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Chapter 5 Chapter 5 Internal Memory Internal Memory

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Key points  The two basic forms of semiconductor random access memory are dynamic RAM(DRAM) and static RAM(SRAM). SRAM is faster, expensive, less dense than DRAM and is used for Cache and DRAM is used for main memory.  Error correction techniques are commonly used in memory systems. These involve adding redundant bits that are a function of the data bits to form an error-correcting code. If a bit error occurs, the code will detect and correct the error.  To compensate for the relatively slow speed of DRAM, a number of advanced DRAM organizations have been introduced. The two most common are synchronous DRAM and RamBus DRAM.

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Page 1: Chapter 5 Internal Memory. contents  Semiconductor main memory - organisation - organisation - DRAM…

Chapter 5Chapter 5Internal MemoryInternal Memory

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contentscontents Semiconductor main memorySemiconductor main memory - organisation- organisation - DRAM and SRAM- DRAM and SRAM - types of ROM- types of ROM - Chip Logic- Chip Logic - Chip packaging- Chip packaging - Module Organisation- Module Organisation Error Correction (Thursday)Error Correction (Thursday) Advanced DRAM organisationAdvanced DRAM organisation - synchronous DRAM- synchronous DRAM - Rambus DRAM- Rambus DRAM - DDR SDRAM- DDR SDRAM - Cache DRAM- Cache DRAM

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Key pointsKey points The two basic forms of semiconductor random access memory The two basic forms of semiconductor random access memory

are are dynamic RAM(DRAM)dynamic RAM(DRAM) and and static RAM(SRAM)static RAM(SRAM). SRAM is . SRAM is faster, expensive, less dense than DRAM and is used for faster, expensive, less dense than DRAM and is used for Cache and DRAM is used for main memory.Cache and DRAM is used for main memory.

Error correctionError correction techniques are commonly used in memory techniques are commonly used in memory systems. These involve adding redundant bits that are a systems. These involve adding redundant bits that are a function of the data bits to form an error-correcting code. If a bit function of the data bits to form an error-correcting code. If a bit error occurs, the code will detect and correct the error.error occurs, the code will detect and correct the error.

To compensate for the relatively To compensate for the relatively slow speed of DRAMslow speed of DRAM, a , a number of advanced DRAM organizations have been number of advanced DRAM organizations have been introduced. The two most common are synchronous DRAM and introduced. The two most common are synchronous DRAM and RamBus DRAM. RamBus DRAM.

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Semiconductor Memory TypesSemiconductor Memory Types

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OrganizationOrganizationThe basic element of a semiconductor memory is the memory The basic element of a semiconductor memory is the memory cell. All semiconductor memory cells share certain properties:-cell. All semiconductor memory cells share certain properties:-

They exhibit two stable states, which can be used toThey exhibit two stable states, which can be used to represent binary 1 and 0represent binary 1 and 0

They are capable of being written into, to set the stateThey are capable of being written into, to set the state

They are capable of being read to sense the state.They are capable of being read to sense the state.

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Memory Cell OperationMemory Cell Operation

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Semiconductor MemorySemiconductor Memory RAM-random access memoryRAM-random access memory

Misnamed as all semiconductor memory is Misnamed as all semiconductor memory is random accessrandom access

Read/WriteRead/Write Volatile-RAM must be provided with constant Volatile-RAM must be provided with constant

power supply.power supply. RAM can be used only as Temporary storageRAM can be used only as Temporary storage Two traditional forms of RAM used in computers Two traditional forms of RAM used in computers

are Static or dynamic(DRAM, SRAM)are Static or dynamic(DRAM, SRAM)

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Dynamic RAMDynamic RAM Bits stored as Bits stored as charge in capacitorscharge in capacitors and the presence or and the presence or

absence of charge in a capacitor is interpreted as a binary absence of charge in a capacitor is interpreted as a binary 1 or 01 or 0

Because of tendency to discharge, dynamic RAMs require Because of tendency to discharge, dynamic RAMs require periodic chargeperiodic charge refreshing to maintain data storage. refreshing to maintain data storage.

