charged particle detection using the timepix and … · charged particle detection using the...
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CHARGED PARTICLE DETECTION USING THE TIMEPIX AND TIMEPIX3 CHIPS AND FUTURE
PLANS
M. Campbell, J. Alozy, R. Ballabriga, E.H.M. Heijne, S. Kulis, X. Llopart, T. Poikela, E. Santin, L. Tlustos and W. Wong
CERN, EP Department1211 Geneva 23Switzerland
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- U INFN Cagliari- CEA-LIST Saclay- CERN Genève- U Erlangen- ESRF Grenoble- U Freiburg- U Glasgow- IFAE Barcelona- Mitthoegskolan- MRC-LMB Cambridge- U INFN Napoli- NIKHEF Amsterdam- U INFN Pisa- FZU CAS Prague - IEAP CTU in Prague - SSL Berkeley
http://medipix.web.cern.ch/MEDIPIX/
The Medipix2 Collaboration (1999-present)
University of Canterbury, Christchurch, New Zealand CEA, Paris, France CERN, Geneva, Switzerland, DESY-Hamburg, Germany Albert-Ludwigs-Universität Freiburg, Germany University of Glasgow, Scotland, UK Leiden University, The Netherlands NIKHEF, Amsterdam, The Netherlands Mid Sweden University, Sundsvall, Sweden IEAP, Czech Technical University, Prague, Czech Republic ESRF, Grenoble, FranceUniversität Erlangen-Nurnberg, Erlangen, Germany University of California, Berkeley, USA VTT, Information Technology, Espoo, Finland KIT/ANKA, Forschungszentrum Karlsruhe, GermanyUniversity of Houston, USADiamond Light Source, Oxfordshire, England, UKUniversidad de los Andes, Bogota, ColombiaUniversity of Bonn, GermanyAMOLF, Amsterdan, The NetherlandsTechnical University of Munich, GermanyBrazilian Light Source, Campinas, Brazil
The Medipix3 Collaboration (2005-present)
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Hybrid Silicon Pixel Detectors
Fill factor is 100 % (away from periphery)Full depletion of sensor allows prompt charge collection Extremely high SNR easy to reach Standard CMOS can be used allowing on-pixel signal processing Sensor material can be changed (Si, GaAs, CdTe..)
But because of low volumes bump bonding is still expensive
p+
n-
ASICn-well
p-substrate
Semiconductor detector
Bump-bond contact
Charged particle
gmIin Vout
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Micro-channel plate readout
Charge distribution on stripsCharge Cloud
MCP stack
Tube Window withphotocathode
γ
MCP can be used to detector electrons, ions or neutrons(when e.g. B doped)
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Gas detector readout - InGrid
Semiconductor detector is replaced with charge amplification gridPermits lower energy events to be detected
NB: GEM foils may be used in place of the InGrid foils
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Hybrid pixel detectors
• Developed initially for LHC• 3 large scale vertex detector systems operating smoothly• One large RICH detector system (based on hybrid pixels
in a photodetector tube) contributing to LHCb physics
• In the Medipix2 and Medipix3 Collaborations we have taken the technology into many new fields
• This talk will focus on charged particle tracking and detection using Timepix and Timepix3
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Outline
• Particle detection and tracking using Timepix and some examples of applications
• TheTimepix3 chip and some use cases
• The VELOpix chip
• Tiling large areas
• Summary
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Outline
• Particle detection and tracking using Timepix and some examples of applications
• TheTimepix3 chip and some use cases
• The VELOpix chip
• Tiling large areas
• Summary
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Pixel matrix 256 x 256Pixel size 55 x 55 μm2
Technology CMOS 250 nmMeasurement modes Programmable per pixel:
• Single particle counting • Timepix (arrival time wrt shutter)• Time over Threshold
# thresholds 1 per 55 μm pixel4-bit threshold adjustment
Counter depth 1 x 14-bits
Readout type Frame based• Sequential R/W
Readout Time Serial: <100ms at 100MHzParallel: <300ms @ 100MHz
Minimum threshold ~ 650 e-
Timepix Specifications
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Timepix miniaturised readout
IEAP/CTU, Prague
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CERN@school
Simon Langton School, Canterbury, England
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LUCID detector
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Annual CERN@school Symposium
Langton student Katherine Evans presenting at the CERN@schoolSymposium in September 2014
2016 Symposium to be held at Rutherford Lab tomorrow
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Institute for Research in Schools
-16- 16Image of the astronaut Chris Cassidy working near the Timepix USB on the International Space Station (Courtesy of NASA, photo ref. no. iss036e006175)
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Timepix - 4s exposures
