catalogue for thermal silicon pad

Thermal silicon pad

Features & benefits:

● High compressibility, soft and flexible, designed for low‐stress application environment

● Good thermal conductivity

● Electrical insulation

● Meet with the environmental requirements of ROHS and UL

● Natural stickiness

Typical applications:

● Laptop

● Communication hardware equipment

● High‐speed hard disk drive equipment

● Automobile engine control mould

● Micro processor, memory chip and graphics processor

● Mobile equipment

Physical properties:

CHIC TECHNOLOGY COMPANY LTD., [email protected] 1

High‐performance thermal conductive pad

The LG series high performance, thermal conductive pad

designed with extremely high thermal conductivity and

fitting performance, which is from the boron nitride

powder of the raw material compound, its thermal

conductivity in the thermally conductive gap filling

materials is unparalleled.

Thermal silicon pad


●High reliability & High thermal conductivity

●High compressibility, soft and flexible

●Natural stickiness, no extra surface frontal adhesives



●Communication equipment ●Mobile equipment

●LED Light ●Video equipment

●Switching power supply ●Networking equipment

●Back light model ●Household appliances

●Medical equipment ●PC server/workstations

Application modes:

●The filling between PCB and heat sink

●The filling between IC and heat sink or product outer coving

●The filling between IC and similar heatsink cooling materials


sink,to achieve fully conforming and obviously cooling effect. Compared to common thermal

conductive & insulating materials, HC series has certain nature stickiness which bring great

convenience in the product installation processing, not easy to fall off and easy to operate.

Thermal conductive silicon pad

LC series thermal conductive silicon pad is high‐

performance, thermal conductive gap filling materials,

mainly for the transmission interface between the

electronic equipment and heat sink or product outer

coving. Nice stickiness,flexibility,good compression

performance and excellent heat conductivity are

designed for HC series, which make the products can

discharge gas from the electronic original and heat

Thermal silicon pad



Thermal silicon pad

Thermal silicon pad with 3M adhesive


●Ultra‐stickiness

●Without fastening devices

●Electrically isolating



●LED light

●Power conversion equipment

●Between the semiconductor or magnetic body and heat sink

●HID ballast

●Household appliances Physical properties:


The LCB series is adhesive thermal conductive silicon

pad, mainly for the thermal conductivity between the

heating device and the heat sink or the product outer

covings without fastening devices.

Thermal silicon pad


●Low hardness with ultra‐conforming

●Enhanced shear strength, piercing and tearing resistance




●Communications industry /AC/DC power


●The framework, chassis or other area need to transfer heat

●HID ballast

●Auto control unit (ECU)

●Uninterruptible power supply (UPS) Physical properties:


Thermal silicon pad coated with fiberglass

The LCP series thermal conductive silicon pad coated with fiberglass is an anti‐piercing & anti‐tearing

product with a high shear strength,which consisted by the low modulus polymer attached to the

glass fiber substrate,so the product can be used as a filler between the machine's contact interface.

Thermal silicon pad

Fiberglass reinforced thermal silicon pad


●Low hardness with ultra‐conforming

●Enhanced shear strength, piercing and tearing resistance




●Communications industry /AC/DC power


●The framework, chassis or other area need to transfer heat

●HID ballast

●Auto control unit (ECU)

●Uninterruptible power supply (UPS)



The LCG series fiberglass reinforced thermal

silicon pad is an anti‐piercing & anti‐tearing

product with a high shear strength , which

consisted by the low modulus polymer

attached to the glass fiber substrate, so the

product can be used as a filler between the

machine's contact interface.

Thermal acrylic tape

Fiberglass reinforced thermal acrylic adhesive


●High acrylic adhesive tape for pressure sensitive of various surfaces

●High‐performance, thermal conductive acrylic tape


●Make the heat sink fixed to the encapsulated chip

●Make the radiator fixed to the power supply circuit board or the vehicle control circuit board

●Efficient thermal conductive acrylic adhesive tape

●Replace the fixed mode of hot melt adhesive, screw and buckle



LCT series is a kind of thermal acrylic adhesive applied in

the bond between heat sink and other power

consumption semiconductor, the adhesive is in the

nature of strong bonding strength and low thermal

resistance, which can replace thermal silicon grease and

mechanical fixation effectively.

