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©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Butterfly Network iQ CMUT SensorFirst CMUT on Silicon Bonded on ASIC Die for Medical Ultrasound
SP20545 - MEMS report by Sylvain HALLEREAUPhysical Analyis done by Veronique Le TROADEC
April 2020 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Butterfly
o Butterfly iQ
Physical Analysis 14
o Summary of the Physical Analysis 15
Module Views
Module Cross-Section
o CMUT Die 28
CMUT Die Views & Dimensions
CMUT Die Process
CMUT Die Cross-Section
CMUT Die Process Characteristics
o ASIC Die 58
ASIC Die Views & Dimensions
ASIC Delayering & Main Blocs
ASIC Die Process
ASIC Die Cross-Section
ASIC Die Process Characteristics
Sensor Manufacturing Process 72
o ASIC Die Front-End Process
o CMUT Die Front-End Process
o CMUT and ASIC Die Fabrication Unit
o Probe test Unit
Cost Analysis 82
o Summary of the Cost Analysis 83
o Yields Explanation & Hypotheses 85
o ASIC Wafer Cost 87
ASIC Wafer Front-End Cost
o CMUT Die Cost 90
CMUT Die Front-End Cost
CMUT Die Probe Test, Thinning & Dicing
CMUT Die Wafer Cost
o Complete Die 97
Summary of the Assembling
CMUT Die Cost
Feedbacks 99
SystemPlus Consulting Services 101
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insights on technology data, manufacturing cost and selling price of theCMUT from the Butterfly iQ from Butterfly Network.
Butterfly Network have developed a large Capacitive Micromachined Ultrasonic Transducer (CMUT) die to be integrated in a handledmedical ultrasound. The iQ is based on semiconductor technology and it is manufactured by a semiconductor supply chain. This solutionallows to reduce the manufacturing cost and produce very small CMUT elements.
The Butterfly Network CMUT die is a phased array transducer, a large matrix of 8,960 transducers (140 x 64 transducers). They emit theultrasonic signal and receive the echo (acoustic waves). The large matrix, 8,960 transducers and the large ASIC die, allow to perform anefficient 2D phased array sensor. Thanks to the miniaturization of the CMUT, it is possible to perform with one probe, curved, linear andphased analyzes. In other case with conventional equipment, three different probes are necessary to enable same procedures.
The CMUT cells are manufactured with MEMS technology in silicon. Bulk and thin film micromachining technologies are used toperform the electrodes and the cavity. The secret of the first CMUT semiconductor is not only in the MEMS die but also in theintegration with the ASIC die. The ASIC die has all the function to drive the pulse generation, measure the echo, runs Butterfly Networkalgorithms and communicate with the processor on the PCB. Each CMUT is driven by a block with CMOS logic, analogic reading circuitand LDMOS transistors for the emission. The ASIC die and the CMUT die are bonded together in wafer-level and a part of the process iscommon at the two wafers after the bonding for TSV connection.
This report is focused on the analysis of the CMUT semiconductor. It includes an ultrasonic MEMS transducer and the ASIC diedeveloped by Butterfly Network. Some pictures of the disassembly of the iQ probe is displayed in the report.
Along with the complete ultrasonic CMUT MEMS teardown, this report goes with cost analysis for the die.
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 4
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Module Disassembly
Opening©2020 by System Plus Consulting
Disassembly©2020 by System Plus Consulting
USB cord
Main electronicboard
Head with the CMUT die
Butterfly iQ
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Module Overview Cross-Section
Butterfly iQ Head Cross-Section©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Overview & Dimensions
CMUT Die - Overview©2020 by System Plus Consulting
XX
mm
XXmmo Die area: xxmm²
(xx x xx)
o Active area xxmm²(xx x xx mm)
o Nb of PGDW per xx-inch wafer: xx
o Pad number: xx
o Connected: xx
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Overview Cross-Section
CMUT and ASIC Die cross-section - SEM View©2020 by System Plus Consulting
CMUT die top view - Optical View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Overview - Details
Detail of the top electrode – Optical view©2020 by System Plus Consulting
Detail of the top electrode – Optical view©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Delayering – Gold Bump
Bottom silicon electrode removed –SEM view©2020 by System Plus Consulting
XXX
Bottom silicon electrode removed –SEM view©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section - Capacitor Cavity
Cavity cross-section - SEM View©2020 by System Plus Consulting
Cavity Die cross-section - SEM View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o System Disassembly
o Views & Dimensionso Cross-Section
o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – Doping Revelation
CMUT after doping revelation - SEM View©2020 by System Plus Consulting
CMUT and ASIC after doping revelation - Optical View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo ASIC Front-End Processo CMUT Front-End Processo CMUT and ASIC Foundry Unito Probe Test Unit
Cost Analysis
Feedbacks
Related Reports
About System Plus
CMUT Process Flow
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso ASIC Wafer Costo CMUT Wafer Costo CMUT Die Cost
Feedbacks
Related Reports
About System Plus
CMUT Front-End Cost
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso ASIC Wafer Costo CMUT Wafer Costo CMUT Die Cost
Feedbacks
Related Reports
About System Plus
CMUT Die Cost
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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& Healthcare 2018• Status of the Medical Imaging 2020 (coming soon)
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Comparison 2019
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 16
COMPANYSERVICES
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
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www.systemplus.fr
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