chapter1 fundamentals of microwave engineering

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Dr. Cuong Huynh Telecommunications DepartmentHCMUT MICROWAVE INTERGRATED CIRCUITS 1 Huynh Phu Minh Cuong, PhD [email protected] Department of Telecommunications Faculty of Electrical and Electronics Engineering Ho Chi Minh city University of Technology

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Fundamentals of Microwave Engineering

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  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    MICROWAVE INTERGRATED CIRCUITS

    1

    Huynh Phu Minh Cuong, PhD [email protected]

    Department of Telecommunications

    Faculty of Electrical and Electronics Engineering

    Ho Chi Minh city University of Technology

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 2

    Instructor: Cuong Huynh (PhD)

    Office: 112 B3 , HCMUT

    Office Hours: Friday 2:00-4:00 PM

    E-mail: [email protected]

    Textbook:

    [1] David M. Pozar, Microwave Engineering, John Wiley & Sons, Inc, 4th ed.,

    2012.

    References:

    [2] Gonzalez, Microwave Transistor Amplifiers, Prentice Hall, 2nd ed. 1997

    [3] I.D. Robertson, S. Lucyszyn, RFIC and MMIC Design and Technology, The

    Institution of Electrical Engineers, London, 2001

    [4] V nh Thnh, Mch Siu Cao Tn, NXB HQG, 2006

    [5] V nh Thnh, K Thut Siu Cao Tn, NXB HQG, 2004.

    MICROWAVE INTERGRATED CIRCUITS

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 3

    Learning outcomes Understand effects of noise and nonlinearity distortion on microwave systems and system parameters such as noise figure, input/output referred

    noise, 1-dB compression point and third-order intercept point.

    Analyze various microwave transceiver architectures and design system parameters for microwave transceivers.

    Analyze, design, fabricate and measure microwave passive components such as power divider/combiner, directional coupler, hybrid coupler, circulator

    and T/R switch.

    Analyze, design, fabricate and measure microwave filters using distributed elements.

    Analyze, design, fabricate and measure microwave amplifiers including low noise amplifier, broadband amplifier and power amplifier.

    Analyze, design, fabricate and measure microwave mixers and oscillators. Use microwave simulation soft-wares such as ADS, Cadence and SDH, and equipments such as network analyzer, spectrum analyzer, synthesizer and noise

    figure analyzer.

    MICROWAVE INTERGRATED CIRCUITS

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 4

    Grading

    Homework 20% You are encouraged to work together with your classmates on the homework. HW can be turned in via Email.

    No late homework will be graded

    Final Project 30% Report and PowerPoint presentation are required

    Final Exams 50% Closed book One single-sided A4 of notes is allowed

    MICROWAVE INTERGRATED CIRCUITS

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 5

    Outline

    Chapter 1: Fundamentals of Microwave Engineering

    Chapter 2: System Parameters and Transceiver

    Architectures

    Chapter 3: Power Dividers and Directional Couplers

    Chapter 4: Microwave Amplifier

    Chapter 5: Oscillators and Mixers

    Chapter 6: Microwave Filters

    MICROWAVE INTERGRATED CIRCUITS

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 6

    Huynh Phu Minh Cuong [email protected]

    Department of Telecommunications

    Faculty of Electrical and Electronics Engineering

    Ho Chi Minh city University of Technology

    Chapter 1

    Fundamentals of Microwave Engineering

    MICROWAVE INTERGRATED CIRCUITS

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 7

    Introduction

    and emerging applications !

    Integrated Circuits (IC)

    Is the key driver behind the scene !

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    Introduction

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    Introduction

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    Introduction

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    Introduction

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    Introduction

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 13

    Introduction

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 14

    1.1 Fundamentals of microwave engineering

    Transmission lines

    . .( ) . .x xV x V e V e

    0

    1 ( )( )

    1 ( )

    xZ x Z

    x

    2( ) ( ). dx l e

    0

    0

    ( ) L

    L

    Z Zl

    Z Z

    00

    0

    . . ( )( )

    . . ( )

    L

    L

    Z j R tg dZ x R

    R j Z tg d

    . .

    0 0

    ( ) l lV V

    I l e eZ Z

    1

    1S VSWR

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 15

    1.1 Fundamentals of microwave engineering

    Smith chart

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 16

    1.1 Fundamentals of microwave engineering

    Impedance Matching

    Using lump elements

    Using transmission line

    ADS Smith chart tool

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 17

    1.1 Fundamentals of microwave engineering

    Scattering Parameters

    At microwave regime: S-parameters

    matrix, defined in terms of traveling

    waves, is used instead.

    The scattering matrix represents the

    relation between the voltage incident

    waves on the ports to voltage reflected

    wave from the ports.

    S-parameters are measured with

    matched loads rather than open- or

    short-circuits.

    At microwave frequencies, matched

    loads are relatively easy to realize.

    S-parameters are measured using

    Vector Network Analyzer (VNA).

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    S-Parametter Definition

    V+n is the incident voltage wave on port n

    V n is the reflected voltage wave from port n.

    The scattering matrix, or [S] matrix, is defined in relation to these incident

    and reflected voltage waves.

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    S-Parametter Definition

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT

    Example: Find [S]

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 23

    1.2 Technology and device for microwave integrated circuits

    Target: smaller size, lighter weight, lower power requirements, lower cost,

    and increased complexity.

    Microwave integrated circuits (MICs) Technology replace bulky and

    expensive waveguide and coaxial components with small and inexpensive planar

    components.

    MIC technology has advanced to the point where complete microwave

    subsystems, such as receiver front ends and radar transmit/receive modules, can be

    integrated on a chip that is only a few square millimeters in size.

    Hybrid MICs

    MIC

    MMIC/RFIC Hybrid Microwave Integrated Circuits

    Monolithic Microwave Integrated Circuits

    Radio Frequency Integrated Circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 24

    1.2 Technology and device for microwave integrated circuits

    Hybrid MICs MMIC/RFIC

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 25

    The metaloxidesemiconductor field-effect transistor (MOSFET) was first patented

    by Julius Edgar Lilienfeld in 1925, well before

    the invention of BJT.

    Due to the fabrication limitation, MOSFET has not been used until the early years of 1960s.

    CMOS (Complementary MOS p- and n-type device) was patented by Frank Wanlass in 1967,

    initiating a revolution in the semiconductor

    industry.

    CMOS initially dominates in the digital circuit/systems while others for analog.

    Why CMOS now ? Low cost, high integration

    and solution for SOC.

    1.2 Technology and device for microwave integrated circuits

    Technology CMOS

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 26

    1.2 Technology and device for microwave integrated circuits

    CMOS Technology

    CMOS Transistors Interconnect Diodes Resistors Capacitors Inductors Bipolar Transistors

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 27

    1.2 Technology and device for microwave integrated circuits

    CMOS Technology Intel 45 nm CMOS Process

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 28

    1.2 Technology and device for microwave integrated circuits

    Microwave Devices

    DIODES BIPOLAR JUNCTION TRANSISTORS FIELD EFFECT TRANSISTORS Capacitor Inductor

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 29

    Microwave devices

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 30

    NMOS Transistor

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 31

    PMOS Transistor

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 32

    Interconnect

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 33

    Diode

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 34

    Resistor

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 35

    Capacitor

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 36

    Inductor

    1.2 Technology and device for microwave integrated circuits

  • Dr. Cuong HuynhTelecommunications DepartmentHCMUT 37

    Circuit Simulator: ADS, Cadence EM simulator: Momentum, HFSS,IE3D, CST, SONET

    1.3 Microwave simulation tools