Used as main memoryUsed as main memory Simpler constructionSimpler construction Smaller per bitSmaller per bit Less expensiveLess expensive Need refresh circuitsNeed refresh circuits Slower - need refreshing processSlower - need refreshing process Essentially analogueEssentially analogue

Level of charge determines valueLevel of charge determines value

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Dynamic RAM StructureDynamic RAM Structure

The address line is activated when the bit value from this cell is to be read or written. The transistor acts as a switch that is closed if a voltage is applied to the address line and opened if no voltage present on the address line.

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DRAM OperationDRAM Operation WriteWrite

Voltage signals is applied to the bit line; a high voltageVoltage signals is applied to the bit line; a high voltagerepresents 1 and low voltage represents 0. A signal is represents 1 and low voltage represents 0. A signal is then applied to the address line, allowing a charge to then applied to the address line, allowing a charge to be transferred to the capacitor.be transferred to the capacitor.

ReadRead when the address line is selected, the transistor turns on and when the address line is selected, the transistor turns on and

the charge stored on the capacitor is fed out onto a bit line the charge stored on the capacitor is fed out onto a bit line and to a sense amplifier. The sense amplifier compares the and to a sense amplifier. The sense amplifier compares the capacitor voltage to a reference value and determines if the capacitor voltage to a reference value and determines if the cell contains a logic 1 or 0. The readout from the cell cell contains a logic 1 or 0. The readout from the cell discharges the capacitor, which must be restored to discharges the capacitor, which must be restored to complete the operation.complete the operation.

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Static RAMStatic RAM Bits stored as on/off switchesBits stored as on/off switches No charges to leak because binary values are No charges to leak because binary values are

stored using traditional flip-flopstored using traditional flip-flop No refreshing needed when poweredNo refreshing needed when powered More complex constructionMore complex construction Larger per bitLarger per bit More expensive – complex logic gateMore expensive – complex logic gate Does not need refresh circuitsDoes not need refresh circuits FasterFaster Used as Cache memoryUsed as Cache memory

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Stating RAM StructureStating RAM Structure

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Static RAM OperationStatic RAM Operation Transistor arrangement gives stable logic stateTransistor arrangement gives stable logic state State 1State 1

CC11 high, C high, C22 low low TT11 T T44 off, T off, T22 T T3 3 onon

State 0State 0 CC22 high, C high, C11 low low TT22 T T33 off, T off, T11 T T4 4 onon

Address line transistors TAddress line transistors T55 T T66 is switch is switch Write – apply value to B & compliment to BWrite – apply value to B & compliment to B Read – value is on line BRead – value is on line B

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SRAM v DRAMSRAM v DRAM Both volatileBoth volatile

Power needed to preserve dataPower needed to preserve data Dynamic cell Dynamic cell

Simpler to build, smallerSimpler to build, smaller More denseMore dense Less expensiveLess expensive Needs refreshNeeds refresh Larger memory unitsLarger memory units

StaticStatic FasterFaster CacheCache

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Read Only Memory (ROM)Read Only Memory (ROM)

Permanent storagePermanent storage NonvolatileNonvolatile

Microprogramming (see later chapter 17)Microprogramming (see later chapter 17) Library subroutines for frequently wanted Library subroutines for frequently wanted

functionsfunctions Systems programs (BIOS)Systems programs (BIOS) Function tablesFunction tables

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Types of ROMTypes of ROM Written during manufactureWritten during manufacture

Very expensive for small runsVery expensive for small runs Programmable (once)Programmable (once)

Nonvolatile and may be written into only onceNonvolatile and may be written into only once Needs special equipment to program (tools)Needs special equipment to program (tools)

Read-mostly memory -> useful for applications in which Read-mostly memory -> useful for applications in which read operations are far more frequent than write operationread operations are far more frequent than write operation Erasable Programmable (EPROM)Erasable Programmable (EPROM)

Erased by UVErased by UV Electrically Erasable (EEPROM)Electrically Erasable (EEPROM)

Takes much longer to write than readTakes much longer to write than read Flash memoryFlash memory

