Y.LIN ELECTRONICS CO.,LTD.

Data Sheet

Customer:

Part No: M3ADSC40

Sample No:

Description:

Item No:

CustomerCheck Inspection Approval Date

Y.LINDrawn Check Approval Date

2016-10-24

Mainland address:Jinhe The Third lndustrialZone,Zhangmutou Town,Dongguan,Guangdong,China

H.K address:Unit 503 5/F,Silvercord Tower 230 Canton Road Tsimshatsuikl

TEL:0769-87181888 FAX:0769-87187333 E-mail:ylin05@y-lin.com Http://www.yong-lin.net

3mm Photodiode LED

M3ADSC40

Features： . Mechanically and spectrally matched to

the phototransistor.

. Rohs compliant.

Description

. This devices are made with PIN GaAs.

Package Dimensions:

NOTES

1.All dimensions are in millimeters .

2.Tolerance is ±0.25mm unless otherwise noted.

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1 Anode 2 Cathode

Part No Material Lens Color

PD Silicon Water Clear

Parameter Symbol Min. Typ. Max Unit Test Condition

Reverse Light Current

IEe=1mw/cm2

Controlled Angle 2θ1/2 30 deg

Y.LIN ELECTRONICS CO.,LTD.

Reverse Dark Current D

IL 10

10

uA

nA

Ee=1mw/cm2λp=940nm

λp=940nm/VR=5V

Electrical / Optical Characteristics at Ta=25°C

Note:

1.1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.

2.the above luminous intensity measurement allowance tolerance ±15%

Absolute Maximum Ratings at Ta=25°C

Parameter Symbol Rating Units

Reverse Voltage VR 32 V

Power Dissipation PD mw

Operating Temperature Topr -40~+80 °C

Storage Temperature Tstg -40~+100 °C

Lead Soldering Temperature[1.6mm(.063") From Body]

260 for 5 seconds

Note:

1. 1/10 Dut cycle,0.1ms pulse width.

2. The above forward voltage measure ment allowance tolerance ±0.1V.

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Parameter Symbol Min. Typ. Max Units test conditionsRang of Spectral

Bandwidth λ0.5 400 1100 nm Vs=5v Ev=0

Peak Wavelength λp 940 nm

Open-Circuit Voltage

Reverse Breakdown Voltage

Total Capacitance

Rise/fall time tr/tf 10/10 us

VCE=5vIC=1mA

RL=1000Ω

Y.LIN ELECTRONICS CO.,LTD.

Voc 0.44 VEe=5mw/cm2λp=940nm

Short-Circuit Current Isc 10Ee=1mw/cm2λp=940nmuA

VBR 32 170Ee=0mw/cm2

IR=100uA

Ct 10 pFEe=0mw/cm2

VR=5VF=1MHZ

150

M3ADSC40

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Fig.1 Dark current vs. ambient temperature

AMBIENT TEMPERATURE : Ta (°C)

100−25 0 25 50 75

0.1

1

10

100

1000

DA

RK

CU

RR

EN

T :

ICE

O (

nA)

VCE=10VVCE=20VVCE=30V

Fig.2 Relative output vs. ambient temperature

−25 75 10050250

20

50

200

500

10

100

1000

RE

LAT

IVE

LIG

HT

CU

RR

EN

T :

IC (

%)

AMBIENT TEMPERATURE : Ta (°C)

Fig.3 Light current vs. irradiance

LIG

HT

CU

RR

EN

T :

IC (

mA

)

ILLUMINANCE : E (Lx)

0 250 500 750 12501000

2

4

6

8VCE=5V

Fig.4 Output characteristics

COLLECTOR−EMITTER VOLTAGE : VCE (V)

160 2 4 6 8 10 12 14

2

0

4

6

8

10

LIG

HT

CU

RR

EN

T :

I C (

mA

)

E=1000Lux

750Lux

500Lux

250Lux

Fig.6 Collector dissipation vs.ambient temperature

−25 0 25 50 75 100

40

160

120

80

0

AMBIENT TEMPERATURE : Ta (°C)

CO

LLE

CT

OR

DIS

SIP

AT

ION

: P

C (

mW

)

Fig.7 Response time vs.collector current

COLLECTOR CURRENT : IC (mA)

0.1 1 101

10

100

1000

RE

SP

ON

SE

TIM

E :

tr (μ

s)

VCE=5VTa=25°C

RL=1kΩ

RL=500Ω

RL=100Ω

Typical optical characteristics curves

Fig.5 Spectral sensitivity

RE

LAT

IVE

SE

NS

ITIV

ITY

: I C

(%

)

OPTICAL WAVELENGTH : λ (nm)

600400 800 1000 1200 140000

25

50

75

100

+30°

+40°

+50°

+70°

+80°

+60°

+90°-90°

-70°

-80°

-50°

-60°

0

Emitted Angle30°

-40°

-30°

-20° +10°-10° 0 +20°

Y.LIN ELECTRONICS CO.,LTD.

M3ADSC40

1.Application:

Infrared applied system

Camera

Printer

Optoelectronic switch

Cockroach catcher

2. Cleaning

Use alcohol-based cleaning solvent such as isopropyl alcohol to clean the LEDs if necessary.

3.Soldering

When soldering leave a minimum of 2mm clearance from the base of the lens to the soldering point.

Dipping the lens into the solder must be avoided.

Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.

Recommended soldering conditions:

Soldering iron Wave soldering

Temperature 320 MaxPre-heat

Pre-heat time100 Max60 sec.Max

Soldering time3 sec.Max

(one time only)Solder wave

Soldering time260 Max

5 sec.Max

Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or

catastrophic failure of the LED.

4.Lead Forming & Assembly

During lead froming, the leads shold be bent at point at least 3mm from the base of PIN lens.

Do not use the base of the lead frame as a fulcrum during forming.

Lead forming must be done before soldering,at normal temperature.

During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.

5.Protece Of ESD

Since the device is static sensitive,it is requested that anti-static measures should be taken on human

body,all devices (including soldering iron) and equipment,machinery,desk and ground.

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Y.LIN ELECTRONICS CO.,LTD.

M3ADSC40