South China Sea South Atlantic Anomaly
University of Houston, IEAP Prague, NASA
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0.3 mGy/d
3 mGy/d
5.5 mGy/d
REM Dose Rate Data (µG/min)
University of Houston, IEAP Prague, NASA
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Carbon Therapy beam monitoring
Slide courtesy of M. Martisikova, German Cancer Research Centre, Heidelberg
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Carbon Therapy beam monitoring
Slide courtesy of M. Martisikova, German Cancer Research Centre, Heidelberg
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Low Energy Electron Microscopy
I. Sikharulidze, J-P Abrahams and co-workers‘Medipix2 applied to low energy electron microscopy’, Ultramicroscopy 110 (2009) 33 - 35
MCP + CCD imagesMedipix2 Images Graphene flakes
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Rutherford backscattering Spectrometry/Channeling @CTN/IST (Lisbon) -> He2+ RBS/C on Si single crystal
• Timepix detector proved to have energy sensitivity andeffective count rate for practical structural analysis byRBS/C
• Improvement on spatial resolution compared with previously used resistive charge PSD
Resistive charge PSD Timepix single chip
Slide courtesy of E. Bosne
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First on-line run with Timepix @ISOLDE CERN24Na : GaN b- - Emission Channeling
l Timepix QUAD→ High position resolutionl Improvement on displacements
and multiple sites determinationl Tpx3 fast count rate will combine
high position resolution with low sample damage
2012-2014FASTVATAGP7PADdetector
22x22=484pads1.4x1.4mm2
>5.5kHz
Slide courtesy of E. Bosne
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Advantages of the Timepix detector in EBSP acquisition
• Sensor separated from the electronics: à Radiation hardnessà Choice of the sensor’s material and thickness
• Direct electron imaging:à Reduced exposure dosesà Reduced beam energies
• Energy discrimination:à Working in noise-free conditionà Energy filtered EBSD pattern
à Improved contrast and sharpness in EBSPs
à increase in the diffraction features of higher order in EBSPs
à Improvement in the depth and lateral resolution
• Compact size Slide courtesy of S. Vespucci
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Energy filtering in EBSD with Timepix
0 10 20 30 40 50 60 70 80
60
80
100
120
140
160
180
Inte
nsity
Pixel
Threshold energy: 4.6 keV 19.4 keV
EBSPs from silicon, Beam energy: 20keV,Beam current: ≈9.5nA, Specimen tilt = 70°Distance specimen-detector: ≈1.5 cmCounted particles: ≈4x1010
Contrast = (Max-Min)/(Min+Max)(a) Threshold energy: 4.6 keV, Contrast: 0.53(b) Threshold energy: 19.4 keV, Contrast: 0.65
c
a Silicon b Silicon
Slid
e co
urte
sy o
f S. V
espu
cci
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Time of Flight Mass Spectrometry
“Enhanced Detection of High-Mass Proteins by Using an Active Pixel Detector”, Shane R Ellis et al, Angewandte Chemie DOI: 10.1002/anie.201305501
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Time of Flight Mass Spectrometry
“Enhanced Detection of High-Mass Proteins by Using an Active Pixel Detector”, Shane R Ellis et al, Angewandte Chemie DOI: 10.1002/anie.201305501
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Timepix at CAST Experiment
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Calibration with very low X-ray energies
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Medipix2/Medipix3 KT License Holders
• Advacam s.r.o. (formerly Widepix)CZ• Amsterdam Scientific Instruments BV, NL• MBI, Christchurch, NZ• PANalytical, Almelo, NL• Quantum Detectors, Didcot, UK• X-ray Imaging Europe GmbH, Freiburg, D• X-Spectrum, Hamburg, D
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Outline
• Particle detection and tracking using Timepix and some examples of applications
• TheTimepix3 chip and some use cases
• The VELOpix chip
• Tiling large areas
• Summary
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Timepix3Pixel matrix 256 x 256Pixel size 55 x 55 μm2
Technology CMOS 130 nmMeasurement modes • Simultaneous 10 bit TOT and 14 + 4 bit
TOA• 14 + 4 bit TOA only • 10 bit PC and 14 bit integral TOT
Readout type • Data driven• Frame based
(both modes with zero suppression)Dead time (pixel, data driven) >475 ns (pulse processing + packet transfer)Output bandwidth 40 Mbits/s – 5.12 Gbits/sMaximum count rate 0.4 Mhits/mm2/s (data driven mode)TOA Precision * 1.56 ns Front end noise 60e- RMSMinimum threshold ~500 e-
Specifications
* Fast ToA block from V. Gromov et al., Nikhef
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Energy and time measurements with cosmic particles
Integral frame ~ 72h
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Timepix3 Spectrum(Si 55µm/300µm)
3.76 keV FWHM
241Am