Erase whole memory electricallyErase whole memory electrically

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Organisation in detailOrganisation in detail A 16Mbit chip can be organised as 1M of 16 bit wordsA 16Mbit chip can be organised as 1M of 16 bit words A bit per chip system has 16 lots of 1Mbit chip with bit 1 of A bit per chip system has 16 lots of 1Mbit chip with bit 1 of

each word in chip 1 and so oneach word in chip 1 and so on A 16Mbit chip can be organised as a 2048 x 2048 x 4bit A 16Mbit chip can be organised as a 2048 x 2048 x 4bit

arrayarray Reduces number of address pinsReduces number of address pins

Multiplex row address and column addressMultiplex row address and column address 11 pins to address (211 pins to address (21111=2048)=2048) Adding one more pin doubles range of values so x4 Adding one more pin doubles range of values so x4

capacitycapacity

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RefreshingRefreshing

Refresh circuit included on chipRefresh circuit included on chip Disable chipDisable chip Count through rowsCount through rows Read & Write backRead & Write back Takes timeTakes time Slows down apparent performanceSlows down apparent performance

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Typical 16 Mb DRAM (4M x 4)Typical 16 Mb DRAM (4M x 4)

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PackagingPackaging

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256kByte Module 256kByte Module OrganisationOrganisation

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1MByte Module Organisation1MByte Module Organisation

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Error CorrectionError Correction

Hard FailureHard Failure Permanent defectPermanent defect

Soft ErrorSoft Error Random, non-destructiveRandom, non-destructive No permanent damage to memoryNo permanent damage to memory

Detected using Hamming error correcting Detected using Hamming error correcting codecode

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Error Correcting Code FunctionError Correcting Code Function

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Advanced DRAM OrganizationAdvanced DRAM Organization

Basic DRAM same since first RAM chipsBasic DRAM same since first RAM chips Enhanced DRAMEnhanced DRAM

Contains small SRAM as wellContains small SRAM as well SRAM holds last line readSRAM holds last line read

Cache DRAMCache DRAM Larger SRAM componentLarger SRAM component Use as cache or serial bufferUse as cache or serial buffer

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Synchronous DRAM (SDRAM)Synchronous DRAM (SDRAM) Access is synchronized with an external clockAccess is synchronized with an external clock Address is presented to RAMAddress is presented to RAM RAM finds data (CPU waits in conventional DRAM)RAM finds data (CPU waits in conventional DRAM) Since SDRAM moves data in time with system clock, Since SDRAM moves data in time with system clock,

CPU knows when data will be readyCPU knows when data will be ready CPU does not have to wait, it can do something elseCPU does not have to wait, it can do something else Burst mode allows SDRAM to set up stream of data Burst mode allows SDRAM to set up stream of data

and fire it out in blockand fire it out in block DDR-SDRAM sends data twice per clock cycle DDR-SDRAM sends data twice per clock cycle

(leading & trailing edge)(leading & trailing edge)

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SDRAMSDRAM

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SDRAM Read TimingSDRAM Read Timing

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RAMBUSRAMBUS Adopted by Intel for Pentium & ItaniumAdopted by Intel for Pentium & Itanium Main competitor to SDRAMMain competitor to SDRAM Vertical package – all pins on one sideVertical package – all pins on one side Data exchange over 28 wires < cm longData exchange over 28 wires < cm long Bus addresses up to 320 RDRAM chips at Bus addresses up to 320 RDRAM chips at

1.6Gbps1.6Gbps Asynchronous block protocolAsynchronous block protocol

480ns access time480ns access time Then 1.6 GbpsThen 1.6 Gbps

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RAMBUS DiagramRAMBUS Diagram

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DDR SDRAMDDR SDRAM

SDRAM can only send data once per SDRAM can only send data once per clockclock

Double-data-rate SDRAM can send data Double-data-rate SDRAM can send data twice per clock cycletwice per clock cycle Rising edge and falling edgeRising edge and falling edge

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Cache DRAMCache DRAM

MitsubishiMitsubishi Integrates small SRAM cache (16 kb) onto generic DRAM Integrates small SRAM cache (16 kb) onto generic DRAM

chipchip Used as true cacheUsed as true cache

64-bit lines64-bit lines Effective for ordinary random accessEffective for ordinary random access

To support serial access of block of dataTo support serial access of block of data E.g. refresh bit-mapped screenE.g. refresh bit-mapped screen

CDRAM can prefetch data from DRAM into SRAM CDRAM can prefetch data from DRAM into SRAM bufferbuffer

Subsequent accesses solely to SRAMSubsequent accesses solely to SRAM