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    Overview of MEMS and Microsystems

    1. MEMS & Microsystems:

    What is MEMS?

    Abbreviation of MicroElectro Mechanical System.

    Contain components of sizes in 1 micrometer (m) to 1 millimeter (mm).

    se the litho!raphic an" other microfabrication technolo!ies to create

    miniat#rize" sensors$ act#ators$ an" str#ct#res.

    %n fabrication processes$ the a""ition$ s#btraction$ mo"ification$ an"

    patternin! of materials are typically "one #sin! technies ori!inally

    "evelope" for the inte!rate" circ#it (%C$) in"#stry.

    Two principal components of MEMS:

    A sensin! or act#atin! element an" a si!nal trans"#ction #nit.

    MEMS as a microsensor'

    Eample' a press#re sensor

    * %np#t si!nal' press#re

    * Microsensin! element' a silicon "iaphra!m

    * +rans"#ction #nit' piezoresistors (for resistance chan!e)$ pl#s a,heatstone bri"!e circ#it

    * -#tp#t si!nal' volta!e chan!e

    an aneroid pressure sensor:

    The basic operating principle is to couple the pressure to-be measured to one

    surface of a membrane and to measure its deflection (knowing the pressure-to-

    deflection transfer function). (ovacs$ /000)

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    MEMS as a microact#ator'

    Eample' a micro!ripper

    Microsystems:

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    A microsystem is an en!ineerin! system that contains MEMS components

    that are "esi!ne" to perform specific en!ineerin! f#nctions.

    components (Ma"o#$ 1223)' micro sensors$ act#ators$ an" a processin!

    #nit.

    Eample' an airba! "eployment system

    An intellient microsystem:

    %ncorporate si!nal processin!an" close"*loop fee"bac4 controlsystemsinto

    a microsystem.

    !. MEMS & Microsystem "rod#cts:

    /.1 Micro!ears

    LIGA toothed wheel (Ruprechtet al.$ 1223)

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    p.s. 5%6A' come from the 6erman terms 5itho!raphy (5itho!raphie)$ electroformin!

    (6alvanoform#n!)$ an" mol"in! (Abform#n!).

    /./ Micro mier

    7olymer micro mier (7rotron Mi4rotechni4)

    /. %n4*8et 7rintin! 9ea"

    7rinciples of %n4*8et 7rintin!'

    : ;rops are shot o#t from !enerator G.

    : ;rops receive a char!e in char!in! #nit C.

    : +he electic fiel"E"eflects the motion of the "rop.

    : +he "rop lan"s at the position on the paper.

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    A thermal*b#bble*act#ate" "roplet !enerator (Allen et al.$ 12>?)'

    An improve" "roplet !enerator (+sen! et al.$ 122>)'

    Comparison of printing results:

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    HP 51626A Printhead Microinjector (Tseng, !!")

    /.= Micro*lens

    micro*lens (9ec4ele et al.$ 122>)

    /.? Micromirrors ()

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    (a)

    (b)

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    silicon to b#il" an entire circ#it) Das pro"#ce" at CA.

    * %n 12?>$ the first %C Das pro"#ce" by ac4 ilby at +eas

    %nstr#ments.

    * +o"ay$ #ltra lar!e scale inte!ration (5S%) can contain 10 million

    transistors an" capacitors on a chip.

    . Microsystems and Microelectronics

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    '. The M#ltidisciplinary (at#re of Microsystem )esin and Man#fact#rin

    3 nat#ral science areas are involve"'

    %. Electrochemistry ()' e. electroplatin! (F in the

    5%6A process)F f#el cell ().

    %%. Electrohy"ro"ynamics%%%. Molec#lar biolo!y ()

    %G. 7lasma physics ()

    G. Scalin! laDs

    G%. H#ant#m physics ()

    G%%. Molec#lar physics ()' molec#lar "ynamics (

    )

    p.s.' 1. H#ant#m physics' for eample$ st#"y the movement of electrons in

    semicon"#ctor materials.

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    /. Electrohy"ro"ynamics involves the "rivin! of an ionize" fl#i" by the

    application of electric fiel"s.

    ? en!ineerin! areas'

    %. Mechanical en!ineerin!

    %%. Electrical en!ineerin!

    %%%. Chemical en!ineerin!

    %G. Material en!ineerin!

    G. %n"#strial en!ineerin!

    *. Microsystems and Miniat#ri+ation

    enefits of miniat#rization'

    %. +en" to move faster.

    %%. Enco#nter feD problems in thermal "istortion an" vibration.

    %%%. Ma4e them more s#itable for applications in me"icine an"

    s#r!ery an" in microelectronic assemblies.

    %G. ;esirable in satellites an" spacecraft en!ineerin!.

    G. S#itable for telecomm#nication systems.

    Eamples'

    * Comp#ters' a"vance" in ?0 years from the vac##m*t#be technolo!y to

    the %C technolo!y.smaller size$ b#t better performance.

    * io*chips' shorter timefor "isease or vir#s "etection (pl#s m#ch less

    samplesreire").

    ,eference:

    1. 9alli"ay$ ;.$ esnic4$ .$ an" ,al4er. .$ $ Electrostatic

    comb"rive*act#ate" micromirrors for laser*beam scannin! an" positionin!$

    o#rnal of Microelectromechanical Systems$ Gol. 3$ %ss#e 1$ pp. /3 :3.

    =. ovacs$ 6eor!e +. A.$ Micromachine" +rans"#cers So#rceboo4$ Ma6raD*9ill

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    Companies$ %nc.$ /000.

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