E. Frojdh
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Read-out chip
Sensor
Energy and time measurements with cosmic particles
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Cosmic ray in Timepix3 - measurement
Precise arrival time information (1.6ns steps) provides depth of interaction within the sensor layer
E. Frojdh
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Aegis Experiment
Slide courtesy of H. Holmestad, Univ Oslo
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90Sr Source measurements with Timepix3
1 sec acquisistion time300 µm p-n Si sensorDetector Vbias = 30VMeasured rate: ~16.5 Khit/sCluster definition: XY distance of ≤ 50 pixelsTOA spread ≤ 150 ns
Measured cluster rate: ~2.2 Kcluster/s
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First 200 events – event number
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First 200 events - ToT (keV)
0 37.5 75
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First 200 events - ToA (ns)
0 65 130
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First 200 events - ToA (ns)
0 65 1300 65 130
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Selected events: #3 and #17
e- impact point
115ns TOA spreadEvent #17
Event #3 30ns TOA spread
130ns TOA spread
#17 impact point
#3 impact point
ToT: 693 KeV
ToT: 374 KeV
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Difference in Charge collection time vs Vbias
0
10000
20000
30000
40000
50000
60000
70000
80000
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Cou
nts
Dt [ns]
cluster tmax-tmin
150V 100V 50V 30V
e- impact point (tmax)
e- (tmin)
1000s acquisition
>1 Mclusters detected
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Total charge in cluster vs Vbias
0
5000
10000
15000
20000
25000
30000
35000
40000
45000
50000
55000
60000
0 50 100 150 200 250 300
Cou
nts
[KeV]
150V 100V
50V 30V
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Outline
• Particle detection and tracking using Timepix and some examples of applications
• TheTimepix3 chip and some use cases
• The VELOpix chip
• Tiling large areas
• Summary
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The LHCb VELO upgrade
624 VeloPixASICs 26 planes
N07-17: P. Collins: ”The LHCb VELO Upgrade”N12-3: P. Collins: “The Timepix3 Telescope and Sensor Development for the LHCb VELO Upgrade”
• Trigger readout @ 1 MHz• Radial strip detector + Beetle ASIC• During physics data-taking, the silicon
sensors @7 mm
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Data rates per ASIC (Gbps)
Hybrid pixel readout chip:Bonded to a sensor.
VeloPix ASIC module
• Trigger-less readout @ 40MHz• The hottest chips 5.1 mm from the beam• Expected integrated radiation 10 years:
– TID: From 50 to 400 Mrad (non-uniform)– 8.5 x 1015 neq cm-2
• Data per chip: ~15.1 Gbps, 2.9 Tbps for VELO
• The module installation during the CERN Long Shutdown 2 (LS2) 2019/2020.
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From Timepix3 à Velopix
Timepix3 (2013) VeloPix (2016)
Pixel arrangement 256 x 256
Pixel size 55 x 55 µm²
Peak hit rate 80 Mhits/s/ASIC 800 Mhits/s/ASIC50 khits/s/pixel
Readout type Continuous, trigger-less, TOT Continuous, trigger-less, binary
Timing resolution/range 1.5625 ns, 18 bits 25 ns, 9 bits
Total Power consumption <1.5 W < 3 W
Radiation hardness 400 Mrad, SEU tolerant
Sensor type Various, e- and h+ collection Planar silicon, e- collection
Max. data rate 5.12 Gbps 20.48 Gbps
Technology IBM 130 nm CMOS TSMC 130 nm CMOS
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Velopix Chip Architecture
• Pixel matrix:– 256 x 256 pixels– 128 x 64 super pixels (2x4 pixels each)– @40MHz
• Packet-based architecture:– 8 pixels/packet + 9 bit time stamp à
30% reduction in data rate
• Data-driven readout:– 20 Mpackets/s/double column
• 40, 80, 160 and 320 MHz TMR clock domains in the periphery
• 1 to 4 configurable serializers (GWT)
• GBT frame compatible
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VeloPix
14.14 mm
Analog front-end16 x 55 um²
Double column:512 pixels64 super pixels
Full matrix:128 Double columns
~190 Mtransistors
Pixel & SuperpixelLogic (HD Library) 16
.6
mm
Active Periphery
2.4
mm
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VeloPix: General Measurements
ü Measured power consumption (@nominal settings):ü Analog < 480 mWü Digital:
ü Periphery < 380mWü Pixel Matrix <350mW (idle)ü @High rate ~+300mW (simulated)
ü Total= ~1.5W @High rateü Slow and Fast control fully functionalü Pixel Configuration and readout ü On-chip biasing DACs (next slide)ü Internally measured packet latency
(@low rate) ü eCDRPLL (CERN) total jitter @320MHz
<6psrms
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Electronic Noise
0
2000
4000
6000
8000
10000
12000
0 1 2 3 4 5 6 7 8
Coun
ts
DACCode
ENCENC fit
µeq= 4.14 (62.9 e-)*σeq= 0.27 (4.1 e-