Thermal graphite sheet


Key property:

●Ultra‐high thermal conductive performance / easy to operate

●Low thermal resistance

●Light weight Application:

●IC ; CPU; MOS; LED; Heat sink; LCD‐TV; Laptop; Communication equipment;

Wireless switch; DVD; Hand‐held device; Camera/digital camera; Mobile phone Physical properties:


The thermal graphite sheet is a kind of totally newthermal & radiating material,heat conducting

evenly along vertical & horizontal direction, shielding with heat and component while improving the

performance of the consumer electronic products.


High‐performance thermal graphite film

Applications:

Cellular phone, DVC,PC and peripherals, pickup ,Semiconductor manufacturing

equipment, MID table PC, Game Console,

Optical communications equipment



It is ideal for providing thermal management/heat‐sinking in limited spaces or to provide

supplemental heat‐sinking in addition to conventional means. This material is flexible and can be cut

into customizable shapes.

LGS800 high‐performance thermal graphite film is a

thermal interface material which is very thin,

synthetically made, and has high thermal conductivity,

and is made from a higly oriented graphite polymer

film.

Silicon insulation

LV series thermal silicon pad

Key property:

●Heat resistance, insulation, fire prevention, shock resistance . Typical application:

●Heating power components, Automobile electronic heating module, Power module,

Household appliances,Computer and peripherals, the filling and any place need heat dissipation

between the heating element and the bottom plate. Physical properties:


The LV series silicon pad is cloth production which made by special process with the base material‐‐

silicon gel and fiberglass, because of its nice thermal conductivity,insulation and convenient

assembly,it's widely used in electronic appliances industry. According to the size of the fever

interface and the height of the clearance select different thickness of the thermal conductive silicon

tape cut zhe pad into different sizes, and put the silicon tap in the gap between the fever interface

and their components to play as an heat‐conducting medium.

Silicon insulation

Thermal silicon cap set

silicon‐based thermally conductive cap set

Key property:

●Heat resistance, insulation, fire prevention, environmental protection and compression resistance

Typical application:


LU series silicon‐based thermally conductive cap set is cap shape product designed with fiberglass &

silicon as basic material and made through special processing. Because of its excellent thermal

conductivity, insulation, shock resistance and easy installation, the product is widely used in fever

transistor, diode and audion, made it can installed directly on the heating tube while Using the

product. The SH series suggested to be used for low‐stress application environment.

Silicon insulation

Thermal silicon tube


●Home appliances, Machine (Heat resistance, insulation, fire prevention, etc.),

Electronic Components Instructions:

●LS‐100A‐‐‐general silicon tube ●LS‐200A‐‐‐high tension

silicon tube

●LS‐300A‐‐‐FDA silicon tube ●LS‐400A‐‐‐silicon‐based,

thermally conductive tubes

●LS‐500A‐‐‐ fire prevention silicon tube

Notes: The most thin wall thickness is 0.5mm currently, Specific shape and color could be provided

according to your requirements.


LS series silicon‐based, thermally conductive tube is tube shape product designed with fiberglass &

silicon as basic material and made through special processing. Because of its excellent thermal

conductivity, insulation, shock resistance and easy installation, the product is widely used in fever

transistor, diode and audion, made it can installed directly on theheating tube while Using the

product.The LS series is suggested to used for low‐stress application environment.

Silicon insulation

TO series thermal silicon pad

Key property:

●Heat resistance, insulation, fire prevention, shock resistance . Typical application:

●Heating power components, Automobile electronic heating module, Power module,Household

appliances,Computer and peripherals, the filling and any place need heat dissipation between the

heating element and the bottom plate.



