghai) Microelec-tronics Trading Co., Ltd. Room 21510, Tower C Shangpin International No.88 Gao Xin Road, Hi-Tech Area Xi'an 710065P.R. of ChinaTel. +86 29 886 00785Fax +86 29 886 00785
KoreaEntegris Korea, Ltd. 4F, 6F and 8F, Seongok Bldg.262 Hwangsaewool-ro Bundang-gu Seongnam-si, Kyunggi-do Korea 463825 Tel. +82 31 738 5300 Fax +82 31 738 5305
MalaysiaEntegris (Malaysia) Sdn. Bhd. Unit 14 and 15, Lower Level 5 (Executive Wing), Hotel Equatorial No. 1 Jalan Bukit Jambul 11900 Bayan Lepas, Penang MalaysiaTel. +60 4 427 4200Fax +60 4 641 3294
SingaporeEntegris Singapore Pte Ltd. 31 Kaki Bukit Road 3 Techlink, #06-08/11 Singapore 417818 Tel. +65 6745 2422 Fax +65 6745 4477
TaiwanEntegris Asia LLC, Taiwan Branch 14F, No. 120, Sec. 2 Gong Dao Wu Road East Dist., Hsinchu City 30072 Taiwan R.O.C. Tel. +886 3 571 0178 Fax +886 3 572 9520
Entegris Asia LLC, Taiwan Branch3F, Rm. 313-314, No.6Zhongxin Road, Xinshi Dist. Tainan City 74148 Taiwan (R.O.C.)Tel. +886 6 589 6008 Fax +886 6 501 3799
Entegris regional customer service centersREgION TELEPHONE FAXNorth America 800 394 4083 800 763 5820Germany +49 (0) 351 795 97 0 +49 (0) 351 795 97 499France +33 (0) 4 76 35 73 50 +33 (0) 4 76 35 73 80United Kingdom +33 476 357 354 +33 476 357 380Italy +33 476 357 352 +33 476 357 380Israel +972 (0) 73 221 00 00 +972 (0) 73 221 00 22Japan +81 3 5442 9718 +81 3 5442 9738Malaysia +60 4 427 4200 +60 4 641 3294Korea +82 31 738 5300 +82 31 738 5305Taiwan +886 3 571 0178 +886 3 572 9520Singapore +65 6745 2422 +65 6745 4477China +86 21 2898 6710 +86 21 5080 5598
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ENTEGRIS, INC. Corporate Headquarters | 129 Concord Road | Billerica, MA 01821 USATel. +1 978 436 6500 | Fax +1 978 436 6735 www.entegris.com
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