rms)*
*@gain of 25mV/ke-
Measured ENC of all pixels• Threshold scan over noise floor• All pixels at code 0xF
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0
1000
2000
3000
4000
5000
6000
7000
8000
1200 1250 1300 1350 1400 1450 1500 1550 1600 1650 1700
Cou
nts
DAC Code
Threshold=0x0F
Threshold=0x0F fit
Threshold=0x0
Threshold=0x0 fit
Threshold equalized
µ0x0= 1378σ0x0= 27.06
µ0xF= 1513σ0xF= 26.19
µeq= 1446σeq= 2.65 (40.3 e-
rms)*
Threshold Equalization
Unequalised Threshold distribution: • All pixels at code 0x0
*@gain of 25mV/ke-
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Summary of VELOpix measurements
Pixel gain ~24.6 mV/Ke-
Pixel to pixel gain variation ~3.3%
Pixel ENC 62.9 e-
Pixel to pixel threshold mismatch 410 e-rms
Pixel to pixel threshold mismatch calibrated (Threq) 40.3 e-rms
Expected minimum threshold > 450 e-
Threshold equalization only calculated not measured on chipAll measurements assuming Ctest=5fF
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First source measurements
• First single chip assemblies available since last week at CERN
Fe55 600s Thr ~900 e-
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Outline
• Particle detection and tracking using Timepix and some examples of applications
• TheTimepix3 chip and some use cases
• The VELOpix chip
• Tiling large areas
• Summary
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Tiling larger areas
Single chip assembly
Sensor
ASIC
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Tiling larger areas – present day solution
ASIC
SensorLadder – n x 1
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Tiling larger areas– present day solution
ASIC
ASIC
Ladder – n x 2
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Tiling larger areas - TSVs at periphery
TSVs for IO eliminate wire bonding reducing dead area
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Tiling larger areas - TSVs within pixel matrix
If IO are distributed within the pixel matric TSVs permit seamless tiling
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Tiling larger areas - TSVs within pixel matrix
Permits use of single 4-side buttable tiles
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Through Silicon Via processing of Medipix3/Timepix3
Through Silicon Vias offer the possibility of creating 4-side buttable tiles
3 projects for been undertaken with LETI- Funding mainly from Medipix3 Collaboration, AIDA and LCD group
1) 2011 - Feasibility of TSV processing on Medipix3 (low yield wafers)
2) 2013 - Proof of yield using Medipix3RX wafers (6 wafers)
3) 2014 - TSV processing of ultra-thin Medipix3/Timepix3 wafers (50µm)
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TSV processing on the Medipix3
MEDIPIX3 pixel side native thickness TSV processed chip“BGA” bottom
distribution
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Yield verification of TSV processed wafers
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Yield from 2nd TSV project with LETI
Lot no. uSA999P Lot no. uSB254PP04 P05 P06 P01 P02 P03
% KGD before TSV (on wafer) 57 51 50 50 60 53% KGD after TSV (chips) 45 41 rework 20 41 38
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Photo comparing 50µm and 120µm thick Medipix3RX Chips with TSV Processing
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What’s next?
• A new Collaboration called Medipix4 has been started (4th March 2016)
• Chips to be fully tile-able on 4-sides • 2 chips development are foreseen (65nm CMOS) • Medipix4 Photon counting spectrometric chip
– Will use charge summing and allocation scheme– Multiple thresholds – Pixel pitch varied to match sensor material– Better high count rate performance (aimed at human CT)
• Timepix4– Smaller pixel pitch– Better timing resolution (sub-ns)– Better high count rate performance (TSV)
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Summary and conclusions
• The Medipix developments grew out of R and D on pixel detectors for LHC
• Timepix has been used extensively in particle tracking applications but is limited by the frame-based readout
• Timepix3 provides data driven readout at relatively high rates (40Mhits/cm2/sec)
• The precise ToA measurement provides particle tracking within the semiconductor detector layer and single layer tracking for electrons
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Summary and conclusions
• The VELOpix chip was derived directly from the Timepix3 work and designed by the same team
• First results are consistent with a well operating chip. Measurements are on-going
• The Medipix4 Collaboration has been formed and will explore 4 side tile-able readout of hybrid pixel detectors for the first time
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Thank you for your attention!
Medipix3RX images: S. Procz et al.