The TO series silicon pad is cloth production which made by special process with the base material‐‐

silicon gel and fiberglass,because of its nice thermal conductivity,insulation and convenient

assembly,it's widely used in electronic appliances industry. According to the size of the fever

interface and the height of the clearance select different thickness of the thermal conductive silicon

tape cut the pad into different sizes, and put the silicon tap in the gap between the fever interface

and their components to play as an heat‐conducting medium.

Silicon insulation

K‐10 silicon pad

Key property:

●Heat emission, insulation , fire prevention, shock resistance. Features & benefits:

1 Thermal impedance: 0.41°C‐in2/w(50psi)

2 Breakdown voltage can reach at 7000V

3 Designed for the substitutes of theceramic insulators


●Heating power components; Automobile electronic heating module; Power module;

Household appliances; Motor control;Power semiconductors; Military project



Sli‐Pad K10 silicon pad,which is high‐performance,elastomer insulating material made with the

special mylar,because of its good thermal conductivity, insulation and convenient assembly,it's

widely used in electronic appliances industry.According to the size of the fever interface and the

height of the clearance select different thickness of the thermal conductive silicon tape cut zhe pad

into different sizes, and put the silicon tap in the gap between the fever interface and their

components to play as an heat‐conducting medium.

Silicon insulation

TO series Bushing Insulator


Model number:


Phase change material

BC phase change interface material


●Low heat resistance und low stress ●Flowing but not silicone oil

●Low volatility—less than 1% ●Self‐adhesive , easy to use

●No radiator preheating


●High frequency microprocessors

●Chipset

●Graphics chips & Amplifiers chip

●Cache memory chips

●Bridge rectifiers


The material is heat reinforced polymer, designed to meet the thermal conductivity and reliability

demand for the thermal conductivity of high application terminal. In addition, the heat sink’s

performance benefits a lot from the low heat resistance. And improve the microprocessor, DC‐DC

converter of memory module and the reliability of power module.

The phase change characteristics:the material is solid in room temperature and the installation is

completely convenient,used between heat sink and devices. The material can be softened and

flowing when the products reach phase‐change temperature to fill the devices'tiny irregular contact

surface.Thus,the material has the ability to fill the gap between the devices and heat sink

completely,make the phase change better than non‐current elastomers or thermal graphite pad and

get the performance of thermal conductive silicon grease.

The material is nonconductive,however,as the material has endured the phase change at high

temperature, may make the metal get to the metal, so the phase change interface material can not

be used as electrical insulating material.

Thermal silicon pad



Thermal grease

Thermal conductive silicon adhesive

Features:

1. fast curing

2. proper adhesion, to splice the heatsink and the component, and it is

removable when it is in need of repair

3. Eco‐friendly and thermostable

How to use:

The gel is a single component silicon sealant in a room temperature, insulate

and non‐poisonous, solvent‐free,

pollution‐free and of ageing resistance, the surface tack free time is

30minutes( in a 25 degree temperature,

relative humidity ≥60% ), to spread the gel on the desired part of the component

directly.

How to store:

To place it at a dry place and protect it from sun in a 30 degree temperature

for 9 months.

Packaging: 100ml/pcs, 100pcs/box

LD120 Physical properties (after curing):


LD120 has good electric insulativity,thermal resistance,dielectric properties,anti‐chemical corrosion

etc.,it is widely used for the insulationarcing, moistureproofof heatsink, TV, FBT component and

household appliances.

Thermal grease

How to use：


● between Semiconductor and heatsink

● between CPU and heatsink

● between power resistor and base

● thermoelectric cooler

● the surface of temperature regulator and assembly

● high‐power LED lighting Physical properties：


Thermal grease

LE series thermal grease has good thermal conductive performance and reliability, which is extremly

suitable for the heat transfer of the CPU, GPU and other heating power components.

As LE series has low adhesion, it can fully contact with the surface, which result in very low interface

thermal resistance and high thermal conductivity.Please apply the grease by the screen printing, the

60‐80 Me SH nylon mesh and 70‐80 hardness rubber scraper are recommended, leave 45 degrees

between the scraper and the apply surface.

Silicon fever pad

Silicon fever pad

1. Power density is 1 to 5w/Cm'.The power density

changes strikingly as the temperature control methods

are different, please contact with us when you choose

the products.

2. Hang the electric heater on the 20Cm' still air of the

surface temperature.

3. As the using environment, material and shape of the

heating objects are different, the electric heater will

happened to change.

Use precautions:

1.Because of no waterproof construction, please do not get wet.

2. Please do not use the controller and the electric heater separately.

3. Please do not use in the flammable gas, or applied in low flash point objects.


Silicon fever pad

Oil Bucket Heater

Features:

The senser is fixed on the surface of the heater, to control the temperature

directly by the thermoregulation

Specifications:

Size: 250×1740 Size: 200×860 Size: 125×1740

Volume: 200V 2000W Volume: 200V 800W Volume: 200V 1000W

Weight: 0.5kg Weight: 0.4kg Weight: 0.3kg


Oil bucket heater makes the liquid, concretion take out from the oil bucket easily bycheating, such as

the adhesion, oil, pitch, paint, paraffins and kinds of the resin, the viscosity falls equably during the

heating to reduce the powe of the pump.

Thermoregulation: 30~150°C EGO

200L oil bucket heater 20L oil bucket heater 200L oil bucket heater

Thermal conductive silicon encapsulant

LTD 315 silicon thermal potting glue


●Nice thermal conductivity and flame retardancy

●Strong adhesive force

●Heat resistance, humidity resistance, cold resistance

●Low viscosity and nice levelling property

●Insulation, cold resistance, shock resistance, electric corona resistance,electric leakage

resistance and the performance of chemical mediator resistance.


● Deep potting of Power Supply Module, electronic components, especially for the

potting of HID power supply module.

● The potting of LED outdoors display screen

● TV,CRT power supply, Communication equipment and other electric components'

mechanical sealing & adhesion or adhesive fixed.

● Other products'(mental, plastics, glass, etc.) adhesion & sealing with flame

retardant requirement.


Thermal conductive silicon encapsulant is silicon encapsulant designed with a low viscosity and flame

retardancy through bi‐component and additional moulding processing,which can cure by room

temperature or heating,the higher the temperature, the curing faster.The product don't produce any

by‐products in the curing reaction, and can be used in the PC (Poly‐carbonate),PP,ABS,PVC materials

and metal surfaces,it is suitable for thermal conductivity,insulation waterproof and flame retardance

of electronic accessories,the flame retardancy can reach UL94‐V0,and meet with european Union

ROHS completely.


Technical properties before & after curing:



LTD 312 silicon thermal potting glue


●Nice thermal conductivity and flame retardancy

●Strong adhesive force

●Heat resistance, humidity resistance, cold resistance

●Low viscosity and nice levelling property

●Insulation, cold resistance, shock resistance, electric corona resistance, electric leakage

resistance and the performance of chemical mediator resistance


● Deep potting of Power Supply Module, electronic components, especially for the

potting of HID power supply module.

● The potting of LED outdoors display screen

● TV,CRT power supply, Communication equipment and other electric components'

mechanical sealing & adhesion or adhesive fixed.

●Other products’ (mental, plastics, glass, etc.) adhesion & sealing with flame

retardant requirement.


potting glue Thermal conductive silicon encapsulant is silicon encapsulant designed with a low

viscosity and flame retardancy through bi‐component and additional moulding processing, which can

cure by room temperature or heating,the higher the temperature, the curing faster. The product don

’t produce any by‐products in the curing reaction, and can be used in the PC (Poly‐

carbonate),PP,ABS,PVC materials and metal surfaces,it is suitable for thermal conductivity, insulation

waterproof and flame retardance of electronic accessories,the flame retardancy can reach UL94‐V0,

and meet with European Union ROHS completely.


Technical properties before & after curing:


catalogue for thermal silicon pad

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